1 backplane 背板 #jnb6v=5v
2 Band gap voltage reference 带隙电压参考 /u?^s "C/
3 benchtop supply 工作台电源 i#
QI}r
4 Block Diagram 方块图 5 Bode Plot 波特图 Er{yQIi0L
6 Bootstrap 自举
Eg
;r]?|6
7 Bottom FET Bottom FET +] FdgmK:
8 bucket capcitor 桶形电容 #
TvY*D,
9 chassis 机架 m~2PpO
10 Combi-sense Combi-sense WXJ%bH
11 constant current source 恒流源 W &*0F~
12 Core Sataration 铁芯饱和 z+;+c$X
13 crossover frequency 交叉频率 Mq-;sPsFP
14 current ripple 纹波电流 $[H3O(B0*
15 Cycle by Cycle 逐周期 R+P1 +5
16 cycle skipping 周期跳步 SoCa_9*X
17 Dead Time 死区时间 d^w6_
18 DIE Temperature 核心温度 Qv#]T,
19 Disable 非使能,无效,禁用,关断 gVb;sk^
20 dominant pole 主极点 aK'BC>uFI
21 Enable 使能,有效,启用 p2\@E}
z
22 ESD Rating ESD额定值 ?v6xaVg:
23 Evaluation Board 评估板 SDZ/rC!C
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. ,XR1N$LN8_
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 f`T#=6C4|
25 Failling edge 下降沿 Y\s@'UoVN
26 figure of merit 品质因数 iOw'NxmY
27 float charge voltage 浮充电压 :Oxrw5`=
28 flyback power stage 反驰式功率级 4v Ug:'DM
29 forward voltage drop 前向压降 ?8pR RzV$
30 free-running 自由运行 J#MUtpPdQ
31 Freewheel diode 续流二极管 $vx]\`
^
32 Full load 满负载 33 gate drive 栅极驱动 G{)2f&<
34 gate drive stage 栅极驱动级 VTS8IXz
35 gerber plot Gerber 图
ym^
36 ground plane 接地层 SIVzc Hm
37 Henry 电感单位:亨利 r"c<15g2'
38 Human Body Model 人体模式 &iez{[O
39 Hysteresis 滞回 |pA3ZWm
40 inrush current 涌入电流 OLTgBXh
41 Inverting 反相 b{_J%p
42 jittery 抖动 DYx3NDX7
43 Junction 结点 #R}sGT
44 Kelvin connection 开尔文连接 bs/Vn'CE
45 Lead Frame 引脚框架 rjz$~(&m6
46 Lead Free 无铅 icH\(
47 level-shift 电平移动 F@UbUm2o
48 Line regulation 电源调整率 M]
7#
49 load regulation 负载调整率 kocgPO5
50 Lot Number 批号 DJR_"8
51 Low Dropout 低压差 ^z)p@sk#
52 Miller 密勒 53 node 节点 ^-Bx zOp
54 Non-Inverting 非反相 q-}qrg
55 novel 新颖的 B^nE^"b
56 off state 关断状态 d#NG]V/
57 Operating supply voltage 电源工作电压 ^\KZE|^3@
58 out drive stage 输出驱动级 WS6'R
59 Out of Phase 异相 j"1#n? 0
60 Part Number 产品型号 <*oTVl4fS
61 pass transistor pass transistor l$
^LY)i
62 P-channel MOSFET P沟道MOSFET >cJf D9-<h
63 Phase margin 相位裕度 6fY-DqF!
64 Phase Node 开关节点 0o7*5| T4
65 portable electronics 便携式电子设备 F!ZE4S_
66 power down 掉电 +VT/c
67 Power Good 电源正常 HtpZ5
68 Power Groud 功率地 wwUa+6?
69 Power Save Mode 节电模式 4h~CDy%_
70 Power up 上电 #q?'<''d,
71 pull down 下拉 O/ybqU\7
72 pull up 上拉 y rH@:D/
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) "RcNy~
74 push pull converter 推挽转换器 Y].,}}9k
75 ramp down 斜降 F#=M$j_
76 ramp up 斜升 ;8m) a
77 redundant diode 冗余二极管 []OmztB
78 resistive divider 电阻分压器 $Y`oqw?g+^
79 ringing 振 铃 gv\WI4"n
80 ripple current 纹波电流 bY&!d.
81 rising edge 上升沿
z>lIZ}
82 sense resistor 检测电阻 :<gC7UW
83 Sequenced Power Supplys 序列电源 ?`hA :X<
84 shoot-through 直通,同时导通 h(C@IIO^;G
85 stray inductances. 杂散电感 V$0mcwH
86 sub-circuit 子电路 P_}wjz}9ZX
87 substrate 基板 *{DpNV8"
88 Telecom 电信 aGBUFCCa
89 Thermal Information 热性能信息 z;wOtKl5r
90 thermal slug 散热片 nEHmiG
91 Threshold 阈值 QlE]OAdB42
92 timing resistor 振荡电阻 =aB c.PJ^
93 Top FET Top FET ?mwa6]
94 Trace 线路,走线,引线 1Be/(pSc
95 Transfer function 传递函数 fb+_]{7g
96 Trip Point 跳变点 Ua%;hI)j$
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) g~p43sVV
98 Under Voltage Lock Out (UVLO) 欠压锁定 j[CXIz?c
99 Voltage Reference 电压参考 q\Q'9Rl0(
100 voltage-second product 伏秒积 T{:8,CiW
101 zero-pole frequency compensation 零极点频率补偿 0hg4y
102 beat frequency 拍频 8B!MgNKV
103 one shots 单击电路 rHiBW!
104 scaling 缩放 Y6G`p
105 ESR 等效串联电阻 [Page] I
>aKa
106 Ground 地电位 Q@ua
G,6
107 trimmed bandgap 平衡带隙 I9Lt>*
108 dropout voltage 压差 'pj*6t1~
109 large bulk capacitance 大容量电容 @)XR
110 circuit breaker 断路器
SwE bVwB
111 charge pump 电荷泵 ^u(-v/D9
112 overshoot 过冲 :'2h0
5R
HSR,moI
印制电路printed circuit IN_O!c0e
印制线路 printed wiring H
S)$|m_
印制板 printed board nvB<pSm
印制板电路 printed circuit board sm Kp3_r
印制线路板 printed wiring board U4=m>Ty
印制元件 printed component A01PEVd@A
印制接点 printed contact >N~orSw%
印制板装配 printed board assembly 1>=%TIO)
板 board 6L"b O'_5K
刚性印制板 rigid printed board )=nB32~J"
挠性印制电路 flexible printed circuit 'i<%kL@
挠性印制线路 flexible printed wiring m
yy*rt
齐平印制板 flush printed board v,|jmv+:
金属芯印制板 metal core printed board \1sWmN6
金属基印制板 metal base printed board oT0:Ny
多重布线印制板 mulit-wiring printed board Q[Gs%/>
塑电路板 molded circuit board cs9"0&JX
散线印制板 discrete wiring board kho$At)V
微线印制板 micro wire board W2{4s
1
积层印制板 buile-up printed board ivg W[]
表面层合电路板 surface laminar circuit NvvD~Bb
埋入凸块连印制板 B2it printed board h t3P@;
载芯片板 chip on board ka@yQ V
埋电阻板 buried resistance board ,]tEh:QC
母板 mother board vRb7=fXf
子板 daughter board &z05h<]
背板 backplane iD.p KG
裸板 bare board (&-I-#i
键盘板夹心板 copper-invar-copper board 97dF
动态挠性板 dynamic flex board }{}?mQ
静态挠性板 static flex board WMS~Bk+!
可断拼板 break-away planel z))rk vL%
电缆 cable %Z8wUG
挠性扁平电缆 flexible flat cable (FFC) uS JLIb
薄膜开关 membrane switch F. I\?b
混合电路 hybrid circuit
_7b4+ L
厚膜 thick film _yp<#q]
厚膜电路 thick film circuit XMzQ8|]
薄膜 thin film !yvw5As %
薄膜混合电路 thin film hybrid circuit P6")OWd
互连 interconnection ydMhb367|
导线 conductor trace line \!"3yd
齐平导线 flush conductor &oE'|^G
传输线 transmission line \E6 0
跨交 crossover Y.q$"lm7k
板边插头 edge-board contact *x_e] /}
增强板 stiffener #r,!-;^'p
基底 substrate fZ(k"*\MZ
基板面 real estate 7Y)i>[u3
导线面 conductor side Wngc(+6O&
元件面 component side p0D@O_
:5
焊接面 solder side r)B55;*Fh
导电图形 conductive pattern 7[0<,O6Q
非导电图形 non-conductive pattern He%v 4S
基材 base material <E:_9#Z0sc
层压板 laminate (Vn3g ra
覆金属箔基材 metal-clad bade material H6Ytp^~>
覆铜箔层压板 copper-clad laminate (CCL) ^x Z=";eq
复合层压板 composite laminate :;;k+Sw3
薄层压板 thin laminate 8?rq{&$t
基体材料 basis material 1+[,eq
预浸材料 prepreg lk[u
粘结片 bonding sheet 3sgo5D-rMI
预浸粘结片 preimpregnated bonding sheer ~>Y^?l
环氧玻璃基板 epoxy glass substrate S_ra8HY8
预制内层覆箔板 mass lamination panel mz<X$2]?
内层芯板 core material Md0`/F:+2
粘结层 bonding layer 2Sk hBb=d
粘结膜 film adhesive ~.#57g F"
无支撑胶粘剂膜 unsupported adhesive film Ffd4c
覆盖层 cover layer (cover lay) r?|(t?
增强板材 stiffener material aWNjl
铜箔面 copper-clad surface 2&=CC4<!d
去铜箔面 foil removal surface :UX8^+bfZ
层压板面 unclad laminate surface wc#k@"2AZb
基膜面 base film surface a|DCpU}
胶粘剂面 adhesive faec 5=fS^]- F
原始光洁面 plate finish p&\DG
粗面 matt finish eep/96G
?
剪切板 cut to size panel JEK_W<BD
超薄型层压板 ultra thin laminate #bCUI*N"P
A阶树脂 A-stage resin 7#N
?{3i
B阶树脂 B-stage resin b!`6s
C阶树脂 C-stage resin Js.G
hTs
环氧树脂 epoxy resin 7+Nl)d:CJ
酚醛树脂 phenolic resin {E}D6`{
聚酯树脂 polyester resin i~3\dp
聚酰亚胺树脂 polyimide resin "yl6WG#J
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin CtUAbR
丙烯酸树脂 acrylic resin ].Ra=^q
三聚氰胺甲醛树脂 melamine formaldehyde resin i>C%[dk9
多官能环氧树脂 polyfunctional epoxy resin We*uZ?+
溴化环氧树脂 brominated epoxy resin lv~ga2>z
环氧酚醛 epoxy novolac =$ T[
氟树脂 fluroresin oTr,zRL
硅树脂 silicone resin `=Rxnl,<U
硅烷 silane I,"q:QS+
聚合物 polymer o5YL_=7m
无定形聚合物 amorphous polymer I]42R;Sc
结晶现象 crystalline polamer ^W`RBrJay
双晶现象 dimorphism fhha-J
共聚物 copolymer YS<KyTb"
合成树脂 synthetic :f7:@8
热固性树脂 thermosetting resin [Page] QWWI
热塑性树脂 thermoplastic resin !Q,Dzv"7
感光性树脂 photosensitive resin eT?vZH[N
环氧值 epoxy value ^)'D
eP/
双氰胺 dicyandiamide &x4*YMh
粘结剂 binder :G=ol2Q
胶粘剂 adesive "Y"`'U=v
固化剂 curing agent jw/@]f;N
阻燃剂 flame retardant 9H53H"5q
遮光剂 opaquer JUJrtKS
增塑剂 plasticizers o#D'"Tn!
不饱和聚酯 unsatuiated polyester ]ki) (Bb
聚酯薄膜 polyester 1\AcceJ|(w
聚酰亚胺薄膜 polyimide film (PI) 6BZi4:PDx
聚四氟乙烯 polytetrafluoetylene (PTFE) e@5w?QzW
增强材料 reinforcing material .Q{VY]B^
折痕 crease T hVq5
云织 waviness DYrci?8Ith
鱼眼 fish eye 7f*b5$+r
毛圈长 feather length !Q}Bz*Y
厚薄段 mark 0IHAoV60
裂缝 split <p?oFD_e4
捻度 twist of yarn A'D2uV
浸润剂含量 size content U.=TjCW
浸润剂残留量 size residue K_;?Sr=
处理剂含量 finish level !<F5W<V
偶联剂 couplint agent dZddoz_
断裂长 breaking length ) bd`U
吸水高度 height of capillary rise d"a\`#
湿强度保留率 wet strength retention !u/c'ZLZ>
白度 whitenness -vh\XO
导电箔 conductive foil NFG~PZ`6R
铜箔 copper foil j9}.U \
压延铜箔 rolled copper foil h?fp(
光面 shiny side ]w]:9w
粗糙面 matte side ACI.{`SrQ=
处理面 treated side %][zn$aa|
防锈处理 stain proofing dV^ck+
双面处理铜箔 double treated foil SPvKq=,
模拟 simulation f%P#.
逻辑模拟 logic simulation [vnxp/v/<
电路模拟 circit simulation r
jnf30
时序模拟 timing simulation gEmsPk,
模块化 modularization s-F3(mc(
设计原点 design origin B9`_~~^U5
优化(设计) optimization (design) =`!#V/=
供设计优化坐标轴 predominant axis }_Y\6fcd
表格原点 table origin Z5*O\kJv
元件安置 component positioning ~F;>4q
比例因子 scaling factor eMP0BS"
扫描填充 scan filling YdYaLTz
矩形填充 rectangle filling @-ir
填充域 region filling \=(U tro
实体设计 physical design xo(>nFjo
逻辑设计 logic design \}gITc).j
逻辑电路 logic circuit VT;cz6"6b4
层次设计 hierarchical design kPSi6ci
自顶向下设计 top-down design j,1cb,}=^
自底向上设计 bottom-up design D/z*F8'c
费用矩阵 cost metrix !3"Hn
元件密度 component density J$(79gH{
自由度 degrees freedom JycC\s+%E
出度 out going degree aOEW$%
入度 incoming degree D&6.> wt
.
曼哈顿距离 manhatton distance +X>Aj=#
欧几里德距离 euclidean distance h0l_9uI
网络 network = d !YM6G
阵列 array cejD(!MKe
段 segment iP?lP= M
逻辑 logic 2p*L~! iM
逻辑设计自动化 logic design automation b^<7@tY
分线 separated time %D ,(S-Uj
分层 separated layer xz}=C:s
定顺序 definite sequence \~T&C5
导线(通道) conduction (track) 8>:u%+C1c
导线(体)宽度 conductor width Enhrkk
导线距离 conductor spacing \obM}caT
导线层 conductor layer T
0?9F2
导线宽度/间距 conductor line/space @[;$R@M_3
第一导线层 conductor layer No.1 - ysd`&
圆形盘 round pad #
tU@\H5kN
方形盘 square pad ItG|{Bo
菱形盘 diamond pad 8]J lYe
长方形焊盘 oblong pad hNF, sA
子弹形盘 bullet pad Jx8DVjy
泪滴盘 teardrop pad oho~?.F
雪人盘 snowman pad {HP.HK
形盘 V-shaped pad V jG,^~5x
环形盘 annular pad x'
3kHw
非圆形盘 non-circular pad 3e|,Z'4}4
隔离盘 isolation pad :(4];Va
非功能连接盘 monfunctional pad eGI&4JgJ.
偏置连接盘 offset land NOtwgZ-
腹(背)裸盘 back-bard land &G7@lz@sK+
盘址 anchoring spaur ^C{?LH/2
连接盘图形 land pattern A$]#f
连接盘网格阵列 land grid array q94*2@KV
孔环 annular ring ,u
元件孔 component hole I!~3xZ
安装孔 mounting hole B_0]$D0
^
支撑孔 supported hole S{~j5tQv^q
非支撑孔 unsupported hole ,fyqa
导通孔 via a&gf0g;@I
镀通孔 plated through hole (PTH) n:%A4*
余隙孔 access hole V V Aw y6
盲孔 blind via (hole) vtTXs]>
埋孔 buried via hole Cx8
H
埋,盲孔 buried blind via ypY7uYO^"
任意层内部导通孔 any layer inner via hole Xgo`XsA
全部钻孔 all drilled hole 7 '7a`-W
定位孔 toaling hole ''CowI
无连接盘孔 landless hole cqb]LC
中间孔 interstitial hole Q8bn|#`
无连接盘导通孔 landless via hole N<|-b0#Z6
引导孔 pilot hole 4,ewp coC%
端接全隙孔 terminal clearomee hole &0J/V>k
准尺寸孔 dimensioned hole [Page] P)hawH=
在连接盘中导通孔 via-in-pad Jl89}Sf
孔位 hole location -257g;
孔密度 hole density *9}~?#b
孔图 hole pattern Wr.~Ns<
钻孔图 drill drawing *q(HW
装配图assembly drawing 2$oGy
参考基准 datum referan ^4>Icz^ F
1) 元件设备 )auuk<
|1Ko5z
三绕组变压器:three-column transformer ThrClnTrans 9!Vp-bo
双绕组变压器:double-column transformer DblClmnTrans v5`Odbc=w
电容器:Capacitor K#plSD^f=
并联电容器:shunt capacitor @#| R{5=+
电抗器:Reactor 8hvh
xp
母线:Busbar OY(znVHU
输电线:TransmissionLine PX,fg5s\b
发电厂:power plant 7:&a,nU
断路器:Breaker pPZ^T5-ks
刀闸(隔离开关):Isolator )hK1W\5
分接头:tap OGU#%5"<
电动机:motor AmT*{Fz8
(2) 状态参数 2N_9S?a3sK
Z!qF0UDj
有功:active power WFFpW{
无功:reactive power r#K" d
电流:current {X>U`0P
容量:capacity 69/qH_Y
电压:voltage SQx:`{O
档位:tap position BGVy
\F<
有功损耗:reactive loss 9i#K{CkC|
无功损耗:active loss ]lzOz<0q
功率因数:power-factor .AZ+|?d
功率:power XY`2>7
功角:power-angle (ZuV5|N
电压等级:voltage grade WjMP]ND#c
空载损耗:no-load loss =6+j
Po{F
铁损:iron loss w'Q2Czso
铜损:copper loss ;V3d"@R,
空载电流:no-load current NbW5a3=
阻抗:impedance Y{ 2xokJ N
正序阻抗:positive sequence impedance G6x 2!Ny
负序阻抗:negative sequence impedance 9<I;9.1S?^
零序阻抗:zero sequence impedance &b&o];a
电阻:resistor gb/M@6/j
电抗:reactance Mt`XHXTp
电导:conductance Gu9x4p
电纳:susceptance esQRg~aCGy
无功负载:reactive load 或者QLoad U9p^?\-=
有功负载: active load PLoad .:#6dG\0z
遥测:YC(telemetering) ZI#Xh5
遥信:YX pvJPMx
励磁电流(转子电流):magnetizing current |qsY0zx
定子:stator K1>(Fs$
功角:power-angle Dbo.N`
上限:upper limit S=~8nr/V
下限:lower limit CDM==Xa*
并列的:apposable `+0)dTA(g$
高压: high voltage 15FGlO<<
低压:low voltage 7oI^sh k
中压:middle voltage Aw *:5 I[
电力系统 power system T"m(V/L$W
发电机 generator >K;'dB/m;1
励磁 excitation \4`2k
励磁器 excitor p,w6D,h
电压 voltage SbW6O_
电流 current L&nGjC+Lr
母线 bus XL7jUi_4:L
变压器 transformer v+Q#O[
升压变压器 step-up transformer 8; s$?*Gi
高压侧 high side kY6))9 O
输电系统 power transmission system ?k:i3$
输电线 transmission line M^^u{);q
固定串联电容补偿fixed series capacitor compensation z[wk-a+w
稳定 stability
8Cr?0Z
电压稳定 voltage stability +>5
"fs$Y
功角稳定 angle stability RFu]vFff
暂态稳定 transient stability
Dk fw*Oo
电厂 power plant Aq{m42EAj
能量输送 power transfer %R{clbbbn
交流 AC n[/|M
装机容量 installed capacity ~U~4QQ V
电网 power system lA<IcW
落点 drop point ngJES`0d
开关站 switch station d0 tN73(
双回同杆并架 double-circuit lines on the same tower .W&rcqy
变电站 transformer substation cZ7b$MZ%9
补偿度 degree of compensation *{)![pDYd
高抗 high voltage shunt reactor \(LHcvbb
无功补偿 reactive power compensation C6eo n4Ut
故障 fault P
+ nT%
调节 regulation ~I>B5^3
裕度 magin L$x/T3@
三相故障 three phase fault AsM""x1Ix
故障切除时间 fault clearing time gGU3e(!Uc
极限切除时间 critical clearing time F7 7[fp
切机 generator triping >}/"gx
高顶值 high limited value 8X]j;Rb
强行励磁 reinforced excitation :OBggb#?!
线路补偿器 LDC(line drop compensation) p$@=N6)I.k
机端 generator terminal 6#5@d^a
静态 static (state) ?xX`_l
动态 dynamic (state) }~-)31e'`
单机无穷大系统 one machine - infinity bus system N_r*Ig
机端电压控制 AVR ki^[~JS>'
电抗 reactance 4#=!VK8ZH
电阻 resistance Pwz^{*u]
功角 power angle 9#6ilF:F
有功(功率) active power |_~BV&g,N
无功(功率) reactive power M)EUR0>8
功率因数 power factor ~%Yh`c
EP
无功电流 reactive current AJ:@c7:eS
下降特性 droop characteristics K"b vUH
斜率 slope qTyU1RU$9^
额定 rating Qq]UEI `Go
变比 ratio b)w3
G%Xx
参考值 reference value 3g|O2>*?
电压互感器 PT !,\9,lc
分接头 tap i`8!Vm
下降率 droop rate Ok({Al1A,w
仿真分析 simulation analysis Ed*`d>
传递函数 transfer function {Rw~G&vQ
框图 block diagram "Jnq~7]
受端 receive-side #8|;Q`Or:
裕度 margin <k^9l6@
同步 synchronization ieS5*@^k
失去同步 loss of synchronization J(/
eR,ak
阻尼 damping B{1+0k
摇摆 swing ;{Z2i%
保护断路器 circuit breaker p7H*Ff`
电阻:resistance ! 2Y,
a
电抗:reactance "TjR]jnV(
阻抗:impedance Cfz1\a&V{
电导:conductance N}FG%a
电纳:susceptance