“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 Y_)!U`>N?
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真空术语 O!kBp(?]
Qhsh{muw(
1.标准环境条件 standard ambient condition: -Yy,L%E]F:
2.气体的标准状态 standard reference conditions forgases: @%fNB,H`
3.压力(压强)p pressure: diGPTV-?$
4.帕斯卡Pa pascal: 6fQNF22E
5.托Torr torr: \;}F6g
6.标准大气压atm standard atmosphere: 7g cr$&+e
7.毫巴mbar millibar: try'%0}>
8.分压力 partial pressure: ^N _kiSr
9.全压力 total pressure: uMtq4.
10.真空 vacuum: u!];RHOp|
11.真空度 degree of vacuum: |#Bz&T
12.真空区域 ranges of vacuum: vZmM=hW ~
13.气体 gas: #7+oM8b
14.非可凝气体 non-condensable gas: 5vxJ|Hse@
15.蒸汽vapor: 1j
"/}0fx
16.饱和蒸汽压saturation vapor pressure: kcVEE)zb
17.饱和度degree of saturation: 1RZhy_$\.
18.饱和蒸汽saturated vapor: m@R!o
19.未饱和蒸汽unsaturated vapor: {A2(a7vV
20.分子数密度n,m-3 number density of molecules: &aqF||v%)
21.平均自由程ι、λ,m mean free path: PW x9CT
22.碰撞率ψ collision rate: +ZEj(fd9
23.体积碰撞率χ volume collision rate: M3c-/7
24.气体量G quantity of gas: KyK%2:
25.气体的扩散 diffusion of gas: nxkbI:+t
26.扩散系数D diffusion coefficient; diffusivity: -uXf?sTV
27.粘滞流 viscous flow: z;JyHC)
28.粘滞系数η viscous factor: 5fMVjd
29.泊肖叶流 poiseuille flow: @k>}h\w
30.中间流 intermediate flow: A'HFpsa
31.分子流 molecular flow: h5e(Avk
32克努曾数 number of knudsen: OZ3iH%
33.分子泻流 molecular effusion; effusive flow: 85+'9#~!
34.流逸 transpiration: P3UU~w+s
35.热流逸 thermal transpiration: 1%68Pnqk
36.分子流率qN molecular flow rate; molecular flux: :3J,t//c
37.分子流率密度 molecular flow rate density; density of molecular flux: 8i/5L=a"`
38.质量流率qm mass flow rare: kAA1+rG
39.流量qG throughput of gas: =VFi}C/
40.体积流率qV volume flow rate: 'hN_H}U
41.摩尔流率qυ molar flow rate: :rd{y`59>&
42.麦克斯韦速度分布 maxwellian velocity distribution: T^> ST
43.传输几率Pc transmission probability: Zvz Zs
44.分子流导CN,UN molecular conductance: `>-fU<Q1
45.流导C,U conductance: ce@1#}*
46.固有流导Ci,Ui intrinsic conductance:
n@xC?D:t*
47.流阻W resistance: u0 myB/`
48.吸附 sorption: ^S:S[0\,
49.表面吸附 adsorption: Vea2 oQq
50.物理吸附physisorption: 9.u}<m
51.化学吸附 chemisorption: *:S_v.Y3"
52.吸收absorption: h|qTMwPr
53.适应系数α accommodation factor: /9T.]H~
54.入射率υ impingement rate: '/8{Mx+
55.凝结率condensation rate: ])F*)U
56.粘着率 sticking rate: j5\z7
57.粘着几率Ps sticking probability: D$@5$./
58.滞留时间τ residence time: {\zTE1X9
59.迁移 migration: ;Z^\$v9?
60.解吸 desorption: \PReQ|[ah
61.去气 degassing: 'D_a2xo0
62.放气 outgassing: prtNfwJz1j
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: yp}J+/PX}
64.蒸发率 evaporation rate: 4Z8FLA+T,
65.渗透 permeation: b9nTg
66.渗透率φ permeability: J5dwd,FQ
67.渗透系数P permeability coefficient (D2G.R\pr
2. 1.真空泵 vacuum pumps h</,p49gM
1-1.容积真空泵 positive displacement pump: S7pf
QF
⑴.气镇真空泵 gas ballast vacuum pump: pmda9V4
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: \LuaI
⑶.干封真空泵 dry-sealed vacuum pump: %Q,6 sH#
⑷.往复真空泵 piston vacuum pump: BoJpf8e'-e
⑸.液环真空泵 liquid ring vacuum pump: uoJ@Jt'j
⑹.旋片真空泵 sliding vane rotary vacuum pump: |5il5UP
⑺.定片真空泵 rotary piston vacuum pump: +;r1AR1)x
⑻.滑阀真空泵 rotary plunger vacuum pump: #aI(fQZe
⑼.余摆线真空泵 trochoidal vacuum pump: xB5qX7*.
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: a]H&k$!c
⑾.罗茨真空泵 roots vacuum pump: an q1zH
1-2.动量传输泵 kinetic vacuum pump: B&fH
FyK1n
⑴.牵引分子泵molecular drag pump: |D*a"*1+A
⑵.涡轮分子泵turbo molecular pump: BD.&K_AW
⑶.喷射真空泵ejector vacuum pump: -S\gDB bb
⑷.液体喷射真空泵liquid jet vacuum pump: }%75Wety
⑸.气体喷射真空泵gas jet vacuum pump: \
-n&z;`
⑹.蒸汽喷射真空泵vapor jet vacuum pump : ?+)>JvWDz
⑺.扩散泵diffusion pump : d1jg3{pwA
⑻.自净化扩散泵self purifying diffusion pump: 3~q#P
⑼.分馏扩散泵 fractionating diffusion pump : ^8.s"4{
⑽.扩散喷射泵diffusion ejector pump : n4XEyCrD
⑾.离子传输泵ion transfer pump: ^%5;Sc1V
1-3.捕集真空泵 entrapment vacuum pump: W3+;1S$k
⑴吸附泵adsorption pump: Xsk/U++
⑵.吸气剂泵 getter pump: i[Qq,MmC
⑶.升华(蒸发)泵 sublimation (evaporation)pump : i/{dD"HwM
⑷.吸气剂离子泵getter ion pump: v[~~q
⑸.蒸发离子泵 evaporation ion pump: E]w2
{%
⑹.溅射离子泵sputter ion pump: M{z&h>
⑺.低温泵cryopump: s4uZ >
w`GjQIA
2.真空泵零部件 :(A k:
2-1.泵壳 pump case: LbkQuq/d
2-2.入口 inlet: n +v(t
2-3.出口outlet: h3e
%(a
2-4.旋片(滑片、滑阀)vane; blade : `\beQ(g
2-5.排气阀discharge valve: t5CJG '!ql
2-6.气镇阀gas ballast valve: c( _R
xLJ
2-7.膨胀室expansion chamber: -!lSk?l
2-8.压缩室compression chamber: ;.66phe
2-9.真空泵油 vacuum pump oil: |.OS7Gt?
2-10.泵液 pump fluid: uS<og P
2-11.喷嘴 nozzle: QsX`IYk
2-13.喷嘴扩张率nozzle expansion rate: g'+2bQ
2-14.喷嘴间隙面积 nozzle clearance area : QVF561Yz
2-15.喷嘴间隙nozzle clearance: .PD_Vv>C/>
2-16.射流jet: _BEDQb{"|
2-17.扩散器diffuser: Py`7)S
2-18.扩散器喉部diffuser thoat: nP&6i5s%
2-19.蒸汽导管vapor tube(pipe;chimney): 6&"*{E
2-20.喷嘴组件nozzle assembly: 1@t8i?:h
2-21.下裙skirt: Bx/)Sl@
a8YFH$Xh
3.附件 hbe";(
3-1阱trap: Xz?7x0)Z
⑴.冷阱 cold trap: U#x`u|L&6
⑵.吸附阱sorption trap: PYwGGB-
⑶.离子阱ion trap: "#:h#uRUb
⑷.冷冻升华阱 cryosublimation trap: _b`/QSL
3-2.挡板baffle: z57q|
3-3.油分离器oil separator: n5 <B*
3-4.油净化器oil purifier: au E8 ^|
3-5.冷凝器condenser: %CZGV7JdA
R2==<"gq
4.泵按工作分类 }tW1\@
=
4-1.主泵main pump: DW>O]\I
4-2.粗抽泵roughing vacuum pump: (&=3Y8
4-3.前级真空泵backing vacuum pump: +y_V$q$G
4-4.粗(低)真空泵 roughing(low)vacuum pump: KBoW(OP4'
4-5.维持真空泵holding vacuum pump: D;h JK-Y
4-6.高真空泵high vacuum pump: _H@8qR
4-7.超高真空泵ultra-high vacuum pump: SBaTbY0
4-8.增压真空泵booster vacuum pump: y(*5qa<>
IrIW>r} -
5.真空泵特性 E#A}2|7,g
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: iL<FFN~{
5-2.真空泵的抽气量Q throughput of vacuum pump:。 FzOlM-)m
5-3.起动压力starting pressure: .]0:`Y,;
5-4.前级压力 backing pressure : 7:zoF],s
5-5.临界前级压力 critical backing pressure: r3Kx
5-6.最大前级压力maximum backing pressure: f[*g8p
5-7.最大工作压力maximum working pressure: i)/#u+Y1P
5-8.真空泵的极限压力ultimate pressure of a pump: ;Za^).=
5-9.压缩比compression ratio: -M+o;
5-10.何氏系数Ho coefficient: |RBL5,t^
5-11.抽速系数speed factor: gk}.LE
5-12.气体的反扩散back-diffusion of gas:
]D^zTl3=q
5-13.泵液返流back-streaming of pump fluid: F ~e}=Nb
5-14.返流率back-streaming rate pf#R]
5-15.返迁移back-migration: f*EDSJu\
5-16.爆腾bumping: H?
%I((+
5-17.水蒸气允许量qm water vapor tolerable load: +jN)$Y3Ya
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: +O1=Ao
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: uG/b Cb+V
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump DG=_E\"#
3. 1.一般术语 ti<;>P[4
1-1.压力计pressure gauge: %C)|fDwN
1-2.真空计vacuum gauge: 3W[Ps?G
⑴.规头(规管)gauge head: rW)}$|-Z
⑵.裸规nude gauge : F)50 6
⑶.真空计控制单元gauge control unit : CHdYY7\{
⑷.真空计指示单元gauge indicating unit : /GA-1cS_(
"/x/]Qx2
2.真空计一般分类 m:g%5'qDZ
2-1.压差式真空计differential vacuum gauge: z-|d/#h
2-2.绝对真空计 absolute vacuum gauge: ^fU,9
2-3.全压真空计total pressure vacuum gauge: ?#:!!.I:
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: t?p>L*
2-5.相对真空计relative vacuum gauge : m xy=3cUi
"77l~3
3.真空计特性 0
d2to5 (
3-1.真空计测量范围pressure range of vacuum gauge: CelM~W$=u
3-2.灵敏度系数sensitivity coefficient: lC^?Jk[N
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): ]Gl5Qf:+z
3-5.规管光电流photon current of vacuum gauge head: [5]*
Be
3-6.等效氮压力equivalent nitrogen pressure : L @8[.
3-7.X射线极限值 X-ray limit: .Pa6HA !
3-8.逆X射线效应anti X-ray effect: K14{c1
3-9.布利尔斯效应blears effect: %"3tGi:/
3H5<w4yk
4.全压真空计 0urM@/j+
4-1.液位压力计liquid level manometer: -vS7 %Fbr
4-2.弹性元件真空计elastic element vacuum gauge: 68!=`49r>
4-3.压缩式真空计compression gauge: 3
J\&t4q
4-4.压力天平pressure balance: t<qXXQ&5
4-5.粘滞性真空计viscosity gauge : KkZ o|\V
4-6.热传导真空计thermal conductivity vacuum gauge : %[m%QP1;p
4-7.热分子真空计thermo-molecular gauge: BeM|1pe.
4-8.电离真空计ionization vacuum gauge: ":^cb =
4-9.放射性电离真空计radioactive ionization gauge: jhE3@c@pT
4-10.冷阴极电离真空计cold cathode ionization gauge: ACH!Gw~
4-11.潘宁真空计penning gauge: RTYhgq
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: Oc^bbC
4-13.放电管指示器discharge tube indicator: nIqmora
4-14.热阴极电离真空计hot cathode ionization gauge: G6j9,#2@
4-15.三极管式真空计triode gauge: Y.8mgy>
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: j=w`%nh4"f
4-17.B-A型电离真空计Bayard-Alpert gauge: j*1O(p+
4-18.调制型电离真空计modulator gauge: 12yX`9h>
4-19.抑制型电离真空计suppressor gauge: 2ZFp(e^%
4-20.分离型电离真空计extractor gauge: 96CC5
4-21.弯注型电离真空计bent beam gauge: nL*
SNQ_
4-22.弹道型电离真空计 orbitron gauge : +DP{ _x)t
4-23.热阴极磁控管真空计hot cathode magnetron gauge: q0QB[)AP
Og<UW^VR
5.分压真空计(分压分析器) xr4kBC
t
5-1.射频质谱仪radio frequency mass spectrometer: 5I@2U vV8
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: 9@z"~H
5-3.单极质谱仪momopole mass spectrometer: nYO4JlNP
5-4.双聚焦质谱仪double focusing mass spectrometer: ,46k8%WW
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: Hh.l,Z7i7D
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: u:&Lf
5-7.回旋质谱仪omegatron mass spectrometer: W RVm^
5-8.飞行时间质谱仪time of flight mass spectrometer: eMDraJv@
T>s3s5Y
6.真空计校准 FG5t\!dt<
6-1.标准真空计reference gauges: u:D,\`;)
6-2.校准系统system of calibration: p'IF2e&z
6-3.校准系数K calibration coefficient: a;e~D
9%1
6-4.压缩计法meleod gauge method: [P746b_\e
6-5.膨胀法expansion method: *f$wmZ5A
6-6.流导法flow method: Sj<WiQ%<
4. 1.真空系统vacuum system B@2VI
1%
1-1.真空机组pump system: }W k!):=y
1-2.有油真空机组pump system used oil : (lVHKg&U[
1-3.无油真空机组oil free pump system 2N:|B O>
1-4.连续处理真空设备continuous treatment vacuum plant: <Xr{1M D
1-5.闸门式真空系统vacuum system with an air-lock: P ||:?3IH
1-6.压差真空系统differentially pumped vacuum system: JA~v:ec
1-7.进气系统gas admittance system: ')>&:~
|\MgE.N
2.真空系统特性参量 P>3
;M'KsO
2-1.抽气装置的抽速volume flow rate of a pumping unit : G\ht)7SGgf
2-2.抽气装置的抽气量throughput of a pumping unit : ?ydqmj2[F
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: [q{[Avqf
2-4.真空系统的漏气速率leak throughput of a vacuum system: Q)s[ls
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: $.2#G"|
2-6.极限压力ultimate pressure: f?A1=lm~
2-7.残余压力residual pressure: 5L4{8X0X8
2-8.残余气体谱residual gas spectrum: >FabmIcC
2-9.基础压力base pressure: cRhu]fv()
2-10.工作压力working pressure: X)peY
2-11.粗抽时间roughing time: XNJPf) T
2-12.抽气时间pump-down time: iFy_D
2-13.真空系统时间常数time constant of a vacuum system: ]hL`HP
2-14.真空系统进气时间venting time: 89[5a
i7/I8y
3.真空容器 C.[abpc
3-1.真空容器;真空室vacuum chamber: hc;8Vsa
3-2.封离真空装置sealed vacuum device: ^%?*u;uU%
3-3.真空钟罩vacuum bell jar: JXIxk"m
3-4.真空容器底板vacuum base plate: lef,-{X-
3-5.真空岐管vacuum manifold: _3YuPMaN
3-6.前级真空容器(贮气罐)backing reservoir: S3iXG
@
3-7.真空保护层outer chamber: %cl=n!T
3-8.真空闸室vacuum air lock: [Cx'a7KWL
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: S_VZ^1X]
bZ$;`F5})
4.真空封接和真空引入线 %9!,PeRe
4-1.永久性真空封接permanent seal : L:ox$RU
4.2.玻璃分级过渡封接graded seal : {T^"`%[
4-3.压缩玻璃金属封接compression glass-to-metal seal: |KHaL?
4-4.匹配式玻璃金属封接matched glass-to-metal seal: 5mxYzu;#]
4-5.陶瓷金属封接ceramic-to-metal seal: axSJ:j8
4-6.半永久性真空封接semi-permanent seal : oXef<- :
4-7.可拆卸的真空封接demountable joint: ,u1Yn}
4-8.液体真空封接liquid seal /Jjub3>Q
4-9.熔融金属真空封接molten metal seal: +EZ Lic
4-10.研磨面搭接封接ground and lapped seal: G'5p /:
4-11.真空法兰连接vacuum flange connection: 2|KgRk|!
4-12.真空密封垫vacuum-tight gasket: Pde|$!Jo
4-13.真空密封圈ring gasket: s^@?+<4:
4-14.真空平密封垫flat gasket: ok"v`76~f5
4-15.真空引入线feedthrough leadthrough: w@&4dau
4-16.真空轴密封shaft seal: `5V=U9zdE
4-17.真空窗vacuum window: ZPieL&uV`
4-18.观察窗viewing window: pu:Ie#xTDf
_R,VNk
5.真空阀门 rfgkw
5-1.真空阀门的特性characteristic of vacuum valves: 6 K+DgNK
⑴.真空阀门的流导conductance of vacuum valves: rff=ud>Jf
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: a5/6DK>
5-2.真空调节阀regulating valve: 6V"|
5-3.微调阀 micro-adjustable valve: o"te7nBI
5-4.充气阀charge valve: vU:FDkx*nn
5-5.进气阀gas admittance valve: ] rP^
5-6.真空截止阀break valve: eD4qh4|u.
5-7.前级真空阀backing valve: -K 7jigac
5-8.旁通阀 by-pass valve: )"W(0M]>
5-9.主真空阀main vacuum valve: ^usZ&9"@P
5-10.低真空阀low vacuum valve: o=t@83Fh5
5-11.高真空阀high vacuum valve: FUVoKX!#
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: </UUvMf"
5-13.手动阀manually operated valve: dr|>P*
5-14.气动阀pneumatically operated valve: cmLGMlFT
5-15.电磁阀electromagnetically operated valve: )U?Tmh
5-16.电动阀valve with electrically motorized operation: \(ygdZ{R
5-17.挡板阀baffle valve: ,cgFdOM.
5-18.翻板阀flap valve: t<)Cbple\
5-19.插板阀gate valve: 7,MDFO{n
5-20.蝶阀butterfly valve: Wchu-]
'MM%Sm,
6.真空管路 o$*aAgS+
6-1.粗抽管路roughing line: B-oQ 9[~
6-2.前级真空管路backing line: pO^PkX
6-3.旁通管路;By-Pass管路 by-pass line: k$u\\`i]oC
6-4.抽气封口接头pumping stem: %h}Q f&U_
6-5.真空限流件limiting conductance: BB x359
6-6.过滤器filter: 3pxZk%
5. 1.一般术语 WrA!'I
1-1真空镀膜vacuum coating: #GDnV/0)
1-2基片substrate: )\
`AD#
1-3试验基片testing substrate: tx,_0[hZi
1-4镀膜材料coating material: -/x=`S*
1-5蒸发材料evaporation material: |K|[>[?Z/
1-6溅射材料sputtering material: (=2-*((&(A
1-7膜层材料(膜层材质)film material: WpPm|h
1-8蒸发速率evaporation rate: iKJ-$x_5
1-9溅射速率sputtering rate: rq>}]
U
1-10沉积速率deposition rate: DjyqQyq~
1-11镀膜角度coating angle: DFgQ1:6[
b^*9m PP
2.工艺 8#m,TOp
2-1真空蒸膜vacuum evaporation coating: L}~"R/iWCT
(1).同时蒸发simultaneous evaporation: 9nM_LV
(2).蒸发场蒸发evaporation field evaporation: .3X5~OH
(3).反应性真空蒸发reactive vacuum evaporation: I7@|{L1|FB
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: S!Alno
(5).直接加热的蒸发direct heating evaporation: #x?Ku\ts
(6).感应加热蒸发induced heating evaporation: YFJw<5&
(7).电子束蒸发electron beam evaporation: C+0MzfLgf
(8).激光束蒸发laser beam evaporation: l}bAwJ?
(9).间接加热的蒸发indirect heating evaporation: sf([8YUd
(10).闪蒸flash evaportion: &z;bX-"E
2-2真空溅射vacuum sputtering: 2
c
2lK
(1).反应性真空溅射 reactive vacuum sputtering: *1H8
&
(2).偏压溅射bias sputtering: @
0'j;")XV
(3).直流二级溅射direct current diode sputtering: r}**^"mFy
(4).非对称性交流溅射asymmtric alternate current sputtering: w#XD4kwQG
(5).高频二极溅射high frequency diode sputtering: 0N|l1Sn
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: -wh?9?W
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: Udi
(8).离子束溅射ion beam sputtering: 4.=jKj9j
(9).辉光放电清洗glow discharge cleaning: -JEiwi ,
2-3物理气相沉积PVD physical vapor deposition: :17Pc\:DS
2-4化学气相沉积CVD chemical vapor deposition: _%@dlT?
2-5磁控溅射magnetron sputtering: @%'1Jd7-Wp
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: ?XlPKY
2-7空心阴极离子镀HCD hollow cathode discharge deposition: tx*L8'jlN
2-8电弧离子镀arc discharge deposition: _o52#Q4
YE*%Y["
3.专用部件 eh39"s
3-1镀膜室coating chamber: ]\C wa9
3-2蒸发器装置evaporator device: fN_qJm#:$y
3-3蒸发器evaporator: gW5yLb_Vz$
3-4直接加热式蒸发器evaporator by direct heat: t/wo
G9N
3-5间接加热式蒸发器evaporator by indirect heat: b8
^O"oDrp
3-7溅射装置sputtering device: =*5< w
3-8靶target: ~n"?*I`
3-10时控挡板timing shutter: W ZT) LYA
3-11掩膜mask: f:K>o.
3-12基片支架substrate holder: H|IG"JB
3-13夹紧装置clamp: :R{pV7<O
3-14换向装置reversing device: $a01">q&y
3-15基片加热装置substrate heating device: KB"N',kG
3-16基片冷却装置substrate colding device: [ *~2Ts
2Ij,OIcdBE
4.真空镀膜设备 g5C$#<28
4-1真空镀膜设备vacuum coating plant: T4nWK!}z
(1).真空蒸发镀膜设备vacuum evaporation coating plant: @DNwzdP
(2).真空溅射镀膜设备vacuum sputtering coating plant: 7BS5Eq B=
4-2连续镀膜设备continuous coating plant: -d. i4X3j
4-3半连续镀膜设备semi- continuous coating plant d =p=eUd2
6. 1.漏孔 N>H#Ew@2U
1-1漏孔leaks: |@1M'
1-2通道漏孔channel leak: ~n~j2OE
1-3薄膜漏孔membrane leak: Dr)jB*yK
1-4分子漏孔molecular leak: j8G$ , ~v
1-5粘滞漏孔vixcous leak: iG ,z3/~v
1-6校准漏孔calibrated leak: ]$,3vYBf
1-7标准漏孔reference leak : *Fg)`M3g
1-8虚漏virtual leak: -q]5@s/
1-9漏率leak rate: Xw#"?B(M]
1-10标准空气漏率standard air leak rate: G=F _{z\}
1-11等值标准空气漏率equivalent standard air leak rate: |vw],r6
1-12探索(示漏)气体: i-}Tt<^
y9N6!M|'y
2.本底 ' Tk4P{
2-1本底background: %g~&$oZmq
2-2探索气体本底search gas background : Ne)3@?
2-3漂移drift: Uc,J+j0F
2-4噪声noise: >V>`}TIH
D<`M<:nq
3.检漏仪 8(ot<3(D
3-1检漏仪leak detector: m^~5Xr"
3-2高频火花检漏仪H.F. spark leak detector: bzr QQQ
3-3卤素检漏仪halide leak detector: ~"\WV4}`v
3-4氦质谱检漏仪helium mass spectrometer leak detector:
;Dbx5-t
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: [1Aoj|
I)kc[/^j$
4.检漏 [C/{ ru&E
4-1气泡检漏leak detection by bubbles: ~.4y* &
4-2氨检漏leak detection by ammonia: )}7X4g6X
4-3升压检漏leak detection of rise pressure: Dkx}}E:<
4-4放射性同位素检漏radioactive isotope leak detection: }[=)sb_
4-5荧光检漏fluorescence leak detection 8`wKq6
7. 1.一般术语 E4'z
1-1真空干燥vacuum drying: ${rWDZ0Z
1-2冷冻干燥freeze drying : O')=]6CQ*
1-3物料material: %
H<@Y$r
1-4待干燥物料material to be dried: )Ii`/I^
1-5干燥物料dried material : 764eXh
1-6湿气moisture;humidity: Vh1y]#w
1-7自由湿气free moisture: %JH/|mA&|
1-8结合湿气bound moisture: !x:{"
1-9分湿气partial moisture: !C|Z+w9Y
1-10含湿量moisture content: PhPe7^
1-11初始含湿量initial moisture content: j
sD]v)LB
1-12最终含湿量final residual moisture: C>'G?
1-13湿度degree of moisture ,degree of humidity : Bd 0oA
)i
1-14干燥物质dry matter : %wXjP`#
1-15干燥物质含量content of dry matter: sv&^sARN
Qv`: E
2.干燥工艺 [y}h
2-1干燥阶段stages of drying : Td|u-9OM
(1).预干燥preliminary dry: ;5.<M<PH
(2).一次干燥(广义)primary drying(in general): /CH]'u^j
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): pY[b[ezb
(4).二次干燥secondary drying: `K:n=hpF
2-2.(1).接触干燥contact drying: /E2P
(2).辐射干燥 drying by radiation : ~1E!Co
(3).微波干燥microwave drying: IdMwpru(
(4).气相干燥vapor phase drying: G'u[0>
(5).静态干燥static drying: <;yS&8
(6).动态干燥dynamic drying: )-ojm$
2-3干燥时间drying time: 5|~nX8>
2-4停留时间length of stay(in the drying chamber):
EADN
2-5循环时间cycle time: xJAQ'ANr
2-6干燥率 dessication ratio : XI|k,Ko<
2-7去湿速率mass flow rate of humidity: Dn@ZS _f
2-8单位面积去湿速率mass flow rate of humidity per surface area: n$XEazUb0N
2-9干燥速度 drying speed : Wz#Cyjo
2-10干燥过程drying process: uY(8KW
2-11加热温度heating temperature: @C!&lrf3
2-12干燥温度temperature of the material being dried : 6Q\|8a
2-13干燥损失loss of material during the drying process : _WvVF*Q"k
2-14飞尘lift off (particles): BgD3P.;[
2-15堆层厚度thickness of the material: a]7g\rg)
y2#"\5dC
3.冷冻干燥 PVH Or^
3-1冷冻freezing: i}zz!dJTE
(1).静态冷冻static freezing: S5u$I
(2).动态冷冻dynamic freezing:
6WT3-@d
(3).离心冷冻centrifugal freezing: Bm,Vu 1]t
(4).滚动冷冻shell freezing: |&{S ~^$
(5).旋转冷冻spin-freezing: j'U1lEZm2
(6).真空旋转冷冻vacuum spin-freezing: 6pSTw\/6
(7).喷雾冷冻spray freezing: Y2XxfZj
(8).气流冷冻air blast freezing: 2"?D aX
3-2冷冻速率rate of freezing: #) :.1Z?
3-3冷冻物料frozen material: g)^s+Y
3-4冰核ice core: EnlAgL']|
3-5干燥物料外壳envelope of dried matter: vG'#5%,|
3-6升华表面sublimation front: M;Pry3J
3-7融化位置freezer burn: jc )7FE
I/O/*^T
4.真空干燥设备;真空冷冻干燥设备 [tof+0Y6
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: ,pI9=e@O/z
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: O^=+"O]
4-3加热表面heating surface: MTCfs~}m
4-4物品装载面shelf : !L9OJ1F
4-5干燥器的处理能力throughput (of the vacuum drying chamber): ^Z#G_%\Y:
4-6单位面积干燥器处理能力throughput per shelf area: ,8Po
_[
4-7冰冷凝器ice condenser: _"B.V(
4-8冰冷凝器的负载load of the ice condenser: GJZjQH-#P
4-9冰冷凝器的额定负载rated load of the ice condenser 3: WEODV2
8. 1.一般术语 ("t'XKP&N
1-1试样sample : #:0-t!<0C
(1).表面层surface layer: aIFlNS,y
(2).真实表面true surface: `j@1]%&z
(3).有效表面积effective surface area: w-e{_R
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: C{pOGc@
(5).表面粒子密度surface particle density: 5 | , b
(6).单分子层monolayer: YwET.(oo
(7).表面单分子层粒子密度monolayer density: ;10YG6:
(8).覆盖系数coverage ratio: i(;`x
1-2激发excitation: YIg43Av
(1).一次粒子primary particle: 0=3)`v{S@
(2).一次粒子通量primary particle flux: u-,}ug|
(3).一次粒子通量密度density of primary particle flux: PjEJC@n
(4).一次粒子负荷primary particle load: G2kU_
(5).一次粒子积分负荷integral load of primary particle: /Yp#`}Ii
(6).一次粒子的入射能量energy of the incident primary particle: SDil\x
(7).激发体积excited volume: vuPNru" 2
(8).激发面积excited area: $~.YB\3
(9).激发深度excited death: [z2UfHpt~
(10).二次粒子secondary particles: z``wqK
(11).二次粒子通量secondary particle flux: 6 Ln~b <I
(12).二次粒子发射能energy of the emitted secondary particles: ap}p?r
(13).发射体积emitting volume: 3r kcIVO
(14).发射面积emitting area: A\Ib
(15).发射深度emitting depth: Q l)hIf$Oo
(16).信息深度information depth: 4($"4>BA
(17).平均信息深度mean information depth: Ha-]U:Vcx
1-3入射角angle of incidence: ( ~5M{Xh
1-4发射角angle of emission: (?\+
1-5观测角observation: 1Y'4 g3T
1-6分析表面积analyzed surface area: `9K5 ;]
1-7产额 yield : 6EyPZ{
1-8表面层微小损伤分析minimum damage surface analysis: ]qv0Y~+`-K
1-9表面层无损伤分析non-destructive surface analysis: $!.>)n
1-10断面深度分析 profile analysis in depth; depth profile analysis : NgGMsE\C}
1-11可观测面积observable area: `2s@O>RV
1-12可观测立体角observable solid angle : dn-
[Gnde
1-13接受立体角;观测立体角angle of acceptance: 2r!ltG3}
1-14角分辨能力angular resolving power: UrvUt$WO
1-15发光度luminosity: KN|<yF
1-16二次粒子探测比detection ratio of secondary particles: mfQ#n!{ZH
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: 8-nf4=ll
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: <@-O06
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: gfg,V.:
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: B]"`}jn
1-21本底压力base pressure: |^1U<'oM#
1-22工作压力working pressure: #%p44%W
XJ4f;U
2.分析方法 f*XCWr
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: w_56y8Pd4
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : QE(.w
dHP
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: 7a'yO+7-)
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: A ]A{HEX
2-3离子散射表面分析ion scattering spectroscopy: #4'wF4DR@
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: %MjoY_<:_
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: ;AEfU^[
2-6离子散射谱仪ion scattering spectrometer: 0!|d .jZI
2-7俄歇效应Auger process: (E0
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: XX~vg>3_
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: neI7VbH4
2-10光电子谱术photoelectron spectroscopy : 9Lb96K?=>
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: 1XSnnkJm
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: :*''ci
2-11光电子谱仪photoelectron spectrometer: ^}=)jLS
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: sW]^YT>?
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: w==BSH[
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): e,p"=/!aY
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus