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真空术语 :j2G0vHIl(
=gL~E9\
1.标准环境条件 standard ambient condition: >5G2!Ns'
2.气体的标准状态 standard reference conditions forgases: AT.WXP0$A
3.压力(压强)p pressure: <7Igd6u
4.帕斯卡Pa pascal: doM}vh)6
5.托Torr torr: )xtDiDB
6.标准大气压atm standard atmosphere: $42%H#
7.毫巴mbar millibar: ~{MmUp rS
8.分压力 partial pressure: Q(Uj5 aX
9.全压力 total pressure: 9;,_Qq
10.真空 vacuum: (5AgI7I,
11.真空度 degree of vacuum: <~ E'% 60;
12.真空区域 ranges of vacuum: GjF'03Z4
13.气体 gas: cu&tdg^q
14.非可凝气体 non-condensable gas: 2Hltgt,
15.蒸汽vapor: v}w=I}<x
16.饱和蒸汽压saturation vapor pressure: {p#[.E8
17.饱和度degree of saturation: 4'L%Wz[6
18.饱和蒸汽saturated vapor: i&KD)&9b#
19.未饱和蒸汽unsaturated vapor: zSs5F_
20.分子数密度n,m-3 number density of molecules: )<W6cDx'H+
21.平均自由程ι、λ,m mean free path:
&}sC8,Sr
22.碰撞率ψ collision rate: 2x3'm
23.体积碰撞率χ volume collision rate: &Z
Ja}5k!r
24.气体量G quantity of gas: erG@8CG
25.气体的扩散 diffusion of gas: pC9Ed9uRK
26.扩散系数D diffusion coefficient; diffusivity: w783e
27.粘滞流 viscous flow: d3
h^L
28.粘滞系数η viscous factor: sA6Ku(9
29.泊肖叶流 poiseuille flow: sR%,l
30.中间流 intermediate flow: MN|8(f5Gs
31.分子流 molecular flow: #)im9LLC#
32克努曾数 number of knudsen: -.#He
33.分子泻流 molecular effusion; effusive flow: ?9<byEO%M
34.流逸 transpiration: OW$?
6
35.热流逸 thermal transpiration: >we/#C"x
36.分子流率qN molecular flow rate; molecular flux: K&{*sa r
37.分子流率密度 molecular flow rate density; density of molecular flux: 'W0?XaEk-
38.质量流率qm mass flow rare: tF> ?]
39.流量qG throughput of gas: :{pJ
40.体积流率qV volume flow rate: _VIVZ2mU=
41.摩尔流率qυ molar flow rate: `9%Q2Al
42.麦克斯韦速度分布 maxwellian velocity distribution: n[2[V*| mI
43.传输几率Pc transmission probability: ==d@0`
44.分子流导CN,UN molecular conductance: U?dd+2^};t
45.流导C,U conductance: (bP\_F5D
46.固有流导Ci,Ui intrinsic conductance: ((BuBu>
47.流阻W resistance: N?j,'gy4
48.吸附 sorption: w`~j(G4N
49.表面吸附 adsorption: )KvQaC
50.物理吸附physisorption: X2#;1 ku
51.化学吸附 chemisorption: neC]\B[Xm
52.吸收absorption: 3e)3t `
53.适应系数α accommodation factor: ,~@0IKIA
Q
54.入射率υ impingement rate: ,$ICv+7]
55.凝结率condensation rate: 5x/q\p-{/
56.粘着率 sticking rate: @C),-TM
57.粘着几率Ps sticking probability: _J}vPm
58.滞留时间τ residence time: eit>4xMu
59.迁移 migration: R!7emc0T
60.解吸 desorption: =d_@k[8<0
61.去气 degassing: qwka77nNT
62.放气 outgassing: <L+D
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: @21G[!%J
64.蒸发率 evaporation rate: IyE9G:fY
65.渗透 permeation: w+vYD2a
66.渗透率φ permeability: G:qkk(6_#
67.渗透系数P permeability coefficient &HKrmFgX{
2. 1.真空泵 vacuum pumps :z=/z!5:j
1-1.容积真空泵 positive displacement pump:
5" U8|
⑴.气镇真空泵 gas ballast vacuum pump: _"`wUMee
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: )4[{+OJa
⑶.干封真空泵 dry-sealed vacuum pump: H9)$ #r6i
⑷.往复真空泵 piston vacuum pump: X/,4hjg
⑸.液环真空泵 liquid ring vacuum pump: Xg#g`m%(M
⑹.旋片真空泵 sliding vane rotary vacuum pump: yc,Qz.+g
⑺.定片真空泵 rotary piston vacuum pump: o5+N_5OE}E
⑻.滑阀真空泵 rotary plunger vacuum pump: >iP>v`J
⑼.余摆线真空泵 trochoidal vacuum pump: Py(l+Ik`>
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: {rr
ED
⑾.罗茨真空泵 roots vacuum pump: tR#uDE\wR
1-2.动量传输泵 kinetic vacuum pump: k|l"Rh<\~
⑴.牵引分子泵molecular drag pump: &o/&T{t}
⑵.涡轮分子泵turbo molecular pump: 1{+Ni{
⑶.喷射真空泵ejector vacuum pump: Tr}@fa
⑷.液体喷射真空泵liquid jet vacuum pump: DvnK_Q!
⑸.气体喷射真空泵gas jet vacuum pump: ]3#_BL)M8p
⑹.蒸汽喷射真空泵vapor jet vacuum pump : 6.tppAO+
⑺.扩散泵diffusion pump : (E)/' sEb
⑻.自净化扩散泵self purifying diffusion pump: c4CBpi?}
⑼.分馏扩散泵 fractionating diffusion pump : ih1s`CjG
⑽.扩散喷射泵diffusion ejector pump : >*A\/Da]j
⑾.离子传输泵ion transfer pump: D@H'8C\
1-3.捕集真空泵 entrapment vacuum pump: rS9*_-NH
⑴吸附泵adsorption pump: 1p,G8 v+B
⑵.吸气剂泵 getter pump: R{.wAH(
⑶.升华(蒸发)泵 sublimation (evaporation)pump : avls[Bq
⑷.吸气剂离子泵getter ion pump: <R~(6krJwZ
⑸.蒸发离子泵 evaporation ion pump: $Vp&Vc8
⑹.溅射离子泵sputter ion pump: Ks09F}
⑺.低温泵cryopump:
K)GC&%_$O
&K k+RHM
2.真空泵零部件 O*oL(dk*8L
2-1.泵壳 pump case: eU7RO
2-2.入口 inlet: 'dj}- Rs
2-3.出口outlet: <2y~7h:
2-4.旋片(滑片、滑阀)vane; blade : >'^l>FPc
2-5.排气阀discharge valve: ; ,*U,eV
2-6.气镇阀gas ballast valve: X4i$,$C
2-7.膨胀室expansion chamber: M 0->
2-8.压缩室compression chamber: qd3B>f
2-9.真空泵油 vacuum pump oil: >FHTBh& Y
2-10.泵液 pump fluid: fx.FHhVu
2-11.喷嘴 nozzle: ' 7>}I{Lq
2-13.喷嘴扩张率nozzle expansion rate: LnZz=
2-14.喷嘴间隙面积 nozzle clearance area : D]b5*_CT
2-15.喷嘴间隙nozzle clearance: r3ZY`zf
2-16.射流jet: Q}]:lmqH
2-17.扩散器diffuser: r3Z-mJ$:
2-18.扩散器喉部diffuser thoat: Ltcr]T(Ic
2-19.蒸汽导管vapor tube(pipe;chimney): @tjC{?5Y
2-20.喷嘴组件nozzle assembly: CNcH)2Mk
2-21.下裙skirt: SVXey?A;CJ
_a*Wk
3.附件 OY~5o&Oa
3-1阱trap: 7+T\
⑴.冷阱 cold trap: ?Pmj }f
⑵.吸附阱sorption trap:
wSV[nK
⑶.离子阱ion trap: lKIHBi
⑷.冷冻升华阱 cryosublimation trap: |#5JI#,vX
3-2.挡板baffle: lW&glU(
3-3.油分离器oil separator: 3 ;.{
O%bX
3-4.油净化器oil purifier: 40%p
lNPj
3-5.冷凝器condenser: k1-?2kf"{
2%vwC]A
4.泵按工作分类 -lSm:O@'
4-1.主泵main pump: XNu2G19jb
4-2.粗抽泵roughing vacuum pump: x+yt|
&B
4-3.前级真空泵backing vacuum pump: 5bmtUIj
4-4.粗(低)真空泵 roughing(low)vacuum pump: [4xN:i
4-5.维持真空泵holding vacuum pump: Y<#7E;aL
4-6.高真空泵high vacuum pump: IRo[|&c
4-7.超高真空泵ultra-high vacuum pump: pJ_Z[}d)c
4-8.增压真空泵booster vacuum pump: L/nz95
lt0(Kf g
5.真空泵特性 :Fj4YP"
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: 8Yq6I>@!
5-2.真空泵的抽气量Q throughput of vacuum pump:。 ,{z$M
5-3.起动压力starting pressure: aeUm,'Y$
5-4.前级压力 backing pressure : NX)7g}S
5-5.临界前级压力 critical backing pressure: *+p'CfsSka
5-6.最大前级压力maximum backing pressure: b@,=;Y)O
5-7.最大工作压力maximum working pressure: _,Fwt
5-8.真空泵的极限压力ultimate pressure of a pump: uc7np]Z
5-9.压缩比compression ratio: wV56LW
5-10.何氏系数Ho coefficient: yJb;V#
5-11.抽速系数speed factor: DU1,i&(
5-12.气体的反扩散back-diffusion of gas: >+oQxml6nI
5-13.泵液返流back-streaming of pump fluid: k )){1O
5-14.返流率back-streaming rate &Vgjd>
5-15.返迁移back-migration: vgE5(fJh
5-16.爆腾bumping: :^iR&`2~
5-17.水蒸气允许量qm water vapor tolerable load: >b*Pd
*f
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: $ a5K
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: ~q|^z[7
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump ol`]6"Sc
3. 1.一般术语 i@B5B2
1-1.压力计pressure gauge: +}9%Duim
1-2.真空计vacuum gauge: Nt/*VYUn
⑴.规头(规管)gauge head: pM
VeUK?
⑵.裸规nude gauge : 8KoPaq
⑶.真空计控制单元gauge control unit : RNvtgZ}k{X
⑷.真空计指示单元gauge indicating unit : ?# G_&
W=)}=^N0
2.真空计一般分类 =}c~BHT
2-1.压差式真空计differential vacuum gauge: TvdmgVNP
2-2.绝对真空计 absolute vacuum gauge: @RaMO#
2-3.全压真空计total pressure vacuum gauge: pbm4C0W}
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: mbS
&>
2-5.相对真空计relative vacuum gauge : kV<VhBql!
};zF&
3.真空计特性 PwDQ<
3-1.真空计测量范围pressure range of vacuum gauge: A0[flIl
3-2.灵敏度系数sensitivity coefficient: b|fq63ar;
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): Lwv9oa|
3-5.规管光电流photon current of vacuum gauge head: L
YH9P-5H
3-6.等效氮压力equivalent nitrogen pressure : * rs_k/2(
3-7.X射线极限值 X-ray limit: 'Y"q=@Ei9
3-8.逆X射线效应anti X-ray effect: `C!Pe84(
3-9.布利尔斯效应blears effect: o-)E_X
Z.R^@@RqJ
4.全压真空计 "sHD8TUX
4-1.液位压力计liquid level manometer: {h@R\bU
4-2.弹性元件真空计elastic element vacuum gauge: $\P!P.
4-3.压缩式真空计compression gauge: rqa;MPl
4-4.压力天平pressure balance: msoE8YK&tg
4-5.粘滞性真空计viscosity gauge : R6AZIN:
4-6.热传导真空计thermal conductivity vacuum gauge : +qS$t
4-7.热分子真空计thermo-molecular gauge: fYCAwS{
4-8.电离真空计ionization vacuum gauge: +pjD{S~Y
4-9.放射性电离真空计radioactive ionization gauge: fwl
RwH(
4-10.冷阴极电离真空计cold cathode ionization gauge: zSq+#O1#
4-11.潘宁真空计penning gauge: 9'4cqR
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: aX
?ON
4-13.放电管指示器discharge tube indicator: ul% q6=f)
4-14.热阴极电离真空计hot cathode ionization gauge: X$st{@}ZB
4-15.三极管式真空计triode gauge: wL%>
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: m*I5 \
4-17.B-A型电离真空计Bayard-Alpert gauge: }QC:!e,yG
4-18.调制型电离真空计modulator gauge: PqP)<d'/
4-19.抑制型电离真空计suppressor gauge: 1P[!B[;c
4-20.分离型电离真空计extractor gauge: oHa6fi
4-21.弯注型电离真空计bent beam gauge: Y8CXinh
4-22.弹道型电离真空计 orbitron gauge : +"d{P,[3J
4-23.热阴极磁控管真空计hot cathode magnetron gauge: Y}Qu-fm
8`*`4m
5.分压真空计(分压分析器) #~ >0Dr
5-1.射频质谱仪radio frequency mass spectrometer: &t6L8[#yd
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: (sPZ1Fr\o
5-3.单极质谱仪momopole mass spectrometer: 5$O@+W!?@
5-4.双聚焦质谱仪double focusing mass spectrometer: [(dAv7YbN
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: q=6M3OnS>
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: B6ys5eQ
5-7.回旋质谱仪omegatron mass spectrometer: m$$U%=r>@
5-8.飞行时间质谱仪time of flight mass spectrometer: sa*hoL18
-$mzzYH
6.真空计校准 7qnw.7p
6-1.标准真空计reference gauges: o!j? )0d
6-2.校准系统system of calibration: $aVcWz%
6-3.校准系数K calibration coefficient: rgOB0[
6-4.压缩计法meleod gauge method: ^LnCxA&QH
6-5.膨胀法expansion method: Wk$%0xZ7
6-6.流导法flow method: 2P]r J
4. 1.真空系统vacuum system ^srx/6X
1-1.真空机组pump system: "\e9Y<
1-2.有油真空机组pump system used oil : 58=fT1
B
1-3.无油真空机组oil free pump system tF=96u_X
1-4.连续处理真空设备continuous treatment vacuum plant: N b+zP[C
1-5.闸门式真空系统vacuum system with an air-lock: )FgcNB1|7
1-6.压差真空系统differentially pumped vacuum system: a7M8sZ?"
1-7.进气系统gas admittance system: okfhd{9
.Z9Bbab:
2.真空系统特性参量 m@TU2
2-1.抽气装置的抽速volume flow rate of a pumping unit :
!$&K~>`
2-2.抽气装置的抽气量throughput of a pumping unit : zR]l2zL3
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: (Kx3:gs
2-4.真空系统的漏气速率leak throughput of a vacuum system: jagsV'o2
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: 4S+P]U*jW
2-6.极限压力ultimate pressure:
1vQ*Br
2-7.残余压力residual pressure: ]Wfnpqc^
2-8.残余气体谱residual gas spectrum: ;[%AeN5W
2-9.基础压力base pressure: Wny{qj)=
2-10.工作压力working pressure: C
!uwD
2-11.粗抽时间roughing time: EXo"F*gW
2-12.抽气时间pump-down time: ?L7z\b"_~
2-13.真空系统时间常数time constant of a vacuum system: Vbz$dpT
2-14.真空系统进气时间venting time: 5J1,Usm
esFBWJ
3.真空容器 ]BX|G`CCc
3-1.真空容器;真空室vacuum chamber: ^Z;5e@S
3-2.封离真空装置sealed vacuum device: 2}hEBw68
3-3.真空钟罩vacuum bell jar: f`vB$r>
3-4.真空容器底板vacuum base plate: ,@(lYeD"
3-5.真空岐管vacuum manifold: -R|v&h%T
3-6.前级真空容器(贮气罐)backing reservoir: *\-6p0~A
3-7.真空保护层outer chamber: h\:"k_u#
3-8.真空闸室vacuum air lock: {QJJw}!#
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: 1[mX_ }K
~
M@8O
4.真空封接和真空引入线 Z+FJ cvYx
4-1.永久性真空封接permanent seal : yA=#Ji
4.2.玻璃分级过渡封接graded seal : F d *p3a
4-3.压缩玻璃金属封接compression glass-to-metal seal: /_>S0
4-4.匹配式玻璃金属封接matched glass-to-metal seal: a$"3T
4-5.陶瓷金属封接ceramic-to-metal seal: Un@d Wf6'
4-6.半永久性真空封接semi-permanent seal : 5_0Eh!sx
4-7.可拆卸的真空封接demountable joint: Np+<)q2
4-8.液体真空封接liquid seal THkg,*;:
4-9.熔融金属真空封接molten metal seal: ioz4kG!
4-10.研磨面搭接封接ground and lapped seal: CKy' 8I9
4-11.真空法兰连接vacuum flange connection: +<&_1%5+
4-12.真空密封垫vacuum-tight gasket: XeJn,=
4-13.真空密封圈ring gasket: 3Vs8"BFjz
4-14.真空平密封垫flat gasket: h 5<46!P
4-15.真空引入线feedthrough leadthrough:
Jf9a<[CcV
4-16.真空轴密封shaft seal: yIA-+# r[
4-17.真空窗vacuum window: SwXVa/9a"
4-18.观察窗viewing window: V*}ft@GPD
(gQP_Oa(
5.真空阀门 Ja"?Pb
5-1.真空阀门的特性characteristic of vacuum valves: VMXccT9i!
⑴.真空阀门的流导conductance of vacuum valves: fl9`Mgu
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: lvY[E9I0
5-2.真空调节阀regulating valve: X0.k Q
5-3.微调阀 micro-adjustable valve: BF
b<"!Y
5-4.充气阀charge valve: Nu/wjx$b
5-5.进气阀gas admittance valve: l1l=52r
5-6.真空截止阀break valve: +0_e a~{
5-7.前级真空阀backing valve: C6Lc
5-8.旁通阀 by-pass valve: o#fr5>h-w
5-9.主真空阀main vacuum valve: s'b 4Me
5-10.低真空阀low vacuum valve: gF#HNv
5-11.高真空阀high vacuum valve: %68'+qz
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: C.].HQ
5-13.手动阀manually operated valve: |Bz1u|uc
5-14.气动阀pneumatically operated valve: ,)@njC?J
5-15.电磁阀electromagnetically operated valve: -n FKP&P
5-16.电动阀valve with electrically motorized operation: m Q4(<,F
5-17.挡板阀baffle valve: %<8`(Uu5
5-18.翻板阀flap valve: iO+,U} &
5-19.插板阀gate valve: \2)D
5-20.蝶阀butterfly valve: Swa0TiT(
jVi>9[rz
6.真空管路 ,cE yV74
6-1.粗抽管路roughing line: `%; Hj _X}
6-2.前级真空管路backing line: lonV_Xx
6-3.旁通管路;By-Pass管路 by-pass line: _rM?g1}5j
6-4.抽气封口接头pumping stem: ' Dp;fEU$
6-5.真空限流件limiting conductance: UE8j8U'L
6-6.过滤器filter: R!f<6l8#W
5. 1.一般术语 'b)qP|
1-1真空镀膜vacuum coating: `OFW^Esc
1-2基片substrate: 5(>SFxz"t
1-3试验基片testing substrate: %5RR<[_/;
1-4镀膜材料coating material: VKV
:U60
1-5蒸发材料evaporation material: VWq]w5oQO
1-6溅射材料sputtering material: dq,j?~ _}
1-7膜层材料(膜层材质)film material: B6=?Qp/f
1-8蒸发速率evaporation rate: p<1y$=zS
1-9溅射速率sputtering rate: NNt
n
1-10沉积速率deposition rate: qG@YNc
1-11镀膜角度coating angle: 3ew4QPT'
{ETM >
2.工艺 HS[($
2-1真空蒸膜vacuum evaporation coating: ]Hp>~Zvbb
(1).同时蒸发simultaneous evaporation: p8Z?R^$9H
(2).蒸发场蒸发evaporation field evaporation: <O5WY37"q
(3).反应性真空蒸发reactive vacuum evaporation: o?Aj6fNY?
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: .G.WPVE
(5).直接加热的蒸发direct heating evaporation: nr2 Q[9~
(6).感应加热蒸发induced heating evaporation: CP~mKmMV
(7).电子束蒸发electron beam evaporation: 4-~Z{#-
(8).激光束蒸发laser beam evaporation: U%q-#^A
(9).间接加热的蒸发indirect heating evaporation: _f'v>"K
(10).闪蒸flash evaportion: >
vdmN]
2-2真空溅射vacuum sputtering: gg>QXui
(1).反应性真空溅射 reactive vacuum sputtering: DQT'OZ:w
(2).偏压溅射bias sputtering: {j=`
(3).直流二级溅射direct current diode sputtering: dvZH ~mF
(4).非对称性交流溅射asymmtric alternate current sputtering: h2 KI
(5).高频二极溅射high frequency diode sputtering: Cb1w8l0
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: OvAhp&k
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: *,mI=1
(8).离子束溅射ion beam sputtering: ~:{05W
(9).辉光放电清洗glow discharge cleaning: /a'1W/^2
2-3物理气相沉积PVD physical vapor deposition: MB!9tju
2-4化学气相沉积CVD chemical vapor deposition: -8xf}v~u
2-5磁控溅射magnetron sputtering: V(_1q
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: "$XX4w
M
2-7空心阴极离子镀HCD hollow cathode discharge deposition: RWc<CQcL"
2-8电弧离子镀arc discharge deposition: RFMPh<Ac
+? h}e
3.专用部件 3w</B-|nQ
3-1镀膜室coating chamber: @^A5{qQ\
3-2蒸发器装置evaporator device: /M_$4O;*@
3-3蒸发器evaporator: =}vT>b
3-4直接加热式蒸发器evaporator by direct heat: 1>"-!ADm
3-5间接加热式蒸发器evaporator by indirect heat: r/2=
nE
3-7溅射装置sputtering device: z@yTkH_
3-8靶target:
;%9]G|*{
3-10时控挡板timing shutter: F}5d>nw
3-11掩膜mask: &)Xc'RQ.C
3-12基片支架substrate holder: =eDIvNps
3-13夹紧装置clamp: CZ<T@k
3-14换向装置reversing device: 1~*1W4};F8
3-15基片加热装置substrate heating device: J0?kEr
3-16基片冷却装置substrate colding device: H/c
(m|KK
Zz0e4C
4.真空镀膜设备 BH">#&j[
4-1真空镀膜设备vacuum coating plant: g w"
\pD
(1).真空蒸发镀膜设备vacuum evaporation coating plant: GC{M"q|_
(2).真空溅射镀膜设备vacuum sputtering coating plant: |;vQ"8J
4-2连续镀膜设备continuous coating plant: gv''A"
4-3半连续镀膜设备semi- continuous coating plant y3zP`^
6. 1.漏孔 pFv u,Q"
1-1漏孔leaks: EU$.{C_O(
1-2通道漏孔channel leak: q`VL i
1-3薄膜漏孔membrane leak: "j@\a)a
1-4分子漏孔molecular leak: .\n` 4A1z
1-5粘滞漏孔vixcous leak: l~6K}g?
1-6校准漏孔calibrated leak: )th[fUC(
1-7标准漏孔reference leak : "9wD|wsz
1-8虚漏virtual leak: 5o#JHD
1-9漏率leak rate: >2'"}np*
1-10标准空气漏率standard air leak rate: zaqX};b
1-11等值标准空气漏率equivalent standard air leak rate: 0B}4$STOo[
1-12探索(示漏)气体: /|IPBU 5
VPe0\?!d
2.本底 FJ:^pROpm
2-1本底background: 5~L]zE
2-2探索气体本底search gas background : u^1#9bAW8
2-3漂移drift: }yz>(Pq
2-4噪声noise: aQCu3T
DxJ;C09xNa
3.检漏仪 tAdE<).!
3-1检漏仪leak detector: 0zaK&]oY0
3-2高频火花检漏仪H.F. spark leak detector: V!W.P
3-3卤素检漏仪halide leak detector: \D7bTn
3-4氦质谱检漏仪helium mass spectrometer leak detector: Vw;Z0_C
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: *l+#<5x
Y`;}w}EcgR
4.检漏 nHseA
4-1气泡检漏leak detection by bubbles: [3Pp
NCY
4-2氨检漏leak detection by ammonia: CM;b_E)9)f
4-3升压检漏leak detection of rise pressure: K~N$s"Qx
4-4放射性同位素检漏radioactive isotope leak detection: cHs3:F~~
4-5荧光检漏fluorescence leak detection Ld4U
7. 1.一般术语 i%hCV o
1-1真空干燥vacuum drying: 0l!#u`cCI
1-2冷冻干燥freeze drying : WYw#mSp
1-3物料material: gcJ!_KZK
1-4待干燥物料material to be dried: C=:<[_m`
1-5干燥物料dried material : &X=7b@r
1-6湿气moisture;humidity: szI7I$Qb
1-7自由湿气free moisture: E}@C4pS
1-8结合湿气bound moisture: 6':iW~iI
1-9分湿气partial moisture: ;<[X\;|'
1-10含湿量moisture content: O tG\Uw8
1-11初始含湿量initial moisture content: g'8Y5x[
1-12最终含湿量final residual moisture: j~CnMKN
1-13湿度degree of moisture ,degree of humidity : BVQy@:K/
1-14干燥物质dry matter : !+l'<*8V
1-15干燥物质含量content of dry matter: ?'a8QJo
: T*Q2
2.干燥工艺 wA)
Hot
2-1干燥阶段stages of drying : x:Y9z_)O
(1).预干燥preliminary dry: (WM3(US|
(2).一次干燥(广义)primary drying(in general): C]`uC^6g
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): {/'T:n#
(4).二次干燥secondary drying: YR%iZ"`*+O
2-2.(1).接触干燥contact drying: +iVEA(0&$
(2).辐射干燥 drying by radiation : p3Sh%=HE'
(3).微波干燥microwave drying: :E:e ^$p
(4).气相干燥vapor phase drying: I6>J.6luF9
(5).静态干燥static drying: p_FM 2K7!
(6).动态干燥dynamic drying: JJ?{V:
2-3干燥时间drying time: g@.$P>Bh
2-4停留时间length of stay(in the drying chamber): #[93$)Gd!
2-5循环时间cycle time: uO?+vYAN
2-6干燥率 dessication ratio : nM,:f)z
2-7去湿速率mass flow rate of humidity: swKkY`g
2-8单位面积去湿速率mass flow rate of humidity per surface area: *rxr:y#Ve
2-9干燥速度 drying speed : dmFn0J-\
2-10干燥过程drying process: ?,} u6tH
2-11加热温度heating temperature: [>=!$>>;8
2-12干燥温度temperature of the material being dried : &V"oJ}M/a
2-13干燥损失loss of material during the drying process : oMh$:jR $
2-14飞尘lift off (particles): V%Uj\cv
2-15堆层厚度thickness of the material: YOCEEh?
VYvfx
3.冷冻干燥 A1WUK=P
3-1冷冻freezing: c}(WniR-"
(1).静态冷冻static freezing: Lb*KEF% s
(2).动态冷冻dynamic freezing: e8m,q~%#/
(3).离心冷冻centrifugal freezing: Ndmt$(b
(4).滚动冷冻shell freezing: !Ok(mgV$/
(5).旋转冷冻spin-freezing: )*')
(6).真空旋转冷冻vacuum spin-freezing: 1+l 8%G=hB
(7).喷雾冷冻spray freezing: Dk1& <} I
(8).气流冷冻air blast freezing: )^2eC<t
3-2冷冻速率rate of freezing: tFN >]`Z
3-3冷冻物料frozen material: n3^(y"q
3-4冰核ice core: DaQ"Df_X
3-5干燥物料外壳envelope of dried matter: g=*jKSZ
3-6升华表面sublimation front: &C 9hT
3-7融化位置freezer burn: NBikYxa
h
><Sp*z_V
4.真空干燥设备;真空冷冻干燥设备 LPk@t^[
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: FG? Mc'r&
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: kfy!T rf
4-3加热表面heating surface: . "Ms7=
4-4物品装载面shelf : iD^,O)b
4-5干燥器的处理能力throughput (of the vacuum drying chamber): nl@an!z
4-6单位面积干燥器处理能力throughput per shelf area: RObnu*
4-7冰冷凝器ice condenser: tvkdNMyX%9
4-8冰冷凝器的负载load of the ice condenser: O-iE 0t
4-9冰冷凝器的额定负载rated load of the ice condenser +pofN-*%
8. 1.一般术语 *~rj!N?;
1-1试样sample : d}
>Po%r:
(1).表面层surface layer: TlG>)Z@/
(2).真实表面true surface: TBlSZZ-55]
(3).有效表面积effective surface area: q"2QNF'
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: U82a]i0
(5).表面粒子密度surface particle density: @]\fO)\f
(6).单分子层monolayer: Fs+tcr/\[
(7).表面单分子层粒子密度monolayer density: @W,jy$U
(8).覆盖系数coverage ratio: GP:<h@:798
1-2激发excitation: 'yo@5*x7
(1).一次粒子primary particle: ofvR0yV
(2).一次粒子通量primary particle flux: +UzQJt/>>
(3).一次粒子通量密度density of primary particle flux: "*g+qll!5d
(4).一次粒子负荷primary particle load: i'~-\F!
(5).一次粒子积分负荷integral load of primary particle: K)Y& I
(6).一次粒子的入射能量energy of the incident primary particle: N?GTfN
(7).激发体积excited volume: w5FIHYl6B
(8).激发面积excited area: A5l Cc
b
(9).激发深度excited death: eJDZ|$
(10).二次粒子secondary particles: s t'T._
(11).二次粒子通量secondary particle flux: hmy%X`%j
(12).二次粒子发射能energy of the emitted secondary particles: ;vx5 =^7P
(13).发射体积emitting volume: 3m1g"
(14).发射面积emitting area: r(,U{bU<
(15).发射深度emitting depth: C@M-_Ud>Q
(16).信息深度information depth: V&Y`?Edc
(17).平均信息深度mean information depth: n@p]v*
1-3入射角angle of incidence: >e]g T
1-4发射角angle of emission: #2Rz=QI
1-5观测角observation: >w,L= z=
1-6分析表面积analyzed surface area: Ee>VA_ss
1-7产额 yield : H MOIUd
1-8表面层微小损伤分析minimum damage surface analysis: [4KQcmJc#
1-9表面层无损伤分析non-destructive surface analysis: b?wrOS
1-10断面深度分析 profile analysis in depth; depth profile analysis : lg%fjBY
1-11可观测面积observable area: @T1G#[C~t
1-12可观测立体角observable solid angle : kG^76dAQL
1-13接受立体角;观测立体角angle of acceptance: I8#2+$Be+@
1-14角分辨能力angular resolving power: GwWK'F'2
1-15发光度luminosity: X><C#G
1-16二次粒子探测比detection ratio of secondary particles: UmKE]1Yw4r
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: Iix,}kzss
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: S
?Zh#`(*
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: <JPN<
Kv
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: $QbJT`,mr
1-21本底压力base pressure: 5"%.8P
1-22工作压力working pressure: LKN7Lkl
%-hSa~20
2.分析方法 {X,%GI
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: 8 t+eu O
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : /<[0o]
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: ixTjXl2g
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: "&(/bdah?&
2-3离子散射表面分析ion scattering spectroscopy: eqtZU\GI>
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: _kKG%U.gbK
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: O>`k@X@9/
2-6离子散射谱仪ion scattering spectrometer:
e=]SIR()`
2-7俄歇效应Auger process: HG"ZN)~
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: .G/Rh92
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: M1jT+
2-10光电子谱术photoelectron spectroscopy : :s)cTq| 3
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: }n)0}U5;0
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: &X4anH>O
2-11光电子谱仪photoelectron spectrometer: 2H%9l@}u
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: y_PA9#v7
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: cXXZ'y>FP
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): G1|1Z5r
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus