“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 qxx.f58H
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真空术语 kn.z8%^(
w[&BY
1.标准环境条件 standard ambient condition: jg(A_V
2.气体的标准状态 standard reference conditions forgases: *#_jTwQe
3.压力(压强)p pressure: 79DC]48M
4.帕斯卡Pa pascal: {PKER$C
5.托Torr torr: T5h[{J^
6.标准大气压atm standard atmosphere: b+>godTi_
7.毫巴mbar millibar: AdNsY/ Y(
8.分压力 partial pressure: 8TZe=sD~cr
9.全压力 total pressure: ^8iy(
10.真空 vacuum: K VCS(oN
11.真空度 degree of vacuum: gNeCnf#Xa
12.真空区域 ranges of vacuum: :?J$ +bm}
13.气体 gas: ~08v]j
q
14.非可凝气体 non-condensable gas: ilP&ctn6+c
15.蒸汽vapor: .z"[z^/uF
16.饱和蒸汽压saturation vapor pressure: ?0x;L/d])
17.饱和度degree of saturation: ]{hfM
18.饱和蒸汽saturated vapor: xjYFTb}!
19.未饱和蒸汽unsaturated vapor: ?m6E@.{
20.分子数密度n,m-3 number density of molecules: e+mD$(h
21.平均自由程ι、λ,m mean free path: 7o<RvM
22.碰撞率ψ collision rate: I(.XK ucU
23.体积碰撞率χ volume collision rate: P_gQ-pF.
24.气体量G quantity of gas: -]e@cevy
25.气体的扩散 diffusion of gas: &}r932
26.扩散系数D diffusion coefficient; diffusivity: y[cAU:P?
27.粘滞流 viscous flow: lQzrf"N'
28.粘滞系数η viscous factor: /[OMpP
29.泊肖叶流 poiseuille flow: *sTQ9 Kr
30.中间流 intermediate flow: s5.2gu|"%
31.分子流 molecular flow: T1E=<q4
32克努曾数 number of knudsen: }73H$ss:
33.分子泻流 molecular effusion; effusive flow: JF7T1T
34.流逸 transpiration: 8c9_=8vw
35.热流逸 thermal transpiration: Dz?F,g_
36.分子流率qN molecular flow rate; molecular flux: b+3pu\w`
37.分子流率密度 molecular flow rate density; density of molecular flux: 7j
Q`i;L}Y
38.质量流率qm mass flow rare: h5JXKR.1]c
39.流量qG throughput of gas: n;U|7it7
40.体积流率qV volume flow rate: 6=
41.摩尔流率qυ molar flow rate: o|+tRl
42.麦克斯韦速度分布 maxwellian velocity distribution: 7;XdTx
43.传输几率Pc transmission probability: D|xSO~M5
44.分子流导CN,UN molecular conductance: yVL~SH|
45.流导C,U conductance: AXyuXB
46.固有流导Ci,Ui intrinsic conductance: bke 1 F
'
47.流阻W resistance: 0ode&dB
48.吸附 sorption: d+(~{xK:
49.表面吸附 adsorption: (w.B_9#
50.物理吸附physisorption: B 5?(gb"
51.化学吸附 chemisorption: r~sGot+sQA
52.吸收absorption: #&2mu
53.适应系数α accommodation factor: */1z=
54.入射率υ impingement rate: 4l|Am3vzX
55.凝结率condensation rate: dL"v*3Fy
56.粘着率 sticking rate: 4avM:h
57.粘着几率Ps sticking probability: {E9Y)Z9
58.滞留时间τ residence time: /4|qfF3
59.迁移 migration: ,YoIn
60.解吸 desorption: i@2?5U>h
61.去气 degassing: a}wB7B;,g
62.放气 outgassing: 1G\ugLm
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: n8?gZ` W
64.蒸发率 evaporation rate:
np~oF
65.渗透 permeation: {M=tw
66.渗透率φ permeability: I=1tf;Bsi
67.渗透系数P permeability coefficient 1}(g=S
2. 1.真空泵 vacuum pumps xzy9~))o
1-1.容积真空泵 positive displacement pump: 8Vq,J :+
⑴.气镇真空泵 gas ballast vacuum pump: p\(%bO
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: W>"i0p
⑶.干封真空泵 dry-sealed vacuum pump: ;{>z\6N
⑷.往复真空泵 piston vacuum pump: QoqdPk#1
⑸.液环真空泵 liquid ring vacuum pump: 03,+uf
⑹.旋片真空泵 sliding vane rotary vacuum pump: ? 0%lB=qQ
⑺.定片真空泵 rotary piston vacuum pump: (\Dd9a8V-
⑻.滑阀真空泵 rotary plunger vacuum pump: "^u|vCqw
⑼.余摆线真空泵 trochoidal vacuum pump: <'/+E4m
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: 0c]Lm?&
⑾.罗茨真空泵 roots vacuum pump: fD!O
aK
1-2.动量传输泵 kinetic vacuum pump: 4Ld0AApncy
⑴.牵引分子泵molecular drag pump: F
Hv|6zUX
⑵.涡轮分子泵turbo molecular pump: Tj>~#~
⑶.喷射真空泵ejector vacuum pump: pdE=9l'
⑷.液体喷射真空泵liquid jet vacuum pump: ?-(E$ll
⑸.气体喷射真空泵gas jet vacuum pump: >iq^Ts
⑹.蒸汽喷射真空泵vapor jet vacuum pump : W
nVX)o
⑺.扩散泵diffusion pump : BqR8%F
⑻.自净化扩散泵self purifying diffusion pump: b2Ct^`|M5
⑼.分馏扩散泵 fractionating diffusion pump : c=ZX7U
⑽.扩散喷射泵diffusion ejector pump : %DiZ&}^Ck
⑾.离子传输泵ion transfer pump: Jx'p\*
1-3.捕集真空泵 entrapment vacuum pump: -8-Aqh8|
⑴吸附泵adsorption pump: L%<1cE))
⑵.吸气剂泵 getter pump: N^)L@6
⑶.升华(蒸发)泵 sublimation (evaporation)pump : Nf3L
⑷.吸气剂离子泵getter ion pump: 9m<>G3Jr
⑸.蒸发离子泵 evaporation ion pump: N 4Dyec\
⑹.溅射离子泵sputter ion pump: = uOFaZ4
⑺.低温泵cryopump: JeiW
z1t
`/#6k>
2.真空泵零部件 o\2#o5#
2-1.泵壳 pump case: ,cpPXcz ?,
2-2.入口 inlet: L!5%;!>.P
2-3.出口outlet: S9mj/GpL3
2-4.旋片(滑片、滑阀)vane; blade : Wvcj\2'yd
2-5.排气阀discharge valve: wJ+"JQY.J+
2-6.气镇阀gas ballast valve: Zr`:A$
2-7.膨胀室expansion chamber: HmQuRW
2-8.压缩室compression chamber: D7 .R
NXo
2-9.真空泵油 vacuum pump oil: 4j/8Otn
2-10.泵液 pump fluid: 3EAu#c@q"
2-11.喷嘴 nozzle: '*W/Bett
2-13.喷嘴扩张率nozzle expansion rate: V"
I+E
2-14.喷嘴间隙面积 nozzle clearance area : 9!PJLI=D
2-15.喷嘴间隙nozzle clearance: mw.9cDf
2-16.射流jet: " >;},$
2-17.扩散器diffuser: cp[k[7XGD
2-18.扩散器喉部diffuser thoat: 1J^{h5?lU
2-19.蒸汽导管vapor tube(pipe;chimney): K47W7zR
2-20.喷嘴组件nozzle assembly: :)bm+xWFF
2-21.下裙skirt: LR}b^QU7
#Ey!?Z
3.附件 ~g)gXPjke
3-1阱trap: *y7^4I-J
⑴.冷阱 cold trap: \Z<' u;
⑵.吸附阱sorption trap: Haiuf)a
⑶.离子阱ion trap: '@rGX+"
⑷.冷冻升华阱 cryosublimation trap: y~;Kf0~
3-2.挡板baffle: HJM- ;C](
3-3.油分离器oil separator: Pr/K5aJeg
3-4.油净化器oil purifier: ><5tnBP|+L
3-5.冷凝器condenser: jFnq{Lt
K6_{AuL}4
4.泵按工作分类 ~-JkuRJ\
4-1.主泵main pump: `AQv\@wp
4-2.粗抽泵roughing vacuum pump: t<x0?vfD
4-3.前级真空泵backing vacuum pump: HBeOK
4-4.粗(低)真空泵 roughing(low)vacuum pump: .\qZkk}2l
4-5.维持真空泵holding vacuum pump: \,lgv
4-6.高真空泵high vacuum pump: BY6QJkI9x
4-7.超高真空泵ultra-high vacuum pump: r`VKb
4-8.增压真空泵booster vacuum pump: W8R@Pf
$D\SueZ
5.真空泵特性 JT, 8/o
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: V6Z2!Ht
5-2.真空泵的抽气量Q throughput of vacuum pump:。 ]xbR:CYJ
5-3.起动压力starting pressure: }5FdX3YR
5-4.前级压力 backing pressure : 5
J61PuH
5-5.临界前级压力 critical backing pressure: UC3?XoT\
5-6.最大前级压力maximum backing pressure: yiiYq(\{
5-7.最大工作压力maximum working pressure: m^% [
5-8.真空泵的极限压力ultimate pressure of a pump: Fz~-m# Ts
5-9.压缩比compression ratio: C]p3,G,oN
5-10.何氏系数Ho coefficient: +hqsIx
5-11.抽速系数speed factor: rx
CSs
5-12.气体的反扩散back-diffusion of gas: }LN +V~
5-13.泵液返流back-streaming of pump fluid: St^ s"A
5-14.返流率back-streaming rate a3sXl+$D@
5-15.返迁移back-migration: d7qHUx'=z
5-16.爆腾bumping: C1Slx!}
5-17.水蒸气允许量qm water vapor tolerable load: vn9_tL&
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: &AG,]#
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: sTU`@}}
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump *O+G}_}
3. 1.一般术语 M9[Fx=
qY
1-1.压力计pressure gauge: &ScADmZP^d
1-2.真空计vacuum gauge: bT2 b)nf
⑴.规头(规管)gauge head: XL1v&'HLV
⑵.裸规nude gauge : 49E<`f0
⑶.真空计控制单元gauge control unit : U5[xW
⑷.真空计指示单元gauge indicating unit : ^duNEu0*
#%rXDGDS
2.真空计一般分类 c~K^ooS-
2-1.压差式真空计differential vacuum gauge: Gcna:w>6d
2-2.绝对真空计 absolute vacuum gauge: t-)C0<
2-3.全压真空计total pressure vacuum gauge: DP6 M4
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: TW8E^k7
2-5.相对真空计relative vacuum gauge : GNlP]9wX
3.Oc8(N^}
3.真空计特性 $*tq$DZ4&
3-1.真空计测量范围pressure range of vacuum gauge: @2yi%_]h
3-2.灵敏度系数sensitivity coefficient: y2bL!Y<s9
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): Q-k{Lqa-
3-5.规管光电流photon current of vacuum gauge head: ,W;\6"Iwx'
3-6.等效氮压力equivalent nitrogen pressure : >gtKyn]
3-7.X射线极限值 X-ray limit: >jD,%yG
3-8.逆X射线效应anti X-ray effect: QWp,(Mv:r
3-9.布利尔斯效应blears effect: SQ9s
&'uFy0d,
4.全压真空计 @kw#\%Uz
4-1.液位压力计liquid level manometer: ],YIEOx6
4-2.弹性元件真空计elastic element vacuum gauge: /f@VRME
4-3.压缩式真空计compression gauge: "T|%F D&[
4-4.压力天平pressure balance: na,j
4-5.粘滞性真空计viscosity gauge : hqd}L~o:
4-6.热传导真空计thermal conductivity vacuum gauge : Hr |De8#f
4-7.热分子真空计thermo-molecular gauge: y w)q3zC
4-8.电离真空计ionization vacuum gauge: 6r4o47_t8#
4-9.放射性电离真空计radioactive ionization gauge: B`3RyM"J @
4-10.冷阴极电离真空计cold cathode ionization gauge: _h",,"p#o
4-11.潘宁真空计penning gauge: G%_6"s
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: #Cks&[!c
4-13.放电管指示器discharge tube indicator: B#9rqC
4-14.热阴极电离真空计hot cathode ionization gauge: Z6F>SL
4-15.三极管式真空计triode gauge: 0*o)k6?q3
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: ^|M\vO
4-17.B-A型电离真空计Bayard-Alpert gauge: 1bs8fUPB3
4-18.调制型电离真空计modulator gauge:
~$-Nl
4-19.抑制型电离真空计suppressor gauge: 20h|e+3
4-20.分离型电离真空计extractor gauge: _-$O6eZ
4-21.弯注型电离真空计bent beam gauge: ]V\qX+K
4-22.弹道型电离真空计 orbitron gauge : zA4m !l*eM
4-23.热阴极磁控管真空计hot cathode magnetron gauge: yNMnByg3?
0vbiq
5.分压真空计(分压分析器) 28>PmH]7
5-1.射频质谱仪radio frequency mass spectrometer: !{tkv4
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: ;`Eie2y{M
5-3.单极质谱仪momopole mass spectrometer: o-"/1 zLg4
5-4.双聚焦质谱仪double focusing mass spectrometer: 4)./d2/E
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: eJFGgJRIvF
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: I%.KFPV
5-7.回旋质谱仪omegatron mass spectrometer: t>p!qKrE'J
5-8.飞行时间质谱仪time of flight mass spectrometer: chv0\k"'
S(<r-bV<
6.真空计校准 6yEYX'_
6-1.标准真空计reference gauges: VU6nu4
6-2.校准系统system of calibration: 7 \)OWp
6-3.校准系数K calibration coefficient: +NL^/y<;
6-4.压缩计法meleod gauge method: P F5;2
6-5.膨胀法expansion method: gn"Y?IZ?
6-6.流导法flow method: 8 Yfg@"Tn
4. 1.真空系统vacuum system z'N_9=
1-1.真空机组pump system: JQ|qg\[
1-2.有油真空机组pump system used oil : +mP&B<=H)
1-3.无油真空机组oil free pump system AY{#!RtV
1-4.连续处理真空设备continuous treatment vacuum plant: z*?-*6W
1-5.闸门式真空系统vacuum system with an air-lock: pGEYke NU
1-6.压差真空系统differentially pumped vacuum system: J!r,ktO^U?
1-7.进气系统gas admittance system: d3Dw[4
*PQu9>1w
2.真空系统特性参量 wBlfQ
w-N
2-1.抽气装置的抽速volume flow rate of a pumping unit : $U=E7JO
2-2.抽气装置的抽气量throughput of a pumping unit : MJJ]8:%
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: *K#7,*Oz
2-4.真空系统的漏气速率leak throughput of a vacuum system: t<S]YA~N'
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: u%n6!Zx
2-6.极限压力ultimate pressure: +c&n7
2-7.残余压力residual pressure: LB*qL
2-8.残余气体谱residual gas spectrum: .Y B}w
2-9.基础压力base pressure: ]C.x8(2!f
2-10.工作压力working pressure: gD&/k
2-11.粗抽时间roughing time: f4.k%| ]
2-12.抽气时间pump-down time: D4
{?f<G0F
2-13.真空系统时间常数time constant of a vacuum system: Fe8JsB-
2-14.真空系统进气时间venting time: c 32IO&W4
!]]QbB
3.真空容器 [KrWL;[1<
3-1.真空容器;真空室vacuum chamber: hT :+x3
3-2.封离真空装置sealed vacuum device: J[E_n;d1
3-3.真空钟罩vacuum bell jar: %jaB>4.A:
3-4.真空容器底板vacuum base plate: B&^WRM;7t
3-5.真空岐管vacuum manifold: cBICG",TA
3-6.前级真空容器(贮气罐)backing reservoir: m8KJ~02l#
3-7.真空保护层outer chamber: ::13$g=T9s
3-8.真空闸室vacuum air lock: w`Q"m x*
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: &0B<iO<f
x1:#rb'
4.真空封接和真空引入线 a^yBtb~,P
4-1.永久性真空封接permanent seal : Ki#({~
4.2.玻璃分级过渡封接graded seal : ~F5JN^5Y
4-3.压缩玻璃金属封接compression glass-to-metal seal: J6x#c`Y
4-4.匹配式玻璃金属封接matched glass-to-metal seal: dre@V(\;hQ
4-5.陶瓷金属封接ceramic-to-metal seal: =%u\x=u|
4-6.半永久性真空封接semi-permanent seal : 8`bQ,E+2
4-7.可拆卸的真空封接demountable joint: f8]Qn8
4-8.液体真空封接liquid seal En&bwLu:s
4-9.熔融金属真空封接molten metal seal: uK6_H vHuy
4-10.研磨面搭接封接ground and lapped seal: qyXx`'e
4-11.真空法兰连接vacuum flange connection: t;BvKH77
4-12.真空密封垫vacuum-tight gasket: q^{Z"ifL
4-13.真空密封圈ring gasket: ?f1PQ
4-14.真空平密封垫flat gasket: BR8W8nRb
4-15.真空引入线feedthrough leadthrough: e">$[IhXtV
4-16.真空轴密封shaft seal: X4<!E#
4-17.真空窗vacuum window: =)Z!qjf1U
4-18.观察窗viewing window: O6rrv,+_L
|Ad1/>8i
5.真空阀门 /4 zO
5-1.真空阀门的特性characteristic of vacuum valves: B35zmFX|}N
⑴.真空阀门的流导conductance of vacuum valves: `c
3IS5
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: Q_}i8p'
5-2.真空调节阀regulating valve: =GO/r;4
5-3.微调阀 micro-adjustable valve: RB]K?
5-4.充气阀charge valve: uQy5t:!
5-5.进气阀gas admittance valve: ">b~k;M?
5-6.真空截止阀break valve: \Y'#}J"dh
5-7.前级真空阀backing valve: -w41Bvz0
5-8.旁通阀 by-pass valve: HnvE\t9`
5-9.主真空阀main vacuum valve: %(4G[R[
5-10.低真空阀low vacuum valve: BoZG^
5-11.高真空阀high vacuum valve: tT7< V{i4
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: 2u9^ )6/
5-13.手动阀manually operated valve: <:#O*Y{
5-14.气动阀pneumatically operated valve: p/V
5-15.电磁阀electromagnetically operated valve: X|.M9zIx
5-16.电动阀valve with electrically motorized operation: }qUNXE@
5-17.挡板阀baffle valve: Y.$InQ gL
5-18.翻板阀flap valve: F?j;3@z[A
5-19.插板阀gate valve: Mwdh]I,#
5-20.蝶阀butterfly valve: =~r?(u6d
y^; =+Z
6.真空管路 $@_7HE3
6-1.粗抽管路roughing line: Ph&AP*Fq
6-2.前级真空管路backing line: dZ!Wj7K)
6-3.旁通管路;By-Pass管路 by-pass line: ?sl 7C
gl
6-4.抽气封口接头pumping stem: @_0g "Ul
6-5.真空限流件limiting conductance: hjiU{@q
6-6.过滤器filter: sPNX)
5. 1.一般术语 a,Gd\.D
1-1真空镀膜vacuum coating: \Cx)
~bq<
1-2基片substrate: _] E ~ci}
1-3试验基片testing substrate: )c@I|L
1-4镀膜材料coating material: yI9~LTlA3
1-5蒸发材料evaporation material: 7^k`:Z
1-6溅射材料sputtering material: Oq{&hH/'}
1-7膜层材料(膜层材质)film material: u>;#.N/
1-8蒸发速率evaporation rate: H[o'j@0
1-9溅射速率sputtering rate: yhr\eiJ@6
1-10沉积速率deposition rate: bhXH<=
1-11镀膜角度coating angle: `Rj<qz^7
`n8) o %E9
2.工艺 R7us9qM4e
2-1真空蒸膜vacuum evaporation coating: HtOo*\Ne
(1).同时蒸发simultaneous evaporation: S~vbISl
(2).蒸发场蒸发evaporation field evaporation: "s$v?voo
(3).反应性真空蒸发reactive vacuum evaporation: w<_.T#
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: OVO0Emv
(5).直接加热的蒸发direct heating evaporation: *[*#cMZ
(6).感应加热蒸发induced heating evaporation: g~d}?B\<@
(7).电子束蒸发electron beam evaporation: JH2?^h|{
(8).激光束蒸发laser beam evaporation: sm}q&m]ad
(9).间接加热的蒸发indirect heating evaporation:
G8`q-B}q
(10).闪蒸flash evaportion: =Mq=\T
2-2真空溅射vacuum sputtering: GCrh4rxgg
(1).反应性真空溅射 reactive vacuum sputtering: >HnD'y*
(2).偏压溅射bias sputtering: 2F-!SI
(3).直流二级溅射direct current diode sputtering: 64}Oa+*s
(4).非对称性交流溅射asymmtric alternate current sputtering: q`09
(5).高频二极溅射high frequency diode sputtering: k]x64hgm
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: !B?/6XRUx
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: j' -akXo<
(8).离子束溅射ion beam sputtering: t~p9iGX<
(9).辉光放电清洗glow discharge cleaning: eif<aG5
2-3物理气相沉积PVD physical vapor deposition: ?PWD[mQE\
2-4化学气相沉积CVD chemical vapor deposition: _,b%t1v
2-5磁控溅射magnetron sputtering: P*/p x4;6
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: !-r@_tn|
2-7空心阴极离子镀HCD hollow cathode discharge deposition: >H@
dgb
2-8电弧离子镀arc discharge deposition: e =&
abu
Z~g~,q
3.专用部件 VS^%PM#:/
3-1镀膜室coating chamber: uc%75TJ@
3-2蒸发器装置evaporator device: W<;i~W
3-3蒸发器evaporator: -$;H_B+.
3-4直接加热式蒸发器evaporator by direct heat: 6KhHS@Z
3-5间接加热式蒸发器evaporator by indirect heat: \~xsBPX+x
3-7溅射装置sputtering device: xXZ$#z\Z,
3-8靶target: uf`o\wqU
3-10时控挡板timing shutter: 8x'rNb
3-11掩膜mask: %-]j;'6}cX
3-12基片支架substrate holder: <(d^2-0
3-13夹紧装置clamp: N!;Y;<Ro_
3-14换向装置reversing device: =b,$jCv<,5
3-15基片加热装置substrate heating device: |x{:GWq
3-16基片冷却装置substrate colding device: M#})
xpFu$2T6P.
4.真空镀膜设备 )aquf<u@
4-1真空镀膜设备vacuum coating plant: *ok89ad
(1).真空蒸发镀膜设备vacuum evaporation coating plant: 3Q[]lFJ}F
(2).真空溅射镀膜设备vacuum sputtering coating plant: KBzEEvx/$
4-2连续镀膜设备continuous coating plant: yqlkf$?
4-3半连续镀膜设备semi- continuous coating plant e@p` -;<
6. 1.漏孔 \ ;Hj,z\
1-1漏孔leaks: a%ec: %
1-2通道漏孔channel leak: jb)z[!FbM
1-3薄膜漏孔membrane leak: 6,_CL M
1-4分子漏孔molecular leak: 3w{4G<I
1-5粘滞漏孔vixcous leak: 8c+i+gp!
1-6校准漏孔calibrated leak: *|$s0ga C
1-7标准漏孔reference leak : nP'ab_>b
1-8虚漏virtual leak: @)VJ,Ql$Y
1-9漏率leak rate: ]S,I}NP
1-10标准空气漏率standard air leak rate: ]9zc[_
!
1-11等值标准空气漏率equivalent standard air leak rate: n5S$Dl
1-12探索(示漏)气体: \R&`bAd k
g_>)Q
2.本底 peGXU/5.I
2-1本底background: HJBUN1n
2-2探索气体本底search gas background : 8XX,(k_b
2-3漂移drift: 3KB)\nF#%
2-4噪声noise: kp<9o!?)
ICq;jf ML
3.检漏仪 sPkT>q
3-1检漏仪leak detector: @Z@yI2#e
3-2高频火花检漏仪H.F. spark leak detector: j@UW[,UI
3-3卤素检漏仪halide leak detector: I$qL=
3-4氦质谱检漏仪helium mass spectrometer leak detector: 6JRee[
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: s26s:A3rh
o,bV.O.W
4.检漏 ~<v`&Gm?"
4-1气泡检漏leak detection by bubbles: ^ 9;s
nr
4-2氨检漏leak detection by ammonia: ?_\Hv@t;
4-3升压检漏leak detection of rise pressure: _sZ/tU@_-K
4-4放射性同位素检漏radioactive isotope leak detection: BT d$n!'$n
4-5荧光检漏fluorescence leak detection LfOGq%&
7. 1.一般术语 FD_0FMZ9,
1-1真空干燥vacuum drying: gADt%K2#Z
1-2冷冻干燥freeze drying : $C#~c1w
1-3物料material: F\-qXSA
1-4待干燥物料material to be dried: *i5&x/ds
1-5干燥物料dried material : Z`b,0[rG[
1-6湿气moisture;humidity: X:8=jHkz
1-7自由湿气free moisture: ( }JX ]-
1-8结合湿气bound moisture: Kh<v2
1-9分湿气partial moisture: *XtZ;os]
1-10含湿量moisture content: 5Odi\SJ&
1-11初始含湿量initial moisture content: ^Po\:x%o
1-12最终含湿量final residual moisture: s%4)}w;z
1-13湿度degree of moisture ,degree of humidity : s)/i_Oe$\
1-14干燥物质dry matter : :Oq!.uO
1-15干燥物质含量content of dry matter: |r0j>F
zb9d{e
2.干燥工艺 G-"#3{~2
2-1干燥阶段stages of drying : >)#*}JI
(1).预干燥preliminary dry: 0"
R|lTYq
(2).一次干燥(广义)primary drying(in general): Mv4JF(,S
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): %5F=!(w
(4).二次干燥secondary drying: Y
3KCIL9
2-2.(1).接触干燥contact drying: "]MF =-v
(2).辐射干燥 drying by radiation : K3
]hUe#
(3).微波干燥microwave drying: &
NOKrN~HX
(4).气相干燥vapor phase drying: ZP%^.wxC
(5).静态干燥static drying: ;'gzRC
(6).动态干燥dynamic drying:
:
]
Y=
2-3干燥时间drying time: p' /$)klt
2-4停留时间length of stay(in the drying chamber): |":^3
2-5循环时间cycle time: -pqShDar|
2-6干燥率 dessication ratio : >-)i_C2
2-7去湿速率mass flow rate of humidity: >b{%j8uM
2-8单位面积去湿速率mass flow rate of humidity per surface area: C=PBF\RkKu
2-9干燥速度 drying speed : i"w$D{N
2-10干燥过程drying process: m?<C\&)6x
2-11加热温度heating temperature: qQpR gzw
2-12干燥温度temperature of the material being dried : % j^=
2-13干燥损失loss of material during the drying process : @*%.V.
2-14飞尘lift off (particles):
ZfvFs
2-15堆层厚度thickness of the material: "me Jn/
zhN'@Wj'_
3.冷冻干燥 hrcR"OZ~X
3-1冷冻freezing: H%faRUonz
(1).静态冷冻static freezing: sBRw#xyS
(2).动态冷冻dynamic freezing: Q`19YX
(3).离心冷冻centrifugal freezing: /5yWvra
(4).滚动冷冻shell freezing: |L`w4;
(5).旋转冷冻spin-freezing: Yj0Ss{Ep
(6).真空旋转冷冻vacuum spin-freezing: ;AG5WPI
(7).喷雾冷冻spray freezing: JN3Oe5yB2@
(8).气流冷冻air blast freezing: NsJUruN
3-2冷冻速率rate of freezing: U8<GD|
3-3冷冻物料frozen material: +(|T\%$DT
3-4冰核ice core: n$b/@hp$z
3-5干燥物料外壳envelope of dried matter: `?Y/:4
3-6升华表面sublimation front: dAAE2}e
3-7融化位置freezer burn: /ebYk-c
pazFVzT
4.真空干燥设备;真空冷冻干燥设备 vhhsOga
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: YO-O-NEP
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: t~@TUTbx
4-3加热表面heating surface: TSuHY0.cp
4-4物品装载面shelf : PeE'#&wn
4-5干燥器的处理能力throughput (of the vacuum drying chamber): Sm,%>
4-6单位面积干燥器处理能力throughput per shelf area: })"9TfC
4-7冰冷凝器ice condenser: RqcX_x(p
4-8冰冷凝器的负载load of the ice condenser: @p`#y
4-9冰冷凝器的额定负载rated load of the ice condenser fMLm_5 (H
8. 1.一般术语 2I>C A[qp
1-1试样sample : ]@WJ&e/'@
(1).表面层surface layer: @~a52'\
(2).真实表面true surface: `^w5/v#
(3).有效表面积effective surface area: g~Q#U;]
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: y6G[-?"/Q
(5).表面粒子密度surface particle density: 'MC)%N,
(6).单分子层monolayer: {qh`8
(7).表面单分子层粒子密度monolayer density: oR3$A :!P=
(8).覆盖系数coverage ratio: *Jp>)>
1-2激发excitation: 5@Rf]'1B0
(1).一次粒子primary particle: a:P%
r
(2).一次粒子通量primary particle flux: &Cdd
(3).一次粒子通量密度density of primary particle flux: s[Njk@y,
(4).一次粒子负荷primary particle load: Ak4iG2
(5).一次粒子积分负荷integral load of primary particle: f5`exfdHE
(6).一次粒子的入射能量energy of the incident primary particle: $R"~BZbt;
(7).激发体积excited volume: _YbHnb
(8).激发面积excited area: +n%WmRf6!
(9).激发深度excited death: Le_?x
(10).二次粒子secondary particles: L18Olu
(11).二次粒子通量secondary particle flux: WXGLo;+>I
(12).二次粒子发射能energy of the emitted secondary particles: i%-c/ lop
(13).发射体积emitting volume: |E!xt6B
(14).发射面积emitting area: 4?d2#Xhs8
(15).发射深度emitting depth: F1MPo;e
(16).信息深度information depth: Z;Tjjws
(17).平均信息深度mean information depth: <4Ujk8Zj
1-3入射角angle of incidence: <v0 d8
1-4发射角angle of emission: >5XE*9
1-5观测角observation: !QC->
1-6分析表面积analyzed surface area: S* <:He&1
1-7产额 yield : \t )Zk2
1-8表面层微小损伤分析minimum damage surface analysis: LoNz
1KJL
1-9表面层无损伤分析non-destructive surface analysis: UG1^G07s
1-10断面深度分析 profile analysis in depth; depth profile analysis : r)h+pga5^E
1-11可观测面积observable area: 5w{_WR6,
1-12可观测立体角observable solid angle : $'kIo*cZ
1-13接受立体角;观测立体角angle of acceptance: {AQ3y,sh
1-14角分辨能力angular resolving power: t0hg!_$bq
1-15发光度luminosity: =Ermh7,
1-16二次粒子探测比detection ratio of secondary particles: @'~v~3
$S
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: (}c}=V
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: LD#]"k
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: }JvyjE
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: L# (o(4g2
1-21本底压力base pressure: N{oD1%
1-22工作压力working pressure: 8]+hfB/
u'P@3'P
2.分析方法 >'E'Mp.
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: i wK,XnIR
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : u9}=g%TV
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: S,qsCnz
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: yg/.=M
2-3离子散射表面分析ion scattering spectroscopy: MJDFm,
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: +*F ;l\R
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: eX$u
2-6离子散射谱仪ion scattering spectrometer: \$GlB+ iCx
2-7俄歇效应Auger process: '6[0NuB
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: L?<V KT
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: -*+7-9A I
2-10光电子谱术photoelectron spectroscopy : 6uR:/PTG
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: E3sl"d;~
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: \*a7DuVw
2-11光电子谱仪photoelectron spectrometer: &5c)qap;n
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: XeJx/'9o{
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: &P,8)YA
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): ^%*%=LJm
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus