“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 }~P%S(zB
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真空术语 \PS{/XK
mv@cGdxu
1.标准环境条件 standard ambient condition: bc}X.IC
2.气体的标准状态 standard reference conditions forgases: !:e|M|T'I*
3.压力(压强)p pressure: `|K,E
4.帕斯卡Pa pascal: 4)D#kP
5.托Torr torr: `(A6uakd
6.标准大气压atm standard atmosphere: J6x\_]1:*
7.毫巴mbar millibar: j,Sg?&"%=
8.分压力 partial pressure: W-wy<<~f
9.全压力 total pressure: ,4y'(DA
10.真空 vacuum: %bf+Y7m
11.真空度 degree of vacuum: "%~\kJ(G
12.真空区域 ranges of vacuum: V~LZ%NZ8
13.气体 gas: L(!4e
14.非可凝气体 non-condensable gas: _3$@s{k-TI
15.蒸汽vapor: }HS:3Dt
16.饱和蒸汽压saturation vapor pressure: ]D^ dQ%{
17.饱和度degree of saturation: 0P`wh=")
18.饱和蒸汽saturated vapor: F\1nc"K/(
19.未饱和蒸汽unsaturated vapor: zx^]3}
20.分子数密度n,m-3 number density of molecules: kTQ:k
}%B
21.平均自由程ι、λ,m mean free path: b ABx'E
22.碰撞率ψ collision rate: 0z?b5D;
23.体积碰撞率χ volume collision rate: @k~?h=o\b
24.气体量G quantity of gas: Du3OmXMk
25.气体的扩散 diffusion of gas: zM6yUEg
26.扩散系数D diffusion coefficient; diffusivity: f uojf+i
27.粘滞流 viscous flow: Vzy]N6QT{
28.粘滞系数η viscous factor: *Yv"lB8
29.泊肖叶流 poiseuille flow: :1u>T3L.z
30.中间流 intermediate flow: Q0~5h?V'
31.分子流 molecular flow: /2^cty.BXw
32克努曾数 number of knudsen: ^|}C!t+
33.分子泻流 molecular effusion; effusive flow: zjgK78!<
34.流逸 transpiration: 1wUZ0r1'
35.热流逸 thermal transpiration: ulFU(%&
36.分子流率qN molecular flow rate; molecular flux: SCeZt [
37.分子流率密度 molecular flow rate density; density of molecular flux: KsYT3
38.质量流率qm mass flow rare: l|`FW
39.流量qG throughput of gas: ':#?YQ}2
40.体积流率qV volume flow rate: .;WJ(kB\U
41.摩尔流率qυ molar flow rate: oTtmn,
T
42.麦克斯韦速度分布 maxwellian velocity distribution: ezTu1-m
43.传输几率Pc transmission probability: mFayU w
44.分子流导CN,UN molecular conductance: Qo
45.流导C,U conductance: wo2^,Y2z+
46.固有流导Ci,Ui intrinsic conductance: TI}H(XL(
47.流阻W resistance: Y0BvN`E
48.吸附 sorption: lp[3z&u
49.表面吸附 adsorption: VL5kjF3/
50.物理吸附physisorption: )DMu`cD
51.化学吸附 chemisorption: , >Y.!
52.吸收absorption: Qv8#{y@U
53.适应系数α accommodation factor: $n `Zvl2
54.入射率υ impingement rate: L1BpkB
55.凝结率condensation rate: Lhl)p P17
56.粘着率 sticking rate: j5z, l
57.粘着几率Ps sticking probability: o!mfd}nG
58.滞留时间τ residence time: Td[w<m+p<P
59.迁移 migration: ]Oc
:x
60.解吸 desorption: iMx+y5O
61.去气 degassing: OdQ>h$ gZ
62.放气 outgassing: w|WZEu:0|
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: {+c/$4<
64.蒸发率 evaporation rate: + WPi}
65.渗透 permeation: q`1t*<sk
66.渗透率φ permeability: q^sMJ
67.渗透系数P permeability coefficient q<>2}[W
2. 1.真空泵 vacuum pumps *"
<tFQ
1-1.容积真空泵 positive displacement pump: {EJVZG:&
⑴.气镇真空泵 gas ballast vacuum pump: Y'fI4
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: T.ub!,Y
⑶.干封真空泵 dry-sealed vacuum pump: N)Qj^bD!
⑷.往复真空泵 piston vacuum pump: z+" :,#
⑸.液环真空泵 liquid ring vacuum pump: :EgdV
⑹.旋片真空泵 sliding vane rotary vacuum pump: 3FPy"[[
⑺.定片真空泵 rotary piston vacuum pump: %W"\
⑻.滑阀真空泵 rotary plunger vacuum pump: {\|? {8f
⑼.余摆线真空泵 trochoidal vacuum pump: hD<z^j+
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: ! qrF=a
⑾.罗茨真空泵 roots vacuum pump: ibzYY"D:
1-2.动量传输泵 kinetic vacuum pump: @PwEom`a
⑴.牵引分子泵molecular drag pump: ZfT%EPoZ:
⑵.涡轮分子泵turbo molecular pump: } Q1$v~
⑶.喷射真空泵ejector vacuum pump: vzi=[A
⑷.液体喷射真空泵liquid jet vacuum pump: QN_5q5
⑸.气体喷射真空泵gas jet vacuum pump: \(T;@r
⑹.蒸汽喷射真空泵vapor jet vacuum pump : D\({]oj]
⑺.扩散泵diffusion pump : W<!q>8Xn?
⑻.自净化扩散泵self purifying diffusion pump: 6$PfX.Fh
⑼.分馏扩散泵 fractionating diffusion pump : %h|z)
⑽.扩散喷射泵diffusion ejector pump : 4L!{U@'
⑾.离子传输泵ion transfer pump: |<y[gj4`T/
1-3.捕集真空泵 entrapment vacuum pump: hN\E8"To
⑴吸附泵adsorption pump: tHoFnPd\|
⑵.吸气剂泵 getter pump: @2$PU{dH
⑶.升华(蒸发)泵 sublimation (evaporation)pump : +Yi=Wo/
⑷.吸气剂离子泵getter ion pump: q<c).4
⑸.蒸发离子泵 evaporation ion pump: 7h&xfrSrD
⑹.溅射离子泵sputter ion pump: Br#]FB|tD
⑺.低温泵cryopump: =m} {g/Bk
hNx`=D9[7
2.真空泵零部件 *otJtEI>6
2-1.泵壳 pump case: PtgUo,P
2-2.入口 inlet: $Z{ fKr
2-3.出口outlet: CWBsiL
f
2-4.旋片(滑片、滑阀)vane; blade : *3"C"4S
2-5.排气阀discharge valve: r}hj,Sq'
2-6.气镇阀gas ballast valve: M8juab%y
2-7.膨胀室expansion chamber: {g/\5Z\b
2-8.压缩室compression chamber: s ^)W?3t]
2-9.真空泵油 vacuum pump oil: 1Za\T?V
2-10.泵液 pump fluid: Mqc[IAcd]
2-11.喷嘴 nozzle: 0w+hf3K+:
2-13.喷嘴扩张率nozzle expansion rate: qsJA|z&6x
2-14.喷嘴间隙面积 nozzle clearance area : 6Ir
?@O1'!
2-15.喷嘴间隙nozzle clearance: Q8:u 1$}
2-16.射流jet:
5j]}/Aq
2-17.扩散器diffuser: a S<JsB
2-18.扩散器喉部diffuser thoat: |AFF*]e S
2-19.蒸汽导管vapor tube(pipe;chimney): |qI_9#M\(
2-20.喷嘴组件nozzle assembly: %J|EDf,M
2-21.下裙skirt: kJDMIh|g
;U20g:K
3.附件 55$by.rf?
3-1阱trap: Ro-Mex2
⑴.冷阱 cold trap: PI{sO |
⑵.吸附阱sorption trap: JpuW
!I
⑶.离子阱ion trap: 2&tGJq-E
⑷.冷冻升华阱 cryosublimation trap: r,b
3-2.挡板baffle: M/1Q/;0P
3-3.油分离器oil separator: /au\OBUge
3-4.油净化器oil purifier: 4yBe(&N-d
3-5.冷凝器condenser: Szg<;._J
QT|m N
4.泵按工作分类 |xf%1(Rl@
4-1.主泵main pump: 5n9F\T5
4-2.粗抽泵roughing vacuum pump: Upv2s:wa}z
4-3.前级真空泵backing vacuum pump: Z&.FJZUP
4-4.粗(低)真空泵 roughing(low)vacuum pump: @#T?SNIL5
4-5.维持真空泵holding vacuum pump: `E|IMUB~
4-6.高真空泵high vacuum pump: +i)1 jX<
4-7.超高真空泵ultra-high vacuum pump: F5MWxAS,>
4-8.增压真空泵booster vacuum pump: gsU&}R1*h
g` h>:5]
5.真空泵特性 55!9U :{
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: JGO>X|T
5-2.真空泵的抽气量Q throughput of vacuum pump:。 ^)fB
"!s
5-3.起动压力starting pressure: x%(!+
5-4.前级压力 backing pressure : MiSFT5$v6
5-5.临界前级压力 critical backing pressure: u@gYEx}
5-6.最大前级压力maximum backing pressure: nEGku]pCH{
5-7.最大工作压力maximum working pressure: 3)3'-wu
5-8.真空泵的极限压力ultimate pressure of a pump: @ym7hk.
5-9.压缩比compression ratio: /4T%s
5-10.何氏系数Ho coefficient: .7kVC
5-11.抽速系数speed factor: 2XXEg>CU
5-12.气体的反扩散back-diffusion of gas: d->b9
5-13.泵液返流back-streaming of pump fluid: t 1&p>
v
5-14.返流率back-streaming rate >yWJk9hf
5-15.返迁移back-migration: I+<`}
5-16.爆腾bumping: Jz|(B_U
5-17.水蒸气允许量qm water vapor tolerable load: Lte\;Se.tu
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: F;_;lRAb
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: u#P7~9ZG-
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump '8Gw{&&
3. 1.一般术语 3;M!]9ms
1-1.压力计pressure gauge: 8WyG49eic
1-2.真空计vacuum gauge: 4B> l|%
⑴.规头(规管)gauge head: ~}M{[6!
⑵.裸规nude gauge : @eMyq1ZU
⑶.真空计控制单元gauge control unit : -!}1{
⑷.真空计指示单元gauge indicating unit : X:e'@]Z)?
2xnOWW
2.真空计一般分类 ZHF@k'vm/9
2-1.压差式真空计differential vacuum gauge: Mr1pRIYMd
2-2.绝对真空计 absolute vacuum gauge: 6@$[x* V
2-3.全压真空计total pressure vacuum gauge: l%U9g
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: Z6*RIdD>
2-5.相对真空计relative vacuum gauge : zCQv:.0L
Zg'[.wov
3.真空计特性 %kUJ:lg;d
3-1.真空计测量范围pressure range of vacuum gauge: \GWq0z&
3-2.灵敏度系数sensitivity coefficient: S_QDYnF)`
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): 6S8l
3-5.规管光电流photon current of vacuum gauge head: ~ACB#D%
3-6.等效氮压力equivalent nitrogen pressure : %EpK=;51U
3-7.X射线极限值 X-ray limit: O7K))w
3-8.逆X射线效应anti X-ray effect: Wu}Co
3-9.布利尔斯效应blears effect: ~q4y'dBy*
ydFY<Mb(o
4.全压真空计 <AIsNqr
4-1.液位压力计liquid level manometer: XmnqZWB
4-2.弹性元件真空计elastic element vacuum gauge: "s*{0'jo
4-3.压缩式真空计compression gauge: q{@Wn]!k
4-4.压力天平pressure balance: '|cuVxcE55
4-5.粘滞性真空计viscosity gauge : af_zZf!0
4-6.热传导真空计thermal conductivity vacuum gauge : F+6ZD5/
4-7.热分子真空计thermo-molecular gauge: E`s_Dr}K
4-8.电离真空计ionization vacuum gauge: 6RF01z|~_
4-9.放射性电离真空计radioactive ionization gauge: L"Gi~:z
4-10.冷阴极电离真空计cold cathode ionization gauge:
V|D;7
4-11.潘宁真空计penning gauge: yjpjJ
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: f"tO*/|`
4-13.放电管指示器discharge tube indicator: vIRE vj#U
4-14.热阴极电离真空计hot cathode ionization gauge: 4a 5n*6G!
4-15.三极管式真空计triode gauge: Kzm_AHA)
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: ;e{2?}#8&
4-17.B-A型电离真空计Bayard-Alpert gauge: h1Lp:@:|
4-18.调制型电离真空计modulator gauge: Dxe|4"%^
4-19.抑制型电离真空计suppressor gauge: ]@f6O*&=
4-20.分离型电离真空计extractor gauge: m<yA]
';s
4-21.弯注型电离真空计bent beam gauge: s=$ 7lYX
4-22.弹道型电离真空计 orbitron gauge : p"JSYF
9]
4-23.热阴极磁控管真空计hot cathode magnetron gauge: eS"gHldz
OBZ |W**N"
5.分压真空计(分压分析器) F>M$|Sc2
5-1.射频质谱仪radio frequency mass spectrometer: i~,k2*o
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: JC#@sJ4az)
5-3.单极质谱仪momopole mass spectrometer: G^R;~J*TDE
5-4.双聚焦质谱仪double focusing mass spectrometer: Z:*U/_G
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: BOWTH{KR<<
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: =.%ZF]Oe+#
5-7.回旋质谱仪omegatron mass spectrometer: cC[n~OV
5-8.飞行时间质谱仪time of flight mass spectrometer: 7HJv4\K
ky#6M?
\
6.真空计校准 $i1A470C
6-1.标准真空计reference gauges: lVFX@I =pI
6-2.校准系统system of calibration: y((_V%F}
6-3.校准系数K calibration coefficient: d5%*^nMpY
6-4.压缩计法meleod gauge method: /;0>*ft4
6-5.膨胀法expansion method: {aL$vgYT1
6-6.流导法flow method: 98]t"ny [
4. 1.真空系统vacuum system <Z;7=k
1-1.真空机组pump system: G225Nz;Y*
1-2.有油真空机组pump system used oil : KH7]`CU
1-3.无油真空机组oil free pump system |:?.-tq
1-4.连续处理真空设备continuous treatment vacuum plant: <7 rK
1-5.闸门式真空系统vacuum system with an air-lock: JA}'d7yEa
1-6.压差真空系统differentially pumped vacuum system: =4D_-Q
1-7.进气系统gas admittance system: +E:(-$"R
[0LqZ<\5
2.真空系统特性参量 n96gDH*
2-1.抽气装置的抽速volume flow rate of a pumping unit : e^GW[lT
2-2.抽气装置的抽气量throughput of a pumping unit : VqrMi *W6
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: iK]g3ew|
2-4.真空系统的漏气速率leak throughput of a vacuum system: vw]nqS~N
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: gB(W`:[
2-6.极限压力ultimate pressure: t/ 1NTa
2-7.残余压力residual pressure: /RC!Yi
2-8.残余气体谱residual gas spectrum: 9/M!S[N9
2-9.基础压力base pressure: t4*A+"~j
2-10.工作压力working pressure: \?^wu
2-11.粗抽时间roughing time: !S!03|
2-12.抽气时间pump-down time: C6M/$_l&a
2-13.真空系统时间常数time constant of a vacuum system: }Yl=lcvw
2-14.真空系统进气时间venting time:
D.o|($S0
ehusI-q
3.真空容器 cv4M[]U~
3-1.真空容器;真空室vacuum chamber: :\JbWj_j
3-2.封离真空装置sealed vacuum device: KaE;4gwM
3-3.真空钟罩vacuum bell jar: )JQQ4D
3-4.真空容器底板vacuum base plate: RM1uYFs<
3-5.真空岐管vacuum manifold: grdyiBSVn
3-6.前级真空容器(贮气罐)backing reservoir: J\ +gd%
3-7.真空保护层outer chamber: PL$F;d
3-8.真空闸室vacuum air lock: vx@p;1RU`
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: GKhwn&qCKb
)hW {>Y3x
4.真空封接和真空引入线 .b`P!
4-1.永久性真空封接permanent seal : 2P_^@g
4.2.玻璃分级过渡封接graded seal : Z{4aGp*
4-3.压缩玻璃金属封接compression glass-to-metal seal: n E0~Y2
4-4.匹配式玻璃金属封接matched glass-to-metal seal: Mgs|*u-5
4-5.陶瓷金属封接ceramic-to-metal seal: FTnQqDuT
4-6.半永久性真空封接semi-permanent seal : VQ<i$ I
4-7.可拆卸的真空封接demountable joint: zlztF$Bo
4-8.液体真空封接liquid seal ]3,.g)U*m
4-9.熔融金属真空封接molten metal seal: \y`3Lh Y
4-10.研磨面搭接封接ground and lapped seal: Z_ gVYa
4-11.真空法兰连接vacuum flange connection: "ue$DyN
4-12.真空密封垫vacuum-tight gasket: nvK7*-
4-13.真空密封圈ring gasket: Pd "mb~
4-14.真空平密封垫flat gasket: @1&;R
4-15.真空引入线feedthrough leadthrough: ^s~n[
4-16.真空轴密封shaft seal: 6a?$=y
4-17.真空窗vacuum window: Z) i1?#
4-18.观察窗viewing window: (g/X(3
pb6^sA%l
5.真空阀门 |id79qY7g
5-1.真空阀门的特性characteristic of vacuum valves: AOx3QgC^NO
⑴.真空阀门的流导conductance of vacuum valves: zO5u{
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: fk7Cf"[w
5-2.真空调节阀regulating valve: LL[#b2CKa
5-3.微调阀 micro-adjustable valve: "]s|D@^4#b
5-4.充气阀charge valve: RvS q KW8
5-5.进气阀gas admittance valve: Y-3[KH D
5-6.真空截止阀break valve: U?F^D4CV\
5-7.前级真空阀backing valve: \_Kt6=
5-8.旁通阀 by-pass valve: BZ;}ROmqk
5-9.主真空阀main vacuum valve: EcU'*
5-10.低真空阀low vacuum valve: /1W7<']>xV
5-11.高真空阀high vacuum valve: NC.P2^%
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: mOgOHb2
5-13.手动阀manually operated valve: A]iv)C;]
5-14.气动阀pneumatically operated valve: r d6F"W
5-15.电磁阀electromagnetically operated valve: g{W6a2
5-16.电动阀valve with electrically motorized operation: $JhZ'Z
5-17.挡板阀baffle valve: TjUZv 1(L
5-18.翻板阀flap valve: R=amKLD?
5-19.插板阀gate valve: b4)*<Zp`
5-20.蝶阀butterfly valve: mbX)'. +L
S
$_Y/x
6.真空管路 {y&\?'L'
6-1.粗抽管路roughing line: N+s?ZE*
6-2.前级真空管路backing line: B221}t
6-3.旁通管路;By-Pass管路 by-pass line: XiRT|%j
6-4.抽气封口接头pumping stem: ZcTL#OTP
6-5.真空限流件limiting conductance: fATA%eA8;
6-6.过滤器filter: :PD`PgQ
5. 1.一般术语 xQ#Akd=
1-1真空镀膜vacuum coating: gR;8ht(pd(
1-2基片substrate: WS1&3mOd
1-3试验基片testing substrate: y*}vG}e%
1-4镀膜材料coating material: XewXTd#x
1-5蒸发材料evaporation material: ;<kZfx
1-6溅射材料sputtering material: gVa+.x]
1-7膜层材料(膜层材质)film material: q:
TT4MUj<
1-8蒸发速率evaporation rate: H-_^TB
1-9溅射速率sputtering rate: Ig02M_
1-10沉积速率deposition rate: &Mhv XHI
1-11镀膜角度coating angle: NMl ?Y uEv
yE.495
2.工艺 sb}K%-
2-1真空蒸膜vacuum evaporation coating: ]g>m? \'n
(1).同时蒸发simultaneous evaporation: M<A;IOpR+
(2).蒸发场蒸发evaporation field evaporation: *(d6Z#
(3).反应性真空蒸发reactive vacuum evaporation: 8tLT'2+H#
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: =mKfFeO.
(5).直接加热的蒸发direct heating evaporation: ~KAp\!,
(6).感应加热蒸发induced heating evaporation: Ha)3i{OM
(7).电子束蒸发electron beam evaporation: %tzN@
(8).激光束蒸发laser beam evaporation: X,WQ'|rC
(9).间接加热的蒸发indirect heating evaporation: R3B5-^s
(10).闪蒸flash evaportion:
)IFl
0<d
2-2真空溅射vacuum sputtering: 9h:jFhsA9
(1).反应性真空溅射 reactive vacuum sputtering: !,? <zg
(2).偏压溅射bias sputtering: }uF[Ra
(3).直流二级溅射direct current diode sputtering: xb =8t!
(4).非对称性交流溅射asymmtric alternate current sputtering: |rE!
(5).高频二极溅射high frequency diode sputtering: q+A<g(Xu
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: %[]"QbF?
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: tt6.
jo
(8).离子束溅射ion beam sputtering: v8=?HUDd
(9).辉光放电清洗glow discharge cleaning: UF&0&`@
2-3物理气相沉积PVD physical vapor deposition: ny12U;'s,
2-4化学气相沉积CVD chemical vapor deposition: r5MxjuOB1
2-5磁控溅射magnetron sputtering: H GO#e
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: ydwK!j0y
2-7空心阴极离子镀HCD hollow cathode discharge deposition: zmrQf/y{R
2-8电弧离子镀arc discharge deposition: ,f8}q]FTA
1MbY7!?PG
3.专用部件 E4sn[DO
3-1镀膜室coating chamber: N]1V1c$G*
3-2蒸发器装置evaporator device: fL ~1
3-3蒸发器evaporator: K&=1Ap
3-4直接加热式蒸发器evaporator by direct heat: dtB[m^$
3-5间接加热式蒸发器evaporator by indirect heat: \%sPNw=e
3-7溅射装置sputtering device: Km6Ub?/7o
3-8靶target: yGb a
3-10时控挡板timing shutter: zKIGWH=qqm
3-11掩膜mask: iYk':iv}S
3-12基片支架substrate holder: Uc_jQ4e_
3-13夹紧装置clamp: [Ja)<!]<
3-14换向装置reversing device: )R jb/3*!
3-15基片加热装置substrate heating device: E]?)FH<oP
3-16基片冷却装置substrate colding device: r_b8,I6{]
nd.57@*M
4.真空镀膜设备 w Y8@1>ah
4-1真空镀膜设备vacuum coating plant: <+V-k|
(1).真空蒸发镀膜设备vacuum evaporation coating plant: v1LKU
(2).真空溅射镀膜设备vacuum sputtering coating plant: =WIE>*3[
4-2连续镀膜设备continuous coating plant: GwcI0~5
4-3半连续镀膜设备semi- continuous coating plant Q;4}gUmI$
6. 1.漏孔 fv|]= e
1-1漏孔leaks: T"n{WmVQ
1-2通道漏孔channel leak: nN>J*02(
1-3薄膜漏孔membrane leak: 1TKEm9j]u
1-4分子漏孔molecular leak: "hL9f=w
1-5粘滞漏孔vixcous leak: u3U4UK
1-6校准漏孔calibrated leak: "gFxfWIA
1-7标准漏孔reference leak : qs=Gj?GwGQ
1-8虚漏virtual leak: + c`AE
1-9漏率leak rate: z)}3**3'y
1-10标准空气漏率standard air leak rate: ,mB Z`X@N
1-11等值标准空气漏率equivalent standard air leak rate: ?Phk~ jE
1-12探索(示漏)气体: BbFa=H.
F "!agc2!
2.本底 YPu9Q
2-1本底background: ful#Px6m
2-2探索气体本底search gas background : 2b5 #PcKa
2-3漂移drift: +}P%HH]E/p
2-4噪声noise: J0=7'@(p
q(,cYu
3.检漏仪 BWWq4mdb{
3-1检漏仪leak detector: YQ;
cJ$
3-2高频火花检漏仪H.F. spark leak detector: k^z0Lo|)'
3-3卤素检漏仪halide leak detector: .Y;b)]@f
3-4氦质谱检漏仪helium mass spectrometer leak detector: _IWxYp
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: Z .quh;
4CLsY n?
4.检漏 HN{z T&
4-1气泡检漏leak detection by bubbles: j.DHqHx
4-2氨检漏leak detection by ammonia: qP7G[%=v
4-3升压检漏leak detection of rise pressure: nP<S6:s:
4-4放射性同位素检漏radioactive isotope leak detection: +=7:4LFOL
4-5荧光检漏fluorescence leak detection o+NMA
(
7. 1.一般术语 </= CZy5w
1-1真空干燥vacuum drying: 5k]XQxc6_
1-2冷冻干燥freeze drying : %Uy%kN_&
1-3物料material: {(4# )K2g%
1-4待干燥物料material to be dried: F+m[&MKL
1-5干燥物料dried material : joqWh!kv7U
1-6湿气moisture;humidity: D?^Y`G$.
1-7自由湿气free moisture: zN%97q_
1-8结合湿气bound moisture: Y6A;AmM8
1-9分湿气partial moisture: @xS]!1-
1-10含湿量moisture content: ND5$bq Nu?
1-11初始含湿量initial moisture content: =Q-k'= 6\
1-12最终含湿量final residual moisture: 3Hw[s0[$
1-13湿度degree of moisture ,degree of humidity : +TH3&H5I_A
1-14干燥物质dry matter : ?n.)&ZIx0
1-15干燥物质含量content of dry matter: >.e+S?o
6W&_2a7*
2.干燥工艺 =s;M]:
2-1干燥阶段stages of drying : " !-Kd'V
(1).预干燥preliminary dry: Q8q@Y R#
(2).一次干燥(广义)primary drying(in general): Mu{BUtkzG
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): XV>@B $hu
(4).二次干燥secondary drying: <*<U!J-i
2-2.(1).接触干燥contact drying: M(enRs3`O
(2).辐射干燥 drying by radiation : G(/DtY]
(3).微波干燥microwave drying: GKZN}bOm\
(4).气相干燥vapor phase drying: :_xh(W+2<
(5).静态干燥static drying: /ylc*3e'4
(6).动态干燥dynamic drying: _7"5wB?|+
2-3干燥时间drying time: n*<v]1
2-4停留时间length of stay(in the drying chamber): qM",( Bh
2-5循环时间cycle time: Qqc]aVRF
2-6干燥率 dessication ratio : w_Uh
2-7去湿速率mass flow rate of humidity: M&KyA
2-8单位面积去湿速率mass flow rate of humidity per surface area: SJk>Jt=
2-9干燥速度 drying speed : ys8Q.oBv_`
2-10干燥过程drying process: !:3.D,
2-11加热温度heating temperature: w<NyV8-hL
2-12干燥温度temperature of the material being dried : xq[Yg15d%
2-13干燥损失loss of material during the drying process : UV AJxqz%}
2-14飞尘lift off (particles): Q`ME@vz
2-15堆层厚度thickness of the material: |quij0_'e
=rFN1M/n{E
3.冷冻干燥 \+m$
3-1冷冻freezing: $SY]fNJQ
(1).静态冷冻static freezing: =:=/Gz1
(2).动态冷冻dynamic freezing: o&SSvW
(3).离心冷冻centrifugal freezing: n?xTkkr0
(4).滚动冷冻shell freezing: [syj#
(5).旋转冷冻spin-freezing: j}f[W [2
(6).真空旋转冷冻vacuum spin-freezing:
c5% 6Y2W0
(7).喷雾冷冻spray freezing: wRvb8F0
(8).气流冷冻air blast freezing: ,<`)>2 'o
3-2冷冻速率rate of freezing: QkQ!Ep(
3-3冷冻物料frozen material: 86
.`T l;
3-4冰核ice core:
]Oeh=gq
3-5干燥物料外壳envelope of dried matter: YcDe@Zuwn
3-6升华表面sublimation front: w0lT%CPx
3-7融化位置freezer burn: np9dM
j:,9%tg
4.真空干燥设备;真空冷冻干燥设备 /7"I#U^u/
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: B&0;4
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: Yh<WA>=
4-3加热表面heating surface: *O~e
T
4-4物品装载面shelf : =9wy/c$
4-5干燥器的处理能力throughput (of the vacuum drying chamber): lioc`C:
4-6单位面积干燥器处理能力throughput per shelf area: !t#F/C
4-7冰冷凝器ice condenser: g)"gw+ZFc
4-8冰冷凝器的负载load of the ice condenser: Cu;5RSr2Z
4-9冰冷凝器的额定负载rated load of the ice condenser %aRT>_6"
8. 1.一般术语 =r2]uW9
1-1试样sample : L2UsqVU
(1).表面层surface layer: g}LAks
(2).真实表面true surface: M@et6aud;K
(3).有效表面积effective surface area: =qy@Wvj$
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: 2JGL;U$
(5).表面粒子密度surface particle density: iUi>y.}"P
(6).单分子层monolayer: soRv1) el
(7).表面单分子层粒子密度monolayer density: D{8PQ2x>
(8).覆盖系数coverage ratio: Smw QET<H
1-2激发excitation: 4T6 {Y
(1).一次粒子primary particle: Q\ppfc{,
(2).一次粒子通量primary particle flux: /] ^#b
(3).一次粒子通量密度density of primary particle flux: L{-LX=G^
(4).一次粒子负荷primary particle load: saf&dd
(5).一次粒子积分负荷integral load of primary particle: W~1~k{A
(6).一次粒子的入射能量energy of the incident primary particle: $'rG-g!f\
(7).激发体积excited volume: ]}|byo
(8).激发面积excited area: as yZe
(9).激发深度excited death: ia @'%8
(10).二次粒子secondary particles: >Gml4vGK
(11).二次粒子通量secondary particle flux: I#F!N6;
(12).二次粒子发射能energy of the emitted secondary particles: 'k0[rDFc#3
(13).发射体积emitting volume: W !w, f;
(14).发射面积emitting area: dP?Ge}
(15).发射深度emitting depth: YyAJ m^o
(16).信息深度information depth: l e4?jQQ@L
(17).平均信息深度mean information depth: m,i,n9C->
1-3入射角angle of incidence: a' Ki;]q
1-4发射角angle of emission: Fb22p6r
1-5观测角observation: *g}Yw
1-6分析表面积analyzed surface area: \wcam`f
1-7产额 yield : %
2$/JZ
1-8表面层微小损伤分析minimum damage surface analysis: 9I27TKy
1-9表面层无损伤分析non-destructive surface analysis: D"(L5jR8m@
1-10断面深度分析 profile analysis in depth; depth profile analysis : ^DeERB
1-11可观测面积observable area: ^hNgm.I
1-12可观测立体角observable solid angle : U4f5xUY0)
1-13接受立体角;观测立体角angle of acceptance: ZYU=\
1-14角分辨能力angular resolving power: a7zcIwk
'{
1-15发光度luminosity: !U9|x\BqJ2
1-16二次粒子探测比detection ratio of secondary particles: B~]5$-
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: KqBk~-G
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: xsd_Uu*
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: d@`M
CchCB
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis:
{vUN+We
1-21本底压力base pressure: u0aJu
1-22工作压力working pressure: [[PEa-992
gVQjL+_W
2.分析方法 $3`>{3x$
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: S#)Eom?V
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : *n"/a{6>
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: SDu#Yt&mhh
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: D]w!2k%V
2-3离子散射表面分析ion scattering spectroscopy: mMsTyM-f
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: 5^']+5_vb
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: Tc8un.
2-6离子散射谱仪ion scattering spectrometer: #e'
}.4cr
2-7俄歇效应Auger process: 5`
Te\H
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: d
;vT ~;
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: i1H\#;`$
2-10光电子谱术photoelectron spectroscopy : Eskb9^A
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: M@ed>.
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: -~?J+o+Pr"
2-11光电子谱仪photoelectron spectrometer: IDnC<