“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 ! a o6e
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真空术语 y_*n9
)Ct
[B,'=,Hbs
1.标准环境条件 standard ambient condition: tRteyNA
2.气体的标准状态 standard reference conditions forgases: i2*d+?Er
3.压力(压强)p pressure: BEWro|]cM
4.帕斯卡Pa pascal: j&WL*XP&5
5.托Torr torr: [EgW/\35
6.标准大气压atm standard atmosphere: SG:bM7*1'
7.毫巴mbar millibar: 7:TO\0]2n
8.分压力 partial pressure: FPF6H puV
9.全压力 total pressure: #zt*xS[{0
10.真空 vacuum: %(`#A.yaE
11.真空度 degree of vacuum: ]*3:DU
12.真空区域 ranges of vacuum: 2U}m RgJu
13.气体 gas: >Q=Ukn;k
14.非可凝气体 non-condensable gas: nLj&Uf&
15.蒸汽vapor: dx@QWTNE
16.饱和蒸汽压saturation vapor pressure: Cp^g'&
17.饱和度degree of saturation: U'y,YtF@
18.饱和蒸汽saturated vapor: 'a#mViPTQ)
19.未饱和蒸汽unsaturated vapor: `4V"s-T'
20.分子数密度n,m-3 number density of molecules: mRwT_(;t
21.平均自由程ι、λ,m mean free path: E"#Xc@
22.碰撞率ψ collision rate: v0#*X5C1'
23.体积碰撞率χ volume collision rate: *"cD.)]#2
24.气体量G quantity of gas: j)Y[4 ^k^
25.气体的扩散 diffusion of gas: .wy$-sG81
26.扩散系数D diffusion coefficient; diffusivity: 2+.18"rvi
27.粘滞流 viscous flow: vc8?I."?
28.粘滞系数η viscous factor: /ZW&0E
29.泊肖叶流 poiseuille flow: f@@s1gdb
30.中间流 intermediate flow: ? gSSli[
31.分子流 molecular flow: -Wc~B3E|
32克努曾数 number of knudsen: (?3[3w~
33.分子泻流 molecular effusion; effusive flow: FRZs[\I|iT
34.流逸 transpiration: 02\JzBU
35.热流逸 thermal transpiration: _dU8'H
36.分子流率qN molecular flow rate; molecular flux: yfEb
37.分子流率密度 molecular flow rate density; density of molecular flux: Dx-KMiQ,"(
38.质量流率qm mass flow rare: $*\L4<(
39.流量qG throughput of gas: .VM3D0aV
40.体积流率qV volume flow rate: qaVy.
41.摩尔流率qυ molar flow rate: ^aF8wbuZ
42.麦克斯韦速度分布 maxwellian velocity distribution: eEl.. y
43.传输几率Pc transmission probability: PB9/m-\H
44.分子流导CN,UN molecular conductance: %}&(h/= e
45.流导C,U conductance: I
:)W*SK
46.固有流导Ci,Ui intrinsic conductance: xx)-d,S
47.流阻W resistance: ?WpenUWk
48.吸附 sorption: J!TBREK
49.表面吸附 adsorption: |c2xy
50.物理吸附physisorption: bk<FL6z
z
51.化学吸附 chemisorption: WKl+{e
52.吸收absorption: @I-Lv5
53.适应系数α accommodation factor: V&ot3- Rf
54.入射率υ impingement rate: QTmZ(>z
55.凝结率condensation rate: 1J}8sG2`
56.粘着率 sticking rate: q; jiw#_
57.粘着几率Ps sticking probability: iY0>lDFm.
58.滞留时间τ residence time: DC Q^fZ/
59.迁移 migration: SDYv(^ f ,
60.解吸 desorption: 8)yI<`q6
61.去气 degassing: F$MX,,4U
62.放气 outgassing: / i_ @
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: P0Z!?`e=M
64.蒸发率 evaporation rate: /6+NU^
65.渗透 permeation: [/ M`
66.渗透率φ permeability: :I1_X
67.渗透系数P permeability coefficient hhI)' $
2. 1.真空泵 vacuum pumps (Yb[)m>fQ}
1-1.容积真空泵 positive displacement pump: jS<_ )
⑴.气镇真空泵 gas ballast vacuum pump: 'ZP)cI:+X
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: 831JwSR
⑶.干封真空泵 dry-sealed vacuum pump: bKDA!R2
⑷.往复真空泵 piston vacuum pump: Kw5Lhc1V
⑸.液环真空泵 liquid ring vacuum pump: f)Xr!7
⑹.旋片真空泵 sliding vane rotary vacuum pump: nFRsc'VT
⑺.定片真空泵 rotary piston vacuum pump: %rkk>m
⑻.滑阀真空泵 rotary plunger vacuum pump: ^tH#YlV4>9
⑼.余摆线真空泵 trochoidal vacuum pump: 58V[mlW)O0
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: b)#Oc,
⑾.罗茨真空泵 roots vacuum pump: c#/H:?q?a
1-2.动量传输泵 kinetic vacuum pump: \qh*E#j
⑴.牵引分子泵molecular drag pump: 5W? v'"
⑵.涡轮分子泵turbo molecular pump: "xJ 0 vlw
⑶.喷射真空泵ejector vacuum pump: #Q"O4 b:8
⑷.液体喷射真空泵liquid jet vacuum pump: qMYe{{r
⑸.气体喷射真空泵gas jet vacuum pump: HQP}w%8x
⑹.蒸汽喷射真空泵vapor jet vacuum pump : sTRJ:fR
⑺.扩散泵diffusion pump : I5m][~6.?
⑻.自净化扩散泵self purifying diffusion pump: .TJEUK
⑼.分馏扩散泵 fractionating diffusion pump : 7q=G&e7
⑽.扩散喷射泵diffusion ejector pump : 2&!bfq![
⑾.离子传输泵ion transfer pump: :4gLjzL
1-3.捕集真空泵 entrapment vacuum pump: gB'fFkd
⑴吸附泵adsorption pump: rN)V[5R#M
⑵.吸气剂泵 getter pump: O1&b]C#
⑶.升华(蒸发)泵 sublimation (evaporation)pump : &opd2
⑷.吸气剂离子泵getter ion pump: R(Kk{c:-@
⑸.蒸发离子泵 evaporation ion pump: o=J9
⑹.溅射离子泵sputter ion pump: SQ*k =4*r
⑺.低温泵cryopump: Hu3wdq
Ev"|FTI/
2.真空泵零部件 nC1zzFFJ
2-1.泵壳 pump case: vmTs9"ujF,
2-2.入口 inlet: tCG76LH
2-3.出口outlet: mEyK1h1G@
2-4.旋片(滑片、滑阀)vane; blade : Gq<X4C#|
2-5.排气阀discharge valve: Z6p5*+
2-6.气镇阀gas ballast valve: 8I;XS14Q
2-7.膨胀室expansion chamber: pCh2SQ(Q>
2-8.压缩室compression chamber: "XgmuSQ!
2-9.真空泵油 vacuum pump oil: C'yppl%
2-10.泵液 pump fluid: 'G\XXf%J
2-11.喷嘴 nozzle: C)'q
QvA
2-13.喷嘴扩张率nozzle expansion rate: u c7Eq45
2-14.喷嘴间隙面积 nozzle clearance area : u9+kLepOT
2-15.喷嘴间隙nozzle clearance: 8lF\v /vN
2-16.射流jet: 66x?A0P
2-17.扩散器diffuser: mm[2wfTE
2-18.扩散器喉部diffuser thoat: G;NF5`*4mc
2-19.蒸汽导管vapor tube(pipe;chimney): PO:"B6
2-20.喷嘴组件nozzle assembly: (;Y8pKl1e
2-21.下裙skirt: 05yZad*
;W>Cqg=
3.附件 [r+ZE7$2b"
3-1阱trap: bV8g|l-4(
⑴.冷阱 cold trap: BrRL7xX
⑵.吸附阱sorption trap: m5mu:
⑶.离子阱ion trap: O$/o'"@ /
⑷.冷冻升华阱 cryosublimation trap: H{J'#
9H
3-2.挡板baffle: 2{-ZD ,(u7
3-3.油分离器oil separator: 0Wa}<]:^
3-4.油净化器oil purifier: d8-A*W[
3-5.冷凝器condenser: 98=wnWX6$
fb8%~3i>
4.泵按工作分类 akw,P$i
4-1.主泵main pump: }Sy=My89r
4-2.粗抽泵roughing vacuum pump: !Z
VU,b>
4-3.前级真空泵backing vacuum pump: ;%tF58&
4-4.粗(低)真空泵 roughing(low)vacuum pump: kmzH'wktt
4-5.维持真空泵holding vacuum pump: DCqY|4Qc
4-6.高真空泵high vacuum pump: -*5Rnx|Y{
4-7.超高真空泵ultra-high vacuum pump: F}Vr:~
4-8.增压真空泵booster vacuum pump: *5 w{8
Z{&cuo.@<]
5.真空泵特性 D}8EER b
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: Eu"_MgD
5-2.真空泵的抽气量Q throughput of vacuum pump:。 N?Lb
5-3.起动压力starting pressure: rZ8`sIWQt
5-4.前级压力 backing pressure : Y0eE-5F,
5-5.临界前级压力 critical backing pressure: PkI:*\R
5-6.最大前级压力maximum backing pressure: dy_:-2S
5-7.最大工作压力maximum working pressure: MSf;ZB
5-8.真空泵的极限压力ultimate pressure of a pump: 8@so"d2e
5-9.压缩比compression ratio: g}@OUG"D
5-10.何氏系数Ho coefficient: w$JvB5O
5-11.抽速系数speed factor: N('&jHF
5-12.气体的反扩散back-diffusion of gas: >EY3/Go>
5-13.泵液返流back-streaming of pump fluid: ;b-XWK=
5-14.返流率back-streaming rate ]_N|L|]M
5-15.返迁移back-migration: cnTaJ/o
5-16.爆腾bumping: pz"0J_xDM
5-17.水蒸气允许量qm water vapor tolerable load: x.S3Zi}=
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: ~69&6C1Ch
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: *6q5S4 r
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump j?'GZ d"B
3. 1.一般术语 vVOh3{e|
1-1.压力计pressure gauge: 7uzkp&+:
1-2.真空计vacuum gauge: Omd .9
⑴.规头(规管)gauge head: y5!KX AQ%
⑵.裸规nude gauge : ;!yQ
⑶.真空计控制单元gauge control unit : B}^w_C2
⑷.真空计指示单元gauge indicating unit : 2}8v(%s p
XI^QF;,
2.真空计一般分类 dAuJXGo
2-1.压差式真空计differential vacuum gauge: $|8!BOx8t
2-2.绝对真空计 absolute vacuum gauge: l\i)$=d&g
2-3.全压真空计total pressure vacuum gauge: 41&\mx
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: KCs[/]
2-5.相对真空计relative vacuum gauge : B_.%i+ZZ
0Vx.nUQ
3.真空计特性 %7|9sQ:
3-1.真空计测量范围pressure range of vacuum gauge: &Xf}8^T<V
3-2.灵敏度系数sensitivity coefficient: YPxM<Gfa8
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): |ZmUNiAa
3-5.规管光电流photon current of vacuum gauge head: 7
qS""f7
3-6.等效氮压力equivalent nitrogen pressure : dkz=CY3p%X
3-7.X射线极限值 X-ray limit: q@{Bt{$x
3-8.逆X射线效应anti X-ray effect: i{`:(F5*
3-9.布利尔斯效应blears effect:
PUUwv_
7' Mm205\
4.全压真空计 |:gf lseE
4-1.液位压力计liquid level manometer: 2'w?\{}D
4-2.弹性元件真空计elastic element vacuum gauge: %KLpig
4-3.压缩式真空计compression gauge: 7j-4TY~
4-4.压力天平pressure balance: :>5@cvc
4-5.粘滞性真空计viscosity gauge : ,y#Kv|R
4-6.热传导真空计thermal conductivity vacuum gauge : 9iQq.$A .
4-7.热分子真空计thermo-molecular gauge: HAa;hb
4-8.电离真空计ionization vacuum gauge: y gz6C
4-9.放射性电离真空计radioactive ionization gauge: c24dSNJg,
4-10.冷阴极电离真空计cold cathode ionization gauge: $&n=$C&x
4-11.潘宁真空计penning gauge: r 8RoE`/T
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: qv!2MUw\j
4-13.放电管指示器discharge tube indicator: cz8T
4-14.热阴极电离真空计hot cathode ionization gauge: 2GDD!w#!j
4-15.三极管式真空计triode gauge: %xI p5h]
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: vQ
6^xvk]
4-17.B-A型电离真空计Bayard-Alpert gauge: r97pOs#5:
4-18.调制型电离真空计modulator gauge: ) AvN\sC
4-19.抑制型电离真空计suppressor gauge:
;{N!Eb`S
4-20.分离型电离真空计extractor gauge: %WjXg:R
4-21.弯注型电离真空计bent beam gauge: te-jfmu2
4-22.弹道型电离真空计 orbitron gauge : C&(N
I
4-23.热阴极磁控管真空计hot cathode magnetron gauge: do>wwgr
.[ICx
5.分压真空计(分压分析器) D9H?:pmv?
5-1.射频质谱仪radio frequency mass spectrometer: ^'PWI{ O
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: m+]K;}.}R
5-3.单极质谱仪momopole mass spectrometer: pOIJH =#
5-4.双聚焦质谱仪double focusing mass spectrometer: g,!L$,/F
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: #V~me
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: vg32y /l]S
5-7.回旋质谱仪omegatron mass spectrometer: M /"I2m
5-8.飞行时间质谱仪time of flight mass spectrometer: rX2.i7i,
u. F9g
#
6.真空计校准 z7fp#>uw
6-1.标准真空计reference gauges: AP 2_MV4W
6-2.校准系统system of calibration: UM"- nZ>[
6-3.校准系数K calibration coefficient: 0AL=S$B)
6-4.压缩计法meleod gauge method: 4O^xY
6m
6-5.膨胀法expansion method: -(;26\lE
6-6.流导法flow method: ek*rp`y]
4. 1.真空系统vacuum system *`5.|{<j{
1-1.真空机组pump system: t-tg-<
1-2.有油真空机组pump system used oil : _@
qjV~%Sy
1-3.无油真空机组oil free pump system *0Skd
1-4.连续处理真空设备continuous treatment vacuum plant: 52Z2]T
c,
1-5.闸门式真空系统vacuum system with an air-lock: L
[pBB
1-6.压差真空系统differentially pumped vacuum system: n FHUy9q
1-7.进气系统gas admittance system: :(P9mt
,is3&9
2.真空系统特性参量 W}@c|d $`
2-1.抽气装置的抽速volume flow rate of a pumping unit : qN9(S:_Px
2-2.抽气装置的抽气量throughput of a pumping unit : 3
/g~A{
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: V^bwXr4f
2-4.真空系统的漏气速率leak throughput of a vacuum system: DEKP5?]
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: $9_xGfx}
2-6.极限压力ultimate pressure: ?]_$Dcmx
2-7.残余压力residual pressure: wd8l$*F*
2-8.残余气体谱residual gas spectrum: -b9\=U[
2-9.基础压力base pressure: <KL,G};0pm
2-10.工作压力working pressure: |4;Fd9q^m
2-11.粗抽时间roughing time: `EA\u]PwQ
2-12.抽气时间pump-down time: wDal5GJp
2-13.真空系统时间常数time constant of a vacuum system: \/r}]Vz
2-14.真空系统进气时间venting time: H)kwQRfu
Fo5FNNiID
3.真空容器 o,\$ZxSlm
3-1.真空容器;真空室vacuum chamber: un mJbY;t
3-2.封离真空装置sealed vacuum device: 6
$4[gcL'
3-3.真空钟罩vacuum bell jar: '}53f2%gKa
3-4.真空容器底板vacuum base plate: 'uSn}hm
3-5.真空岐管vacuum manifold: -A^ _{4X
3-6.前级真空容器(贮气罐)backing reservoir: !C':
3-7.真空保护层outer chamber: dVtG/0
3-8.真空闸室vacuum air lock: 4yy>jXDG
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: g[' ^L+hd
-">;-3,K
4.真空封接和真空引入线 24 ' J
4-1.永久性真空封接permanent seal : XPXIg
4.2.玻璃分级过渡封接graded seal : r=
`Jn6@
4-3.压缩玻璃金属封接compression glass-to-metal seal: U2#"p
4-4.匹配式玻璃金属封接matched glass-to-metal seal: =
SMXDaH
4-5.陶瓷金属封接ceramic-to-metal seal: M6"PX *K
4-6.半永久性真空封接semi-permanent seal : !GjQPAW
4-7.可拆卸的真空封接demountable joint: *SJ_z(CZm
4-8.液体真空封接liquid seal @alK;\
4-9.熔融金属真空封接molten metal seal: ?=Z?6fw
4-10.研磨面搭接封接ground and lapped seal: Y.(PiuG$G
4-11.真空法兰连接vacuum flange connection: Uiw2oi&_
4-12.真空密封垫vacuum-tight gasket: C2kPMB=Xo
4-13.真空密封圈ring gasket: ( Y[Q,
4-14.真空平密封垫flat gasket: O3,jg|,
4-15.真空引入线feedthrough leadthrough: U)o-8OEZ9
4-16.真空轴密封shaft seal: hn
GZ=
4-17.真空窗vacuum window: &-)N'
4-18.观察窗viewing window: 8b&/k8i:
5{X<y#vAC0
5.真空阀门 lfow1WRF
5-1.真空阀门的特性characteristic of vacuum valves: Hk3sI-XkA
⑴.真空阀门的流导conductance of vacuum valves: Qz1E 2yJ
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat:
=4YhG;%
5-2.真空调节阀regulating valve: 0
1rK8jX
5-3.微调阀 micro-adjustable valve: |mfvr*7
5-4.充气阀charge valve: \;Biq`
5-5.进气阀gas admittance valve: /hR&8 `\\
5-6.真空截止阀break valve: >y7?-*0
5-7.前级真空阀backing valve: k(nW#*N_
5-8.旁通阀 by-pass valve: V~3a!-m\
5-9.主真空阀main vacuum valve: GR_-9}jQP
5-10.低真空阀low vacuum valve: D#C~pdp
5-11.高真空阀high vacuum valve: iOghb*aW
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: s/#!VnU6
5-13.手动阀manually operated valve: %YscBG
5-14.气动阀pneumatically operated valve: cOJo3p;&
5-15.电磁阀electromagnetically operated valve: zR:L!S
5-16.电动阀valve with electrically motorized operation: ITI)soa~
5-17.挡板阀baffle valve: rglXs
5-18.翻板阀flap valve: 'n3uu1C
5-19.插板阀gate valve: 6<QQ@5_
5-20.蝶阀butterfly valve: x|Bf-kc[#Q
FDs>m
#e
6.真空管路 sY&IquK^
6-1.粗抽管路roughing line: ! n@KU!&k
6-2.前级真空管路backing line: BX7kO0j
6-3.旁通管路;By-Pass管路 by-pass line: zwjgE6
6-4.抽气封口接头pumping stem: E{`fF8]K
6-5.真空限流件limiting conductance: XNkn|q2
6-6.过滤器filter: R
'zWYQ
5. 1.一般术语 X.{S*E:$u
1-1真空镀膜vacuum coating: 7`'Tb p
1-2基片substrate: oD.Cs'
1-3试验基片testing substrate: 0'C1YvF
1-4镀膜材料coating material: Ve; n}mJ?
1-5蒸发材料evaporation material: ;4|15S
1-6溅射材料sputtering material: q>+k@>bk@
1-7膜层材料(膜层材质)film material: m-#2n?
z-
1-8蒸发速率evaporation rate: sDlO#
1-9溅射速率sputtering rate: YU'E@t5
1-10沉积速率deposition rate: 8(~h"]`!
1-11镀膜角度coating angle: /nA{#HY
d\8l`Krs[_
2.工艺 \_f(M|
2-1真空蒸膜vacuum evaporation coating:
T(Eugl"
(1).同时蒸发simultaneous evaporation: )3EY;
(2).蒸发场蒸发evaporation field evaporation: E ~<JC"]
(3).反应性真空蒸发reactive vacuum evaporation: vA8nvoi
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: OQJ6e:BGt
(5).直接加热的蒸发direct heating evaporation: ukyZes8o K
(6).感应加热蒸发induced heating evaporation: e(t\g^X
(7).电子束蒸发electron beam evaporation: /82b S|
(8).激光束蒸发laser beam evaporation: +cN8Y}V
(9).间接加热的蒸发indirect heating evaporation: )+DmOsH
(10).闪蒸flash evaportion: M .mfw#*
2-2真空溅射vacuum sputtering: s;Q!X ?Q
(1).反应性真空溅射 reactive vacuum sputtering: Ad_hKO
(2).偏压溅射bias sputtering: XXa|BZ1RX
(3).直流二级溅射direct current diode sputtering: (f"4,b^]
(4).非对称性交流溅射asymmtric alternate current sputtering: AoxA+.O
(5).高频二极溅射high frequency diode sputtering: SO!8Di
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: VMWf>ZU
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: @K-">f
(8).离子束溅射ion beam sputtering: q(84+{>B
(9).辉光放电清洗glow discharge cleaning: t b}V5VH
2-3物理气相沉积PVD physical vapor deposition: "4{r6[dn
2-4化学气相沉积CVD chemical vapor deposition: S"H2 7
2-5磁控溅射magnetron sputtering: <RL]
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: Qvhl4-XjZa
2-7空心阴极离子镀HCD hollow cathode discharge deposition: Ysv"
6b}
2-8电弧离子镀arc discharge deposition: Y76gJ[yjn
5=ryDrx
3.专用部件 ZJiG!+-j
3-1镀膜室coating chamber: eJ-nKkg~a
3-2蒸发器装置evaporator device: `;egv*!P
3-3蒸发器evaporator: Cw&KVw*
3-4直接加热式蒸发器evaporator by direct heat: pEA:L$&
3-5间接加热式蒸发器evaporator by indirect heat: )Pv%#P-<
3-7溅射装置sputtering device: 0</);g}
3-8靶target: Y.p;1"
3-10时控挡板timing shutter: ^iV)MTT
3-11掩膜mask: tKXIk9e
3-12基片支架substrate holder: sFRQe]zCcP
3-13夹紧装置clamp: )9]P MA?u
3-14换向装置reversing device: 3u0RKLc\
3-15基片加热装置substrate heating device: cw
<l{A
3-16基片冷却装置substrate colding device: jmG~Un M
b&U62iq
4.真空镀膜设备 1?l1:}^L
4-1真空镀膜设备vacuum coating plant: ZbKg~jdF
(1).真空蒸发镀膜设备vacuum evaporation coating plant: KMax$
(2).真空溅射镀膜设备vacuum sputtering coating plant: \s\?l(ooq"
4-2连续镀膜设备continuous coating plant: ;!Fn1|)
4-3半连续镀膜设备semi- continuous coating plant &$H!@@09|w
6. 1.漏孔 =Dj#gV
1-1漏孔leaks: 4CTi]E=H{
1-2通道漏孔channel leak: GTHt'[t@;
1-3薄膜漏孔membrane leak: VUuE T
1-4分子漏孔molecular leak: 6ik$B
1-5粘滞漏孔vixcous leak: f
_:A0
1-6校准漏孔calibrated leak: qf-8<{T
1-7标准漏孔reference leak : Wx#;E9=Im
1-8虚漏virtual leak: F8ulkcD
1-9漏率leak rate: (/$^uWj
1-10标准空气漏率standard air leak rate: {oL>1h,%3?
1-11等值标准空气漏率equivalent standard air leak rate: \Vk:93OH21
1-12探索(示漏)气体: 7zj{wp!
s5.CFA
2.本底 0> \sQ,T
2-1本底background: yB!dp;gM{
2-2探索气体本底search gas background : |w3M7;~eF
2-3漂移drift: m]&SN z=
2-4噪声noise:
v"0J&7!J
3OB"#Ap8<
3.检漏仪 4skD(au8
3-1检漏仪leak detector: R.3q0yZ
wF
3-2高频火花检漏仪H.F. spark leak detector: ~}Pfu
3-3卤素检漏仪halide leak detector: mR)wX 6
3-4氦质谱检漏仪helium mass spectrometer leak detector: %z$#6?OK^
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: Dha1/g1q
"J1
4C9u
4.检漏 '5tCz9}Y
4-1气泡检漏leak detection by bubbles: yt2PU_),
4-2氨检漏leak detection by ammonia: ~VB1OLgv#.
4-3升压检漏leak detection of rise pressure: 1Z&(6cDY8M
4-4放射性同位素检漏radioactive isotope leak detection: -:rUw$3J
4-5荧光检漏fluorescence leak detection \{D"
!e
7. 1.一般术语 zT{VE+=
1-1真空干燥vacuum drying: !5N.B|Nt
1-2冷冻干燥freeze drying :
Fk;Rfqq
1-3物料material: Uw:"n]G]D?
1-4待干燥物料material to be dried: n&!-9:0
1-5干燥物料dried material : G+m }MOQP7
1-6湿气moisture;humidity: hqdDm
1-7自由湿气free moisture: nr3==21Om4
1-8结合湿气bound moisture: ~>XxGjxe
1-9分湿气partial moisture: GtHivC
1-10含湿量moisture content: lLIAw$
1-11初始含湿量initial moisture content: C_Wc5{
1-12最终含湿量final residual moisture: uw8f ~:LT
1-13湿度degree of moisture ,degree of humidity : p
K$`$H
1-14干燥物质dry matter : v` r:=K
1-15干燥物质含量content of dry matter: 5IG-~jzCLb
#LNED)Vg
2.干燥工艺 7[wPn`v2
2-1干燥阶段stages of drying : "wc<B4"
(1).预干燥preliminary dry: `0R./|bv\I
(2).一次干燥(广义)primary drying(in general): 4Po_-4
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): i-&yH
(4).二次干燥secondary drying: d d;T-wa}
2-2.(1).接触干燥contact drying: cc3 4e
(2).辐射干燥 drying by radiation : LH6vLuf
(3).微波干燥microwave drying: ~QVH<`sn
(4).气相干燥vapor phase drying: F:ELPs4"
(5).静态干燥static drying: wKHBAW[i]
(6).动态干燥dynamic drying: #A.@i+Zv
2-3干燥时间drying time: %
u6Sr5A[s
2-4停留时间length of stay(in the drying chamber): `y0FY&y=
2-5循环时间cycle time: 048kPXm`
2-6干燥率 dessication ratio : #fM'>$N
2-7去湿速率mass flow rate of humidity: wyG;8I
2-8单位面积去湿速率mass flow rate of humidity per surface area: $od7;%
2-9干燥速度 drying speed : wA.\i
2-10干燥过程drying process: E\$W_Lmr
2-11加热温度heating temperature: Xm&L
BX
2-12干燥温度temperature of the material being dried : eDB ;cN
2-13干燥损失loss of material during the drying process : tnIX:6
2-14飞尘lift off (particles): {>;R?TG]$
2-15堆层厚度thickness of the material: GKCroyor
C7?/%7{
3.冷冻干燥 azU"G(6y?+
3-1冷冻freezing: FPTK`Gd0
(1).静态冷冻static freezing: PaN"sf
(2).动态冷冻dynamic freezing: S[QrS7
(3).离心冷冻centrifugal freezing: jFb?b6b
(4).滚动冷冻shell freezing: H[|~/0?K
(5).旋转冷冻spin-freezing: -Qe Z#w|
(6).真空旋转冷冻vacuum spin-freezing: y?!"6t7&
(7).喷雾冷冻spray freezing: \[nut;
(8).气流冷冻air blast freezing: hzC>~Ub5
3-2冷冻速率rate of freezing: },[}$m%
3-3冷冻物料frozen material: t:c.LFrF
3-4冰核ice core: @|)Z"m7
3-5干燥物料外壳envelope of dried matter: &?RQZHtg
3-6升华表面sublimation front: 6zn5UW#q
3-7融化位置freezer burn: $]8Q(/mbK
tI{_y
4.真空干燥设备;真空冷冻干燥设备 bjS{(
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: LIdF 0
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: j~QwV='S
4-3加热表面heating surface: :i7;w%B
4-4物品装载面shelf : 9C i-v/M]
4-5干燥器的处理能力throughput (of the vacuum drying chamber): "*H`HRi4T
4-6单位面积干燥器处理能力throughput per shelf area: |D.ND%K&
4-7冰冷凝器ice condenser: Xm2'6f,
4-8冰冷凝器的负载load of the ice condenser: u2[w#
4-9冰冷凝器的额定负载rated load of the ice condenser s<o7!!c
8. 1.一般术语 [8*)8jP3
1-1试样sample : a}uSm/S
(1).表面层surface layer: l@:0e]8|o
(2).真实表面true surface: KG5>]_GH
(3).有效表面积effective surface area: ]:\dPw`A
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: [1KuzCcK}
(5).表面粒子密度surface particle density: IIqUZJ
(6).单分子层monolayer: %PJQ%~
A
(7).表面单分子层粒子密度monolayer density: 1i] ^{;]
(8).覆盖系数coverage ratio: M#[{>6>iE
1-2激发excitation: =I~mKn
(1).一次粒子primary particle: snikn&
(2).一次粒子通量primary particle flux: 'Z |mQZN
(3).一次粒子通量密度density of primary particle flux: >"<Wjr8W!$
(4).一次粒子负荷primary particle load: 8JD,u
(5).一次粒子积分负荷integral load of primary particle: {}Za_(Y,]
(6).一次粒子的入射能量energy of the incident primary particle: YnP5i#"
(7).激发体积excited volume: A +)`ZTuO
(8).激发面积excited area: #5j\C+P}|
(9).激发深度excited death: 188*XCtjQ9
(10).二次粒子secondary particles: Xs?o{]Fe
(11).二次粒子通量secondary particle flux: u~-8d;+?y
(12).二次粒子发射能energy of the emitted secondary particles: !Rt>xD
(13).发射体积emitting volume: Oc; G(l(
(14).发射面积emitting area: @ry_nKr9
(15).发射深度emitting depth: 1'\/,Es
(16).信息深度information depth: >dG[G>
(17).平均信息深度mean information depth: V$?SR44>nH
1-3入射角angle of incidence: NN`uI6=
1-4发射角angle of emission: vZoaT|3
G]
1-5观测角observation: v}Fr@0%
1-6分析表面积analyzed surface area: m9Hit8f@Q
1-7产额 yield : ,4oo=&
1-8表面层微小损伤分析minimum damage surface analysis: ?K\axf>F
1-9表面层无损伤分析non-destructive surface analysis: F@:'J\I}:
1-10断面深度分析 profile analysis in depth; depth profile analysis : ;d9QAN&0}
1-11可观测面积observable area: XvlU*TO~(~
1-12可观测立体角observable solid angle : &JI8]JmU)
1-13接受立体角;观测立体角angle of acceptance: E\,-XH
1-14角分辨能力angular resolving power: [zM-^
1-15发光度luminosity: 0_t`%l=
1-16二次粒子探测比detection ratio of secondary particles: J9[r|`gJ(
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: :Zz
'1C
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: h2""9aP!
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: Z/;aT -N
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: }U9G
1-21本底压力base pressure: ox (%5c)b|
1-22工作压力working pressure: %1$,Vs<RH
xlg9TvvI
2.分析方法 igR";OQk
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: KyQX!,rV
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : j ?(&#
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: 46&/gehr
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: *ppffz
2-3离子散射表面分析ion scattering spectroscopy: s}% M4
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: fsWTF<Y
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: hFl^\$Re
2-6离子散射谱仪ion scattering spectrometer: .xWC{}7[
2-7俄歇效应Auger process: v OpKNp
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: =rCIumqD-}
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: b`O'1r\Y;
2-10光电子谱术photoelectron spectroscopy : = {wcfhUl+
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: 5, 6"&vU,
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: 8q}q{8
2-11光电子谱仪photoelectron spectrometer: "5wa91*
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: 7Da`
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: RuVGG)
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): _8_R 1s
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus