1 backplane 背板 {X\FS
2 Band gap voltage reference 带隙电压参考 &9n=!S'Md
3 benchtop supply 工作台电源 T !pHT'J
4 Block Diagram 方块图 5 Bode Plot 波特图 kgX"I ?>d
6 Bootstrap 自举 :r_/mzR#
7 Bottom FET Bottom FET [}l
1`>
8 bucket capcitor 桶形电容 taSYR$VJ
9 chassis 机架 w 3L+7V,!
10 Combi-sense Combi-sense /jU4mPb;\D
11 constant current source 恒流源 f*[Uq0?
12 Core Sataration 铁芯饱和 ehX4[j6
13 crossover frequency 交叉频率 (>om.FM
14 current ripple 纹波电流 f./j%R@
15 Cycle by Cycle 逐周期 BLo=@C%w5
16 cycle skipping 周期跳步 jdD`C`w|,
17 Dead Time 死区时间 fqm6Pd{:(
18 DIE Temperature 核心温度 Ys%d
19 Disable 非使能,无效,禁用,关断
A^pRHbRq
20 dominant pole 主极点 ~HX'8\5
21 Enable 使能,有效,启用 C:}"?tri
22 ESD Rating ESD额定值 l'\m'Ioh
23 Evaluation Board 评估板 CakB`q(8
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. 0^MRPE|f5
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 A6F/w
25 Failling edge 下降沿 lHgmljn5u
26 figure of merit 品质因数 _4t
27 float charge voltage 浮充电压 KlRIJOS
28 flyback power stage 反驰式功率级 rdm&YM`J
29 forward voltage drop 前向压降 Nu%MXu+
30 free-running 自由运行 0~nub
31 Freewheel diode 续流二极管 OmECvL'Z
32 Full load 满负载 33 gate drive 栅极驱动 l9$"zEC
34 gate drive stage 栅极驱动级 L q;=UE
35 gerber plot Gerber 图 iC<qWq|S_m
36 ground plane 接地层 ~w$ ^`e!]
37 Henry 电感单位:亨利 gs= (h*
38 Human Body Model 人体模式 wb-_CQ
39 Hysteresis 滞回 0a's[>-'A
40 inrush current 涌入电流 =&?BPhJE
41 Inverting 反相 G+Zm
42 jittery 抖动 )m(?U
43 Junction 结点 y$HV;%G{26
44 Kelvin connection 开尔文连接 c0:`+>p2
45 Lead Frame 引脚框架 k iY1
46 Lead Free 无铅 ;ywUl`d
47 level-shift 电平移动 J?bx<$C@
48 Line regulation 电源调整率 E$E#c8I:
49 load regulation 负载调整率 5+iXOs<
50 Lot Number 批号 |VML.u:N
51 Low Dropout 低压差 'WJ3q|o/
52 Miller 密勒 53 node 节点 *Ag,/Cm]
54 Non-Inverting 非反相 sxU
0Fg
55 novel 新颖的 !&vPG>V
56 off state 关断状态 V5HK6- T
57 Operating supply voltage 电源工作电压 A#Jx6T`a
58 out drive stage 输出驱动级 rTtxmw0
59 Out of Phase 异相 ABnJ{$=n#
60 Part Number 产品型号 Ouc$M2m0!
61 pass transistor pass transistor [#C(^J*@c
62 P-channel MOSFET P沟道MOSFET :^992]EBEj
63 Phase margin 相位裕度 R"qxT.P(
64 Phase Node 开关节点 nHF%PH#|o
65 portable electronics 便携式电子设备 {3*Zx"e![
66 power down 掉电 59M\uVWR
67 Power Good 电源正常 !"QvV6Lq\
68 Power Groud 功率地 tx||<8
69 Power Save Mode 节电模式 UrEfFtH'
70 Power up 上电 y^hCO:`l3
71 pull down 下拉 p;9"0rj,z
72 pull up 上拉 '/QS
sZR
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) +I r
74 push pull converter 推挽转换器 F>s5<pKAX
75 ramp down 斜降 QlK]2r9
76 ramp up 斜升 2"!s8x1$
77 redundant diode 冗余二极管 jS| 9jg:
78 resistive divider 电阻分压器 X_2pC|C
79 ringing 振 铃 ~~X-$rtU
80 ripple current 纹波电流 ]}0QrD
81 rising edge 上升沿 )TzQ8YpO}
82 sense resistor 检测电阻 4
oZm0
83 Sequenced Power Supplys 序列电源 ='<789wT
84 shoot-through 直通,同时导通 Q6rvTV'vv
85 stray inductances. 杂散电感 jdAjCy; s!
86 sub-circuit 子电路 \d}>@@U&
87 substrate 基板 |WDMyKf6J
88 Telecom 电信 S!+}\*
89 Thermal Information 热性能信息 MC;2.e`
90 thermal slug 散热片 0 pPSg9
91 Threshold 阈值 nb}rfd.
92 timing resistor 振荡电阻 7FGi+
93 Top FET Top FET :SvgXMY@
94 Trace 线路,走线,引线 ;HoBLxb P
95 Transfer function 传递函数 20A`]-D
96 Trip Point 跳变点 EN;s
8sC!
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) CWw#0
98 Under Voltage Lock Out (UVLO) 欠压锁定 F;sZc,Y,^
99 Voltage Reference 电压参考 EE$\8Gx']!
100 voltage-second product 伏秒积 :.aMhyh#*
101 zero-pole frequency compensation 零极点频率补偿 qvG@kuz8g5
102 beat frequency 拍频 &r)[6a$fW
103 one shots 单击电路 @p ZjJ<9QM
104 scaling 缩放 hU6oWm
105 ESR 等效串联电阻 [Page] _kXq0~
106 Ground 地电位 '|^x[8^
107 trimmed bandgap 平衡带隙 k{ ~0BK
108 dropout voltage 压差 wGg_ vAn
109 large bulk capacitance 大容量电容 V;29ieE!
110 circuit breaker 断路器 y7~y@ 2
111 charge pump 电荷泵 7]H<ou
112 overshoot 过冲 ?!HU$>
a]nK!;>$
印制电路printed circuit g0ks[ }f-
印制线路 printed wiring mLm?yb:
印制板 printed board K*S3{s%UR
印制板电路 printed circuit board F<TIZ^gFP
印制线路板 printed wiring board g+A>Bl3#
印制元件 printed component WT63ve
印制接点 printed contact @8*lqV2
印制板装配 printed board assembly y4)iL?!J~
板 board A~}5T%qb
刚性印制板 rigid printed board 'e/wjV
挠性印制电路 flexible printed circuit LS]0 p#
挠性印制线路 flexible printed wiring %y_{?|+
齐平印制板 flush printed board Kv9Z.DY
金属芯印制板 metal core printed board .F},Z[a&
金属基印制板 metal base printed board qWM+!f
多重布线印制板 mulit-wiring printed board LyH1tF
塑电路板 molded circuit board F.),|t$\
散线印制板 discrete wiring board rXP~k]tC
微线印制板 micro wire board }Xvm(
;
积层印制板 buile-up printed board gCq'#G\Z
表面层合电路板 surface laminar circuit D$N;Qb
埋入凸块连印制板 B2it printed board =;"=o5g_
载芯片板 chip on board V]NCFG
埋电阻板 buried resistance board :g ~_
母板 mother board @;\0cEn>
子板 daughter board =;Dj[<mJ45
背板 backplane Q[{RNab
裸板 bare board ]f_`w81[
键盘板夹心板 copper-invar-copper board R.!.7dO
动态挠性板 dynamic flex board LXqPNVp#
静态挠性板 static flex board _iL?kf
可断拼板 break-away planel 6H=gura&
电缆 cable mv7W03
挠性扁平电缆 flexible flat cable (FFC) &`oybm-p(
薄膜开关 membrane switch 0SDnMij&bf
混合电路 hybrid circuit gxx#<=`
厚膜 thick film 5;+KMM:zb
厚膜电路 thick film circuit Dxy^r*B
薄膜 thin film ?lML+
薄膜混合电路 thin film hybrid circuit 6?'7`p
互连 interconnection <RKT
|
导线 conductor trace line Ec2;?pvd%J
齐平导线 flush conductor DD2K>1A1
传输线 transmission line #_{Q&QUk
跨交 crossover WdH/^QvTP
板边插头 edge-board contact |]?zH~L
增强板 stiffener L0oVXmlr
基底 substrate v&bG`\ !
基板面 real estate PD&gC88
导线面 conductor side sn"z'=ch
元件面 component side 0( *L)s,5
焊接面 solder side W.NZ%~|+e/
导电图形 conductive pattern 1jej7p>K
非导电图形 non-conductive pattern FgL892[
基材 base material =r*Ykd;W|E
层压板 laminate C!|LGzs0
覆金属箔基材 metal-clad bade material 9z..LD(
覆铜箔层压板 copper-clad laminate (CCL) kg
8Dn
复合层压板 composite laminate &gPP#D6A
薄层压板 thin laminate z$WLx
基体材料 basis material {`Gd
预浸材料 prepreg J>5 rkR@/
粘结片 bonding sheet !|up"T I
预浸粘结片 preimpregnated bonding sheer a|"Uw
`pX+
环氧玻璃基板 epoxy glass substrate 0Ni{UV?
k
预制内层覆箔板 mass lamination panel 7[w<v(Rc
内层芯板 core material s8)`wH?
粘结层 bonding layer s M*ay,v;
粘结膜 film adhesive mf)+ 5On
无支撑胶粘剂膜 unsupported adhesive film 1Dl6T\20
覆盖层 cover layer (cover lay) #-@uLc
增强板材 stiffener material eIfQ
TV
铜箔面 copper-clad surface ;0Pv49q
去铜箔面 foil removal surface 0~z\WSo
层压板面 unclad laminate surface xhOoZ-
基膜面 base film surface !3Pbu=(cte
胶粘剂面 adhesive faec <l$ d>,
原始光洁面 plate finish >W;NMcN~
粗面 matt finish t`&x.o
剪切板 cut to size panel r:;.?f@
超薄型层压板 ultra thin laminate 10i$ b<O
A阶树脂 A-stage resin uINdeq 7|F
B阶树脂 B-stage resin ? ep#s$i
C阶树脂 C-stage resin Rh?bBAn8
环氧树脂 epoxy resin Ff%V1BH[
酚醛树脂 phenolic resin EgU#r@7I
聚酯树脂 polyester resin u;gO+)wqv
聚酰亚胺树脂 polyimide resin Z sTtSM\Ac
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin 4]uj+J
丙烯酸树脂 acrylic resin uTxa5j
三聚氰胺甲醛树脂 melamine formaldehyde resin /rnI"ze`
多官能环氧树脂 polyfunctional epoxy resin kB> ~Tb0
溴化环氧树脂 brominated epoxy resin {VE
h@yn
环氧酚醛 epoxy novolac 7P7OTN
氟树脂 fluroresin !6T"J!F#
硅树脂 silicone resin iBd6&?E?<
硅烷 silane Z(T{K\)uN
聚合物 polymer yGf7k>K'
无定形聚合物 amorphous polymer :t{~Mi=T
结晶现象 crystalline polamer [YfoQ1
双晶现象 dimorphism w{6C4~0
共聚物 copolymer B-R#?Xn:!I
合成树脂 synthetic =d<RgwscJ
热固性树脂 thermosetting resin [Page] \ph.c*c
热塑性树脂 thermoplastic resin fq]PKLW'
感光性树脂 photosensitive resin 1!~cPD'F
环氧值 epoxy value ?
T6K]~g
双氰胺 dicyandiamide {O^u^a\m
粘结剂 binder by
X!,
胶粘剂 adesive ds(?:zx#
固化剂 curing agent ~lys
阻燃剂 flame retardant 6!ve6ZB[p
遮光剂 opaquer pn
gto
增塑剂 plasticizers /Hyz]46
不饱和聚酯 unsatuiated polyester g[3LPKQ
聚酯薄膜 polyester /i'078F
聚酰亚胺薄膜 polyimide film (PI) d]pb1ECuu
聚四氟乙烯 polytetrafluoetylene (PTFE) HU i?\4
增强材料 reinforcing material ,vJt!}}
折痕 crease 0N.h: 21(4
云织 waviness 4^tSg#!V{
鱼眼 fish eye MC}t8L=
毛圈长 feather length ?m
|}}a
厚薄段 mark [y[d7V9_o
裂缝 split Xv8-<Ks
捻度 twist of yarn N1c=cZDV
浸润剂含量 size content B7C3r9wj
浸润剂残留量 size residue 9CY{}g
处理剂含量 finish level V&M*,#(?
偶联剂 couplint agent QPJ\Iu@D$
断裂长 breaking length /SD}`GxH
吸水高度 height of capillary rise 9=%zd z2_S
湿强度保留率 wet strength retention G<;~nAo?f0
白度 whitenness J:L+q}A
导电箔 conductive foil $;qi-K3j
铜箔 copper foil tnRf!A;m
压延铜箔 rolled copper foil Je1d|1!3
光面 shiny side `Y#At3{
粗糙面 matte side / (&E
处理面 treated side }}AIpYp,P
防锈处理 stain proofing /BL:"t@-
双面处理铜箔 double treated foil sgX!4wG&Z
模拟 simulation 21uK&nVf^l
逻辑模拟 logic simulation !Zz;;Z
电路模拟 circit simulation eqo0{e
时序模拟 timing simulation q$Gs;gz^(
模块化 modularization 9%/hoA)
设计原点 design origin 9y7N}T6
优化(设计) optimization (design) ze+YQF
供设计优化坐标轴 predominant axis zfIo]M`
表格原点 table origin &L;ocd$
元件安置 component positioning liKlc]oM
比例因子 scaling factor :C~Ar]
扫描填充 scan filling ^SdF\uk{?6
矩形填充 rectangle filling ^\\3bW9}H
填充域 region filling .DCHc,DxA
实体设计 physical design Bt+^H6cb
逻辑设计 logic design rbw$=bX}
逻辑电路 logic circuit -+#%]P8l
层次设计 hierarchical design b_0THy.Z
自顶向下设计 top-down design Dyov}y
自底向上设计 bottom-up design -Zt!H%U
费用矩阵 cost metrix _gvFs%J
元件密度 component density 3nq?Y8yac
自由度 degrees freedom 4CNrIF@
出度 out going degree LW %AZkAx
入度 incoming degree |Wh3a#
曼哈顿距离 manhatton distance BuJo W@)
欧几里德距离 euclidean distance ^9g$/8[^c_
网络 network "g{q=[U}
阵列 array v, $r.g;
段 segment '0<d9OlJ}
逻辑 logic aAo|3KCs
逻辑设计自动化 logic design automation dGIdSQ~ _
分线 separated time ]ss[n.T0*
分层 separated layer 9mF'
定顺序 definite sequence ^|Ap_!t$;
导线(通道) conduction (track) XHr*Rs.[=
导线(体)宽度 conductor width h3ygL" k
导线距离 conductor spacing o-,."|6
导线层 conductor layer vCzZjGBY
导线宽度/间距 conductor line/space p~pD`'%
第一导线层 conductor layer No.1 [);oj<
圆形盘 round pad 4ot<Uw5
方形盘 square pad -9Q(3$}
菱形盘 diamond pad X8Z?G,[H
长方形焊盘 oblong pad IpP%WW u
子弹形盘 bullet pad ke4E1T-1n
泪滴盘 teardrop pad Y-VDi.]W
雪人盘 snowman pad th?+TNb^
形盘 V-shaped pad V
q6
CrUn
环形盘 annular pad 0YH5B5b
非圆形盘 non-circular pad mG~_*8}e<
隔离盘 isolation pad <_EKCk
非功能连接盘 monfunctional pad N5
ME_)
偏置连接盘 offset land g}an
5a
腹(背)裸盘 back-bard land m4:c$5
盘址 anchoring spaur GABZsdFZ!
连接盘图形 land pattern TOwd+]B
连接盘网格阵列 land grid array cc@W
6W
孔环 annular ring |;ztK[(
元件孔 component hole TCr4-"`r-{
安装孔 mounting hole T(J'p4
支撑孔 supported hole Ln"wjO,
非支撑孔 unsupported hole _&<n'fK[
导通孔 via ]e>qvSuYh
镀通孔 plated through hole (PTH) b!<_ JOL2.
余隙孔 access hole qBA)5Sv\V
盲孔 blind via (hole) I!x.bp~V!
埋孔 buried via hole *ap,r&]#F
埋,盲孔 buried blind via *a9cBl'_
任意层内部导通孔 any layer inner via hole CM6% g f3
全部钻孔 all drilled hole C @(@n!o:!
定位孔 toaling hole ZU4=&K
无连接盘孔 landless hole uLhGp@Dx
中间孔 interstitial hole iaGA9l<b
无连接盘导通孔 landless via hole IH|zNg{\Y
引导孔 pilot hole pUIN`ya[[
端接全隙孔 terminal clearomee hole ,jU>V]YC
准尺寸孔 dimensioned hole [Page] qu=~\t1[6
在连接盘中导通孔 via-in-pad ?N#I2jxaD
孔位 hole location TdhfX {nk
孔密度 hole density S%SYvA
孔图 hole pattern lriezI
钻孔图 drill drawing M2$/x`\-~
装配图assembly drawing ,d"T2Hy
参考基准 datum referan ;6tra_
1) 元件设备 19 5_1?'<
Z@~gN5@,M
三绕组变压器:three-column transformer ThrClnTrans !np_B0`
双绕组变压器:double-column transformer DblClmnTrans ~i,d%a
电容器:Capacitor iZGbNN
并联电容器:shunt capacitor wNB?3v{n
电抗器:Reactor -(vHy/Hz.
母线:Busbar
:1'
输电线:TransmissionLine G% F#I
发电厂:power plant xIdb9hm<
断路器:Breaker *zrT;jG
刀闸(隔离开关):Isolator A95f!a
分接头:tap b
74!Zw
电动机:motor d$ouH%^cGu
(2) 状态参数 hf`y_H+\7
\!ZA#7
有功:active power h ldZA
无功:reactive power "~r<ZG
电流:current mnt&!X4<
容量:capacity K,4Ig!
电压:voltage 0'sZ7f<e7
档位:tap position H_xHoCLI
有功损耗:reactive loss [P2>KQ\
无功损耗:active loss }8'_M/u\
功率因数:power-factor n:AZ(f
功率:power ;>,B(Xz4i
功角:power-angle +y|
B"}x
电压等级:voltage grade b8!oZ~K
空载损耗:no-load loss rO87V!Cj
铁损:iron loss =dXHQU&Q
铜损:copper loss 0\mf1{$"!7
空载电流:no-load current FSuC)Xg
阻抗:impedance FB k7Cn!
正序阻抗:positive sequence impedance VL#:oyWA
负序阻抗:negative sequence impedance wgz]R
零序阻抗:zero sequence impedance xQR/Xp!h
电阻:resistor 6 (rm%c
电抗:reactance Df"PNUwA"
电导:conductance s}zR@ !`
电纳:susceptance Y3@+aA
无功负载:reactive load 或者QLoad >~g-
有功负载: active load PLoad r] /Ej!|
遥测:YC(telemetering) CvIuH=,
遥信:YX B:>:$LIL
励磁电流(转子电流):magnetizing current >s<Bu' r
定子:stator JMAdsg/
功角:power-angle [3dGHf;miw
上限:upper limit g0 f4>m
下限:lower limit gs<~)&x
并列的:apposable k$=L&id
高压: high voltage 5K
Ij}VN
低压:low voltage EH".ki=e
中压:middle voltage o0Teect=
电力系统 power system Y`gO:d8
发电机 generator 1
-Z&/3T]
励磁 excitation w,hm_aDq
励磁器 excitor F`KXG$
电压 voltage (-ELxshd
电流 current <gPM/4$G
母线 bus 1_7p`Gxt[/
变压器 transformer p,=IL_
升压变压器 step-up transformer =2q#- ,t
高压侧 high side Up
Z 9g"
输电系统 power transmission system 6TRLHL~B
输电线 transmission line auI`'O`/
固定串联电容补偿fixed series capacitor compensation E"}%$=yK
稳定 stability !S~)U{SSK
电压稳定 voltage stability 7,)E1dx -V
功角稳定 angle stability V;^-EWNj
暂态稳定 transient stability cO:lpsKYQ
电厂 power plant rzdQLan
能量输送 power transfer "=2\kZ
交流 AC ,wf_o%'eW
装机容量 installed capacity <hzHrx'o{
电网 power system DXJw)%G
w
落点 drop point `*[Kmb\
开关站 switch station ,t_&tbf3
双回同杆并架 double-circuit lines on the same tower ; &rxwL
变电站 transformer substation
/$93#$
补偿度 degree of compensation '!$QI@@
高抗 high voltage shunt reactor <j,I@%
无功补偿 reactive power compensation e'~Qe_
故障 fault aP (~l_
调节 regulation >'n[B
裕度 magin -qpvVLR,
三相故障 three phase fault 2V8"jc
故障切除时间 fault clearing time em7L`,
极限切除时间 critical clearing time j7d^ga-`
切机 generator triping M*'8$|Z
高顶值 high limited value J+CGhk
强行励磁 reinforced excitation 'h ?
线路补偿器 LDC(line drop compensation) ,&Zp^
机端 generator terminal 6r^ZMW
静态 static (state) eG+$~\%Fub
动态 dynamic (state) Sj)?!
单机无穷大系统 one machine - infinity bus system (4z_2a(Dl,
机端电压控制 AVR ka=A:biz
电抗 reactance A99;bf}"
电阻 resistance 37n2 #E
功角 power angle .`*;AT
有功(功率) active power } A6z%|d
无功(功率) reactive power 7E*0;sA#
功率因数 power factor 4iSN.nxIZ
无功电流 reactive current V(XU^}b#
下降特性 droop characteristics nYC.zc*o x
斜率 slope nzO-\`40
额定 rating ,nog6\
变比 ratio Na]ITCVR
参考值 reference value @WXRZEz
电压互感器 PT Gqq<-drR
分接头 tap EWl9rF@I
下降率 droop rate b L.Xby<Y
仿真分析 simulation analysis H [M:iV
传递函数 transfer function c.Izm+9k
框图 block diagram A[4HD!9=
受端 receive-side rD6NUS
裕度 margin s!W{ru
同步 synchronization o8g]ho
失去同步 loss of synchronization ^^V+0 l
阻尼 damping 8\)4waz$
摇摆 swing !#1UTa
保护断路器 circuit breaker @6[aLF]F
电阻:resistance 7u1o>a%9
电抗:reactance 'e>'JZR
阻抗:impedance 8u*Q^-fpo0
电导:conductance amQiH!}8R
电纳:susceptance