1 backplane 背板 $-5iwZ
2 Band gap voltage reference 带隙电压参考 5p
U(A6RtS
3 benchtop supply 工作台电源 p9oru0q
4 Block Diagram 方块图 5 Bode Plot 波特图 1a/@eqF''
6 Bootstrap 自举 Ndx.SOj
7 Bottom FET Bottom FET g#9KG
8 bucket capcitor 桶形电容 HTf7r-
9 chassis 机架 qB<D'h7
10 Combi-sense Combi-sense 0-l
@U{
11 constant current source 恒流源 YOP=gvZq
12 Core Sataration 铁芯饱和 OHp 121
13 crossover frequency 交叉频率 `"A\8)6-
14 current ripple 纹波电流 @6h=O`X>
15 Cycle by Cycle 逐周期 lJ R",_
16 cycle skipping 周期跳步 <3Co/ .VQd
17 Dead Time 死区时间 2ai \("?
18 DIE Temperature 核心温度 1i2jYDB"
19 Disable 非使能,无效,禁用,关断 'ZTE"KT
20 dominant pole 主极点 r\` R$
21 Enable 使能,有效,启用 #E{OOcM
22 ESD Rating ESD额定值 Eq~&d.j
23 Evaluation Board 评估板 4q~+K'Z
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. fCO!M1 t
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 M6pGf_qt
25 Failling edge 下降沿 l'B`f)
26 figure of merit 品质因数 q:J,xC_sF(
27 float charge voltage 浮充电压 j9x}D;?n
28 flyback power stage 反驰式功率级 0qw,R4YK
29 forward voltage drop 前向压降 1 /7H` O?
30 free-running 自由运行 *oZBv4Vh
31 Freewheel diode 续流二极管 oxH S7b
32 Full load 满负载 33 gate drive 栅极驱动 :HMnU37m W
34 gate drive stage 栅极驱动级 =WFMqBh<`
35 gerber plot Gerber 图 wKXKc\r
36 ground plane 接地层 ran
Q_\
37 Henry 电感单位:亨利 <CzH'!FJN
38 Human Body Model 人体模式 2@uo2]o)
39 Hysteresis 滞回 gqyQ Zew
40 inrush current 涌入电流 9_5Fl,u
z
41 Inverting 反相 NU I|4X
42 jittery 抖动 JV(|7Sk
43 Junction 结点 pRPz1J$58
44 Kelvin connection 开尔文连接 $-jj%x\}
45 Lead Frame 引脚框架 M=`F $
46 Lead Free 无铅 `fY~Lv{4d_
47 level-shift 电平移动 iW.8+?Xq&
48 Line regulation 电源调整率 [fxAj]
49 load regulation 负载调整率 qZ6P(5X
50 Lot Number 批号 o*'J8El\y^
51 Low Dropout 低压差 k8 ,.~HkU
52 Miller 密勒 53 node 节点 m~(]\
54 Non-Inverting 非反相 &N[~+"
55 novel 新颖的 2\CFt;fk
56 off state 关断状态 ;]KGRT
57 Operating supply voltage 电源工作电压 D(@#Gd\Z@
58 out drive stage 输出驱动级 'fy1'^VPAV
59 Out of Phase 异相 #- f7hg*
60 Part Number 产品型号 $X
WJxQRUv
61 pass transistor pass transistor b@/z^k{%
62 P-channel MOSFET P沟道MOSFET ,*@m<{DX)
63 Phase margin 相位裕度 bF|j%If%
64 Phase Node 开关节点 2oGl"3/p
65 portable electronics 便携式电子设备 -KCm#!
66 power down 掉电 &owBmpz
67 Power Good 电源正常 Y3mATw 3Wh
68 Power Groud 功率地 m%qah>11
69 Power Save Mode 节电模式 0 #VH=p ga
70 Power up 上电 5d*k[fZ
71 pull down 下拉 a4 O
72 pull up 上拉 vz#rbBY*;
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) h<$V ry}
74 push pull converter 推挽转换器 UpN:F
75 ramp down 斜降 N$6Rg1
76 ramp up 斜升 .B6$U>>NS^
77 redundant diode 冗余二极管 g(;t,Vy,I
78 resistive divider 电阻分压器 Q/1
6D
79 ringing 振 铃 %K\_gR}V
80 ripple current 纹波电流 S^c5
81 rising edge 上升沿 0^?3hK
82 sense resistor 检测电阻 BYqDC<Fq
83 Sequenced Power Supplys 序列电源 13'tsM&
84 shoot-through 直通,同时导通 A@?2qX^4
85 stray inductances. 杂散电感 <q~&g
&&+
86 sub-circuit 子电路 oi::/W|A+
87 substrate 基板 |GA4fFE=
88 Telecom 电信 7M<7^)9
89 Thermal Information 热性能信息 5Q?7 xTQ
90 thermal slug 散热片 n,wLk./`
91 Threshold 阈值 :05>~bn>pC
92 timing resistor 振荡电阻 2(\~z@g
93 Top FET Top FET yLW iY~Fd
94 Trace 线路,走线,引线 cW/RH.N
95 Transfer function 传递函数 H/|Mq#K
96 Trip Point 跳变点 `2o/W]SSk
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) !BIq>pO%Ui
98 Under Voltage Lock Out (UVLO) 欠压锁定 (fUXJ$
99 Voltage Reference 电压参考 Aq^1(-g
100 voltage-second product 伏秒积 MV-fDqA(
101 zero-pole frequency compensation 零极点频率补偿 94 H\,}i8
102 beat frequency 拍频 |0vY'A)]
103 one shots 单击电路 >/. -N
104 scaling 缩放 LrX7WI
105 ESR 等效串联电阻 [Page] N>z_uPy{A
106 Ground 地电位 }mxy6m ,
107 trimmed bandgap 平衡带隙 pfe9n[
108 dropout voltage 压差 VuN=
JX
109 large bulk capacitance 大容量电容 t9Ht
54
110 circuit breaker 断路器 J)6RXt*!
111 charge pump 电荷泵 +`r;3kH ..
112 overshoot 过冲 </>;PnzE
:tu6'X\k
印制电路printed circuit b%2+g<UKh
印制线路 printed wiring l5b?
'L
印制板 printed board 1[
ME/r
印制板电路 printed circuit board +?),BRCce
印制线路板 printed wiring board ULIbVy7Y
印制元件 printed component P5yS`v$@
印制接点 printed contact yEJ}!/
印制板装配 printed board assembly ]E .+)>
板 board nbj &3z,
刚性印制板 rigid printed board c`yLn%Of%
挠性印制电路 flexible printed circuit :rnn`/L
挠性印制线路 flexible printed wiring QeuIAs* _
齐平印制板 flush printed board ArDkJ`DE
金属芯印制板 metal core printed board @/@#,+
金属基印制板 metal base printed board y
Rr,+>W
多重布线印制板 mulit-wiring printed board 4nmc(CHQ:
塑电路板 molded circuit board [8EzyB>fH
散线印制板 discrete wiring board t7pe)i,)
微线印制板 micro wire board Ms;:+JI
积层印制板 buile-up printed board {9q~bt
表面层合电路板 surface laminar circuit y m<3
埋入凸块连印制板 B2it printed board )@Fuw*
载芯片板 chip on board AifnC4
埋电阻板 buried resistance board y*0bHzJ
母板 mother board ^31X-}tv
子板 daughter board rK;F]ei
背板 backplane 7E*d>:5I
裸板 bare board 81u}J9z;
键盘板夹心板 copper-invar-copper board LE%3..
!
动态挠性板 dynamic flex board Z&e_yl
静态挠性板 static flex board ;i\m:8!;
可断拼板 break-away planel "a
%5on
电缆 cable )R.y>Ucb0
挠性扁平电缆 flexible flat cable (FFC) ^
ry
薄膜开关 membrane switch |j($2.
混合电路 hybrid circuit GLrHb3@"N
厚膜 thick film I&^B?"Y
厚膜电路 thick film circuit H(GWC[tv
薄膜 thin film 6," 86
薄膜混合电路 thin film hybrid circuit M@ILB-H
互连 interconnection d%FD=wm
导线 conductor trace line owHhlS{
齐平导线 flush conductor jHBzZ!<
传输线 transmission line th]1>
.
跨交 crossover FvQ>Y')R7Z
板边插头 edge-board contact Bj5_=oo+d
增强板 stiffener sDA&U9;
基底 substrate OBp<A+a
基板面 real estate bBA
#o\[
导线面 conductor side ~jWG U-m
元件面 component side LxaR1E(Cc'
焊接面 solder side 7~n<%q/6
导电图形 conductive pattern $Tci_(V=F
非导电图形 non-conductive pattern oKjQ?
4
基材 base material ?*lpu
层压板 laminate <RH2G
覆金属箔基材 metal-clad bade material k`ulDQu
覆铜箔层压板 copper-clad laminate (CCL) YBb%D
复合层压板 composite laminate Wm_:1~
薄层压板 thin laminate F)rU*i7
基体材料 basis material !lf'gW
预浸材料 prepreg *F7ksLH|q
粘结片 bonding sheet l'TM^B)`c
预浸粘结片 preimpregnated bonding sheer y
qDE|DIez
环氧玻璃基板 epoxy glass substrate hZ6CiEJB
预制内层覆箔板 mass lamination panel 1Z-f@PoM
内层芯板 core material >(nb8T|
粘结层 bonding layer JtA
tG%
粘结膜 film adhesive ]@YBa4}w
无支撑胶粘剂膜 unsupported adhesive film $KDH"J
覆盖层 cover layer (cover lay) P(B:tg
增强板材 stiffener material uXD?s3Wv
铜箔面 copper-clad surface eaSf[!24"
去铜箔面 foil removal surface F#d`nZ=M
层压板面 unclad laminate surface {Yp>h5nwM_
基膜面 base film surface Xi vzhI4
胶粘剂面 adhesive faec ;.*n77Y
原始光洁面 plate finish cVCylRU"
粗面 matt finish 2rK%fV53b
剪切板 cut to size panel &,~0*&r0
超薄型层压板 ultra thin laminate M;s r1C
A阶树脂 A-stage resin 1Q-O&\-xg
B阶树脂 B-stage resin l!UF`C0g
C阶树脂 C-stage resin P,1[NW
环氧树脂 epoxy resin ~:8}Bz2!5
酚醛树脂 phenolic resin L<8:1/d\
聚酯树脂 polyester resin ;oL`fQyr
聚酰亚胺树脂 polyimide resin !e+ex"7
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin -U'3kaX5<
丙烯酸树脂 acrylic resin QAs$fi}f]s
三聚氰胺甲醛树脂 melamine formaldehyde resin aH@GhI^@
多官能环氧树脂 polyfunctional epoxy resin ~%)ug3%e
溴化环氧树脂 brominated epoxy resin t\&u
环氧酚醛 epoxy novolac E=PmOw7b
氟树脂 fluroresin sJA` A
硅树脂 silicone resin .7lDJ2
硅烷 silane EtVRnI@
聚合物 polymer )qxZHV
无定形聚合物 amorphous polymer %=C49(/K_
结晶现象 crystalline polamer DK-V3}`q}
双晶现象 dimorphism Ih_2")d
共聚物 copolymer UvwO/A\Gv
合成树脂 synthetic 1$1s0yg
热固性树脂 thermosetting resin [Page] 8#?jYhT7
热塑性树脂 thermoplastic resin Ns3k(j16
感光性树脂 photosensitive resin 0xv@l^B
环氧值 epoxy value 7;]n+QRfm
双氰胺 dicyandiamide P[E:=p
粘结剂 binder J-Xw}|>@
胶粘剂 adesive ji'NR
固化剂 curing agent Z+# =]Kw)
阻燃剂 flame retardant UvR F\x%
遮光剂 opaquer x+1Cs$E;
增塑剂 plasticizers TV^m1uC
不饱和聚酯 unsatuiated polyester V(/ @$&
聚酯薄膜 polyester ,_ zivUU
聚酰亚胺薄膜 polyimide film (PI) |ATz<"q>
聚四氟乙烯 polytetrafluoetylene (PTFE) }ZPO^4H;-
增强材料 reinforcing material '!$g<= @
折痕 crease @(k}q3b<
云织 waviness "YW&,X5R
鱼眼 fish eye a?63 5*9K
毛圈长 feather length }cl~Vo-mp
厚薄段 mark Nd5G-eYI
裂缝 split ):LgZ4h
捻度 twist of yarn \U(;%V
浸润剂含量 size content
OHEl.p]|
浸润剂残留量 size residue x:Mh&dq?
处理剂含量 finish level '{e9Vh<x
偶联剂 couplint agent M|HW$8V3_2
断裂长 breaking length &Nzq/~uqP
吸水高度 height of capillary rise V5]}b[X
湿强度保留率 wet strength retention +0{$J\s
白度 whitenness %
~!A,
导电箔 conductive foil osBwX.G'l
铜箔 copper foil Q~p)@[q
压延铜箔 rolled copper foil {=Z xF
光面 shiny side ]6:|-x:m
粗糙面 matte side 2N)siH
处理面 treated side H%`$@U>
防锈处理 stain proofing V'-}B6 3S>
双面处理铜箔 double treated foil A }(V2
模拟 simulation &?(<6v7
逻辑模拟 logic simulation %MA o<,ha
电路模拟 circit simulation :TPT]q
d@
时序模拟 timing simulation ]$4DhB
模块化 modularization %A]?5J)Bi
设计原点 design origin t[dOWgHi
优化(设计) optimization (design) @ PboT1
供设计优化坐标轴 predominant axis f1Az|h
表格原点 table origin { :^;byd
元件安置 component positioning 0.MD_s0)>
比例因子 scaling factor b8QQS#q)V
扫描填充 scan filling *-.{->#Y
矩形填充 rectangle filling nBN+.RB:(
填充域 region filling u!]g^r
实体设计 physical design eNQQ`ll@m
逻辑设计 logic design bi@z<Xm%
逻辑电路 logic circuit l0
Eh?
层次设计 hierarchical design BXzn-S
自顶向下设计 top-down design 4V6^@
自底向上设计 bottom-up design ApT8;F B
费用矩阵 cost metrix @k|V4
元件密度 component density &d%0[Ui`
自由度 degrees freedom ,$H[DX
出度 out going degree e$vvm bK.
入度 incoming degree =yR$^VSY
曼哈顿距离 manhatton distance 3dl#:Si
欧几里德距离 euclidean distance t)p . $
网络 network o(gEyK
阵列 array /s/\5-U7q
段 segment goMv8d
逻辑 logic ,
z-#B]
逻辑设计自动化 logic design automation ep ,"@,,
分线 separated time _l ,_NV&T
分层 separated layer t7P[^f15[
定顺序 definite sequence }ldOxJSB?
导线(通道) conduction (track) I:l/U-b7h
导线(体)宽度 conductor width pHftz-RS!
导线距离 conductor spacing 6T`F'Fk[
导线层 conductor layer ?q*,,+'0
导线宽度/间距 conductor line/space p;x3gc;0
第一导线层 conductor layer No.1 Ic<J]+Xq
圆形盘 round pad :`Z'vRj
方形盘 square pad G/)]aGr
菱形盘 diamond pad @L-] %C
长方形焊盘 oblong pad 3g{T+c*
子弹形盘 bullet pad aAi"
泪滴盘 teardrop pad ozCH1V{p
雪人盘 snowman pad I{8sLzA03S
形盘 V-shaped pad V *7JsmN?
环形盘 annular pad j,Vir"-)
非圆形盘 non-circular pad xQ]^wT.Q
隔离盘 isolation pad SK]"JSY`
非功能连接盘 monfunctional pad 4nz$Ja)
偏置连接盘 offset land Vlf =gP
腹(背)裸盘 back-bard land
_!K@(dl
盘址 anchoring spaur ir?Y>
连接盘图形 land pattern S 9;:)
连接盘网格阵列 land grid array e.>>al
孔环 annular ring `h(*D
元件孔 component hole (p1}i::Y8
安装孔 mounting hole -*nd5(lY&
支撑孔 supported hole 9*ek5vPB
非支撑孔 unsupported hole o-ee3j.
导通孔 via dBeZx1Dy
镀通孔 plated through hole (PTH) %"gV>E_u
余隙孔 access hole &2Q0ii#Aa
盲孔 blind via (hole) C]f`
埋孔 buried via hole a*N<gId
埋,盲孔 buried blind via wRCv?D`vV
任意层内部导通孔 any layer inner via hole ,UA-Pq3}
全部钻孔 all drilled hole vK7J;U+cJ
定位孔 toaling hole + 2j]
无连接盘孔 landless hole $j"TPkW{M
中间孔 interstitial hole 7,!$lT#
无连接盘导通孔 landless via hole FG{45/0We
引导孔 pilot hole %gbvX^E?
端接全隙孔 terminal clearomee hole h4,S/n
准尺寸孔 dimensioned hole [Page] 7.!`c-8
u
在连接盘中导通孔 via-in-pad rv26vnJy"
孔位 hole location ln&9WF\I
孔密度 hole density =K`]$Og}8
孔图 hole pattern ?>}&,:U}
钻孔图 drill drawing ;#+Se,)
装配图assembly drawing :OC(93d)0
参考基准 datum referan IS[&V&.n
1) 元件设备 UPr8Q^wm
PpWn+''M
三绕组变压器:three-column transformer ThrClnTrans +}Q@{@5w
双绕组变压器:double-column transformer DblClmnTrans vbMt}bM(GD
电容器:Capacitor cq,8^o&
并联电容器:shunt capacitor e<E]8GAF
电抗器:Reactor sR*.i?lN
母线:Busbar =.9uuF:
输电线:TransmissionLine =e!o
发电厂:power plant dl;
断路器:Breaker qs
0'}>
刀闸(隔离开关):Isolator !Bqmw
分接头:tap ;qwNM~
电动机:motor <`Q*I
Y
(2) 状态参数 >6\rhx>
cd-;?/
有功:active power /2jw]ekQ'
无功:reactive power s<`54o ,
电流:current laX67Vjv
容量:capacity fo$Ac
电压:voltage \4FKZ>1+R
档位:tap position n+94./Mh
有功损耗:reactive loss tI;pdR]
无功损耗:active loss *(*3/P4D
功率因数:power-factor qR>"r"Fq
功率:power ~L3]Wa.
功角:power-angle 15L0B5(3
电压等级:voltage grade $=rLs)
空载损耗:no-load loss |-!
yKB
铁损:iron loss A3cW8OClz
铜损:copper loss Q ,6[
空载电流:no-load current -)dS`hM
阻抗:impedance lMW4SRk1C
正序阻抗:positive sequence impedance ")?NCun>
负序阻抗:negative sequence impedance |8<P%:*N
零序阻抗:zero sequence impedance :f|X$>
b
电阻:resistor ,^d!K(xb
电抗:reactance )?D w)s5
电导:conductance tMnwY'
电纳:susceptance TexSUtx@$
无功负载:reactive load 或者QLoad cN]]J
有功负载: active load PLoad ;+W9EbY2
遥测:YC(telemetering) @ApX43U(
遥信:YX FaVeP%v
励磁电流(转子电流):magnetizing current = m6yH_`@
定子:stator /`"&n1
功角:power-angle LjOHlT'
上限:upper limit 0A.PfqYi
下限:lower limit r|!r!V8j
并列的:apposable &:MfLDJ
高压: high voltage 6;^ e
低压:low voltage [WxRwE
中压:middle voltage <6L=% \X{*
电力系统 power system NIasce e
发电机 generator YLO/J2['
励磁 excitation -g`3;1EV^
励磁器 excitor sKU?"|G81G
电压 voltage LsGu-Y5^
电流 current erQ0fW
母线 bus ( 8}'JvSu
变压器 transformer 3Q-[)Z )
升压变压器 step-up transformer #vnJJ#uI|>
高压侧 high side 057$b!A-a
输电系统 power transmission system cHO8%xu`
输电线 transmission line ""2g{!~r
固定串联电容补偿fixed series capacitor compensation _# mo6')j
稳定 stability zC[lPABQ
电压稳定 voltage stability .xIu
功角稳定 angle stability 2*<'=*zaQ
暂态稳定 transient stability 5|^{t00T~
电厂 power plant $F,&7{^
能量输送 power transfer pHpHvSI
交流 AC OYC\+
=
装机容量 installed capacity n$S`NNO{]
电网 power system Q|+g= |%^
落点 drop point !R/-|Kjy
开关站 switch station FYtf<C+
双回同杆并架 double-circuit lines on the same tower _a e&@s1
变电站 transformer substation 3{;W!/&>
补偿度 degree of compensation d|, B* N(w
高抗 high voltage shunt reactor \h&ui]V
无功补偿 reactive power compensation %j*i=
故障 fault ,*w
调节 regulation V&>\U?q:
裕度 magin *i>?YT
三相故障 three phase fault .}V&*-ep
故障切除时间 fault clearing time Qn*a#]p
极限切除时间 critical clearing time t=;84lA
切机 generator triping s?2DLXv}!
高顶值 high limited value I
)LO@
强行励磁 reinforced excitation ?(!<m'jEy
线路补偿器 LDC(line drop compensation) 0B;cQSH!q
机端 generator terminal H"g$qSx
静态 static (state) q:9#Vcw
动态 dynamic (state) (^ Q:zU
单机无穷大系统 one machine - infinity bus system {#c**' 4
机端电压控制 AVR Rt{`v<
电抗 reactance MGmUgc
电阻 resistance 3Q@HP;<
功角 power angle <R?_Yjsw
有功(功率) active power ,z1fiq
无功(功率) reactive power BRx`83CK
功率因数 power factor d5x>kO'[l
无功电流 reactive current D3>;X= 1
下降特性 droop characteristics :Gdfpz-{?
斜率 slope b(Ev :
额定 rating +[DL]e]@U
变比 ratio jb~/>I^1
参考值 reference value %qM3IVPK)q
电压互感器 PT l-N4RCt h
分接头 tap [uh$\s7
下降率 droop rate _(q|W3
仿真分析 simulation analysis r95l.v
传递函数 transfer function V|h/a\P
框图 block diagram ZN:~etd
受端 receive-side "F*'UfOwrZ
裕度 margin 73C
同步 synchronization O-M4NKl]6
失去同步 loss of synchronization $1CAfSgKw
阻尼 damping ~\9bh6%R
摇摆 swing 6L~tUe.G
保护断路器 circuit breaker J:YFy-[w(
电阻:resistance WaVP+Ap
电抗:reactance }/%(7Ff{
阻抗:impedance }wJDHgt]-p
电导:conductance f8Xe%"<
电纳:susceptance