1 backplane 背板 n UD;y}}n
2 Band gap voltage reference 带隙电压参考 ==~
lc;
3 benchtop supply 工作台电源 %>:d5"&Lbs
4 Block Diagram 方块图 5 Bode Plot 波特图 `,FvYA"
6 Bootstrap 自举 rh(77x1|(G
7 Bottom FET Bottom FET IZ+ZIR@}ci
8 bucket capcitor 桶形电容 :FI4GR*?
9 chassis 机架 i>@"&
10 Combi-sense Combi-sense X1lL@ `r.5
11 constant current source 恒流源 'FGf#l<
12 Core Sataration 铁芯饱和 $:0?"?o);
13 crossover frequency 交叉频率 }m-+EUEo9
14 current ripple 纹波电流 VXu1Y xY
15 Cycle by Cycle 逐周期 v
iM6q<Ht
16 cycle skipping 周期跳步 iYzm<3n?
17 Dead Time 死区时间 3 e<sNU?
18 DIE Temperature 核心温度 tje
19 Disable 非使能,无效,禁用,关断 >*[Bq;
20 dominant pole 主极点 GAcU8MD
21 Enable 使能,有效,启用 HVcd< :g0
22 ESD Rating ESD额定值 '~kAsn*/
23 Evaluation Board 评估板 Fu#mMn0c
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. ai(J%"D"
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 qi-!iT(fe
25 Failling edge 下降沿 swT/
tesj
26 figure of merit 品质因数 -<WQ>mrB&
27 float charge voltage 浮充电压 (8OaXif
28 flyback power stage 反驰式功率级 i.*Utm`1"e
29 forward voltage drop 前向压降 ih/MW_t=m=
30 free-running 自由运行 lzStJ,NPqn
31 Freewheel diode 续流二极管 ?W4IAbT\G
32 Full load 满负载 33 gate drive 栅极驱动 uE{nnNZy
34 gate drive stage 栅极驱动级 Z,m;eCLG]
35 gerber plot Gerber 图 7\1bq&a<
36 ground plane 接地层 *%xmCPJ
37 Henry 电感单位:亨利 kkE1CHY
38 Human Body Model 人体模式 m\xE8D(,
39 Hysteresis 滞回 +MP`iuDO
40 inrush current 涌入电流 y%x2
41 Inverting 反相 3xGk@ 333
42 jittery 抖动 N_"mC^Vx
43 Junction 结点 SB'$?Kh
44 Kelvin connection 开尔文连接 Gdf*x<T1
45 Lead Frame 引脚框架 Jd>"g9
46 Lead Free 无铅 6P KH%
47 level-shift 电平移动 <kr%ylhIu
48 Line regulation 电源调整率 @.Pe.\Z
49 load regulation 负载调整率
Q>}*l|Ci
50 Lot Number 批号 @ \(*pa
51 Low Dropout 低压差 bl;C=n
52 Miller 密勒 53 node 节点 NbtNu$%t
54 Non-Inverting 非反相 h&}XG\ioNA
55 novel 新颖的 %XieKL
56 off state 关断状态 @4N@cM0
57 Operating supply voltage 电源工作电压 p%v+\T2r
58 out drive stage 输出驱动级 U^$o<2
59 Out of Phase 异相 P9aGDma
60 Part Number 产品型号 GCTf/V\#
61 pass transistor pass transistor Be(h x
62 P-channel MOSFET P沟道MOSFET Vg)]F+E
63 Phase margin 相位裕度 JtrLTo
64 Phase Node 开关节点 YI*Av+Z)
65 portable electronics 便携式电子设备 hDJ84$eVZ
66 power down 掉电 >1=sw
qa
67 Power Good 电源正常 Gmi$Nl!~
68 Power Groud 功率地 E|jbbCZy2
69 Power Save Mode 节电模式 HJ2r~KIw
70 Power up 上电 b4$-?f?V
71 pull down 下拉 H1FSN6'
72 pull up 上拉 Gdd lB2L)x
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) dfBTx6/F
74 push pull converter 推挽转换器 ]#N~r&hmQ
75 ramp down 斜降 Jn_; cN
76 ramp up 斜升 4EiEE{9V
77 redundant diode 冗余二极管 8N|y
78 resistive divider 电阻分压器 HV^*_
79 ringing 振 铃 p9[J9D3~
80 ripple current 纹波电流 OJUH".o
81 rising edge 上升沿 \i-HECc"U
82 sense resistor 检测电阻 G#&R/Tc5N
83 Sequenced Power Supplys 序列电源 ?>V4pgGCE
84 shoot-through 直通,同时导通 5X5 &(S\
85 stray inductances. 杂散电感 IZV D.1
86 sub-circuit 子电路 09{B6l6P
87 substrate 基板 i-'rS/R
88 Telecom 电信 S/?KC^JP
89 Thermal Information 热性能信息
9I:H=5c
90 thermal slug 散热片 _[8BAm
91 Threshold 阈值 , wT$L3
92 timing resistor 振荡电阻 FbVdqO
93 Top FET Top FET Jp<Y2-
94 Trace 线路,走线,引线 S"iz
fQ@
95 Transfer function 传递函数 ;=IGl:
96 Trip Point 跳变点 VemgG)\
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) LO,G2]
98 Under Voltage Lock Out (UVLO) 欠压锁定 W[]N.d7G
99 Voltage Reference 电压参考 *5bKJgwJ
100 voltage-second product 伏秒积 M4rOnIJ
101 zero-pole frequency compensation 零极点频率补偿 cCd2f>EHw
102 beat frequency 拍频 dHnR)[?e
103 one shots 单击电路 gOpGwpYZ,
104 scaling 缩放 OQ>r;)/
105 ESR 等效串联电阻 [Page] }];8v+M
106 Ground 地电位 -,t2D/xK
107 trimmed bandgap 平衡带隙 aO9a G*9T
108 dropout voltage 压差 smLXNO
109 large bulk capacitance 大容量电容 `b^eRnpR
110 circuit breaker 断路器 X0Q};,
111 charge pump 电荷泵 G'/36M@
112 overshoot 过冲 ^w eU\
]g
jhrD
印制电路printed circuit $0C1';=^}
印制线路 printed wiring 1>$fLbmkI
印制板 printed board ZW$PJmz
印制板电路 printed circuit board ppt`5F O
印制线路板 printed wiring board #\kYGr-G)
印制元件 printed component ,
4Vr,?"EO
印制接点 printed contact v7+f@Z:N*
印制板装配 printed board assembly /=9t$u|
板 board
}xcEWC\
刚性印制板 rigid printed board {c|=L@/
挠性印制电路 flexible printed circuit Sq,ZzMw
挠性印制线路 flexible printed wiring Ij_Y+Mnl4:
齐平印制板 flush printed board H]5%"(h
金属芯印制板 metal core printed board P%hi*0pwZ
金属基印制板 metal base printed board wXv\[zL`
多重布线印制板 mulit-wiring printed board 2<jbNnj
塑电路板 molded circuit board ?:(BkY,K5
散线印制板 discrete wiring board Fa`/i v
微线印制板 micro wire board `}/&}Sp
积层印制板 buile-up printed board Hf( d x\5
表面层合电路板 surface laminar circuit 6$qn'K$
埋入凸块连印制板 B2it printed board \8%64ZL`
载芯片板 chip on board -I7"9}j3
埋电阻板 buried resistance board yjUSM}$
母板 mother board hX\z93an
子板 daughter board sM)n-Yy#9
背板 backplane #<20vdc
裸板 bare board \hpD
键盘板夹心板 copper-invar-copper board nmlQ-V-
动态挠性板 dynamic flex board \'I->O]
静态挠性板 static flex board lg_X|yhL
可断拼板 break-away planel VU7x w
电缆 cable +@),Fk_
挠性扁平电缆 flexible flat cable (FFC) *Z"9Q X
薄膜开关 membrane switch P+!j[X^
混合电路 hybrid circuit )jbYWR*&
厚膜 thick film "G\OKt'Z
厚膜电路 thick film circuit 8<}f:9/
薄膜 thin film ;h>s=D,r
薄膜混合电路 thin film hybrid circuit 5a1)`2V2M
互连 interconnection VkCv`E
导线 conductor trace line nlaJ
齐平导线 flush conductor G<9UL*HU
传输线 transmission line trL:qD+{(
跨交 crossover y#HDJ=2
板边插头 edge-board contact "Gx(-NH+
增强板 stiffener #gbJ$1s
基底 substrate f6x}M9xS%
基板面 real estate o*7`r ~
导线面 conductor side V3&_ST
元件面 component side E"7 iU
焊接面 solder side z-*/jFE
导电图形 conductive pattern Nq|b$S [4
非导电图形 non-conductive pattern VmM?KlC
基材 base material !\.%^LK1
层压板 laminate |) {)w`
覆金属箔基材 metal-clad bade material 5 3=zHYQ
覆铜箔层压板 copper-clad laminate (CCL) M&Aeh8>uX
复合层压板 composite laminate yrO\\No#H
薄层压板 thin laminate '1]Iu@?
基体材料 basis material
y21zaQ
预浸材料 prepreg e1ru#'z
粘结片 bonding sheet Wh4`Iv\.
预浸粘结片 preimpregnated bonding sheer W%@L7 xh
环氧玻璃基板 epoxy glass substrate ZW\}4q;[A
预制内层覆箔板 mass lamination panel 0U'g2F>{
内层芯板 core material c`
^I% i
粘结层 bonding layer ndEW$?W,
粘结膜 film adhesive {?c`0C
无支撑胶粘剂膜 unsupported adhesive film {VqcZhqy/l
覆盖层 cover layer (cover lay) Yoy}Zdu}h
增强板材 stiffener material HY[eo/nM1d
铜箔面 copper-clad surface c}K>#{YeB
去铜箔面 foil removal surface l
:\DC
层压板面 unclad laminate surface C.M]~"e
基膜面 base film surface Yhu
6QyRV
胶粘剂面 adhesive faec $ftcYBZa
原始光洁面 plate finish "I.PV$Rxl
粗面 matt finish 5(kRFb'31F
剪切板 cut to size panel hawE2k0p(
超薄型层压板 ultra thin laminate |U}al[
A阶树脂 A-stage resin / 0Z_$Q&e
B阶树脂 B-stage resin Tdvw7I-q
C阶树脂 C-stage resin G%N3h'zDi
环氧树脂 epoxy resin e>W}3H5w0
酚醛树脂 phenolic resin W#1t%hT$
聚酯树脂 polyester resin C"w>U
聚酰亚胺树脂 polyimide resin ,<]X0;~oB
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin |ho|Kl `=
丙烯酸树脂 acrylic resin ao>`[-
三聚氰胺甲醛树脂 melamine formaldehyde resin -xi]~svg
多官能环氧树脂 polyfunctional epoxy resin noz&4"S.{
溴化环氧树脂 brominated epoxy resin B 14Ziopww
环氧酚醛 epoxy novolac i6F`KF'i&
氟树脂 fluroresin M5DW!^
硅树脂 silicone resin :Z0m "
硅烷 silane >W%tEc
聚合物 polymer ?ysC7((
无定形聚合物 amorphous polymer _B4H"2}[Y
结晶现象 crystalline polamer NbyVBl0=
双晶现象 dimorphism Vm
NCknG
共聚物 copolymer 871taL=
合成树脂 synthetic D&KD5_Sw
热固性树脂 thermosetting resin [Page] =lIG#{`Q
热塑性树脂 thermoplastic resin Gb]t%\
感光性树脂 photosensitive resin 1muB*
O
环氧值 epoxy value G?\\k[#,&
双氰胺 dicyandiamide F)x^AJie
粘结剂 binder bL>J0LWQ
胶粘剂 adesive =1' / ?
固化剂 curing agent E>xd*23+\
阻燃剂 flame retardant 'Q\I@s }
遮光剂 opaquer % j4
增塑剂 plasticizers *^]Hqf(`
不饱和聚酯 unsatuiated polyester bnS"@^M
聚酯薄膜 polyester E;7vGGf]
聚酰亚胺薄膜 polyimide film (PI) D;%(Z!
聚四氟乙烯 polytetrafluoetylene (PTFE) at_~b Ox6X
增强材料 reinforcing material XI#1)
折痕 crease 7Ddo^Gtx
云织 waviness 8.9TWsZ
鱼眼 fish eye 9/N=7<$
毛圈长 feather length 4Eq$f (QJ
厚薄段 mark md8r"
裂缝 split Kts#e:k@
捻度 twist of yarn -X#Zn>#
浸润剂含量 size content Kfho:e,
浸润剂残留量 size residue E3X6-J|
处理剂含量 finish level ^,`;x
偶联剂 couplint agent o5(`7XV6D
断裂长 breaking length |q&&"SpA
吸水高度 height of capillary rise 1+\ZLy!5:
湿强度保留率 wet strength retention yEm[C(gZ
白度 whitenness tz0_S7h
导电箔 conductive foil ":t'}Eg=6
铜箔 copper foil 4c"x&x|
压延铜箔 rolled copper foil ~@8r-[
光面 shiny side t#pF.!9=
粗糙面 matte side q$>/~aVM
处理面 treated side ROZOX$XM
防锈处理 stain proofing 8*O]
双面处理铜箔 double treated foil 2u0C~s
模拟 simulation 5$C4Ui{<E'
逻辑模拟 logic simulation |TCHPKN
电路模拟 circit simulation QH:PClW![
时序模拟 timing simulation -*;-T9
模块化 modularization Rlvb@aXgy
设计原点 design origin o&tETJ5Bhe
优化(设计) optimization (design) b(<#n6a}\
供设计优化坐标轴 predominant axis H=2sT +Sp
表格原点 table origin dW
hU
o\>=
元件安置 component positioning :q6j{C(
比例因子 scaling factor di^E8egR$
扫描填充 scan filling H^UuT
矩形填充 rectangle filling e!_+TyI
填充域 region filling B&J;yla6`d
实体设计 physical design O5^!\j.WR
逻辑设计 logic design JO\F-xO
逻辑电路 logic circuit ILsw'
层次设计 hierarchical design q/I':a[1
自顶向下设计 top-down design RRGo$
自底向上设计 bottom-up design E3IB> f
费用矩阵 cost metrix a`]Dmw8@
元件密度 component density ;|(_;d
自由度 degrees freedom |etA2"r&
出度 out going degree ZH]n&%@j
入度 incoming degree ]xhZJ~"@u
曼哈顿距离 manhatton distance EJF*_<f9O
欧几里德距离 euclidean distance v(uYso_
网络 network v[S>
阵列 array >hg?!jMjrr
段 segment "P4#Q_
逻辑 logic |3tq.JU
逻辑设计自动化 logic design automation {(o$? =
分线 separated time |8xu*dVAp4
分层 separated layer R $vo
定顺序 definite sequence }bwH(OOS
导线(通道) conduction (track) ?!PpooYK
导线(体)宽度 conductor width LEnm6
导线距离 conductor spacing `/WX!4eR,
导线层 conductor layer 9
U6cM-p?
导线宽度/间距 conductor line/space Q};g~b3
第一导线层 conductor layer No.1 TF_~)f(`
圆形盘 round pad Qfx:}zk{
方形盘 square pad xx^7
菱形盘 diamond pad y[ikpp#ozY
长方形焊盘 oblong pad xj/Iq<'R*O
子弹形盘 bullet pad 51:NL[[6
泪滴盘 teardrop pad h/T^+U?-<
雪人盘 snowman pad @qC](5|TQ
形盘 V-shaped pad V )~(( 6?k4e
环形盘 annular pad K,pQ11J
非圆形盘 non-circular pad Fu@2gd
隔离盘 isolation pad R?,O h*
非功能连接盘 monfunctional pad DB1F_! 9
偏置连接盘 offset land HzdtR
腹(背)裸盘 back-bard land (]*otVJ
盘址 anchoring spaur u ##.t
连接盘图形 land pattern b:OQ/
连接盘网格阵列 land grid array Ne6]?\Z
孔环 annular ring FH"u9ygF
元件孔 component hole irg%n
安装孔 mounting hole zkFx2(Hq-f
支撑孔 supported hole '"#W!p
非支撑孔 unsupported hole dd $}FlT
导通孔 via xPuuG{Sm
镀通孔 plated through hole (PTH) !F@9xG
余隙孔 access hole t-, =sV
盲孔 blind via (hole) *b<
a@
埋孔 buried via hole ]`p*ZTr)\
埋,盲孔 buried blind via Us5P?}
任意层内部导通孔 any layer inner via hole AD_aI
%7
全部钻孔 all drilled hole :cx}I
定位孔 toaling hole fu}ZOPu
无连接盘孔 landless hole 4tv}5llSG
中间孔 interstitial hole 0vu$dxb[
无连接盘导通孔 landless via hole O@$wU9D<
引导孔 pilot hole 1:L _qL
端接全隙孔 terminal clearomee hole "JHdF&
准尺寸孔 dimensioned hole [Page] F;I % 9-R
在连接盘中导通孔 via-in-pad 'a}<|Et.
孔位 hole location r`t|}m
孔密度 hole density ]<9KX} B
孔图 hole pattern jB"?iC.
钻孔图 drill drawing 6*!R'
装配图assembly drawing m^6& !`CD
参考基准 datum referan !|SVRaS
1) 元件设备 Bu:h_sV D
s]D&):
三绕组变压器:three-column transformer ThrClnTrans ncF|wz
双绕组变压器:double-column transformer DblClmnTrans :P!"'&gCL
电容器:Capacitor #osP"~{
并联电容器:shunt capacitor 5)IJ|"]y
电抗器:Reactor ( !K?^si
母线:Busbar Xm#E9 9
输电线:TransmissionLine WAzYnl'p
发电厂:power plant ]\ fXy?2
断路器:Breaker C`p)S`d
刀闸(隔离开关):Isolator '+@q
分接头:tap @W{VT7w
电动机:motor L<GF1I)
(2) 状态参数 .V4w+:i
0`{3|g
有功:active power #u<^
无功:reactive power Sr9)i8x{
电流:current 88K=jo))b
容量:capacity \wyn
电压:voltage ]8Eci^i
档位:tap position 7K*\F}2)q
有功损耗:reactive loss s8/sH];
无功损耗:active loss f{} zqCK
功率因数:power-factor {iz,iv/U
功率:power u]D>O$_ s
功角:power-angle \R m2c8Z2
电压等级:voltage grade v#HaZT]u
空载损耗:no-load loss BdK2I!mm
铁损:iron loss CY"iP,nHl
铜损:copper loss U}6FB =
空载电流:no-load current 6m=FWw3y
阻抗:impedance 72YL
正序阻抗:positive sequence impedance W(C\lSE0
负序阻抗:negative sequence impedance tHvc*D
零序阻抗:zero sequence impedance p1-bq:
电阻:resistor )yHJc$OlMx
电抗:reactance YY&3M
电导:conductance cz2guUu
电纳:susceptance 0<,Q7onDD:
无功负载:reactive load 或者QLoad )_MIUQ%
有功负载: active load PLoad u-31$z<<5}
遥测:YC(telemetering) i?*_-NAm
遥信:YX (|{b ZW}
励磁电流(转子电流):magnetizing current /SXms'C
定子:stator :9_N
Y"P
功角:power-angle Ca&p;K9FR
上限:upper limit VcLB0T7m\
下限:lower limit &8l4A=l$
并列的:apposable ?gq',FFDq
高压: high voltage <Z$r\Huf
低压:low voltage yNVmTb9mF
中压:middle voltage Up(Jw-.
电力系统 power system +[=yLE#P%
发电机 generator ^/)!)=?
励磁 excitation d )}@0Q
励磁器 excitor AK#`&)0i
电压 voltage isdEs k#A.
电流 current fP6]zy^*
母线 bus @YH<Hc
变压器 transformer |k
# ~
升压变压器 step-up transformer !Q`vOVSUD
高压侧 high side :3FJe
输电系统 power transmission system f;Iaf#V_
输电线 transmission line FUq>+U!Qu
固定串联电容补偿fixed series capacitor compensation uv:DO6 {
稳定 stability 6X@]<R
电压稳定 voltage stability BFCF+hU^6R
功角稳定 angle stability w&M)ws;$
暂态稳定 transient stability WWO@ULGY
电厂 power plant SO}$96
能量输送 power transfer ,P?R
3
交流 AC -:5]*zVp+-
装机容量 installed capacity p6VHa$[
电网 power system !'-|]xx(
落点 drop point &HPzm6.3
开关站 switch station m4U7{sE
双回同杆并架 double-circuit lines on the same tower CoZXbTq
变电站 transformer substation >=|;2*9v
补偿度 degree of compensation UF
g N@
高抗 high voltage shunt reactor m&'z|eN
无功补偿 reactive power compensation Qx_K)
故障 fault ?~mw
调节 regulation ~)RKpRga\p
裕度 magin t`"]"Re
三相故障 three phase fault .] S{T
故障切除时间 fault clearing time D]I]I!2c
极限切除时间 critical clearing time 9Q!X~L|\S
切机 generator triping G8JwY\
高顶值 high limited value . PzlhTL7
强行励磁 reinforced excitation ^:b%QO
线路补偿器 LDC(line drop compensation) 8:BPXdiK
机端 generator terminal 5UFR^\e
静态 static (state) \XG18V&
动态 dynamic (state) x*)@:W!
单机无穷大系统 one machine - infinity bus system iNTw;ov
机端电压控制 AVR +sTZ)
5vQ
电抗 reactance zH0{S.3k
电阻 resistance Lv;R8^n
功角 power angle Cq7EdK;x
有功(功率) active power >5i(U_`l
无功(功率) reactive power ] -6=+\]
功率因数 power factor zuWfR&U|W
无功电流 reactive current [WOLUb
下降特性 droop characteristics DhQYjC[
斜率 slope _&/FO{ F@m
额定 rating Ib)>M`J
变比 ratio MTKd:.J6
参考值 reference value 29+p|n
电压互感器 PT Wr \rruH6
分接头 tap #&Zb8HAj
下降率 droop rate P|"U
仿真分析 simulation analysis T~nm Eap
传递函数 transfer function 0G(T'Z1
框图 block diagram YpFh_Zr[
受端 receive-side P'prp=JD
裕度 margin ^9})@,(D
同步 synchronization VQ{.Ls2`Z
失去同步 loss of synchronization DR."C+
阻尼 damping XO)|l8t#$=
摇摆 swing /4\!zPPj.
保护断路器 circuit breaker ?i.]|#{Z
电阻:resistance y<|vcg8x
电抗:reactance S`LS/)
阻抗:impedance ub|tX 'o
电导:conductance w[>/(R7im
电纳:susceptance