“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 D$YAi%*H
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真空术语 zVGjXuNa
B[S.6"/H
1.标准环境条件 standard ambient condition: -]+XTsL
2.气体的标准状态 standard reference conditions forgases: [j
'Ogm7"
3.压力(压强)p pressure: U@ALo
4.帕斯卡Pa pascal: gupB8 .!
5.托Torr torr: *P61q\2Z
6.标准大气压atm standard atmosphere: y@nWa\iG
7.毫巴mbar millibar: C ])Q#!D|
8.分压力 partial pressure: 9hmCvQgtf
9.全压力 total pressure: Olj]A]v}
10.真空 vacuum: ,B5Ptf#
11.真空度 degree of vacuum: O->i>d
12.真空区域 ranges of vacuum: 6IctW5b
13.气体 gas: h<Yn0(.
14.非可凝气体 non-condensable gas: \Y
Cj/tG8
15.蒸汽vapor: ~V`D@-VND
16.饱和蒸汽压saturation vapor pressure: "SNsOf
17.饱和度degree of saturation: $P866F
18.饱和蒸汽saturated vapor: ed'}ReLK
19.未饱和蒸汽unsaturated vapor: -,TBUWg
20.分子数密度n,m-3 number density of molecules: X']>b
21.平均自由程ι、λ,m mean free path: Mpk^e_9`<
22.碰撞率ψ collision rate: SV<*qz
23.体积碰撞率χ volume collision rate: l0U6eOx
24.气体量G quantity of gas: 5y(irbk7
25.气体的扩散 diffusion of gas: Q= + Frsk
26.扩散系数D diffusion coefficient; diffusivity: 1_fFbb"
27.粘滞流 viscous flow: xv$^%(Ujp
28.粘滞系数η viscous factor: zv@'x
nY]
29.泊肖叶流 poiseuille flow: o*qEAy?
30.中间流 intermediate flow: YQ,IdWav
31.分子流 molecular flow: W ;P1T"*A
32克努曾数 number of knudsen: c72Oy+#
33.分子泻流 molecular effusion; effusive flow: q[M7)-
34.流逸 transpiration: c~5#)AXMT
35.热流逸 thermal transpiration: 6zRJ5uI,/
36.分子流率qN molecular flow rate; molecular flux: p$?c>lim
37.分子流率密度 molecular flow rate density; density of molecular flux: mIFS/C
38.质量流率qm mass flow rare: ?OZbns~
39.流量qG throughput of gas: _8 vxb
40.体积流率qV volume flow rate: MeQ(,irr^
41.摩尔流率qυ molar flow rate: r?{Vqephz
42.麦克斯韦速度分布 maxwellian velocity distribution: B
0 K2Uw
43.传输几率Pc transmission probability: D8m?`^Zz
44.分子流导CN,UN molecular conductance: \CUxGyu
45.流导C,U conductance: 7KRc^ *pZs
46.固有流导Ci,Ui intrinsic conductance: $C9<{zX
47.流阻W resistance: K[~Wj8W0
48.吸附 sorption: r;|Bc$P
49.表面吸附 adsorption: ~-']Q0Z
50.物理吸附physisorption: IH\k_Yf#u
51.化学吸附 chemisorption: O<6/0ub&+h
52.吸收absorption: jph~g*Z
53.适应系数α accommodation factor: F#X\}MvEU
54.入射率υ impingement rate: }2`S@Rq.WW
55.凝结率condensation rate: *VHBTO9
56.粘着率 sticking rate: +FY-r[_~
57.粘着几率Ps sticking probability: )6bxP&k
58.滞留时间τ residence time: h,FP,w;G
59.迁移 migration: ^>%=/RX
60.解吸 desorption: "{z9 L+
61.去气 degassing: 1G.+)*:3
62.放气 outgassing: 5CU< ?
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: g+ 2SB5 2D
64.蒸发率 evaporation rate: B
susXW$
65.渗透 permeation: ^3=8*Xr
66.渗透率φ permeability: mKe{y.
67.渗透系数P permeability coefficient VZAdc*X
2. 1.真空泵 vacuum pumps Gk[P-%%b /
1-1.容积真空泵 positive displacement pump: 5Hr(9)
⑴.气镇真空泵 gas ballast vacuum pump: <R GRvv
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: jvu,W4
⑶.干封真空泵 dry-sealed vacuum pump: &CUkR6
⑷.往复真空泵 piston vacuum pump: }{K)5k@
⑸.液环真空泵 liquid ring vacuum pump: <>j,Q
⑹.旋片真空泵 sliding vane rotary vacuum pump: YgM6z K~
⑺.定片真空泵 rotary piston vacuum pump: :6HMb^4
⑻.滑阀真空泵 rotary plunger vacuum pump: et9c<'
⑼.余摆线真空泵 trochoidal vacuum pump: D|e 6$O5o
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: ~@'|R%jJ
⑾.罗茨真空泵 roots vacuum pump: oC4rL\d{
1-2.动量传输泵 kinetic vacuum pump: U-WrZ|-
⑴.牵引分子泵molecular drag pump: cLR8U1k'
⑵.涡轮分子泵turbo molecular pump: ngm7Vs
⑶.喷射真空泵ejector vacuum pump: A8Jbl^7E+
⑷.液体喷射真空泵liquid jet vacuum pump: & RROra
⑸.气体喷射真空泵gas jet vacuum pump: h(G&X9*
⑹.蒸汽喷射真空泵vapor jet vacuum pump : < "~k8:=4
⑺.扩散泵diffusion pump : n8:2Z>
⑻.自净化扩散泵self purifying diffusion pump: Cs]xs9
⑼.分馏扩散泵 fractionating diffusion pump : P92:}" )*>
⑽.扩散喷射泵diffusion ejector pump : "H G:by
⑾.离子传输泵ion transfer pump: 5~rs55W
1-3.捕集真空泵 entrapment vacuum pump: f_Wn[I{
⑴吸附泵adsorption pump: nF=Ig-NX^
⑵.吸气剂泵 getter pump: /f# rN_4
⑶.升华(蒸发)泵 sublimation (evaporation)pump : H.>KYiv+
⑷.吸气剂离子泵getter ion pump: l" sR\`~
⑸.蒸发离子泵 evaporation ion pump: :-6_X<
⑹.溅射离子泵sputter ion pump: {< kl)}
⑺.低温泵cryopump: ?nt6vqaV
Uj!L:u2b
2.真空泵零部件 |9_e2OwH
2-1.泵壳 pump case: "UAW
2-2.入口 inlet: 58v5Z$%--
2-3.出口outlet: R0/~)
P
2-4.旋片(滑片、滑阀)vane; blade : \[D"W{9l
2-5.排气阀discharge valve: 0hNc#x6
2-6.气镇阀gas ballast valve: b%)a5H(
2-7.膨胀室expansion chamber: M2oKLRt)L
2-8.压缩室compression chamber: Pc4sReo'
2-9.真空泵油 vacuum pump oil: rcyH2)Y/e
2-10.泵液 pump fluid: Q2fa]*Z5
2-11.喷嘴 nozzle: GGLVv)
2-13.喷嘴扩张率nozzle expansion rate: wkIH<w|jb
2-14.喷嘴间隙面积 nozzle clearance area : aX~iY ~?_
2-15.喷嘴间隙nozzle clearance: [6/%ynlP
2-16.射流jet: =3(
ZUV X
2-17.扩散器diffuser: ;c;;cJc!
2-18.扩散器喉部diffuser thoat: WrG)&&d
2-19.蒸汽导管vapor tube(pipe;chimney): 9]7^/g*!
2-20.喷嘴组件nozzle assembly: YEZ"BgUnbp
2-21.下裙skirt: 0&mz'xra
!MGQ+bD6
3.附件 5,mb]v0k
3-1阱trap: 5k\61(*s
⑴.冷阱 cold trap: `q5*VqIhs
⑵.吸附阱sorption trap: Z>X-u eV
⑶.离子阱ion trap: 54'z"S:W
⑷.冷冻升华阱 cryosublimation trap: W5yqnjK
$4
3-2.挡板baffle: `[:f;2(@
3-3.油分离器oil separator: sxuYwQ
3-4.油净化器oil purifier: 6~2!ZU
3-5.冷凝器condenser: G4=v2_]
UnO -?
4.泵按工作分类 RWoa'lnu
4-1.主泵main pump: W}Z|v
M$
4-2.粗抽泵roughing vacuum pump: "C0oFRk
4-3.前级真空泵backing vacuum pump: : 0%V:B
4-4.粗(低)真空泵 roughing(low)vacuum pump: U|y+k`
4-5.维持真空泵holding vacuum pump: A!j&g(Z"Q
4-6.高真空泵high vacuum pump: cy}2~w&s4
4-7.超高真空泵ultra-high vacuum pump: '7E?|B0],
4-8.增压真空泵booster vacuum pump: {WC{T2:8
QGYmQ9m{kL
5.真空泵特性 "0]i4d1l
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: :ox+WY
5-2.真空泵的抽气量Q throughput of vacuum pump:。 7d9%L}+q
5-3.起动压力starting pressure: ,ur_n7+LH
5-4.前级压力 backing pressure : jmAWto}.
5-5.临界前级压力 critical backing pressure: D&]SPhX
5-6.最大前级压力maximum backing pressure: q'1rSK
5-7.最大工作压力maximum working pressure: gN(8T_r
5-8.真空泵的极限压力ultimate pressure of a pump: #|gt(p]C
5-9.压缩比compression ratio: tt`b+NOH>
5-10.何氏系数Ho coefficient: 8WaVs 6
5-11.抽速系数speed factor: @=@WRPGM*9
5-12.气体的反扩散back-diffusion of gas: Ao=.=0os
5-13.泵液返流back-streaming of pump fluid: rt."P20T
5-14.返流率back-streaming rate $_<,bC1[
5-15.返迁移back-migration: g y&B"`
5-16.爆腾bumping: q5QYp
5-17.水蒸气允许量qm water vapor tolerable load: ymzlRs1^Ct
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: y&SueU=
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: *xt3mv/<z
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump y=q\1~] Z
3. 1.一般术语 1'}~;?_
1-1.压力计pressure gauge: G#K=n
1-2.真空计vacuum gauge: eyUo67'7
⑴.规头(规管)gauge head: xy[R9_V
⑵.裸规nude gauge : o,u-%
⑶.真空计控制单元gauge control unit : $%sOL(
r
⑷.真空计指示单元gauge indicating unit : 8wwD\1pLS
`F(KM '
2.真空计一般分类 &{"aD&
2-1.压差式真空计differential vacuum gauge: k+%6:r,r&
2-2.绝对真空计 absolute vacuum gauge: &grT}
2-3.全压真空计total pressure vacuum gauge: Q7f\ 5QjT
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: ,AWN *OS
2-5.相对真空计relative vacuum gauge : O~ w&4F;{
347p2sK>
3.真空计特性 R`A@F2
3-1.真空计测量范围pressure range of vacuum gauge: @Vc*JEW
3-2.灵敏度系数sensitivity coefficient: RV7l=G9tq
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): `2UzJ~
3-5.规管光电流photon current of vacuum gauge head: gNN{WFHQX:
3-6.等效氮压力equivalent nitrogen pressure : P b2exS(
3-7.X射线极限值 X-ray limit: 7pmhH%Dn$
3-8.逆X射线效应anti X-ray effect: t&0pE(MO/
3-9.布利尔斯效应blears effect: lcyan
IU/dY`J1
4.全压真空计 vA:1z$m
4-1.液位压力计liquid level manometer: $^d,>hJi
4-2.弹性元件真空计elastic element vacuum gauge: WOR~tS
4-3.压缩式真空计compression gauge: fY$M**/,
4-4.压力天平pressure balance: XkOsnI8n
4-5.粘滞性真空计viscosity gauge : ;#cb%e3
4-6.热传导真空计thermal conductivity vacuum gauge : OZs^c2
W
4-7.热分子真空计thermo-molecular gauge: xR\$2(
4-8.电离真空计ionization vacuum gauge:
x.~Z9j
4-9.放射性电离真空计radioactive ionization gauge: fD]}&xc
4-10.冷阴极电离真空计cold cathode ionization gauge: 8`kK)iCq
4-11.潘宁真空计penning gauge: i\2~yXw\
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: DNC2]kS<
4-13.放电管指示器discharge tube indicator: `/8Dmg
4-14.热阴极电离真空计hot cathode ionization gauge: ytKh[Uo
4-15.三极管式真空计triode gauge: !A, ]
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: Z$~Wr3/
4-17.B-A型电离真空计Bayard-Alpert gauge: JZ]4?_l
4-18.调制型电离真空计modulator gauge: PW~+=,
4-19.抑制型电离真空计suppressor gauge: YrL:!\p.
4-20.分离型电离真空计extractor gauge: C/\)-^
4-21.弯注型电离真空计bent beam gauge: -]\UFR
4-22.弹道型电离真空计 orbitron gauge : z* "zXLC
4-23.热阴极磁控管真空计hot cathode magnetron gauge: fOtL6/?
u-$(TyDEl|
5.分压真空计(分压分析器) y08.R.
l
5-1.射频质谱仪radio frequency mass spectrometer: \f5$L`
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: ZM`6zS!
5-3.单极质谱仪momopole mass spectrometer: Zchs/C 9{
5-4.双聚焦质谱仪double focusing mass spectrometer: >A;Mf*E
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: %!mJnc%
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: `rN,*kcP
5-7.回旋质谱仪omegatron mass spectrometer: 7H %>\^A^
5-8.飞行时间质谱仪time of flight mass spectrometer: Xk8+m>
Oca_1dlx
6.真空计校准 z}&?^YU*)`
6-1.标准真空计reference gauges: b*\K I
6-2.校准系统system of calibration: Lo5itW
6-3.校准系数K calibration coefficient: '%vb&a!.6
6-4.压缩计法meleod gauge method: {m.l{<H
6-5.膨胀法expansion method: vT#zc)j
6-6.流导法flow method: ?|s1Cuc
4. 1.真空系统vacuum system hOx'uO`x(
1-1.真空机组pump system: Gt3V}"B3\
1-2.有油真空机组pump system used oil : `lX |yy"
1-3.无油真空机组oil free pump system *$1M=$
1-4.连续处理真空设备continuous treatment vacuum plant: )
wtVFG
1-5.闸门式真空系统vacuum system with an air-lock: 7Ps I'1v
1-6.压差真空系统differentially pumped vacuum system: wt0^R<28
1-7.进气系统gas admittance system: y0k*iS
e
^1sX22k
2.真空系统特性参量 tpwMy:<Ex
2-1.抽气装置的抽速volume flow rate of a pumping unit :
K[!OfP
2-2.抽气装置的抽气量throughput of a pumping unit : *7u~`
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: Ne!F
p
2-4.真空系统的漏气速率leak throughput of a vacuum system: s<Px au+A
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: B2w\
2-6.极限压力ultimate pressure: ^V#9{)B
2-7.残余压力residual pressure: .&:y+Oww~
2-8.残余气体谱residual gas spectrum: =ZR9zL=h
2-9.基础压力base pressure: # -e
2-10.工作压力working pressure: ;[V_w/-u
2-11.粗抽时间roughing time: XkLl (uyh
2-12.抽气时间pump-down time: $w4%JBZr
2-13.真空系统时间常数time constant of a vacuum system: #Drs=7w
2-14.真空系统进气时间venting time: KCu @5`p
>>oR@
3.真空容器 J6r"_>)z
3-1.真空容器;真空室vacuum chamber: [%7y !XD
3-2.封离真空装置sealed vacuum device: 3z';Zwz &X
3-3.真空钟罩vacuum bell jar: +[Cdd{2
3-4.真空容器底板vacuum base plate: FKRO0%M4}Z
3-5.真空岐管vacuum manifold: Y /$`vgqs
3-6.前级真空容器(贮气罐)backing reservoir: <ZGEmQ
3-7.真空保护层outer chamber: `@1y|j:m
3-8.真空闸室vacuum air lock: l$N
b1&
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: ;T0F1
D;VQoO
4.真空封接和真空引入线 ywWF+kR_
4-1.永久性真空封接permanent seal : INtt0Cm9"
4.2.玻璃分级过渡封接graded seal : Yt*2/jw^
4-3.压缩玻璃金属封接compression glass-to-metal seal: K(@QKRZ7[
4-4.匹配式玻璃金属封接matched glass-to-metal seal: XJ,P8nx
4-5.陶瓷金属封接ceramic-to-metal seal: ^L#\z7
4-6.半永久性真空封接semi-permanent seal : ~'>RK
4-7.可拆卸的真空封接demountable joint: `]%\Y>(a}
4-8.液体真空封接liquid seal ^wN x5t
4-9.熔融金属真空封接molten metal seal: :ZG^`H/X1d
4-10.研磨面搭接封接ground and lapped seal: k]?M^jrm
4-11.真空法兰连接vacuum flange connection: A`_(L|~
4-12.真空密封垫vacuum-tight gasket: ^PA[fL"
4-13.真空密封圈ring gasket: \9k$pC+l
4-14.真空平密封垫flat gasket: DID&fj9m
4-15.真空引入线feedthrough leadthrough: 7fRL'I#[@
4-16.真空轴密封shaft seal: |:yQOq|
4-17.真空窗vacuum window: ?|!167/O
4-18.观察窗viewing window: WvSh i=
5(e?,B }
5.真空阀门
Z)}q=NjA
5-1.真空阀门的特性characteristic of vacuum valves: =5=D)x~
⑴.真空阀门的流导conductance of vacuum valves: /xf4*zr
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: m| 8%%E}d
5-2.真空调节阀regulating valve: 4bXAA9"
5-3.微调阀 micro-adjustable valve: b*$/(2"m
5-4.充气阀charge valve: (}E-+:vFU
5-5.进气阀gas admittance valve: at7|r\`?-
5-6.真空截止阀break valve: )#ze
5-7.前级真空阀backing valve: Zkl:^!*
5-8.旁通阀 by-pass valve: `.>5H\w0e
5-9.主真空阀main vacuum valve: `s74g0h
5-10.低真空阀low vacuum valve: EGMj5@>
5-11.高真空阀high vacuum valve: E><!Owxt/
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: Y^5X>
5-13.手动阀manually operated valve: clfi)-^{K
5-14.气动阀pneumatically operated valve: rx`G*k{X
5-15.电磁阀electromagnetically operated valve: "j|}-a
5-16.电动阀valve with electrically motorized operation: nsR^TD;
5-17.挡板阀baffle valve: @?ntMh6
5-18.翻板阀flap valve: XgY( Vv
5-19.插板阀gate valve: yH_L<n
5-20.蝶阀butterfly valve: +SCUS]
T{=.mW^ x
6.真空管路 mw}obblR
6-1.粗抽管路roughing line: Zur7"OkQ
6-2.前级真空管路backing line: T8Sgu6:*R
6-3.旁通管路;By-Pass管路 by-pass line: G"!YV#"~
6-4.抽气封口接头pumping stem: - bL
7M5
6-5.真空限流件limiting conductance: ^$3 ~;/|
6-6.过滤器filter:
PRmZ3
5. 1.一般术语 !1<x@%
1-1真空镀膜vacuum coating: ),`MAevp
1-2基片substrate: G#V5E)Dx
1-3试验基片testing substrate: 5wXe^G
1-4镀膜材料coating material: ,Ie~zZE&
1-5蒸发材料evaporation material: 4eb<SNi
1-6溅射材料sputtering material: g*8LdH6mq
1-7膜层材料(膜层材质)film material: a(CZGIB
1-8蒸发速率evaporation rate: x)<5f|j
1-9溅射速率sputtering rate: pGw|T~e%
1-10沉积速率deposition rate: pNpj, H*4
1-11镀膜角度coating angle: B.fLgQK0
}D.?O,ue
2.工艺 5vIuH+0
2-1真空蒸膜vacuum evaporation coating: t!^FWr&
(1).同时蒸发simultaneous evaporation: 5xW)nEV
(2).蒸发场蒸发evaporation field evaporation: m'1NZV%#
(3).反应性真空蒸发reactive vacuum evaporation: rN?
L8
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: .K^'Q|?
(5).直接加热的蒸发direct heating evaporation: @'[w7HsJ
(6).感应加热蒸发induced heating evaporation: gOw|s1`2,
(7).电子束蒸发electron beam evaporation: }8WpX2U
(8).激光束蒸发laser beam evaporation: E&0A W{
(9).间接加热的蒸发indirect heating evaporation: N^|r.J
(10).闪蒸flash evaportion: cqeId&Cg
2-2真空溅射vacuum sputtering: 2^Gl;3
(1).反应性真空溅射 reactive vacuum sputtering: n`f},.NM|
(2).偏压溅射bias sputtering: [;dWFG"f
(3).直流二级溅射direct current diode sputtering: X?$Eb
(4).非对称性交流溅射asymmtric alternate current sputtering: }|f\'S
(5).高频二极溅射high frequency diode sputtering: )>at]mH
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: 'T[=Uuj"
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: %kD WUJZ
(8).离子束溅射ion beam sputtering: YlOYgr^
(9).辉光放电清洗glow discharge cleaning: g92M\5
x9
2-3物理气相沉积PVD physical vapor deposition: M0o=bYI
2-4化学气相沉积CVD chemical vapor deposition: (omdmT%D
2-5磁控溅射magnetron sputtering: 9\TvX!)h
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: _J&u{
2-7空心阴极离子镀HCD hollow cathode discharge deposition: Y">tfLIL_
2-8电弧离子镀arc discharge deposition: h./cs'&
GSV,
3.专用部件 eG# (9
3-1镀膜室coating chamber: Sw#Ez-X
3-2蒸发器装置evaporator device: &nn!{S^
3-3蒸发器evaporator: YU76(S9 0#
3-4直接加热式蒸发器evaporator by direct heat: xTD6?X'4
3-5间接加热式蒸发器evaporator by indirect heat: YkPz ~;
3-7溅射装置sputtering device: S$%/9^\jF
3-8靶target: u]E% R&
3-10时控挡板timing shutter: $Z10Zf=
3-11掩膜mask: 0]8+rWp|Nz
3-12基片支架substrate holder: `]]gD EPG{
3-13夹紧装置clamp: ]Ke|wRQD
3-14换向装置reversing device: &.kg8|s{
3-15基片加热装置substrate heating device: f&`v-kiAn=
3-16基片冷却装置substrate colding device: {114
[
m'k`p5[=h
4.真空镀膜设备 Tv3 ZNh
4-1真空镀膜设备vacuum coating plant: doc5;?6
(1).真空蒸发镀膜设备vacuum evaporation coating plant: !=&]#-;b
(2).真空溅射镀膜设备vacuum sputtering coating plant: oD{V_/pdx
4-2连续镀膜设备continuous coating plant: /Re1QS
4-3半连续镀膜设备semi- continuous coating plant &\sg~
6. 1.漏孔 $$ _ uQf
1-1漏孔leaks: avO+1<`4B
1-2通道漏孔channel leak: *sJx0<!M}
1-3薄膜漏孔membrane leak: \Qk:\aLR
1-4分子漏孔molecular leak: qa^x4xZM
1-5粘滞漏孔vixcous leak: r_)-NOp
1-6校准漏孔calibrated leak: mm#U a/~1u
1-7标准漏孔reference leak : R$,`}@VqZ3
1-8虚漏virtual leak: 2!68W
X
1-9漏率leak rate: E\m?0]W|
1-10标准空气漏率standard air leak rate: w])~m1yW
1-11等值标准空气漏率equivalent standard air leak rate: }J`{g/
1-12探索(示漏)气体: \<lV),
rF~q"9
2.本底 Zy*}C,Z
2-1本底background: ::H jpM
2-2探索气体本底search gas background : 86%weU/*
2-3漂移drift: ~ezCE4^&
2-4噪声noise: ie.cTTOI
(-dJ0!
3.检漏仪 :Yz.Bfli
3-1检漏仪leak detector: WtRy~5A2
3-2高频火花检漏仪H.F. spark leak detector: \TMRS(
3-3卤素检漏仪halide leak detector: @D"|Jq=6P
3-4氦质谱检漏仪helium mass spectrometer leak detector: [&3"kb
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: w5|@vB/pj
PYz| d
4.检漏 K&|zWpb
4-1气泡检漏leak detection by bubbles: w4L\@y3
4-2氨检漏leak detection by ammonia: SmR*b2U
4-3升压检漏leak detection of rise pressure: ixKQh};5/
4-4放射性同位素检漏radioactive isotope leak detection: (OG@]|-
4-5荧光检漏fluorescence leak detection b:O4d<+%
7. 1.一般术语 |?8CV\D!
1-1真空干燥vacuum drying: -IX;r1UD
1-2冷冻干燥freeze drying :
iI
^{OD
1-3物料material: eazP'(rc
1-4待干燥物料material to be dried: e:7aVOm
1-5干燥物料dried material : uDoSe^0
1-6湿气moisture;humidity: ["L?t ^*G
1-7自由湿气free moisture: yp*kMC,3
1-8结合湿气bound moisture: Ue,"CQ6H
1-9分湿气partial moisture: V;:A&
1-10含湿量moisture content: HKxrBQr78
1-11初始含湿量initial moisture content: x~{m%)I
1-12最终含湿量final residual moisture: ,RT\&Ze5
1-13湿度degree of moisture ,degree of humidity : T@vVff
1-14干燥物质dry matter : YYM
1-15干燥物质含量content of dry matter: A1'IK.
@~N#)L^
2.干燥工艺 }<Me%`x"
2-1干燥阶段stages of drying : wK\SeX
(1).预干燥preliminary dry: q?0goL
(2).一次干燥(广义)primary drying(in general): 0?`#ko7~d
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): a9qZI
(4).二次干燥secondary drying: O-'T*M>
2-2.(1).接触干燥contact drying: Ahwu'mgnC
(2).辐射干燥 drying by radiation : Hd2_Cg FB
(3).微波干燥microwave drying: XqwdJND
(4).气相干燥vapor phase drying: r}5GJ|p0
(5).静态干燥static drying: e4`KnHsL
(6).动态干燥dynamic drying: _9gn;F
2-3干燥时间drying time: _|Dt6
2-4停留时间length of stay(in the drying chamber): jyT(LDsS
2-5循环时间cycle time: 1)Ag|4
2-6干燥率 dessication ratio : c`jTdVD
2-7去湿速率mass flow rate of humidity: ,`Mlo
2-8单位面积去湿速率mass flow rate of humidity per surface area: )eG&"3kFe!
2-9干燥速度 drying speed : #M>E{w9
2-10干燥过程drying process: =VSieh
2-11加热温度heating temperature: ^IId
=V=2
2-12干燥温度temperature of the material being dried : 9q5[W=|
2-13干燥损失loss of material during the drying process : 1%:A9%O)t
2-14飞尘lift off (particles): p_nrua?
2-15堆层厚度thickness of the material: AP~!YwLW
Pb`sn5;
3.冷冻干燥 0y1t%C075
3-1冷冻freezing: 50Jr(OeU<
(1).静态冷冻static freezing: w##Fpv<m
(2).动态冷冻dynamic freezing: wvYxL
c#p0
(3).离心冷冻centrifugal freezing: TDseWdA
(4).滚动冷冻shell freezing: .5z|g@
6
(5).旋转冷冻spin-freezing: \ lKQ'_
(6).真空旋转冷冻vacuum spin-freezing: GkO6r'MVE
(7).喷雾冷冻spray freezing: wb?hfe
(8).气流冷冻air blast freezing: D|BN_ai9
3-2冷冻速率rate of freezing: ZN1p>+oY!
3-3冷冻物料frozen material: VcL
3-4冰核ice core: ?=G H{
%E
3-5干燥物料外壳envelope of dried matter: g-s@m}[T
3-6升华表面sublimation front: (Zn\S*_@/
3-7融化位置freezer burn: sd6Wmmo
d"cfSH;h
4.真空干燥设备;真空冷冻干燥设备 pJ(l=a
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: .edZKmC6
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: !K2[S
J
4-3加热表面heating surface: aD^MoB3
4-4物品装载面shelf :
Qi}LV"&L
4-5干燥器的处理能力throughput (of the vacuum drying chamber): 0T5>i 0/
4-6单位面积干燥器处理能力throughput per shelf area: ",+uvJT1O
4-7冰冷凝器ice condenser: }:irjeI,
4-8冰冷凝器的负载load of the ice condenser: r]S9z
4-9冰冷凝器的额定负载rated load of the ice condenser GwycSb1
8. 1.一般术语 -$q/7,os
1-1试样sample : I6fpXPP).
(1).表面层surface layer: {MtB!x
(2).真实表面true surface: buFtLPe
(3).有效表面积effective surface area: 2uTa}{/%
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: Yp)U'8{h c
(5).表面粒子密度surface particle density: )X/Faje
(6).单分子层monolayer: {P5@2u6S
(7).表面单分子层粒子密度monolayer density: i<?4iwX%i*
(8).覆盖系数coverage ratio: 9|`@czw
1-2激发excitation: SMFW]I2T/
(1).一次粒子primary particle: v3"xJN_,[p
(2).一次粒子通量primary particle flux: !O-+h0Z
(3).一次粒子通量密度density of primary particle flux: H-W)Tq_?-
(4).一次粒子负荷primary particle load: ~}AP@t*
(5).一次粒子积分负荷integral load of primary particle: o~K 2K5I
(6).一次粒子的入射能量energy of the incident primary particle: :I('xVNPz
(7).激发体积excited volume: d/&|%Z
r
(8).激发面积excited area: >N
J$ac
(9).激发深度excited death: o;mIu#u
(10).二次粒子secondary particles: g@k9w{_
(11).二次粒子通量secondary particle flux: t["Df;"O
(12).二次粒子发射能energy of the emitted secondary particles: j1<1D@UO
(13).发射体积emitting volume: m=}X$QF`^
(14).发射面积emitting area: \sd"iMEi
(15).发射深度emitting depth: Y
zS*p~|
(16).信息深度information depth: r\d:fot
(17).平均信息深度mean information depth: q#`^EqtUF
1-3入射角angle of incidence: m #QI*R
XP
1-4发射角angle of emission: JWL J<z
1-5观测角observation: ];;w/$zke
1-6分析表面积analyzed surface area: @45 H8|:k
1-7产额 yield : 5XI*I(.%/
1-8表面层微小损伤分析minimum damage surface analysis: B6\VxSX4{
1-9表面层无损伤分析non-destructive surface analysis: H\mVK!](D
1-10断面深度分析 profile analysis in depth; depth profile analysis : =fG8YZ(
1-11可观测面积observable area: LDeVNVM
1-12可观测立体角observable solid angle : E+zn\v
1-13接受立体角;观测立体角angle of acceptance: :$aW@?zAY
1-14角分辨能力angular resolving power: L@r.R_*H?s
1-15发光度luminosity: 17)M.(qmuP
1-16二次粒子探测比detection ratio of secondary particles: HW726K*
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: M[u3]dN
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: , ~xU>L^
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: "ru1 ;I
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: _KVB~loT
1-21本底压力base pressure: [Z\1"m
1-22工作压力working pressure: sVd_O[
qk,y |7p
2.分析方法 F |81i$R
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: %E"/]!}3
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : X.l"f'`l
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: yQ{_\t1Wd
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: J.2]km
2-3离子散射表面分析ion scattering spectroscopy: K=TW}ZO
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: Ko)T>8:
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: (B,t
1+%
2-6离子散射谱仪ion scattering spectrometer: @ ^cgq3H'
2-7俄歇效应Auger process: o%PoSZZ
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: +A ?+G
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: w s>Iyw.u
2-10光电子谱术photoelectron spectroscopy : 8M+F!1-#
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: E)wT+\
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: h)
PB
2-11光电子谱仪photoelectron spectrometer: KH>sCEt
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: f^sb0nU
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: ' 5 qL
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): irb.F>(x
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus