“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 q[nX<tO
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真空术语 !%_Z>a
H ZIJKk(
1.标准环境条件 standard ambient condition: z"u4t.KpL
2.气体的标准状态 standard reference conditions forgases: &eG,CIT
3.压力(压强)p pressure: jmmm0,#D
4.帕斯卡Pa pascal: ;M{ @23?`
5.托Torr torr: }>=k!l{
6.标准大气压atm standard atmosphere: YW}q@AY7
7.毫巴mbar millibar: ;+g
p#&i`
8.分压力 partial pressure:
5 .
5
9.全压力 total pressure: ><viJ$i
10.真空 vacuum: B@Ez,u5
11.真空度 degree of vacuum: j08}5Eo
12.真空区域 ranges of vacuum: iJk`{P _
13.气体 gas: t;TMD\BU
14.非可凝气体 non-condensable gas: &7!&]kA+
15.蒸汽vapor: p)N=
16.饱和蒸汽压saturation vapor pressure: q%w\UAqA
17.饱和度degree of saturation: 3<1Uq3Pa
18.饱和蒸汽saturated vapor: lplEQ]J|
19.未饱和蒸汽unsaturated vapor: !krbGpTVH
20.分子数密度n,m-3 number density of molecules: ` =RJ8u
21.平均自由程ι、λ,m mean free path: 7JD
jJQy
22.碰撞率ψ collision rate: ~EG`[cv
23.体积碰撞率χ volume collision rate: I#zrz3WU
24.气体量G quantity of gas:
fD
25.气体的扩散 diffusion of gas: x1W<r)A )r
26.扩散系数D diffusion coefficient; diffusivity: :D8V*F6P
27.粘滞流 viscous flow: ~&4Hc%*IB
28.粘滞系数η viscous factor: Kgbgp mW
29.泊肖叶流 poiseuille flow: o"->RC
30.中间流 intermediate flow: r`pg`ChHv
31.分子流 molecular flow: aB;syl{
32克努曾数 number of knudsen: `$\g8Mo
33.分子泻流 molecular effusion; effusive flow: XMd-r8yYr
34.流逸 transpiration: dkt'~
35.热流逸 thermal transpiration:
/L'r
L
36.分子流率qN molecular flow rate; molecular flux: .$y}}/{j?[
37.分子流率密度 molecular flow rate density; density of molecular flux: nR-`;lrF~
38.质量流率qm mass flow rare: Ci0: -IS
39.流量qG throughput of gas: r5h}o)J
40.体积流率qV volume flow rate: t8DySFT
41.摩尔流率qυ molar flow rate: L!Iu\_{q
42.麦克斯韦速度分布 maxwellian velocity distribution: @cA`del
43.传输几率Pc transmission probability: uV!Ax*'
44.分子流导CN,UN molecular conductance: :^tw!U%y1
45.流导C,U conductance: l69&-Nyg
46.固有流导Ci,Ui intrinsic conductance: `=g9Rg/<
47.流阻W resistance: T3,"g=
48.吸附 sorption: l)m\i_r:
49.表面吸附 adsorption: sy=M#WGS
50.物理吸附physisorption: /_5I}{
51.化学吸附 chemisorption: v=zqj}T
52.吸收absorption:
3e~ab#/
53.适应系数α accommodation factor: "Lk-R5iFd
54.入射率υ impingement rate: {L5!_]6
55.凝结率condensation rate: s!esk%h{K
56.粘着率 sticking rate: fCdd,,,}
57.粘着几率Ps sticking probability: `mXbF
58.滞留时间τ residence time: la:i!qAH
59.迁移 migration: u@tJu'X
60.解吸 desorption: 17AJT
61.去气 degassing: ifTMoC%
62.放气 outgassing: i_Dv+^&zV
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: r|wB&
PGW
64.蒸发率 evaporation rate: Ca?5bCI,
65.渗透 permeation: wegu1Ny
66.渗透率φ permeability: 2A7g}V
67.渗透系数P permeability coefficient T+ey>[
2. 1.真空泵 vacuum pumps GO{o #}
1-1.容积真空泵 positive displacement pump: ,e{( r0
⑴.气镇真空泵 gas ballast vacuum pump: NWWag}
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: L1A0->t
⑶.干封真空泵 dry-sealed vacuum pump: \]ouQR.t@\
⑷.往复真空泵 piston vacuum pump: Y?W"@awE"\
⑸.液环真空泵 liquid ring vacuum pump: Vw.c05 x
⑹.旋片真空泵 sliding vane rotary vacuum pump: JRt^YX
⑺.定片真空泵 rotary piston vacuum pump:
@ c,KK~{
⑻.滑阀真空泵 rotary plunger vacuum pump: NSH20$A<
⑼.余摆线真空泵 trochoidal vacuum pump: >=Hm2daN
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: 0`.3`Mk
⑾.罗茨真空泵 roots vacuum pump: qplz !=
1-2.动量传输泵 kinetic vacuum pump: NfvvwG;M
⑴.牵引分子泵molecular drag pump: &$F4/2|b%
⑵.涡轮分子泵turbo molecular pump: 2g5Ft
⑶.喷射真空泵ejector vacuum pump: Jlw%t!Kx
⑷.液体喷射真空泵liquid jet vacuum pump: - 6a4H?L
⑸.气体喷射真空泵gas jet vacuum pump: [~03Z[_"/
⑹.蒸汽喷射真空泵vapor jet vacuum pump : BayO+,>K
⑺.扩散泵diffusion pump : sf )ojq6s
⑻.自净化扩散泵self purifying diffusion pump: #-$\f(+<
⑼.分馏扩散泵 fractionating diffusion pump : fq(r,h=|
⑽.扩散喷射泵diffusion ejector pump : CBw/a0Uck
⑾.离子传输泵ion transfer pump: i(P/=B
1-3.捕集真空泵 entrapment vacuum pump: V\Oe ]w
⑴吸附泵adsorption pump: gM_z`H5[!
⑵.吸气剂泵 getter pump: Ah:!
⑶.升华(蒸发)泵 sublimation (evaporation)pump : 7|4hs:4mD
⑷.吸气剂离子泵getter ion pump: c@9jc^CJ
⑸.蒸发离子泵 evaporation ion pump: 6(Za}H
⑹.溅射离子泵sputter ion pump: 7 j$ |fS
⑺.低温泵cryopump: <Y~?G:v6+
AffVah2o:
2.真空泵零部件 [<SM*fQ>t
2-1.泵壳 pump case: E*V UP5E
2-2.入口 inlet: #;FHyKx
2-3.出口outlet: P\<dy?nZ
2-4.旋片(滑片、滑阀)vane; blade : ]-h$CJSY
2-5.排气阀discharge valve: Q79& Q04XN
2-6.气镇阀gas ballast valve: [0|g3K!A
2-7.膨胀室expansion chamber: [P,YW|:n
2-8.压缩室compression chamber: Hik8u!#P
2-9.真空泵油 vacuum pump oil: n+Ofbiz@
2-10.泵液 pump fluid: l{oAqTN
2-11.喷嘴 nozzle: /3|uU
2-13.喷嘴扩张率nozzle expansion rate: sVP[7&vr~
2-14.喷嘴间隙面积 nozzle clearance area : 3=o^Vv
2-15.喷嘴间隙nozzle clearance: `H+~LVH
2-16.射流jet: Ar&]/X,WG
2-17.扩散器diffuser: Fx#0
:p
2-18.扩散器喉部diffuser thoat: 0l-m:6
2-19.蒸汽导管vapor tube(pipe;chimney): V_Z ~$
2-20.喷嘴组件nozzle assembly: oFt]q
=EU
2-21.下裙skirt: ]jo^P5\h>
Y4*ezt:;Q
3.附件 !wH7;tU
3-1阱trap: 2 mM0\ja
⑴.冷阱 cold trap: 9>~UqP9
⑵.吸附阱sorption trap: 48X;'b,h
⑶.离子阱ion trap: ;0*T7l
⑷.冷冻升华阱 cryosublimation trap: s+Qm/ h2
3-2.挡板baffle: XVXiiQ^
3-3.油分离器oil separator: d>"t*>i]>
3-4.油净化器oil purifier: *&p `8:
3-5.冷凝器condenser: "=)i'x"0"
hgCF!eud
4.泵按工作分类 NJJsg^'
4-1.主泵main pump: ' k~'aZ
4-2.粗抽泵roughing vacuum pump: U9:?d>7
4-3.前级真空泵backing vacuum pump: s8w7/*<d
4-4.粗(低)真空泵 roughing(low)vacuum pump: gs;3NW
4-5.维持真空泵holding vacuum pump: cU}j
Whu
4-6.高真空泵high vacuum pump: # Sfz^
4-7.超高真空泵ultra-high vacuum pump: i<<NKv8;
4-8.增压真空泵booster vacuum pump: cJ9:XWW
HfN-WYiR
5.真空泵特性 s_Y1rD*B
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: Xh==F:
5-2.真空泵的抽气量Q throughput of vacuum pump:。
fuJ6
fmT
5-3.起动压力starting pressure: Hb&-pR@e\?
5-4.前级压力 backing pressure : 0gNwC~IA8
5-5.临界前级压力 critical backing pressure: _Y@'<S.
5-6.最大前级压力maximum backing pressure: [
bv>(a_,
5-7.最大工作压力maximum working pressure: ,aI 6P-
5-8.真空泵的极限压力ultimate pressure of a pump: jJ%
*hDZ6t
5-9.压缩比compression ratio: e6s-;
5-10.何氏系数Ho coefficient: `5}XmSJ?5
5-11.抽速系数speed factor: q4_&C&7
5-12.气体的反扩散back-diffusion of gas: zjd]65P
5-13.泵液返流back-streaming of pump fluid: .S/W_R
5-14.返流率back-streaming rate ,=KJ7zIK?
5-15.返迁移back-migration: @W3fKF9*R
5-16.爆腾bumping: ;6aTt2BQ
5-17.水蒸气允许量qm water vapor tolerable load: x#yL&+'?Mj
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: Alh"G6
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: Ve>*KHDSt
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump u?[P@_i<
3. 1.一般术语 xQs2)
1-1.压力计pressure gauge: E"k\eZns&
1-2.真空计vacuum gauge: Zab5"JR
⑴.规头(规管)gauge head: \~ O6S`,
⑵.裸规nude gauge : cWIX!tc8
⑶.真空计控制单元gauge control unit : pE >~F
⑷.真空计指示单元gauge indicating unit : -05zcIVo
|YjuaXd7N
2.真空计一般分类 YIs (Q
2-1.压差式真空计differential vacuum gauge: rC~hjViG.
2-2.绝对真空计 absolute vacuum gauge: rlu{C4l
2-3.全压真空计total pressure vacuum gauge: Qz&I~7aoyV
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: A
S;ra,x
2-5.相对真空计relative vacuum gauge : ji{V#
bG
nBV7b
3.真空计特性 :,<e
3-1.真空计测量范围pressure range of vacuum gauge: @=x=dL(
3-2.灵敏度系数sensitivity coefficient: hnS
~r4
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): E@QsuS2&
3-5.规管光电流photon current of vacuum gauge head: !!f)w!wW
3-6.等效氮压力equivalent nitrogen pressure : "PGEiLY
3-7.X射线极限值 X-ray limit: %Bg}
a
3-8.逆X射线效应anti X-ray effect: 30]?Jz6m
3-9.布利尔斯效应blears effect: u#XNl":x
0hcrQ^BB!b
4.全压真空计 `.nkC_d
4-1.液位压力计liquid level manometer: s9)
@$3\
4-2.弹性元件真空计elastic element vacuum gauge: [>#?C*s
4-3.压缩式真空计compression gauge: Mvoi
4-4.压力天平pressure balance: M=n!tVlCV
4-5.粘滞性真空计viscosity gauge : $A6'YgK
4-6.热传导真空计thermal conductivity vacuum gauge : g<oSTAw
4-7.热分子真空计thermo-molecular gauge: `/ix[:}m^
4-8.电离真空计ionization vacuum gauge: hX\XNiCiK8
4-9.放射性电离真空计radioactive ionization gauge: EL80f>K
4-10.冷阴极电离真空计cold cathode ionization gauge: 1R9hA7y&,/
4-11.潘宁真空计penning gauge: e#IED!U
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: /HH5Mn*
4-13.放电管指示器discharge tube indicator: f5zxy!dhKS
4-14.热阴极电离真空计hot cathode ionization gauge: LKY4rY!|@d
4-15.三极管式真空计triode gauge: R{)Sv| +`
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: :
:8UVLX
4-17.B-A型电离真空计Bayard-Alpert gauge: {c|nIwdB
4-18.调制型电离真空计modulator gauge: >
taT;[Oa
4-19.抑制型电离真空计suppressor gauge: ]hTYh^'e
4-20.分离型电离真空计extractor gauge: x,
a[ p\1
4-21.弯注型电离真空计bent beam gauge: rs2~spN;h
4-22.弹道型电离真空计 orbitron gauge : ga^O]yK
4-23.热阴极磁控管真空计hot cathode magnetron gauge: [qlq& ?"
YMLo~j4J
5.分压真空计(分压分析器) 0wXfu"E{
5-1.射频质谱仪radio frequency mass spectrometer: F7UY>z3jL
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: By6C+)up
5-3.单极质谱仪momopole mass spectrometer: ')I/D4v
5-4.双聚焦质谱仪double focusing mass spectrometer: wIuwq>
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: y!GjC]/
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: z.oDH<1
5-7.回旋质谱仪omegatron mass spectrometer: s@
m
A\
5-8.飞行时间质谱仪time of flight mass spectrometer: S(mJ;C
Wcn3\v6_
6.真空计校准 z^I"{eT8
6-1.标准真空计reference gauges: hFuS>Hx
6-2.校准系统system of calibration: Sj(uc#
6-3.校准系数K calibration coefficient: )ruC_)
6-4.压缩计法meleod gauge method: qrO]t\
6-5.膨胀法expansion method: o\h[K<^>)
6-6.流导法flow method: ja70w:ja
4. 1.真空系统vacuum system d|]F^DDuI
1-1.真空机组pump system: r Y|'<$wvg
1-2.有油真空机组pump system used oil : ?mS798=f
1-3.无油真空机组oil free pump system A{\7HV 5
1-4.连续处理真空设备continuous treatment vacuum plant: cEi{+rfZd|
1-5.闸门式真空系统vacuum system with an air-lock: RfDIwkpp
1-6.压差真空系统differentially pumped vacuum system: IV_uf
1-7.进气系统gas admittance system: 3SVI|A5(d
%m!o#y(hD`
2.真空系统特性参量 6tI7vLmG
2-1.抽气装置的抽速volume flow rate of a pumping unit : >>Hsx2M
2-2.抽气装置的抽气量throughput of a pumping unit : zC!]bWsD
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: o1MI&}r
2-4.真空系统的漏气速率leak throughput of a vacuum system: 1gts=g.
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: FIlw
2-6.极限压力ultimate pressure: UtG@0(6C
2-7.残余压力residual pressure: @)m[:n
2-8.残余气体谱residual gas spectrum: D4G*K*z,w4
2-9.基础压力base pressure: 2{!'L'km
2-10.工作压力working pressure: n99:2r_
2-11.粗抽时间roughing time: lYv :
2-12.抽气时间pump-down time: Wt()DG|[
2-13.真空系统时间常数time constant of a vacuum system: SG
|!wH^
2-14.真空系统进气时间venting time: &5Ea6j
AUcq\Ys
3.真空容器 7xB#) o53
3-1.真空容器;真空室vacuum chamber: JM -Tp!C>
3-2.封离真空装置sealed vacuum device: 7!hL(k[
3-3.真空钟罩vacuum bell jar: -aLBj?N c[
3-4.真空容器底板vacuum base plate: M:6H%6eT
3-5.真空岐管vacuum manifold: yfiRMN"2
3-6.前级真空容器(贮气罐)backing reservoir: +cheLc
3-7.真空保护层outer chamber: _a8^AG
3-8.真空闸室vacuum air lock: IE: x&q`3
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: *58<.L|
heZJ(mR
4.真空封接和真空引入线 %;^[WT`,
4-1.永久性真空封接permanent seal : 5|NM]8^^0[
4.2.玻璃分级过渡封接graded seal : N'Ywn}!js
4-3.压缩玻璃金属封接compression glass-to-metal seal: C"k8M\RW?
4-4.匹配式玻璃金属封接matched glass-to-metal seal: Dd<gYPC
4-5.陶瓷金属封接ceramic-to-metal seal: <tuh%k
4-6.半永久性真空封接semi-permanent seal : 'SYj Ehvw
4-7.可拆卸的真空封接demountable joint: 8<0H(lj7_
4-8.液体真空封接liquid seal /],:sS7
4-9.熔融金属真空封接molten metal seal: hz<kR@k}
4-10.研磨面搭接封接ground and lapped seal: I?J$";A
4-11.真空法兰连接vacuum flange connection: &E.0!BuqV
4-12.真空密封垫vacuum-tight gasket: iBwl(,)?m2
4-13.真空密封圈ring gasket: ruS/Yh
4-14.真空平密封垫flat gasket: t<$9!"
4-15.真空引入线feedthrough leadthrough: .Di+G-#aEs
4-16.真空轴密封shaft seal: {3yzC
4-17.真空窗vacuum window: <d#9d.<
4-18.观察窗viewing window: ^TVy:5Ag
SEr\ u#
5.真空阀门 jkQv cU
5-1.真空阀门的特性characteristic of vacuum valves: Au#(guvm
⑴.真空阀门的流导conductance of vacuum valves: D@^ r
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: .=3Sm%
5-2.真空调节阀regulating valve: i
cQsA
5-3.微调阀 micro-adjustable valve: vUS$DUF
5-4.充气阀charge valve: 8? W\kf$
5-5.进气阀gas admittance valve: '1~mnmiP
5-6.真空截止阀break valve: 8UwL%"?YB
5-7.前级真空阀backing valve: :(} {uG
5-8.旁通阀 by-pass valve: ]d_Id]Qa+
5-9.主真空阀main vacuum valve: \! Os!s
5-10.低真空阀low vacuum valve: &sR{3pC}
5-11.高真空阀high vacuum valve: .(VxeF(v_k
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: <\8dh(>
5-13.手动阀manually operated valve: Itr yiU9
5-14.气动阀pneumatically operated valve: ;Y?7|G97*S
5-15.电磁阀electromagnetically operated valve: Cj"k
Fq4
5-16.电动阀valve with electrically motorized operation: KNC!T@O|{#
5-17.挡板阀baffle valve: 9x ?" %b
5-18.翻板阀flap valve: $ n`<,;^l
5-19.插板阀gate valve: \|@]XNSN
5-20.蝶阀butterfly valve: %&c[g O!Za
4FQU$f
6.真空管路 Q
{3"&
6-1.粗抽管路roughing line: bICi'`
6-2.前级真空管路backing line: A~\:}PN
6-3.旁通管路;By-Pass管路 by-pass line: (nbqL+
6-4.抽气封口接头pumping stem: vs{i2!^
6-5.真空限流件limiting conductance: qdCa]n!d
6-6.过滤器filter:
8yOzD
5. 1.一般术语
%3KWc-
1-1真空镀膜vacuum coating: 6f?5/hq
1-2基片substrate: kR%CSLOVy
1-3试验基片testing substrate: {}D8Y_=9\
1-4镀膜材料coating material: ~YlbS-
1-5蒸发材料evaporation material: ~kS~v
1-6溅射材料sputtering material: Sl:Qq!
1-7膜层材料(膜层材质)film material: 6>%)qc$i
1-8蒸发速率evaporation rate: UN`-;!
1-9溅射速率sputtering rate: (5_l7hWY
1-10沉积速率deposition rate: J*.Nf)i
1-11镀膜角度coating angle: 1MRt_*N4
KOV^wSwS
2.工艺 r}WV"/]p
2-1真空蒸膜vacuum evaporation coating: 5L42'gJ
(1).同时蒸发simultaneous evaporation: ] \4-e2N`\
(2).蒸发场蒸发evaporation field evaporation: Wgq*| teW
(3).反应性真空蒸发reactive vacuum evaporation: IA&((\YC
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: HGC>jeWd_
(5).直接加热的蒸发direct heating evaporation: $ZK4Ps -$
(6).感应加热蒸发induced heating evaporation: 4^w>An6
(7).电子束蒸发electron beam evaporation: W+H27qsv
(8).激光束蒸发laser beam evaporation: 8/-GrdyE
(9).间接加热的蒸发indirect heating evaporation: ]QtdT8~
(10).闪蒸flash evaportion: ?fnJ`^|-r
2-2真空溅射vacuum sputtering: d}>Nl$
(1).反应性真空溅射 reactive vacuum sputtering: 'ujtw:Z:
(2).偏压溅射bias sputtering: :?RooJ~#
(3).直流二级溅射direct current diode sputtering: C&NoEtL>s
(4).非对称性交流溅射asymmtric alternate current sputtering: PP[{c
(5).高频二极溅射high frequency diode sputtering: #|A
@
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: 3+{hO@O
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: >Hic
tH
(8).离子束溅射ion beam sputtering: ro}plK(<WQ
(9).辉光放电清洗glow discharge cleaning: YXg:cXE8e
2-3物理气相沉积PVD physical vapor deposition: Mn7 y@/1
2-4化学气相沉积CVD chemical vapor deposition: s)375jCga
2-5磁控溅射magnetron sputtering: hNyYk(t^
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: (+@3Dr5o0}
2-7空心阴极离子镀HCD hollow cathode discharge deposition: y:iE'SRRK6
2-8电弧离子镀arc discharge deposition: b-M[la}1"
kR-N9|>i
3.专用部件 n1y#gC
3-1镀膜室coating chamber: za<Ja=f9X
3-2蒸发器装置evaporator device: V*5:Vt7N
3-3蒸发器evaporator: w{F8]N>0<
3-4直接加热式蒸发器evaporator by direct heat: |; $fy-
3-5间接加热式蒸发器evaporator by indirect heat:
iq5h[
3-7溅射装置sputtering device: fyYv}z
3-8靶target: >P>.j+o/
3-10时控挡板timing shutter: cw/g1,p
3-11掩膜mask: P;MS%32
3-12基片支架substrate holder: f3y_&I+zl
3-13夹紧装置clamp: m1]rLeeEt
3-14换向装置reversing device: l"IBt:
3-15基片加热装置substrate heating device: WT'P[RU2
3-16基片冷却装置substrate colding device: ,BW^j.7
+SrE
4.真空镀膜设备 #MHnJ
4-1真空镀膜设备vacuum coating plant: <rRmbFH#
(1).真空蒸发镀膜设备vacuum evaporation coating plant: yeE_1C .
(2).真空溅射镀膜设备vacuum sputtering coating plant: {8@?9Z9R{
4-2连续镀膜设备continuous coating plant: Toy~\
4-3半连续镀膜设备semi- continuous coating plant ]=WJ%p1l
6. 1.漏孔 3hO`GM
1-1漏孔leaks: [5)1
4%
x
1-2通道漏孔channel leak: v^[tK2&v
1-3薄膜漏孔membrane leak: `Wn0v2@a(~
1-4分子漏孔molecular leak: pF K[b
1-5粘滞漏孔vixcous leak: asQ pVP
1-6校准漏孔calibrated leak: Iy8gQdI
1-7标准漏孔reference leak : y<BiR@%,7
1-8虚漏virtual leak: m?;)C~[
1-9漏率leak rate: *vJ1~SRV
1-10标准空气漏率standard air leak rate: iBN,YPo~
1-11等值标准空气漏率equivalent standard air leak rate: mRj-$:}L
1-12探索(示漏)气体: VG&|fekF
?7^('
2.本底 eff6=DP
2-1本底background: /y@$|DI1
2-2探索气体本底search gas background : U+@yx>!
2-3漂移drift: Mr2dhSQ!
2-4噪声noise: e>nRJH8pK
mC>7l7%
3.检漏仪 >p\IC
3-1检漏仪leak detector: >5/dmHPc
3-2高频火花检漏仪H.F. spark leak detector: r.-NfK4
3-3卤素检漏仪halide leak detector: C.8]~MP
3-4氦质谱检漏仪helium mass spectrometer leak detector: [%P_
Y/
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: y"e'Gg2
.A\9|sRZ5
4.检漏 (LL4V
3)
4-1气泡检漏leak detection by bubbles: hAG++<H{
4-2氨检漏leak detection by ammonia: "h$A. S
4-3升压检漏leak detection of rise pressure: TQE 3/I L
4-4放射性同位素检漏radioactive isotope leak detection: K+ ufcct
4-5荧光检漏fluorescence leak detection [g=yuVXNZZ
7. 1.一般术语 G{+sC2
1-1真空干燥vacuum drying: Ln[R}qD
1-2冷冻干燥freeze drying : oF]0o`U&a
1-3物料material: N(t1?R/e,
1-4待干燥物料material to be dried: 3t68cdFlz
1-5干燥物料dried material : K`(STvtM
1-6湿气moisture;humidity: 4K0N$9pd:
1-7自由湿气free moisture: R/ l1$}
1-8结合湿气bound moisture: ll[U-v{
1-9分湿气partial moisture: TL]2{rf~
1-10含湿量moisture content: COJqVC(#
1-11初始含湿量initial moisture content: 7k+UCiu>
1-12最终含湿量final residual moisture: qFe|$rVVIl
1-13湿度degree of moisture ,degree of humidity : q6H90Zb
1-14干燥物质dry matter : "* %=k%'
1-15干燥物质含量content of dry matter: kSB)}q6a
(cNT ud$
2.干燥工艺 lG%oqxJ+ L
2-1干燥阶段stages of drying : 3|9)A+,#
(1).预干燥preliminary dry: Q&`$:h.~
(2).一次干燥(广义)primary drying(in general): A3$
rPb8
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): )l[ +7
(4).二次干燥secondary drying: )"t=sFxaB
2-2.(1).接触干燥contact drying: Z%(aBz7Et
(2).辐射干燥 drying by radiation : z)43+8 ;
(3).微波干燥microwave drying:
A-ir
(4).气相干燥vapor phase drying: e3)rF5pp
(5).静态干燥static drying: r A0[ y
(6).动态干燥dynamic drying: 9zi/z_G
2-3干燥时间drying time: .Pxb9mW
2-4停留时间length of stay(in the drying chamber): 'PV,c|f>
2-5循环时间cycle time: >/5D/}4
2-6干燥率 dessication ratio : ;Qk* h'}f
2-7去湿速率mass flow rate of humidity: *% Vd2jW/
2-8单位面积去湿速率mass flow rate of humidity per surface area: kj@#oLd%
2-9干燥速度 drying speed : *=@Z\]"?
2-10干燥过程drying process: I4qzdD
2-11加热温度heating temperature: #mx;t3ja7
2-12干燥温度temperature of the material being dried : gOgG23 x
2-13干燥损失loss of material during the drying process : ,0lRs
2-14飞尘lift off (particles): P1Re7/
2-15堆层厚度thickness of the material: N7+K$)3
iu*u|e
3.冷冻干燥 !G`w@E9M)
3-1冷冻freezing: rZ:
(1).静态冷冻static freezing:
6$fC
R
(2).动态冷冻dynamic freezing: =*"Amd,
(3).离心冷冻centrifugal freezing: !Aunwq^
(4).滚动冷冻shell freezing: C(e!cOG
(5).旋转冷冻spin-freezing: 5!tmG- 'b
(6).真空旋转冷冻vacuum spin-freezing: 1PLKcU
(7).喷雾冷冻spray freezing: <`-"K+e!J
(8).气流冷冻air blast freezing: T_v
3-2冷冻速率rate of freezing: a^4(7
3-3冷冻物料frozen material: @_N -> l
3-4冰核ice core: ]y.,J
3-5干燥物料外壳envelope of dried matter: 2=F_<Jh|+
3-6升华表面sublimation front: zrnc~I+
3-7融化位置freezer burn:
w>/KQ> \"
-aKk#fd
4.真空干燥设备;真空冷冻干燥设备 jDH)S{k
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: E<-}Jc1
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: /~gM,*
4-3加热表面heating surface: Q`r1pO
4-4物品装载面shelf : (873:"(
4-5干燥器的处理能力throughput (of the vacuum drying chamber): iLv"ZqGrw
4-6单位面积干燥器处理能力throughput per shelf area: RD{jYr;
4-7冰冷凝器ice condenser: <XCH{Te1
4-8冰冷凝器的负载load of the ice condenser: Y<a/(`
4-9冰冷凝器的额定负载rated load of the ice condenser oDKgW?x
8. 1.一般术语 mc!3FJ
1-1试样sample : i,;Q
(1).表面层surface layer: Cv;z^8PZJz
(2).真实表面true surface: w<\N-J|m
(3).有效表面积effective surface area: "=4=Q\0PT
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: ^Ud`2 OW;2
(5).表面粒子密度surface particle density: G!0|ocE}
(6).单分子层monolayer: @OwU[\6fc}
(7).表面单分子层粒子密度monolayer density: Rg0\Ng4|G
(8).覆盖系数coverage ratio: RoJ&dK
1-2激发excitation: BN#^
/a-
(1).一次粒子primary particle: ~@itZ,d\
(2).一次粒子通量primary particle flux: szmjp{g0
(3).一次粒子通量密度density of primary particle flux: G=yQYsC$
(4).一次粒子负荷primary particle load: ~)oC+H@{
(5).一次粒子积分负荷integral load of primary particle: %\:.rs^
(6).一次粒子的入射能量energy of the incident primary particle: 4fP>;9[F
(7).激发体积excited volume: p)TH^87
(8).激发面积excited area: pjjs'A*y
(9).激发深度excited death: rp(`V@x3
(10).二次粒子secondary particles:
Ge(r6"%7
(11).二次粒子通量secondary particle flux: &^&k]JBaV
(12).二次粒子发射能energy of the emitted secondary particles: f)"O( c
(13).发射体积emitting volume: CZwZ#WV6
(14).发射面积emitting area: x%cKTpDh!
(15).发射深度emitting depth: M{O2O(
(16).信息深度information depth: :Tj,;0#/
(17).平均信息深度mean information depth: QD\S E
1-3入射角angle of incidence: 3 5|5|ma
1-4发射角angle of emission: i$%;z~#wW
1-5观测角observation: |6_<4lmTxF
1-6分析表面积analyzed surface area: [DjdR_9*I
1-7产额 yield : XUW~8P
1-8表面层微小损伤分析minimum damage surface analysis: !H?#~{
W}
1-9表面层无损伤分析non-destructive surface analysis: #;?z<
1-10断面深度分析 profile analysis in depth; depth profile analysis : Z)6bqU<LQE
1-11可观测面积observable area: `@Kh>K
1-12可观测立体角observable solid angle : 9J2%9,^
1-13接受立体角;观测立体角angle of acceptance: LR9dQ=fHS
1-14角分辨能力angular resolving power: V4VTP]'n
1-15发光度luminosity: 3z~zcQ^\
1-16二次粒子探测比detection ratio of secondary particles: m;Sw`nw?
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: dzbzZ@y
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: 9D8el}uHf
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: J5|Dduv
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: XPWK"t01
1-21本底压力base pressure: tw*qlb FHv
1-22工作压力working pressure: 0 w@~ynW[
kw=+"U
2.分析方法 YW/YeID
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: u\=Nu4)Z
F
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : kFuaLEJi
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: H6'xXS
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: E\RQm}Z09
2-3离子散射表面分析ion scattering spectroscopy: `"-)ObOj}
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: k}jH
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: 3~Ipcr
B
2-6离子散射谱仪ion scattering spectrometer: b?HW6Kfc
2-7俄歇效应Auger process: ;O{AYF?,N
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: q;B-np?U
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: gDAA>U3|$
2-10光电子谱术photoelectron spectroscopy : Gi;eDrgj~
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: 2psLX
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: V=E9*$b]
2-11光电子谱仪photoelectron spectrometer: }.`ycLW'
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: lza'l
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: 6S`eN\s
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): :/Sx\Nz78
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus