“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 L(eLxw e%
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真空术语 Ucz`^}+
2q.J1:lW
1.标准环境条件 standard ambient condition: bIahjxd:
2.气体的标准状态 standard reference conditions forgases: p_2-(n@
3.压力(压强)p pressure: V,)bw
4.帕斯卡Pa pascal:
^iaG>rvA
5.托Torr torr: 8!{F6DG
6.标准大气压atm standard atmosphere: x0_$,Tz@
7.毫巴mbar millibar: w#M66=je_
8.分压力 partial pressure: W-+~r
9.全压力 total pressure: v9s/!<j
10.真空 vacuum: =E''$b?Em
11.真空度 degree of vacuum: !r*Ogv[
12.真空区域 ranges of vacuum: +\n8##oAI
13.气体 gas: E)w^odwMU
14.非可凝气体 non-condensable gas: H$i4OQ2
15.蒸汽vapor: VdV18-ea
16.饱和蒸汽压saturation vapor pressure: =tE7XC3X_
17.饱和度degree of saturation: yb:Xjg7
18.饱和蒸汽saturated vapor: B'Ll\<mq@
19.未饱和蒸汽unsaturated vapor: 2-*zevPiG=
20.分子数密度n,m-3 number density of molecules: )a%kAUNj
21.平均自由程ι、λ,m mean free path: 8Yq_6
22.碰撞率ψ collision rate: w8df-]r
23.体积碰撞率χ volume collision rate: k-&fPEjG
24.气体量G quantity of gas: 9'|NF<
25.气体的扩散 diffusion of gas: {m/h3hjFa
26.扩散系数D diffusion coefficient; diffusivity: co$I htOv
27.粘滞流 viscous flow: 0"_FQv
28.粘滞系数η viscous factor: xi2!__
29.泊肖叶流 poiseuille flow: OZ6gu$
n*
30.中间流 intermediate flow: 6Tn.56 X
31.分子流 molecular flow: Oi=c
6n
32克努曾数 number of knudsen: |i7j}i
33.分子泻流 molecular effusion; effusive flow: z\fmwI
34.流逸 transpiration: ')Drv)L
35.热流逸 thermal transpiration: tz&oe
36.分子流率qN molecular flow rate; molecular flux: |lOH
P A
37.分子流率密度 molecular flow rate density; density of molecular flux: #sK:q&/G`
38.质量流率qm mass flow rare: [80L|?, *
39.流量qG throughput of gas: ,dM}B-
40.体积流率qV volume flow rate: 7]w]i5
41.摩尔流率qυ molar flow rate: "[ 091 <
42.麦克斯韦速度分布 maxwellian velocity distribution: U!rhj&n
43.传输几率Pc transmission probability: O*dN+o
44.分子流导CN,UN molecular conductance: ersddb^J]
45.流导C,U conductance: oyS43/."
46.固有流导Ci,Ui intrinsic conductance: Bu\:+3 )
47.流阻W resistance: t`6R)'
48.吸附 sorption: kCO`JAH#
49.表面吸附 adsorption: \/Z?QBFvz
50.物理吸附physisorption: n:-:LSa+3
51.化学吸附 chemisorption: I'M,p<B
52.吸收absorption: #R<ErX)F
53.适应系数α accommodation factor: qd=&*?
54.入射率υ impingement rate: :qbbo~U
55.凝结率condensation rate: 1d4?+[)gUv
56.粘着率 sticking rate: ?n 9<PMo
57.粘着几率Ps sticking probability: jW^@lH
EU
58.滞留时间τ residence time: Ydw04WEJ
59.迁移 migration: ^x8yWbrE
60.解吸 desorption: Bn 5]{Df
61.去气 degassing: [f9U9.fR
62.放气 outgassing: fZQC'Z>EX
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: ^Gc#D:zU
64.蒸发率 evaporation rate: mlsM;Ad2
65.渗透 permeation: |]tIE{d
66.渗透率φ permeability: Gf(|?"
H
67.渗透系数P permeability coefficient "w#jC~J<W
2. 1.真空泵 vacuum pumps =}6yMR!4R<
1-1.容积真空泵 positive displacement pump: 9U[
A
⑴.气镇真空泵 gas ballast vacuum pump: ai!zb2j!E
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: 6PF7Wl7.
⑶.干封真空泵 dry-sealed vacuum pump: &R\t<X9 n
⑷.往复真空泵 piston vacuum pump: Q:6i
3 Nr/
⑸.液环真空泵 liquid ring vacuum pump: 7$8YBcZ6
⑹.旋片真空泵 sliding vane rotary vacuum pump: vR X_}`m8#
⑺.定片真空泵 rotary piston vacuum pump: 2E
Ufd\
⑻.滑阀真空泵 rotary plunger vacuum pump: uTgvMkO
⑼.余摆线真空泵 trochoidal vacuum pump: s}NE[Tw
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: FwB}@)3
⑾.罗茨真空泵 roots vacuum pump: KiXRBFo
1-2.动量传输泵 kinetic vacuum pump: \>b
:
⑴.牵引分子泵molecular drag pump: \OV><|Lkh
⑵.涡轮分子泵turbo molecular pump: x]~{#pH@<
⑶.喷射真空泵ejector vacuum pump: r &<sSE;5
⑷.液体喷射真空泵liquid jet vacuum pump: t u)kWDk
⑸.气体喷射真空泵gas jet vacuum pump: ~(( '1+
⑹.蒸汽喷射真空泵vapor jet vacuum pump : jA&ZO>4
⑺.扩散泵diffusion pump : q97Z .o
⑻.自净化扩散泵self purifying diffusion pump: R!mFMw"
⑼.分馏扩散泵 fractionating diffusion pump : 2$)xpET
⑽.扩散喷射泵diffusion ejector pump : Z2HH&3HA
⑾.离子传输泵ion transfer pump: (%&HufT
1-3.捕集真空泵 entrapment vacuum pump: ~C|. .Z
⑴吸附泵adsorption pump: f~HC%C
YH
⑵.吸气剂泵 getter pump: tVB9kxtE
⑶.升华(蒸发)泵 sublimation (evaporation)pump : }Zs
y&K
⑷.吸气剂离子泵getter ion pump: Pz+2(Z
⑸.蒸发离子泵 evaporation ion pump: ws!pp\F
⑹.溅射离子泵sputter ion pump: fwe4f
⑺.低温泵cryopump: 381a(F[$e
^lB=O
2.真空泵零部件 7+!4pf
2-1.泵壳 pump case: {yo<19kV@
2-2.入口 inlet: eXB'>#&s
2-3.出口outlet: _"b[UT}m
2-4.旋片(滑片、滑阀)vane; blade : N-
!>\n
2-5.排气阀discharge valve: :gD=F &V
2-6.气镇阀gas ballast valve: p_^Jr*Mv
2-7.膨胀室expansion chamber: /$w,8pV=
2-8.压缩室compression chamber: yK1@`3@?
2-9.真空泵油 vacuum pump oil: 3`%]3qd}
2-10.泵液 pump fluid: 4=BIYC"Lu
2-11.喷嘴 nozzle: >(>,*zP<9
2-13.喷嘴扩张率nozzle expansion rate: k}MmgaT:5]
2-14.喷嘴间隙面积 nozzle clearance area : ZDQc_{e{
2-15.喷嘴间隙nozzle clearance: d:j65yu
2-16.射流jet: V 6DWYs>
2-17.扩散器diffuser: _#9F@SCA
2-18.扩散器喉部diffuser thoat: t)!(s,;T
2-19.蒸汽导管vapor tube(pipe;chimney): L5 -p0O`R
2-20.喷嘴组件nozzle assembly: M>eMDCB\
2-21.下裙skirt: <_o).hE{
sbeS9vE
3.附件 >-%tvrS%
3-1阱trap: 2.,4b- ^
⑴.冷阱 cold trap: A_:CGtv:
⑵.吸附阱sorption trap: Mj9Mv<io
⑶.离子阱ion trap: 3}Xf
⑷.冷冻升华阱 cryosublimation trap: &xAwk-{W
3-2.挡板baffle: F'~\!dNL
3-3.油分离器oil separator: [:CV5k~xc
3-4.油净化器oil purifier: @N
tiT,3k
3-5.冷凝器condenser: ? Zhnb0/
uWtj?Q+M|
4.泵按工作分类 e-Pn,j
4-1.主泵main pump: ;hz;|\ko5
4-2.粗抽泵roughing vacuum pump: *Y:;fl +v
4-3.前级真空泵backing vacuum pump: F,[GdE;P
4-4.粗(低)真空泵 roughing(low)vacuum pump: zwLJ|>
4-5.维持真空泵holding vacuum pump: K:<j=j@51
4-6.高真空泵high vacuum pump: ]
I&l0Fx
4-7.超高真空泵ultra-high vacuum pump: n+'gVEBA
4-8.增压真空泵booster vacuum pump: tL>c@w#Pv
j
aU.hASj
5.真空泵特性 uK6'TJ
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: 43'!<[?x
5-2.真空泵的抽气量Q throughput of vacuum pump:。 [C>>j;q%
5-3.起动压力starting pressure: EE{]EW(
5-4.前级压力 backing pressure : %X5p\VS\7
5-5.临界前级压力 critical backing pressure: wr) \GJ#>
5-6.最大前级压力maximum backing pressure: (9]8r2|.
5-7.最大工作压力maximum working pressure: ~x-"?K
5-8.真空泵的极限压力ultimate pressure of a pump:
;4:[kv@
5-9.压缩比compression ratio: v@&UTU
5-10.何氏系数Ho coefficient: QC,LHt?6
5-11.抽速系数speed factor: &1 BACKu
5-12.气体的反扩散back-diffusion of gas: aVE/qXB
5-13.泵液返流back-streaming of pump fluid: 6T9?C|q
5-14.返流率back-streaming rate xlP0?Y1Bl
5-15.返迁移back-migration: }!`_Bz:
5-16.爆腾bumping: I(5sKU3<
5-17.水蒸气允许量qm water vapor tolerable load: 'PS_|zI
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: 59@PY! c>
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: D;Bij=
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump J4woZ{d
3. 1.一般术语 r.JM!x8
1-1.压力计pressure gauge: w$evAPuz^
1-2.真空计vacuum gauge: O30eq 7(
⑴.规头(规管)gauge head: )w_hbU_Pb&
⑵.裸规nude gauge : ~VKuRli|m
⑶.真空计控制单元gauge control unit : qlNB\~HCe
⑷.真空计指示单元gauge indicating unit : >7$h
"n, %Hh
2.真空计一般分类 * YR>u@
2-1.压差式真空计differential vacuum gauge: 3nbTK3,
2-2.绝对真空计 absolute vacuum gauge: !r#36kO
2-3.全压真空计total pressure vacuum gauge: *-vH64e
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: sqv!,@*q
2-5.相对真空计relative vacuum gauge : 6N#0D2~^
4;|@eN
3.真空计特性 g9.y`o}c
3-1.真空计测量范围pressure range of vacuum gauge: Oj F]K,$
3-2.灵敏度系数sensitivity coefficient: Y(<(!TJ-
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): =j!nt8]8
3-5.规管光电流photon current of vacuum gauge head: s}93nv*ez
3-6.等效氮压力equivalent nitrogen pressure : TB%NHq-!
3-7.X射线极限值 X-ray limit: 84g8$~M
3-8.逆X射线效应anti X-ray effect: X
2Zp@q(
3-9.布利尔斯效应blears effect: n|'}W+
}nK=~Wcu\
4.全压真空计 ;39~G T
4-1.液位压力计liquid level manometer: k++"
4-2.弹性元件真空计elastic element vacuum gauge: f5`q9w_c
4-3.压缩式真空计compression gauge: #ULzh&yO
4-4.压力天平pressure balance: <"z9(t(V\%
4-5.粘滞性真空计viscosity gauge : m:W+s4!E
4-6.热传导真空计thermal conductivity vacuum gauge : 5M?
I-m
4-7.热分子真空计thermo-molecular gauge: xFj<KvV[
4-8.电离真空计ionization vacuum gauge: c?%}J\<n
4-9.放射性电离真空计radioactive ionization gauge: Qm)c!
4-10.冷阴极电离真空计cold cathode ionization gauge: Srom@c
4-11.潘宁真空计penning gauge: G2s2i2&6E
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: qir8RPW
4-13.放电管指示器discharge tube indicator: wu;^fL
4-14.热阴极电离真空计hot cathode ionization gauge: 6#;u6@+}yy
4-15.三极管式真空计triode gauge: S#F%OIx
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: l3Wh&*0
4-17.B-A型电离真空计Bayard-Alpert gauge: mum4Uj
4-18.调制型电离真空计modulator gauge: 9!,f4&G`
4-19.抑制型电离真空计suppressor gauge: Ewa/6=]LA
4-20.分离型电离真空计extractor gauge: v@1f,d
4-21.弯注型电离真空计bent beam gauge: 9`Y\`F#}q
4-22.弹道型电离真空计 orbitron gauge : r<1.'F
4-23.热阴极磁控管真空计hot cathode magnetron gauge: AmX ~KK
`s\E"QeZN
5.分压真空计(分压分析器) ^5Ob(FvU
5-1.射频质谱仪radio frequency mass spectrometer: /_V4gwb}|-
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: *EF`s~
5-3.单极质谱仪momopole mass spectrometer: h%ba!
5-4.双聚焦质谱仪double focusing mass spectrometer: R,8460e7
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: axM(3k.n
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: \Z^Tk
5-7.回旋质谱仪omegatron mass spectrometer: .|/VD'xV"
5-8.飞行时间质谱仪time of flight mass spectrometer: s(r1q$5
>@.:9}Z
6.真空计校准 '"9Wt@
.
6-1.标准真空计reference gauges: S.*.nv
6-2.校准系统system of calibration: xsRu~'f
6-3.校准系数K calibration coefficient: 9)S,c=z83
6-4.压缩计法meleod gauge method: )rbcY0q
6-5.膨胀法expansion method: la_FZ
6-6.流导法flow method: \os"j
4. 1.真空系统vacuum system vPET'Bf(YV
1-1.真空机组pump system: ;edt["Eu
1-2.有油真空机组pump system used oil : "q7pkxEuJ
1-3.无油真空机组oil free pump system D%h_V>#z
1-4.连续处理真空设备continuous treatment vacuum plant: S20E}bS:>
1-5.闸门式真空系统vacuum system with an air-lock: `e}6/~R`
1-6.压差真空系统differentially pumped vacuum system: Wo,fHY
1-7.进气系统gas admittance system: <]u]rZc$
B18?)LA
2.真空系统特性参量 Df}3^J~JX
2-1.抽气装置的抽速volume flow rate of a pumping unit : WjF#YW\
2-2.抽气装置的抽气量throughput of a pumping unit : {TC_
4Y|8
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: SV i{B*
2-4.真空系统的漏气速率leak throughput of a vacuum system: wmaj[e,h
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: T-.Bof(?w
2-6.极限压力ultimate pressure: |K'7BK_^J
2-7.残余压力residual pressure: o(Q='kK
2-8.残余气体谱residual gas spectrum: AxiCpAS;J
2-9.基础压力base pressure: Yzih-$g
2-10.工作压力working pressure: )WbE -m
2-11.粗抽时间roughing time: 7s2e>6Q[
2-12.抽气时间pump-down time: JA
"
2-13.真空系统时间常数time constant of a vacuum system: FfibR\dhY
2-14.真空系统进气时间venting time: f4+}k GJN
M<3m/l%`Y
3.真空容器 iYl{V']A
3-1.真空容器;真空室vacuum chamber: M%N_4j.
3-2.封离真空装置sealed vacuum device: r&O:Bt}x
3-3.真空钟罩vacuum bell jar: OYY_@'D
3-4.真空容器底板vacuum base plate: nm
!H<
3-5.真空岐管vacuum manifold: 7=@MnF`
3-6.前级真空容器(贮气罐)backing reservoir: 9I*i/fa
3-7.真空保护层outer chamber: NqZR*/BOz
3-8.真空闸室vacuum air lock: J85Kgd1
\a
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: Vf`9[*j
(!dwUB
4.真空封接和真空引入线 rtk1 8U-
4-1.永久性真空封接permanent seal : o;J_"'kP
4.2.玻璃分级过渡封接graded seal : C:P.+AU"`
4-3.压缩玻璃金属封接compression glass-to-metal seal: ~n9-
4-4.匹配式玻璃金属封接matched glass-to-metal seal: ~w}Zv0
4-5.陶瓷金属封接ceramic-to-metal seal: B{-+1f4
4-6.半永久性真空封接semi-permanent seal : zK ir
4-7.可拆卸的真空封接demountable joint: @+^5ze\
4-8.液体真空封接liquid seal U66 zm9
3&
4-9.熔融金属真空封接molten metal seal: : t6.J
4-10.研磨面搭接封接ground and lapped seal: ARa9Ia{@
4-11.真空法兰连接vacuum flange connection: 5JA5:4aev
4-12.真空密封垫vacuum-tight gasket: gTqtTd~L
4-13.真空密封圈ring gasket: 5wGc"JHm
4-14.真空平密封垫flat gasket: 5:
O,-b&
4-15.真空引入线feedthrough leadthrough: w\Bx=a>vc
4-16.真空轴密封shaft seal: TF;}NQ
4-17.真空窗vacuum window: I,YP{H 4
4-18.观察窗viewing window: I
DtGtkF
h2fTG
5.真空阀门 uY*|bD`6&
5-1.真空阀门的特性characteristic of vacuum valves: Vv5#{+eT;
⑴.真空阀门的流导conductance of vacuum valves: o0Pc^
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: 4
n\dh<uY
5-2.真空调节阀regulating valve: 4XsKOv
5-3.微调阀 micro-adjustable valve: ZHW|P
5-4.充气阀charge valve: `DcZpd.n
5-5.进气阀gas admittance valve: bF{14F$
5-6.真空截止阀break valve: 'CC;=@J
5-7.前级真空阀backing valve: pm~uWXqxr=
5-8.旁通阀 by-pass valve: _9Y7.5
5-9.主真空阀main vacuum valve: o 2sOf
5-10.低真空阀low vacuum valve: ^q
?xi5w
5-11.高真空阀high vacuum valve: *Zi:^<hv
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: 7s-ZRb[)1
5-13.手动阀manually operated valve: a]u1_ $)
5-14.气动阀pneumatically operated valve: %$.]g
5-15.电磁阀electromagnetically operated valve: @Zd/>'
5-16.电动阀valve with electrically motorized operation: ILq"/S.
5-17.挡板阀baffle valve: ]@UJ 8hDy
5-18.翻板阀flap valve: tr$~INe
5-19.插板阀gate valve: 84$#!=v
5-20.蝶阀butterfly valve: 6Y(Vs>
cWG?`6xU&
6.真空管路 :D !}jN/)
6-1.粗抽管路roughing line: @I$;
6-2.前级真空管路backing line: rlIDym9nY~
6-3.旁通管路;By-Pass管路 by-pass line: M<x
W)R
6-4.抽气封口接头pumping stem: ^6[o$eY3
6-5.真空限流件limiting conductance: -H;p +XAY
6-6.过滤器filter: $VLCD
5. 1.一般术语 r]+N(&q
1-1真空镀膜vacuum coating: p .^#mN
1-2基片substrate: yxU??#v|g
1-3试验基片testing substrate: "mm|0PUJ
1-4镀膜材料coating material: 'aoHNZfxw
1-5蒸发材料evaporation material: (e$/@3*
1-6溅射材料sputtering material: G[=8Ko0U+n
1-7膜层材料(膜层材质)film material: d5ivtK?
1-8蒸发速率evaporation rate: umD[4aP~;
1-9溅射速率sputtering rate: ,/ P)c*at5
1-10沉积速率deposition rate: |2eF~tJqc
1-11镀膜角度coating angle: ssy+x;<x,
C3
m#v[+
2.工艺 v<qiu>sbz}
2-1真空蒸膜vacuum evaporation coating: fm%1vM$[J
(1).同时蒸发simultaneous evaporation: W~&PGmRI
(2).蒸发场蒸发evaporation field evaporation: M;i4ss,}!
(3).反应性真空蒸发reactive vacuum evaporation: ix=H=U]Q{
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: I3ZbHb-)_,
(5).直接加热的蒸发direct heating evaporation: 4vk^=
(6).感应加热蒸发induced heating evaporation: #n_uELE
(7).电子束蒸发electron beam evaporation: ? <.U,
(8).激光束蒸发laser beam evaporation: TdAHw
@(
(9).间接加热的蒸发indirect heating evaporation: yb(zyGe
(10).闪蒸flash evaportion: `RG_FS"v
2-2真空溅射vacuum sputtering: 4l~0LdYXKm
(1).反应性真空溅射 reactive vacuum sputtering: >{dj6Wo
(2).偏压溅射bias sputtering: gZs UX^%
(3).直流二级溅射direct current diode sputtering: faVR %
(4).非对称性交流溅射asymmtric alternate current sputtering: +|w-1&-
(5).高频二极溅射high frequency diode sputtering: jJmg9&^R
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: 1JU1XQi
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: nPj+mg
(8).离子束溅射ion beam sputtering: @?GOOD_i
(9).辉光放电清洗glow discharge cleaning: ?kvkdHEO_
2-3物理气相沉积PVD physical vapor deposition: ir4uy
2-4化学气相沉积CVD chemical vapor deposition: Z~-A*{u?
2-5磁控溅射magnetron sputtering: 96.A8o
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: _/)?GXwLn
2-7空心阴极离子镀HCD hollow cathode discharge deposition: 79>8tOuo
2-8电弧离子镀arc discharge deposition: 7Lr}Y/1=
^'|\8
3.专用部件 1z\>>N$7B
3-1镀膜室coating chamber: MO{6B#(<F
3-2蒸发器装置evaporator device: k-(hJ}N
3-3蒸发器evaporator: m*h, <,}-+
3-4直接加热式蒸发器evaporator by direct heat: YJO,"7+
3-5间接加热式蒸发器evaporator by indirect heat: #<7ajmr
3-7溅射装置sputtering device: K_Jo^BZ
3-8靶target: S|8O$9{x9q
3-10时控挡板timing shutter: #0HF7C3
3-11掩膜mask: 3huTT"G
3-12基片支架substrate holder: jF'azlT
3-13夹紧装置clamp: 6'M"-9?G
3-14换向装置reversing device: eKL)jzC:
3-15基片加热装置substrate heating device: wNuS'P_(:T
3-16基片冷却装置substrate colding device: !Z7
~Rsdm
a/.O,&3
4.真空镀膜设备 ms8PFu(f
4-1真空镀膜设备vacuum coating plant: NC 0H5
(1).真空蒸发镀膜设备vacuum evaporation coating plant: SR#%gR_SC
(2).真空溅射镀膜设备vacuum sputtering coating plant: w@Pc7$EP
4-2连续镀膜设备continuous coating plant: $+Hv5]/hb
4-3半连续镀膜设备semi- continuous coating plant ;mXr])J
6. 1.漏孔 $V"~\h8
1-1漏孔leaks: =W9;rQm
1-2通道漏孔channel leak: 0VV 1!g
1-3薄膜漏孔membrane leak: Kl[WscR
1-4分子漏孔molecular leak: 13]sZ([B%|
1-5粘滞漏孔vixcous leak: #![i
{7
1-6校准漏孔calibrated leak: ms=Ilz
1-7标准漏孔reference leak : ?Rl?Pp=>
1-8虚漏virtual leak: 8VLr*83~8
1-9漏率leak rate: <R:KR(bT
1-10标准空气漏率standard air leak rate: V*U7-{ *a
1-11等值标准空气漏率equivalent standard air leak rate: u OEFb
1-12探索(示漏)气体: {PHxm
C!SB5G>OH
2.本底 7
:s6W%W1*
2-1本底background: P
7 [p$Z
2-2探索气体本底search gas background : K \}xb2s
2-3漂移drift: ~ e[)]b3
2-4噪声noise: U~SK 'R
$-VW)~Sl
3.检漏仪 I\sCH
3-1检漏仪leak detector: bw{%X
3-2高频火花检漏仪H.F. spark leak detector: %@U<|9 %ua
3-3卤素检漏仪halide leak detector: voaRh@DZ%/
3-4氦质谱检漏仪helium mass spectrometer leak detector: S<Q6b_D
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: J4te!,
ru)%0Cyx
4.检漏 .1MXQLy
4-1气泡检漏leak detection by bubbles: EkV v
4-2氨检漏leak detection by ammonia: `SWf)1K
4-3升压检漏leak detection of rise pressure: @4_CR
4-4放射性同位素检漏radioactive isotope leak detection: hHoc7
4-5荧光检漏fluorescence leak detection WKpHb:H
7. 1.一般术语 $g#j,
1-1真空干燥vacuum drying: SSi}1
1-2冷冻干燥freeze drying : +v&+8S`+
1-3物料material: MQ"<r,o?:
1-4待干燥物料material to be dried: "P< drz<
1-5干燥物料dried material : &%J{C3Q9
1-6湿气moisture;humidity: _'Q}Y nEv
1-7自由湿气free moisture: c*!bT$]~\
1-8结合湿气bound moisture: F1?@tcr'
1-9分湿气partial moisture: Zx5vIm
1-10含湿量moisture content: R\yw9!ESd
1-11初始含湿量initial moisture content: xYRL4
1-12最终含湿量final residual moisture: 8Md*9E#J("
1-13湿度degree of moisture ,degree of humidity : hdN3r{
1-14干燥物质dry matter : \C*?a0!:Z}
1-15干燥物质含量content of dry matter: e&F,z=XJ}
$|z8WCJ
2.干燥工艺 pz?.(AmU\
2-1干燥阶段stages of drying : QsI>_<r
(1).预干燥preliminary dry: Czb@:l%sc
(2).一次干燥(广义)primary drying(in general): z-(dT
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): kvSSz%R~
(4).二次干燥secondary drying: "xS",6Sy
2-2.(1).接触干燥contact drying: Abce]-E
(2).辐射干燥 drying by radiation : X>F/0/
(3).微波干燥microwave drying: Aye!@RjM8
(4).气相干燥vapor phase drying: BWL~)Hx
(5).静态干燥static drying: Lc*i[J<s
(6).动态干燥dynamic drying: *BBP"_$
2-3干燥时间drying time: L3X>v3CZ5
2-4停留时间length of stay(in the drying chamber): suPQlU>2sj
2-5循环时间cycle time: tTF/$`Q#*
2-6干燥率 dessication ratio : tb&{[|O^
2-7去湿速率mass flow rate of humidity: SLz^Wg._
2-8单位面积去湿速率mass flow rate of humidity per surface area: HnioB=fc
2-9干燥速度 drying speed : ,/:#=TuYm
2-10干燥过程drying process: sqac>v
2-11加热温度heating temperature: r6 ,5&`&
2-12干燥温度temperature of the material being dried : .'+Tnu(5q
2-13干燥损失loss of material during the drying process : )#Y*]
2-14飞尘lift off (particles): 5@Ot@o
2-15堆层厚度thickness of the material: ^7TM.lE
5x4JDaG2
3.冷冻干燥 FL0(q>$*8
3-1冷冻freezing: OMO.-p
(1).静态冷冻static freezing: Aq QArSu,
(2).动态冷冻dynamic freezing: K!HSQ,AC
(3).离心冷冻centrifugal freezing: gGe `w
(4).滚动冷冻shell freezing: W?F+QmD
(5).旋转冷冻spin-freezing: 292e0cE
(6).真空旋转冷冻vacuum spin-freezing: #=7~.Y
(7).喷雾冷冻spray freezing: }I,]"0b
(8).气流冷冻air blast freezing: 2HkP$;lED
3-2冷冻速率rate of freezing: cRT@Cu
3-3冷冻物料frozen material: *Yl9%x]3c
3-4冰核ice core: fX#Em'Ab[
3-5干燥物料外壳envelope of dried matter: ?$pp%
3-6升华表面sublimation front: q%Obrk
3-7融化位置freezer burn: GvF~h0wMt
MBXumc_g
4.真空干燥设备;真空冷冻干燥设备 yXR$MT+ ~
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: :s$ rD
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: l>7`D3
4-3加热表面heating surface: Y%|f<C)lx2
4-4物品装载面shelf : 2m[z4V@`
4-5干燥器的处理能力throughput (of the vacuum drying chamber): k1_f7_m
4-6单位面积干燥器处理能力throughput per shelf area: 5Ee%!Pk
4-7冰冷凝器ice condenser: e6QUe.S
4-8冰冷凝器的负载load of the ice condenser: 6*GY%~JbD
4-9冰冷凝器的额定负载rated load of the ice condenser j5G8IP_Wx
8. 1.一般术语 { >bw:^F
1-1试样sample : k[gO>UGB;
(1).表面层surface layer: +VI2i~
(2).真实表面true surface: \;.\g6zX
(3).有效表面积effective surface area: 68+9^
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: $3W[fC
(5).表面粒子密度surface particle density: ~*- eL.
(6).单分子层monolayer: )(_}60
(7).表面单分子层粒子密度monolayer density: ;l7wme8Qk
(8).覆盖系数coverage ratio: 4nXS}bW f
1-2激发excitation: lBgf' b3$
(1).一次粒子primary particle: %'%ej^s-R
(2).一次粒子通量primary particle flux: Tc T%[h!
(3).一次粒子通量密度density of primary particle flux: 8uchp
(4).一次粒子负荷primary particle load: g"FG7E&
(5).一次粒子积分负荷integral load of primary particle: ow>^(>^~
(6).一次粒子的入射能量energy of the incident primary particle: # ~}
26
(7).激发体积excited volume: SZzS$6t
(8).激发面积excited area: C*,-lk0b@
(9).激发深度excited death: .]k+hc`
(10).二次粒子secondary particles:
B ;9^
(11).二次粒子通量secondary particle flux: '0p 5|[ZD
(12).二次粒子发射能energy of the emitted secondary particles: YRfs8I^rg
(13).发射体积emitting volume: Gvb>M=9
(14).发射面积emitting area: k>FMy#N|@
(15).发射深度emitting depth: kBS;SDl)
(16).信息深度information depth: o6'I%Gs
(17).平均信息深度mean information depth: #Ne<=ayS
1-3入射角angle of incidence: 2+s_*zM-
1-4发射角angle of emission: N)RyRR.x1.
1-5观测角observation: `kpX}cKK}
1-6分析表面积analyzed surface area: "
2Dz5L1v
1-7产额 yield : q?nXhUD
1-8表面层微小损伤分析minimum damage surface analysis: `{gkL-
1-9表面层无损伤分析non-destructive surface analysis: \ExM.T
1-10断面深度分析 profile analysis in depth; depth profile analysis : J{
P<^<m_
1-11可观测面积observable area: >8"oO[U5>
1-12可观测立体角observable solid angle : C\ZL*,%}
1-13接受立体角;观测立体角angle of acceptance: TUw^KSa
1-14角分辨能力angular resolving power: osoreo;V^
1-15发光度luminosity: o+4/L)h
1-16二次粒子探测比detection ratio of secondary particles: ] QGYEjW
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: .0:BgM
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: h3Nwxj~E
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: '_lyoVP
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: wZJpSkcEx
1-21本底压力base pressure: 9%S{fd\#
1-22工作压力working pressure: >XcbNZV
*p`0dvXG2
2.分析方法 AjKP -[
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: HgvgO\`]
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : Wb+^Ue
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: l"5$6h
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: r Lg(J|^
2-3离子散射表面分析ion scattering spectroscopy: K_{f6c<
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: w,bILv)
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: F[<EXLQ
2-6离子散射谱仪ion scattering spectrometer: }fpK{db
2-7俄歇效应Auger process: jV]'/X<
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: zlF*F8>m
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: ?&I gD.
2-10光电子谱术photoelectron spectroscopy : K{.s{;#
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: x|d Xa0=N_
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: bE#=\kf|
2-11光电子谱仪photoelectron spectrometer: P~Q5d&1SO
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: RrSSAoz1
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: )xX(Et6+`
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): >J_{mU
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus