“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 H7Uli]e3
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真空术语 ,mS/h~-5n
<e]Oa$
1.标准环境条件 standard ambient condition: P7ph}mB
2.气体的标准状态 standard reference conditions forgases: o@]So(9f
3.压力(压强)p pressure: Q-Ux<#
4.帕斯卡Pa pascal: JjpRHw8\
5.托Torr torr: `~eX55W
6.标准大气压atm standard atmosphere: 9`jcC-;iv
7.毫巴mbar millibar: `-`qdda
8.分压力 partial pressure: 9odJr]
9.全压力 total pressure: -7/s]9o'
10.真空 vacuum: &mj6rIz
11.真空度 degree of vacuum: fPi3sb`}
12.真空区域 ranges of vacuum: ^JZ^>E~
13.气体 gas: =cN&A_L(
14.非可凝气体 non-condensable gas: L%v^s4@
15.蒸汽vapor: .6O"|
Mqb
16.饱和蒸汽压saturation vapor pressure: y-p70.'{U
17.饱和度degree of saturation: _LAS~x7,
18.饱和蒸汽saturated vapor: ZvYLL{>}w
19.未饱和蒸汽unsaturated vapor: Q9d`zR]
20.分子数密度n,m-3 number density of molecules: ms($9 Lv/
21.平均自由程ι、λ,m mean free path: {mWui9 %M
22.碰撞率ψ collision rate: %p^.\ch9
23.体积碰撞率χ volume collision rate: i,V;xB2
24.气体量G quantity of gas: wxm:7$4C
25.气体的扩散 diffusion of gas: -yGDh+-
26.扩散系数D diffusion coefficient; diffusivity: R1F5-#?'E
27.粘滞流 viscous flow: kyAXRwzI
28.粘滞系数η viscous factor: "G-1>:
29.泊肖叶流 poiseuille flow: 'Y$R~e^Y?
30.中间流 intermediate flow: 9_\'LJ
31.分子流 molecular flow: {QBB^px
32克努曾数 number of knudsen: ;!o]wHmA
33.分子泻流 molecular effusion; effusive flow: 2fU$J>Y
34.流逸 transpiration: xD&^j$Em
35.热流逸 thermal transpiration: ]0;864X0
36.分子流率qN molecular flow rate; molecular flux: KZ!3j_pKy
37.分子流率密度 molecular flow rate density; density of molecular flux: >FhK#*Pa
38.质量流率qm mass flow rare: ug{R 3SS
39.流量qG throughput of gas: uE[(cko
40.体积流率qV volume flow rate: bifS 2>c
41.摩尔流率qυ molar flow rate: &U+ _ -Ph
42.麦克斯韦速度分布 maxwellian velocity distribution: !R*-R.%
43.传输几率Pc transmission probability: =fm]D l9h*
44.分子流导CN,UN molecular conductance: )uv=S;+
45.流导C,U conductance: $Vc~/>
46.固有流导Ci,Ui intrinsic conductance: kc7lc|'z
47.流阻W resistance: =#mTfJ
48.吸附 sorption: ]zO/A4
49.表面吸附 adsorption: .nYUL>
50.物理吸附physisorption: s5RjIa0$7
51.化学吸附 chemisorption: x^"ES%*
52.吸收absorption: K"<PGOF
53.适应系数α accommodation factor: <I}2k
54.入射率υ impingement rate: oG$)UTzGc
55.凝结率condensation rate: ZEYgK)^
56.粘着率 sticking rate: |
ohL]7b<
57.粘着几率Ps sticking probability: =%zLh<3v
58.滞留时间τ residence time: @&D?e:|!U
59.迁移 migration: |uW:r17
60.解吸 desorption: Z%GTnG|rG
61.去气 degassing: h^
-.]Y
62.放气 outgassing:
)1g"?]
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: jjJ2>3avY
64.蒸发率 evaporation rate: fN"(mW>!
65.渗透 permeation: SXao|{?O
66.渗透率φ permeability: Mv c`)_Md
67.渗透系数P permeability coefficient 64-#}3zL
2. 1.真空泵 vacuum pumps $3Z-)m
1-1.容积真空泵 positive displacement pump: @!&}}"<
⑴.气镇真空泵 gas ballast vacuum pump: 9 Pw0m=4
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: j@Yi`a(sdm
⑶.干封真空泵 dry-sealed vacuum pump: E;21?`x5
⑷.往复真空泵 piston vacuum pump: 4tSv{B/}
⑸.液环真空泵 liquid ring vacuum pump: /ywD{*
⑹.旋片真空泵 sliding vane rotary vacuum pump: bCZ gcN
⑺.定片真空泵 rotary piston vacuum pump: 2,aPr:]
⑻.滑阀真空泵 rotary plunger vacuum pump: pT?Q#,fh
⑼.余摆线真空泵 trochoidal vacuum pump: x{NX8lN
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: X0-IRJ[
⑾.罗茨真空泵 roots vacuum pump: l!#m&'16"
1-2.动量传输泵 kinetic vacuum pump: 8 6f2'o+
⑴.牵引分子泵molecular drag pump: PSawMPw
⑵.涡轮分子泵turbo molecular pump: X7L8h'(@
⑶.喷射真空泵ejector vacuum pump: (HoqR
⑷.液体喷射真空泵liquid jet vacuum pump: TpA\9N#$
⑸.气体喷射真空泵gas jet vacuum pump: T32BnmB{
⑹.蒸汽喷射真空泵vapor jet vacuum pump : [FUjnI
⑺.扩散泵diffusion pump : l"n{.aL
⑻.自净化扩散泵self purifying diffusion pump: kt4d;4n
⑼.分馏扩散泵 fractionating diffusion pump : S osj$9E
⑽.扩散喷射泵diffusion ejector pump : !ZDzEP*
⑾.离子传输泵ion transfer pump: EBtLzbj
1-3.捕集真空泵 entrapment vacuum pump: R:p62c;Tv0
⑴吸附泵adsorption pump: @|a>&~xX
⑵.吸气剂泵 getter pump: "U.^lkN
⑶.升华(蒸发)泵 sublimation (evaporation)pump : &D%(~|'
⑷.吸气剂离子泵getter ion pump: 7u\*_mrv
⑸.蒸发离子泵 evaporation ion pump: ~)?
⑹.溅射离子泵sputter ion pump: LJX-AO.4
⑺.低温泵cryopump: ~.%K/=wK @
=66Nw(E.
2.真空泵零部件 Vtppuu$
2-1.泵壳 pump case: gn5)SP 8
2-2.入口 inlet: 4/X/>Y1
2-3.出口outlet: Nr2 C@FU:0
2-4.旋片(滑片、滑阀)vane; blade : :V)lbn\
2-5.排气阀discharge valve: E{HY!L[
2-6.气镇阀gas ballast valve: 5unG#szq
2-7.膨胀室expansion chamber: Q4t(@0e}
2-8.压缩室compression chamber: xUF_1hY
2-9.真空泵油 vacuum pump oil: `RMI(zI3g.
2-10.泵液 pump fluid: >r &;3:"
2-11.喷嘴 nozzle: vaf&X]p
2-13.喷嘴扩张率nozzle expansion rate: iVB^,KQ@
2-14.喷嘴间隙面积 nozzle clearance area : UZ8?[
2-15.喷嘴间隙nozzle clearance: 0iCPi)B
2-16.射流jet: Gamr6I"K
2-17.扩散器diffuser: ,fEO>
i
2-18.扩散器喉部diffuser thoat: (]/9-\6(#
2-19.蒸汽导管vapor tube(pipe;chimney): (><zsLs&
2-20.喷嘴组件nozzle assembly: (I@bkMp
2-21.下裙skirt: hVjNZ
1GEK:g2B
3.附件 !h&g7do]Z
3-1阱trap: s=?aox7
⑴.冷阱 cold trap: iAY!oZR(WT
⑵.吸附阱sorption trap: {;2i.m1
⑶.离子阱ion trap: %iJ%{{f`
⑷.冷冻升华阱 cryosublimation trap: H7i$xWs
3-2.挡板baffle: MJj4Hd
3-3.油分离器oil separator: PLM _#+R>
3-4.油净化器oil purifier: HxK$ 4I`
3-5.冷凝器condenser: R`F,aIJ]
]E3U
J!!
4.泵按工作分类 TEUY3z[g
4-1.主泵main pump: 1Xy]D
4-2.粗抽泵roughing vacuum pump: f[gqT
yiP
4-3.前级真空泵backing vacuum pump: -{h
4-4.粗(低)真空泵 roughing(low)vacuum pump: Bs`$ i ;&
4-5.维持真空泵holding vacuum pump: g%[n4
4-6.高真空泵high vacuum pump:
4eVI},
4-7.超高真空泵ultra-high vacuum pump: 0;,IKXK6X
4-8.增压真空泵booster vacuum pump: dQy>Nmfy
66snC{gU
5.真空泵特性 s!/TU{8J
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: 7iuQ9q^&
5-2.真空泵的抽气量Q throughput of vacuum pump:。 T~sTBGcv
5-3.起动压力starting pressure: P`U<7xF~
5-4.前级压力 backing pressure : PIcrA2ll
5-5.临界前级压力 critical backing pressure: `h;k2Se5
5-6.最大前级压力maximum backing pressure: o6"*4P|
5-7.最大工作压力maximum working pressure: .AV)'j#6P
5-8.真空泵的极限压力ultimate pressure of a pump: 0ZAj=u@O
5-9.压缩比compression ratio: `,wu}F85
5-10.何氏系数Ho coefficient: Kr L>FI
5-11.抽速系数speed factor: 1|,Pq9
5-12.气体的反扩散back-diffusion of gas: "a1O01n
5-13.泵液返流back-streaming of pump fluid: N#N0Q0W=
5-14.返流率back-streaming rate SEKN|YQV/t
5-15.返迁移back-migration: us?&:L|!=
5-16.爆腾bumping: SM[{BH<
5-17.水蒸气允许量qm water vapor tolerable load: NGjdG=,
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: B68H&h]D#'
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: (7lBID4
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump D-9\~gvh
3. 1.一般术语 } :iBx
1-1.压力计pressure gauge: 2k7bK6=nm
1-2.真空计vacuum gauge: _BnTv$.P
⑴.规头(规管)gauge head: 9-*NW0
⑵.裸规nude gauge : YHxbDf dA
⑶.真空计控制单元gauge control unit : ]pTvMom$6
⑷.真空计指示单元gauge indicating unit : Hr;h4J
S_J :&9L
2.真空计一般分类 z?8~[h{i%
2-1.压差式真空计differential vacuum gauge: ScnY3&rc
2-2.绝对真空计 absolute vacuum gauge: (J:dK=O@Z
2-3.全压真空计total pressure vacuum gauge: $%2_{m_K:p
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: s #:%x#
2-5.相对真空计relative vacuum gauge : LR)&
[{Kk
>AD=31lq
3.真空计特性 }|8*sk#[
3-1.真空计测量范围pressure range of vacuum gauge: g+q@i{Yn
3-2.灵敏度系数sensitivity coefficient: ,W5.:0Y;f[
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): _|c&@M
3-5.规管光电流photon current of vacuum gauge head: ^.X [)U
3-6.等效氮压力equivalent nitrogen pressure : U/MFhD(06
3-7.X射线极限值 X-ray limit: ~HLRfL?
3-8.逆X射线效应anti X-ray effect: 5?u[XAE
3-9.布利尔斯效应blears effect: Qb^q+C)o]
H;_yRUY9
4.全压真空计 GA^mgm"O
4-1.液位压力计liquid level manometer: L0Vgo<A
4-2.弹性元件真空计elastic element vacuum gauge: >POO-8Q
4-3.压缩式真空计compression gauge: ESQ!@G/n
4-4.压力天平pressure balance: .e[Tu|qo
4-5.粘滞性真空计viscosity gauge : $B\E.ml.
4-6.热传导真空计thermal conductivity vacuum gauge : tR`S#rk
4-7.热分子真空计thermo-molecular gauge: I{.HO<$7D}
4-8.电离真空计ionization vacuum gauge: ='Oj4T
4-9.放射性电离真空计radioactive ionization gauge: Q49BU@xX
4-10.冷阴极电离真空计cold cathode ionization gauge: 9$WJ"]
4-11.潘宁真空计penning gauge: Vk<k +=7
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: dBEIMn@
4-13.放电管指示器discharge tube indicator: c c G['7
4-14.热阴极电离真空计hot cathode ionization gauge: Zy$L rr!
4-15.三极管式真空计triode gauge: c;!g
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: P@ypk^v
4-17.B-A型电离真空计Bayard-Alpert gauge: ;i)KHj'
4-18.调制型电离真空计modulator gauge: NXoK@Y
4-19.抑制型电离真空计suppressor gauge: XDmbm*~i
4-20.分离型电离真空计extractor gauge: u]vPy
ria
4-21.弯注型电离真空计bent beam gauge: IlZu~B9c
4-22.弹道型电离真空计 orbitron gauge : bAhZ7;T~
4-23.热阴极磁控管真空计hot cathode magnetron gauge: ;x[pM_
fp !:u
5.分压真空计(分压分析器) /5a;_
5-1.射频质谱仪radio frequency mass spectrometer:
)5l u.R%
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: ~
l )t|'6
5-3.单极质谱仪momopole mass spectrometer: +t\^(SJ6
5-4.双聚焦质谱仪double focusing mass spectrometer: V:^H4WvL\W
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: [!+D<Y
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: Lo3-X
5-7.回旋质谱仪omegatron mass spectrometer: W7e4pR?w
5-8.飞行时间质谱仪time of flight mass spectrometer: |$w*RI0C
J%P)%yX
6.真空计校准 |^5 /(16
6-1.标准真空计reference gauges: `ut)+T V
6-2.校准系统system of calibration: H`|0-`q
6-3.校准系数K calibration coefficient: c cr" ep
6-4.压缩计法meleod gauge method: zeOb Aw1O
6-5.膨胀法expansion method: 26nBBS,;
6-6.流导法flow method: +{>.Sk'$
4. 1.真空系统vacuum system FLbZ9pX}
1-1.真空机组pump system: |HgfV@Han
1-2.有油真空机组pump system used oil : A~y VYC6l
1-3.无油真空机组oil free pump system x70N8TQ_gK
1-4.连续处理真空设备continuous treatment vacuum plant: ;/A}}B]y
1-5.闸门式真空系统vacuum system with an air-lock: RjtC:H&XZ
1-6.压差真空系统differentially pumped vacuum system: YRa4W.&Yn
1-7.进气系统gas admittance system: Sr7@ buF
nZW4} ~0j
2.真空系统特性参量 &q>h*w4O
2-1.抽气装置的抽速volume flow rate of a pumping unit : &wGg6$
2-2.抽气装置的抽气量throughput of a pumping unit : m.146
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: %Rn:GK
2-4.真空系统的漏气速率leak throughput of a vacuum system: vahf]2jEB
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: 'Kd7l}e!
2-6.极限压力ultimate pressure: h#R&=t1,^
2-7.残余压力residual pressure: PJwEA
2-8.残余气体谱residual gas spectrum: #_p
2-9.基础压力base pressure: _h~p:=
2-10.工作压力working pressure: Lw*1 .~
2-11.粗抽时间roughing time: +3?`M<L0
2-12.抽气时间pump-down time: :|($,3*
2-13.真空系统时间常数time constant of a vacuum system: 0~i q G
2-14.真空系统进气时间venting time: AO8:|?3S
[; F{mN
3.真空容器 =F[lg?g
3-1.真空容器;真空室vacuum chamber: Ltg-w\?]
3-2.封离真空装置sealed vacuum device: G;9|%yvd8
3-3.真空钟罩vacuum bell jar: yTj p-
3-4.真空容器底板vacuum base plate: qa;EI ;8
3-5.真空岐管vacuum manifold: okh0_4
3-6.前级真空容器(贮气罐)backing reservoir:
u;(K34!)
3-7.真空保护层outer chamber: aKOf;^@
3-8.真空闸室vacuum air lock: o3= .T+B
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: <[FS%2,0mb
u=l0f6W
4.真空封接和真空引入线 -_w~JCx
4-1.永久性真空封接permanent seal : 69OET_AS>
4.2.玻璃分级过渡封接graded seal : rJp?d9B
4-3.压缩玻璃金属封接compression glass-to-metal seal: :%>oe> _"
4-4.匹配式玻璃金属封接matched glass-to-metal seal: 5D-BIPn=JV
4-5.陶瓷金属封接ceramic-to-metal seal: >+f'!*%7He
4-6.半永久性真空封接semi-permanent seal : 6BHPzv+Y
4-7.可拆卸的真空封接demountable joint: % IPyCEJD
4-8.液体真空封接liquid seal 6i^0T
4-9.熔融金属真空封接molten metal seal: &BTfDsxAK
4-10.研磨面搭接封接ground and lapped seal: l]/> `62
4-11.真空法兰连接vacuum flange connection: W=M<
c@
4-12.真空密封垫vacuum-tight gasket: O{*GW0}55
4-13.真空密封圈ring gasket: }o{!}g9
4-14.真空平密封垫flat gasket: y#nSk%"t"
4-15.真空引入线feedthrough leadthrough: r5Wkc$
4-16.真空轴密封shaft seal: w[M5M2CF
4-17.真空窗vacuum window: M Yu?&}%^
4-18.观察窗viewing window: I(y`)$}
[I_BCf
5.真空阀门 DZF[dxH
5-1.真空阀门的特性characteristic of vacuum valves: "&|lO|
⑴.真空阀门的流导conductance of vacuum valves: ScsWnZ
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: vr<)Ay
5-2.真空调节阀regulating valve: bQ
i<0|S
5-3.微调阀 micro-adjustable valve: d7\k gh
5-4.充气阀charge valve: US"2O!u
5-5.进气阀gas admittance valve: !+%Az*ik
5-6.真空截止阀break valve: c;nx59w]q
5-7.前级真空阀backing valve: nJW_a&'
5-8.旁通阀 by-pass valve: r$Yh)rpt:
5-9.主真空阀main vacuum valve: /1H9z`qV
5-10.低真空阀low vacuum valve: '=-s1c@^
5-11.高真空阀high vacuum valve: $)4GCP
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: qW+=g]x\
5-13.手动阀manually operated valve: ;}$Z
80
5-14.气动阀pneumatically operated valve: P~n8EO1r
5-15.电磁阀electromagnetically operated valve: 6MrZ6dz^
5-16.电动阀valve with electrically motorized operation: oPp!*$V
5-17.挡板阀baffle valve: _95- -\
5-18.翻板阀flap valve: N,h1$)\B#
5-19.插板阀gate valve: Dg1kbO=2
5-20.蝶阀butterfly valve: i#Ne'q;T
]L[JS^#7
6.真空管路 fpI;`s
6-1.粗抽管路roughing line: Ax :3}
6-2.前级真空管路backing line: @Pd)
%'s
6-3.旁通管路;By-Pass管路 by-pass line: 8 /5sv
6-4.抽气封口接头pumping stem: +"TI_tK,S
6-5.真空限流件limiting conductance: qr7 X-[&
6-6.过滤器filter: n.=e)*
5. 1.一般术语 aslU`#"
1-1真空镀膜vacuum coating: \Ac}R'
1-2基片substrate: 8Pl+yiB/o`
1-3试验基片testing substrate: LuQ"E4;nY%
1-4镀膜材料coating material: 0\8*S3,q
1-5蒸发材料evaporation material: uEc0/a :.
1-6溅射材料sputtering material: /8 e2dw:
\
1-7膜层材料(膜层材质)film material: 6~:W(E}
1-8蒸发速率evaporation rate: =$&7IQ?
1-9溅射速率sputtering rate: Dlqn~
1-10沉积速率deposition rate: *#ob5TBq[
1-11镀膜角度coating angle: -lJx%9>
$]Q*E4(kV9
2.工艺 BG(R=,
7
2-1真空蒸膜vacuum evaporation coating: e|2vb
GQ
(1).同时蒸发simultaneous evaporation: 0BbiQXU
(2).蒸发场蒸发evaporation field evaporation: &/J.0d-*``
(3).反应性真空蒸发reactive vacuum evaporation: Y&K<{KA\4
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: `@ VM<av
(5).直接加热的蒸发direct heating evaporation: 4*@G&v?n
(6).感应加热蒸发induced heating evaporation: BXQ\A~P\
(7).电子束蒸发electron beam evaporation: Jdk3)
\
(8).激光束蒸发laser beam evaporation: Bt|9%o06l
(9).间接加热的蒸发indirect heating evaporation: R=#q"9qz
(10).闪蒸flash evaportion: _QC?:mv6-
2-2真空溅射vacuum sputtering: 0})7of
(1).反应性真空溅射 reactive vacuum sputtering: s$SU
vo1J
(2).偏压溅射bias sputtering: 'xLM>6[wz
(3).直流二级溅射direct current diode sputtering: _WRR
3
(4).非对称性交流溅射asymmtric alternate current sputtering: N'lGA;}i
(5).高频二极溅射high frequency diode sputtering: INN/VDsJ
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: ^P3g9'WK
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: c%xED%X9
(8).离子束溅射ion beam sputtering: '$2oSd
(9).辉光放电清洗glow discharge cleaning: X]3l| D
2-3物理气相沉积PVD physical vapor deposition: XwKZv0ub
2-4化学气相沉积CVD chemical vapor deposition: m11"i=S"
2-5磁控溅射magnetron sputtering: "/ a*[_sV
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: 1)P<cNj
2-7空心阴极离子镀HCD hollow cathode discharge deposition: []6ShcqJ[v
2-8电弧离子镀arc discharge deposition: FcA)RsMI*
Allt]P>
3.专用部件 }(f.uN_v
3-1镀膜室coating chamber: rE
bx%u7Q
3-2蒸发器装置evaporator device: ^cKv JSY
3-3蒸发器evaporator: LP0;n\
3-4直接加热式蒸发器evaporator by direct heat: M[`w{A
3-5间接加热式蒸发器evaporator by indirect heat: 6\)8mK
3-7溅射装置sputtering device: lzr>WbM{{p
3-8靶target: A|`Joxr
3-10时控挡板timing shutter: #G[
*2h~99
3-11掩膜mask: 4acP*LkkQ
3-12基片支架substrate holder: x 1%J1?Fp
3-13夹紧装置clamp: oneSgJ
3-14换向装置reversing device: ,\m;DR1
3-15基片加热装置substrate heating device: `ohF?5J,
3-16基片冷却装置substrate colding device: G]m[S-
m&8U4uHN
4.真空镀膜设备 u$Pf.#
4-1真空镀膜设备vacuum coating plant: i SAidK,
(1).真空蒸发镀膜设备vacuum evaporation coating plant: l7D4`i<F
(2).真空溅射镀膜设备vacuum sputtering coating plant: 3u"J4%zg|L
4-2连续镀膜设备continuous coating plant: fRv
S@
4-3半连续镀膜设备semi- continuous coating plant NejsI un%
6. 1.漏孔 V!kQuQJ>
1-1漏孔leaks: Chb4VoE
1-2通道漏孔channel leak: 1=/MT#d^?
1-3薄膜漏孔membrane leak: 9m#H24{V'
1-4分子漏孔molecular leak: 69<rsp(p
1-5粘滞漏孔vixcous leak: pT_e;,KW
U
1-6校准漏孔calibrated leak: ![X.%
1-7标准漏孔reference leak : kDceBs s
1-8虚漏virtual leak: T`RQUJO
1-9漏率leak rate: =?I1V#.
1-10标准空气漏率standard air leak rate: KH@) +Rj
1-11等值标准空气漏率equivalent standard air leak rate: yoA*\V
1-12探索(示漏)气体: 3' :[i2[
:+gCO!9Y
2.本底 0=(-8vwd
2-1本底background: 00.iMmJ
2-2探索气体本底search gas background : (X`t"*y"
2-3漂移drift:
$V {- @=
2-4噪声noise: Ph!KL\
ru6H nLhL
3.检漏仪 NkjQyMF
3-1检漏仪leak detector: |V~(mS747:
3-2高频火花检漏仪H.F. spark leak detector: d)17r\*>I
3-3卤素检漏仪halide leak detector: )*$
3-4氦质谱检漏仪helium mass spectrometer leak detector: qS/71Kv'
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: 5@%=LPV
)8N)Z~h
4.检漏 w4<u@L
4-1气泡检漏leak detection by bubbles: 8 *(W |J
4-2氨检漏leak detection by ammonia: -~Z@,
4-3升压检漏leak detection of rise pressure: sJYKt
4-4放射性同位素检漏radioactive isotope leak detection: JY050FL
4-5荧光检漏fluorescence leak detection dn.c#,Y
7. 1.一般术语 EK- bvZ
1-1真空干燥vacuum drying: t&Y^W <
1-2冷冻干燥freeze drying : |)P;%Fy9
1-3物料material: n.H`1@
1-4待干燥物料material to be dried: ow>[#.ua
1-5干燥物料dried material : 8`LLHX1|
1-6湿气moisture;humidity: I+4qu|0lA
1-7自由湿气free moisture: )V+Dqh,-g
1-8结合湿气bound moisture: abk:_
1-9分湿气partial moisture: Z]> e & N
1-10含湿量moisture content: )>A%FL9
1-11初始含湿量initial moisture content: 2QuypVC ]
1-12最终含湿量final residual moisture: bM3'm$34
1-13湿度degree of moisture ,degree of humidity : 0,D9\ Ebd
1-14干燥物质dry matter : B& f~.UH
1-15干燥物质含量content of dry matter: K?9H.#(
<812V8<!
2.干燥工艺 { G>+.
2-1干燥阶段stages of drying : "F.J>QBd
(1).预干燥preliminary dry: J`D<
(2).一次干燥(广义)primary drying(in general): ewff(e9
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): CYic_rF$
(4).二次干燥secondary drying: %!hA\S
2-2.(1).接触干燥contact drying: O [ ; 6E
(2).辐射干燥 drying by radiation : >, Swk3
(3).微波干燥microwave drying: E6&uZr
(4).气相干燥vapor phase drying: D]>86&
(5).静态干燥static drying: ?Kz`
O>"6
(6).动态干燥dynamic drying: wYxFjXm
2-3干燥时间drying time: !\|@{UJk/
2-4停留时间length of stay(in the drying chamber): Z_ *ZUN?B
2-5循环时间cycle time: * jNu?$
2-6干燥率 dessication ratio : V9 t:JY
2-7去湿速率mass flow rate of humidity: >a]
s
2-8单位面积去湿速率mass flow rate of humidity per surface area: HvfTC<+H
2-9干燥速度 drying speed : 1XKIK(l
2-10干燥过程drying process: @md^mss
2-11加热温度heating temperature: Erymx$@P
2-12干燥温度temperature of the material being dried : 6 VJj(9%
2-13干燥损失loss of material during the drying process : { dxyBDK
2-14飞尘lift off (particles): ).#D:eO[~
2-15堆层厚度thickness of the material: 7&U+f:-w
KqIe8bi^G
3.冷冻干燥 JU`'?b
3-1冷冻freezing: .;sPG
(1).静态冷冻static freezing: Tf]VcEF
(2).动态冷冻dynamic freezing: VQJ5$4a&
(3).离心冷冻centrifugal freezing: fHp#Gi3Lz
(4).滚动冷冻shell freezing: #[rFep
(5).旋转冷冻spin-freezing: ?=o]Wx0(9
(6).真空旋转冷冻vacuum spin-freezing: o\YdL2:X
(7).喷雾冷冻spray freezing: Yy:sZJ
(8).气流冷冻air blast freezing: 2F)OyE
3-2冷冻速率rate of freezing: CMf~Yv
3-3冷冻物料frozen material: :r+
1>F$o
3-4冰核ice core: )uJ`E8>-
3-5干燥物料外壳envelope of dried matter: x~,?Zj)n?C
3-6升华表面sublimation front: *>H'@gS
3-7融化位置freezer burn: KD<`-b)7<
`-e}:9~q
4.真空干燥设备;真空冷冻干燥设备 BP><G^
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: $f-pLF+x
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: N@
tb^M
4-3加热表面heating surface: \nt'I;f
4-4物品装载面shelf : RR {9
4-5干燥器的处理能力throughput (of the vacuum drying chamber): lk'jBl%
4-6单位面积干燥器处理能力throughput per shelf area: ^g"6p#S=n
4-7冰冷凝器ice condenser: UE](`|4H
4-8冰冷凝器的负载load of the ice condenser: xGQ:7g+qu
4-9冰冷凝器的额定负载rated load of the ice condenser 6h"?3w
8. 1.一般术语 os+wTUR^
1-1试样sample : <1K:
G/!
(1).表面层surface layer: ({62GWnn_
(2).真实表面true surface: }{PtQc6RL!
(3).有效表面积effective surface area: Eu_0n6J
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: jh!IOtf
(5).表面粒子密度surface particle density: D#(L@{vC
(6).单分子层monolayer: qoq<dCt3
(7).表面单分子层粒子密度monolayer density: A}}t86T
(8).覆盖系数coverage ratio: 667tL(
1-2激发excitation: _$x *CP0(
(1).一次粒子primary particle: Yhdt8[ 2
(2).一次粒子通量primary particle flux: 35\0g&
(3).一次粒子通量密度density of primary particle flux: Qx#)c%v\\
(4).一次粒子负荷primary particle load: G4]``
(5).一次粒子积分负荷integral load of primary particle: xpo}YF'5
(6).一次粒子的入射能量energy of the incident primary particle: 5Ww\h
(7).激发体积excited volume: L^Af3]]2
(8).激发面积excited area: v:ZD}Q_
(9).激发深度excited death: B9 {DO
(10).二次粒子secondary particles: 8XE0 p7
(11).二次粒子通量secondary particle flux: :\cJvm
(12).二次粒子发射能energy of the emitted secondary particles: \%*y+I0>
(13).发射体积emitting volume: .5zJ bZ9
(14).发射面积emitting area: <i?-x&Q?=
(15).发射深度emitting depth: nP
/$uj
(16).信息深度information depth: =sJHnWL[
(17).平均信息深度mean information depth: BF#e=p
1-3入射角angle of incidence: 7~f l4*
1-4发射角angle of emission: Fs~-exY1
1-5观测角observation: Gj0NN:
1-6分析表面积analyzed surface area: d":{a6D*d
1-7产额 yield : ^u<+tV
1-8表面层微小损伤分析minimum damage surface analysis: O`| ri5d
1-9表面层无损伤分析non-destructive surface analysis: mI18A#[ 3
1-10断面深度分析 profile analysis in depth; depth profile analysis : 43fA;Uc{Y`
1-11可观测面积observable area: [!$>:_Vq/
1-12可观测立体角observable solid angle : UJ&,9}L8
1-13接受立体角;观测立体角angle of acceptance: n(MEG'9}
1-14角分辨能力angular resolving power: 8t"DQ Y-R
1-15发光度luminosity: we?#)9Q<
1-16二次粒子探测比detection ratio of secondary particles: vUNE!j
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: W>49,A,q
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: C $;~=
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: {,-# ;A*yW
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: Plv+ mb
1-21本底压力base pressure: &0TheY;srf
1-22工作压力working pressure: u?i1n=Ne
C?J%^?v
2.分析方法 YG|T;/-
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: 'r0gqtB
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : ]vrs?
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: .:/@<V+K
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: bf+2c6_BN0
2-3离子散射表面分析ion scattering spectroscopy: &3. 8i%
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: '`"&RuB
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: ~>|U %3}]
2-6离子散射谱仪ion scattering spectrometer: 4#uoPkLK
2-7俄歇效应Auger process: cm<3'#~Q?
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: ShP V!$0
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: k[m-"I%ZFX
2-10光电子谱术photoelectron spectroscopy : }Q_i#e(S
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: P{ o/F
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: G_@H:4$3
2-11光电子谱仪photoelectron spectrometer: u8QX2|
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: ^S@b*
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: 5=\b+<pE
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): U# gmk0>t{
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus