“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 ]PdpC"
--------------------------------------------------- i[FcY2
真空术语 oH~ZqX.3
TnET1$@qr*
1.标准环境条件 standard ambient condition: y@g{:/cmO
2.气体的标准状态 standard reference conditions forgases: rXo2MX@u
3.压力(压强)p pressure: X'N4a
4.帕斯卡Pa pascal: !v\m%t|.
5.托Torr torr: wqo2iRql
6.标准大气压atm standard atmosphere: N>i1TM2
7.毫巴mbar millibar: #|^7{TN
8.分压力 partial pressure: -F,o@5W>Y
9.全压力 total pressure: @ [_I|
10.真空 vacuum: WH :+HNl1d
11.真空度 degree of vacuum: p-V#nPb
12.真空区域 ranges of vacuum: #r 1
$=GY
13.气体 gas: :4$Ex2
14.非可凝气体 non-condensable gas: b!hxx Z
15.蒸汽vapor: &rj6<b1A
16.饱和蒸汽压saturation vapor pressure: s%]-Sw9
17.饱和度degree of saturation: e1{t qNJ
18.饱和蒸汽saturated vapor: >K#Z]k
19.未饱和蒸汽unsaturated vapor: [ANit0-~
20.分子数密度n,m-3 number density of molecules: 77/y{#Sk
21.平均自由程ι、λ,m mean free path: yAEOn/.~
22.碰撞率ψ collision rate: `9Ngax=_
23.体积碰撞率χ volume collision rate: RhyI\(Z2q
24.气体量G quantity of gas: 6, ag\
25.气体的扩散 diffusion of gas: tjk Y[
26.扩散系数D diffusion coefficient; diffusivity: Mr:*l`b_
27.粘滞流 viscous flow: |w[}\#2
28.粘滞系数η viscous factor: Zx25H"5j
29.泊肖叶流 poiseuille flow: $V?zJ:a>L
30.中间流 intermediate flow: hXS'*vO"
31.分子流 molecular flow: 'xZxX3
32克努曾数 number of knudsen: Bt,qG1>$-
33.分子泻流 molecular effusion; effusive flow: [$3Zid
34.流逸 transpiration: If6wkY6sR
35.热流逸 thermal transpiration: c}vy9m$B_
36.分子流率qN molecular flow rate; molecular flux: 5WP[-J)
37.分子流率密度 molecular flow rate density; density of molecular flux: 'N=' B<^;%
38.质量流率qm mass flow rare: 6 6x} |7
39.流量qG throughput of gas: 4M(w<f\5F
40.体积流率qV volume flow rate: P,h@F+OZN
41.摩尔流率qυ molar flow rate: 3]'=s>UO>^
42.麦克斯韦速度分布 maxwellian velocity distribution: f&`v-kiAn=
43.传输几率Pc transmission probability: {114
[
44.分子流导CN,UN molecular conductance: m'k`p5[=h
45.流导C,U conductance: Tv3 ZNh
46.固有流导Ci,Ui intrinsic conductance: doc5;?6
47.流阻W resistance: "r cPJX
48.吸附 sorption: 9b]*R.x:$&
49.表面吸附 adsorption: g^)> -$=
50.物理吸附physisorption: X_s;j5ur
51.化学吸附 chemisorption: F)e*w:D
52.吸收absorption: sLbz@5 4
53.适应系数α accommodation factor: ABhza|
54.入射率υ impingement rate: f;u;hQxs
55.凝结率condensation rate: WbH/K]/1)h
56.粘着率 sticking rate: %n}fkj'
57.粘着几率Ps sticking probability: z('93vsO
58.滞留时间τ residence time: &%u,b~cL?
59.迁移 migration: c}Z,xop<P{
60.解吸 desorption: 1I3u~J3]/
61.去气 degassing: yF0,}
62.放气 outgassing: JPQ02&e
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate:
4EB$e?
64.蒸发率 evaporation rate: w0/W=!_
65.渗透 permeation: ]CC~Eo-%-
66.渗透率φ permeability: |&n dQ(!l
67.渗透系数P permeability coefficient w#PaN83+
2. 1.真空泵 vacuum pumps 7M;Y#=sR
1-1.容积真空泵 positive displacement pump: -<z'f){gb
⑴.气镇真空泵 gas ballast vacuum pump: vp mSzh
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: ,eUMSg~P.7
⑶.干封真空泵 dry-sealed vacuum pump: NBMY1Xgj
⑷.往复真空泵 piston vacuum pump: $<s@S;Ri
⑸.液环真空泵 liquid ring vacuum pump: <S$y=>.9
⑹.旋片真空泵 sliding vane rotary vacuum pump: [9(B;;R@
⑺.定片真空泵 rotary piston vacuum pump: NlcWnSv
⑻.滑阀真空泵 rotary plunger vacuum pump: '2[ _U&e
⑼.余摆线真空泵 trochoidal vacuum pump: 't)j
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: /4~RlXf@
⑾.罗茨真空泵 roots vacuum pump: #i2q}/w5`C
1-2.动量传输泵 kinetic vacuum pump: vMRKs#&8
⑴.牵引分子泵molecular drag pump: (OG@]|-
⑵.涡轮分子泵turbo molecular pump: 3&' STPpW
⑶.喷射真空泵ejector vacuum pump:
iI
^{OD
⑷.液体喷射真空泵liquid jet vacuum pump: ;4qalxzu
⑸.气体喷射真空泵gas jet vacuum pump: tQFFt,)
⑹.蒸汽喷射真空泵vapor jet vacuum pump : Ci*TX
⑺.扩散泵diffusion pump : sL/Lw
WH
⑻.自净化扩散泵self purifying diffusion pump: n<hwstk
⑼.分馏扩散泵 fractionating diffusion pump : nAts.pVy"
⑽.扩散喷射泵diffusion ejector pump : _R-#I
⑾.离子传输泵ion transfer pump: 0]HK(,/h
1-3.捕集真空泵 entrapment vacuum pump: T3?kabbF
⑴吸附泵adsorption pump: N@d4)
⑵.吸气剂泵 getter pump: i-ogeR?
⑶.升华(蒸发)泵 sublimation (evaporation)pump : >LLz G
⑷.吸气剂离子泵getter ion pump: [e^i".
⑸.蒸发离子泵 evaporation ion pump:
@ics
⑹.溅射离子泵sputter ion pump: P2s0H+<
⑺.低温泵cryopump: uPo>?hpq+
+M.|D,wg2
2.真空泵零部件 dO8Z {wfs
2-1.泵壳 pump case: &Y#9~$V=
2-2.入口 inlet: 'Gt`3qG
2-3.出口outlet: V&}Z# 9Dx
2-4.旋片(滑片、滑阀)vane; blade :
E;|\?>
2-5.排气阀discharge valve: EhVnt#`Si
2-6.气镇阀gas ballast valve: WYzY#-j
2-7.膨胀室expansion chamber: %vThbP#mR|
2-8.压缩室compression chamber: #{?oUg>$
2-9.真空泵油 vacuum pump oil: GYs4#40
2-10.泵液 pump fluid: kU^@R<Fo
2-11.喷嘴 nozzle: 0y ;gi3W
2-13.喷嘴扩张率nozzle expansion rate: {MEU|9@
Y
2-14.喷嘴间隙面积 nozzle clearance area : >qgBu_
2-15.喷嘴间隙nozzle clearance: :-
5Mn3*
2-16.射流jet: Wex4>J<`/
2-17.扩散器diffuser: x
p$0J<2
2-18.扩散器喉部diffuser thoat: "yz@LV1
2-19.蒸汽导管vapor tube(pipe;chimney): r-0
7!A
2-20.喷嘴组件nozzle assembly: 4{Ak|
2-21.下裙skirt: %FRkvqV*
AP~!YwLW
3.附件 Pb`sn5;
3-1阱trap: "bO]
⑴.冷阱 cold trap: e,4G:V'NX
⑵.吸附阱sorption trap: gI%n(eY
⑶.离子阱ion trap: D"WkD j"M
⑷.冷冻升华阱 cryosublimation trap: Bl1I "B
3-2.挡板baffle: %B?5l^W@
3-3.油分离器oil separator: qqAsh]Z
3-4.油净化器oil purifier: J+4uUf/d!
3-5.冷凝器condenser: lGz0K5P{
@Uu\x~3y
4.泵按工作分类 E:tUbWVp
4-1.主泵main pump: N1-LM9S
4-2.粗抽泵roughing vacuum pump: j)0R*_-B[
4-3.前级真空泵backing vacuum pump: ?t"PawBWE
4-4.粗(低)真空泵 roughing(low)vacuum pump: bpILiC
4-5.维持真空泵holding vacuum pump: 7/yd@#$X
4-6.高真空泵high vacuum pump: ;|%r!!#-t
4-7.超高真空泵ultra-high vacuum pump: Qp54(`
4-8.增压真空泵booster vacuum pump: {!S/8o"]
O*PHo_&G
5.真空泵特性 .`p_vS9
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: =1(BKk>
5-2.真空泵的抽气量Q throughput of vacuum pump:。 ][mc^eI0s|
5-3.起动压力starting pressure: f:SF&t*
5-4.前级压力 backing pressure : S.jjB
5-5.临界前级压力 critical backing pressure: ;0*^9 8K
5-6.最大前级压力maximum backing pressure: ; n@C(hG
5-7.最大工作压力maximum working pressure: aVb]H0
5-8.真空泵的极限压力ultimate pressure of a pump: 2uTa}{/%
5-9.压缩比compression ratio: 3{z|301<m
5-10.何氏系数Ho coefficient: ?uN(" I
5-11.抽速系数speed factor: w;(gi
5-12.气体的反扩散back-diffusion of gas: :&%;s*-9
5-13.泵液返流back-streaming of pump fluid: 9|`@czw
5-14.返流率back-streaming rate yM2&cMHH~
5-15.返迁移back-migration: ChGM7uu2
5-16.爆腾bumping: m [g}vwS
5-17.水蒸气允许量qm water vapor tolerable load: THp `!l
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: |gz,Ip{
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: X
A|`wAGP
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump yDC97#%3u
3. 1.一般术语 1sjn_fPz
1-1.压力计pressure gauge: #V6
-*
1-2.真空计vacuum gauge: B,>Fh X>h
⑴.规头(规管)gauge head: <&2,G5XA
⑵.裸规nude gauge : pYG,5+g
⑶.真空计控制单元gauge control unit : :c t+.#
⑷.真空计指示单元gauge indicating unit : DE ws+y-*
[//f BO
2.真空计一般分类 A&F4;>dms
2-1.压差式真空计differential vacuum gauge: pxx(BE
2-2.绝对真空计 absolute vacuum gauge: l'T0<
2-3.全压真空计total pressure vacuum gauge: 81cmG`G7
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: M<unQ1+wh
2-5.相对真空计relative vacuum gauge : G{.+D2
7
L\?
3.真空计特性 6hK"k
3-1.真空计测量范围pressure range of vacuum gauge: gpWS_Dw9
3-2.灵敏度系数sensitivity coefficient: @E2nF|N
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): %b;+/s2W
3-5.规管光电流photon current of vacuum gauge head: =fG8YZ(
3-6.等效氮压力equivalent nitrogen pressure : LDeVNVM
3-7.X射线极限值 X-ray limit: E+zn\v
3-8.逆X射线效应anti X-ray effect: .M2&ad :
3-9.布利尔斯效应blears effect: SZ{cno1`
GuWBl$|+b
4.全压真空计 XB-|gPk
4-1.液位压力计liquid level manometer: E{s|#
4-2.弹性元件真空计elastic element vacuum gauge: QtQ^"d65
4-3.压缩式真空计compression gauge: =bWq 3aP)P
4-4.压力天平pressure balance: QJWES%m`
4-5.粘滞性真空计viscosity gauge : |:+pPh!-
4-6.热传导真空计thermal conductivity vacuum gauge : o$VH,2 QF
4-7.热分子真空计thermo-molecular gauge: 3gy;$}Lq T
4-8.电离真空计ionization vacuum gauge: *^6xt7
4-9.放射性电离真空计radioactive ionization gauge: +c`C9RXk
4-10.冷阴极电离真空计cold cathode ionization gauge: "NH+qQhs
4-11.潘宁真空计penning gauge: [!?,TGM}^
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: [9om"'
4-13.放电管指示器discharge tube indicator: ZHlin#"
4-14.热阴极电离真空计hot cathode ionization gauge: Z(mn
U;9{v
4-15.三极管式真空计triode gauge: .oj" ru
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: KHz838C]
4-17.B-A型电离真空计Bayard-Alpert gauge: g/Jj]X#r
4-18.调制型电离真空计modulator gauge: #0^3Wm`X;
4-19.抑制型电离真空计suppressor gauge: }#*zjMOz
4-20.分离型电离真空计extractor gauge: }#>d2 =T$
4-21.弯注型电离真空计bent beam gauge: hX| UE
4-22.弹道型电离真空计 orbitron gauge : ( L\G!pP.
4-23.热阴极磁控管真空计hot cathode magnetron gauge: BON""yIC
F>kn:I"X)
5.分压真空计(分压分析器) \w[ZY$/
5-1.射频质谱仪radio frequency mass spectrometer: H0 n@kKr
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: 8sF0]J[g{
5-3.单极质谱仪momopole mass spectrometer: b%f2"e0g
5-4.双聚焦质谱仪double focusing mass spectrometer: '3UIriY6
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: gc7:Rb^E5t
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: GnrW{o
5-7.回旋质谱仪omegatron mass spectrometer: u|>U`[Zpj
5-8.飞行时间质谱仪time of flight mass spectrometer: ;
9&.QR(
{R!TUQ5
6.真空计校准 *Gh8nQbh
6-1.标准真空计reference gauges: A;j$rGx
6-2.校准系统system of calibration: #u5;utY:F
6-3.校准系数K calibration coefficient: W<N QUf[=
6-4.压缩计法meleod gauge method: pD_eo6xX
6-5.膨胀法expansion method: r]EZ)qp^@
6-6.流导法flow method: 1\J1yOL
4. 1.真空系统vacuum system `)!2E6 =
1-1.真空机组pump system: r]//Q6|S
1-2.有油真空机组pump system used oil : C+]q
1-3.无油真空机组oil free pump system 7U
)qC}(
1-4.连续处理真空设备continuous treatment vacuum plant: LOUKURe E
1-5.闸门式真空系统vacuum system with an air-lock: .'{6u;8
1-6.压差真空系统differentially pumped vacuum system: >`?+FDOJ,
1-7.进气系统gas admittance system: vua1iN1
p C2c(4
2.真空系统特性参量 ;7^j-6
2-1.抽气装置的抽速volume flow rate of a pumping unit : m>-^K
2-2.抽气装置的抽气量throughput of a pumping unit : ^AjYe<RU}
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: (=tF2YBV
2-4.真空系统的漏气速率leak throughput of a vacuum system: L5qCv -{
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: :f
!=_^}
2-6.极限压力ultimate pressure: z0Z\d
2-7.残余压力residual pressure: Iam-'S5
2-8.残余气体谱residual gas spectrum: ;0Ct\ [eh
2-9.基础压力base pressure: 9s6>9hMb)
2-10.工作压力working pressure: n.Eoi4jV'
2-11.粗抽时间roughing time: O$umu_
2-12.抽气时间pump-down time: #
/,2MQ
2-13.真空系统时间常数time constant of a vacuum system: "tz0ko,(
2-14.真空系统进气时间venting time: a.`JS
-G<2R"Q#N
3.真空容器 sHPwW5j/o'
3-1.真空容器;真空室vacuum chamber: cM<hG:4%wX
3-2.封离真空装置sealed vacuum device: iI@Gyq=
3-3.真空钟罩vacuum bell jar: -2jBs-z
3-4.真空容器底板vacuum base plate: Zc\h15+P
3-5.真空岐管vacuum manifold: 7~l
3-6.前级真空容器(贮气罐)backing reservoir: X6N]gD
3-7.真空保护层outer chamber: $L&9x3+?Kg
3-8.真空闸室vacuum air lock: xX&>5 "
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: E%2!C/+B
q%kj[ZOY$]
4.真空封接和真空引入线 i h$@:^\
4-1.永久性真空封接permanent seal : :
`6$/DK
4.2.玻璃分级过渡封接graded seal :
Eagmafu
4-3.压缩玻璃金属封接compression glass-to-metal seal: tp0!,ne*
4-4.匹配式玻璃金属封接matched glass-to-metal seal: <;,S"e
4-5.陶瓷金属封接ceramic-to-metal seal: N} x/&e
4-6.半永久性真空封接semi-permanent seal : K'{W9~9Lq
4-7.可拆卸的真空封接demountable joint: Ubw!/|mi
4-8.液体真空封接liquid seal "U5Ln2X{J
4-9.熔融金属真空封接molten metal seal: [>M*_1F
4-10.研磨面搭接封接ground and lapped seal: c]aK
N
4-11.真空法兰连接vacuum flange connection: z^a!C#IX
4-12.真空密封垫vacuum-tight gasket: fBWJ%W
4-13.真空密封圈ring gasket:
u5{5ts+:
4-14.真空平密封垫flat gasket: #-gGsj;F
4-15.真空引入线feedthrough leadthrough: %M;_(jda
4-16.真空轴密封shaft seal: v1"g!%U6
4-17.真空窗vacuum window: ) (?UA$"
4-18.观察窗viewing window: 32bkouq
v-7Rb)EP
5.真空阀门 UU;-q_H6
5-1.真空阀门的特性characteristic of vacuum valves: gGI#QPT`X
⑴.真空阀门的流导conductance of vacuum valves: ]2xx+P#Y
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: L`HH);Ozw
5-2.真空调节阀regulating valve: ZXsY-5$#d-
5-3.微调阀 micro-adjustable valve: XEUa
5-4.充气阀charge valve: mSw?2ba
5-5.进气阀gas admittance valve: RP|>&I
5-6.真空截止阀break valve: 9HJ'p:{)
5-7.前级真空阀backing valve: g@k#J"Q'[
5-8.旁通阀 by-pass valve: 4*D fI
5-9.主真空阀main vacuum valve: m_E[bDON
5-10.低真空阀low vacuum valve: 6L:trLuQ
5-11.高真空阀high vacuum valve: :uIi
?
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: L&DF,fWsF&
5-13.手动阀manually operated valve: fZw9zqg
5-14.气动阀pneumatically operated valve: 94p:| 5@
5-15.电磁阀electromagnetically operated valve: L)R[)$2(g
5-16.电动阀valve with electrically motorized operation: +C'TW^
5-17.挡板阀baffle valve: 9Ew:.&d
5-18.翻板阀flap valve: 22al
5-19.插板阀gate valve:
/.| A
5-20.蝶阀butterfly valve: [B"dH-r7
OZ>)sL
6.真空管路 y;{^Ln4{
6-1.粗抽管路roughing line: U=&^H!LVY
6-2.前级真空管路backing line: l?o-!M{
6-3.旁通管路;By-Pass管路 by-pass line: T]Tdx.B
6-4.抽气封口接头pumping stem: ==h|+NFa
6-5.真空限流件limiting conductance: /slm
]'
6-6.过滤器filter: #90[PASx
5. 1.一般术语 *%OYAsc
1-1真空镀膜vacuum coating: O2`oe4."vd
1-2基片substrate: jSwtf
1-3试验基片testing substrate: &*G5J7%w
1-4镀膜材料coating material: xb+RRTgj
1-5蒸发材料evaporation material: `x{.z=xC
1-6溅射材料sputtering material: (b/A|hl
1-7膜层材料(膜层材质)film material: wQD0vsD
1-8蒸发速率evaporation rate: Yo~LckFF
1-9溅射速率sputtering rate: rP^TN^bd|
1-10沉积速率deposition rate: G%P>Ag
1-11镀膜角度coating angle: VxkCK02k
(B_7\}v|_
2.工艺 QQg8+{>
2-1真空蒸膜vacuum evaporation coating: BR& Aq
(1).同时蒸发simultaneous evaporation: kCaO\#ta
(2).蒸发场蒸发evaporation field evaporation: vU_d=T%$
(3).反应性真空蒸发reactive vacuum evaporation: v"P&`1=T
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: .>mH]/]m
(5).直接加热的蒸发direct heating evaporation:
JmU<y
(6).感应加热蒸发induced heating evaporation: e/"yGQu
(7).电子束蒸发electron beam evaporation: >lD;0EN
(8).激光束蒸发laser beam evaporation: ||-nmOy
(9).间接加热的蒸发indirect heating evaporation: z-EwXE
(10).闪蒸flash evaportion: csH2_+uG
2-2真空溅射vacuum sputtering: }xAie(
(1).反应性真空溅射 reactive vacuum sputtering: 0bMoUy*q
(2).偏压溅射bias sputtering: q"gqO%Wb|
(3).直流二级溅射direct current diode sputtering: ?z2jk
(4).非对称性交流溅射asymmtric alternate current sputtering: U@Z>/ q
(5).高频二极溅射high frequency diode sputtering: NFk}3w:
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: ?PBa'g
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: >5)<Uv$
(8).离子束溅射ion beam sputtering: #O2wyG)oU
(9).辉光放电清洗glow discharge cleaning: +hE',i.
2-3物理气相沉积PVD physical vapor deposition: j$3rJA%rN
2-4化学气相沉积CVD chemical vapor deposition: ,Bisu:v6FW
2-5磁控溅射magnetron sputtering: @Ii-NmOr
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: 21r==
H$
2-7空心阴极离子镀HCD hollow cathode discharge deposition: j|:dYt`WM
2-8电弧离子镀arc discharge deposition: 4p.^'2m
'
|&>/dyq
3.专用部件 :.*HQt9N
3-1镀膜室coating chamber: `NBbTQtgO
3-2蒸发器装置evaporator device: K&=D-50%
3-3蒸发器evaporator: >\V6+$cNp
3-4直接加热式蒸发器evaporator by direct heat: \|CPR6I
3-5间接加热式蒸发器evaporator by indirect heat: DH
6q7"@
3-7溅射装置sputtering device: y|$R`P
3-8靶target: 0,HqE='w
3-10时控挡板timing shutter: 7ftR4
3-11掩膜mask: Pm4e8b
3-12基片支架substrate holder: 1N8;)HLIBJ
3-13夹紧装置clamp: n.*3,4.]
3-14换向装置reversing device: LO)GTyzvJ
3-15基片加热装置substrate heating device: vxZg &SRK
3-16基片冷却装置substrate colding device: $@_{p*q
R {HV]o|qk
4.真空镀膜设备 RctU' T
4-1真空镀膜设备vacuum coating plant: o]Gguw5W{
(1).真空蒸发镀膜设备vacuum evaporation coating plant: 5iVQc -m&
(2).真空溅射镀膜设备vacuum sputtering coating plant: l^\(ss0~
4-2连续镀膜设备continuous coating plant: oL]mjo=jN
4-3半连续镀膜设备semi- continuous coating plant i3#'*7f%j
6. 1.漏孔 Y9F)`17
1-1漏孔leaks: (S`6Q
1-2通道漏孔channel leak: ?WQNIX4
1-3薄膜漏孔membrane leak: !xu9+{-
1-4分子漏孔molecular leak: *ZaaO^!
1-5粘滞漏孔vixcous leak: 2-~|Z=eGW
1-6校准漏孔calibrated leak: [)^mBVht
1-7标准漏孔reference leak : ]4`t\YaT
1-8虚漏virtual leak: yGxv?%%2
1-9漏率leak rate: Ojq]HM6f
1-10标准空气漏率standard air leak rate: ?~J i-{#X
1-11等值标准空气漏率equivalent standard air leak rate: 69-:]7.g
1-12探索(示漏)气体: N2BI_,hI1
k;k}qq`d
2.本底 ?]c+j1i
2-1本底background: FZF @
2-2探索气体本底search gas background : W^es;5
2-3漂移drift: r`jWp\z
2-4噪声noise: !;S"&mcPDJ
5Fmav5
3.检漏仪 )tS-.P rA-
3-1检漏仪leak detector: kbYeV_OwM
3-2高频火花检漏仪H.F. spark leak detector: iib
3-3卤素检漏仪halide leak detector: P ZxFZvE
3-4氦质谱检漏仪helium mass spectrometer leak detector:
W^Y#pn
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: LH2PTW\b!6
sYqgXE.
4.检漏 i0:>Nk
4-1气泡检漏leak detection by bubbles: Dw_D+7>(v
4-2氨检漏leak detection by ammonia: ye%iDdf
4-3升压检漏leak detection of rise pressure: DIaYo4
4-4放射性同位素检漏radioactive isotope leak detection: 2#vv$YD
4-5荧光检漏fluorescence leak detection TJ(K3/)Z
7. 1.一般术语 Ya#h'+}
1-1真空干燥vacuum drying: S|em[D[Y^
1-2冷冻干燥freeze drying : rkB'Hf
1-3物料material: =Q<L
eh=G
1-4待干燥物料material to be dried: Y
ya`&V
1-5干燥物料dried material : Ub_4yN;
1-6湿气moisture;humidity: QJn`WSw$_-
1-7自由湿气free moisture: xyA-P& N
1-8结合湿气bound moisture: ibpzeuUl
1-9分湿气partial moisture: :K':P5i
1-10含湿量moisture content: o31Nmy
Ni
1-11初始含湿量initial moisture content: RO&H5m r%@
1-12最终含湿量final residual moisture: nwA8ALhE
1-13湿度degree of moisture ,degree of humidity : 2-'Opu
1-14干燥物质dry matter : CSTI?A"P
1-15干燥物质含量content of dry matter: At6qtoPRA
wW 2d\Zd&
2.干燥工艺 *|% ^0#$c
2-1干燥阶段stages of drying : ua5?(,E`']
(1).预干燥preliminary dry:
?wb+L
(2).一次干燥(广义)primary drying(in general): rJJ[X4$
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): J=W0Xi!
(4).二次干燥secondary drying: 71fk.16
2-2.(1).接触干燥contact drying: W_`A"WdT.
(2).辐射干燥 drying by radiation : ]y@F8$D!
(3).微波干燥microwave drying: 5fJ[}~
(4).气相干燥vapor phase drying: \4d.sy0&>-
(5).静态干燥static drying: C&~1M}I
(6).动态干燥dynamic drying: Ju2l?RrX
2-3干燥时间drying time: \HZ9S=
2-4停留时间length of stay(in the drying chamber): 6KZf%)$
2-5循环时间cycle time: /9pM>Cd*Z
2-6干燥率 dessication ratio : B,WTHU[AV
2-7去湿速率mass flow rate of humidity: N587(wZ
2-8单位面积去湿速率mass flow rate of humidity per surface area: _>m-AI4^
2-9干燥速度 drying speed : Bux [6O%
2-10干燥过程drying process: V 9wI\0
2-11加热温度heating temperature: .w?(NZ2~
2-12干燥温度temperature of the material being dried : E.`U`L
2-13干燥损失loss of material during the drying process : A{ eL l
2-14飞尘lift off (particles): o Y}]UB>
2-15堆层厚度thickness of the material: (ll*OVL
b5G}3)'w
3.冷冻干燥 :}:3i9e*2
3-1冷冻freezing: ;%C'FV e]
(1).静态冷冻static freezing: 'XrRhF
(
(2).动态冷冻dynamic freezing: }n_p$g[Nj/
(3).离心冷冻centrifugal freezing: [,RI-#n
(4).滚动冷冻shell freezing: d[ >`")2)
(5).旋转冷冻spin-freezing: #H?t!DU
(6).真空旋转冷冻vacuum spin-freezing: YgUH'P-
(7).喷雾冷冻spray freezing: B/JO~;{
(8).气流冷冻air blast freezing: 7dG79H
3-2冷冻速率rate of freezing: H5CR'Rp
3-3冷冻物料frozen material: WEg6Kz
3-4冰核ice core: "\W-f
3-5干燥物料外壳envelope of dried matter: LVJI_ O{fH
3-6升华表面sublimation front: `;|5
3-7融化位置freezer burn: O,bkQY$v
?3ig)J,e[
4.真空干燥设备;真空冷冻干燥设备 1"7Sy3
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: >(w2GD?
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: 4/ kv3rv
4-3加热表面heating surface: kE8>dmH23
4-4物品装载面shelf : s>k Uh
4-5干燥器的处理能力throughput (of the vacuum drying chamber): *[ #;j$m
4-6单位面积干燥器处理能力throughput per shelf area: 3f" %G\
4-7冰冷凝器ice condenser: PWRy7d
4-8冰冷凝器的负载load of the ice condenser: VErv;GyV
4-9冰冷凝器的额定负载rated load of the ice condenser (&|_quP7O
8. 1.一般术语 Jj~EiA
1-1试样sample : t^]$!H
(1).表面层surface layer: EN{]Qb06A
(2).真实表面true surface: 1g##sSa6
(3).有效表面积effective surface area: -K,-h[o
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: Jd\apBIf
(5).表面粒子密度surface particle density: |Fm6#1A@
(6).单分子层monolayer: \^( 0B8|w
(7).表面单分子层粒子密度monolayer density: M.-"U+#aD
(8).覆盖系数coverage ratio: }+o:j'jB
1-2激发excitation: IK,|5] *Ar
(1).一次粒子primary particle: k#8Ti"0
(2).一次粒子通量primary particle flux: )"zvwgaW
(3).一次粒子通量密度density of primary particle flux: /525w^'pd
(4).一次粒子负荷primary particle load: yR{x}DbG
(5).一次粒子积分负荷integral load of primary particle: -9RDr\&`(
(6).一次粒子的入射能量energy of the incident primary particle: v_e9}yI
(7).激发体积excited volume: l`kWz5[~
(8).激发面积excited area: kGpa\c
g1
(9).激发深度excited death: L9pvG(R%
(10).二次粒子secondary particles: l4n)#?Q?
(11).二次粒子通量secondary particle flux: qq)0yyL r
(12).二次粒子发射能energy of the emitted secondary particles: Qk!;M|
(13).发射体积emitting volume: y4h=Lki@
(14).发射面积emitting area: (~zd6C1.
(15).发射深度emitting depth: 'r(1Nj
(16).信息深度information depth: %r&-gWTQ,
(17).平均信息深度mean information depth: q$1PG+-
1-3入射角angle of incidence: {G <kA(Lm
1-4发射角angle of emission: i)#:qAtP*
1-5观测角observation: $^u}a
1-6分析表面积analyzed surface area: vR0];{
1-7产额 yield : 8Ll[ fJZA
1-8表面层微小损伤分析minimum damage surface analysis: pg]BsJN
1-9表面层无损伤分析non-destructive surface analysis: < >UPD02
1-10断面深度分析 profile analysis in depth; depth profile analysis : zF5uN:-s
1-11可观测面积observable area: $/6;9d^
1-12可观测立体角observable solid angle : QwhRNnE=
1-13接受立体角;观测立体角angle of acceptance: I^o!n5VM
1-14角分辨能力angular resolving power: ikE<=:pe
1-15发光度luminosity: Fnk_\d6Ma
1-16二次粒子探测比detection ratio of secondary particles: n| GaV
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: hhoEb(BA
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: XqM3<~$
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: @EE."T9
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: r`c_e)STO
1-21本底压力base pressure: 4&/j|9=X
1-22工作压力working pressure: AeAp0cbet
Z|RY2P>E
2.分析方法 g$.
\
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: =^
T\Xs;GK
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : FKe, qTqa
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: wP"dZagpj
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: ]kG(G%r|M
2-3离子散射表面分析ion scattering spectroscopy: bQ|V!mrN}
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: +cU>k}
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: s+:=I
e
2-6离子散射谱仪ion scattering spectrometer: S*AERm
2-7俄歇效应Auger process: "`6n6r42
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: AIA6yeaU
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: K'#E3={tt
2-10光电子谱术photoelectron spectroscopy : tGB@$UmfU
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: 9n}p;3{f
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: Xl74@wq
2-11光电子谱仪photoelectron spectrometer: []s^
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: >
xIJE2
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: nC{%quwh{
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): 0a"igq9t
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus