1 backplane 背板 n)kbQ]
2 Band gap voltage reference 带隙电压参考 !1)aie+p6
3 benchtop supply 工作台电源 5?-HQoT)G
4 Block Diagram 方块图 5 Bode Plot 波特图 yiZtG#6K{
6 Bootstrap 自举 g,+e3f
7 Bottom FET Bottom FET 7'IIB1v.\
8 bucket capcitor 桶形电容 >$ZG=&
9 chassis 机架 v1:.t
10 Combi-sense Combi-sense V.*TOU{{xh
11 constant current source 恒流源 (t-hi8"
12 Core Sataration 铁芯饱和 `*8}q!.
13 crossover frequency 交叉频率 /]`@.mZ9:
14 current ripple 纹波电流 : .x((
FU
15 Cycle by Cycle 逐周期 &!8 WRJ
16 cycle skipping 周期跳步 J9mK9{#q
17 Dead Time 死区时间 ~*iF`T6
18 DIE Temperature 核心温度 ;MS.ag#
19 Disable 非使能,无效,禁用,关断 RM|J |R
20 dominant pole 主极点 072C!F
21 Enable 使能,有效,启用 }emUpju<C
22 ESD Rating ESD额定值 {fXkbMO|
23 Evaluation Board 评估板 vXDs/,`r
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. <VxA&bb7c
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 hObL=^F
25 Failling edge 下降沿 KOy{?
26 figure of merit 品质因数 EwPrh
27 float charge voltage 浮充电压 6iU&9Z<%
28 flyback power stage 反驰式功率级 qi,) l*?f
29 forward voltage drop 前向压降 .t@|2
30 free-running 自由运行 ;b {#$#`=
31 Freewheel diode 续流二极管 E`fG9:6l]
32 Full load 满负载 33 gate drive 栅极驱动 ;JkSZs3
34 gate drive stage 栅极驱动级 Yqs=jTq`{
35 gerber plot Gerber 图 *igmi9A
36 ground plane 接地层 $@z77td3
37 Henry 电感单位:亨利 ?6:qAFw
38 Human Body Model 人体模式 P~\rP6
;
39 Hysteresis 滞回 ZexC3LD"
40 inrush current 涌入电流 ZE=sw}=
41 Inverting 反相 *O_fw 0jV
42 jittery 抖动 z0}j7ns]
43 Junction 结点 ='m$O
44 Kelvin connection 开尔文连接 SxRJ{m~
45 Lead Frame 引脚框架 &BPYlfB1
46 Lead Free 无铅 x4q}xwH
47 level-shift 电平移动 P =X]'m_B
48 Line regulation 电源调整率 tRoSq;VrS
49 load regulation 负载调整率 d {!P
c<
50 Lot Number 批号 O=o}uB-*6
51 Low Dropout 低压差 W> pe-
52 Miller 密勒 53 node 节点 W3.[d->X
54 Non-Inverting 非反相 =!\Nh,\eQ
55 novel 新颖的 +VUkV-kP
56 off state 关断状态 y[ dBmTY
57 Operating supply voltage 电源工作电压
p'h'Cz
58 out drive stage 输出驱动级 X?_rD'3
59 Out of Phase 异相 Usf@kVQ
60 Part Number 产品型号 ~wa4kS<>
61 pass transistor pass transistor .\XRkr'-
62 P-channel MOSFET P沟道MOSFET SP%X@~d
63 Phase margin 相位裕度 s 4`-mIa
64 Phase Node 开关节点 ^?lpY{aa
65 portable electronics 便携式电子设备 &hWELZe0vv
66 power down 掉电 *u$aItx
67 Power Good 电源正常 ,l>w9?0Z
68 Power Groud 功率地 ]KFh 1
69 Power Save Mode 节电模式 Ij#mmj NW
70 Power up 上电 |nQfgl=V
71 pull down 下拉 kZ%
AGc
72 pull up 上拉 !`{?qQ[=
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) mV^w|x
74 push pull converter 推挽转换器 j
e\!0{
75 ramp down 斜降 6{+yAsI
76 ramp up 斜升 [(n5-#1S
77 redundant diode 冗余二极管 /4r2B.91O
78 resistive divider 电阻分压器 #ZZe*B!s_
79 ringing 振 铃 )la3GT*1mS
80 ripple current 纹波电流 \'y]m B~k
81 rising edge 上升沿 !RKuEg4hQ
82 sense resistor 检测电阻 }U7IMONU
83 Sequenced Power Supplys 序列电源 N]W*ei
84 shoot-through 直通,同时导通 F8w7N$/V",
85 stray inductances. 杂散电感 2O kID
WcM
86 sub-circuit 子电路 =CQfs6np:N
87 substrate 基板 2c Xae
88 Telecom 电信 gvc@q`_]
89 Thermal Information 热性能信息 P`Zon
90 thermal slug 散热片 t=7Gfv
91 Threshold 阈值 EE'2<"M
92 timing resistor 振荡电阻 kQ=bd{a6
93 Top FET Top FET F+*E}QpM
94 Trace 线路,走线,引线 I{$suPk
95 Transfer function 传递函数 od!44p]
96 Trip Point 跳变点 Ft>B% -;
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) >M5}L<
98 Under Voltage Lock Out (UVLO) 欠压锁定 RC7F/|w.z
99 Voltage Reference 电压参考 f,ro1Nke
100 voltage-second product 伏秒积 a#1r'z~]}
101 zero-pole frequency compensation 零极点频率补偿 'fn}I0Vc
102 beat frequency 拍频 G!FdTvx$
103 one shots 单击电路 H
r:*p6
104 scaling 缩放 +Ug &
105 ESR 等效串联电阻 [Page] -)-:rRx-
106 Ground 地电位 v
o:KL%)
107 trimmed bandgap 平衡带隙 >9w^C1"
108 dropout voltage 压差 #.Dl1L/
109 large bulk capacitance 大容量电容 ]{tWfv|Xg8
110 circuit breaker 断路器 bm;iX*~
111 charge pump 电荷泵 O+-+=W
112 overshoot 过冲 <);j5)/
0@_8JB ?E
印制电路printed circuit `6rLd>=R
印制线路 printed wiring 7O)ATb#up
印制板 printed board ~T}D#}
印制板电路 printed circuit board HP*)^`6X
印制线路板 printed wiring board 0-p^ oA
印制元件 printed component -,
+o*BP
印制接点 printed contact _CNXyFw.7
印制板装配 printed board assembly VY/r2o#
板 board 6`9QGi,)
刚性印制板 rigid printed board U,b80%k:
挠性印制电路 flexible printed circuit m&A bH&;
挠性印制线路 flexible printed wiring ky !ZJR
齐平印制板 flush printed board ]Z[3 \~?
金属芯印制板 metal core printed board dtuCA"D
金属基印制板 metal base printed board L@MCB-@V
多重布线印制板 mulit-wiring printed board azmeJpC
塑电路板 molded circuit board 0^{Tq0Ri[
散线印制板 discrete wiring board 7'+`vt#E
微线印制板 micro wire board di_N}x*
积层印制板 buile-up printed board x6>WvFZ
表面层合电路板 surface laminar circuit }*XF- U
埋入凸块连印制板 B2it printed board ~/4j&IG
载芯片板 chip on board ,JH*l:7
埋电阻板 buried resistance board e|A=sCN-
母板 mother board 6 w!qZ4$
子板 daughter board |%4nU#GoB
背板 backplane +
o< 7*
裸板 bare board Tx?s?DwC
键盘板夹心板 copper-invar-copper board KUW )F
动态挠性板 dynamic flex board f$ /C.E
静态挠性板 static flex board :V8oWMY
可断拼板 break-away planel }!g$k
$y
电缆 cable eI2041z
挠性扁平电缆 flexible flat cable (FFC) *)r_Y|vg
薄膜开关 membrane switch =2Ju)!%wr
混合电路 hybrid circuit |x.[*'X@
厚膜 thick film "=?JIQ
厚膜电路 thick film circuit rDaiAx&
薄膜 thin film W*H %\Y:N
薄膜混合电路 thin film hybrid circuit 2v?#r"d
互连 interconnection ^N}{M$
导线 conductor trace line lS;S:-
-F
齐平导线 flush conductor 3 }
$9./+
传输线 transmission line ;d7Qw~v1s
跨交 crossover o)\EfPT
板边插头 edge-board contact 'o]}vyz;
增强板 stiffener g3n>}\xG>
基底 substrate -b%' K}.C
基板面 real estate U&kdR+dB
导线面 conductor side *[nS*D\:
元件面 component side :@~3wD[y
焊接面 solder side @6 jKjI
导电图形 conductive pattern a6T!)g
非导电图形 non-conductive pattern C1HNcfa7
基材 base material ~O;?;@
层压板 laminate !H^R_GC
覆金属箔基材 metal-clad bade material yaj1nq!*"
覆铜箔层压板 copper-clad laminate (CCL) w4y???90)
复合层压板 composite laminate Z_<Wr7D
薄层压板 thin laminate GB>h8yXH
基体材料 basis material Ft2ZZ<As
预浸材料 prepreg ue
*mTMN
粘结片 bonding sheet #$t93EI
预浸粘结片 preimpregnated bonding sheer TGPdi5Eq
环氧玻璃基板 epoxy glass substrate 0J )VEMC
预制内层覆箔板 mass lamination panel Se/]J<]
内层芯板 core material ]N'4q}<5o
粘结层 bonding layer w RTzpG4
粘结膜 film adhesive (B+zh
无支撑胶粘剂膜 unsupported adhesive film )Z?\9'6e4
覆盖层 cover layer (cover lay) #|xj*+)H
增强板材 stiffener material 6mrfkYK
铜箔面 copper-clad surface 53^1;
去铜箔面 foil removal surface b |Ed@C
层压板面 unclad laminate surface 9hwn,=Vh)
基膜面 base film surface h1_KZ[X
胶粘剂面 adhesive faec wCr+/"t
原始光洁面 plate finish e3&.RrA
粗面 matt finish $/i;UUd
剪切板 cut to size panel 'UCF2L
超薄型层压板 ultra thin laminate =dC5q{
A阶树脂 A-stage resin +QrbW
B阶树脂 B-stage resin {u7_<G7
C阶树脂 C-stage resin 1lUY27MF
环氧树脂 epoxy resin g|3FJA/
酚醛树脂 phenolic resin :'dH)yO
聚酯树脂 polyester resin .!Q[kn0a
聚酰亚胺树脂 polyimide resin rUF= uO(
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin 9%uJ:c?
丙烯酸树脂 acrylic resin $VE =sS.
三聚氰胺甲醛树脂 melamine formaldehyde resin {,m W7
多官能环氧树脂 polyfunctional epoxy resin T;I>5aQ:q4
溴化环氧树脂 brominated epoxy resin tO QY./I
环氧酚醛 epoxy novolac a
U*cwR
氟树脂 fluroresin
F_%&,"$
硅树脂 silicone resin (OK;*ZH+T@
硅烷 silane W[W}:@KZ
聚合物 polymer 2}R)0][W
无定形聚合物 amorphous polymer FZtIC77X5
结晶现象 crystalline polamer C@
z^{Z+
双晶现象 dimorphism [^-DFq5@
共聚物 copolymer ddjaM/.E
合成树脂 synthetic VJ(#FA2
热固性树脂 thermosetting resin [Page] Z4Qq#iHZR
热塑性树脂 thermoplastic resin kO\aNtK
感光性树脂 photosensitive resin AUAJMS!m
环氧值 epoxy value ~lLIq!!\
双氰胺 dicyandiamide M>g\Y
粘结剂 binder RV:%^=V-
胶粘剂 adesive |q\:3R_0
固化剂 curing agent djcCm5m
阻燃剂 flame retardant UYb:q
遮光剂 opaquer Hlq#X:DCn
增塑剂 plasticizers viY &D
不饱和聚酯 unsatuiated polyester [&
&9F};
聚酯薄膜 polyester 4h~o>(Sq
聚酰亚胺薄膜 polyimide film (PI) "o[j'
聚四氟乙烯 polytetrafluoetylene (PTFE) Ik4U+'z6
增强材料 reinforcing material toCT5E_0=
折痕 crease Fn!kest
云织 waviness 3v%V\kO=F
鱼眼 fish eye V"@]PI pr
毛圈长 feather length }A`4ae=
厚薄段 mark LY^pmak
裂缝 split +H~})PeQ
捻度 twist of yarn "V;M,/Q|
浸润剂含量 size content q>*+.~
浸润剂残留量 size residue +
>oA@z
处理剂含量 finish level !8U\GR `
偶联剂 couplint agent q~=]_PMP
断裂长 breaking length !7lS=D(?
吸水高度 height of capillary rise .5zqpm
湿强度保留率 wet strength retention \Z^YaKj&
白度 whitenness 3X&}{M:Qo
导电箔 conductive foil &pD6Qq{
铜箔 copper foil n15F4DnP
压延铜箔 rolled copper foil Vn6 g(:\w
光面 shiny side tQ:)j^\
粗糙面 matte side viT/$7`AI
处理面 treated side g3(fhfR'RN
防锈处理 stain proofing zR+EJFf
双面处理铜箔 double treated foil y#Ao6Od6
模拟 simulation h+!Ld^'c
逻辑模拟 logic simulation RAQi&?Ko
电路模拟 circit simulation n%]1p36
时序模拟 timing simulation Og?]y ^y
模块化 modularization >c>f6
设计原点 design origin v'*#P7%Kf
优化(设计) optimization (design) IR,`-
供设计优化坐标轴 predominant axis wYJ. F
表格原点 table origin uf (`I
元件安置 component positioning shOQ/
比例因子 scaling factor M3350
扫描填充 scan filling ^6 F-H(
矩形填充 rectangle filling `2y2Bk
填充域 region filling <3iL5}
实体设计 physical design MkG3TODfHB
逻辑设计 logic design PG8|w[V1 "
逻辑电路 logic circuit l Ud/^u`
层次设计 hierarchical design ^|?/
y=
自顶向下设计 top-down design 8M;VX3X
自底向上设计 bottom-up design `Li3=!V[
费用矩阵 cost metrix )Ab!R:4
元件密度 component density $UAmUQg)}_
自由度 degrees freedom %SL'X`j
出度 out going degree mVN^X/L(y
入度 incoming degree 0Kxc$c
曼哈顿距离 manhatton distance .AOf-a
欧几里德距离 euclidean distance Tp&03
网络 network 8o-*s+EY"&
阵列 array q"@Y2lhD!
段 segment Re**)3#gn
逻辑 logic eDR4c%
逻辑设计自动化 logic design automation ]?p&sI4
分线 separated time =l
TV2C<
分层 separated layer 8S[`(]
)
定顺序 definite sequence j()<.h;'
导线(通道) conduction (track) -ckk2D?
导线(体)宽度 conductor width y,i:BQJ<
导线距离 conductor spacing 445}Yw5;9
导线层 conductor layer FWv-_
导线宽度/间距 conductor line/space &y/
第一导线层 conductor layer No.1 4i>sOP3
B
圆形盘 round pad x'OE},>i
方形盘 square pad FOxMt;|M
菱形盘 diamond pad L,L>cmpM
长方形焊盘 oblong pad !fXw X3B
子弹形盘 bullet pad )54;YK
泪滴盘 teardrop pad #;?j]npg]
雪人盘 snowman pad ^fT|Wm<
形盘 V-shaped pad V w~A{]s{4
环形盘 annular pad mrR~[533j
非圆形盘 non-circular pad Mvq5s +.
隔离盘 isolation pad ^| L@f
非功能连接盘 monfunctional pad Q%61_l
偏置连接盘 offset land 6\ g-KO
腹(背)裸盘 back-bard land !sA[A>
盘址 anchoring spaur ,*SoV~
连接盘图形 land pattern _Gv[ D
连接盘网格阵列 land grid array bLyU;
孔环 annular ring \M-}(>Pfk
元件孔 component hole rnvKfTpZDU
安装孔 mounting hole pBV_'A}ioh
支撑孔 supported hole c|8[$_2
非支撑孔 unsupported hole AvF:$kG
导通孔 via M8oCh
镀通孔 plated through hole (PTH) dYdZt<6W<(
余隙孔 access hole :feU
盲孔 blind via (hole) Sq"O<FmI
埋孔 buried via hole iq_y80g`8h
埋,盲孔 buried blind via RO(~c-fV
任意层内部导通孔 any layer inner via hole B2\R#&X.
全部钻孔 all drilled hole x9Veg4Z7
定位孔 toaling hole RN(>37B3_
无连接盘孔 landless hole I^>m-M.
中间孔 interstitial hole ?-mDvW
无连接盘导通孔 landless via hole qP6Yn JWl
引导孔 pilot hole $xRZU9+
端接全隙孔 terminal clearomee hole *GxOiv7"4W
准尺寸孔 dimensioned hole [Page] Wy{xTLXk2
在连接盘中导通孔 via-in-pad 0F$;]zg
孔位 hole location 8zv=@`4@G
孔密度 hole density f;1DhAS
孔图 hole pattern 3T)GUzt`
钻孔图 drill drawing AnK-\4
装配图assembly drawing ck-ab0n
参考基准 datum referan Q@B--Omfh
1) 元件设备 C{mL]ds<
*7: )k
三绕组变压器:three-column transformer ThrClnTrans |_q:0qo
双绕组变压器:double-column transformer DblClmnTrans bqjj6bf'o
电容器:Capacitor HP T{83
并联电容器:shunt capacitor tmM8YN|
电抗器:Reactor ~ZbEKqni2
母线:Busbar bvZTB<rA
输电线:TransmissionLine LgN\%5f-
发电厂:power plant P|mV((/m4
断路器:Breaker jx _n$D
刀闸(隔离开关):Isolator ,})x1y
分接头:tap ^+Ho#]
电动机:motor 29P vPR6
(2) 状态参数 n{oRmw-
'\yp}r'u
有功:active power 72oiO[>N'
无功:reactive power L`E^BuP/
电流:current ,0ZkE}<=w
容量:capacity TNYd_:j
电压:voltage {oIv%U9
档位:tap position ?U~}uG^
有功损耗:reactive loss uMW5F-~-+
无功损耗:active loss JN;92|x
功率因数:power-factor DoV<p?U
功率:power 4Y>v+N^
功角:power-angle 9y/gWE
电压等级:voltage grade }2qmL$
空载损耗:no-load loss Wl3jbupu _
铁损:iron loss 9$0-UUCk
铜损:copper loss -]=-IiC#
空载电流:no-load current WH Zz?|^
阻抗:impedance XRU^7@Ylks
正序阻抗:positive sequence impedance Efo,5
负序阻抗:negative sequence impedance _ PC}`Y'&
零序阻抗:zero sequence impedance [5&zyIi
电阻:resistor 8ut:cCrmg
电抗:reactance u@!iByVAg
电导:conductance CV<@Rgoa
电纳:susceptance ,/V'(\>
无功负载:reactive load 或者QLoad q3.L6M
有功负载: active load PLoad oS'M
遥测:YC(telemetering) cp|&&q
遥信:YX JDO5eEwj
励磁电流(转子电流):magnetizing current n ,<`.^
定子:stator _;*|"e@^
功角:power-angle [E_+fT
上限:upper limit I"*;fdm
下限:lower limit ]s
lYr8m
并列的:apposable k&\YfE3*
高压: high voltage dt NHj/\
低压:low voltage 0(9]m)e
中压:middle voltage Ve<3XRq|8
电力系统 power system k^A Yg!~
发电机 generator %,9iY&;U"
励磁 excitation bI^zwK,@4
励磁器 excitor g=?KpI-pn0
电压 voltage G-FTyIP>'
电流 current ~;/\l=Xl
母线 bus .F'fBT`$
变压器 transformer %I]?xe6
升压变压器 step-up transformer f3h&K}x
高压侧 high side R#Z1+&='
输电系统 power transmission system hv xvwV1
输电线 transmission line s^_E'j$
固定串联电容补偿fixed series capacitor compensation #k%3Ag
稳定 stability y%T5"p$,
电压稳定 voltage stability HLMEB0zh^
功角稳定 angle stability J90q\_dY.
暂态稳定 transient stability ],r?]>
电厂 power plant xNt
能量输送 power transfer x/$s:[0B#
交流 AC
[kqxC
装机容量 installed capacity *"E?n>b
电网 power system &k3'UN!&Ix
落点 drop point Meh?FW||5
开关站 switch station Z-m,~Hh
双回同杆并架 double-circuit lines on the same tower [P*3ld,,G%
变电站 transformer substation x{io*sY-
补偿度 degree of compensation zE VJ
高抗 high voltage shunt reactor QjfQoT F
无功补偿 reactive power compensation nLq7J:
故障 fault 2tvMa%1^
调节 regulation z`uqK!v(K
裕度 magin WNTm
三相故障 three phase fault d#T8|#O"
故障切除时间 fault clearing time o"^}2^)_SR
极限切除时间 critical clearing time ~B%EvG7:n
切机 generator triping |7Z,z0 ?V
高顶值 high limited value ma LJ M\C
强行励磁 reinforced excitation ZNPzQ:I@
线路补偿器 LDC(line drop compensation) V"VWHAu*.w
机端 generator terminal D%LM"p
静态 static (state) ww"ihUX
动态 dynamic (state) Ms?V1
单机无穷大系统 one machine - infinity bus system X|L8s$>
机端电压控制 AVR =y7]9SOq
电抗 reactance U'LO;s04m
电阻 resistance $P]%Px!x
功角 power angle %5RYa<oP
有功(功率) active power @1P1n8mH]
无功(功率) reactive power ua:.97~Ym
功率因数 power factor |bDN~c:/
无功电流 reactive current w_^&X;0^
下降特性 droop characteristics %dZD;Vhg
斜率 slope w;Qo9=-
额定 rating /#$bb4
变比 ratio l1c&a[M)
参考值 reference value lg;Y}?P
电压互感器 PT Xvs{2
分接头 tap ^e8R43w:!
下降率 droop rate {mL/)\
仿真分析 simulation analysis ~U8#Iq1
传递函数 transfer function }Iub{30mp
框图 block diagram )T#;1qNB
受端 receive-side U6X~]| o
裕度 margin nx=#QLi
同步 synchronization l{#m"S7J^
失去同步 loss of synchronization )F? 57eh
阻尼 damping H'I|tPs
摇摆 swing #2DH_P
保护断路器 circuit breaker wRPBJ-C)
电阻:resistance Xkl^!,
电抗:reactance J+\F)k>r
阻抗:impedance O)Nt"k7
b
电导:conductance sNvT0
电纳:susceptance