“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 5,
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--------------------------------------------------- OjhX:{"59
真空术语 eN<L)a:J_
X$5
1.标准环境条件 standard ambient condition: nG<oae6z"
2.气体的标准状态 standard reference conditions forgases: *k7BE_&*0Z
3.压力(压强)p pressure: X&WP.n)
4.帕斯卡Pa pascal: bkd`7(r
5.托Torr torr: :^ywc O
6.标准大气压atm standard atmosphere: &%rM|
7.毫巴mbar millibar: hdDT'+
8.分压力 partial pressure: "AUSgVE+h
9.全压力 total pressure: `h@fW- r
10.真空 vacuum: 'Ou C[$Z
11.真空度 degree of vacuum: R ` ViRJh
12.真空区域 ranges of vacuum: O[VY|.MEk
13.气体 gas: _Z(t**Zh6y
14.非可凝气体 non-condensable gas: Dizz ?O
15.蒸汽vapor: >OaD7
16.饱和蒸汽压saturation vapor pressure: 6C2~0b
17.饱和度degree of saturation: |'z8>1
18.饱和蒸汽saturated vapor: WGz)-IB!PE
19.未饱和蒸汽unsaturated vapor: Imv#7{ndq
20.分子数密度n,m-3 number density of molecules: %rb$tKk
21.平均自由程ι、λ,m mean free path: 36{GZDGQ
22.碰撞率ψ collision rate: b=r 3WkB6
23.体积碰撞率χ volume collision rate: p=:Vpg<!
24.气体量G quantity of gas: N`Q.u-'
25.气体的扩散 diffusion of gas: r>(,)rs(l
26.扩散系数D diffusion coefficient; diffusivity: 94-BcN
27.粘滞流 viscous flow: o*)Sg6Yk
28.粘滞系数η viscous factor: o#p%IGG`
29.泊肖叶流 poiseuille flow: o,WjM[e
30.中间流 intermediate flow: Bh&pZcm|
31.分子流 molecular flow: ^:-GPr
32克努曾数 number of knudsen: 3tZIL
33.分子泻流 molecular effusion; effusive flow: iv >MIdIm
34.流逸 transpiration: 3`cA!ZVQ
35.热流逸 thermal transpiration: l^	d
36.分子流率qN molecular flow rate; molecular flux: 1<G+KC[F
37.分子流率密度 molecular flow rate density; density of molecular flux: o{y}c->
38.质量流率qm mass flow rare: K ~mUO
39.流量qG throughput of gas: .yy-jf/
40.体积流率qV volume flow rate: ~Fuq{e9`
41.摩尔流率qυ molar flow rate: D#LV&4e>.E
42.麦克斯韦速度分布 maxwellian velocity distribution: l$/pp
43.传输几率Pc transmission probability: ULAr!
44.分子流导CN,UN molecular conductance: T`!R
ki%~
45.流导C,U conductance: 1*=ev,Z
46.固有流导Ci,Ui intrinsic conductance: sm-[=d%@L
47.流阻W resistance: JVuju$k
48.吸附 sorption: &MSU<S?1
49.表面吸附 adsorption: M?lh1Yu"
50.物理吸附physisorption: H<Sf0>OA
51.化学吸附 chemisorption: dO82T3T
52.吸收absorption: Z8v 8@Y
53.适应系数α accommodation factor: ) bFl-
54.入射率υ impingement rate: 2#7|zhgb
55.凝结率condensation rate: Dylm=ZZa
56.粘着率 sticking rate: X6cn8ak3
57.粘着几率Ps sticking probability: w&?XsO@0W
58.滞留时间τ residence time: y`va6 %u{
59.迁移 migration: w5 . ^meU
60.解吸 desorption: cp@Fj"
61.去气 degassing: 8Nzn%0(Q
62.放气 outgassing: [1vm~w'
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: |H
t5a.
64.蒸发率 evaporation rate: &DMC\R* j
65.渗透 permeation: ==[(Mn,%d
66.渗透率φ permeability: 59oTU
67.渗透系数P permeability coefficient s-IE}I?;
2. 1.真空泵 vacuum pumps Y2DL%'K^
1-1.容积真空泵 positive displacement pump: D<J'\mo
⑴.气镇真空泵 gas ballast vacuum pump:
RU~na/3
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: i]c{(gd`
⑶.干封真空泵 dry-sealed vacuum pump: NTt4sWP!I
⑷.往复真空泵 piston vacuum pump: <uuumi-!%G
⑸.液环真空泵 liquid ring vacuum pump: G^Gs/-
f
⑹.旋片真空泵 sliding vane rotary vacuum pump: .u)KP*_
⑺.定片真空泵 rotary piston vacuum pump: |3FI\F;^q
⑻.滑阀真空泵 rotary plunger vacuum pump: `Xos]L'w
⑼.余摆线真空泵 trochoidal vacuum pump: T!H(Y4A
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: |<c9ZS+
⑾.罗茨真空泵 roots vacuum pump: 0ZjT.Ep
1-2.动量传输泵 kinetic vacuum pump: h*VDd3[#
⑴.牵引分子泵molecular drag pump: "0!h-bQN
⑵.涡轮分子泵turbo molecular pump: y8$3kXh
⑶.喷射真空泵ejector vacuum pump: {P6Bfh7CZ
⑷.液体喷射真空泵liquid jet vacuum pump: dT0W8oL
⑸.气体喷射真空泵gas jet vacuum pump: r^
Dm|^f#
⑹.蒸汽喷射真空泵vapor jet vacuum pump : \$_02:#
⑺.扩散泵diffusion pump : X]y8-}Qf
⑻.自净化扩散泵self purifying diffusion pump: 50MM05aC
⑼.分馏扩散泵 fractionating diffusion pump : WVeNO,?ytS
⑽.扩散喷射泵diffusion ejector pump : QG*hQh
⑾.离子传输泵ion transfer pump: o:#jvi84F
1-3.捕集真空泵 entrapment vacuum pump: 5&8BO1V.
⑴吸附泵adsorption pump: vt5w(}v(
⑵.吸气剂泵 getter pump: '^)'q\v'k
⑶.升华(蒸发)泵 sublimation (evaporation)pump : GUu8 N
⑷.吸气剂离子泵getter ion pump: /
<(|4e
⑸.蒸发离子泵 evaporation ion pump: =wX;OK|U(^
⑹.溅射离子泵sputter ion pump: f4p*!e
⑺.低温泵cryopump: 'KjH|u
:Hq%y/
2.真空泵零部件 1vo3aF
2-1.泵壳 pump case: %O9 Wm_%
2-2.入口 inlet: sR/Yv
2-3.出口outlet: n=-vOa%
2-4.旋片(滑片、滑阀)vane; blade : >l 0aME@-0
2-5.排气阀discharge valve: fR[8O\U~
2-6.气镇阀gas ballast valve: y7pBcyWTE=
2-7.膨胀室expansion chamber: &Z~_BT
2-8.压缩室compression chamber: 2e\"?y OD
2-9.真空泵油 vacuum pump oil: _zDS-e@
2-10.泵液 pump fluid: Gs~eRcIB
2-11.喷嘴 nozzle: 7D<Aa?cv_l
2-13.喷嘴扩张率nozzle expansion rate: +}m`$B}mJ
2-14.喷嘴间隙面积 nozzle clearance area : z/91v#}.
2-15.喷嘴间隙nozzle clearance: @rT$}O1?`
2-16.射流jet: e r_6PV
2-17.扩散器diffuser: 5{yg
2-18.扩散器喉部diffuser thoat: K-]) RIM
2-19.蒸汽导管vapor tube(pipe;chimney): L&+k`b
2-20.喷嘴组件nozzle assembly: _kBmKE
2-21.下裙skirt: yreH/$Ou8
(^~a1@f,J
3.附件 pbG-uH^
3-1阱trap: =EVB?k
,
⑴.冷阱 cold trap: (tA[] ne2
⑵.吸附阱sorption trap: EJ
{vJZO
⑶.离子阱ion trap: C)m@/w
⑷.冷冻升华阱 cryosublimation trap: s>L-0vG
3-2.挡板baffle: ^N7cX K*
3-3.油分离器oil separator: r } Wdj
3-4.油净化器oil purifier: GdC=>\]
3-5.冷凝器condenser: F
lVG, Z
;LgMi5dN
4.泵按工作分类 5xr2
4-1.主泵main pump: =,*/Ph&
4-2.粗抽泵roughing vacuum pump: c
k[uvH
4-3.前级真空泵backing vacuum pump: WS&a9!3;
4-4.粗(低)真空泵 roughing(low)vacuum pump: -5e8m4*
4-5.维持真空泵holding vacuum pump: q>%.zc[x
4-6.高真空泵high vacuum pump: %J6>Vc!ix=
4-7.超高真空泵ultra-high vacuum pump: &u9,|n]O9
4-8.增压真空泵booster vacuum pump: j7);N
A]iT
uu5 p
5.真空泵特性 Gmu[UI}w8
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: :{eYm|2-
5-2.真空泵的抽气量Q throughput of vacuum pump:。 -ik$<>{X
5-3.起动压力starting pressure: nd\$Y
5-4.前级压力 backing pressure : !|9@f$Jv
5-5.临界前级压力 critical backing pressure: L7lpOy4k
5-6.最大前级压力maximum backing pressure: lw8t#_P
5-7.最大工作压力maximum working pressure: @sa_/LH!K
5-8.真空泵的极限压力ultimate pressure of a pump: -AL^
5-9.压缩比compression ratio: %a8e_
5-10.何氏系数Ho coefficient: ,V!Wo4M
5-11.抽速系数speed factor: *B4OvHi)'
5-12.气体的反扩散back-diffusion of gas: kb$Yc)+R4
5-13.泵液返流back-streaming of pump fluid: DIYR8l}x
5-14.返流率back-streaming rate l^tRy_T:-
5-15.返迁移back-migration: T
g(\7Kq
5-16.爆腾bumping: 0f_`;{
5-17.水蒸气允许量qm water vapor tolerable load: pQZ`dS\
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: >`WQxkpy
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: _TdH6[9
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump 2I suBX\[
3. 1.一般术语 2ETv H~23
1-1.压力计pressure gauge: |pknaz
1-2.真空计vacuum gauge: 'o=DGm2H
⑴.规头(规管)gauge head: ?;w`hA3ei
⑵.裸规nude gauge : |U'` Sc
⑶.真空计控制单元gauge control unit : <2O#!bX1
⑷.真空计指示单元gauge indicating unit : hw`pi6
,ZYPffu<*
2.真空计一般分类 Lf.Ia*R:
2-1.压差式真空计differential vacuum gauge: 1"t9x.
2-2.绝对真空计 absolute vacuum gauge: HOPl0fY$L
2-3.全压真空计total pressure vacuum gauge: $<VH~Q<
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: ijcF[bmE
2-5.相对真空计relative vacuum gauge : s,mt%^x[
TrgKl2xfx
3.真空计特性 N3Q
.4?
z9
3-1.真空计测量范围pressure range of vacuum gauge: r^E(GmW
3-2.灵敏度系数sensitivity coefficient: ^!O!HMX0
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): o*~=NoR
3-5.规管光电流photon current of vacuum gauge head: tJ7tZ~Ak
3-6.等效氮压力equivalent nitrogen pressure : $Ups9p Q
3-7.X射线极限值 X-ray limit: r~|7paX!
3-8.逆X射线效应anti X-ray effect: $WRRCB/A6
3-9.布利尔斯效应blears effect: /A>nsN?:]
[\ 0>@j}Z
4.全压真空计 3*?W2;Zw$
4-1.液位压力计liquid level manometer: .|P
:n'
4-2.弹性元件真空计elastic element vacuum gauge: Rw63{b/
4-3.压缩式真空计compression gauge: h`v T[u~l
4-4.压力天平pressure balance: #l* w=D?
4-5.粘滞性真空计viscosity gauge : all2?neK
4-6.热传导真空计thermal conductivity vacuum gauge : %LqT>HXJ
4-7.热分子真空计thermo-molecular gauge: sA+K?_
4-8.电离真空计ionization vacuum gauge: %ol1WG 9
4-9.放射性电离真空计radioactive ionization gauge: 6xr%xk2E
4-10.冷阴极电离真空计cold cathode ionization gauge: 9[&q
C
4-11.潘宁真空计penning gauge: Oku7&L1
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: WS@"8+re;
4-13.放电管指示器discharge tube indicator: |rgPHRX^Hn
4-14.热阴极电离真空计hot cathode ionization gauge: N3)n**
4-15.三极管式真空计triode gauge: EZp >Cf7
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: fG8^ |:
4-17.B-A型电离真空计Bayard-Alpert gauge: oOLj?
0t
4-18.调制型电离真空计modulator gauge: BEAY}P(y3
4-19.抑制型电离真空计suppressor gauge: T`u
,!S
4-20.分离型电离真空计extractor gauge: |NTqJ j
4-21.弯注型电离真空计bent beam gauge: [1Qg *
4-22.弹道型电离真空计 orbitron gauge : szqR1A
4-23.热阴极磁控管真空计hot cathode magnetron gauge: w}97`.Kt!n
DHvZ:)aT}
5.分压真空计(分压分析器) ?oV|.LM:W
5-1.射频质谱仪radio frequency mass spectrometer: 5]kv1nQ
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: nb*`GE
5-3.单极质谱仪momopole mass spectrometer: 4,=;:#n,J
5-4.双聚焦质谱仪double focusing mass spectrometer: +sq_fd ;'D
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: qjg Z
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: #op0|:/N
5-7.回旋质谱仪omegatron mass spectrometer: J9J/3O
Q=
5-8.飞行时间质谱仪time of flight mass spectrometer: ssH[\i
v4X ` Ul*
6.真空计校准 B oiS
6-1.标准真空计reference gauges: S*7 6V"")
6-2.校准系统system of calibration: `O%O[
6-3.校准系数K calibration coefficient: zW`a]n.
6-4.压缩计法meleod gauge method: iJKGzHvS
6-5.膨胀法expansion method: Nn?$}g
6-6.流导法flow method: yKz%-6cpSl
4. 1.真空系统vacuum system l&Y'5k_R
1-1.真空机组pump system: vr6YE;Rs
1-2.有油真空机组pump system used oil : r&F
6ZCw
1-3.无油真空机组oil free pump system z$ {[Z=
1-4.连续处理真空设备continuous treatment vacuum plant: u2[L^]|
1-5.闸门式真空系统vacuum system with an air-lock: g<$2#c}
1-6.压差真空系统differentially pumped vacuum system: M[u6+`
1-7.进气系统gas admittance system: 0xeY0!ux
CZ{7?:^f
2.真空系统特性参量 XBcbLF
2-1.抽气装置的抽速volume flow rate of a pumping unit : ;R@D
2-2.抽气装置的抽气量throughput of a pumping unit : [;~"ctf{
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: lPtML<a
2-4.真空系统的漏气速率leak throughput of a vacuum system: m|OB_[9
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: .Ep&O#
2-6.极限压力ultimate pressure: gr@Ril^
2-7.残余压力residual pressure: 50T^V`6
2-8.残余气体谱residual gas spectrum: `9T5Dem|#
2-9.基础压力base pressure: ao|n<*}
2-10.工作压力working pressure: s5*HS3D
2-11.粗抽时间roughing time: 8 0o'=E}"
2-12.抽气时间pump-down time: $(*>]PC+)
2-13.真空系统时间常数time constant of a vacuum system: B;piO-hH
2-14.真空系统进气时间venting time: 7 Z?
Hyv
5;HCNwX
3.真空容器 }EJ/H3<
3-1.真空容器;真空室vacuum chamber: G9GLRdP
3-2.封离真空装置sealed vacuum device: 9E[==2TO
3-3.真空钟罩vacuum bell jar: K7nyQGS
3-4.真空容器底板vacuum base plate: @:>gRD
3-5.真空岐管vacuum manifold: kZi/2UA5Z
3-6.前级真空容器(贮气罐)backing reservoir: )me`Ud
3-7.真空保护层outer chamber: G68@(<<Z
3-8.真空闸室vacuum air lock: # nAq~@X
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: #ZP;] W
3Y&4yIx
4.真空封接和真空引入线 Cbm^:
_LR
4-1.永久性真空封接permanent seal : B$hog_=s
4.2.玻璃分级过渡封接graded seal : &rl;+QS
4-3.压缩玻璃金属封接compression glass-to-metal seal: #~.RJ%
4-4.匹配式玻璃金属封接matched glass-to-metal seal: U;!J(Us
4-5.陶瓷金属封接ceramic-to-metal seal: +F2X2e)g"
4-6.半永久性真空封接semi-permanent seal : #5{BxX&\
4-7.可拆卸的真空封接demountable joint: L1y71+iqU
4-8.液体真空封接liquid seal "{Y6.)x
4-9.熔融金属真空封接molten metal seal: _c5*9')-)
4-10.研磨面搭接封接ground and lapped seal: n.C5w8f
4-11.真空法兰连接vacuum flange connection: /?Mr2!3N
4-12.真空密封垫vacuum-tight gasket: $q.}eb0
4-13.真空密封圈ring gasket: g=,}j]tl
4-14.真空平密封垫flat gasket: 9b@yDq3hQ
4-15.真空引入线feedthrough leadthrough: ;BKU
_}k=
4-16.真空轴密封shaft seal: B<a` o&?
4-17.真空窗vacuum window: 8lA,3'z
4-18.观察窗viewing window: dep"$pys>
YBF$/W+=9|
5.真空阀门 f$vTD ak
5-1.真空阀门的特性characteristic of vacuum valves: %&q}5Y4!
⑴.真空阀门的流导conductance of vacuum valves: qV/>d',
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: {];-b0MS~
5-2.真空调节阀regulating valve: vJV/3-yX
5-3.微调阀 micro-adjustable valve: 1EWZA
5-4.充气阀charge valve: uU^iY$w
5-5.进气阀gas admittance valve: y*v|q=
5-6.真空截止阀break valve: l"jYY3N|h
5-7.前级真空阀backing valve: HPJHA ,
5-8.旁通阀 by-pass valve: mZjpPlJ
5-9.主真空阀main vacuum valve: Zj1bG{G=i
5-10.低真空阀low vacuum valve: =2ED
w_5E
5-11.高真空阀high vacuum valve: ,|.}6\zl*{
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: bX`Gv+
5-13.手动阀manually operated valve: ='m%Iq7X
5-14.气动阀pneumatically operated valve: e0otr_)3F
5-15.电磁阀electromagnetically operated valve: 4"\cA:9a
5-16.电动阀valve with electrically motorized operation: "Wr[DqFd
5-17.挡板阀baffle valve: ItZYOt|Hn
5-18.翻板阀flap valve: G#^0Bh&
5-19.插板阀gate valve: 2A:h&t/|C
5-20.蝶阀butterfly valve: `u PLyS.
Dg{d^>T!_x
6.真空管路 c"pOi&
6-1.粗抽管路roughing line: aql8Or1[
6-2.前级真空管路backing line: =
6-3.旁通管路;By-Pass管路 by-pass line: `Pc<0*`a
6-4.抽气封口接头pumping stem: N;6o=^ic
6-5.真空限流件limiting conductance: X)+6>\
6-6.过滤器filter: u]9\_{c]Q
5. 1.一般术语 !\9^|Ef?
1-1真空镀膜vacuum coating: I0z 7bx
1-2基片substrate: S6a\KtVa
1-3试验基片testing substrate: I~@8SSO,vH
1-4镀膜材料coating material: tMp!MQ
1-5蒸发材料evaporation material: Ki7t?4YE
1-6溅射材料sputtering material: (/,l0
1-7膜层材料(膜层材质)film material: slUi)@b
1-8蒸发速率evaporation rate: 6)P.wW
1-9溅射速率sputtering rate: UxzF5V5
1-10沉积速率deposition rate: o[iN/
1-11镀膜角度coating angle: c;fLM`{*
vv{+p(~**O
2.工艺 j%^4
1 y
2-1真空蒸膜vacuum evaporation coating: #8yo9g6
(1).同时蒸发simultaneous evaporation: lG%697P
(2).蒸发场蒸发evaporation field evaporation: |%mZ|,[
(3).反应性真空蒸发reactive vacuum evaporation: TjYHoL5
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: tp>YsQy]8
(5).直接加热的蒸发direct heating evaporation: K,,) FM
(6).感应加热蒸发induced heating evaporation: " QiR
(7).电子束蒸发electron beam evaporation: v$Hz)J.01
(8).激光束蒸发laser beam evaporation: !4'F z[RK
(9).间接加热的蒸发indirect heating evaporation: l:uQ#Z)
(10).闪蒸flash evaportion: (;%T]?<9#
2-2真空溅射vacuum sputtering: i/1$uQ
(1).反应性真空溅射 reactive vacuum sputtering: WKlyOK=}
(2).偏压溅射bias sputtering: b \ln XN
(3).直流二级溅射direct current diode sputtering: vZ"gCf3#?3
(4).非对称性交流溅射asymmtric alternate current sputtering: wlaPE8Gc
(5).高频二极溅射high frequency diode sputtering: 6[c|14l
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: /#H P;>!n
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: Rqp#-04*W
(8).离子束溅射ion beam sputtering: )H{1Xjh-
(9).辉光放电清洗glow discharge cleaning: t^FE]$,
2-3物理气相沉积PVD physical vapor deposition: MJ1qU}+]
2-4化学气相沉积CVD chemical vapor deposition: orH6R8P]
2-5磁控溅射magnetron sputtering: -OlrA{=c_
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: H>+])~#
2-7空心阴极离子镀HCD hollow cathode discharge deposition: o,dp{+({
2-8电弧离子镀arc discharge deposition: 3mo4;F,h9
-bzlp7q*
3.专用部件 ~ILv*v@m
3-1镀膜室coating chamber: $5)#L$!,]
3-2蒸发器装置evaporator device: ng!cK<p
3-3蒸发器evaporator: KGg
S"d
3-4直接加热式蒸发器evaporator by direct heat: h%ys::\zF
3-5间接加热式蒸发器evaporator by indirect heat: YRX^fZ-b
3-7溅射装置sputtering device: Babzrt-
3-8靶target: M-Efe_VRQc
3-10时控挡板timing shutter: _G/R;N71
3-11掩膜mask: a(]&H
"
3-12基片支架substrate holder: ": M]3.
3-13夹紧装置clamp: AG=PbY9
3-14换向装置reversing device: 4=Ru{ewRV
3-15基片加热装置substrate heating device: A%Ka)UU+n
3-16基片冷却装置substrate colding device: YYYF a
d\]KG(T
4.真空镀膜设备 SYA~I-OYc
4-1真空镀膜设备vacuum coating plant: vxEi C:&]
(1).真空蒸发镀膜设备vacuum evaporation coating plant: vu\W5M
(2).真空溅射镀膜设备vacuum sputtering coating plant: Yr_B(n
4-2连续镀膜设备continuous coating plant: o?>0WSLlm
4-3半连续镀膜设备semi- continuous coating plant ofQs
/
6. 1.漏孔 ZF[W<Q
1-1漏孔leaks: 1bCE~,tD
1-2通道漏孔channel leak: KYm8|]'g
1-3薄膜漏孔membrane leak: Jj>Rzj!m
1-4分子漏孔molecular leak:
S
W%>8
1-5粘滞漏孔vixcous leak: D5P-$1KPt
1-6校准漏孔calibrated leak: h$!YKfhq}
1-7标准漏孔reference leak : E4892B:`
1-8虚漏virtual leak: }
u;{38~
1-9漏率leak rate: yV:8>9wE8
1-10标准空气漏率standard air leak rate: K9%rr_ja!
1-11等值标准空气漏率equivalent standard air leak rate: Yp;Z+!!UZ
1-12探索(示漏)气体: NeY*l
2[+.*Ef
2.本底 xB Wl|j
2-1本底background: :5%98V>02
2-2探索气体本底search gas background : L{%L*z9J
2-3漂移drift: }={@_g#
2-4噪声noise: '2lzMc>wvP
Eb[;nk?
3.检漏仪 -J+1V{
3-1检漏仪leak detector: 6)uBUM;i
3-2高频火花检漏仪H.F. spark leak detector: L?N&kzA
3-3卤素检漏仪halide leak detector: `D[O\ VE
3-4氦质谱检漏仪helium mass spectrometer leak detector: *mp:#'
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: F8-GnTxa
r4SwvxhG
4.检漏 )
~=pt&+
4-1气泡检漏leak detection by bubbles: ]j>xQm\
4-2氨检漏leak detection by ammonia: { im?tZ,
4-3升压检漏leak detection of rise pressure: :k1?I'q%
4-4放射性同位素检漏radioactive isotope leak detection: q x)\{By
4-5荧光检漏fluorescence leak detection /e>%yq<9B
7. 1.一般术语 Q/]~`S
1-1真空干燥vacuum drying: 1*hE bO
1-2冷冻干燥freeze drying : j;`Q82V\
1-3物料material: S}JOS}\^j
1-4待干燥物料material to be dried: TS6xF?
1-5干燥物料dried material : m)p|NdTZc8
1-6湿气moisture;humidity: 2.%)OC!q&5
1-7自由湿气free moisture: _{k*JT2
1-8结合湿气bound moisture: MQwxQ{
1-9分湿气partial moisture: zb9G&'7
1-10含湿量moisture content: RQ8d1US
1-11初始含湿量initial moisture content: vlkwWm
1-12最终含湿量final residual moisture: xcW\U^1d
1-13湿度degree of moisture ,degree of humidity : K{DC{yLu
1-14干燥物质dry matter : ik(YJw'i7E
1-15干燥物质含量content of dry matter: p"%D/-%Gu
Ak@!F6~
2.干燥工艺 ]?VVwft
2-1干燥阶段stages of drying : 8*0QVFn$
(1).预干燥preliminary dry: CHKhJ v3+4
(2).一次干燥(广义)primary drying(in general): #[=kQ&
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): f5 bq)Pm&
(4).二次干燥secondary drying: "
7^nRJy
2-2.(1).接触干燥contact drying: S3%2T
(2).辐射干燥 drying by radiation : yk4@@kHW
(3).微波干燥microwave drying: 1}\p:`
(4).气相干燥vapor phase drying: G%bv<_R
(5).静态干燥static drying: /";tkad^
(6).动态干燥dynamic drying: % vUU
Fub
2-3干燥时间drying time: zz
U,0
L
2-4停留时间length of stay(in the drying chamber): o:QL%J{[
2-5循环时间cycle time: (%L/|F_
2-6干燥率 dessication ratio : >ZOlSLu
2-7去湿速率mass flow rate of humidity: D^@@ P
2-8单位面积去湿速率mass flow rate of humidity per surface area: gDU!dT
2-9干燥速度 drying speed : @)h>vg
2-10干燥过程drying process: ?.`
ga*
2-11加热温度heating temperature: rlKR
<4H
2-12干燥温度temperature of the material being dried : F0_w9"3E~
2-13干燥损失loss of material during the drying process : phu,&DS!
2-14飞尘lift off (particles): 6ncwa<q5
2-15堆层厚度thickness of the material: j_g(6uZhz3
y-+W
3.冷冻干燥 e}?Q&Lci
3-1冷冻freezing: |-V:#1wR.]
(1).静态冷冻static freezing: b+qd'
,.Z
(2).动态冷冻dynamic freezing: Am*IC?@tq
(3).离心冷冻centrifugal freezing: o+.L@3RT4
(4).滚动冷冻shell freezing: KuJ9bn{u!C
(5).旋转冷冻spin-freezing: Nt$4;
(6).真空旋转冷冻vacuum spin-freezing: >rQj1D)@
(7).喷雾冷冻spray freezing: l-%] f]>
(8).气流冷冻air blast freezing: y-E'Y=j
3-2冷冻速率rate of freezing: i5TGK#3o
3-3冷冻物料frozen material: _$AM=?P&
3-4冰核ice core: w|&lRo@1
3-5干燥物料外壳envelope of dried matter: KR$Fd
3-6升华表面sublimation front: g PCf+>X{
3-7融化位置freezer burn: x,mt}>
iz-z?)%
4.真空干燥设备;真空冷冻干燥设备 d?X,od6
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: tsg`c;{
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: ;'{7wr|9
4-3加热表面heating surface: 5.VPK 338A
4-4物品装载面shelf : m'}`+#C%)
4-5干燥器的处理能力throughput (of the vacuum drying chamber): ~b]enG5xS4
4-6单位面积干燥器处理能力throughput per shelf area: oVK:A;3T|
4-7冰冷凝器ice condenser: 7vZO;FGtG
4-8冰冷凝器的负载load of the ice condenser: Dazm8_x
4-9冰冷凝器的额定负载rated load of the ice condenser KE,.Evyu=
8. 1.一般术语 =.8n K
y
1-1试样sample : f%EHzm/V
(1).表面层surface layer: %@C8EFl%3
(2).真实表面true surface: I^A>YJW
(3).有效表面积effective surface area: .Qrpz^wdt
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: ]|!|3lQ
(5).表面粒子密度surface particle density: GU>j8.
(6).单分子层monolayer: r =x"E$
(7).表面单分子层粒子密度monolayer density: A2gFY}
(8).覆盖系数coverage ratio: < +*
1-2激发excitation: #3*cA!V.<
(1).一次粒子primary particle: _{'[Uf/l
(2).一次粒子通量primary particle flux: KMi$0+
(3).一次粒子通量密度density of primary particle flux: [;ZCq!)>
(4).一次粒子负荷primary particle load: ]^"Lc~w8&
(5).一次粒子积分负荷integral load of primary particle: H(;@7dh
(6).一次粒子的入射能量energy of the incident primary particle: pZS]i
"
(7).激发体积excited volume: VLm\P S
(8).激发面积excited area: _0$>LWO~
(9).激发深度excited death: `0ym3} (O
(10).二次粒子secondary particles: Pi"?l[T0
(11).二次粒子通量secondary particle flux: k9*UBx
(12).二次粒子发射能energy of the emitted secondary particles: 1_{ e*=/y
(13).发射体积emitting volume: [c=Wp
(14).发射面积emitting area: H_f8/H
(15).发射深度emitting depth: !k%
PP
(16).信息深度information depth: ^^}htg
(17).平均信息深度mean information depth: .iR<5.
1-3入射角angle of incidence: AsE77AUA
1-4发射角angle of emission: /#T {0GBXe
1-5观测角observation: qZ!kVrmg&
1-6分析表面积analyzed surface area: ng+sK
1-7产额 yield : >8{w0hh;
1-8表面层微小损伤分析minimum damage surface analysis: ;!f~
1-9表面层无损伤分析non-destructive surface analysis: \h'7[vkr
1-10断面深度分析 profile analysis in depth; depth profile analysis : X[h{g`
1-11可观测面积observable area: kO}%Y?9d
1-12可观测立体角observable solid angle : Io<T'K
1-13接受立体角;观测立体角angle of acceptance: a^LckHPI>
1-14角分辨能力angular resolving power: ]d(Z%
1-15发光度luminosity: 69$R.
1-16二次粒子探测比detection ratio of secondary particles: (pCHj'
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: Sydl[c pH$
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: I*%3E.Z@g
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: %1p-DX6
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: B~}BDnu 6
1-21本底压力base pressure: \2+ngq)
1-22工作压力working pressure: 8!35
K
Ju#j%!
2.分析方法 wg[
+NWJ
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: r&xIVFPI[
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : vKW!;U9~P
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: 9LPXhxNwB
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: K?,?.!ev
2-3离子散射表面分析ion scattering spectroscopy: rr,A Vw
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: !D1#3?L
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: 8Ys)q x>7'
2-6离子散射谱仪ion scattering spectrometer:
kVZs:
2-7俄歇效应Auger process: =U~53Tg
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: &V
7J5~_
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: f{2UL ?y
2-10光电子谱术photoelectron spectroscopy : e}5x6t
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: Q[3hOFCX
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: D8!
Y0
2-11光电子谱仪photoelectron spectrometer: VXZYRr3F
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: 00IW9B-
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: g]h@U&`~u_
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): Ndl{f=sjX-
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus