“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 I:|<};mm
--------------------------------------------------- Y5mQY5u|
真空术语 F#b^l}
zv%]j0 ?
1.标准环境条件 standard ambient condition: mYUR(*[
2.气体的标准状态 standard reference conditions forgases: {beu
3.压力(压强)p pressure: 7C;oMh5
4.帕斯卡Pa pascal: YL?2gBT
5.托Torr torr: UY5wef2sF
6.标准大气压atm standard atmosphere: bwR$910b
7.毫巴mbar millibar: ,|}}Ml
8.分压力 partial pressure: xdLMy#U2
9.全压力 total pressure: P^3`znq{
10.真空 vacuum: cMU"SO
11.真空度 degree of vacuum: Bm>>-nG;
12.真空区域 ranges of vacuum: [,bra8f[C
13.气体 gas: @5RbMf{
14.非可凝气体 non-condensable gas: iY,FfuE
15.蒸汽vapor: hr@kU x
16.饱和蒸汽压saturation vapor pressure: #Vy8<Vy&w
17.饱和度degree of saturation: 4 EE7gkM5
18.饱和蒸汽saturated vapor: ~:krJ[=
19.未饱和蒸汽unsaturated vapor: g)Tr#
20.分子数密度n,m-3 number density of molecules: y:HH@aa)
21.平均自由程ι、λ,m mean free path: #}p@+rkg2
22.碰撞率ψ collision rate: | V:9 ][\
23.体积碰撞率χ volume collision rate:
WrHY'
24.气体量G quantity of gas: A:$4cacu9
25.气体的扩散 diffusion of gas: WqO4_;X6/
26.扩散系数D diffusion coefficient; diffusivity: Xi~7pH
27.粘滞流 viscous flow: Wa5B;X~
28.粘滞系数η viscous factor: ROhhd.
29.泊肖叶流 poiseuille flow: )FdS;]
30.中间流 intermediate flow: $xU)t&Df
31.分子流 molecular flow: !kxJ&VmeF
32克努曾数 number of knudsen: ;;|o+4Ob;
33.分子泻流 molecular effusion; effusive flow: ~dBx<
34.流逸 transpiration: ^7Rc\
35.热流逸 thermal transpiration:
O0^?VW$y_
36.分子流率qN molecular flow rate; molecular flux: ('~}$%C
37.分子流率密度 molecular flow rate density; density of molecular flux: Nov)'2g7G
38.质量流率qm mass flow rare: ^qY?x7mx1
39.流量qG throughput of gas: f6,?Yex8B
40.体积流率qV volume flow rate: d iWi0@
41.摩尔流率qυ molar flow rate: aizJ&7(>
42.麦克斯韦速度分布 maxwellian velocity distribution: yU"lJ>Eh}}
43.传输几率Pc transmission probability: h-<Qj,L{W
44.分子流导CN,UN molecular conductance: ?CD[jX}!
45.流导C,U conductance: ;Rf@S$
46.固有流导Ci,Ui intrinsic conductance: |SfCuV#g/<
47.流阻W resistance: ,p>@:C/M
48.吸附 sorption: Bwc_N.w?3
49.表面吸附 adsorption: |s'5~+
50.物理吸附physisorption: KG=57=[
51.化学吸附 chemisorption: b5S4C2Ynq
52.吸收absorption: R=J5L36F
53.适应系数α accommodation factor: ]7{
e~U
54.入射率υ impingement rate: yBRYEqS+
55.凝结率condensation rate: MW2{w<-]7
56.粘着率 sticking rate: K=Z.<f
57.粘着几率Ps sticking probability: 4;2
58.滞留时间τ residence time: - i#Kpf
59.迁移 migration: z5J$".O`
60.解吸 desorption: n52Q-6H
61.去气 degassing: G ?Hx"3:?
62.放气 outgassing: +a"f)4\
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: Z,oCkv("n
64.蒸发率 evaporation rate: ZY|$[>X!
65.渗透 permeation: 0!b9%I=j
66.渗透率φ permeability: 9S|a!9J
67.渗透系数P permeability coefficient &;naaV_2T
2. 1.真空泵 vacuum pumps +i~kqiy.
1-1.容积真空泵 positive displacement pump: aHdQi,=z
⑴.气镇真空泵 gas ballast vacuum pump: lhPxMMS`j
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: (]` rri*^
⑶.干封真空泵 dry-sealed vacuum pump: C~IE_E&Q`
⑷.往复真空泵 piston vacuum pump: !;U oZ~
⑸.液环真空泵 liquid ring vacuum pump: DLN zH
⑹.旋片真空泵 sliding vane rotary vacuum pump: UyAy?i8K
⑺.定片真空泵 rotary piston vacuum pump: "vX\Q rL
⑻.滑阀真空泵 rotary plunger vacuum pump: "&/lF[q
⑼.余摆线真空泵 trochoidal vacuum pump: -wr_x<7
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: r&+w)U~
⑾.罗茨真空泵 roots vacuum pump: dJe
3DW :
1-2.动量传输泵 kinetic vacuum pump: eQwvp`@"
⑴.牵引分子泵molecular drag pump: X"sJiF S
⑵.涡轮分子泵turbo molecular pump: `nRF"T_
⑶.喷射真空泵ejector vacuum pump: 2wJa:=$
⑷.液体喷射真空泵liquid jet vacuum pump: `pjB^--w
⑸.气体喷射真空泵gas jet vacuum pump: _\gCdNrD
⑹.蒸汽喷射真空泵vapor jet vacuum pump : V`8\)FFG
⑺.扩散泵diffusion pump : ~RH)iI
⑻.自净化扩散泵self purifying diffusion pump: (^"2"[?a
⑼.分馏扩散泵 fractionating diffusion pump : c^<~Y$i
⑽.扩散喷射泵diffusion ejector pump : M.HMnN#
⑾.离子传输泵ion transfer pump: DkSs^ym
1-3.捕集真空泵 entrapment vacuum pump: m8V}E&6
⑴吸附泵adsorption pump: |\>Ifv%{
⑵.吸气剂泵 getter pump: 6OB3%R'p
⑶.升华(蒸发)泵 sublimation (evaporation)pump : dQz#&&s-
⑷.吸气剂离子泵getter ion pump: CEVisKcE:
⑸.蒸发离子泵 evaporation ion pump: lD{*Z spz
⑹.溅射离子泵sputter ion pump: _'4S1
⑺.低温泵cryopump: K
$WMrp
(I#mo2
2.真空泵零部件 *I[tIO\
2-1.泵壳 pump case: <'QI_mP*
2-2.入口 inlet: K)
Ums-b
2-3.出口outlet: /|lAxAm?
2-4.旋片(滑片、滑阀)vane; blade : MxH |yo[
2-5.排气阀discharge valve: gZiwXb
2-6.气镇阀gas ballast valve: S503b*pM
2-7.膨胀室expansion chamber: >=:^N-a
2-8.压缩室compression chamber:
?\kuP ?\
2-9.真空泵油 vacuum pump oil: %@:6&
2-10.泵液 pump fluid: e,r7UtjoxR
2-11.喷嘴 nozzle: =kf"%vFV
2-13.喷嘴扩张率nozzle expansion rate: t
.}];IJP
2-14.喷嘴间隙面积 nozzle clearance area : O~v~s
'c&
2-15.喷嘴间隙nozzle clearance: -L<FVB
2-16.射流jet: ?bpVdm!
2-17.扩散器diffuser: Wffz&pR8
2-18.扩散器喉部diffuser thoat: /::Y &&$f
2-19.蒸汽导管vapor tube(pipe;chimney): wFMw&=j
2-20.喷嘴组件nozzle assembly: ~4|Tr z2T
2-21.下裙skirt: #G_'5{V
9 r&JsCc
3.附件 xQ2:tY#?
3-1阱trap: \ @[Q3.VX
⑴.冷阱 cold trap: .lq83;
k
⑵.吸附阱sorption trap: ~L>86/hP,N
⑶.离子阱ion trap: !Qf*d;wxn(
⑷.冷冻升华阱 cryosublimation trap: =6+99<G|%M
3-2.挡板baffle: pp@B]We
3-3.油分离器oil separator: yn"4qC#Z
3-4.油净化器oil purifier: T--%UZD]W
3-5.冷凝器condenser: hu1ZckIw?
x7Gf):,LK
4.泵按工作分类 6(BgnH8oc
4-1.主泵main pump: :5.F
4-2.粗抽泵roughing vacuum pump: 2Y<]X7Ch:
4-3.前级真空泵backing vacuum pump: @OGG]0
J
4-4.粗(低)真空泵 roughing(low)vacuum pump: 4 R(m$!E!
4-5.维持真空泵holding vacuum pump: |2%|=
4-6.高真空泵high vacuum pump: OScqf]H
4-7.超高真空泵ultra-high vacuum pump: Yufjy=!
4-8.增压真空泵booster vacuum pump: 'n
^,lXWB
0:>hK\F#
5.真空泵特性 sei2\l8q
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: Z1:%AqxP
5-2.真空泵的抽气量Q throughput of vacuum pump:。 <hj2'dU
5-3.起动压力starting pressure: d=n{Wn{C
5-4.前级压力 backing pressure : +iFt)
5-5.临界前级压力 critical backing pressure: n>R(e>
5-6.最大前级压力maximum backing pressure: &oq0XV.M^
5-7.最大工作压力maximum working pressure: @K+gh#
5-8.真空泵的极限压力ultimate pressure of a pump: T1*.3_wtP
5-9.压缩比compression ratio: wwywiFj
5-10.何氏系数Ho coefficient: ]@ke_'
"
5-11.抽速系数speed factor: *coUHbP9>
5-12.气体的反扩散back-diffusion of gas: \D(3~y>
5-13.泵液返流back-streaming of pump fluid: UAT\ .
5-14.返流率back-streaming rate {wsJ1v8!
5-15.返迁移back-migration: oC*a;o
5-16.爆腾bumping: w/(c}%v}=
5-17.水蒸气允许量qm water vapor tolerable load: xVbRCu#Z
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: <R;wa@a>
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: } `r.fD
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump 5h`L W AB
3. 1.一般术语 @+H0D"
1-1.压力计pressure gauge: k&%i+5X
1-2.真空计vacuum gauge: "C\yM{JZ
⑴.规头(规管)gauge head: u~j
H
⑵.裸规nude gauge : Z\EA!Cs3
⑶.真空计控制单元gauge control unit : \20}/&
⑷.真空计指示单元gauge indicating unit : Zfcf?&><
1(dKb
2.真空计一般分类 !CcDA/0
2-1.压差式真空计differential vacuum gauge:
V){Io_"
2-2.绝对真空计 absolute vacuum gauge: /\# f@Sg
2-3.全压真空计total pressure vacuum gauge: pR93T+X
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: @R50M (@W
2-5.相对真空计relative vacuum gauge : D|*w6p("z
G^#>HE|
3.真空计特性 GRbbU#/=G
3-1.真空计测量范围pressure range of vacuum gauge: vN\[2r%S
3-2.灵敏度系数sensitivity coefficient: 3CjixXaA$
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): RuIBOo\XL7
3-5.规管光电流photon current of vacuum gauge head: +cqUp6x.
3-6.等效氮压力equivalent nitrogen pressure : t_w\k_
T
3-7.X射线极限值 X-ray limit: 1h?ve,$
3-8.逆X射线效应anti X-ray effect: A1-,b.Ni
3-9.布利尔斯效应blears effect: *c[w9(fU
<tFq^qB
4.全压真空计 }7 +%k/
4-1.液位压力计liquid level manometer: r8:"\%"f>
4-2.弹性元件真空计elastic element vacuum gauge: xS tsw5d
4-3.压缩式真空计compression gauge: n|&=6hiI
4-4.压力天平pressure balance: K+!e1
'
4-5.粘滞性真空计viscosity gauge : g"5Kth
4-6.热传导真空计thermal conductivity vacuum gauge :
^ExuIe
4-7.热分子真空计thermo-molecular gauge: "WQ6[;&V
4-8.电离真空计ionization vacuum gauge: >pLJ ,Z
4-9.放射性电离真空计radioactive ionization gauge: 5%WAnh
4-10.冷阴极电离真空计cold cathode ionization gauge: UtTlJb{-j
4-11.潘宁真空计penning gauge: 1L4-;HYJm
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: QJ;dw8
4-13.放电管指示器discharge tube indicator: x>Q% hl
4-14.热阴极电离真空计hot cathode ionization gauge: g:)iEw>a
4-15.三极管式真空计triode gauge: f0sLe 3
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: /qy6YF8;y
4-17.B-A型电离真空计Bayard-Alpert gauge: tm.60udbo
4-18.调制型电离真空计modulator gauge: sIf]e'@AC
4-19.抑制型电离真空计suppressor gauge: M' z.d
4-20.分离型电离真空计extractor gauge: {c9 fv H
4-21.弯注型电离真空计bent beam gauge: 9X 4[Zk
4-22.弹道型电离真空计 orbitron gauge : B2Y.1mXq
4-23.热阴极磁控管真空计hot cathode magnetron gauge: By8SRWs
ZBpcC0
z
5.分压真空计(分压分析器) E#:!&{O
5-1.射频质谱仪radio frequency mass spectrometer: sED"}F)
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: 5uQ+'*xN%
5-3.单极质谱仪momopole mass spectrometer: \]f+{d-&
5-4.双聚焦质谱仪double focusing mass spectrometer: |{kbc0*
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: $Bz};@
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: M9R'ONYAa
5-7.回旋质谱仪omegatron mass spectrometer: wB0vpt5f
5-8.飞行时间质谱仪time of flight mass spectrometer: T^|k`
eZ(ThA*2=t
6.真空计校准 Dh2Cj-|
~
6-1.标准真空计reference gauges: .(q'7Q Z/
6-2.校准系统system of calibration: sk3 9[9
6-3.校准系数K calibration coefficient: FNH)wk
6-4.压缩计法meleod gauge method: iZy>V$Aq
6-5.膨胀法expansion method: 8bdO-LJ9
6-6.流导法flow method: Pb?v i<ug+
4. 1.真空系统vacuum system }WIkNG4{Z
1-1.真空机组pump system: .cJoNl'q
1-2.有油真空机组pump system used oil : /i>n1>~yn
1-3.无油真空机组oil free pump system Rkg8
1-4.连续处理真空设备continuous treatment vacuum plant: 9n\>Yieu
1-5.闸门式真空系统vacuum system with an air-lock: f^1J_}cL
1-6.压差真空系统differentially pumped vacuum system: T(x@gwc
1-7.进气系统gas admittance system: [%bGs1U
AH&RabH2
2.真空系统特性参量 r6uN6XCM
2-1.抽气装置的抽速volume flow rate of a pumping unit : G4SA
u
2-2.抽气装置的抽气量throughput of a pumping unit : Fnak:R0
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: u*2?Gky
2-4.真空系统的漏气速率leak throughput of a vacuum system: 3#t#NW*e
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: P'tXG
2-6.极限压力ultimate pressure: ,M{G
X
2-7.残余压力residual pressure: 4Z%1eOR9V
2-8.残余气体谱residual gas spectrum: bI:W4y>I=
2-9.基础压力base pressure: )1#/@cU
2-10.工作压力working pressure: #)~u
YQ
2-11.粗抽时间roughing time: $aJ6i7C,j}
2-12.抽气时间pump-down time: k5aB|xo
2-13.真空系统时间常数time constant of a vacuum system: O$6&4p*F.
2-14.真空系统进气时间venting time: \OkZ\!<hg
Gl'G;F$Y-
3.真空容器 C3W4:kbau
3-1.真空容器;真空室vacuum chamber: /.7RWy`
3-2.封离真空装置sealed vacuum device: R`<2DC>h9
3-3.真空钟罩vacuum bell jar: *z69ti/
t
3-4.真空容器底板vacuum base plate: I?PqWG!O
3-5.真空岐管vacuum manifold: z7IJSj1gQI
3-6.前级真空容器(贮气罐)backing reservoir: ?}8r h%
3-7.真空保护层outer chamber: `OMX 9i
3-8.真空闸室vacuum air lock: RVm-0[m}
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: _*e_?]G-
wl]3g
4.真空封接和真空引入线 E} XmZxHV
4-1.永久性真空封接permanent seal : .8s-)I
4.2.玻璃分级过渡封接graded seal : 1!(lpp
4-3.压缩玻璃金属封接compression glass-to-metal seal: Wj,s/Yr:
4-4.匹配式玻璃金属封接matched glass-to-metal seal: uT,i&
4-5.陶瓷金属封接ceramic-to-metal seal: B@M9oNWHu
4-6.半永久性真空封接semi-permanent seal : ~;CNWJtcf(
4-7.可拆卸的真空封接demountable joint: 2k<#e2
4-8.液体真空封接liquid seal iS+"Jsz
4-9.熔融金属真空封接molten metal seal: F|>
3gW
4-10.研磨面搭接封接ground and lapped seal: j36YIz$a
4-11.真空法兰连接vacuum flange connection: .5a>!B.I
4-12.真空密封垫vacuum-tight gasket: A{q%sp:3~
4-13.真空密封圈ring gasket: ;GG,Z#\m
4-14.真空平密封垫flat gasket: >D!R)W`
4-15.真空引入线feedthrough leadthrough: 7P3pjgh
4-16.真空轴密封shaft seal: l,h`YIy
4-17.真空窗vacuum window: '(B -{}l
4-18.观察窗viewing window: !gW`xVGv
n-8/CBEH(
5.真空阀门 %dPk,Ylz
5-1.真空阀门的特性characteristic of vacuum valves: Jfr'OD2$ %
⑴.真空阀门的流导conductance of vacuum valves: m0;j1-t
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: 2LUsqL\m}.
5-2.真空调节阀regulating valve: {H[N|\
5-3.微调阀 micro-adjustable valve: lfDd%.:q4S
5-4.充气阀charge valve: M^oL.'
5-5.进气阀gas admittance valve: 6vbKKn`ST
5-6.真空截止阀break valve: (n7xYGfYS
5-7.前级真空阀backing valve: _Sd^/jGpU
5-8.旁通阀 by-pass valve: I ==)a6^
5-9.主真空阀main vacuum valve: ;iX~3[]
5-10.低真空阀low vacuum valve: {7m2vv? Z
5-11.高真空阀high vacuum valve: {rMf/ RAE
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: <J+Oh\8tad
5-13.手动阀manually operated valve: ~_JfI7={Jn
5-14.气动阀pneumatically operated valve: V WZpEi
5-15.电磁阀electromagnetically operated valve: ^AU-hVj
5-16.电动阀valve with electrically motorized operation: UZs '[pm)
5-17.挡板阀baffle valve: &T, ,fz$
5-18.翻板阀flap valve: 'e]>lRZ
5-19.插板阀gate valve: qX\85dPn@}
5-20.蝶阀butterfly valve: 3>VL>;75[
]*| hd/j
6.真空管路 {2:baoG-
6-1.粗抽管路roughing line: M5:.\0_
6-2.前级真空管路backing line: B(Yg1jAe
6-3.旁通管路;By-Pass管路 by-pass line: TM6wjHFm
6-4.抽气封口接头pumping stem: 8m' f8.x
6-5.真空限流件limiting conductance: KdozB!\
6-6.过滤器filter: j}.gK6Yq*
5. 1.一般术语 ,H6P%
1-1真空镀膜vacuum coating: l[[`-f8j
1-2基片substrate: %!Eh9C*
1-3试验基片testing substrate: W[J2>`k9
1-4镀膜材料coating material: f3!Oc
1-5蒸发材料evaporation material: Xk|a%%O*H
1-6溅射材料sputtering material: =I'iD0eR
1-7膜层材料(膜层材质)film material: ]_B<K5
1-8蒸发速率evaporation rate: TW&s c9
1-9溅射速率sputtering rate: i5le0lM
1-10沉积速率deposition rate: c`3`}&g#
1-11镀膜角度coating angle: k0j4P^d
T U_'1
2.工艺 bX38=.up
2-1真空蒸膜vacuum evaporation coating: -'miM ~kG[
(1).同时蒸发simultaneous evaporation: kXhd]7ru
(2).蒸发场蒸发evaporation field evaporation: 6
DQOar>d
(3).反应性真空蒸发reactive vacuum evaporation: $,Xn@4
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: [\Wl~
a l
(5).直接加热的蒸发direct heating evaporation: ~\-=q^/!
(6).感应加热蒸发induced heating evaporation: ;C*2Djb*n
(7).电子束蒸发electron beam evaporation: ^NU_Tp:2^
(8).激光束蒸发laser beam evaporation: *<cRQfA1
(9).间接加热的蒸发indirect heating evaporation: &J/!D#
(10).闪蒸flash evaportion: aoW2 c1`?Z
2-2真空溅射vacuum sputtering: [.|& /O
(1).反应性真空溅射 reactive vacuum sputtering: AoGpM,W]5
(2).偏压溅射bias sputtering: 1d49&-N
(3).直流二级溅射direct current diode sputtering: 2* `kkS
(4).非对称性交流溅射asymmtric alternate current sputtering: m$[:J
(5).高频二极溅射high frequency diode sputtering: 8HLL3H0
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: 5,XEN$^
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: *j83E[(]
(8).离子束溅射ion beam sputtering: J ##a;6@
(9).辉光放电清洗glow discharge cleaning: O2 Y|<m
2-3物理气相沉积PVD physical vapor deposition: @dK_w'W
2-4化学气相沉积CVD chemical vapor deposition: do^=Oq07$
2-5磁控溅射magnetron sputtering: uHquJQ4
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: [r7Hcb
2-7空心阴极离子镀HCD hollow cathode discharge deposition: tlO=>
2-8电弧离子镀arc discharge deposition: k2->Z);X
t5l<Lm)
3.专用部件 ,.{M1D6'R`
3-1镀膜室coating chamber: ;FwUUKj
3-2蒸发器装置evaporator device: iDDq<a.A
3-3蒸发器evaporator: V+sZ;$
3-4直接加热式蒸发器evaporator by direct heat: hH>a{7V
3-5间接加热式蒸发器evaporator by indirect heat: >N!
Xey
3-7溅射装置sputtering device: qYe`</
3-8靶target: R7:u 8-dU1
3-10时控挡板timing shutter: V
7~ 9z\lW
3-11掩膜mask: p\~ a=
3-12基片支架substrate holder: 2vUcSKG7
3-13夹紧装置clamp: G$*=9`
3-14换向装置reversing device: ^`xS|Sq1D
3-15基片加热装置substrate heating device: '#A_KHD
3-16基片冷却装置substrate colding device: |a[ "
^
2
vbd
;Je"
4.真空镀膜设备 5R.jhYAj
4-1真空镀膜设备vacuum coating plant: W1o6Sh8v(
(1).真空蒸发镀膜设备vacuum evaporation coating plant: 4avkyFj!h
(2).真空溅射镀膜设备vacuum sputtering coating plant: lgt&kdc%o
4-2连续镀膜设备continuous coating plant: !2B~.!&
4-3半连续镀膜设备semi- continuous coating plant xK[[b
6. 1.漏孔 -2laM9Ed
1-1漏孔leaks: (F;*@Z*R
1-2通道漏孔channel leak: yp]vDm
1-3薄膜漏孔membrane leak: b[&ri:AC
1-4分子漏孔molecular leak: -
]We|{
1-5粘滞漏孔vixcous leak: ?gU-a
1-6校准漏孔calibrated leak: WB (?6"
1-7标准漏孔reference leak : b-`P-
1-8虚漏virtual leak: a]V#mF |{
1-9漏率leak rate: fUq}dAs*K
1-10标准空气漏率standard air leak rate: GdScYAC
1-11等值标准空气漏率equivalent standard air leak rate: [4;_8-[Nv
1-12探索(示漏)气体: Wvd-be
!:vQg+S
2.本底 \l[AD-CZPh
2-1本底background: ~P!=fU)
2-2探索气体本底search gas background : CucW84H`J
2-3漂移drift: }7%ol&<@
2-4噪声noise: 92,@tNQQ}
ga1b%5]v.
3.检漏仪 jtpk5 fJB
3-1检漏仪leak detector: kiin7 8W
3-2高频火花检漏仪H.F. spark leak detector: ^LSD_R^N
3-3卤素检漏仪halide leak detector: \Ff]}4
3-4氦质谱检漏仪helium mass spectrometer leak detector: TFbF^Kd#:d
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: h52+f
Iw$T'I+4W
4.检漏 kd
p*6ynD
4-1气泡检漏leak detection by bubbles: yYaYuf
4-2氨检漏leak detection by ammonia: e \kR/<L
4-3升压检漏leak detection of rise pressure: oe9S$C;$'
4-4放射性同位素检漏radioactive isotope leak detection: z&qOu8Jh
4-5荧光检漏fluorescence leak detection H?ue!5R#L
7. 1.一般术语 oqK:
5|
1-1真空干燥vacuum drying: M-!#-l
1-2冷冻干燥freeze drying : s.Mrd~(Drz
1-3物料material: 3WfZ zb+
1-4待干燥物料material to be dried: gs@^u#O
1-5干燥物料dried material : f|!@H><
1-6湿气moisture;humidity: (Zy=e?E,
1-7自由湿气free moisture: %z
@T /
1-8结合湿气bound moisture: !P6y_Frpe
1-9分湿气partial moisture: 9 771D
1-10含湿量moisture content: el^<M,7!
1-11初始含湿量initial moisture content: F zBny[F
1-12最终含湿量final residual moisture: ryd}-_LL
1-13湿度degree of moisture ,degree of humidity : =Y3 d~~
1-14干燥物质dry matter : noT}NX%
1-15干燥物质含量content of dry matter: DEv,!8
b DF_
2.干燥工艺 ~vR<UQz
2-1干燥阶段stages of drying : b\t@vMJ
(1).预干燥preliminary dry: @[rlwwG,
(2).一次干燥(广义)primary drying(in general): A_6Dol=J@
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): \>eFs} Y/
(4).二次干燥secondary drying: hn/SS
2-2.(1).接触干燥contact drying: /hyCR___
(2).辐射干燥 drying by radiation : =4x-x nA
(3).微波干燥microwave drying: k"FY
&;G(G
(4).气相干燥vapor phase drying: S7hfwu&7F
(5).静态干燥static drying: \g@jc OKU
(6).动态干燥dynamic drying: XoiZ"zE
2-3干燥时间drying time: W?@+LQa??
2-4停留时间length of stay(in the drying chamber): ^A;ec
h7I
2-5循环时间cycle time: AqrK==0N
2-6干燥率 dessication ratio : KEr?&e
2-7去湿速率mass flow rate of humidity: l%xeM!}
2-8单位面积去湿速率mass flow rate of humidity per surface area: Xb*>7U/'T
2-9干燥速度 drying speed : Q[Tbdc%1EG
2-10干燥过程drying process: *-_joAWTG
2-11加热温度heating temperature: kZ
9n@($B
2-12干燥温度temperature of the material being dried : jRdW=/q+(
2-13干燥损失loss of material during the drying process : }% ?WS
2-14飞尘lift off (particles): >LB x\/
2-15堆层厚度thickness of the material: 0k|/]zfb
CwfGp[|}e
3.冷冻干燥 <gr2k8m6$
3-1冷冻freezing: uFi[50
(1).静态冷冻static freezing: rg+3pX\{
(2).动态冷冻dynamic freezing: S>?B)
(3).离心冷冻centrifugal freezing: 7m9T'
(4).滚动冷冻shell freezing: =0mGfTc
(5).旋转冷冻spin-freezing: Jc9^Hyqu&
(6).真空旋转冷冻vacuum spin-freezing: c6pGy%T-
(7).喷雾冷冻spray freezing: "[]J[!}x
(8).气流冷冻air blast freezing: x6*.zo5e
3-2冷冻速率rate of freezing: SVyJUd_
3-3冷冻物料frozen material: fm,:8%
3-4冰核ice core: qS2]|7q?Tc
3-5干燥物料外壳envelope of dried matter: X<$8'/p r
3-6升华表面sublimation front: :!g zx n
3-7融化位置freezer burn: t!vlZNc
12%4>2}~>
4.真空干燥设备;真空冷冻干燥设备 p/uOCQ|1l
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: ol8uV{:"
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: |teDe6\m
4-3加热表面heating surface: 4K*DEVS
4-4物品装载面shelf : &@xeWB
4-5干燥器的处理能力throughput (of the vacuum drying chamber): Z$a4@W9o
4-6单位面积干燥器处理能力throughput per shelf area: S1n'r}z8
4-7冰冷凝器ice condenser: g7W\
&
4-8冰冷凝器的负载load of the ice condenser: !J@pox-t
4-9冰冷凝器的额定负载rated load of the ice condenser pDx}~IB
8. 1.一般术语 [Z?vC
1-1试样sample : A&fh0E (t
(1).表面层surface layer: jk}m
(2).真实表面true surface: s97L/iH
(3).有效表面积effective surface area: V5ihplAk
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: TDQh ^Wo
(5).表面粒子密度surface particle density: @AdJu-u
(6).单分子层monolayer: ;R?9|:7
(7).表面单分子层粒子密度monolayer density: 0H{0aQQ
(8).覆盖系数coverage ratio: 9Fh(tzz
1-2激发excitation: @'!61'}f
(1).一次粒子primary particle: {VE$i2nC8
(2).一次粒子通量primary particle flux: KBFAV&
(3).一次粒子通量密度density of primary particle flux: \ow0Y>
(4).一次粒子负荷primary particle load: Q,`Y
(5).一次粒子积分负荷integral load of primary particle: I2=Kq{
(6).一次粒子的入射能量energy of the incident primary particle: { n%U2LVL
(7).激发体积excited volume: /`Lki>"
(8).激发面积excited area: B1Iq:5nmoS
(9).激发深度excited death: w8g36v*+(u
(10).二次粒子secondary particles: >KXT2+w
(11).二次粒子通量secondary particle flux: [}_ar
(12).二次粒子发射能energy of the emitted secondary particles: h@D4~(r
(13).发射体积emitting volume: G1'w50Yu
(14).发射面积emitting area: MY["
zv
(15).发射深度emitting depth: i=<(fq
(16).信息深度information depth: , 0rC_)&B
(17).平均信息深度mean information depth: u$[T8UqF
1-3入射角angle of incidence: 4.dMNqU
1-4发射角angle of emission: [@/[#p
1-5观测角observation: *lG$B@;rc|
1-6分析表面积analyzed surface area: JhDjY8?86
1-7产额 yield : Ja#idF[V
1-8表面层微小损伤分析minimum damage surface analysis: q 9pcEm4?
1-9表面层无损伤分析non-destructive surface analysis: &[KFCn
1-10断面深度分析 profile analysis in depth; depth profile analysis : c(AjM9s
1-11可观测面积observable area: /aJl0GL4!
1-12可观测立体角observable solid angle : BWX&5""
1-13接受立体角;观测立体角angle of acceptance: }H,A
T
1-14角分辨能力angular resolving power: q+o(`N'~G
1-15发光度luminosity: {_/6,22j(V
1-16二次粒子探测比detection ratio of secondary particles: 3)g1e=\i$
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: ?I 1@:?Qi
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: 1.H"$D>TC
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: CsR~qQ
5
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: I|O~F e.
1-21本底压力base pressure: .[Sv|;x"E
1-22工作压力working pressure: R/O_*XY
t@v>eb
2.分析方法 5#f&WL*U@
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: qW<: `y
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : oa1a5+A
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: $9 DZ5"
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: tXKhkt`
2-3离子散射表面分析ion scattering spectroscopy: f3l >26
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: i]$7w! r&
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: l1wxs@](
2-6离子散射谱仪ion scattering spectrometer: xG}eiUbM`
2-7俄歇效应Auger process: "3j0)
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: up2%QbN(
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: l2`8]Qr
2-10光电子谱术photoelectron spectroscopy : iZyk2kc
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: Da@ tpKU)p
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: LbYI{|_Js
2-11光电子谱仪photoelectron spectrometer: >LU*F|F]B
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: ) L{Tn8
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: {h%.i Et%
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): eNNgxQw>m
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus