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真空术语 l=.h]]`;
+'f+0T\)
1.标准环境条件 standard ambient condition: H$o=kQN
2.气体的标准状态 standard reference conditions forgases: }aC@o v]2
3.压力(压强)p pressure: ,2C{X+t
4.帕斯卡Pa pascal: (yB)rBh>n
5.托Torr torr: 3j2#'Jf|:
6.标准大气压atm standard atmosphere: K,'v{wSr
7.毫巴mbar millibar: quGvq"Y>
8.分压力 partial pressure: GL<u#[
9.全压力 total pressure: zXRq) ;s
10.真空 vacuum: UBZ37P
11.真空度 degree of vacuum: q*E<~!jL
12.真空区域 ranges of vacuum: #lld*I"d
13.气体 gas: <*'%Xgm
14.非可凝气体 non-condensable gas: X@j.$0eK
15.蒸汽vapor: +thkx$o
16.饱和蒸汽压saturation vapor pressure: ].e4a;pt
17.饱和度degree of saturation: A)j',jE&1
18.饱和蒸汽saturated vapor: t5"g 9`A L
19.未饱和蒸汽unsaturated vapor: &ap&dM0@%a
20.分子数密度n,m-3 number density of molecules: eGF+@)K1"
21.平均自由程ι、λ,m mean free path: 0!fT:Ra
22.碰撞率ψ collision rate: 6 J
B"qd
23.体积碰撞率χ volume collision rate:
c1x{$
24.气体量G quantity of gas: yJRqX]MLA
25.气体的扩散 diffusion of gas: 6";ew:Ih^
26.扩散系数D diffusion coefficient; diffusivity: *\!>22*
27.粘滞流 viscous flow: gFQ\zOlY8a
28.粘滞系数η viscous factor: YooPHeQ
29.泊肖叶流 poiseuille flow: V }?MP-.c
30.中间流 intermediate flow: b$W~w*O
31.分子流 molecular flow: )oU%++cdo
32克努曾数 number of knudsen: I)YUGA5
33.分子泻流 molecular effusion; effusive flow: E'ay
@YAp
34.流逸 transpiration: )d$FFTH
35.热流逸 thermal transpiration: %p t^?
36.分子流率qN molecular flow rate; molecular flux: \fD)|
37.分子流率密度 molecular flow rate density; density of molecular flux: |T) $E
38.质量流率qm mass flow rare: FJCL K#-
39.流量qG throughput of gas: ]I<w;.z
40.体积流率qV volume flow rate: t3(~aH
41.摩尔流率qυ molar flow rate: d"0=.sA
42.麦克斯韦速度分布 maxwellian velocity distribution: 3[Xc:;+/
43.传输几率Pc transmission probability: LyuA("xB#
44.分子流导CN,UN molecular conductance: N7 ox#=g
45.流导C,U conductance: b2 5.CGF
46.固有流导Ci,Ui intrinsic conductance: "pInb5F
47.流阻W resistance: h%UM<TZ]"
48.吸附 sorption: z55g'+Kab
49.表面吸附 adsorption: xMr=tU1C
50.物理吸附physisorption: %5yP^BL0
51.化学吸附 chemisorption: s$D"
52.吸收absorption: vi;yT.
53.适应系数α accommodation factor: #9e 2+5s
54.入射率υ impingement rate: =!N,{V_
55.凝结率condensation rate: rf=oH
}
56.粘着率 sticking rate: #6F|}E
57.粘着几率Ps sticking probability: 9~5LKg7Ac
58.滞留时间τ residence time: {\u6Cj x
59.迁移 migration: O/b1^
Y
60.解吸 desorption: nIEIb.-
61.去气 degassing: 9cXL4
62.放气 outgassing: l0K_29^
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: pJo#7rxd6
64.蒸发率 evaporation rate: me
YSW
65.渗透 permeation: ZE[NQ8
66.渗透率φ permeability: W!R7D%nX
67.渗透系数P permeability coefficient CsX@u#
2. 1.真空泵 vacuum pumps OD6dMql
1-1.容积真空泵 positive displacement pump: P/,ezVb=
⑴.气镇真空泵 gas ballast vacuum pump: +#Ga}eCM
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: Txa
2`2t7
⑶.干封真空泵 dry-sealed vacuum pump: fi
⑷.往复真空泵 piston vacuum pump: Xk?Y
⑸.液环真空泵 liquid ring vacuum pump: otmyI;v 7<
⑹.旋片真空泵 sliding vane rotary vacuum pump: ~sVbg$]\ G
⑺.定片真空泵 rotary piston vacuum pump: v`\ CzT
⑻.滑阀真空泵 rotary plunger vacuum pump: nU23D@l
⑼.余摆线真空泵 trochoidal vacuum pump: PnJA'@x
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: (vPE?^}b
⑾.罗茨真空泵 roots vacuum pump: =l4F/?u]f@
1-2.动量传输泵 kinetic vacuum pump: S;}/ql y
⑴.牵引分子泵molecular drag pump: 6g)X&pZ
⑵.涡轮分子泵turbo molecular pump: *t bgIW+h
⑶.喷射真空泵ejector vacuum pump: xgJyG.?
⑷.液体喷射真空泵liquid jet vacuum pump: ,veo/k<"r8
⑸.气体喷射真空泵gas jet vacuum pump: :v%iF!+.P
⑹.蒸汽喷射真空泵vapor jet vacuum pump : $xK(bc'{
⑺.扩散泵diffusion pump : F#Bi*YY
⑻.自净化扩散泵self purifying diffusion pump: H><!
C
⑼.分馏扩散泵 fractionating diffusion pump : SN5Z@kK
⑽.扩散喷射泵diffusion ejector pump : JpZ3T~Wrf
⑾.离子传输泵ion transfer pump: g+QNIM>
1-3.捕集真空泵 entrapment vacuum pump: GiKmB-HO
⑴吸附泵adsorption pump: ]htx9ds=
⑵.吸气剂泵 getter pump: v%)=!T,
⑶.升华(蒸发)泵 sublimation (evaporation)pump : :auq#$B
⑷.吸气剂离子泵getter ion pump: Q5c13g2(c
⑸.蒸发离子泵 evaporation ion pump: ?MD\\gN
⑹.溅射离子泵sputter ion pump: fl71{jJ_
⑺.低温泵cryopump: {PkPKp
;5:3 =F>ao
2.真空泵零部件 y<^hM6S?Z
2-1.泵壳 pump case: Tl
S904'
2-2.入口 inlet: U(\ ^!S1
2-3.出口outlet: DIWcX<s
2-4.旋片(滑片、滑阀)vane; blade : P`y 0FKS
2-5.排气阀discharge valve: }qN
2-6.气镇阀gas ballast valve: $*;ke5Dm4
2-7.膨胀室expansion chamber: p;rT#R&6>
2-8.压缩室compression chamber: eXCH*vZY
2-9.真空泵油 vacuum pump oil: Za'}26
2-10.泵液 pump fluid: "FXT8Qxg
2-11.喷嘴 nozzle: Jm3iYR+,
2-13.喷嘴扩张率nozzle expansion rate: E|ZLz~
2-14.喷嘴间隙面积 nozzle clearance area : ePY69!pO5e
2-15.喷嘴间隙nozzle clearance: }O8#4-E_Ji
2-16.射流jet: r~sQdf
2-17.扩散器diffuser: YA@OA$`E
2-18.扩散器喉部diffuser thoat: |\/V1
2-19.蒸汽导管vapor tube(pipe;chimney): w6.J&O
2-20.喷嘴组件nozzle assembly: =Cp}iM
2-21.下裙skirt: 3ms{gZbw
F}4jm,w
3.附件 $-lP"m@}
3-1阱trap: 2@a]x(
⑴.冷阱 cold trap: oT[8Iu
⑵.吸附阱sorption trap: T0lbMp
⑶.离子阱ion trap: Q*caX
⑷.冷冻升华阱 cryosublimation trap: /;xmM2B'
3-2.挡板baffle: K*oWcsu
3-3.油分离器oil separator: LE@`TPg$R
3-4.油净化器oil purifier: xyRZ
v]K1
3-5.冷凝器condenser: yWZ%|K~$
oWdvpvO
4.泵按工作分类 Hh0a\%!
4-1.主泵main pump: MUqV$#4@I
4-2.粗抽泵roughing vacuum pump: Q~G>=J9
4-3.前级真空泵backing vacuum pump: bId@V[9
4-4.粗(低)真空泵 roughing(low)vacuum pump: Xw<N nvz6
4-5.维持真空泵holding vacuum pump: Oz7WtN
4-6.高真空泵high vacuum pump: l;'c6o0e
4-7.超高真空泵ultra-high vacuum pump: 5mF"nY&lI
4-8.增压真空泵booster vacuum pump: 16n8[U!
Avi8&@ya
5.真空泵特性 NRZ>03w
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: $K*&Wdo
5-2.真空泵的抽气量Q throughput of vacuum pump:。 %SD=3UK6
5-3.起动压力starting pressure: Pdw[#X<[`
5-4.前级压力 backing pressure : .+Fh,bNYK
5-5.临界前级压力 critical backing pressure: $.-\2;U
5-6.最大前级压力maximum backing pressure: \D,c*I|p7
5-7.最大工作压力maximum working pressure:
i;8tA!
5-8.真空泵的极限压力ultimate pressure of a pump: m\?H
<o0
5-9.压缩比compression ratio: 4^Ghn
5-10.何氏系数Ho coefficient: h` ,! p
5-11.抽速系数speed factor: :Vx5%4J
5-12.气体的反扩散back-diffusion of gas: 4]3(Vyh`
5-13.泵液返流back-streaming of pump fluid: RNn5,W
5-14.返流率back-streaming rate Ye) F{WqZ#
5-15.返迁移back-migration: -% Z?rn2
5-16.爆腾bumping: '{xPdN
5-17.水蒸气允许量qm water vapor tolerable load: q(I`g;MF
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: Ff@Cs0R
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: ?\NWKp
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump ULIpb
3. 1.一般术语 6_h'0~3?`
1-1.压力计pressure gauge: cN\Fgbt
1-2.真空计vacuum gauge: =g+Rk+ jn
⑴.规头(规管)gauge head: ]7yr.4?a
⑵.裸规nude gauge : \,5OPSB
⑶.真空计控制单元gauge control unit : 1O,<JrE+-
⑷.真空计指示单元gauge indicating unit : Yx{q VU
k(.6K[b
2.真空计一般分类 P\R#!+FgW8
2-1.压差式真空计differential vacuum gauge: 'lD"{^
2-2.绝对真空计 absolute vacuum gauge: 0xQ="aXE
2-3.全压真空计total pressure vacuum gauge: _]# ^2S
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: HRxA0y=
2-5.相对真空计relative vacuum gauge : yq2pg8%
~t-!{F
3.真空计特性 J"Z=`I)KON
3-1.真空计测量范围pressure range of vacuum gauge: lboi\GP|
3-2.灵敏度系数sensitivity coefficient: @?r[
$Ea1M
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): f Nnemn@>
3-5.规管光电流photon current of vacuum gauge head: ht1d[
3-6.等效氮压力equivalent nitrogen pressure : HM(S}>
3-7.X射线极限值 X-ray limit: M$0-!$RY
3-8.逆X射线效应anti X-ray effect: yMoV|U6
3-9.布利尔斯效应blears effect: _rU%DL?
W dNOE;R
4.全压真空计 da/Tms`T
4-1.液位压力计liquid level manometer: Lradyo44u\
4-2.弹性元件真空计elastic element vacuum gauge: n$O[yRMI[
4-3.压缩式真空计compression gauge: $+$S}i=
4-4.压力天平pressure balance: C>:'@o
Z
4-5.粘滞性真空计viscosity gauge : 7A mnxFC
4-6.热传导真空计thermal conductivity vacuum gauge : J*} warf&
4-7.热分子真空计thermo-molecular gauge: Ghb Jty`
4-8.电离真空计ionization vacuum gauge: awic9uMH
4-9.放射性电离真空计radioactive ionization gauge: Ob#d;F
4-10.冷阴极电离真空计cold cathode ionization gauge: *lT: P-
4-11.潘宁真空计penning gauge: =
olmBXn/
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: exHg<18WSe
4-13.放电管指示器discharge tube indicator: Y 3 QrD&V
4-14.热阴极电离真空计hot cathode ionization gauge: tr t^o
4-15.三极管式真空计triode gauge: hmQ;!9
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: 5v`[c+@F
4-17.B-A型电离真空计Bayard-Alpert gauge: e(~9JP9
4-18.调制型电离真空计modulator gauge: (q]_&%yW
4-19.抑制型电离真空计suppressor gauge: F?B`rw@xr
4-20.分离型电离真空计extractor gauge: 34gC[G=
4-21.弯注型电离真空计bent beam gauge: +-*Ww5Zti
4-22.弹道型电离真空计 orbitron gauge : zY=eeG+4s
4-23.热阴极磁控管真空计hot cathode magnetron gauge: "A]Xe[oS
j@HOU~x
5.分压真空计(分压分析器) KW1b #g%Z
5-1.射频质谱仪radio frequency mass spectrometer: %A^V@0K3
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: O;dtz\
5-3.单极质谱仪momopole mass spectrometer: 0lm7'H*~
5-4.双聚焦质谱仪double focusing mass spectrometer: 8h%oJ4da
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: %Y:"5fH
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: :+qd>;yf#
5-7.回旋质谱仪omegatron mass spectrometer: IGQcQ/M
5-8.飞行时间质谱仪time of flight mass spectrometer: P\lEfsuR
L]kd.JJvy
6.真空计校准 _* m<Z;Et
6-1.标准真空计reference gauges: nUy. gAb
6-2.校准系统system of calibration: N7
FndB5%
6-3.校准系数K calibration coefficient: };Oyv7D+b
6-4.压缩计法meleod gauge method: 9-3, DxZ}
6-5.膨胀法expansion method: (E{}iq@2
6-6.流导法flow method: R ~ZcTY[8
4. 1.真空系统vacuum system ?-Zl(uX
1-1.真空机组pump system: LpYG!K l
1-2.有油真空机组pump system used oil : N|@jHxy
1-3.无油真空机组oil free pump system $&~moAl
1-4.连续处理真空设备continuous treatment vacuum plant: 2Pm[
kD4E=
1-5.闸门式真空系统vacuum system with an air-lock: /f}!G
1-6.压差真空系统differentially pumped vacuum system: M(/ATOJ(
1-7.进气系统gas admittance system: Db`SNk=
d2a*xDkv
2.真空系统特性参量 n(h9I'V8)F
2-1.抽气装置的抽速volume flow rate of a pumping unit : xMs!FMn[
2-2.抽气装置的抽气量throughput of a pumping unit : h4#y'E!,Z
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: v6C$Y+5~
2-4.真空系统的漏气速率leak throughput of a vacuum system: |ns
B'Q
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: 1]A$
2-6.极限压力ultimate pressure: C==yl"w
2-7.残余压力residual pressure: bt{b%r
2-8.残余气体谱residual gas spectrum: ,6EhtNDu
2-9.基础压力base pressure: M
'#a.z%
2-10.工作压力working pressure: i$5<>\g
2-11.粗抽时间roughing time: n
"bii7h
2-12.抽气时间pump-down time: J6I:UML
2-13.真空系统时间常数time constant of a vacuum system: FMi:2.E
2-14.真空系统进气时间venting time: ?Xl;>}zj
lHUd<kEC
3.真空容器 S54q?sb_
3-1.真空容器;真空室vacuum chamber: QdrZi.qKH
3-2.封离真空装置sealed vacuum device: /rIyW?& f
3-3.真空钟罩vacuum bell jar: jQrj3*V
3-4.真空容器底板vacuum base plate: `y|_hb
3-5.真空岐管vacuum manifold: ZXIw^!8@/
3-6.前级真空容器(贮气罐)backing reservoir: hYht8?6}m
3-7.真空保护层outer chamber: ^B)f!HtU
3-8.真空闸室vacuum air lock: bFIM07
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: O
joa3
Qhq' %LR
4.真空封接和真空引入线 rJ)j./c
4-1.永久性真空封接permanent seal : F[v:&fle
4.2.玻璃分级过渡封接graded seal : PU,%Y_xR
4-3.压缩玻璃金属封接compression glass-to-metal seal: KdBpfPny@
4-4.匹配式玻璃金属封接matched glass-to-metal seal: N[rAb*iT
4-5.陶瓷金属封接ceramic-to-metal seal: Vel}lQD
4-6.半永久性真空封接semi-permanent seal : =%B5TBG
4-7.可拆卸的真空封接demountable joint: 4{@{VsXN
4-8.液体真空封接liquid seal q{ [!" ,
4-9.熔融金属真空封接molten metal seal: C-@[=
4-10.研磨面搭接封接ground and lapped seal: RR+{uSO,t
4-11.真空法兰连接vacuum flange connection: ^TtL-|I
4-12.真空密封垫vacuum-tight gasket: 5a-x$Qb9
4-13.真空密封圈ring gasket: :sQ>oNnz
4-14.真空平密封垫flat gasket: FUarI5#fwF
4-15.真空引入线feedthrough leadthrough: ^Z-oO#)h#
4-16.真空轴密封shaft seal: 9Pb6Z}
4-17.真空窗vacuum window: p$t|eu
4-18.观察窗viewing window: %.m+6
zaF
wFX9F3m
5.真空阀门 NS65F7<&
5-1.真空阀门的特性characteristic of vacuum valves: RA!q)/+
⑴.真空阀门的流导conductance of vacuum valves: Mf2F LrAh
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: EV?U
!O
5-2.真空调节阀regulating valve: 9Ta0Li
5-3.微调阀 micro-adjustable valve: DXo]O}VF
5-4.充气阀charge valve: ^)wKS]BQ..
5-5.进气阀gas admittance valve: `BQv;NtP
5-6.真空截止阀break valve: <PVwf`W.
5-7.前级真空阀backing valve: ae2Q^yLA
5-8.旁通阀 by-pass valve: $~S~pvT
5-9.主真空阀main vacuum valve: 64mg :ed&
5-10.低真空阀low vacuum valve: f4
qVUU
5-11.高真空阀high vacuum valve: pCDN9*0/
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: >.6|\{*sG
5-13.手动阀manually operated valve: -72EXO=|
5-14.气动阀pneumatically operated valve: j*5IRzK1%0
5-15.电磁阀electromagnetically operated valve: ESNI$[`
5-16.电动阀valve with electrically motorized operation: 7o0zny3?
5-17.挡板阀baffle valve: 6Cz
O
ztn
5-18.翻板阀flap valve: xorafL
5-19.插板阀gate valve: R{fJ"Q5'
5-20.蝶阀butterfly valve: `sCn4-$8
FJDE48Vi
6.真空管路 g@37t @I
6-1.粗抽管路roughing line: LQHL4jRXU
6-2.前级真空管路backing line: +U1
Ir5Lx
6-3.旁通管路;By-Pass管路 by-pass line: =#/Kg_RKL
6-4.抽气封口接头pumping stem: {nbT$3=Zt
6-5.真空限流件limiting conductance: veHe
6-6.过滤器filter: r=&,2meo
5. 1.一般术语 WFiX=@SS
1-1真空镀膜vacuum coating: }b1FB<e]
1-2基片substrate: #]x3(}3W
1-3试验基片testing substrate: ?+))J~@t
1-4镀膜材料coating material: `0N7G c
1-5蒸发材料evaporation material: i1|>JM[V
1-6溅射材料sputtering material: ~L"$(^/
1-7膜层材料(膜层材质)film material: m/1FVC@*
1-8蒸发速率evaporation rate: G.H8
><%
1-9溅射速率sputtering rate: qx'0(q2Ii(
1-10沉积速率deposition rate: v !8=B21
1-11镀膜角度coating angle: N(Ru/9!y"
%\v8FCb
2.工艺 c3 O/#*
2-1真空蒸膜vacuum evaporation coating: W;'fAohr
(1).同时蒸发simultaneous evaporation: 54CJ6"q
(2).蒸发场蒸发evaporation field evaporation: W|7|XO
(3).反应性真空蒸发reactive vacuum evaporation: bDM },(
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: ts!tv6@
(5).直接加热的蒸发direct heating evaporation: }! EVf
(6).感应加热蒸发induced heating evaporation: ~<?Zj
(7).电子束蒸发electron beam evaporation: ,\s`T O
(8).激光束蒸发laser beam evaporation: !,$#i
(9).间接加热的蒸发indirect heating evaporation: Y>8Qj+d
(10).闪蒸flash evaportion: D xV=S0P
2-2真空溅射vacuum sputtering: Ifn|wrx;g
(1).反应性真空溅射 reactive vacuum sputtering: -;7xUNQ
(2).偏压溅射bias sputtering: (T_-`N|
(3).直流二级溅射direct current diode sputtering: b3^:Bh9
(4).非对称性交流溅射asymmtric alternate current sputtering: 0+e=s0s.
(5).高频二极溅射high frequency diode sputtering: s`jlE|jtN
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: /)6T>/
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: `9co7[Z
(8).离子束溅射ion beam sputtering: T82 `-bZ
(9).辉光放电清洗glow discharge cleaning: nwU],{(Hgr
2-3物理气相沉积PVD physical vapor deposition: z'U.}27&o
2-4化学气相沉积CVD chemical vapor deposition: {^z73Gxt,
2-5磁控溅射magnetron sputtering: 1ysfpX{=
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: XI\Slq
2-7空心阴极离子镀HCD hollow cathode discharge deposition: fAgeF$9@
2-8电弧离子镀arc discharge deposition: cu N9RG
Y(g_h:lf,]
3.专用部件 y:RW:D&
3-1镀膜室coating chamber: Hz.i $L0}
3-2蒸发器装置evaporator device: ?$|tT\SFV
3-3蒸发器evaporator: 2y
-
QH
3-4直接加热式蒸发器evaporator by direct heat: J'}+0mln
3-5间接加热式蒸发器evaporator by indirect heat: S=_u3OH0
3-7溅射装置sputtering device: <= o<lRU
3-8靶target: /_0B5,6R
3-10时控挡板timing shutter: wa8jr5/k"
3-11掩膜mask: 7|5kak>=
3-12基片支架substrate holder: ,~Mf2Y#m0p
3-13夹紧装置clamp:
$@L;j
3-14换向装置reversing device: AioW*`[WjA
3-15基片加热装置substrate heating device: ZAr6RRv ^
3-16基片冷却装置substrate colding device: 5@2Rl>B$
uO]D=Z\S(
4.真空镀膜设备 {Dpsr` &
4-1真空镀膜设备vacuum coating plant: |*NLWN.ja)
(1).真空蒸发镀膜设备vacuum evaporation coating plant: ,<U=
7<NU
(2).真空溅射镀膜设备vacuum sputtering coating plant: NV*
2
4-2连续镀膜设备continuous coating plant: SaXt"Ju,AH
4-3半连续镀膜设备semi- continuous coating plant vwT1bw .
6. 1.漏孔 1kvX#h&V
1-1漏孔leaks: N;3!oo4
1-2通道漏孔channel leak: [c3!xHt5O
1-3薄膜漏孔membrane leak: cy8>M))c
1-4分子漏孔molecular leak: uppa`addK
1-5粘滞漏孔vixcous leak: ]`$6=)_X
1-6校准漏孔calibrated leak: ^*}D*=>\
1-7标准漏孔reference leak : nnyT,e%
1-8虚漏virtual leak: ~^2w)-N
1-9漏率leak rate: f6Y?),`
1-10标准空气漏率standard air leak rate: @rYZ0`E9
1-11等值标准空气漏率equivalent standard air leak rate: M2Nh3ijr
1-12探索(示漏)气体: %unn{92)
jlBsm'M<m
2.本底 @@D/&}#F
2-1本底background: E{T3Xwg
2-2探索气体本底search gas background : zIF1A*UH
2-3漂移drift: Xex7Lr&
2-4噪声noise: 6]1RxrAV
16AlmegDk
3.检漏仪 +S~ u ,=
3-1检漏仪leak detector: <.ZIhDiEl
3-2高频火花检漏仪H.F. spark leak detector: SD^::bH
3-3卤素检漏仪halide leak detector: k9
r49lb
3-4氦质谱检漏仪helium mass spectrometer leak detector: >V^8<^?G
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: >GIQT?O6
E<yQB39
4.检漏 lf(+]k30
4-1气泡检漏leak detection by bubbles: ._0$#J S[
4-2氨检漏leak detection by ammonia: 2!6hB sEr
4-3升压检漏leak detection of rise pressure: 96\FJHtZ
4-4放射性同位素检漏radioactive isotope leak detection: 7**zb"#y
4-5荧光检漏fluorescence leak detection dzIBdth
7. 1.一般术语 DNmC
1-1真空干燥vacuum drying: rPB Ju0D"
1-2冷冻干燥freeze drying : I;XM4a
1-3物料material: D\G 8p;
1-4待干燥物料material to be dried: /uWUQ#9
1-5干燥物料dried material : XIMh<
1-6湿气moisture;humidity: :7(fBf5
1-7自由湿气free moisture: @lzq`SzM
1-8结合湿气bound moisture: .Yk}iHcW.
1-9分湿气partial moisture: >(2;(TbQm0
1-10含湿量moisture content: &5HI
1-11初始含湿量initial moisture content: glch06
1-12最终含湿量final residual moisture: <\~@l^lU
1-13湿度degree of moisture ,degree of humidity : S8v,'Cc
1-14干燥物质dry matter : |Gq3pL<jkC
1-15干燥物质含量content of dry matter: eV_",W
i`i`Hu>
2.干燥工艺 ~Xx}:@Ld
2-1干燥阶段stages of drying : @^0}w k
(1).预干燥preliminary dry: #IppjaPl8
(2).一次干燥(广义)primary drying(in general): 6<z#*`U1
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): p!E*ANwX
(4).二次干燥secondary drying: BHpay
2-2.(1).接触干燥contact drying: XyB_8(/E
(2).辐射干燥 drying by radiation : k6 OO\=
(3).微波干燥microwave drying: )E",)}Nh
(4).气相干燥vapor phase drying: vo#$xwm1
(5).静态干燥static drying: *=md!^x`
(6).动态干燥dynamic drying: 9F3aT'3#!
2-3干燥时间drying time: ~p+
`pwjY1
2-4停留时间length of stay(in the drying chamber): l )r^|9{
2-5循环时间cycle time: |xb;#ruR6
2-6干燥率 dessication ratio : .5HD i-
2-7去湿速率mass flow rate of humidity: \HD:#a
2-8单位面积去湿速率mass flow rate of humidity per surface area: #+i5'p(4
2-9干燥速度 drying speed : Nl4uQ_"
2-10干燥过程drying process: 2L<1]:I
2-11加热温度heating temperature: Ozqh Jb
2-12干燥温度temperature of the material being dried : Eb,M+c?
2-13干燥损失loss of material during the drying process : mb'{@
2-14飞尘lift off (particles): UnDX .W*2
2-15堆层厚度thickness of the material: BD$Lf,_
Nt
tu)wr
3.冷冻干燥 4{,!'NA
3-1冷冻freezing: Yi-,Pb?
(1).静态冷冻static freezing: ,jnaa (n
(2).动态冷冻dynamic freezing: _+}o/449
(3).离心冷冻centrifugal freezing: {#=o4~u%;H
(4).滚动冷冻shell freezing: 'Q*.[aJt
(5).旋转冷冻spin-freezing: KsTE)@F:
(6).真空旋转冷冻vacuum spin-freezing: /`qQWB5b
(7).喷雾冷冻spray freezing: $U&p&pgH=W
(8).气流冷冻air blast freezing: uv$utu><
*
3-2冷冻速率rate of freezing: Vf(..8
3-3冷冻物料frozen material: ^Ux.s Q
3-4冰核ice core: C,O9?t
3-5干燥物料外壳envelope of dried matter: ;5|d[r}k3
3-6升华表面sublimation front: K6F05h 5S
3-7融化位置freezer burn: B&(/,.
Qp@}v7Due
4.真空干燥设备;真空冷冻干燥设备 IUWJi\,
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: Eb'M< ZY
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: 2L.6!THG
4-3加热表面heating surface: 2Z9ck|L>
4-4物品装载面shelf : B$q5/ L$}
4-5干燥器的处理能力throughput (of the vacuum drying chamber): kB?Uw#
4-6单位面积干燥器处理能力throughput per shelf area: xNJ*TA[+
4-7冰冷凝器ice condenser: .*?-j?U.
4-8冰冷凝器的负载load of the ice condenser: yJw.z#bB#
4-9冰冷凝器的额定负载rated load of the ice condenser (nkiuCO
8. 1.一般术语 p`"Ic2xPJ
1-1试样sample : F${}n1D
(1).表面层surface layer: &`'@}o>2
(2).真实表面true surface: -LFk7a
(3).有效表面积effective surface area: z+c8G
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: iII%!f?{[
(5).表面粒子密度surface particle density: Ln4Dq[M
(6).单分子层monolayer: fG@]G9Z
(7).表面单分子层粒子密度monolayer density: ND3|wQ`M0
(8).覆盖系数coverage ratio: =Q# (2
1-2激发excitation: 8NWuhRRrw
(1).一次粒子primary particle: X4k|k>
(2).一次粒子通量primary particle flux: hBDmC_\~
(3).一次粒子通量密度density of primary particle flux: 7 $Cv=8
(4).一次粒子负荷primary particle load: DRVvC~M-,
(5).一次粒子积分负荷integral load of primary particle: gd0a,_`M
(6).一次粒子的入射能量energy of the incident primary particle: S2
-J1x2N
(7).激发体积excited volume: 5sB~.z@
(8).激发面积excited area: ayg^js2,
(9).激发深度excited death: gP!k[E,Q8
(10).二次粒子secondary particles: Kciz^)'Z
(11).二次粒子通量secondary particle flux: a 4?c~bs
(12).二次粒子发射能energy of the emitted secondary particles: eV9,G8
(13).发射体积emitting volume: 0\1g-kc!v
(14).发射面积emitting area: /W{^hVkvC
(15).发射深度emitting depth: ,W$&OD
(16).信息深度information depth: K7,Sr1O `
(17).平均信息深度mean information depth: "JgwL_2
1-3入射角angle of incidence: ,9buI='
1-4发射角angle of emission: EO/TuKt
1-5观测角observation: +~xzgaL
1-6分析表面积analyzed surface area: 5',&8
1-7产额 yield : ] $F%
1-8表面层微小损伤分析minimum damage surface analysis: Xk :_aJ
1-9表面层无损伤分析non-destructive surface analysis: :?gp}.
1-10断面深度分析 profile analysis in depth; depth profile analysis : ^_=bssaOd
1-11可观测面积observable area: !#4b#l(e6
1-12可观测立体角observable solid angle : Nm#[ A4
1-13接受立体角;观测立体角angle of acceptance: 3[R[`l]v?
1-14角分辨能力angular resolving power: "i%=QON`
1-15发光度luminosity: m>DJ w7<
1-16二次粒子探测比detection ratio of secondary particles: k7nke^,|
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: g
T0@pxl
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: fTGVG
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: >4?735f=x
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: AD7&-=p&w
1-21本底压力base pressure: q3u:Tpn4%
1-22工作压力working pressure: Go7 oj'"
cZ,}1?!
2.分析方法 VP }To
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: =pb ru=/
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : C)&BtiUN/
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: >B$B|g~
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: I9sQPa
2-3离子散射表面分析ion scattering spectroscopy: =BO>Bi&&
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: }4q1"iMlO
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: l(Uwci
2-6离子散射谱仪ion scattering spectrometer: 3oPyh $*
2-7俄歇效应Auger process: U ?6.UtNf
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: /!pJ" @
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: XrGP]k6.^
2-10光电子谱术photoelectron spectroscopy : H6MG5f_
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: *dxE
( dP
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: tf>"fU\P
2-11光电子谱仪photoelectron spectrometer: CE|rn8MB
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: TV?MB(mN
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: Eu[/* t+l
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): "|/Q5*L
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus