“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 /50g3?X,
--------------------------------------------------- DQ n`@
真空术语 -e`oW.+
aX[1H6&=7
1.标准环境条件 standard ambient condition: a$xeiy9
2.气体的标准状态 standard reference conditions forgases: <>T&ab@dE(
3.压力(压强)p pressure: L)R[)$2(g
4.帕斯卡Pa pascal: +C'TW^
5.托Torr torr: StdS$XW
6.标准大气压atm standard atmosphere: 4(Cd
7.毫巴mbar millibar: r{_B:
8.分压力 partial pressure: { /F rs*AF
9.全压力 total pressure: t4jd
KYA
10.真空 vacuum: _\4`
11.真空度 degree of vacuum: n ,&/D
12.真空区域 ranges of vacuum:
pT3X/ra
13.气体 gas: ~<2 IIR$H
14.非可凝气体 non-condensable gas: k"q!|+&Fs
15.蒸汽vapor: 8z."X$
16.饱和蒸汽压saturation vapor pressure: !y
qa?\v9
17.饱和度degree of saturation: j]!7B HC
18.饱和蒸汽saturated vapor: 9k=U0]!ch
19.未饱和蒸汽unsaturated vapor: FUyB"-<
20.分子数密度n,m-3 number density of molecules: (<bm4MPf
21.平均自由程ι、λ,m mean free path: |2
YubAIZ(
22.碰撞率ψ collision rate: F}6DB*
23.体积碰撞率χ volume collision rate: #hD}S~
24.气体量G quantity of gas: {uaZ<4N.
25.气体的扩散 diffusion of gas: 0|fb< "
26.扩散系数D diffusion coefficient; diffusivity: <fC@KY>#
27.粘滞流 viscous flow: Ge^zX$.'
28.粘滞系数η viscous factor: )h>\05|T
29.泊肖叶流 poiseuille flow: 7K>D@O
30.中间流 intermediate flow: L25kh}Q#7
31.分子流 molecular flow:
#gW /qJ
32克努曾数 number of knudsen: k#axt
Sc
33.分子泻流 molecular effusion; effusive flow: h&=O-5
34.流逸 transpiration: biK)&6|`sa
35.热流逸 thermal transpiration: Pl rkgS0J
36.分子流率qN molecular flow rate; molecular flux: ibd$%;bX3
37.分子流率密度 molecular flow rate density; density of molecular flux: P"(z jG9-
38.质量流率qm mass flow rare: e/"yGQu
39.流量qG throughput of gas: oUJj5iu}
40.体积流率qV volume flow rate: ADv^eJJ|
41.摩尔流率qυ molar flow rate: u* t,i`
42.麦克斯韦速度分布 maxwellian velocity distribution: {fGd:2dh
43.传输几率Pc transmission probability: prNhn:j
44.分子流导CN,UN molecular conductance: Vq3gceo'0A
45.流导C,U conductance: <Rcu%&;i
46.固有流导Ci,Ui intrinsic conductance: ?S (im
47.流阻W resistance: 7d&DrI@~
48.吸附 sorption: Ds%9cp*6
49.表面吸附 adsorption: R)0N0gH
50.物理吸附physisorption: A6Ghj{~
51.化学吸附 chemisorption: o&(wg(Rv
52.吸收absorption: YBb)/ZghY
53.适应系数α accommodation factor: z$JX'(<Z7
54.入射率υ impingement rate: QWrIa1.JC
55.凝结率condensation rate: LHs-&
56.粘着率 sticking rate: J|VK P7
57.粘着几率Ps sticking probability: 2
;JQX!
58.滞留时间τ residence time: Ye9Y^+-
59.迁移 migration: c_
La^HS
60.解吸 desorption: ShQ|{P9
61.去气 degassing: ?Bo?JMV
62.放气 outgassing: nz4<pvC,*
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: 0cHfxy3
64.蒸发率 evaporation rate: sX+`wc
65.渗透 permeation: ;{|X,;s
66.渗透率φ permeability: ;Vg^!]LL#
67.渗透系数P permeability coefficient t)YUPDQ@J
2. 1.真空泵 vacuum pumps rh@r\H@j
1-1.容积真空泵 positive displacement pump: #
;K,,ku
x
⑴.气镇真空泵 gas ballast vacuum pump: Vclr)}5
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: ~12_D'8D[
⑶.干封真空泵 dry-sealed vacuum pump: S_J,[#&
⑷.往复真空泵 piston vacuum pump: t/}L36@+
⑸.液环真空泵 liquid ring vacuum pump: (+*
][|T
⑹.旋片真空泵 sliding vane rotary vacuum pump: {P-xCmZ~Wt
⑺.定片真空泵 rotary piston vacuum pump: u*2fP]n
⑻.滑阀真空泵 rotary plunger vacuum pump: ^YGTh0$W
⑼.余摆线真空泵 trochoidal vacuum pump: M\Se_
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: ;HDZ+B
⑾.罗茨真空泵 roots vacuum pump: 3gAR4
1-2.动量传输泵 kinetic vacuum pump: \V,c]I
⑴.牵引分子泵molecular drag pump: tQWWgLM
⑵.涡轮分子泵turbo molecular pump: ipobr7G.SD
⑶.喷射真空泵ejector vacuum pump: [F+(^- (
⑷.液体喷射真空泵liquid jet vacuum pump: r'/\HWNP
⑸.气体喷射真空泵gas jet vacuum pump: nX|Q~x]
⑹.蒸汽喷射真空泵vapor jet vacuum pump : _a](V6
⑺.扩散泵diffusion pump : Ly;I,)w
⑻.自净化扩散泵self purifying diffusion pump: Hou*lCA
⑼.分馏扩散泵 fractionating diffusion pump : IV'p~t
⑽.扩散喷射泵diffusion ejector pump : w5`#q&?
⑾.离子传输泵ion transfer pump: iv*V#J>
1-3.捕集真空泵 entrapment vacuum pump: owvS/"@
⑴吸附泵adsorption pump: # ly@;!M
⑵.吸气剂泵 getter pump: ?~J i-{#X
⑶.升华(蒸发)泵 sublimation (evaporation)pump : 69-:]7.g
⑷.吸气剂离子泵getter ion pump: N2BI_,hI1
⑸.蒸发离子泵 evaporation ion pump: k;k}qq`d
⑹.溅射离子泵sputter ion pump: ?]c+j1i
⑺.低温泵cryopump: ,M QVE
4WC9US-k
2.真空泵零部件 wJe?t$ac?
2-1.泵壳 pump case: =. *98
2-2.入口 inlet: re^Hc(8M
2-3.出口outlet: Q$~n/
2-4.旋片(滑片、滑阀)vane; blade : U&UKUACn"
2-5.排气阀discharge valve:
B/G-Yh$E
2-6.气镇阀gas ballast valve: MoD?2J
2-7.膨胀室expansion chamber: T>A{qu
2-8.压缩室compression chamber: ]ab#q=
2-9.真空泵油 vacuum pump oil: E V2 )
2-10.泵液 pump fluid: 2?W7I/F
2-11.喷嘴 nozzle: |Y},V_@d
2-13.喷嘴扩张率nozzle expansion rate: a8pY[)^c
2-14.喷嘴间隙面积 nozzle clearance area : [ %}u=}@
2-15.喷嘴间隙nozzle clearance: j?6X1cM q
2-16.射流jet: wG1l+^p
2-17.扩散器diffuser: er2cQS7R
2-18.扩散器喉部diffuser thoat: 06 i;T~Y
2-19.蒸汽导管vapor tube(pipe;chimney): \}5p0.=
2-20.喷嘴组件nozzle assembly: `pL^}_>|GM
2-21.下裙skirt: >xqM5#m`E$
m}3gZu]
3.附件 .$!{-v[
3-1阱trap: `]=oo%(h
⑴.冷阱 cold trap: \L # INP4~
⑵.吸附阱sorption trap: G_ >G'2
⑶.离子阱ion trap: S QY"OBo<e
⑷.冷冻升华阱 cryosublimation trap: 4nqoZk^R
3-2.挡板baffle: &H||&Z[pk
3-3.油分离器oil separator: krB'9r<wa`
3-4.油净化器oil purifier: oH#v6{y
3-5.冷凝器condenser: }tG3tz0%fX
-F\qnsZ2
4.泵按工作分类 4-R^/A0
4-1.主泵main pump: ^e Gue
4-2.粗抽泵roughing vacuum pump: ;@3FF
4-3.前级真空泵backing vacuum pump: En6H%^d2
4-4.粗(低)真空泵 roughing(low)vacuum pump: qQ0C ?
4-5.维持真空泵holding vacuum pump: T6#CK
4-6.高真空泵high vacuum pump: -c%dvck^,
4-7.超高真空泵ultra-high vacuum pump: 2HD]?:Fk7
4-8.增压真空泵booster vacuum pump: R@iUCT^$
pI.+"Hz
5.真空泵特性 ;sPoUn
s'
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: mee$"Y
5-2.真空泵的抽气量Q throughput of vacuum pump:。 l@JSK;
5-3.起动压力starting pressure: &fOdlQ?
5-4.前级压力 backing pressure : EH*o"N`!r
5-5.临界前级压力 critical backing pressure: .8WXC
5-6.最大前级压力maximum backing pressure: <7_KeOLJ
5-7.最大工作压力maximum working pressure: 52_#
5-8.真空泵的极限压力ultimate pressure of a pump: Q=uR Kh
5-9.压缩比compression ratio: 1ocJ+
5-10.何氏系数Ho coefficient: G:W>I=^DaR
5-11.抽速系数speed factor: (ljF{)Ml+=
5-12.气体的反扩散back-diffusion of gas: $wB^R(f@
5-13.泵液返流back-streaming of pump fluid: (X[CsaXt
5-14.返流率back-streaming rate 5O/i3m26
5-15.返迁移back-migration: MJ`3ta
5-16.爆腾bumping: en F :>H4
5-17.水蒸气允许量qm water vapor tolerable load: SqA
J-_~
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: .7NNT18
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: '8 Ztj
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump nmU_N:Y
3. 1.一般术语 a:,y
Z
1-1.压力计pressure gauge: I6!5Yj]O"
1-2.真空计vacuum gauge: bx4'en#
⑴.规头(规管)gauge head: 'XrRhF
(
⑵.裸规nude gauge : N6OMYP1
⑶.真空计控制单元gauge control unit : N2'qpxOLI
⑷.真空计指示单元gauge indicating unit : {c?JuV4q?
Ny- [9S-<
2.真空计一般分类 !$;a[Te
2-1.压差式真空计differential vacuum gauge: I04jjr:<
2-2.绝对真空计 absolute vacuum gauge: I){\0vb@
2-3.全压真空计total pressure vacuum gauge: v1JS~uDz
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: |'O[7uT
2-5.相对真空计relative vacuum gauge : V
r(J+1@
$?G"GQ!.
3.真空计特性 qBV x6MI
3-1.真空计测量范围pressure range of vacuum gauge: $''?HjB}T
3-2.灵敏度系数sensitivity coefficient: =J-5.0Q\_\
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): 57a2^
3-5.规管光电流photon current of vacuum gauge head: b-U
eIjX
3-6.等效氮压力equivalent nitrogen pressure : 1n5(S<T
3-7.X射线极限值 X-ray limit: >T2LEW
3-8.逆X射线效应anti X-ray effect: ,#FLM`
3-9.布利尔斯效应blears effect: B
vo5-P6XY
~\)qi=
4.全压真空计 :A
%^^F%
4-1.液位压力计liquid level manometer: 3A:q7#m
4-2.弹性元件真空计elastic element vacuum gauge: W7"{r)7
4-3.压缩式真空计compression gauge: *[ #;j$m
4-4.压力天平pressure balance: 3f" %G\
4-5.粘滞性真空计viscosity gauge : n79QJl/
4-6.热传导真空计thermal conductivity vacuum gauge : znJhP}(
4-7.热分子真空计thermo-molecular gauge: Q|Y0,1eVp|
4-8.电离真空计ionization vacuum gauge: $Nrm!/)*'}
4-9.放射性电离真空计radioactive ionization gauge: }G o$
\Bk
4-10.冷阴极电离真空计cold cathode ionization gauge: fkSO( C)
4-11.潘宁真空计penning gauge: !Cgx.
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: <!-sZ_qq
4-13.放电管指示器discharge tube indicator: KrVcwAcq|1
4-14.热阴极电离真空计hot cathode ionization gauge: ih,%i4<}6m
4-15.三极管式真空计triode gauge: ^;,M}|<h
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: =S '%`] f?
4-17.B-A型电离真空计Bayard-Alpert gauge: g4`Kp;}&'
4-18.调制型电离真空计modulator gauge: D jk C
4-19.抑制型电离真空计suppressor gauge: dY?`f<*
4-20.分离型电离真空计extractor gauge: gqXS~K9t
4-21.弯注型电离真空计bent beam gauge: iwz
4-22.弹道型电离真空计 orbitron gauge : /525w^'pd
4-23.热阴极磁控管真空计hot cathode magnetron gauge: gBT2)2]
!US d9
5.分压真空计(分压分析器) du$|lxC
5-1.射频质谱仪radio frequency mass spectrometer: g %K>
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: Om{l>24i.\
5-3.单极质谱仪momopole mass spectrometer: {3})=>u:S
5-4.双聚焦质谱仪double focusing mass spectrometer: Wg{k$T_>
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: q~CA0AR
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: u2oKH{/z
5-7.回旋质谱仪omegatron mass spectrometer: PJxH7|GSi
5-8.飞行时间质谱仪time of flight mass spectrometer: `%+ mO88o
yC
77c=
6.真空计校准 K{n{KB&_&
6-1.标准真空计reference gauges: -a*K$rnB
6-2.校准系统system of calibration: 4Mk-2 Dx
6-3.校准系数K calibration coefficient: Z_\C*^
6-4.压缩计法meleod gauge method: QL6C,#6
6-5.膨胀法expansion method: &//wSlL3
6-6.流导法flow method: ^F?&|clM/
4. 1.真空系统vacuum system UobyK3.%
1-1.真空机组pump system: ThPE
0V
1-2.有油真空机组pump system used oil : Dnc(l(
1-3.无油真空机组oil free pump system Z/rP"|EuQ
1-4.连续处理真空设备continuous treatment vacuum plant: NmMIQ@K
1-5.闸门式真空系统vacuum system with an air-lock: gP+fN$5'd
1-6.压差真空系统differentially pumped vacuum system: +,~zWv1v
1-7.进气系统gas admittance system: VG/3xR&y
AiD[SR
2.真空系统特性参量 BpX6aAx
2-1.抽气装置的抽速volume flow rate of a pumping unit : s1|/S\
2-2.抽气装置的抽气量throughput of a pumping unit : pJN$ {
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: ,=?{("+
2-4.真空系统的漏气速率leak throughput of a vacuum system: _gKe%J&
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: XeBP`\>Ve
2-6.极限压力ultimate pressure: OL_{_K(w
2-7.残余压力residual pressure: $}")1|U,X
2-8.残余气体谱residual gas spectrum: lL]y~u
2-9.基础压力base pressure: T~h5B(J;
2-10.工作压力working pressure: GUsl PnG
2-11.粗抽时间roughing time: }|%eCVB
2-12.抽气时间pump-down time: 4v[~r1!V
2-13.真空系统时间常数time constant of a vacuum system: -,K!
2-14.真空系统进气时间venting time: eNiaM6(J
[r/k% <
3.真空容器 zhY+x<-
3-1.真空容器;真空室vacuum chamber: 1-RIN}CSd
3-2.封离真空装置sealed vacuum device: EyY.KxCB
3-3.真空钟罩vacuum bell jar: ]kG(G%r|M
3-4.真空容器底板vacuum base plate: zE;bBwy&
3-5.真空岐管vacuum manifold: E^U0f/5
m
3-6.前级真空容器(贮气罐)backing reservoir: @
P|LLG'
3-7.真空保护层outer chamber: fO#vF.k%
3-8.真空闸室vacuum air lock: T{wuj[Q#:
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: AkOO)0
dMR3)CO
4.真空封接和真空引入线 h*ZC*eV>
4-1.永久性真空封接permanent seal : =IAsH85Q
4.2.玻璃分级过渡封接graded seal : Gycm,Cy
4-3.压缩玻璃金属封接compression glass-to-metal seal: QRLt9L
4-4.匹配式玻璃金属封接matched glass-to-metal seal: 9'hv%A:\3
4-5.陶瓷金属封接ceramic-to-metal seal: bI|2@HV2
4-6.半永久性真空封接semi-permanent seal : YJ(*wByM
4-7.可拆卸的真空封接demountable joint: A)ipFB
6K
4-8.液体真空封接liquid seal t43)F9!
4-9.熔融金属真空封接molten metal seal: m|OO,gR
4-10.研磨面搭接封接ground and lapped seal: BB|?1"neg
4-11.真空法兰连接vacuum flange connection: >vo=]cw
4-12.真空密封垫vacuum-tight gasket: "vtCTl~t
4-13.真空密封圈ring gasket: !'LW_@
4-14.真空平密封垫flat gasket: TIvRhbu
4-15.真空引入线feedthrough leadthrough: kA7mLrON
4-16.真空轴密封shaft seal: v@# b}N0n
4-17.真空窗vacuum window: H4]Ul
eU
4-18.观察窗viewing window: %,ngRYxT#
-GLMmZJt
5.真空阀门 Ali9pvE
5-1.真空阀门的特性characteristic of vacuum valves: 7t.!lh5G%
⑴.真空阀门的流导conductance of vacuum valves: /PsnD_s]5
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: ^]
kF{
o?
5-2.真空调节阀regulating valve: ytNO*XoR
5-3.微调阀 micro-adjustable valve: C!7>1I~5
5-4.充气阀charge valve: :T9<der,
5-5.进气阀gas admittance valve: vOg#Dqn-
5-6.真空截止阀break valve: _ 84ut
5-7.前级真空阀backing valve: ^U]UqX`
5-8.旁通阀 by-pass valve: 1{P'7IEj
5-9.主真空阀main vacuum valve: : _QCfH
5-10.低真空阀low vacuum valve: IUtx!.]4
5-11.高真空阀high vacuum valve: 9uWY@zu
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: =N 5z@;!
5-13.手动阀manually operated valve: yv)ux:P&+
5-14.气动阀pneumatically operated valve: 4V~?.
5-15.电磁阀electromagnetically operated valve:
YtO|D
5-16.电动阀valve with electrically motorized operation: aN(|'uO@
5-17.挡板阀baffle valve: /a6Xa&(B
5-18.翻板阀flap valve: .H,xle
5-19.插板阀gate valve: ;t+ub8
5-20.蝶阀butterfly valve: Afk$?wkL
m>SErxU(z
6.真空管路 |.wEm;Bz
6-1.粗抽管路roughing line: >$ 2V%};
6-2.前级真空管路backing line: V%Sy"IG
6-3.旁通管路;By-Pass管路 by-pass line: ^%`wJ.c
6-4.抽气封口接头pumping stem: hdVdcnM
6-5.真空限流件limiting conductance: -1J[n0O.
6-6.过滤器filter: fNrgdfo
5. 1.一般术语 ~jsLqY*(+
1-1真空镀膜vacuum coating: Ge<nxl<Bd
1-2基片substrate: a. z;t8
1-3试验基片testing substrate: <\;#jF%V
1-4镀膜材料coating material: wg w(YU
1-5蒸发材料evaporation material: GH[wv<
1-6溅射材料sputtering material: \m1~jMz*>k
1-7膜层材料(膜层材质)film material: !A%<#Gjt
1-8蒸发速率evaporation rate: }*L(;r)q
1-9溅射速率sputtering rate: %AQIGBcgL
1-10沉积速率deposition rate: 7NJhRz`_
1-11镀膜角度coating angle: 2,*M|+W~
RZ+`T+zL
2.工艺 [}&Sxgv
2-1真空蒸膜vacuum evaporation coating: xNbPsoK
(1).同时蒸发simultaneous evaporation: A,4fEmWM
(2).蒸发场蒸发evaporation field evaporation: ~s5SZK*
(3).反应性真空蒸发reactive vacuum evaporation: [p<w._b i
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: 8Ac:_Zg
(5).直接加热的蒸发direct heating evaporation: db6mfxi
(6).感应加热蒸发induced heating evaporation: @*sWu_-Y%
(7).电子束蒸发electron beam evaporation: AnT3M.>ek
(8).激光束蒸发laser beam evaporation: _8E/)M
(9).间接加热的蒸发indirect heating evaporation: e;(0(rI
(10).闪蒸flash evaportion: l'eyq}&
2-2真空溅射vacuum sputtering: [KxF'm z9
(1).反应性真空溅射 reactive vacuum sputtering: pxa(
(2).偏压溅射bias sputtering: s;A@*Y;v
(3).直流二级溅射direct current diode sputtering: KRA/MQ^7~U
(4).非对称性交流溅射asymmtric alternate current sputtering: k5T,990
(5).高频二极溅射high frequency diode sputtering: zE_i*c"`
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: Ih"XV
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: CvD"sHVq%
(8).离子束溅射ion beam sputtering: 87YyDWTn
(9).辉光放电清洗glow discharge cleaning: Bs?^2T~%{
2-3物理气相沉积PVD physical vapor deposition: 4F{70"a
2-4化学气相沉积CVD chemical vapor deposition: ^(FdXGs[
2-5磁控溅射magnetron sputtering:
)KAEt.
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: \o^2y.q:>
2-7空心阴极离子镀HCD hollow cathode discharge deposition: r
>nG@A
2-8电弧离子镀arc discharge deposition: m|G'K[8
o !U
6?
3.专用部件 ^N)R=tl
3-1镀膜室coating chamber: y_?Me]
3-2蒸发器装置evaporator device: ){b@}13cF
3-3蒸发器evaporator: :*KHx|Q
3-4直接加热式蒸发器evaporator by direct heat: 2=^m9%
3-5间接加热式蒸发器evaporator by indirect heat: >m$ 1+30X
3-7溅射装置sputtering device: .Fp4:
e
3-8靶target:
>=-(UA
3-10时控挡板timing shutter: J7g8D{4
3-11掩膜mask: sL$:"=
3-12基片支架substrate holder: ^RI?ybDd
3-13夹紧装置clamp: @qYp>|AF
3-14换向装置reversing device: H7DJ~z~J
3-15基片加热装置substrate heating device: sjV!5Z
3-16基片冷却装置substrate colding device: 5wDg'X]>V
K9up:.{QQ
4.真空镀膜设备 2_Z ? #Y
4-1真空镀膜设备vacuum coating plant: <Pi|J-Y
(1).真空蒸发镀膜设备vacuum evaporation coating plant: 6g)GY"49
(2).真空溅射镀膜设备vacuum sputtering coating plant: =aTv! 8</
4-2连续镀膜设备continuous coating plant: !/]WrGqbS
4-3半连续镀膜设备semi- continuous coating plant ?snp8W-WB
6. 1.漏孔 |Ur"&
Z{
1-1漏孔leaks: ZG&>:Si;
1-2通道漏孔channel leak: r<d_[?1N
1-3薄膜漏孔membrane leak: Xx>X5Fy
1-4分子漏孔molecular leak: #*UN >X
1-5粘滞漏孔vixcous leak: P`cq H(
1-6校准漏孔calibrated leak: CTZ8Da^
1-7标准漏孔reference leak : Jh!I:;/
1-8虚漏virtual leak: @/ohg0
1-9漏率leak rate: 2|*JSU.I
1-10标准空气漏率standard air leak rate: oc >{?.^
1-11等值标准空气漏率equivalent standard air leak rate: G\+L~t
1-12探索(示漏)气体:
t!_<~
,tu.2VQc@
2.本底 #ZrHsfP
2-1本底background: o9dY9o+Z
2-2探索气体本底search gas background : N@Uy=?)ZJ
2-3漂移drift: lSVp%0jR
2-4噪声noise: _v> }_S
Evg_q>
3.检漏仪 %2{%Obp'
3-1检漏仪leak detector: ud'-;W
3-2高频火花检漏仪H.F. spark leak detector: .Z
`av n
3-3卤素检漏仪halide leak detector: 1oWED*B
3-4氦质谱检漏仪helium mass spectrometer leak detector: [R^iF
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: U"^kH|
9 %I?).5
4.检漏 %|q>pin2
4-1气泡检漏leak detection by bubbles: ]\hSI){
4-2氨检漏leak detection by ammonia: [`"ZjkR_J
4-3升压检漏leak detection of rise pressure: 0vD7v
4-4放射性同位素检漏radioactive isotope leak detection: 1e{IC=
4-5荧光检漏fluorescence leak detection ij( B,Y
7. 1.一般术语 E^/t$M|H
1-1真空干燥vacuum drying: <(fRn`)PT
1-2冷冻干燥freeze drying : }o?AP vd
1-3物料material: LcTt)rs
f
1-4待干燥物料material to be dried: `-J%pEIza
1-5干燥物料dried material : i/`m`qdg
1-6湿气moisture;humidity: qGB{7-r u
1-7自由湿气free moisture: lJ}_G>GJ
1-8结合湿气bound moisture: ?IqQ-C)6D
1-9分湿气partial moisture: R\G0'?h
>
1-10含湿量moisture content: sHt].gZ
1-11初始含湿量initial moisture content: 2q=AEv/
1-12最终含湿量final residual moisture: zck#tht4
n
1-13湿度degree of moisture ,degree of humidity : g4=pnK8
1-14干燥物质dry matter : aJbO((%$|u
1-15干燥物质含量content of dry matter: :*Z4yx
{E9+WFz5
2.干燥工艺 Ez
fN&8E
2-1干燥阶段stages of drying : }Mp:JPH&S4
(1).预干燥preliminary dry: ;Q OBBF3HG
(2).一次干燥(广义)primary drying(in general): >_-s8t=|
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): l3Q(TH ~I
(4).二次干燥secondary drying: g9}DnCT*.
2-2.(1).接触干燥contact drying: /'l{E
(2).辐射干燥 drying by radiation : lhAX;s&9
(3).微波干燥microwave drying: j7$e28|_n
(4).气相干燥vapor phase drying: jHE}qE~>5
(5).静态干燥static drying: i@)i$i4
(6).动态干燥dynamic drying: aW)-?(6>
2-3干燥时间drying time: @s ?
2-4停留时间length of stay(in the drying chamber): N~goI#4
2-5循环时间cycle time: ao1(]64X"
2-6干燥率 dessication ratio : Dwr)0nk
2-7去湿速率mass flow rate of humidity: ODNM+#}`
2-8单位面积去湿速率mass flow rate of humidity per surface area: =[cS0Sy
2-9干燥速度 drying speed : n22zq6m
2-10干燥过程drying process: bMg(B-uF7
2-11加热温度heating temperature: 4:$4u@
2-12干燥温度temperature of the material being dried : 6}[I2F_^
2-13干燥损失loss of material during the drying process : aQ?/%\>
2-14飞尘lift off (particles): iNtaDX|%/
2-15堆层厚度thickness of the material: "d#Y}@*~o
AS'R?aX|C
3.冷冻干燥 Z_};|B}
3-1冷冻freezing: 7~^GA.92
(1).静态冷冻static freezing: %Gz0^[+
(2).动态冷冻dynamic freezing: nm5cpnNl
(3).离心冷冻centrifugal freezing: Fq~yL!#!
(4).滚动冷冻shell freezing: J%v=yBC2
(5).旋转冷冻spin-freezing: J>wt(] y
(6).真空旋转冷冻vacuum spin-freezing: 9YIM'q>`v
(7).喷雾冷冻spray freezing: [R(`W#W
(8).气流冷冻air blast freezing: D0&,?
3-2冷冻速率rate of freezing: X^}I-M%{m
3-3冷冻物料frozen material: =9y[1t
3-4冰核ice core: b~KDP+Ri
3-5干燥物料外壳envelope of dried matter: ieDk ;
3-6升华表面sublimation front: 2,$8icM
3-7融化位置freezer burn: gPNZF\ r
jaTh^L
4.真空干燥设备;真空冷冻干燥设备 we~[ ]
\
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: kO.%9wFbz
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: -BrMp%C
4-3加热表面heating surface: j"ThEx0
4-4物品装载面shelf : #C~+JL
4-5干燥器的处理能力throughput (of the vacuum drying chamber): GY6`JWk
4-6单位面积干燥器处理能力throughput per shelf area: mXRB7k
4-7冰冷凝器ice condenser: [-65PC4aN
4-8冰冷凝器的负载load of the ice condenser: 3KRd
4-9冰冷凝器的额定负载rated load of the ice condenser ]
bM)t<
8. 1.一般术语 YIn',]p:
1-1试样sample : ?{P"O!I{
(1).表面层surface layer: #a/5SZP
Z\
(2).真实表面true surface: a]JYDq`,3
(3).有效表面积effective surface area: "cE7
5
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: q.KG^=10
(5).表面粒子密度surface particle density: %+@O#P
(6).单分子层monolayer: .Xfq^'I[
(7).表面单分子层粒子密度monolayer density: ''q@>
(8).覆盖系数coverage ratio: _GXk0Ia3`
1-2激发excitation: HmiR.e%<b
(1).一次粒子primary particle: *]ly0nP
(2).一次粒子通量primary particle flux: YZL kL26[
(3).一次粒子通量密度density of primary particle flux: B -?6M6#
(4).一次粒子负荷primary particle load: "Q}#^h]F
(5).一次粒子积分负荷integral load of primary particle: 1t:Q_j0Ym
(6).一次粒子的入射能量energy of the incident primary particle: 0IwA#[m1`
(7).激发体积excited volume: !POl;%\
(8).激发面积excited area: ~ZmN44?R
(9).激发深度excited death: hEA<o67
(10).二次粒子secondary particles: chcbd
y>C
(11).二次粒子通量secondary particle flux: s[M?as
(12).二次粒子发射能energy of the emitted secondary particles: Vi>,kF.fV
(13).发射体积emitting volume: |jQ:~2U|
(14).发射面积emitting area: T}Km?d
(15).发射深度emitting depth: 8qk?E6
(16).信息深度information depth: K#%&0D!
(17).平均信息深度mean information depth: NTdixfR
1-3入射角angle of incidence: 8>trS=;n
1-4发射角angle of emission: K$&s=Hm
1-5观测角observation: 6%'.A]"
1-6分析表面积analyzed surface area: ~qcNEl\-y
1-7产额 yield : q$ZHd
1-8表面层微小损伤分析minimum damage surface analysis: HKU~UTRnZ
1-9表面层无损伤分析non-destructive surface analysis: KX76UW
1-10断面深度分析 profile analysis in depth; depth profile analysis : o>).Cj
1-11可观测面积observable area: zjJ *n8l
1-12可观测立体角observable solid angle : VvvRRP^q
1-13接受立体角;观测立体角angle of acceptance: *i\Qo
1-14角分辨能力angular resolving power: ?+_Gs;DGVE
1-15发光度luminosity: J4QXz[dG
1-16二次粒子探测比detection ratio of secondary particles: 8qY79)vD4E
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: w zYzug
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: 33o9Yg|J~
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: \.C+ue
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: xO$lsZPG
1-21本底压力base pressure: `e(c^ z#
1-22工作压力working pressure: VeGL)
udxFz2>_l$
2.分析方法 J,V9k[88
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: 7R`M,u~f2^
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : *?Lv3}E
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: ~?D4[D|sB
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: Te.Y#lCT$
2-3离子散射表面分析ion scattering spectroscopy: m`v2: S}
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: t`WB;o!
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: %dRo^E1p
2-6离子散射谱仪ion scattering spectrometer: DQNnNsP:M-
2-7俄歇效应Auger process: lphFhxJA{
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: `{eyvW[Ks
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: M9Cv
wMi
2-10光电子谱术photoelectron spectroscopy : L;
T8?+ x
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: u6M.'
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: o4`hY/<t
2-11光电子谱仪photoelectron spectrometer: ;,$NAejgd
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: k>F'ypm
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: +awW3^1Ed
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): , R'@%,/
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus