1 backplane 背板 bl.EIyG>
2 Band gap voltage reference 带隙电压参考 ,q</@}.\wN
3 benchtop supply 工作台电源 b:Dg}
4 Block Diagram 方块图 5 Bode Plot 波特图 s0!kwrBsp
6 Bootstrap 自举 C #aFc01B
7 Bottom FET Bottom FET >'Hx1;
8 bucket capcitor 桶形电容 os**hFPk;1
9 chassis 机架 ,8VXA +'_
10 Combi-sense Combi-sense }Vl^EAR
11 constant current source 恒流源 e5OVq
,
12 Core Sataration 铁芯饱和 FL&dv
13 crossover frequency 交叉频率 P`
]ps?l
14 current ripple 纹波电流 j_c+.iET
15 Cycle by Cycle 逐周期 G_(ct5:_"!
16 cycle skipping 周期跳步 S:GTc QU
17 Dead Time 死区时间 #(dhBEXPW;
18 DIE Temperature 核心温度 D|TR!
19 Disable 非使能,无效,禁用,关断 26PD[af64O
20 dominant pole 主极点 3:AU:
21 Enable 使能,有效,启用 f4
O]`U
22 ESD Rating ESD额定值 kfK[u/<i
23 Evaluation Board 评估板 FG#nap{
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. ^A#x<J+
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 8A4TAT4,
25 Failling edge 下降沿 24X=5Aj
26 figure of merit 品质因数 G?ZC9w]rA
27 float charge voltage 浮充电压 '!@A}&]
28 flyback power stage 反驰式功率级 I>hmbBlDv
29 forward voltage drop 前向压降 r?$&Z^
30 free-running 自由运行 0_HJ.g!
31 Freewheel diode 续流二极管 JMePI%#8
32 Full load 满负载 33 gate drive 栅极驱动 {*fUJmao"
34 gate drive stage 栅极驱动级 W5X7FEW
35 gerber plot Gerber 图 pN+I]NgQ
36 ground plane 接地层 # JFYws
37 Henry 电感单位:亨利 TrQm]9 @
38 Human Body Model 人体模式 y#e ?iE@
39 Hysteresis 滞回 }VZM,.w
40 inrush current 涌入电流 CjV7q y
41 Inverting 反相 D-D# `
42 jittery 抖动 ==` Pb
43 Junction 结点 #G~wE*VR$
44 Kelvin connection 开尔文连接 tWX7dspx/
45 Lead Frame 引脚框架 X TM$a9)
46 Lead Free 无铅 B!iFmkCy
47 level-shift 电平移动 b=G4MZQ
48 Line regulation 电源调整率 ogp{rY
49 load regulation 负载调整率 B,MQ.|s[
50 Lot Number 批号 m{O
Dz:
51 Low Dropout 低压差 )r#,ML
52 Miller 密勒 53 node 节点 W1`Dx(g
54 Non-Inverting 非反相 4v>o%
55 novel 新颖的 jm+blB^%K
56 off state 关断状态 F {/>u(@3
57 Operating supply voltage 电源工作电压 ,z oB0([
58 out drive stage 输出驱动级 BjB&[5?z
59 Out of Phase 异相 Lz?*B$h
60 Part Number 产品型号 1wlVz#f.
61 pass transistor pass transistor H7}g!n?
62 P-channel MOSFET P沟道MOSFET GI?PGAT
63 Phase margin 相位裕度 FvAbh]/4
64 Phase Node 开关节点 '(T mV#3
65 portable electronics 便携式电子设备 X*)?LxTj
66 power down 掉电 9u?Eb~#$
67 Power Good 电源正常 ?0uOR*y'
68 Power Groud 功率地 T:6K?$y?
69 Power Save Mode 节电模式 /Bh>
70 Power up 上电 3jXR"@Z-
71 pull down 下拉 Enu!u~1]F
72 pull up 上拉 \Vz,wy%-
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) pbPz$Y
74 push pull converter 推挽转换器 FN>L7
*,0
75 ramp down 斜降 7oD
y7nV4
76 ramp up 斜升 ^K"ZJ6?+1
77 redundant diode 冗余二极管 f&f`J/(
78 resistive divider 电阻分压器 X8i[fk1.R
79 ringing 振 铃 O%52V|m}{
80 ripple current 纹波电流
}\>+H
81 rising edge 上升沿 pL8H8kn
82 sense resistor 检测电阻 '!AT
83 Sequenced Power Supplys 序列电源 }iMXXXBOT
84 shoot-through 直通,同时导通 k~{Fnkt
85 stray inductances. 杂散电感 O/(3 87= U
86 sub-circuit 子电路 LNaeB(z"
87 substrate 基板 dV)Y,Yx0${
88 Telecom 电信 z}iSq$
89 Thermal Information 热性能信息 q ?(A!1(u
90 thermal slug 散热片 :MK:TJV
91 Threshold 阈值 >B`Cch/'U
92 timing resistor 振荡电阻 g
,`F<CF9
93 Top FET Top FET 6={IMkmA
94 Trace 线路,走线,引线 pa>p%
95 Transfer function 传递函数 x!OWJ/O
96 Trip Point 跳变点 u
IAZo;
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) ~KJ,SLzhx9
98 Under Voltage Lock Out (UVLO) 欠压锁定 *3!(*F@M,
99 Voltage Reference 电压参考 hK
Fk$A
100 voltage-second product 伏秒积 NWw<B3aL
101 zero-pole frequency compensation 零极点频率补偿 Ih(:HFRMq6
102 beat frequency 拍频 Fs?( UM
103 one shots 单击电路 tp7oc_s?.
104 scaling 缩放 z'?SRK5+
105 ESR 等效串联电阻 [Page] O5ucI$s
106 Ground 地电位 m\_+)eI|
107 trimmed bandgap 平衡带隙 sf
fV.cC`
108 dropout voltage 压差 fdN45in=>
109 large bulk capacitance 大容量电容 BHEs+e0
110 circuit breaker 断路器 2@rp<&s
111 charge pump 电荷泵 ~(stA3]k
112 overshoot 过冲 t#a.}Jl
wj}=@HS,3!
印制电路printed circuit <_=JMA5
印制线路 printed wiring ur?d6a
印制板 printed board SRP5P,- y
印制板电路 printed circuit board kZJt~}
印制线路板 printed wiring board >Dk1axZ!>/
印制元件 printed component th5
X?so
印制接点 printed contact q
sv+.aW
印制板装配 printed board assembly -K:yU4V
板 board Qk?jGXB>^
刚性印制板 rigid printed board ,?C|.5
挠性印制电路 flexible printed circuit | -JI`!7
挠性印制线路 flexible printed wiring >Kz_My9
齐平印制板 flush printed board /TzNdIv
金属芯印制板 metal core printed board .UNF~}^H
金属基印制板 metal base printed board eLCdAr
多重布线印制板 mulit-wiring printed board mk#>Dpy?
塑电路板 molded circuit board ` 52%XI
散线印制板 discrete wiring board f1)HHUB
微线印制板 micro wire board 5T~3$kuO
积层印制板 buile-up printed board @<hF.4,]
表面层合电路板 surface laminar circuit ) ~ l\
埋入凸块连印制板 B2it printed board ,lrYl!,
载芯片板 chip on board V*~1,6N[
埋电阻板 buried resistance board 3 %z
母板 mother board FgXu1-
子板 daughter board Mi;}.K0J
背板 backplane /p[|DJoM
裸板 bare board xR\D(FLVS
键盘板夹心板 copper-invar-copper board :({-0&&_
动态挠性板 dynamic flex board Q&oC]u(="&
静态挠性板 static flex board l0qdk#v
可断拼板 break-away planel k\sc }z8X
电缆 cable KC&H*
挠性扁平电缆 flexible flat cable (FFC) <f7?PAd
薄膜开关 membrane switch \;nD)<)J
混合电路 hybrid circuit 9zXu6<|qrL
厚膜 thick film \pjRv
厚膜电路 thick film circuit 3$GY,B
薄膜 thin film r^?)F?n!
薄膜混合电路 thin film hybrid circuit !F=|*j
互连 interconnection
N BV}4
导线 conductor trace line _<Hb(z
齐平导线 flush conductor >t1_5
传输线 transmission line v p"%IW
跨交 crossover ygmv_YLjm
板边插头 edge-board contact eXj\DjttG}
增强板 stiffener FQ;4'B^k]
基底 substrate P5'iYahCq_
基板面 real estate #G'S
ve?
导线面 conductor side $sA,$x:^xI
元件面 component side ioE66-n
焊接面 solder side ti$oZ4PpF
导电图形 conductive pattern u Y?/B~
非导电图形 non-conductive pattern Y|{r
vBKjf
基材 base material b&\3ps
层压板 laminate '5|Q<5!o
覆金属箔基材 metal-clad bade material W?*Xy6",JF
覆铜箔层压板 copper-clad laminate (CCL) _hAj2%SL
复合层压板 composite laminate 5~ _eN
薄层压板 thin laminate (lyt"Ty
基体材料 basis material *r)zBr
预浸材料 prepreg wMlf3Uz
粘结片 bonding sheet (SgEt
预浸粘结片 preimpregnated bonding sheer &+)+5z_d
环氧玻璃基板 epoxy glass substrate { ()p%#*
预制内层覆箔板 mass lamination panel lfU"SSQ
内层芯板 core material 2 pM
粘结层 bonding layer ?V&Ld$db
粘结膜 film adhesive p6&LZ=tL3
无支撑胶粘剂膜 unsupported adhesive film p0}+071o%
覆盖层 cover layer (cover lay) zh#OD{
增强板材 stiffener material ~6@c]:
铜箔面 copper-clad surface p^pQZ6-
去铜箔面 foil removal surface EuKrYY] g
层压板面 unclad laminate surface #hy5c,}>
基膜面 base film surface IEno.i\
胶粘剂面 adhesive faec N3XVT{yo
原始光洁面 plate finish dvg;
粗面 matt finish mr{k>Un\
剪切板 cut to size panel ;w>3,ub(0
超薄型层压板 ultra thin laminate hQg,#r(JE4
A阶树脂 A-stage resin |:7EJkKZ
B阶树脂 B-stage resin ])Q9=?Sd}
C阶树脂 C-stage resin ?YkO+?}+
环氧树脂 epoxy resin u):%5F/
酚醛树脂 phenolic resin h@PMCmf_
聚酯树脂 polyester resin z)
]BV=
聚酰亚胺树脂 polyimide resin uZqu xu.
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin O" X!S_R
丙烯酸树脂 acrylic resin <eud#v
三聚氰胺甲醛树脂 melamine formaldehyde resin :|3"H&FWK
多官能环氧树脂 polyfunctional epoxy resin K^]?@oHO
溴化环氧树脂 brominated epoxy resin )9A<fwpN
环氧酚醛 epoxy novolac a>)_ `m
氟树脂 fluroresin {|Mxvp*Hg
硅树脂 silicone resin k$$S!qi#
硅烷 silane E5Snl#Gl\0
聚合物 polymer =#POMK".6
无定形聚合物 amorphous polymer M@!]U:5~V
结晶现象 crystalline polamer ;9!yh\\
双晶现象 dimorphism y]E)2:B[d
共聚物 copolymer 2#$}yP~
合成树脂 synthetic H649J)v+m
热固性树脂 thermosetting resin [Page] JL]k:i^`A
热塑性树脂 thermoplastic resin dFI.`pB
感光性树脂 photosensitive resin n7`.<*:
环氧值 epoxy value Gpxb_}P
双氰胺 dicyandiamide PoBukOv
粘结剂 binder k"DQbUy0L
胶粘剂 adesive W{$+mow7S
固化剂 curing agent
FM;;x(sg
阻燃剂 flame retardant ~Me&cT8
遮光剂 opaquer G
+nY}c
增塑剂 plasticizers =CG!"&T
不饱和聚酯 unsatuiated polyester @
@3)D%h
聚酯薄膜 polyester xyz\;3
聚酰亚胺薄膜 polyimide film (PI) VxPTh\O*[
聚四氟乙烯 polytetrafluoetylene (PTFE) v:J.d5
增强材料 reinforcing material fUL{c,7xda
折痕 crease $:-= >
云织 waviness ;K)?:
鱼眼 fish eye GH; F3s
毛圈长 feather length @0/@p"j
厚薄段 mark
jKb=Zkd
裂缝 split mISuo
捻度 twist of yarn COkLn)+0
浸润剂含量 size content VvMU)
浸润剂残留量 size residue <4!&iU+;
处理剂含量 finish level vU\w3
偶联剂 couplint agent ('o; M:
断裂长 breaking length @|\s$L
吸水高度 height of capillary rise x9&tlKKxf
湿强度保留率 wet strength retention 9/X v&<Tn
白度 whitenness !g8.8(/t)
导电箔 conductive foil PE;0
jgsiI
铜箔 copper foil
8tFyNl`c
压延铜箔 rolled copper foil !3X%5=#L4
光面 shiny side Fb<\(#t
粗糙面 matte side /J9T=N
处理面 treated side 9V4V}[%
防锈处理 stain proofing bbPd&7
双面处理铜箔 double treated foil 7"CH\*%
模拟 simulation <1'X)n&Kw$
逻辑模拟 logic simulation .}hZ7>4-
电路模拟 circit simulation *V@MAt
时序模拟 timing simulation <,]CVo
模块化 modularization 1^H<+0
设计原点 design origin -Bwu$$0
优化(设计) optimization (design) z_,]fd=o
供设计优化坐标轴 predominant axis `w+9j-
表格原点 table origin $qyM
X[
元件安置 component positioning <hF~L k ,
比例因子 scaling factor -5-SlQu
扫描填充 scan filling I3E8vi%B.
矩形填充 rectangle filling :#&U95EC0
填充域 region filling %ucmJ-<y#
实体设计 physical design b8b PK<
逻辑设计 logic design :PjUl
逻辑电路 logic circuit ;|$]Qq
层次设计 hierarchical design %},S#5L3
自顶向下设计 top-down design Xde=}9
自底向上设计 bottom-up design K/.hJ
费用矩阵 cost metrix JU%yqXO
元件密度 component density 4z3$
自由度 degrees freedom *ej o6>
出度 out going degree Nxs%~wZ
入度 incoming degree w-Q 6
-
曼哈顿距离 manhatton distance Ef*.}gcU
欧几里德距离 euclidean distance #y9K-}u
网络 network me`$5Z`
阵列 array Y X{
段 segment m"m;(T{ v
逻辑 logic R\Ynn^w
逻辑设计自动化 logic design automation }Yl8Q>t
分线 separated time ZwrYss
分层 separated layer [t=+$pf(-
定顺序 definite sequence ORPl^n-
导线(通道) conduction (track) ,c %gwzU
导线(体)宽度 conductor width 0v)mgrl=,
导线距离 conductor spacing FCB/FtI0
导线层 conductor layer _TcQ12H 5<
导线宽度/间距 conductor line/space IEsD=
第一导线层 conductor layer No.1 0}C}\1
圆形盘 round pad >`V|`Zi ?
方形盘 square pad 8}`8lOE7
菱形盘 diamond pad X qva&/-
长方形焊盘 oblong pad VKfHN_m*
子弹形盘 bullet pad Hf]}OvT>Z
泪滴盘 teardrop pad Mw7UU1 ei
雪人盘 snowman pad j<-o{6r
形盘 V-shaped pad V F4{. 7BT
环形盘 annular pad J3S byI!T
非圆形盘 non-circular pad m3!MHe~t
隔离盘 isolation pad exN#!&;
非功能连接盘 monfunctional pad >Vm
偏置连接盘 offset land "uERa(i
腹(背)裸盘 back-bard land YZtA:>;p
盘址 anchoring spaur ^aM/BS\
连接盘图形 land pattern 9@>hm>g.
连接盘网格阵列 land grid array r|BKp,u9
孔环 annular ring b020U>)v
元件孔 component hole (S 3kP5:F
安装孔 mounting hole ' g!_Flk
支撑孔 supported hole LO*a>9LI
非支撑孔 unsupported hole >oYwzK0&
导通孔 via MP&4}De
镀通孔 plated through hole (PTH) U5%]nT"[]
余隙孔 access hole n8D;6#P^
盲孔 blind via (hole) %z_b/yG
埋孔 buried via hole a9JJuSRC
埋,盲孔 buried blind via UHszOl
任意层内部导通孔 any layer inner via hole JV{!Ukuyp+
全部钻孔 all drilled hole EGO@`<"h
定位孔 toaling hole BqA wo
无连接盘孔 landless hole u"$HWB~@z
中间孔 interstitial hole >a~FSZf
无连接盘导通孔 landless via hole qGUe0(
引导孔 pilot hole 4tu>~ vOE
端接全隙孔 terminal clearomee hole 0# GwhB
准尺寸孔 dimensioned hole [Page] Os]M$c_88
在连接盘中导通孔 via-in-pad 5W'|qmJ
孔位 hole location -+Ji~;b
孔密度 hole density <[??\YOc
孔图 hole pattern Ev ,8?
钻孔图 drill drawing D"aQbQP
装配图assembly drawing aV#;o9H{
参考基准 datum referan pODo[Rkq
1) 元件设备 ~OfKn1D
_
L6>4
三绕组变压器:three-column transformer ThrClnTrans QZP;k!"w
双绕组变压器:double-column transformer DblClmnTrans 56aJE
.?<
电容器:Capacitor UZ0O
j5B.
并联电容器:shunt capacitor NT:>.~ah@&
电抗器:Reactor ozwqK oE
母线:Busbar 45JLx?rN_
输电线:TransmissionLine A Mfu|%ZL
发电厂:power plant 3{E}^ve
断路器:Breaker pDN,(Ip
刀闸(隔离开关):Isolator f}d@G/L
分接头:tap (Gsg+c
电动机:motor zOp"n\
(2) 状态参数 N=x,96CF
3Or3@e5r
有功:active power j* ja)
无功:reactive power JYUKs~Qt
电流:current ~kFRy {z
容量:capacity 8\_,Y
ji
电压:voltage m>:ig\
档位:tap position Ps-d#~4U;
有功损耗:reactive loss =~*u(0sJa
无功损耗:active loss ovVU%2o1b
功率因数:power-factor yU`IyaazZ
功率:power c3mlO[(
功角:power-angle $o^}<)DW
电压等级:voltage grade |mX8fRh
空载损耗:no-load loss +fmZ&9hFNJ
铁损:iron loss pYQs|5d
铜损:copper loss _"TG:RP
空载电流:no-load current !qq@F%tv
阻抗:impedance SS-
正序阻抗:positive sequence impedance 7MfvU|D[d/
负序阻抗:negative sequence impedance ?+_"2XY
零序阻抗:zero sequence impedance VW/1[?HG5
电阻:resistor b`=rd 4cpU
电抗:reactance :eO0{JN4T
电导:conductance sk/Mh8z
电纳:susceptance O^hV<+CX
无功负载:reactive load 或者QLoad %J'_c|EQM
有功负载: active load PLoad ABf#!G
遥测:YC(telemetering) ]|(?i ,p
遥信:YX *n\qV*|6bI
励磁电流(转子电流):magnetizing current ^a
r9$$~/!
定子:stator u[@*}|uXM
功角:power-angle n9ih^H
上限:upper limit v4zARE9#
下限:lower limit ==9Ez
并列的:apposable Bf'(JJ7&N
高压: high voltage &bNj/n/
低压:low voltage oKiu6=
中压:middle voltage zyE yZc?
电力系统 power system 6w#v,RDEu
发电机 generator Z )I4U
励磁 excitation ^
T S\x/P
励磁器 excitor ]a()siT
电压 voltage 7[PXZT
电流 current
%G*D0pE
母线 bus P7!Sc
变压器 transformer [; bLlS,
升压变压器 step-up transformer OduTg^R
高压侧 high side
aY~IS?!;
输电系统 power transmission system IG\\RYr
输电线 transmission line ]0O$2 j_ 7
固定串联电容补偿fixed series capacitor compensation ?T"crX
稳定 stability s Y,3
电压稳定 voltage stability 1zffPC8jl
功角稳定 angle stability O_q_O
暂态稳定 transient stability 6 s/O\A
电厂 power plant P:o<kRj1
能量输送 power transfer H+Wd#7l,
交流 AC 0ni5 :tYy
装机容量 installed capacity l%O-c}X
电网 power system ueOvBFgZ
落点 drop point _e
W*
开关站 switch station ? "gy`oCv
双回同杆并架 double-circuit lines on the same tower hG U &C]
变电站 transformer substation 3ml|`S
补偿度 degree of compensation 2t'&7>Ys{
高抗 high voltage shunt reactor ?bEYvHAzg
无功补偿 reactive power compensation 0#ph1a<
故障 fault POf \l
调节 regulation k dqH36&<
裕度 magin \]D;HR`vo
三相故障 three phase fault b]~M$y60q
故障切除时间 fault clearing time D'X'h}+2
极限切除时间 critical clearing time fHiCuF
切机 generator triping d0,I] "
高顶值 high limited value #rC% \
强行励磁 reinforced excitation `@90b4u
线路补偿器 LDC(line drop compensation) q:'(1y~
机端 generator terminal F^f]*MhT"
静态 static (state) ETIf x)B-
动态 dynamic (state) 8CL05:&
单机无穷大系统 one machine - infinity bus system Q'N<jX[
机端电压控制 AVR Mm5l> D'c
电抗 reactance 0t~--/lA
电阻 resistance (8{Z@
功角 power angle e1#}/U
有功(功率) active power p81~Lk*Hz@
无功(功率) reactive power _MR2,mC
功率因数 power factor F-nt7l
无功电流 reactive current gm8H)y,
下降特性 droop characteristics
tnsYY
斜率 slope ;rFa I^
额定 rating IRQ(/:]
变比 ratio +$9w[ARN+
参考值 reference value #
;9KDt@
电压互感器 PT O;XF'r_
分接头 tap E,;nx^`!l
下降率 droop rate 1)%o:Xy o
仿真分析 simulation analysis dZm{?\^_
传递函数 transfer function ,UP6.C14
框图 block diagram FvkKM+?F
受端 receive-side b`2~
裕度 margin (GeJBw,Q
同步 synchronization k";;Snk
失去同步 loss of synchronization au8)G_A
阻尼 damping m'S-h'a
摇摆 swing hZpFI?lqc\
保护断路器 circuit breaker `@ObM[0p(
电阻:resistance -~5yl}
电抗:reactance 27MgwX
NQ
阻抗:impedance N9i>81tY
电导:conductance m?csake.Me
电纳:susceptance