“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 -Kc-eU-&q
--------------------------------------------------- wXZ-%,R-D
真空术语 <B
fwR$
},"g*
1.标准环境条件 standard ambient condition: `C()H@;
2.气体的标准状态 standard reference conditions forgases: I&vB\A
3.压力(压强)p pressure: m2}&5vD8-
4.帕斯卡Pa pascal: *PI3L/*
5.托Torr torr: D H.ljGb
6.标准大气压atm standard atmosphere: [Ytia#Vv
7.毫巴mbar millibar: %*/[aq, #
8.分压力 partial pressure: ._R82gy
9.全压力 total pressure: 3a5H<3w_
10.真空 vacuum: >:xnjEsi$/
11.真空度 degree of vacuum: F0!r9U((
12.真空区域 ranges of vacuum: F?dTCa
13.气体 gas: kQb0pfYs
14.非可凝气体 non-condensable gas: s R~&S))
15.蒸汽vapor:
~ 52
16.饱和蒸汽压saturation vapor pressure: hh?'tb{
17.饱和度degree of saturation: =?2y
<B
18.饱和蒸汽saturated vapor: lfKknp#B/O
19.未饱和蒸汽unsaturated vapor: p<+]+,|\~:
20.分子数密度n,m-3 number density of molecules: /qCYNwWH9
21.平均自由程ι、λ,m mean free path: H{V-C_
22.碰撞率ψ collision rate: m0edkt-x
23.体积碰撞率χ volume collision rate: hw7_8pAbh
24.气体量G quantity of gas: lAGxE-B^a"
25.气体的扩散 diffusion of gas: {NFeX'5bP
26.扩散系数D diffusion coefficient; diffusivity: 226s:\d
27.粘滞流 viscous flow: G'epsD,.bX
28.粘滞系数η viscous factor: lt*k(JD
29.泊肖叶流 poiseuille flow: 7q?YdAUz
30.中间流 intermediate flow: *K)v&}uw
31.分子流 molecular flow: l&rDa=m.J
32克努曾数 number of knudsen: <hea%6
33.分子泻流 molecular effusion; effusive flow: yO6i "3
34.流逸 transpiration: :@/fy}!
35.热流逸 thermal transpiration: ?1{`~)"
36.分子流率qN molecular flow rate; molecular flux: 5[3hw4
37.分子流率密度 molecular flow rate density; density of molecular flux: }n.h)Oz
38.质量流率qm mass flow rare: a_ P[J8j
39.流量qG throughput of gas: *Z]|
Z4Q/`
40.体积流率qV volume flow rate: A`r9"([-A
41.摩尔流率qυ molar flow rate: j@ "`!uPz
42.麦克斯韦速度分布 maxwellian velocity distribution: .
9
NS
43.传输几率Pc transmission probability: 9,Mp/.T" \
44.分子流导CN,UN molecular conductance: *HC8kD a%$
45.流导C,U conductance: {7wvC)WW
46.固有流导Ci,Ui intrinsic conductance: V;6M[ic}
47.流阻W resistance: bDkE*4SRX
48.吸附 sorption: miKi$jC}vq
49.表面吸附 adsorption: .~8+s.y
50.物理吸附physisorption: rEf\|x=st:
51.化学吸附 chemisorption: EH:1Z*|Z{\
52.吸收absorption: NWg\{a
53.适应系数α accommodation factor: HB}gn2.1&
54.入射率υ impingement rate: PYUY bRn
55.凝结率condensation rate: 9JtvHUkO
56.粘着率 sticking rate: V588Leb?
57.粘着几率Ps sticking probability: YfalsQ8
58.滞留时间τ residence time: )L!R~F
C
59.迁移 migration: g-^m\>B
60.解吸 desorption: Jv<)/Km`
61.去气 degassing: q+z\Y?
62.放气 outgassing: ]~zJ7I
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: pd1m/:
64.蒸发率 evaporation rate: )eEvyU
65.渗透 permeation: {|gJC>f@
66.渗透率φ permeability: U{_s1
67.渗透系数P permeability coefficient EVL;"
2. 1.真空泵 vacuum pumps G"[pr%?
1-1.容积真空泵 positive displacement pump: qWpC e*C
⑴.气镇真空泵 gas ballast vacuum pump: OgS8.wX
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: 9O Q4\
⑶.干封真空泵 dry-sealed vacuum pump: >FHsZKJ
⑷.往复真空泵 piston vacuum pump: @e,Zmx
⑸.液环真空泵 liquid ring vacuum pump: $ddYH
⑹.旋片真空泵 sliding vane rotary vacuum pump: 2P
?Iu&
⑺.定片真空泵 rotary piston vacuum pump: w3N%J>4_E
⑻.滑阀真空泵 rotary plunger vacuum pump: Ltw7b
⑼.余摆线真空泵 trochoidal vacuum pump: 713M4CtJ
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: ,m?D\Pru
⑾.罗茨真空泵 roots vacuum pump: LPn}QzH
1-2.动量传输泵 kinetic vacuum pump: +E~`H^
⑴.牵引分子泵molecular drag pump: ] )L'Rk#4
⑵.涡轮分子泵turbo molecular pump: |w2AB7EU
⑶.喷射真空泵ejector vacuum pump: pCUOeQL(
⑷.液体喷射真空泵liquid jet vacuum pump: h /QP=Zd
⑸.气体喷射真空泵gas jet vacuum pump: mv.I.EL
⑹.蒸汽喷射真空泵vapor jet vacuum pump : I0vnd7
⑺.扩散泵diffusion pump : X@&uu0JJ
⑻.自净化扩散泵self purifying diffusion pump: )JQQ4D
⑼.分馏扩散泵 fractionating diffusion pump : FBAC9}V"
⑽.扩散喷射泵diffusion ejector pump : &] 6T^.
⑾.离子传输泵ion transfer pump: *F*fH>?C#
1-3.捕集真空泵 entrapment vacuum pump: $tHwJ!<$&
⑴吸附泵adsorption pump: .K1E1Z_
⑵.吸气剂泵 getter pump: *UoHzaIqz
⑶.升华(蒸发)泵 sublimation (evaporation)pump : $-?5Q~
⑷.吸气剂离子泵getter ion pump: Y^Q|l%Qrb
⑸.蒸发离子泵 evaporation ion pump: cu^*x/0,
⑹.溅射离子泵sputter ion pump: Sc$wR{W<:
⑺.低温泵cryopump: ~&lJT
_0q~s@-
2.真空泵零部件 w%dIe!sV
2-1.泵壳 pump case: |Du13i4].&
2-2.入口 inlet: Ju7C?)x
2-3.出口outlet: zZc@;S#
2-4.旋片(滑片、滑阀)vane; blade : yO;C3q
2-5.排气阀discharge valve: (+8xUc(w
2-6.气镇阀gas ballast valve: #Rx"L&3Ue
2-7.膨胀室expansion chamber: /)?P>!#;\
2-8.压缩室compression chamber: r&3o~!
2-9.真空泵油 vacuum pump oil: Fg\| e%
2-10.泵液 pump fluid: ^s~n[
2-11.喷嘴 nozzle: E9B*K2l^{
2-13.喷嘴扩张率nozzle expansion rate: `ab\i`g9
2-14.喷嘴间隙面积 nozzle clearance area : x<j"DS}S)D
2-15.喷嘴间隙nozzle clearance: "E|r 3cN
2-16.射流jet: ,e FQ}&^A
2-17.扩散器diffuser: UxcDDa/j2T
2-18.扩散器喉部diffuser thoat: 9>&tMq
2-19.蒸汽导管vapor tube(pipe;chimney): ,PMb9O\B
2-20.喷嘴组件nozzle assembly: MupW=3.38
2-21.下裙skirt: QiE<[QP{g
+F~0\#d
3.附件 -Bo~"q
3-1阱trap: d6@jEa-
⑴.冷阱 cold trap: 9X$#x90
⑵.吸附阱sorption trap: @ZkAul0@
⑶.离子阱ion trap: )*K<;WIWH
⑷.冷冻升华阱 cryosublimation trap: n*i'v tQ8
3-2.挡板baffle: T$^>Fiz{Se
3-3.油分离器oil separator:
X'#$e{
3-4.油净化器oil purifier: -j`!(IJ
3-5.冷凝器condenser: q= yZx)
ZE8/ m")
4.泵按工作分类 Qyv'nx0=
4-1.主泵main pump: a][pTC\ rb
4-2.粗抽泵roughing vacuum pump: Z0ncN])
4-3.前级真空泵backing vacuum pump: h lkvk]v
4-4.粗(低)真空泵 roughing(low)vacuum pump: E/7vIg
F
4-5.维持真空泵holding vacuum pump: $EQT"ZX>%i
4-6.高真空泵high vacuum pump: a()6bRc~T
4-7.超高真空泵ultra-high vacuum pump: FQ^<,
4-8.增压真空泵booster vacuum pump: _(6B.
[7e{=\`=
5.真空泵特性 c2/R]%`)9
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: H6ky)kF&
5-2.真空泵的抽气量Q throughput of vacuum pump:。 `\ef0
5-3.起动压力starting pressure: (9KDtr*(2i
5-4.前级压力 backing pressure : RO%tuU,-
5-5.临界前级压力 critical backing pressure: up&N CX
5-6.最大前级压力maximum backing pressure: -4vHK!l
5-7.最大工作压力maximum working pressure: ^%5~;
5-8.真空泵的极限压力ultimate pressure of a pump: 6MQs \ J6.
5-9.压缩比compression ratio: ii_|)udz
5-10.何氏系数Ho coefficient: O2q=gYX>\
5-11.抽速系数speed factor: MvZ+n
5-12.气体的反扩散back-diffusion of gas: fVH*dX'Jz
5-13.泵液返流back-streaming of pump fluid: /lr1hW~Dbk
5-14.返流率back-streaming rate jSie&V@ px
5-15.返迁移back-migration: x&R9${e%
5-16.爆腾bumping: KUp
5-17.水蒸气允许量qm water vapor tolerable load: M<A;IOpR+
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: *(d6Z#
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: 8tLT'2+H#
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump \!UF|mD^tG
3. 1.一般术语 rnn2u+OG
1-1.压力计pressure gauge: Ha)3i{OM
1-2.真空计vacuum gauge: H@%7\g,`
⑴.规头(规管)gauge head: U]V3DDN
⑵.裸规nude gauge : U|Bsa(?nx
⑶.真空计控制单元gauge control unit : I|g@W_
⑷.真空计指示单元gauge indicating unit : 0i8[=
A6^p}_
2.真空计一般分类 'v\1:zi
2-1.压差式真空计differential vacuum gauge: Rwc[:6;fn
2-2.绝对真空计 absolute vacuum gauge: s[G|q5n
2-3.全压真空计total pressure vacuum gauge: ),cQUB
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: dGbU{#"3s
2-5.相对真空计relative vacuum gauge : AI1@-
[&h#iTRT
3.真空计特性 ^&+zA,aL,A
3-1.真空计测量范围pressure range of vacuum gauge: u}K5/hC
3-2.灵敏度系数sensitivity coefficient: xm<v"><
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): FOOQ'o[}
3-5.规管光电流photon current of vacuum gauge head: Js\-['`
3-6.等效氮压力equivalent nitrogen pressure : /S:w&5e
3-7.X射线极限值 X-ray limit: {S5RK-ax
3-8.逆X射线效应anti X-ray effect: LP^p~5Az
3-9.布利尔斯效应blears effect: 5h`m]#YEG
+1otn~(E
4.全压真空计 V";mWws+?#
4-1.液位压力计liquid level manometer: 5f;n<EPy
4-2.弹性元件真空计elastic element vacuum gauge: &Ki>h
4-3.压缩式真空计compression gauge: K0tV'Ml#"
4-4.压力天平pressure balance: Sm$p\ORa
4-5.粘滞性真空计viscosity gauge : T ;i?w
4-6.热传导真空计thermal conductivity vacuum gauge : 0JmFQ^g(
4-7.热分子真空计thermo-molecular gauge: f{)+-8
4-8.电离真空计ionization vacuum gauge: 9#v-2QY
4-9.放射性电离真空计radioactive ionization gauge: oN *SRaAp
4-10.冷阴极电离真空计cold cathode ionization gauge: 9{_8cpm4
4-11.潘宁真空计penning gauge: l6iw=b[?
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: JB&G~7Q85
4-13.放电管指示器discharge tube indicator: S5uJX#*;
4-14.热阴极电离真空计hot cathode ionization gauge: {eEBrJJeB
4-15.三极管式真空计triode gauge: \Dn&"YG7
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: CQ@LmTW[
4-17.B-A型电离真空计Bayard-Alpert gauge: 2>F\&
4-18.调制型电离真空计modulator gauge: }5Yj
4-19.抑制型电离真空计suppressor gauge: *:a'GC%/
4-20.分离型电离真空计extractor gauge: PeO] lq
4-21.弯注型电离真空计bent beam gauge: JZ `>|<W
4-22.弹道型电离真空计 orbitron gauge : cNe0x2Z$?
4-23.热阴极磁控管真空计hot cathode magnetron gauge: P+[QI
U
^#]c0
5.分压真空计(分压分析器) Z:K+I+:t
5-1.射频质谱仪radio frequency mass spectrometer: hT?6sWa
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: +T9Q_e*
5-3.单极质谱仪momopole mass spectrometer: O`cdQu
5-4.双聚焦质谱仪double focusing mass spectrometer: k/% #>
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: he"L*p*H
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: `YPe^!`$
5-7.回旋质谱仪omegatron mass spectrometer: Z;#%t.
5-8.飞行时间质谱仪time of flight mass spectrometer: 1Fv8T'
rvW!7-R
6.真空计校准 x
Sv-;!y
6-1.标准真空计reference gauges: zJ5hvDmC
6-2.校准系统system of calibration: 85'nXYN{d
6-3.校准系数K calibration coefficient: rVY?6OMkd
6-4.压缩计法meleod gauge method: ! 0^;;'
6-5.膨胀法expansion method: 'iJDWxCD
6-6.流导法flow method: f0vJm
4. 1.真空系统vacuum system M&r2:Whk
1-1.真空机组pump system: n|WfaJQZ
1-2.有油真空机组pump system used oil : m#JI!_~!
1-3.无油真空机组oil free pump system _1ew(x2J
1-4.连续处理真空设备continuous treatment vacuum plant: YydA6IK4
1-5.闸门式真空系统vacuum system with an air-lock: 2Zy_5>~
1-6.压差真空系统differentially pumped vacuum system: WJfES2N
1-7.进气系统gas admittance system: ]Kv q |}=
1pK6=-3w3
2.真空系统特性参量 5k]XQxc6_
2-1.抽气装置的抽速volume flow rate of a pumping unit : +]c/&Xo!
2-2.抽气装置的抽气量throughput of a pumping unit : ^5>s7SGB"
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: 9e!vA6Fx
2-4.真空系统的漏气速率leak throughput of a vacuum system: e&0K;yU
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: ld.7`)
2-6.极限压力ultimate pressure: OOok hZd`
2-7.残余压力residual pressure: X1oGp+&
2-8.残余气体谱residual gas spectrum: b^x07lO
2-9.基础压力base pressure: ,9d9_c.T
2-10.工作压力working pressure: +c--&tBo
2-11.粗抽时间roughing time: _-O cc=Z
2-12.抽气时间pump-down time: gw^'{b
2-13.真空系统时间常数time constant of a vacuum system: 2:Q(Gl`<l
2-14.真空系统进气时间venting time: }k7_'p&yk
Hy]
3.真空容器 VevNG*
3-1.真空容器;真空室vacuum chamber: 'f+NW&
3-2.封离真空装置sealed vacuum device: ~M5:=zKQ
3-3.真空钟罩vacuum bell jar: *t(4 $
3-4.真空容器底板vacuum base plate: _1aGtX|W
3-5.真空岐管vacuum manifold: dQD$K|aUp
3-6.前级真空容器(贮气罐)backing reservoir: 'Dath>Y=
3-7.真空保护层outer chamber: ='}#`',
3-8.真空闸室vacuum air lock: $
KB
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: aE)by-'
yS!(Ap
4.真空封接和真空引入线 3-C\2
4-1.永久性真空封接permanent seal : {:bN/zV#
4.2.玻璃分级过渡封接graded seal : )#C
mQXgG
4-3.压缩玻璃金属封接compression glass-to-metal seal: E)W@{?.o#
4-4.匹配式玻璃金属封接matched glass-to-metal seal: T p<s1'"
4-5.陶瓷金属封接ceramic-to-metal seal: e4\dpvL
4-6.半永久性真空封接semi-permanent seal : (?>cn_m
4-7.可拆卸的真空封接demountable joint: l+[czb~
4-8.液体真空封接liquid seal _'!kuE,*1
4-9.熔融金属真空封接molten metal seal: wfR&li{
4-10.研磨面搭接封接ground and lapped seal: ;JT(3yK4>p
4-11.真空法兰连接vacuum flange connection: 7C7>y/uS
4-12.真空密封垫vacuum-tight gasket: irKIy
4-13.真空密封圈ring gasket: &eQJfc\a
4-14.真空平密封垫flat gasket: booRrTS
4-15.真空引入线feedthrough leadthrough: bcH_V|5}
4-16.真空轴密封shaft seal: ^:KO_{3E
4-17.真空窗vacuum window: I[d]!YI}F
4-18.观察窗viewing window: QM'X@
X(Qu{HhI
5.真空阀门 eg<pa'Hw
5-1.真空阀门的特性characteristic of vacuum valves: 7 ^$;
⑴.真空阀门的流导conductance of vacuum valves: @MbVWiv
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: MsOs{2
)2
5-2.真空调节阀regulating valve: r2\c'9uH
5-3.微调阀 micro-adjustable valve: 8 lT{1ro
5-4.充气阀charge valve: o6a0'vU><
5-5.进气阀gas admittance valve: ]s_8A`vm
5-6.真空截止阀break valve: )8,|-o=
5-7.前级真空阀backing valve: I:l01W;
5-8.旁通阀 by-pass valve: DHw<%Z-J
5-9.主真空阀main vacuum valve: Z[?mc|*x
5-10.低真空阀low vacuum valve: Z7a945Jd
5-11.高真空阀high vacuum valve: @S^ASDuQU7
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: pQa:pX
5-13.手动阀manually operated valve: 56}X/u
5-14.气动阀pneumatically operated valve: rD
&D)w
5-15.电磁阀electromagnetically operated valve: ezm&]F`
5-16.电动阀valve with electrically motorized operation: @'6"7g
5-17.挡板阀baffle valve: J G$Z.s
5-18.翻板阀flap valve: Bc5+ss
5-19.插板阀gate valve: "ju'UOcS/
5-20.蝶阀butterfly valve: wT,R0~V0
w@-M{?R
6.真空管路 g)"gw+ZFc
6-1.粗抽管路roughing line: bHE2,;o
6-2.前级真空管路backing line: 3=mr
"&]r:
6-3.旁通管路;By-Pass管路 by-pass line: v,@F|c?_S
6-4.抽气封口接头pumping stem: kz}R[7
6-5.真空限流件limiting conductance: V3Z]DA
6-6.过滤器filter: hz:pbes
5. 1.一般术语 xc@Ss[
1-1真空镀膜vacuum coating: oUZoj2G1
1-2基片substrate: Yk!/ow@.
1-3试验基片testing substrate: 3FE( }G
1-4镀膜材料coating material: (p#0)C
1-5蒸发材料evaporation material: 4?\:{1X=
1-6溅射材料sputtering material: >l']H*&B<
1-7膜层材料(膜层材质)film material: Of,2Q#oji
1-8蒸发速率evaporation rate: &7e)O=
1-9溅射速率sputtering rate: (V:E2WR
1-10沉积速率deposition rate: S$,'Q^~K
1-11镀膜角度coating angle: WJH\~<{mP
GLMm(
2.工艺 zi9[)YqxPH
2-1真空蒸膜vacuum evaporation coating: &ANP`=
(1).同时蒸发simultaneous evaporation: :aCrX
(2).蒸发场蒸发evaporation field evaporation: Yr.sm!xA
(3).反应性真空蒸发reactive vacuum evaporation: Qn@Pd* DR
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: MK#wut
(5).直接加热的蒸发direct heating evaporation: 46@{5)Tq
(6).感应加热蒸发induced heating evaporation: CNZ z]H
(7).电子束蒸发electron beam evaporation: i:]*P
(8).激光束蒸发laser beam evaporation: r0;:t
(9).间接加热的蒸发indirect heating evaporation: @gC=$A#
(10).闪蒸flash evaportion: \JEXX4%
2-2真空溅射vacuum sputtering: q[q?hQ/b
(1).反应性真空溅射 reactive vacuum sputtering: RGKYW>$0RR
(2).偏压溅射bias sputtering: t]jFo
(3).直流二级溅射direct current diode sputtering: ~}EMk 3
(4).非对称性交流溅射asymmtric alternate current sputtering: 1RcSTg
(5).高频二极溅射high frequency diode sputtering: JF&$t}
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: bV+(b9
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: v{zMO:3
(8).离子束溅射ion beam sputtering: JxE53ev
(9).辉光放电清洗glow discharge cleaning: Q/uwQo/
2-3物理气相沉积PVD physical vapor deposition: vX0f,y
2-4化学气相沉积CVD chemical vapor deposition: J]lrS
2-5磁控溅射magnetron sputtering: jp8@vdRg
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: m7a#qs;,
2-7空心阴极离子镀HCD hollow cathode discharge deposition: )c n+1R
2-8电弧离子镀arc discharge deposition: KqBk~-G
3~ S'LxV
3.专用部件 y&}E~5O
3-1镀膜室coating chamber:
{vUN+We
3-2蒸发器装置evaporator device: u0aJu
3-3蒸发器evaporator: [[PEa-992
3-4直接加热式蒸发器evaporator by direct heat: (~CLn;'
3-5间接加热式蒸发器evaporator by indirect heat: $3`>{3x$
3-7溅射装置sputtering device: S#)Eom?V
3-8靶target: L^2FQti>
3-10时控挡板timing shutter: wW>zgTG
3-11掩膜mask: mMsTyM-f
3-12基片支架substrate holder: Bjk]ZU0T
3-13夹紧装置clamp: jK \T|vGJa
3-14换向装置reversing device: kB?al#`
3-15基片加热装置substrate heating device: w0w G-R ?
3-16基片冷却装置substrate colding device: Ox#\M0Wn$3
6"Bic rY
4.真空镀膜设备 3)-/`iy#
4-1真空镀膜设备vacuum coating plant: 7VcmVq}X
(1).真空蒸发镀膜设备vacuum evaporation coating plant:
;};wq&b#
(2).真空溅射镀膜设备vacuum sputtering coating plant: l @^3Exwt
4-2连续镀膜设备continuous coating plant: }|PY!O
4-3半连续镀膜设备semi- continuous coating plant 9Gv[8'I
6. 1.漏孔 @d Jr/6Yx
1-1漏孔leaks: :Y9NLbv
1-2通道漏孔channel leak: qM#R0ZUIe\
1-3薄膜漏孔membrane leak: j'9"cE5_
1-4分子漏孔molecular leak: b
Q]/?cCYV
1-5粘滞漏孔vixcous leak: K>*a*[t0Sy
1-6校准漏孔calibrated leak: ylt`*|$
1-7标准漏孔reference leak : 0a-:<zm
1-8虚漏virtual leak: :_!8
WB
1-9漏率leak rate: FQ
g~l4WX
1-10标准空气漏率standard air leak rate: 8_T6_jL<
1-11等值标准空气漏率equivalent standard air leak rate: v) vkn/:
1-12探索(示漏)气体: 7S?4XyU/o
A&nU]R8S
2.本底 zZVfj:i8
2-1本底background: @V03a
)6,h
2-2探索气体本底search gas background : J_s>N
2-3漂移drift: v\p;SwI
2-4噪声noise: e{m2l2Tx:
v4C{<8:X
3.检漏仪 @)Ofi j
3-1检漏仪leak detector: um9_ru~
3-2高频火花检漏仪H.F. spark leak detector: bV ZMW/w
3-3卤素检漏仪halide leak detector: ]Dw]p!@
3-4氦质谱检漏仪helium mass spectrometer leak detector: rETRTp0HT
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: Iu$K i
4~B>
9<$e>
4.检漏 Mn)@{^
4-1气泡检漏leak detection by bubbles: ~%YBI9$+
4-2氨检漏leak detection by ammonia: OE}*2P/M>
4-3升压检漏leak detection of rise pressure: wE~V]bmtW
4-4放射性同位素检漏radioactive isotope leak detection: cReB~wk
4-5荧光检漏fluorescence leak detection CiB%B`,N
7. 1.一般术语 HuOIFv
1-1真空干燥vacuum drying: 8MSC.0
1-2冷冻干燥freeze drying : $m42:a mM
1-3物料material: D9z|VIw8
1-4待干燥物料material to be dried: H,b5C_D29
1-5干燥物料dried material : hZ.Z3`v70
1-6湿气moisture;humidity: {)-aSywe
1-7自由湿气free moisture: )I3NeKWz
1-8结合湿气bound moisture: fMOU$0]$<
1-9分湿气partial moisture: eut-U/3: #
1-10含湿量moisture content: V{JAB]?^
1-11初始含湿量initial moisture content: #-bA[eQV
1-12最终含湿量final residual moisture: q5?# 3 T=
1-13湿度degree of moisture ,degree of humidity : gvLf|+m
1-14干燥物质dry matter : 7D<#(CE{
1-15干燥物质含量content of dry matter: 2 $Tj84'X
92EWIHEWZ
2.干燥工艺 Y 'ow
2-1干燥阶段stages of drying : |`cKD >
(1).预干燥preliminary dry: l,kUhZ@W
(2).一次干燥(广义)primary drying(in general): 0(S"{Ov
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): 1PpyV f
(4).二次干燥secondary drying: ,G2TVjz
2-2.(1).接触干燥contact drying: M8tRjNWS?
(2).辐射干燥 drying by radiation : bFW =ylF9
(3).微波干燥microwave drying: $C `;fA
(4).气相干燥vapor phase drying: %@u;5qD&
(5).静态干燥static drying: 8?%-'z.
(6).动态干燥dynamic drying: QDu 2?EYZq
2-3干燥时间drying time: d!$Z(W0
2-4停留时间length of stay(in the drying chamber): UXdUO@
2-5循环时间cycle time: Ry'= ke
2-6干燥率 dessication ratio : #W|'1
OX4
2-7去湿速率mass flow rate of humidity: .,OVzW
2-8单位面积去湿速率mass flow rate of humidity per surface area: [<6S%s
2-9干燥速度 drying speed : Z-l=\ekJ
2-10干燥过程drying process: f`[R7Q5
2-11加热温度heating temperature: ;dJ1
2-12干燥温度temperature of the material being dried : 1~PV[2a
2-13干燥损失loss of material during the drying process : :AE&Ny4
2-14飞尘lift off (particles): (JM5`XwM
2-15堆层厚度thickness of the material: |6$p;Aar
9pX&ZjYP-
3.冷冻干燥 AT%u%cE-
3-1冷冻freezing: w'UVKpG+
(1).静态冷冻static freezing: >M`CVUf
(2).动态冷冻dynamic freezing: *"{lMZ+
(3).离心冷冻centrifugal freezing: `I3r3WyA
(4).滚动冷冻shell freezing: W' s
(5).旋转冷冻spin-freezing: F~P%AjAx'
(6).真空旋转冷冻vacuum spin-freezing: * cgI.+
(7).喷雾冷冻spray freezing: wbst8*$
(8).气流冷冻air blast freezing: (,8$V\
3-2冷冻速率rate of freezing: %;rHrDP(>
3-3冷冻物料frozen material: F 9@h|#an
3-4冰核ice core: u4/kR
3-5干燥物料外壳envelope of dried matter: $GTU$4u
3-6升华表面sublimation front: D`$hPYK|_
3-7融化位置freezer burn: ;9c<K
apu4DAy&8
4.真空干燥设备;真空冷冻干燥设备 sL\L"rQN6
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: BYMi6wts
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: cj1cZ-
4-3加热表面heating surface: |%'
nVxc4r
4-4物品装载面shelf : 6Q${U7%7
4-5干燥器的处理能力throughput (of the vacuum drying chamber): ~W{2Jd
4-6单位面积干燥器处理能力throughput per shelf area: |563D#?cR
4-7冰冷凝器ice condenser: ;oy-#p>N%
4-8冰冷凝器的负载load of the ice condenser: L{8xlx`
4-9冰冷凝器的额定负载rated load of the ice condenser 28UU60
8. 1.一般术语 BBtzs^C|
1-1试样sample : <=>=.kmGt
(1).表面层surface layer: G{6;>8h
(2).真实表面true surface: <psZQdH
(3).有效表面积effective surface area: 6x%h6<#xh*
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: ZR(x%ews
(5).表面粒子密度surface particle density: Bq$rf < W
(6).单分子层monolayer: SN1}xR$
(7).表面单分子层粒子密度monolayer density: 1q,{0s_kp
(8).覆盖系数coverage ratio: [D<1CF
1-2激发excitation: /\4'ddGU
(1).一次粒子primary particle: jbS\vyG
(2).一次粒子通量primary particle flux: *tK\R&4,4s
(3).一次粒子通量密度density of primary particle flux: ;{U@qQD7
(4).一次粒子负荷primary particle load: d2H|LMhJ
(5).一次粒子积分负荷integral load of primary particle: 2(#7[mgPI
(6).一次粒子的入射能量energy of the incident primary particle: %3ICI
(7).激发体积excited volume: -De9_0#R
(8).激发面积excited area: UOxkO
(9).激发深度excited death: ''0fF_P
(10).二次粒子secondary particles: u[DfzH
(11).二次粒子通量secondary particle flux: '*"vkgN
(12).二次粒子发射能energy of the emitted secondary particles: a- |*?{o
(13).发射体积emitting volume: 4X+ifZO
(14).发射面积emitting area: ):b$xNn
(15).发射深度emitting depth: }x07^4$j
(16).信息深度information depth: V0P>YQq9s
(17).平均信息深度mean information depth: M!REygyx
1-3入射角angle of incidence: Cd>WUw
1-4发射角angle of emission: 2AO~HxF
1-5观测角observation: Vnr[}<L
1-6分析表面积analyzed surface area: %)0*&a 4
1-7产额 yield : )'6DNa[y
1-8表面层微小损伤分析minimum damage surface analysis: id2j7|$,
1-9表面层无损伤分析non-destructive surface analysis: [YUv7|\
1-10断面深度分析 profile analysis in depth; depth profile analysis : p IU&^yX>
1-11可观测面积observable area: U qFv}VsnF
1-12可观测立体角observable solid angle : /Z@tv.f
1-13接受立体角;观测立体角angle of acceptance: 4Za7^c.
1-14角分辨能力angular resolving power: 5*,f
Fib
1-15发光度luminosity: ;;:-l99
1-16二次粒子探测比detection ratio of secondary particles: ~;#Y9>7\\'
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: +i@y@<l:+
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: T<55a6NoK
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: U8LtG/
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: P dhEQ}H
1-21本底压力base pressure: K"4>DaK2P
1-22工作压力working pressure: wv\w;'
'<ZlGFt'n
2.分析方法 .U?'i<
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: h3z{(-~y
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : gT#&"aP5S
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: w[IE
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: >76\nGO
2-3离子散射表面分析ion scattering spectroscopy: 4:dH]
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: `O[};3O&
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: "hzB9*"t
2-6离子散射谱仪ion scattering spectrometer: XbD4:i%
2-7俄歇效应Auger process: O4^8jK}
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: 7:)n$,31FW
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: 8p@Piy{p
2-10光电子谱术photoelectron spectroscopy : p%*%n3bw
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: r0 ,:J
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: pJt,9e6
2-11光电子谱仪photoelectron spectrometer: n=c
2Kc
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: q(.:9A*0
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: "F.;Dv9V[0
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): Z`KC%!8K
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus