1 backplane 背板 Pu/-Qpqh
2 Band gap voltage reference 带隙电压参考 FZeN,
3 benchtop supply 工作台电源 +9=@E
4 Block Diagram 方块图 5 Bode Plot 波特图 6qz!M
6 Bootstrap 自举 ?qq!%4mTB
7 Bottom FET Bottom FET jQH5$
8 bucket capcitor 桶形电容 w>/pQ6=OFR
9 chassis 机架 $1Q3Y'Q9
10 Combi-sense Combi-sense jSUAU}u!M
11 constant current source 恒流源 ]4LT#
12 Core Sataration 铁芯饱和 nr<}Hc^f-
13 crossover frequency 交叉频率 's56L,^:
14 current ripple 纹波电流 "-~D!{rS
15 Cycle by Cycle 逐周期 Ivd[U`=Q
16 cycle skipping 周期跳步 ` $QzTv
17 Dead Time 死区时间 $=@9 D,R
18 DIE Temperature 核心温度 ;f\R$u-
19 Disable 非使能,无效,禁用,关断 Up1$xLSl
20 dominant pole 主极点 cNuuzA
21 Enable 使能,有效,启用 )cv0$
22 ESD Rating ESD额定值 : .FfE
23 Evaluation Board 评估板 0pZ.; /<{
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. !h`cXY~w
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 +Y.uZJ6+
25 Failling edge 下降沿 IlC:dA
26 figure of merit 品质因数 D>"{H7mY
27 float charge voltage 浮充电压 w|hyU4- ^
28 flyback power stage 反驰式功率级 .SRuyioF&
29 forward voltage drop 前向压降 W?4&lC^G
30 free-running 自由运行
mZ& \3m=
31 Freewheel diode 续流二极管 .zSimEOF
32 Full load 满负载 33 gate drive 栅极驱动 jl 30\M7
34 gate drive stage 栅极驱动级 5{!a+
35 gerber plot Gerber 图 #1,>Qnl
36 ground plane 接地层 =ihoVA:|
37 Henry 电感单位:亨利 CHdet(_=v
38 Human Body Model 人体模式 0Tn|Q9R
39 Hysteresis 滞回 ;s!ns N
40 inrush current 涌入电流 /!&b'7y
41 Inverting 反相 R"\ub"]
42 jittery 抖动 U#~nN+SIt
43 Junction 结点 `|ck5DZT5L
44 Kelvin connection 开尔文连接 QB.*R? A
45 Lead Frame 引脚框架 #P,[fgNy
46 Lead Free 无铅 J*6n6
47 level-shift 电平移动 )W}/k$S
48 Line regulation 电源调整率 wr;|\<c
49 load regulation 负载调整率 JK^B +.
50 Lot Number 批号 0[$Mo3c+'
51 Low Dropout 低压差 9-Nq[i"
52 Miller 密勒 53 node 节点 9B?t3:
54 Non-Inverting 非反相 '#An+;x{
55 novel 新颖的 tr9_bl&z
56 off state 关断状态 v[3hnLN%
57 Operating supply voltage 电源工作电压 -XDP-Trk
58 out drive stage 输出驱动级 *F%ol;|Q
59 Out of Phase 异相 <>5:u
60 Part Number 产品型号 /PB3^d>Q2
61 pass transistor pass transistor j
O5:{%
62 P-channel MOSFET P沟道MOSFET ~jRk10T(B
63 Phase margin 相位裕度 A86lyBDQ*
64 Phase Node 开关节点 E't G5,/m
65 portable electronics 便携式电子设备 b1['uJF
66 power down 掉电 ^?S@v1~7d
67 Power Good 电源正常 L_zmU_zD
68 Power Groud 功率地 Zy+QA>d|
69 Power Save Mode 节电模式 i&s=!`
70 Power up 上电 2I(@aB+
71 pull down 下拉 #3:'lGBIK
72 pull up 上拉 J^+$L"K
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) S1^Mw;?P
74 push pull converter 推挽转换器 |uBot#K|
75 ramp down 斜降 @ !O&b%8X%
76 ramp up 斜升 C[<\ufclD
77 redundant diode 冗余二极管 G4J6
78 resistive divider 电阻分压器 rEpKX
79 ringing 振 铃 @vYN7
80 ripple current 纹波电流 p7=^m>Z6
81 rising edge 上升沿 B|
0s4E
82 sense resistor 检测电阻 $> rfAs!
83 Sequenced Power Supplys 序列电源 ka9v2tE\
84 shoot-through 直通,同时导通 ht74h
85 stray inductances. 杂散电感 l<MCmKuYp
86 sub-circuit 子电路 m$y$wo<K[7
87 substrate 基板 ~JmxW;|_x)
88 Telecom 电信 M(]|}%
89 Thermal Information 热性能信息 F]&J%i
F[
90 thermal slug 散热片 ALt";8Oa
91 Threshold 阈值 WZ
V*J&
92 timing resistor 振荡电阻 #uw*8&%0
93 Top FET Top FET HgBEV
94 Trace 线路,走线,引线 wqoN@d
95 Transfer function 传递函数 D~ `YRbv
96 Trip Point 跳变点 =z/mI y<
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) q@"4Rbu6
98 Under Voltage Lock Out (UVLO) 欠压锁定 zB7dCw
99 Voltage Reference 电压参考 d?qO`-
~$
100 voltage-second product 伏秒积 $6?KH7lA
101 zero-pole frequency compensation 零极点频率补偿 hB<z]sl
102 beat frequency 拍频 )mZy>45
103 one shots 单击电路 ?(L?X&)v
104 scaling 缩放 g8*|"{
105 ESR 等效串联电阻 [Page] ~)CU m[:oM
106 Ground 地电位 W:( Usy
107 trimmed bandgap 平衡带隙 m?CjYqvf
108 dropout voltage 压差 1Y0oo jD
109 large bulk capacitance 大容量电容 ]{,=mOk
110 circuit breaker 断路器 xupdjT%4
111 charge pump 电荷泵 @5@{Es1u
112 overshoot 过冲 "dU#j,B2
WaK{/6?T,
印制电路printed circuit 0QSi\: 1f
印制线路 printed wiring z+B
印制板 printed board dz.MH
印制板电路 printed circuit board kK6>>lD'
印制线路板 printed wiring board +fR`@HI
印制元件 printed component v+2qR0,LM
印制接点 printed contact ba1QFzN
印制板装配 printed board assembly j%<@uiu
板 board :[?o7%"
刚性印制板 rigid printed board !g:G{b
挠性印制电路 flexible printed circuit }pZnWK+
挠性印制线路 flexible printed wiring ^?0,G>I%-
齐平印制板 flush printed board g/Nj|:3
金属芯印制板 metal core printed board mZ&Mj.0+~
金属基印制板 metal base printed board ]6 7wk
多重布线印制板 mulit-wiring printed board o;P;=<
塑电路板 molded circuit board DLQ`<aU
散线印制板 discrete wiring board Y##P9^zH1
微线印制板 micro wire board -Af`AX
积层印制板 buile-up printed board XD>@EYN<X
表面层合电路板 surface laminar circuit z4UQ:z@
埋入凸块连印制板 B2it printed board ! yUKNR
载芯片板 chip on board qk"=nAJX
埋电阻板 buried resistance board gV>\lMc[-%
母板 mother board
W/QOG&g
子板 daughter board +FK<j;}C7
背板 backplane '0]_8Sy&
裸板 bare board 4f~ZY]|nM
键盘板夹心板 copper-invar-copper board j[eEyCW[)
动态挠性板 dynamic flex board ~ ?_Z!eS
静态挠性板 static flex board Pz!yIj
可断拼板 break-away planel B{KD ]
电缆 cable d> AmM!J
挠性扁平电缆 flexible flat cable (FFC) TzXl ?N
薄膜开关 membrane switch 6%y: hLT
混合电路 hybrid circuit k&;L(D
厚膜 thick film ?wY.B
厚膜电路 thick film circuit WSwmX3rn
薄膜 thin film (3*Hl
薄膜混合电路 thin film hybrid circuit :!\./z8v
互连 interconnection !XC7FUO
导线 conductor trace line Kf5 p*AI
齐平导线 flush conductor d)sl)qt}0
传输线 transmission line fX|,s2-FW
跨交 crossover sVnuSm
板边插头 edge-board contact E6)mBAE
增强板 stiffener Q;M\P/f
基底 substrate &|;!St]!M
基板面 real estate /LzNr0>2
导线面 conductor side [: j_Y3-9
元件面 component side W=w@SO_?wp
焊接面 solder side %>z}P&Yz
导电图形 conductive pattern tB7aHZ|
非导电图形 non-conductive pattern p}z0(lQ*~
基材 base material F,:VL*.5kJ
层压板 laminate ]x\wP7x
覆金属箔基材 metal-clad bade material ?g.w%Mf*
覆铜箔层压板 copper-clad laminate (CCL) _ji%BwJ
复合层压板 composite laminate wH<*
薄层压板 thin laminate jT0fF
基体材料 basis material ~?r6Ax-R
预浸材料 prepreg 9-SXu lgu
粘结片 bonding sheet ,{at?y*
预浸粘结片 preimpregnated bonding sheer O}V2>W$
环氧玻璃基板 epoxy glass substrate p}uw-$O
预制内层覆箔板 mass lamination panel UW3F)
内层芯板 core material Bnv%W4
粘结层 bonding layer {BU,kjv1g
粘结膜 film adhesive PGGJpD?
无支撑胶粘剂膜 unsupported adhesive film q[ZYlF,Ho
覆盖层 cover layer (cover lay) VPbNLi
增强板材 stiffener material 'fsOKx4Z
铜箔面 copper-clad surface E~Nr4vq
去铜箔面 foil removal surface HC+R:Dz
层压板面 unclad laminate surface 'l;|t"R12
基膜面 base film surface uy~j$ lrn
胶粘剂面 adhesive faec ,sK-gw
原始光洁面 plate finish oJy/PR3
粗面 matt finish <s>SnOD
剪切板 cut to size panel CqV
\:50g
超薄型层压板 ultra thin laminate 2]wh1)
A阶树脂 A-stage resin {`> x"Y5
B阶树脂 B-stage resin %94"e7Hy
C阶树脂 C-stage resin G39t'^ZK*#
环氧树脂 epoxy resin QWEK;kUa@
酚醛树脂 phenolic resin %LyB~X
聚酯树脂 polyester resin u9Ro=#xt
聚酰亚胺树脂 polyimide resin 9q?gmAn.
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin JI(|sAH
丙烯酸树脂 acrylic resin )uP= o
三聚氰胺甲醛树脂 melamine formaldehyde resin "( xu
多官能环氧树脂 polyfunctional epoxy resin 78wcMQNX9
溴化环氧树脂 brominated epoxy resin kQ+5pFo3
环氧酚醛 epoxy novolac 04:Dbt~=?p
氟树脂 fluroresin @z.!Dby
硅树脂 silicone resin <V{BRRx
硅烷 silane q I}Zg)q]
聚合物 polymer .755-S
无定形聚合物 amorphous polymer n$QFj'
结晶现象 crystalline polamer whshjl?a
双晶现象 dimorphism 1mqFnVkf&+
共聚物 copolymer ,ic}
合成树脂 synthetic 5:wf"3%%
热固性树脂 thermosetting resin [Page] O{PRK5 ^h
热塑性树脂 thermoplastic resin ?zEgN!\R)
感光性树脂 photosensitive resin I
g`#U~
环氧值 epoxy value W7 $yE},z
双氰胺 dicyandiamide {#MViBhd%
粘结剂 binder d hy= x
胶粘剂 adesive jp|wc,]!
固化剂 curing agent 'CvZiW[_r
阻燃剂 flame retardant !jm
a --
遮光剂 opaquer PNq#o%q
增塑剂 plasticizers %zGPF
不饱和聚酯 unsatuiated polyester `#hy'S:e
聚酯薄膜 polyester Tn|reXc0e
聚酰亚胺薄膜 polyimide film (PI) |zf||ju
聚四氟乙烯 polytetrafluoetylene (PTFE) pR$c<p
增强材料 reinforcing material zI(Pti
折痕 crease _v\QuI6
云织 waviness Z(s}
#-
鱼眼 fish eye Q]\xO/
毛圈长 feather length p w,.*N3P
厚薄段 mark Aq-v3$XL
裂缝 split {)+/w"^.
捻度 twist of yarn u^uW<.#z
浸润剂含量 size content <NUZPX29
浸润剂残留量 size residue ZISR]xay
处理剂含量 finish level +{s^"M2`
偶联剂 couplint agent 2:]Sy4K{
断裂长 breaking length ny}?+&K
吸水高度 height of capillary rise -`( :L[
湿强度保留率 wet strength retention @[^H*^1|g
白度 whitenness XH/|jE.9^|
导电箔 conductive foil |D\ ukml
铜箔 copper foil '{|87kI
压延铜箔 rolled copper foil =y<Fz*aA
光面 shiny side `bi5#xR
粗糙面 matte side GxBj N7"
处理面 treated side fRbVc
防锈处理 stain proofing Y=5hm
双面处理铜箔 double treated foil :F_U^pyG
模拟 simulation BjShK+Y
逻辑模拟 logic simulation Lczcz"t
电路模拟 circit simulation N.fIg
时序模拟 timing simulation S+He
模块化 modularization ow&R~_
设计原点 design origin /<n_X:[)
优化(设计) optimization (design) cD 1p5U
供设计优化坐标轴 predominant axis 3[c54S+(U
表格原点 table origin ?HW*qD#k
元件安置 component positioning F/&&VSv>LO
比例因子 scaling factor KMZ% 1=a
扫描填充 scan filling n9#@
e}r
矩形填充 rectangle filling {BF$N#7
填充域 region filling )t|M)z J
实体设计 physical design Mqna0"IYx*
逻辑设计 logic design 8.vD]hO
逻辑电路 logic circuit ej0q*TH.
层次设计 hierarchical design 2nf{2edC
自顶向下设计 top-down design v"^G9u
自底向上设计 bottom-up design rtPQ:CaA)?
费用矩阵 cost metrix ZqSczS7uf
元件密度 component density Alrk3I3{
自由度 degrees freedom P:Bg()
出度 out going degree f>Ge
Em~
入度 incoming degree RxAZ<8T_
曼哈顿距离 manhatton distance 4kIy4x'*
欧几里德距离 euclidean distance
Eg
;r]?|6
网络 network +] FdgmK:
阵列 array #
TvY*D,
段 segment m~2PpO
逻辑 logic gI[xOK#
逻辑设计自动化 logic design automation W &*0F~
分线 separated time z+;+c$X
分层 separated layer /:B!hvpw
定顺序 definite sequence /W fpA\4S
导线(通道) conduction (track) tY VmB:l
导线(体)宽度 conductor width SoCa_9*X
导线距离 conductor spacing emTqbO
导线层 conductor layer }e1f kjWk
导线宽度/间距 conductor line/space zh7NXTzyf
第一导线层 conductor layer No.1 B
lD
圆形盘 round pad UZqr6A(/H
方形盘 square pad g$uj<"^
菱形盘 diamond pad V4_ZBeWA
长方形焊盘 oblong pad cZA l.}/
子弹形盘 bullet pad HG{OkDx]fl
泪滴盘 teardrop pad p?ICZg:
雪人盘 snowman pad BjSLbw-C
形盘 V-shaped pad V Uh{|@D
环形盘 annular pad L\o-zNY
非圆形盘 non-circular pad g%Eb{~v
隔离盘 isolation pad WSUU_^.
非功能连接盘 monfunctional pad 7V?TLGgd$
偏置连接盘 offset land ih~ R?W
腹(背)裸盘 back-bard land nzU^G)
盘址 anchoring spaur 9[T}cN=|
连接盘图形 land pattern NU O9,
连接盘网格阵列 land grid array yoQ}m/Cj
孔环 annular ring ).5$c0`U&
元件孔 component hole Re-4y5f
安装孔 mounting hole kyMWO*>|
支撑孔 supported hole z`XX[9$qm
非支撑孔 unsupported hole r761vtC#
导通孔 via wMr*D['" #
镀通孔 plated through hole (PTH) s>ilxLSX]
余隙孔 access hole JZB7?@h%
盲孔 blind via (hole) |<gYzbq
埋孔 buried via hole 4"7/+6Z
埋,盲孔 buried blind via #L
ffmS
任意层内部导通孔 any layer inner via hole WTbq)D(&[_
全部钻孔 all drilled hole <<4U:
定位孔 toaling hole 8(]*J8/wt
无连接盘孔 landless hole 22$M6Qof]n
中间孔 interstitial hole p%[/
_ -7
无连接盘导通孔 landless via hole &]tZ6
引导孔 pilot hole ].w~FUa
端接全隙孔 terminal clearomee hole ~qT5F)$B-
准尺寸孔 dimensioned hole [Page] _c,c;
在连接盘中导通孔 via-in-pad b*(74 >XY
孔位 hole location jnho*,X
孔密度 hole density q8#zv_>K
孔图 hole pattern B)*?H=f/
钻孔图 drill drawing @~sJ
((G[5
装配图assembly drawing MfNsor
参考基准 datum referan #TS:|=
1) 元件设备 Xs}.7
=#0f4z
三绕组变压器:three-column transformer ThrClnTrans *3
8
u ~n
双绕组变压器:double-column transformer DblClmnTrans ^ZP
$(a4
电容器:Capacitor x4v@o?zW
并联电容器:shunt capacitor -c4g;;%
电抗器:Reactor cao=O
\Y7
母线:Busbar kn%i#Fz
输电线:TransmissionLine (X zy~l<
发电厂:power plant RqB 8g
断路器:Breaker zi%Ql|zI~
刀闸(隔离开关):Isolator {#y~ Qk;T
分接头:tap Dk%+|c
电动机:motor /x q^]0xy
(2) 状态参数 37<^Oly!
6--t6>5
有功:active power |r['"6
无功:reactive power SR_<3WW
电流:current '-X[T}
容量:capacity SFJ"(ey$
电压:voltage y90wLU9f
档位:tap position duQ,6
有功损耗:reactive loss u43W.4H13
无功损耗:active loss N2 4J!L
功率因数:power-factor m)Ta5w^
功率:power f*o+g:]3
功角:power-angle \?tE,\Ln
电压等级:voltage grade i+90##4<?
空载损耗:no-load loss +9exap27
铁损:iron loss WYJH+"@%j
铜损:copper loss )s N}ClgJ
空载电流:no-load current q{Ao
j
阻抗:impedance 9$f%
正序阻抗:positive sequence impedance ij5|P4Eka
负序阻抗:negative sequence impedance 4ibOVBG:*,
零序阻抗:zero sequence impedance CFXr=.yz
电阻:resistor ;&c9!LfP
电抗:reactance (h"-#q8$
电导:conductance UMUG~P&@
电纳:susceptance G,!{Q''w
无功负载:reactive load 或者QLoad wU(p_G3
有功负载: active load PLoad u+
b `aB
遥测:YC(telemetering) H7FOf[3'
遥信:YX CT?4A1[aD
励磁电流(转子电流):magnetizing current Yz)+UF,
定子:stator +\-cf,WkI
功角:power-angle S-5O$EnD
上限:upper limit R0~w F>
下限:lower limit mor[AJ
并列的:apposable AO]k*N,N
高压: high voltage LEuDDJ-
低压:low voltage U4=m>Ty
中压:middle voltage A01PEVd@A
电力系统 power system >N~orSw%
发电机 generator 1>=%TIO)
励磁 excitation 6L"b O'_5K
励磁器 excitor BD-
c<K"
电压 voltage o-<XR9,N*
电流 current jr(|-!RVMN
母线 bus 4&AGVplgF
变压器 transformer }Gva=N:
升压变压器 step-up transformer -e O>d}
高压侧 high side Q[Gs%/>
输电系统 power transmission system cHC1l
输电线 transmission line Y0yu,
固定串联电容补偿fixed series capacitor compensation {>UT'fa-
稳定 stability )>tT""yEl
电压稳定 voltage stability Ax6zx
功角稳定 angle stability
RK/>5
暂态稳定 transient stability `-MCI)Fq_R
电厂 power plant 5(thDZ !
能量输送 power transfer !5
?<QKOe
交流 AC lWDSF]ZYV
装机容量 installed capacity N :OLN[
电网 power system Dtox/ ,"
落点 drop point eus@;l*
开关站 switch station =)}Yw)
双回同杆并架 double-circuit lines on the same tower wbB\~*Z)
变电站 transformer substation [0D.+("EW
补偿度 degree of compensation 1HLU
&
高抗 high voltage shunt reactor d ATAH}r&
无功补偿 reactive power compensation 9*P-k.Bl
故障 fault 5Y 7 %Z
调节 regulation W=y9mW|p/
裕度 magin M?5v oV*
三相故障 three phase fault oT|:gih5
故障切除时间 fault clearing time YZAQt*x
极限切除时间 critical clearing time drvz
[
9;
切机 generator triping 558!?kx$
高顶值 high limited value &oE'|^G
强行励磁 reinforced excitation \E6 0
线路补偿器 LDC(line drop compensation) 5&.I9}[)j
机端 generator terminal XZ2 ji_D
静态 static (state) ]@m`bs_6
动态 dynamic (state) g 'Wr+(A_
单机无穷大系统 one machine - infinity bus system r?9".H
机端电压控制 AVR =3nA5'UZ
电抗 reactance y Ni3@f
电阻 resistance XT\2
功角 power angle ?w&?P}e +
有功(功率) active power >3,}^`l
无功(功率) reactive power R[kF(C&
功率因数 power factor |tC= j.
无功电流 reactive current _0y]U];ce
下降特性 droop characteristics ]x66/O\0u
斜率 slope
c& $[a%s
额定 rating *uSlp_;kB
变比 ratio lk[u
参考值 reference value 3sgo5D-rMI
电压互感器 PT ~>Y^?l
分接头 tap S_ra8HY8
下降率 droop rate mz<X$2]?
仿真分析 simulation analysis Md0`/F:+2
传递函数 transfer function hOYX
框图 block diagram ~.#57g F"
受端 receive-side N'PK4:
裕度 margin `<#O8,7`
同步 synchronization |WNI[49
失去同步 loss of synchronization %0({MU
阻尼 damping L3\(<[
摇摆 swing B`w8d[cL7
保护断路器 circuit breaker &XW~l>!+
电阻:resistance }rnu:7
电抗:reactance iVo-z#
阻抗:impedance X5(oL
电导:conductance nGsFt.
电纳:susceptance