1 backplane 背板 {\f`s^;8{
2 Band gap voltage reference 带隙电压参考 u-E*_%y
3 benchtop supply 工作台电源 pUaGrdGxzQ
4 Block Diagram 方块图 5 Bode Plot 波特图 |7l*
6 Bootstrap 自举 kVe_2oQ_>
7 Bottom FET Bottom FET 4]]1JL(Ka
8 bucket capcitor 桶形电容 "5R8Zl+
9 chassis 机架 `ynD-_fTN
10 Combi-sense Combi-sense #x|h@(y|
11 constant current source 恒流源 u4[3JI>
12 Core Sataration 铁芯饱和 j:{d'OV
13 crossover frequency 交叉频率 t^qPQ;"=,
14 current ripple 纹波电流 fhp][)g;
15 Cycle by Cycle 逐周期 (""1[XURQK
16 cycle skipping 周期跳步 u9"1%
17 Dead Time 死区时间 t,K_!-HX+
18 DIE Temperature 核心温度 B?r [|
19 Disable 非使能,无效,禁用,关断 Awad!_VdHS
20 dominant pole 主极点 /Hl]$sJY
21 Enable 使能,有效,启用 @l:\Ka~TS
22 ESD Rating ESD额定值 <w d+cPZQr
23 Evaluation Board 评估板 Pz1[ b$%
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. 29E9ZjSK
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 ye)CfP=ID\
25 Failling edge 下降沿 wg[ D*a
26 figure of merit 品质因数 dF%sD|<)
27 float charge voltage 浮充电压 4X2/n
28 flyback power stage 反驰式功率级 3yu{Q z5y,
29 forward voltage drop 前向压降 -\!"Kz/
30 free-running 自由运行 TY3WP$u
31 Freewheel diode 续流二极管 Td5;bg6Qy
32 Full load 满负载 33 gate drive 栅极驱动 fhAK^@h
34 gate drive stage 栅极驱动级 j6KGri
35 gerber plot Gerber 图 4W9#z~'
36 ground plane 接地层 I2=?H<
37 Henry 电感单位:亨利 ^\uj&K6l
38 Human Body Model 人体模式 =%YU~
39 Hysteresis 滞回 m4~Co*]w
40 inrush current 涌入电流 #eT{?_wM
41 Inverting 反相 `UpZk?k
42 jittery 抖动 $b/oiy!=|3
43 Junction 结点 F$FCfP7
44 Kelvin connection 开尔文连接 Z`5v6"Na
45 Lead Frame 引脚框架 b"y][5VE
46 Lead Free 无铅 daIt `} s
47 level-shift 电平移动 joh=0nk;D
48 Line regulation 电源调整率 mzz77i
49 load regulation 负载调整率 AoEG%nT
50 Lot Number 批号 \*s'S*~
51 Low Dropout 低压差 YN
~7 nOw
52 Miller 密勒 53 node 节点 Fa$ pr`
54 Non-Inverting 非反相 {<a(1#{
55 novel 新颖的 b<B|p|
56 off state 关断状态 VGY#ph%
57 Operating supply voltage 电源工作电压 Y
zXL8
58 out drive stage 输出驱动级 N6Fj}m&E
59 Out of Phase 异相 2!/_Xh
60 Part Number 产品型号 (DCC4%w"
61 pass transistor pass transistor U<**Est
62 P-channel MOSFET P沟道MOSFET QUp()B1
63 Phase margin 相位裕度 WKFmU0RK
64 Phase Node 开关节点 G l=dL<F
65 portable electronics 便携式电子设备 w<<G}4~u|
66 power down 掉电 ~\c]!%)o
67 Power Good 电源正常 K4i#:7r'b
68 Power Groud 功率地 ) w.cCDL c
69 Power Save Mode 节电模式 7CzZHkTg
70 Power up 上电
] }XK
71 pull down 下拉 ;SF0}51
72 pull up 上拉 Cyxt EzPp
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) O&=?,zLO[
74 push pull converter 推挽转换器 'g8~539{&
75 ramp down 斜降 W;coi4
76 ramp up 斜升 UB]}j^
77 redundant diode 冗余二极管 xNTO59Y-s
78 resistive divider 电阻分压器 R/M:~h~F!
79 ringing 振 铃 BlS0I%SN
80 ripple current 纹波电流 m&DDz+g
81 rising edge 上升沿 Pq~"`-h7:
82 sense resistor 检测电阻 <L@0w8i`
83 Sequenced Power Supplys 序列电源 >A|6kzC
84 shoot-through 直通,同时导通 8@|_];9#.
85 stray inductances. 杂散电感 . \*Z:
86 sub-circuit 子电路 .!Kdi| a)
87 substrate 基板 KL!k'4JNY
88 Telecom 电信 @6>R/]
89 Thermal Information 热性能信息 >~I~!i3
90 thermal slug 散热片 pJx88LfR
91 Threshold 阈值 lDNB0Ad
92 timing resistor 振荡电阻 *plsZ*Q8
93 Top FET Top FET '8~7Ru\KyX
94 Trace 线路,走线,引线 G8@({EY
95 Transfer function 传递函数 ~zFs/(k
96 Trip Point 跳变点 B&#TbKp
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) o|Obl@CSBD
98 Under Voltage Lock Out (UVLO) 欠压锁定 2"C'Au
99 Voltage Reference 电压参考 &"fMiK3
100 voltage-second product 伏秒积 K IiV z<
101 zero-pole frequency compensation 零极点频率补偿 )JTh=w4n|z
102 beat frequency 拍频 n8Jx;j
103 one shots 单击电路 A?q[C4-BO,
104 scaling 缩放 g.X?wyg5
105 ESR 等效串联电阻 [Page] LpJ\OI*v
106 Ground 地电位 3@?#4]D{'
107 trimmed bandgap 平衡带隙 X3I\O,"I
108 dropout voltage 压差 a <FzHCw
109 large bulk capacitance 大容量电容 ZPn`.Qc
110 circuit breaker 断路器 >fI<g8N D
111 charge pump 电荷泵 8Vv"'CU#
112 overshoot 过冲 |x2>F
*'vX:n&t
印制电路printed circuit <O&L2E @~f
印制线路 printed wiring FZz\zp
印制板 printed board BD[XP`[{
印制板电路 printed circuit board q"'^W<i
印制线路板 printed wiring board #Oz<<G<
印制元件 printed component ;_M .(8L
印制接点 printed contact 7_d gQI3y
印制板装配 printed board assembly eCMcr !.
板 board ]x?9lQ1&
刚性印制板 rigid printed board qiiX49}{
挠性印制电路 flexible printed circuit \y{Bnp5h
挠性印制线路 flexible printed wiring x
SF#ys4v
齐平印制板 flush printed board C
7YZ;{t
金属芯印制板 metal core printed board *f$mSI=
金属基印制板 metal base printed board =-~82%
多重布线印制板 mulit-wiring printed board P*T'R
塑电路板 molded circuit board 97e fWYj
散线印制板 discrete wiring board \f1r/e(G|
微线印制板 micro wire board \CM(
积层印制板 buile-up printed board K0yTHX?(.
表面层合电路板 surface laminar circuit 3/>McZ@OH
埋入凸块连印制板 B2it printed board 7 w_`<b6
载芯片板 chip on board K!"[,=u_
埋电阻板 buried resistance board FJKt5}`8
母板 mother board c~b[_J)
子板 daughter board ~d^+yR-
背板 backplane WZ'8{XY8
裸板 bare board bKYLBu:
键盘板夹心板 copper-invar-copper board "X g@X5BG
动态挠性板 dynamic flex board uO>$,s
静态挠性板 static flex board Ku*@4#<L6h
可断拼板 break-away planel C;}~C:aJ
电缆 cable THWT\3~,
挠性扁平电缆 flexible flat cable (FFC) *qj @y'1\
薄膜开关 membrane switch ~4'e)g.hG
混合电路 hybrid circuit 1]aM)},
厚膜 thick film bv5,Yk
厚膜电路 thick film circuit D)8&v`LS
薄膜 thin film .%<oy"_
薄膜混合电路 thin film hybrid circuit "'p:M,:
互连 interconnection F:x" RbbF
导线 conductor trace line SfyZ,0
齐平导线 flush conductor }H!c9Y
传输线 transmission line $SRpFz5y$
跨交 crossover hf^,
板边插头 edge-board contact 9xyj,;P>
增强板 stiffener 63QMv[`,
基底 substrate
YH&`+ +
基板面 real estate )7Gm<r
导线面 conductor side D3$PvX[f
元件面 component side )9 5&-Hs
焊接面 solder side kjfZ*V=-
导电图形 conductive pattern %RG kXOgp
非导电图形 non-conductive pattern xmb]L:4F
基材 base material RZ:Yu
层压板 laminate fQ=Yf ?b
覆金属箔基材 metal-clad bade material "yXKu)_
覆铜箔层压板 copper-clad laminate (CCL) g2JNa?z
复合层压板 composite laminate <w`
R;
薄层压板 thin laminate d^mw&F)S
基体材料 basis material ;"-(QE?Mv
预浸材料 prepreg f)l:^/WP+
粘结片 bonding sheet UX;?~X
预浸粘结片 preimpregnated bonding sheer Ij` %'/J
环氧玻璃基板 epoxy glass substrate S3EY9:^C
预制内层覆箔板 mass lamination panel 8{#WF#
内层芯板 core material V$VqYy9 *
粘结层 bonding layer ynvU$}w ~'
粘结膜 film adhesive >N62t9Ll[
无支撑胶粘剂膜 unsupported adhesive film z6]dF"N
覆盖层 cover layer (cover lay) t, #7F$t
增强板材 stiffener material t>N~PXr
铜箔面 copper-clad surface .LhIB?
去铜箔面 foil removal surface F{0Z
层压板面 unclad laminate surface VdjS\VYe,
基膜面 base film surface Qn(2UO!pD
胶粘剂面 adhesive faec bGOOC?[UX
原始光洁面 plate finish @X+m,u
粗面 matt finish _VGAh:v
剪切板 cut to size panel m_zl*s*6
超薄型层压板 ultra thin laminate K'%2 'd
A阶树脂 A-stage resin f6vhW66:?x
B阶树脂 B-stage resin ayfR{RYi
C阶树脂 C-stage resin O;z:?
环氧树脂 epoxy resin {^=T&aCYdS
酚醛树脂 phenolic resin yhv(KI
聚酯树脂 polyester resin <K;
聚酰亚胺树脂 polyimide resin $nF|n+m
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin [Gop-Vi/~
丙烯酸树脂 acrylic resin bc=,$
三聚氰胺甲醛树脂 melamine formaldehyde resin EudX^L5U<d
多官能环氧树脂 polyfunctional epoxy resin k#uSH
eq7f
溴化环氧树脂 brominated epoxy resin (hNTr(z
环氧酚醛 epoxy novolac M<^]Ywq*p
氟树脂 fluroresin :+NZW9_
硅树脂 silicone resin 1AQVj]#S
硅烷 silane mivb}cKM
聚合物 polymer 6!zBLIYFI
无定形聚合物 amorphous polymer fb-Lp#!T39
结晶现象 crystalline polamer |0ATH`{
双晶现象 dimorphism g xY6 M4
共聚物 copolymer 94VtGg=b}
合成树脂 synthetic hb#Nm6
热固性树脂 thermosetting resin [Page] 86Hg?!<i.
热塑性树脂 thermoplastic resin /N= }wC
感光性树脂 photosensitive resin :B{Wf 2<z
环氧值 epoxy value (StX1g'
双氰胺 dicyandiamide :No`+X[Kq
粘结剂 binder )Tjh
胶粘剂 adesive fh_+M"Y0`
固化剂 curing agent Lh%z2 5t
阻燃剂 flame retardant EP,j+^RVf
遮光剂 opaquer xfoQx_]$Im
增塑剂 plasticizers 9$[6\jMh
不饱和聚酯 unsatuiated polyester Ak3cE_*Y/
聚酯薄膜 polyester _PT5
聚酰亚胺薄膜 polyimide film (PI) 9d&@;&al
聚四氟乙烯 polytetrafluoetylene (PTFE) YBh|\
增强材料 reinforcing material "uCO?hv0
折痕 crease $B%wK`J
云织 waviness
hr$Wt?B
鱼眼 fish eye +t*V7nW
毛圈长 feather length U\*]cw
厚薄段 mark `eZzYe(N
裂缝 split !Gob `# r
捻度 twist of yarn DW(
/[jo\
浸润剂含量 size content Gyx4}pV
浸润剂残留量 size residue (
jAC Lo
处理剂含量 finish level 4>^LEp
偶联剂 couplint agent !/nXEjW?
断裂长 breaking length 37apOK4+
吸水高度 height of capillary rise "s-3226kj
湿强度保留率 wet strength retention LMKhtOZ?
白度 whitenness F m?j-'
导电箔 conductive foil .~$!BWP
铜箔 copper foil $%BI8_
压延铜箔 rolled copper foil nQGl]2
光面 shiny side Cj%n?-
粗糙面 matte side Pi+pQFz5
处理面 treated side cWtuI(.
防锈处理 stain proofing [Ef6@
双面处理铜箔 double treated foil 5(zdM)Y7
模拟 simulation D:] QBA)C
逻辑模拟 logic simulation Su/8P[q_
电路模拟 circit simulation n6AA%? 5
时序模拟 timing simulation _'8P8T&
模块化 modularization IG+g7kDCY
设计原点 design origin QC,fyw\
优化(设计) optimization (design) (E;+E\E
供设计优化坐标轴 predominant axis ;b{yu|
表格原点 table origin GYZP?E p*
元件安置 component positioning Hr_5N,
比例因子 scaling factor oyB
gF\
扫描填充 scan filling gY'-C
矩形填充 rectangle filling *\.8*6*$!
填充域 region filling xKR\w!+Z'
实体设计 physical design arIEd VfNa
逻辑设计 logic design ho-#Xbq#g
逻辑电路 logic circuit SR$ 'JGfp
层次设计 hierarchical design 7}:+Yx
自顶向下设计 top-down design 3CzF@t;5
自底向上设计 bottom-up design lihIPMU
费用矩阵 cost metrix +GJPj(S
元件密度 component density m"@o
自由度 degrees freedom 0~~yYo&
出度 out going degree
d^=9YRc
入度 incoming degree 7fI2b,~
曼哈顿距离 manhatton distance TZ63=m
欧几里德距离 euclidean distance }*
\*<d
3
网络 network H;R~d%!b
阵列 array PYBE?td
段 segment 3eg6 CdT
逻辑 logic Lqdapx"Z_
逻辑设计自动化 logic design automation Ngj&1Ta&[
分线 separated time MyZVx|7E
分层 separated layer X n8&&w"
定顺序 definite sequence ollsB3]]
导线(通道) conduction (track) HfZ ^ED"}
导线(体)宽度 conductor width QM![tZt%;
导线距离 conductor spacing ]5K+W
导线层 conductor layer
1fvN[
导线宽度/间距 conductor line/space Kt](|
第一导线层 conductor layer No.1 gu6%$z
圆形盘 round pad "fr{:'HX
方形盘 square pad V@g v
菱形盘 diamond pad 42~.N=2
长方形焊盘 oblong pad I_5/e>9
子弹形盘 bullet pad /oW]? 9
泪滴盘 teardrop pad iciKjXJ:
雪人盘 snowman pad hxzA1s%~
形盘 V-shaped pad V ,PmUl=
环形盘 annular pad 3dSb!q0&N
非圆形盘 non-circular pad dQ:F 5|p
隔离盘 isolation pad ufCpX>lNF
非功能连接盘 monfunctional pad J/fnSy
偏置连接盘 offset land c7~R0nP
腹(背)裸盘 back-bard land ]J [d8S5
盘址 anchoring spaur .uVd'
连接盘图形 land pattern }zks@7kf
连接盘网格阵列 land grid array _Dd>e=v
孔环 annular ring Um}AV
元件孔 component hole OLPY<ax
安装孔 mounting hole y=c={Qz@vn
支撑孔 supported hole O2\(:tvw
非支撑孔 unsupported hole lP*n%Pn)
导通孔 via zz[fkH3
镀通孔 plated through hole (PTH) N2k<W?wQ
余隙孔 access hole tu Y+n2
盲孔 blind via (hole) d&CpaOSu
埋孔 buried via hole R)BXN~dQ
埋,盲孔 buried blind via xu_,0ZT]{
任意层内部导通孔 any layer inner via hole H0#=oJr$)W
全部钻孔 all drilled hole T\n6^@.>
定位孔 toaling hole r88De=*
无连接盘孔 landless hole g0bYO!gCr
中间孔 interstitial hole =/_u k{
无连接盘导通孔 landless via hole (M"rpG>L
引导孔 pilot hole qC{JsX`~
端接全隙孔 terminal clearomee hole CvmIDRP*
准尺寸孔 dimensioned hole [Page] Gc"hU:m
在连接盘中导通孔 via-in-pad
WB?HY?[r
孔位 hole location *2u~5Kc<
孔密度 hole density /W)A[jR
孔图 hole pattern zxx\jpBBk
钻孔图 drill drawing |dqHpogh
装配图assembly drawing OtoM
参考基准 datum referan vjS=ZinN"
1) 元件设备 ;<N:! $p
}rI:pp^KS
三绕组变压器:three-column transformer ThrClnTrans Hc=QSP
双绕组变压器:double-column transformer DblClmnTrans *Q^z4UY
电容器:Capacitor :u./"[G
并联电容器:shunt capacitor (z>t 4(%\
电抗器:Reactor >9rZVNMU
母线:Busbar 6_4B!
输电线:TransmissionLine Fu_I0z
发电厂:power plant w+>+hq
断路器:Breaker RzjUrt
刀闸(隔离开关):Isolator EC;>-s
分接头:tap Nw'03Jzx_
电动机:motor }VZExqm)
(2) 状态参数 HK8sn1j
6ki2/ Q
有功:active power s91[@rh/
无功:reactive power @2/|rq
电流:current 1*9.K'
容量:capacity ?}Z t&(#
电压:voltage \O;2^
档位:tap position (_zlCHB
有功损耗:reactive loss WN+i 3hC
无功损耗:active loss N
o6!gZ1
功率因数:power-factor ,< x/
功率:power <mE`<-$
功角:power-angle ^"X.aksA
电压等级:voltage grade g w([08
空载损耗:no-load loss \"oZ\_
铁损:iron loss ^sD
M>OHp
铜损:copper loss 4MzQH-U>/
空载电流:no-load current (MI>7| ';
阻抗:impedance iyl
i/3|
正序阻抗:positive sequence impedance B={_}f
负序阻抗:negative sequence impedance Q!;syJBb.
零序阻抗:zero sequence impedance b&+zAt.
电阻:resistor JP5e=Z<
电抗:reactance l,7&
z
电导:conductance b<00 %Z
电纳:susceptance 5,1<A@H
无功负载:reactive load 或者QLoad KOS0Du
有功负载: active load PLoad E7fQ9]
遥测:YC(telemetering) a)JXxst
遥信:YX =Z
励磁电流(转子电流):magnetizing current fz=?QEG
定子:stator W5
F\e[Ax5
功角:power-angle z#GZb
上限:upper limit cjEqN8
下限:lower limit y4Jc|)
并列的:apposable [34N/;5
高压: high voltage #[#evlr=
低压:low voltage dtC@cK/,D
中压:middle voltage V:kRr cX
电力系统 power system f1MRmp-f'
发电机 generator \b"rf697,
励磁 excitation m}uOBR+
励磁器 excitor
=\oH=
f
电压 voltage Af;Pl|Zh[
电流 current eBrNhE-[G]
母线 bus ,x8;| o5
变压器 transformer 7y'":1
升压变压器 step-up transformer jmID@37t
高压侧 high side JXK\mah
输电系统 power transmission system y&zFS4"x
输电线 transmission line 5l6/5
固定串联电容补偿fixed series capacitor compensation pbzFzLal
稳定 stability `I5^zi8
电压稳定 voltage stability }csA|cC
功角稳定 angle stability }=^ ,c
暂态稳定 transient stability R |c=I}@F
电厂 power plant :(n<c
能量输送 power transfer KNx/1lf
交流 AC zuvPV{
X
装机容量 installed capacity zqeQ
电网 power system $jN.yNm0
落点 drop point LTWkHyx
开关站 switch station _uQ]I^ 'D
双回同杆并架 double-circuit lines on the same tower Hb=#`
变电站 transformer substation #d-({blo<
补偿度 degree of compensation Ay16/7h@hi
高抗 high voltage shunt reactor |p6d]#z3
无功补偿 reactive power compensation ,9P-<P
故障 fault "6f`hy
调节 regulation x0
)V
o]r
裕度 magin
-tg|y
三相故障 three phase fault F0:]@0>r
故障切除时间 fault clearing time 4[gmA
极限切除时间 critical clearing time D\Ak-$kJ^
切机 generator triping GcVQz[E
高顶值 high limited value ipv5JD[
强行励磁 reinforced excitation Z1
D
线路补偿器 LDC(line drop compensation) y]j.PT`Cw
机端 generator terminal O?e9wI=H
静态 static (state) jrib"Bh3,
动态 dynamic (state) _?c.m*)A
单机无穷大系统 one machine - infinity bus system L`+[mX&2B
机端电压控制 AVR }_D .Hy5
电抗 reactance <0CjEsAB]
电阻 resistance mU/o%|h
功角 power angle o:d7IL
有功(功率) active power ?@b6(f
xX
无功(功率) reactive power ?:;;0kSk
功率因数 power factor V\L;EHtc$
无功电流 reactive current rqamBm 5
下降特性 droop characteristics j6qtR$l|
斜率 slope kKyU?/aj
额定 rating $plk>Khg
变比 ratio .|,LBc!
参考值 reference value h.\I
tK{)
电压互感器 PT i KSRr#/
分接头 tap X=sE1RB
下降率 droop rate ._}}@V_/
仿真分析 simulation analysis Cj0r2^`
传递函数 transfer function WyO*8b_
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框图 block diagram qezWfR`
受端 receive-side CD`a-]6qA
裕度 margin 7'\.QJ!<
同步 synchronization t!?`2Z5
失去同步 loss of synchronization kF|$oBQ
阻尼 damping Px_8lB/;
摇摆 swing Ng#psN
保护断路器 circuit breaker !<w6j-S
电阻:resistance Ic/hVKYG5
电抗:reactance Cd%5XD^
阻抗:impedance @@Q4{o
电导:conductance AwJg/VBo)
电纳:susceptance