“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 r@3-vLI!u
--------------------------------------------------- F*[E28ia&
真空术语 %jzTQ+.%]^
86OrJdD8
1.标准环境条件 standard ambient condition: ?OFa
Q
2.气体的标准状态 standard reference conditions forgases: _K9`o^g%PJ
3.压力(压强)p pressure: `Y:]&w
4.帕斯卡Pa pascal: i"}z9Ae~.
5.托Torr torr: 04-_ K
6.标准大气压atm standard atmosphere: Z?{\34lPj
7.毫巴mbar millibar: y017
B<Ou
8.分压力 partial pressure: &N^~=y^`C'
9.全压力 total pressure: D+3?p
10.真空 vacuum: MvpJ0Y (
11.真空度 degree of vacuum: m"9f(
12.真空区域 ranges of vacuum: xRD+!3
13.气体 gas: rNq*z,
14.非可凝气体 non-condensable gas: SvM\9
15.蒸汽vapor: D{N8q^Cs9
16.饱和蒸汽压saturation vapor pressure:
^wolY0p
17.饱和度degree of saturation: h p|v?3(
18.饱和蒸汽saturated vapor: kM506U<g
19.未饱和蒸汽unsaturated vapor: ;stuTj@vH
20.分子数密度n,m-3 number density of molecules: 9VxM1-8Gs
21.平均自由程ι、λ,m mean free path: h.X4x2(.
22.碰撞率ψ collision rate: :EV.nD7
23.体积碰撞率χ volume collision rate: 9,'m,2%W
24.气体量G quantity of gas: $\BYN=#
25.气体的扩散 diffusion of gas: $(9QnH1KY
26.扩散系数D diffusion coefficient; diffusivity: K5qCPt`'
27.粘滞流 viscous flow: 5)RZJrN]
28.粘滞系数η viscous factor: .J75bX5
29.泊肖叶流 poiseuille flow: &IQ=M.!r
30.中间流 intermediate flow: U*[E+Uq}:N
31.分子流 molecular flow: 8:{id>Mm^
32克努曾数 number of knudsen: F-/z@tM
33.分子泻流 molecular effusion; effusive flow: `3F#k[IR
34.流逸 transpiration: 3%+~"4&
35.热流逸 thermal transpiration: #-;c!<2
36.分子流率qN molecular flow rate; molecular flux: Y6v{eWtSn
37.分子流率密度 molecular flow rate density; density of molecular flux: 2%pED
xui
38.质量流率qm mass flow rare: _Q5mPBO
39.流量qG throughput of gas: `DY
yK?R
40.体积流率qV volume flow rate: qi4P(s-i
41.摩尔流率qυ molar flow rate: Dx-P]j)4x
42.麦克斯韦速度分布 maxwellian velocity distribution: wD9K\%jIr!
43.传输几率Pc transmission probability: >R F|Q
44.分子流导CN,UN molecular conductance: h-P|O6@Ki
45.流导C,U conductance: j?2~6W/[
46.固有流导Ci,Ui intrinsic conductance: Wi&v?nm
47.流阻W resistance: uxf,95<g)
48.吸附 sorption: %)lp]Y33
49.表面吸附 adsorption: l53i
{o
50.物理吸附physisorption: dQj/Sr
51.化学吸附 chemisorption: W"Ip]LJ
52.吸收absorption: @)U.Dbm
53.适应系数α accommodation factor: ?#K.D vGJ
54.入射率υ impingement rate: LlX)xJ
55.凝结率condensation rate: ?),b902C
56.粘着率 sticking rate: }93kHO{
57.粘着几率Ps sticking probability: 8S1@,O,
58.滞留时间τ residence time: <VxA&bb7c
59.迁移 migration: -+WAaJ(b
60.解吸 desorption: !J7`frv"(
61.去气 degassing: *E/Bfp1LIe
62.放气 outgassing: $f
=`fPo
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: !zE{`Ha~
64.蒸发率 evaporation rate: yvB]rz} i
65.渗透 permeation: RAO+<m
66.渗透率φ permeability: >-MnB
67.渗透系数P permeability coefficient Ms!EK
2. 1.真空泵 vacuum pumps xOTvrX
1-1.容积真空泵 positive displacement pump: <[db)r~c
⑴.气镇真空泵 gas ballast vacuum pump: u} mj)Nk
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: ZE=sw}=
⑶.干封真空泵 dry-sealed vacuum pump: *O_fw 0jV
⑷.往复真空泵 piston vacuum pump: jR/Gd01)
⑸.液环真空泵 liquid ring vacuum pump: Ugri _
⑹.旋片真空泵 sliding vane rotary vacuum pump: CQWXLQED>
⑺.定片真空泵 rotary piston vacuum pump: xk,Uf,,>
⑻.滑阀真空泵 rotary plunger vacuum pump: Clum
m@z;#
⑼.余摆线真空泵 trochoidal vacuum pump: C7%R2>}?f
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: (e7!p=D
⑾.罗茨真空泵 roots vacuum pump: o,rF 15
1-2.动量传输泵 kinetic vacuum pump: 2)=whnFS
⑴.牵引分子泵molecular drag pump: *wTX
⑵.涡轮分子泵turbo molecular pump: l?m"o-Gp3
⑶.喷射真空泵ejector vacuum pump: W22S/s
⑷.液体喷射真空泵liquid jet vacuum pump: /!H24[tnk1
⑸.气体喷射真空泵gas jet vacuum pump: );0
⑹.蒸汽喷射真空泵vapor jet vacuum pump : Nh!`"B2B
⑺.扩散泵diffusion pump : f+ r>ur}\)
⑻.自净化扩散泵self purifying diffusion pump: "|3I|#s
⑼.分馏扩散泵 fractionating diffusion pump : ..`c# O&
⑽.扩散喷射泵diffusion ejector pump : <X8Urum
⑾.离子传输泵ion transfer pump: Ux_tzd0!
1-3.捕集真空泵 entrapment vacuum pump: QEJu.o
⑴吸附泵adsorption pump: i-CJ{l
⑵.吸气剂泵 getter pump: [7@blU
⑶.升华(蒸发)泵 sublimation (evaporation)pump : HJl?@&l/
⑷.吸气剂离子泵getter ion pump: [edF'7La
⑸.蒸发离子泵 evaporation ion pump: )O[8 D
⑹.溅射离子泵sputter ion pump: u2#q7}
⑺.低温泵cryopump: 6Ryc&z5
']nIa7
2.真空泵零部件 .V;,6Vq
2-1.泵壳 pump case: \tgY2:
2-2.入口 inlet: )g:5}+
2-3.出口outlet: d4b!
r
2-4.旋片(滑片、滑阀)vane; blade : -m`|S q
2-5.排气阀discharge valve: +~"IF+TRH
2-6.气镇阀gas ballast valve: (:bf m
2-7.膨胀室expansion chamber: _A,_RM$Y
2-8.压缩室compression chamber: K&[0`sH!
2-9.真空泵油 vacuum pump oil: e i=
4u'
2-10.泵液 pump fluid: FF8jW1
2-11.喷嘴 nozzle: :BxO6@>Xc
2-13.喷嘴扩张率nozzle expansion rate: s@L ;3WdO
2-14.喷嘴间隙面积 nozzle clearance area : ?T/4
=
2-15.喷嘴间隙nozzle clearance: ,kJ'_mq
2-16.射流jet: B!&5*f}*
2-17.扩散器diffuser: :I#.d7`uk
2-18.扩散器喉部diffuser thoat: oCCtjr
2-19.蒸汽导管vapor tube(pipe;chimney): C@qWour
2-20.喷嘴组件nozzle assembly: %wbdg&^
2-21.下裙skirt: ?i<l7
~ikp'5
3.附件 ]>~.U~
3-1阱trap: ?c8~VQaQ
⑴.冷阱 cold trap: :cA P{rSe
⑵.吸附阱sorption trap: !>Nlp,r&~
⑶.离子阱ion trap: .w4|$.H
⑷.冷冻升华阱 cryosublimation trap: @ 51!3jeu
3-2.挡板baffle: CAc]SxLh
3-3.油分离器oil separator: 9'(_*KSH
3-4.油净化器oil purifier: rai'x/Ut}+
3-5.冷凝器condenser: 6Jgl"Jw8
?,VpZ%Df2
4.泵按工作分类 `*U@d%a
4-1.主泵main pump: F.TIdkvp
4-2.粗抽泵roughing vacuum pump: gxhp7c182
4-3.前级真空泵backing vacuum pump: qBk[Afjgz
4-4.粗(低)真空泵 roughing(low)vacuum pump: pqg2#@F.
4-5.维持真空泵holding vacuum pump: cEHpa%_5
4-6.高真空泵high vacuum pump: _L8&.=4]i
4-7.超高真空泵ultra-high vacuum pump: [
&Wy $
4-8.增压真空泵booster vacuum pump: Xf;!w:u
"*zDb|v
5.真空泵特性 E:rJi]
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: ;*5z&1O
5-2.真空泵的抽气量Q throughput of vacuum pump:。 u4lM>(3Y}
5-3.起动压力starting pressure: kgBkwp
5-4.前级压力 backing pressure : \WE/#To
5-5.临界前级压力 critical backing pressure: ZvuY]=^3
5-6.最大前级压力maximum backing pressure: moM'RO,M
5-7.最大工作压力maximum working pressure: y1 a%f.F`
5-8.真空泵的极限压力ultimate pressure of a pump: dtuCA"D
5-9.压缩比compression ratio: L@MCB-@V
5-10.何氏系数Ho coefficient: azmeJpC
5-11.抽速系数speed factor: 0^{Tq0Ri[
5-12.气体的反扩散back-diffusion of gas: _
(b4|hJ'
5-13.泵液返流back-streaming of pump fluid: EW]DzL3
5-14.返流率back-streaming rate tic3a1
5-15.返迁移back-migration: g,E)F90
5-16.爆腾bumping: tLJ 7tnB
5-17.水蒸气允许量qm water vapor tolerable load: Fz8& Jn!
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: jGLmgJG-P
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: Rq15AR
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump ~a=]w#-KD
3. 1.一般术语 ';eAaDM
1-1.压力计pressure gauge: []\-*{^r
1-2.真空计vacuum gauge: pe[huYE
⑴.规头(规管)gauge head: 6+sz4
⑵.裸规nude gauge : V,ZRX}O
⑶.真空计控制单元gauge control unit : pz2E+o
⑷.真空计指示单元gauge indicating unit : s,-<P1}/
K{y`Sb~k
2.真空计一般分类 :SFf}
2-1.压差式真空计differential vacuum gauge: 1
=?pL$+G
2-2.绝对真空计 absolute vacuum gauge: ~i-n_7 +
2-3.全压真空计total pressure vacuum gauge: <mLU-'c@
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: "% \y$
2-5.相对真空计relative vacuum gauge : \ bNDeA&l
z@[n?t!7k
3.真空计特性 MXVCu"g%
3-1.真空计测量范围pressure range of vacuum gauge: ]mBlXE:Z
3-2.灵敏度系数sensitivity coefficient: '(ETXQ@
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): a&)$s;
3-5.规管光电流photon current of vacuum gauge head: OG IN-
3-6.等效氮压力equivalent nitrogen pressure : 3rh t5n2-
3-7.X射线极限值 X-ray limit: g7%vI8Y)@
3-8.逆X射线效应anti X-ray effect: )$Fw<;4
3-9.布利尔斯效应blears effect: }2y"F@{T
w#(E+s~}
4.全压真空计 g[2[
zIB=
4-1.液位压力计liquid level manometer: 1iY?t
4-2.弹性元件真空计elastic element vacuum gauge: 1g!%ej
jd
4-3.压缩式真空计compression gauge: :)_P7k`>e/
4-4.压力天平pressure balance: ,J*#Ixe}
4-5.粘滞性真空计viscosity gauge : bB.nevb9p
4-6.热传导真空计thermal conductivity vacuum gauge : D5T0o"A
4-7.热分子真空计thermo-molecular gauge: tG,xG&
4-8.电离真空计ionization vacuum gauge: arPqVMVr
4-9.放射性电离真空计radioactive ionization gauge: [:Odb?+ `F
4-10.冷阴极电离真空计cold cathode ionization gauge: &)Wm rF
4-11.潘宁真空计penning gauge: 5tbi};
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: 'vIVsv<p
4-13.放电管指示器discharge tube indicator: ELV$!f|u
4-14.热阴极电离真空计hot cathode ionization gauge: MM+nE_9lV
4-15.三极管式真空计triode gauge: d cht8nX7~
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: ilj9&.isB
4-17.B-A型电离真空计Bayard-Alpert gauge: 0w^awT<$6
4-18.调制型电离真空计modulator gauge: \]/6>yT
4-19.抑制型电离真空计suppressor gauge: jK=-L#hz
4-20.分离型电离真空计extractor gauge: iV%tn{fc
4-21.弯注型电离真空计bent beam gauge: ZONe}tv:
4-22.弹道型电离真空计 orbitron gauge : Xo4K!U>TzZ
4-23.热阴极磁控管真空计hot cathode magnetron gauge: YsjTC$Tx,
5|[\Se#
5.分压真空计(分压分析器) 0Ioa;XgOn
5-1.射频质谱仪radio frequency mass spectrometer: ! F&{I
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: S1$&
5-3.单极质谱仪momopole mass spectrometer: :'dH)yO
5-4.双聚焦质谱仪double focusing mass spectrometer: 7^8<[8
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: rUF= uO(
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: x: Tm4V{
5-7.回旋质谱仪omegatron mass spectrometer: 0Z[8d0
5-8.飞行时间质谱仪time of flight mass spectrometer: 7+p=4i^@Zs
QXT*O
6.真空计校准 V@>s]]HMq#
6-1.标准真空计reference gauges: *}i.,4+y
6-2.校准系统system of calibration: ,e>N9\*
6-3.校准系数K calibration coefficient: T*C]:=)
6-4.压缩计法meleod gauge method: zTt6L6:u
6-5.膨胀法expansion method:
Et0;1
6-6.流导法flow method: ;lo!o9`<
4. 1.真空系统vacuum system szb],)|18
1-1.真空机组pump system: ~); 7D'[
1-2.有油真空机组pump system used oil : l7JY`x
1-3.无油真空机组oil free pump system F0 FF:><
1-4.连续处理真空设备continuous treatment vacuum plant: A[oxG;9xi
1-5.闸门式真空系统vacuum system with an air-lock: xBcE>^{1.
1-6.压差真空系统differentially pumped vacuum system: O7RW*V:G@
1-7.进气系统gas admittance system: $'VFb=?XrK
ugt|'i
2.真空系统特性参量 t7DT5SrR
2-1.抽气装置的抽速volume flow rate of a pumping unit : !n/"39KT
2-2.抽气装置的抽气量throughput of a pumping unit : 9a9{OJa6M
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: -d
6B;I<'
2-4.真空系统的漏气速率leak throughput of a vacuum system: ;/Dp
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: n P4DHb&5
2-6.极限压力ultimate pressure: F\;G'dm
2-7.残余压力residual pressure: 7fJWb)z!k
2-8.残余气体谱residual gas spectrum: vJfex,#lv
2-9.基础压力base pressure: 3"hPplE
2-10.工作压力working pressure: "M.vu}~>
2-11.粗抽时间roughing time: +O@0gl
2-12.抽气时间pump-down time: +K%4jIm
2-13.真空系统时间常数time constant of a vacuum system: !8O*)=RA
2-14.真空系统进气时间venting time: "V;M,/Q|
9IC|2w66
3.真空容器 _YW1Mk1
3-1.真空容器;真空室vacuum chamber: %A dE5HI-
3-2.封离真空装置sealed vacuum device: xV4
#_1(
3-3.真空钟罩vacuum bell jar: I vQ]-A}N
3-4.真空容器底板vacuum base plate: Iw$7f kq
3-5.真空岐管vacuum manifold: y
ZsC>
3-6.前级真空容器(贮气罐)backing reservoir: 58Fan*fO
3-7.真空保护层outer chamber: -P<e-V%<
3-8.真空闸室vacuum air lock: f6ad@2
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: bi bjFg
["\Y-6"l
4.真空封接和真空引入线 4cni_m]
4-1.永久性真空封接permanent seal : ^{GnEqml&
4.2.玻璃分级过渡封接graded seal : 0BM3:]=wr
4-3.压缩玻璃金属封接compression glass-to-metal seal: SAt{At
4-4.匹配式玻璃金属封接matched glass-to-metal seal: pN"d~Z8
4-5.陶瓷金属封接ceramic-to-metal seal: jLf. qf8qm
4-6.半永久性真空封接semi-permanent seal : #s)Wzv%OX
4-7.可拆卸的真空封接demountable joint: @""aNKA^r>
4-8.液体真空封接liquid seal hSq3LoHV
4-9.熔融金属真空封接molten metal seal: '8v^.gZ
4-10.研磨面搭接封接ground and lapped seal: D0D0=s
4-11.真空法兰连接vacuum flange connection: ([='LyH];z
4-12.真空密封垫vacuum-tight gasket: Bg*Oj)NM
4-13.真空密封圈ring gasket: AAE8j.
4-14.真空平密封垫flat gasket: 9GuG"^08
4-15.真空引入线feedthrough leadthrough: `)FSJV1
4-16.真空轴密封shaft seal: i*' 6"
4-17.真空窗vacuum window: jX79Nm|
4-18.观察窗viewing window: aCe<*;b@
e`fN+
5.真空阀门 `Pv[A
5-1.真空阀门的特性characteristic of vacuum valves: y1!c:&
⑴.真空阀门的流导conductance of vacuum valves: +^
n\?!
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: ~r6qnC2
5-2.真空调节阀regulating valve: ,mR$YT8
5-3.微调阀 micro-adjustable valve: 'Jww}^h1
5-4.充气阀charge valve: #y"EhwF
5-5.进气阀gas admittance valve: 'PF?D~
5-6.真空截止阀break valve: vd>X4e^j
5-7.前级真空阀backing valve: cTpAU9|(
5-8.旁通阀 by-pass valve: X|)Ox
,(
5-9.主真空阀main vacuum valve: _4VF>#b
5-10.低真空阀low vacuum valve: y|1,h}H^n
5-11.高真空阀high vacuum valve: Y#EM]x5!=
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: L\--h`~YU
5-13.手动阀manually operated valve: Cvr?%+)$M
5-14.气动阀pneumatically operated valve: r7r>1W%4
5-15.电磁阀electromagnetically operated valve: ^~k2(DLk
5-16.电动阀valve with electrically motorized operation: 1-4iy_d
5-17.挡板阀baffle valve: RfVVAaI
5-18.翻板阀flap valve: pZx'%-\-T
5-19.插板阀gate valve: 7{
zkqug
5-20.蝶阀butterfly valve: &o>ctf.x
dHV3d'.P
6.真空管路 p.kJNPO\@
6-1.粗抽管路roughing line: M}E0Msq_o
6-2.前级真空管路backing line: :!a'N3o>
6-3.旁通管路;By-Pass管路 by-pass line: 5T)qn`%
6-4.抽气封口接头pumping stem: s*.CJ
6-5.真空限流件limiting conductance: c=iv\hn
6-6.过滤器filter: I;]Q}SUsm
5. 1.一般术语 ~wmc5L/!?
1-1真空镀膜vacuum coating: rnvKfTpZDU
1-2基片substrate: iO)FZ%?"
1-3试验基片testing substrate: @Omgk=6
1-4镀膜材料coating material: C
7)w8y
1-5蒸发材料evaporation material: 'xi[- -
1-6溅射材料sputtering material: e"9u}-Q@
1-7膜层材料(膜层材质)film material: !iBe/yb
1-8蒸发速率evaporation rate: n4Od4&r
1-9溅射速率sputtering rate: Fdsaf[3[v
1-10沉积速率deposition rate: BFP (2j
1-11镀膜角度coating angle: .:?X<=!S&t
O(U'G|
2.工艺 :=q blc
2-1真空蒸膜vacuum evaporation coating: CPssk,q~C
(1).同时蒸发simultaneous evaporation: / 4P+
(2).蒸发场蒸发evaporation field evaporation: 41f4zisZ
(3).反应性真空蒸发reactive vacuum evaporation: |F_Z
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: VPG+]>*
(5).直接加热的蒸发direct heating evaporation: xxWrSl`fB
(6).感应加热蒸发induced heating evaporation: dLb9p"EE#
(7).电子束蒸发electron beam evaporation: n\8;4]n
(8).激光束蒸发laser beam evaporation: =SJwCT0;
(9).间接加热的蒸发indirect heating evaporation: GRV#f06
(10).闪蒸flash evaportion: 5g9lO]WDI
2-2真空溅射vacuum sputtering: @Sb 86Ee
(1).反应性真空溅射 reactive vacuum sputtering: 9aYDi)
(2).偏压溅射bias sputtering: tHlKo0S$0
(3).直流二级溅射direct current diode sputtering: bvY'=
(4).非对称性交流溅射asymmtric alternate current sputtering: <i9pJGW
(5).高频二极溅射high frequency diode sputtering: XRi/O)98o
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: `NIc*B4q.
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: "RPX_
(8).离子束溅射ion beam sputtering: )c
vA}U.z
(9).辉光放电清洗glow discharge cleaning: >_3+s~
2-3物理气相沉积PVD physical vapor deposition: $F V!HD
2-4化学气相沉积CVD chemical vapor deposition: 'BY{]{SL
2-5磁控溅射magnetron sputtering: *~b3FLzq
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: 5fpBzn$
2-7空心阴极离子镀HCD hollow cathode discharge deposition: x2gnB@t
2-8电弧离子镀arc discharge deposition: ^6*LuXPv
cR.[4rG'
3.专用部件 e!cZW.B=`f
3-1镀膜室coating chamber: V\k?$}
3-2蒸发器装置evaporator device: ?@W=bJ8{
3-3蒸发器evaporator: x|B$n} B
3-4直接加热式蒸发器evaporator by direct heat: pAwmQS\W
3-5间接加热式蒸发器evaporator by indirect heat: Y@WCp
3-7溅射装置sputtering device: 4j9
3-8靶target: %si5cc?
3-10时控挡板timing shutter: DoV<p?U
3-11掩膜mask: jA ?tDAx`
3-12基片支架substrate holder: 'M"JF;*r
3-13夹紧装置clamp: 9$0-UUCk
3-14换向装置reversing device: BzFD_A>j;_
3-15基片加热装置substrate heating device: f@@2@#
5B
3-16基片冷却装置substrate colding device: jn+NX)9
}T!2IaAB
4.真空镀膜设备 $.Fti-5
4-1真空镀膜设备vacuum coating plant: Al?LO;$Pa?
(1).真空蒸发镀膜设备vacuum evaporation coating plant: wFr}]<=Mi
(2).真空溅射镀膜设备vacuum sputtering coating plant: C^Jf&a
4-2连续镀膜设备continuous coating plant: "52nT
4-3半连续镀膜设备semi- continuous coating plant v` 9^?Xw)
6. 1.漏孔 7 ky$9+~
1-1漏孔leaks: DwTqj=l
1-2通道漏孔channel leak: pPztUz/.
1-3薄膜漏孔membrane leak: FS.z lk\D=
1-4分子漏孔molecular leak: I W_:nm6
1-5粘滞漏孔vixcous leak: \L14rQ
t
1-6校准漏孔calibrated leak: xW84g08_,
1-7标准漏孔reference leak : ~i)O^CKq
1-8虚漏virtual leak: @d5G\1(%
1-9漏率leak rate: i*16kdI.
1-10标准空气漏率standard air leak rate: S30@|@fTz
1-11等值标准空气漏率equivalent standard air leak rate: :sT\-MpQvn
1-12探索(示漏)气体: !oXA^7Th6]
bI^zwK,@4
2.本底 g=?KpI-pn0
2-1本底background: ^/+0L[R
2-2探索气体本底search gas background : >-0b@ +j
2-3漂移drift: 3HsjF5?W
2-4噪声noise: phIEz3Fu/
$"Oy }
3.检漏仪 \Yv<TzJ9
3-1检漏仪leak detector: h-VpX6
3-2高频火花检漏仪H.F. spark leak detector: @a.Y9;O
3-3卤素检漏仪halide leak detector: \!8`kC
3-4氦质谱检漏仪helium mass spectrometer leak detector: y%T5"p$,
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: :j/PtNT@
c"+N{$ vp
4.检漏 V'h
O
4-1气泡检漏leak detection by bubbles: bTzVmqGY
4-2氨检漏leak detection by ammonia: ^
K8JE,
4-3升压检漏leak detection of rise pressure:
[kqxC
4-4放射性同位素检漏radioactive isotope leak detection: *"E?n>b
4-5荧光检漏fluorescence leak detection e=t?mDh#E
7. 1.一般术语 5 Vm
|/
1-1真空干燥vacuum drying: Vy
= fm
1-2冷冻干燥freeze drying : [P*3ld,,G%
1-3物料material: U4#[>*
1-4待干燥物料material to be dried: HF-Msu6
1-5干燥物料dried material : rVkoj;[
1-6湿气moisture;humidity: G+=6]0HT
1-7自由湿气free moisture: pk'@!|g%=
1-8结合湿气bound moisture: 1r}fnT<
1-9分湿气partial moisture: :)nn/[>fC
1-10含湿量moisture content: z`uqK!v(K
1-11初始含湿量initial moisture content: $;*YdZ`q
1-12最终含湿量final residual moisture: G)l[\6Dn
1-13湿度degree of moisture ,degree of humidity : o"^}2^)_SR
1-14干燥物质dry matter : ~B%EvG7:n
1-15干燥物质含量content of dry matter: RM53B
i L1.R+
2.干燥工艺 vCwDE~
2-1干燥阶段stages of drying : 9frx 60
(1).预干燥preliminary dry: 0_bt*.wI+
(2).一次干燥(广义)primary drying(in general): /qF7^9LtaY
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): dJ`Fvj
(4).二次干燥secondary drying: x&R&\}@G m
2-2.(1).接触干燥contact drying: G?QFF6)}!
(2).辐射干燥 drying by radiation :
(H9%a-3
(3).微波干燥microwave drying: -5\aL"?4
(4).气相干燥vapor phase drying: $JmL)r
(5).静态干燥static drying: >
3JU
(6).动态干燥dynamic drying: H<`[,t
2-3干燥时间drying time: ~nb%w?vv
2-4停留时间length of stay(in the drying chamber): @.kv",[{[
2-5循环时间cycle time: ?{q w
/&
2-6干燥率 dessication ratio : TMG:fg&E~
2-7去湿速率mass flow rate of humidity: bi!4I<E>k
2-8单位面积去湿速率mass flow rate of humidity per surface area: 14\%2nE
2-9干燥速度 drying speed : X.s?=6}g
2-10干燥过程drying process: P<kTjG
2-11加热温度heating temperature: &tZ?%sr
2-12干燥温度temperature of the material being dried : nvD"_.K rJ
2-13干燥损失loss of material during the drying process : ;JFE7\-mC
2-14飞尘lift off (particles): ,@!8jar@w}
2-15堆层厚度thickness of the material: XrC{{K
U=XaI%ZM)
3.冷冻干燥 6u7(}K
3-1冷冻freezing: #`GW7(M
(1).静态冷冻static freezing: oAWk<B(@
(2).动态冷冻dynamic freezing: 1s\10 hK1c
(3).离心冷冻centrifugal freezing: 4PiN Q'*
(4).滚动冷冻shell freezing: &7Ixf?e!K
(5).旋转冷冻spin-freezing: C?rL>_+71
(6).真空旋转冷冻vacuum spin-freezing: RYE::[O7
(7).喷雾冷冻spray freezing: |[K7oa~#
(8).气流冷冻air blast freezing: `P/* x[?
3-2冷冻速率rate of freezing: j`BFk>
3-3冷冻物料frozen material: Hh;w\)/%j
3-4冰核ice core: W~k!qy `
3-5干燥物料外壳envelope of dried matter: ^&&dO*0{
3-6升华表面sublimation front: DHt 8 f
3-7融化位置freezer burn: wt2S[:!p
ErESk"2t
4.真空干燥设备;真空冷冻干燥设备 @+1E|4L1vf
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: Q77qrx3
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: kTiQO2H
4-3加热表面heating surface: xOT'4v&.
4-4物品装载面shelf : T|.Q81.NE
4-5干燥器的处理能力throughput (of the vacuum drying chamber): 10#!{].#x
4-6单位面积干燥器处理能力throughput per shelf area: MVt#n\_BZV
4-7冰冷凝器ice condenser: A</[Q>8
4-8冰冷凝器的负载load of the ice condenser: &K>]!yn
4-9冰冷凝器的额定负载rated load of the ice condenser 9^a>U(,
8. 1.一般术语 2Fx<QRz
1-1试样sample : sxThz7#i)
(1).表面层surface layer: -&)^|Atm
(2).真实表面true surface: MruWt*
(3).有效表面积effective surface area: Qlb@A z
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: "fpj"lf-
(5).表面粒子密度surface particle density: $elrX-(vL
(6).单分子层monolayer: HAO/r`7*
(7).表面单分子层粒子密度monolayer density: p~8~EQFj
(8).覆盖系数coverage ratio: i"rMP#7
1-2激发excitation: hsqUiB tc6
(1).一次粒子primary particle: 9Biw!%a
(2).一次粒子通量primary particle flux: cJA:vHyw
(3).一次粒子通量密度density of primary particle flux: #eUfwd6.Y
(4).一次粒子负荷primary particle load: |Y'$+[TE
(5).一次粒子积分负荷integral load of primary particle: x *qef_Hu
(6).一次粒子的入射能量energy of the incident primary particle: IN%>46e`
(7).激发体积excited volume: 'oT}jI
(8).激发面积excited area: :W1,s53
(9).激发深度excited death: G0Wd"AV+
(10).二次粒子secondary particles: Q|ik\
(11).二次粒子通量secondary particle flux: |nicvg@
(12).二次粒子发射能energy of the emitted secondary particles: 9d{W/t?NH
(13).发射体积emitting volume: ;~1r{kXxA"
(14).发射面积emitting area: g u|;C
(15).发射深度emitting depth: !r
LHPg
(16).信息深度information depth: 'nT#3/rL
(17).平均信息深度mean information depth: ?1N0+OW
1-3入射角angle of incidence: O]Kb~jkd
1-4发射角angle of emission: g$ 2M|Q
1-5观测角observation: &)X<yd0
1-6分析表面积analyzed surface area: rmabm\QY
1-7产额 yield : lwY{rWo
1-8表面层微小损伤分析minimum damage surface analysis: &R5M&IwL
1-9表面层无损伤分析non-destructive surface analysis: dt \O7Rjw8
1-10断面深度分析 profile analysis in depth; depth profile analysis : ,gOQIS56
1-11可观测面积observable area: D46|)-
1-12可观测立体角observable solid angle : +%<Jr<~W
1-13接受立体角;观测立体角angle of acceptance: 'I<j`)4`d
1-14角分辨能力angular resolving power: pc.0;gN
1-15发光度luminosity: \
yOZ&qU
1-16二次粒子探测比detection ratio of secondary particles: bv+e'$U3
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: IL\mFjZ'
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: >bZ#
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: #KK(Z\;
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: 6)3eB{$;
1-21本底压力base pressure: p|FX_4RjX
1-22工作压力working pressure:
k9n
SW; bE
2.分析方法 `UI)H*GA8
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: v'>Yc#VJ
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : u!-eP7;7
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: gU~)(|Nu.
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: V")Q4h{
2-3离子散射表面分析ion scattering spectroscopy: q@sH@-z4]
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: J6%op{7/
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: x$Oz0 [
2-6离子散射谱仪ion scattering spectrometer: \1MDCP9:
2-7俄歇效应Auger process: M[{Cy[ta
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: #
R&[+1=9j
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: (s3%1OC[
2-10光电子谱术photoelectron spectroscopy : `o3d@Vc
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: Q|1bF!#(1
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: i3"sArP"|
2-11光电子谱仪photoelectron spectrometer: h0eo:Ahi
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: ]Bsq?e^
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: GMNb;D(>K
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): kb:C>Y8!sC
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus