“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 nX\mCO4T
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真空术语 M@Ti$=
Xpt9$=d
1.标准环境条件 standard ambient condition: Mcq!QaO}&
2.气体的标准状态 standard reference conditions forgases: [NV/*>"j&
3.压力(压强)p pressure: //RD$e?h~
4.帕斯卡Pa pascal: *U$%mZS]1
5.托Torr torr: 8c>xgFWp9
6.标准大气压atm standard atmosphere: Vt,P.CfdC
7.毫巴mbar millibar: Xkk 8#Y":
8.分压力 partial pressure: =\mJ5v"hA
9.全压力 total pressure: ~z,qr09
10.真空 vacuum: d%RH]j4
11.真空度 degree of vacuum: 4$81ilBcL
12.真空区域 ranges of vacuum: :i|]iXEI"
13.气体 gas: $/ $Hi U`.
14.非可凝气体 non-condensable gas: wk{]eD%
15.蒸汽vapor: 4dm0:,
G
16.饱和蒸汽压saturation vapor pressure: y0p\Gu;3j
17.饱和度degree of saturation: )[u'LgVN/L
18.饱和蒸汽saturated vapor: FlUO3rc|
19.未饱和蒸汽unsaturated vapor: Y/?z8g'p
20.分子数密度n,m-3 number density of molecules: dn:\V?9
21.平均自由程ι、λ,m mean free path: jeB"j
22.碰撞率ψ collision rate: X\>/'fC$
23.体积碰撞率χ volume collision rate:
d ^zuo
24.气体量G quantity of gas: abCxB^5VL
25.气体的扩散 diffusion of gas: H7k@Br
26.扩散系数D diffusion coefficient; diffusivity: sk*vmxClY
27.粘滞流 viscous flow: 3sW!ya-VZ
28.粘滞系数η viscous factor: J#q^CWN3R
29.泊肖叶流 poiseuille flow: |>1#)cONW
30.中间流 intermediate flow: !}5rd\
31.分子流 molecular flow: _xy[\X;9
32克努曾数 number of knudsen: -8R SE4)
33.分子泻流 molecular effusion; effusive flow: \cf'Hj}
34.流逸 transpiration: @%YbptT}
35.热流逸 thermal transpiration: x 0#u2j?zj
36.分子流率qN molecular flow rate; molecular flux: e {3%-
37.分子流率密度 molecular flow rate density; density of molecular flux: \(&&ed:
38.质量流率qm mass flow rare: o,S(;6pDJ
39.流量qG throughput of gas: fJ6Q:7
40.体积流率qV volume flow rate: U9*< dR
41.摩尔流率qυ molar flow rate: 6L)7Q0Z
42.麦克斯韦速度分布 maxwellian velocity distribution: )eqF21\
43.传输几率Pc transmission probability: 7#Uzz"^
44.分子流导CN,UN molecular conductance: F/[m.!Eo
45.流导C,U conductance: J1Az+m
46.固有流导Ci,Ui intrinsic conductance: /a9CqK
47.流阻W resistance: NqveL<r`
48.吸附 sorption: {B e9$$W,
49.表面吸附 adsorption: M%RH4%NZ0
50.物理吸附physisorption: Y\+LBbB8
51.化学吸附 chemisorption: G]{^.5
52.吸收absorption: 8EX?/33$
53.适应系数α accommodation factor: }`!-WY
54.入射率υ impingement rate: lR9uD9Dr
55.凝结率condensation rate: {oR@'^N
56.粘着率 sticking rate: TP~1-(M)}
57.粘着几率Ps sticking probability: I Gi9YpI&K
58.滞留时间τ residence time: )]4=anJu@|
59.迁移 migration: / {[p?7x>
60.解吸 desorption: T LF'7ufq
61.去气 degassing: Koj9]2<0
62.放气 outgassing: ^SW9J^9
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: #{^qBP[
64.蒸发率 evaporation rate: uBn35%
65.渗透 permeation: M{jq6c
66.渗透率φ permeability: BjA$^ i|8
67.渗透系数P permeability coefficient #&fu"W+D96
2. 1.真空泵 vacuum pumps & JJ*?Dl
1-1.容积真空泵 positive displacement pump: VE1j2=3+o
⑴.气镇真空泵 gas ballast vacuum pump: Aon.Y Z
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: wA)nryXV
⑶.干封真空泵 dry-sealed vacuum pump: %iJ}H6m
⑷.往复真空泵 piston vacuum pump: <G`1(,g
⑸.液环真空泵 liquid ring vacuum pump: ;t,v/(/3
⑹.旋片真空泵 sliding vane rotary vacuum pump: Pl-9FLJ
⑺.定片真空泵 rotary piston vacuum pump: O:
#SjjK
⑻.滑阀真空泵 rotary plunger vacuum pump: F?0Q AA
⑼.余摆线真空泵 trochoidal vacuum pump: )qOcx
I
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: 0IP0zil
⑾.罗茨真空泵 roots vacuum pump: -_eG/o=M
1-2.动量传输泵 kinetic vacuum pump: Y> ATL
⑴.牵引分子泵molecular drag pump: 0&b;!N!vJ
⑵.涡轮分子泵turbo molecular pump: KmM:V2@A$
⑶.喷射真空泵ejector vacuum pump: TIR Is1
⑷.液体喷射真空泵liquid jet vacuum pump: G;/l[mvh,
⑸.气体喷射真空泵gas jet vacuum pump: '5~l{3Lw
⑹.蒸汽喷射真空泵vapor jet vacuum pump : w`3.wALb
⑺.扩散泵diffusion pump : N93R(x)%
⑻.自净化扩散泵self purifying diffusion pump: UI%4d3
⑼.分馏扩散泵 fractionating diffusion pump : ^tI&5S]nE
⑽.扩散喷射泵diffusion ejector pump : x25zk4-
⑾.离子传输泵ion transfer pump: Df:/r%
1-3.捕集真空泵 entrapment vacuum pump: h@\HPYi#.
⑴吸附泵adsorption pump: Y(2Z<d
⑵.吸气剂泵 getter pump: rKd|s7l
⑶.升华(蒸发)泵 sublimation (evaporation)pump : 53pT{2]zAi
⑷.吸气剂离子泵getter ion pump: yF%e)6
⑸.蒸发离子泵 evaporation ion pump: )0"T?Ivp]
⑹.溅射离子泵sputter ion pump: }UQ,B
⑺.低温泵cryopump: K[
S>EITr
-T-yt2h(
2.真空泵零部件 X8?@Y@
2-1.泵壳 pump case: v&3"(fp
2-2.入口 inlet: JnIG;/
2-3.出口outlet: :XPat93w
2-4.旋片(滑片、滑阀)vane; blade : &GvSgdttv
2-5.排气阀discharge valve: |"9vq<`
2-6.气镇阀gas ballast valve: fX6pW%Q'6
2-7.膨胀室expansion chamber: nZc6
*jiz
2-8.压缩室compression chamber: YI > xxWA
2-9.真空泵油 vacuum pump oil: }[MkJ21!
2-10.泵液 pump fluid: ]=I2:Rb
2-11.喷嘴 nozzle: QD%6K=8Q
2-13.喷嘴扩张率nozzle expansion rate: mH5>50H;
2-14.喷嘴间隙面积 nozzle clearance area : _x#y
2-15.喷嘴间隙nozzle clearance: k B4Fz
2-16.射流jet: _`0DO4IU
2-17.扩散器diffuser: VM\\.L
2-18.扩散器喉部diffuser thoat: aGsO~ODc
2-19.蒸汽导管vapor tube(pipe;chimney): +aPe)U<t
2-20.喷嘴组件nozzle assembly: J^%E$s
2-21.下裙skirt: U5@B7v1
]#rV]As
3.附件 jO|`aUYTf
3-1阱trap: 8*&73cp
⑴.冷阱 cold trap: ;C
,
g6{
⑵.吸附阱sorption trap: 5 wN)N~JE
⑶.离子阱ion trap: w}t}Sh
⑷.冷冻升华阱 cryosublimation trap: GC3d7
3-2.挡板baffle: Br&&#
3-3.油分离器oil separator: x2aG5@<3
3-4.油净化器oil purifier: <w8H[y"c
3-5.冷凝器condenser: $ndBT+i
aRI. &3-
4.泵按工作分类 ,1lW`Krx
4-1.主泵main pump: dnXu(e%
4-2.粗抽泵roughing vacuum pump: C=U4z|Ym
4-3.前级真空泵backing vacuum pump: X}C8!LA
4-4.粗(低)真空泵 roughing(low)vacuum pump: "&^KnWk=
4-5.维持真空泵holding vacuum pump: (b&Z\?"
4-6.高真空泵high vacuum pump: R\#5;W^
4-7.超高真空泵ultra-high vacuum pump: $AMcU5^b7
4-8.增压真空泵booster vacuum pump: .pm%qEh
TL7qOA7^X
5.真空泵特性 0Q,Tcj
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: T2)CiR-b
5-2.真空泵的抽气量Q throughput of vacuum pump:。 t7xJ"
5-3.起动压力starting pressure: {)!ua7GF0H
5-4.前级压力 backing pressure : d7zZ~n
5-5.临界前级压力 critical backing pressure: YN:Sn\`D 8
5-6.最大前级压力maximum backing pressure: ^gpd '*b
5-7.最大工作压力maximum working pressure: xXmlHo<D
5-8.真空泵的极限压力ultimate pressure of a pump: o8%o68py
5-9.压缩比compression ratio: T?.l_"%%d
5-10.何氏系数Ho coefficient: KZ^>_K&
5-11.抽速系数speed factor: EGFPv'De
5-12.气体的反扩散back-diffusion of gas: CtD<%v3`
5-13.泵液返流back-streaming of pump fluid: {Dy,|}7s
5-14.返流率back-streaming rate ;:J"- p
5-15.返迁移back-migration: ,pf\g[tz
5-16.爆腾bumping: QyZ'%T5J
5-17.水蒸气允许量qm water vapor tolerable load: sE|8a
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: ;b=7m#5
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: HJpx,NU'
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump ~HT:BO$
3. 1.一般术语 'xaEG,P
1-1.压力计pressure gauge: |o(te
1-2.真空计vacuum gauge: $M4_"!
⑴.规头(规管)gauge head: R3)ccom
⑵.裸规nude gauge : v~._]f$:
⑶.真空计控制单元gauge control unit : aYHs35
⑷.真空计指示单元gauge indicating unit : ^"vmIC.h
:fy,%su
2.真空计一般分类 ^(7l!
2-1.压差式真空计differential vacuum gauge: EBQ_c@
2-2.绝对真空计 absolute vacuum gauge: IEJ)Q$GI#
2-3.全压真空计total pressure vacuum gauge: X9^q-3&60
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: dBN:
2-5.相对真空计relative vacuum gauge : 6!*zgA5M'
ybv< 1
3.真空计特性 +#(GU9_i+M
3-1.真空计测量范围pressure range of vacuum gauge: ^U,C])n
3-2.灵敏度系数sensitivity coefficient: <+b~E,
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): PG|Zu3[
3-5.规管光电流photon current of vacuum gauge head: %P#|
}
3-6.等效氮压力equivalent nitrogen pressure : >Kl_948
3-7.X射线极限值 X-ray limit: =_Z.x&fi
3-8.逆X射线效应anti X-ray effect: M.)z;[3O
3-9.布利尔斯效应blears effect: Nr]guC? rE
HyYJ"54
4.全压真空计 `(O#$n
4-1.液位压力计liquid level manometer: H&k&mRi
4-2.弹性元件真空计elastic element vacuum gauge: d+ $:u
4-3.压缩式真空计compression gauge: ,,)'YhG(
4-4.压力天平pressure balance: Zny9TP
4-5.粘滞性真空计viscosity gauge : MD,BGO?C
4-6.热传导真空计thermal conductivity vacuum gauge : G#uB%:)&0u
4-7.热分子真空计thermo-molecular gauge: YX3NZW2i
4-8.电离真空计ionization vacuum gauge: Fy.!amXu
4-9.放射性电离真空计radioactive ionization gauge: 7nW <kA
4-10.冷阴极电离真空计cold cathode ionization gauge: s(L!]d.S$y
4-11.潘宁真空计penning gauge: "(';UFa
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: g0;6}n
4-13.放电管指示器discharge tube indicator: 3qV\XC+
4-14.热阴极电离真空计hot cathode ionization gauge: e-lc2$o7{
4-15.三极管式真空计triode gauge: >I&s%4
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: *Id[6Z
4-17.B-A型电离真空计Bayard-Alpert gauge: [?2?7>D8
4-18.调制型电离真空计modulator gauge: mU||(;I
4-19.抑制型电离真空计suppressor gauge: Sb)}
4-20.分离型电离真空计extractor gauge: ^EmePkPI
4-21.弯注型电离真空计bent beam gauge: 65RD68a
4-22.弹道型电离真空计 orbitron gauge : -h8Z@r~a/
4-23.热阴极磁控管真空计hot cathode magnetron gauge: u`!Dp$P
X>]<rEh
5.分压真空计(分压分析器) %y)hYLOJ
5-1.射频质谱仪radio frequency mass spectrometer: 1h)K3cC
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: hOdU%
5-3.单极质谱仪momopole mass spectrometer: $"0`2C
5-4.双聚焦质谱仪double focusing mass spectrometer: wg:\$_Og
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: uOd1:\%*
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: 7c@5tCcC-
5-7.回旋质谱仪omegatron mass spectrometer: YNp-A.o
W@
5-8.飞行时间质谱仪time of flight mass spectrometer: =i/r:
%\!0*(8
6.真空计校准 N7X(gh2h
6-1.标准真空计reference gauges: E^pn-rB
6-2.校准系统system of calibration: 3z"%ht~;
6-3.校准系数K calibration coefficient: tejpY
6-4.压缩计法meleod gauge method: t[G7&ovj
6-5.膨胀法expansion method: RYl\Q,#
6-6.流导法flow method: AF{@lDa1h
4. 1.真空系统vacuum system z>
N73 u
1-1.真空机组pump system: @;S)j!m`
1-2.有油真空机组pump system used oil : {?3i^Q=V
1-3.无油真空机组oil free pump system 4>Nig.#
1-4.连续处理真空设备continuous treatment vacuum plant: <9;X1XtpI
1-5.闸门式真空系统vacuum system with an air-lock: t+0/$
1-6.压差真空系统differentially pumped vacuum system: yK_$d0ZGE~
1-7.进气系统gas admittance system: |H5$VSw
=xb/zu(
2.真空系统特性参量 ?dCJv_w
2-1.抽气装置的抽速volume flow rate of a pumping unit : #wh[F"zX
2-2.抽气装置的抽气量throughput of a pumping unit : IZd~Am3f
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: AD6 b
2-4.真空系统的漏气速率leak throughput of a vacuum system: 'BVI ^H4
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: 0 r;tI"
2-6.极限压力ultimate pressure: C9>^!?>
2-7.残余压力residual pressure: |n(b>.X
2-8.残余气体谱residual gas spectrum: PevT`\>
2-9.基础压力base pressure: 4v#s!W
2-10.工作压力working pressure: !4YmaijeN
2-11.粗抽时间roughing time: 9.6ni1a'
2-12.抽气时间pump-down time: B!)Tytm9u
2-13.真空系统时间常数time constant of a vacuum system: w.=rea~
2-14.真空系统进气时间venting time: ,z+n@sUR:
1{qG?1<zZ6
3.真空容器 xBqZ:
BQ
3-1.真空容器;真空室vacuum chamber: 8Qkwg]X
3-2.封离真空装置sealed vacuum device: )cm^;(#pV
3-3.真空钟罩vacuum bell jar: T[J8zLO
3-4.真空容器底板vacuum base plate: #VZ
js`d6
3-5.真空岐管vacuum manifold: &m TYMpA
3-6.前级真空容器(贮气罐)backing reservoir: .j"@7#tW
3-7.真空保护层outer chamber: A 0;ng2&
3-8.真空闸室vacuum air lock: }|znQ3A2\l
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: SUsdX[byb
@ xTVX'$
4.真空封接和真空引入线 1h{7dLA
4-1.永久性真空封接permanent seal : '\"5qB
4.2.玻璃分级过渡封接graded seal : vJb/.)gh]
4-3.压缩玻璃金属封接compression glass-to-metal seal: DYgz;Y/%l
4-4.匹配式玻璃金属封接matched glass-to-metal seal: =}SLQdT
4-5.陶瓷金属封接ceramic-to-metal seal: W"tGCnd
4-6.半永久性真空封接semi-permanent seal : F-D$Y?m
4-7.可拆卸的真空封接demountable joint: ~!/a gLwY
4-8.液体真空封接liquid seal }=u#,nDl>$
4-9.熔融金属真空封接molten metal seal: DJ!pZUO{
4-10.研磨面搭接封接ground and lapped seal: 7<X!Xok
4-11.真空法兰连接vacuum flange connection: g$qM}#s0}
4-12.真空密封垫vacuum-tight gasket: 3u,B<
4-13.真空密封圈ring gasket: FbW$H]C$
4-14.真空平密封垫flat gasket: Xpfw2;`U'
4-15.真空引入线feedthrough leadthrough: NpS =_QeNw
4-16.真空轴密封shaft seal: LO38}w<k
4-17.真空窗vacuum window: /?}2OCq
4-18.观察窗viewing window: U8<C4
Z55C4F5v
5.真空阀门 d?/>Qqw:#
5-1.真空阀门的特性characteristic of vacuum valves: e&NJj:Ph*
⑴.真空阀门的流导conductance of vacuum valves: /!*=*
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: x,GLGGi}_x
5-2.真空调节阀regulating valve: S&c5Q*->[
5-3.微调阀 micro-adjustable valve: -Q%Pg<Q-#
5-4.充气阀charge valve: o
ethO
5-5.进气阀gas admittance valve: IL"N_ux~w~
5-6.真空截止阀break valve: VaO[SW^
5-7.前级真空阀backing valve: s&\krW&
5-8.旁通阀 by-pass valve: qga?-oz,<6
5-9.主真空阀main vacuum valve: bfK4ps}m*
5-10.低真空阀low vacuum valve: lLU8eHf\
5-11.高真空阀high vacuum valve: NGW:hgf
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: J58S8:c
5-13.手动阀manually operated valve: 9H+Q/Q*-a
5-14.气动阀pneumatically operated valve: 8cuI-Swz
5-15.电磁阀electromagnetically operated valve: ENFM``dV#
5-16.电动阀valve with electrically motorized operation: ^^*Ia'9
5-17.挡板阀baffle valve: rshUF
5-18.翻板阀flap valve: WDt 6{5T
5-19.插板阀gate valve: }$(\,SzW
5-20.蝶阀butterfly valve: +/hd;s$x
`dRqheX
6.真空管路 c Ze59
6-1.粗抽管路roughing line: $\PU Y8
6-2.前级真空管路backing line: M6].V *k'2
6-3.旁通管路;By-Pass管路 by-pass line: q*cEosi'F?
6-4.抽气封口接头pumping stem: r4b-.>w
6-5.真空限流件limiting conductance: #RHt;SFx
6-6.过滤器filter: sFsf~|
5. 1.一般术语 .-Dc%ap]
1-1真空镀膜vacuum coating: +M<W8KF
1-2基片substrate: 2)-4?uz~
1-3试验基片testing substrate: NnaO!QW%
1-4镀膜材料coating material: m!]J{OGG:
1-5蒸发材料evaporation material: d;{k,rP6
1-6溅射材料sputtering material: Bi>]s%zp
1-7膜层材料(膜层材质)film material: amWKykVS5
1-8蒸发速率evaporation rate: FwD
q@Oj
1-9溅射速率sputtering rate: M;YJpi
1-10沉积速率deposition rate: )RQQhB
1-11镀膜角度coating angle: !t\sg
F6C7k9
2.工艺 QXgfjo
2-1真空蒸膜vacuum evaporation coating: t=fP^bJ
(1).同时蒸发simultaneous evaporation: c6SXz%'k
(2).蒸发场蒸发evaporation field evaporation: [8K :ml
(3).反应性真空蒸发reactive vacuum evaporation: ]ZNFrpq
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: zMd><UQP{
(5).直接加热的蒸发direct heating evaporation: OU!."r`9
(6).感应加热蒸发induced heating evaporation: z";(0%
(7).电子束蒸发electron beam evaporation: 0?O_]SD
(8).激光束蒸发laser beam evaporation: MZ~N}y
(9).间接加热的蒸发indirect heating evaporation: m7i(0jd
+
(10).闪蒸flash evaportion: : t/0
2-2真空溅射vacuum sputtering: D]N)
(1).反应性真空溅射 reactive vacuum sputtering: k$pND,Ws
(2).偏压溅射bias sputtering: oA@c.%&
(3).直流二级溅射direct current diode sputtering: '%o^#gJ p
(4).非对称性交流溅射asymmtric alternate current sputtering: ln8es{q
(5).高频二极溅射high frequency diode sputtering: .K`n;lVs
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: m;L3c(r.
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: W>:MK-_J
(8).离子束溅射ion beam sputtering: h0I5zQZm
(9).辉光放电清洗glow discharge cleaning: M }q;\}
2-3物理气相沉积PVD physical vapor deposition: L!,@_
2-4化学气相沉积CVD chemical vapor deposition: b~@+6?
2-5磁控溅射magnetron sputtering: w\{#nrhYU
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: XL'\$f
2-7空心阴极离子镀HCD hollow cathode discharge deposition: $xcZ{C
2-8电弧离子镀arc discharge deposition: qk(bA/+e
M0OIcMTv
3.专用部件 s!>9od6^
3-1镀膜室coating chamber: S(CVkCP
3-2蒸发器装置evaporator device: $`lm]} {&
3-3蒸发器evaporator: m9+?>/R
3-4直接加热式蒸发器evaporator by direct heat: Q>cE G"
3-5间接加热式蒸发器evaporator by indirect heat: ,t:P
3-7溅射装置sputtering device: T8Q_JQ
3-8靶target: )d2:r 07a
3-10时控挡板timing shutter: 1}+b4"7]
3-11掩膜mask: M^>l>?#rl
3-12基片支架substrate holder: &0fV;%N
3-13夹紧装置clamp: 'f.k'2T
3-14换向装置reversing device: PsD)]V9%:
3-15基片加热装置substrate heating device: H4j1yD(d
3-16基片冷却装置substrate colding device: *'\ HG
Mc!LC
.8
4.真空镀膜设备 5UG9&:zu'V
4-1真空镀膜设备vacuum coating plant: q8FpJ\
(1).真空蒸发镀膜设备vacuum evaporation coating plant: rBy0hGx
(2).真空溅射镀膜设备vacuum sputtering coating plant: 8Op^6rX4
4-2连续镀膜设备continuous coating plant: _*b`;{3
4-3半连续镀膜设备semi- continuous coating plant a'.7)f[g}
6. 1.漏孔 kGYsjhL\d
1-1漏孔leaks: `"<hO
'WU
1-2通道漏孔channel leak: }^j8<
1-3薄膜漏孔membrane leak: e4tC[6 ;
1-4分子漏孔molecular leak:
]qu6/Z
1-5粘滞漏孔vixcous leak: )=MK&72r
1-6校准漏孔calibrated leak: d2^/
1-7标准漏孔reference leak : *<6dB#'
J
1-8虚漏virtual leak: $R+gA{49%
1-9漏率leak rate: 3IB9-wG
1-10标准空气漏率standard air leak rate: `!(%Rk
1-11等值标准空气漏率equivalent standard air leak rate: MI(;0
1-12探索(示漏)气体: x'..j5
pU'>!<zGr
2.本底 _Hfpizm
2-1本底background: Z @ef2y;
2-2探索气体本底search gas background : wu`+KUx
2-3漂移drift: >]C/ Q6
2-4噪声noise: $5&~gHc,
I,HtW ),
3.检漏仪 V\opC6*L_e
3-1检漏仪leak detector: !H{>c@i
3-2高频火花检漏仪H.F. spark leak detector: O:pg+o&
3-3卤素检漏仪halide leak detector: DT)][V^w
3-4氦质谱检漏仪helium mass spectrometer leak detector: "@/pQoLy
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: =&qH%S6
YRr,{[e
4.检漏 $xq04ejJ
4-1气泡检漏leak detection by bubbles: d_0(;'
4-2氨检漏leak detection by ammonia: UK1 )U)*+
4-3升压检漏leak detection of rise pressure: qu dY9_
4-4放射性同位素检漏radioactive isotope leak detection: r|jM;
4-5荧光检漏fluorescence leak detection ZGsd cnz
7. 1.一般术语 V2M4g
1-1真空干燥vacuum drying: m%>}T75C^
1-2冷冻干燥freeze drying : _nEVmz!zg
1-3物料material: R5(([C1
1-4待干燥物料material to be dried: vw(ecs^C
1-5干燥物料dried material : 3dLqlJ^7B
1-6湿气moisture;humidity: Il(o[Q>jJ3
1-7自由湿气free moisture: p@uHzu7
1-8结合湿气bound moisture: n:) [%on
1-9分湿气partial moisture: b6sf1E
1-10含湿量moisture content: e84%Y8,0
1-11初始含湿量initial moisture content: dv3u<X M~
1-12最终含湿量final residual moisture: 6w{_+=T
1-13湿度degree of moisture ,degree of humidity : Dm8fcD
1-14干燥物质dry matter : Az8ZA ~Op=
1-15干燥物质含量content of dry matter: DI2e%`$
I"x|U[*B
2.干燥工艺 %dq%+yw{%m
2-1干燥阶段stages of drying : w?^[*_Y
(1).预干燥preliminary dry: 6sQ;Z |!Pz
(2).一次干燥(广义)primary drying(in general): Ql l{;A
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): <)T~_s
(4).二次干燥secondary drying: >A6W^J|[
2-2.(1).接触干燥contact drying: -PGxG 8S
(2).辐射干燥 drying by radiation : !6RDq`
(3).微波干燥microwave drying: {=mGXd`x?l
(4).气相干燥vapor phase drying: GiEt;8
(5).静态干燥static drying: vt*
(6).动态干燥dynamic drying: K%mR=u#%&
2-3干燥时间drying time: JoiGuZd>
2-4停留时间length of stay(in the drying chamber): BG?>)]6
2-5循环时间cycle time: `XK\',
}F
2-6干燥率 dessication ratio : II.:k.D`
2-7去湿速率mass flow rate of humidity: .74C~{}$
2-8单位面积去湿速率mass flow rate of humidity per surface area: j4=iHnE;
2-9干燥速度 drying speed : Ddg!1SF
2-10干燥过程drying process: " M?dU^U^
2-11加热温度heating temperature: aGi`(|shW
2-12干燥温度temperature of the material being dried : JJ}DYv
2-13干燥损失loss of material during the drying process : H)gc"aRe;Y
2-14飞尘lift off (particles): q{f\_2[
2-15堆层厚度thickness of the material: EA8plQ~GtE
0zSz[;A
3.冷冻干燥 \gPMYMd
3-1冷冻freezing: Ry]9n.y
(1).静态冷冻static freezing: 0:u:#))1
(2).动态冷冻dynamic freezing: nQ+5jGP1
(3).离心冷冻centrifugal freezing: Uuu2wz3O0
(4).滚动冷冻shell freezing: w)@Wug
(5).旋转冷冻spin-freezing: $`/UG0rdC
(6).真空旋转冷冻vacuum spin-freezing: ZCc23UwI
(7).喷雾冷冻spray freezing: E&y)`>Nq{
(8).气流冷冻air blast freezing: :?g+\:`/0j
3-2冷冻速率rate of freezing: xRXvTNEg
3-3冷冻物料frozen material: 7_l
Wr
3-4冰核ice core: K|-m6!C!7
3-5干燥物料外壳envelope of dried matter: ]3f[v:JQ
3-6升华表面sublimation front: \ f+;X
3-7融化位置freezer burn: 5 D^#6h 4
@_-,Q5
4.真空干燥设备;真空冷冻干燥设备 Z.Z;p/4F
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: $6wSqH?q
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: 'F.P93
4-3加热表面heating surface: Qr3!6
4-4物品装载面shelf : #!UJY%c~
4-5干燥器的处理能力throughput (of the vacuum drying chamber): ``VE<:2+
4-6单位面积干燥器处理能力throughput per shelf area: 6?<lS.s
4-7冰冷凝器ice condenser: ov,s]g83
4-8冰冷凝器的负载load of the ice condenser: 5!qf{4j
4-9冰冷凝器的额定负载rated load of the ice condenser K&NH?
8. 1.一般术语 0LL0\ly]
1-1试样sample : 63Gq5dF
(1).表面层surface layer: u_9c>
(2).真实表面true surface: 8uLS7\,$z
(3).有效表面积effective surface area: g1[BrT,
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: Er
j{_i?R?
(5).表面粒子密度surface particle density: T:{r*zLSN
(6).单分子层monolayer: jF}kV%E
(7).表面单分子层粒子密度monolayer density: GEf=A.WAfw
(8).覆盖系数coverage ratio: $Uy+]9
1-2激发excitation:
-WqhOZ
(1).一次粒子primary particle: ROQ]sQpk
(2).一次粒子通量primary particle flux: j;_
(3).一次粒子通量密度density of primary particle flux: Ru*gbv,U
(4).一次粒子负荷primary particle load:
a}FyJp
(5).一次粒子积分负荷integral load of primary particle: H(76sE
(6).一次粒子的入射能量energy of the incident primary particle: W#P\hx
(7).激发体积excited volume: r.#r!.6 q
(8).激发面积excited area: <Y}m/-sD5
(9).激发深度excited death: z!bT^_Cc0
(10).二次粒子secondary particles: -sJD:G,%
(11).二次粒子通量secondary particle flux: sa o &
(12).二次粒子发射能energy of the emitted secondary particles: 7JQ4*RM
(13).发射体积emitting volume: K\U`gTGc
(14).发射面积emitting area: 9Q s5e
(15).发射深度emitting depth: *,lDo9
(16).信息深度information depth: vMou`[\WlJ
(17).平均信息深度mean information depth: =oL:|$Pj
1-3入射角angle of incidence: E#(e2Z=
1-4发射角angle of emission: Q2m[XcnX
1-5观测角observation:
{q8|/{;
1-6分析表面积analyzed surface area: vJ'22)n
1-7产额 yield : aQx6;PC
1-8表面层微小损伤分析minimum damage surface analysis: }>BNdm"Er
1-9表面层无损伤分析non-destructive surface analysis: _yN5sLLyb
1-10断面深度分析 profile analysis in depth; depth profile analysis : W1"NKg~4
1-11可观测面积observable area: P`Ku.
ONQ
1-12可观测立体角observable solid angle : SQf[1}$ .
1-13接受立体角;观测立体角angle of acceptance: F=e;[uK\
1-14角分辨能力angular resolving power: j`.&4.7+
1-15发光度luminosity: g*oX`K.
1-16二次粒子探测比detection ratio of secondary particles: Y(7&3+'K
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: g tMR/P:S
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: xtv%C
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: q`2dL)E
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: X(BxC<!D.
1-21本底压力base pressure: "M
iJM+,
1-22工作压力working pressure: U~ a\v8l~
#bt f|\D
2.分析方法 p! :oT1U
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: K(upzn*a
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : S5>ztK.e
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: _4Eq_w`
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: QEt"T7a[/
2-3离子散射表面分析ion scattering spectroscopy: oZY|o0/9
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: ?y>ji1
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: Y2l;NSWU
2-6离子散射谱仪ion scattering spectrometer: 0g:q%P0
2-7俄歇效应Auger process: nn:'<6"oV
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: ya~;Of5
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: iKPgiL~
2-10光电子谱术photoelectron spectroscopy : I[K4/91
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: au50%sA~
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: Gy):hGgN
2-11光电子谱仪photoelectron spectrometer: &K'*67h
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: --l
UEo ~
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: \w1XOm [)
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): y]@JkF(
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus