“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 8+Bu+|c%f
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真空术语 42 \-~]
U-^[lWn[@4
1.标准环境条件 standard ambient condition: 8#D:H/`'
2.气体的标准状态 standard reference conditions forgases: %riK+
3.压力(压强)p pressure: PG]%Bv57
4.帕斯卡Pa pascal: W@2vjz
5.托Torr torr: W#Qmv^StZ
6.标准大气压atm standard atmosphere: \-*eL;qP
7.毫巴mbar millibar: aSP4a+\*
8.分压力 partial pressure: |G/7_+J6
9.全压力 total pressure: efY8M2
10.真空 vacuum: 9TAj) {U%'
11.真空度 degree of vacuum: {W\T"7H
12.真空区域 ranges of vacuum: P6Mhbmt9*
13.气体 gas: ]LZ`LL'#Y_
14.非可凝气体 non-condensable gas: Hp|}~xjn
15.蒸汽vapor: Cbs5dn(Y
16.饱和蒸汽压saturation vapor pressure: y4Er@8I`
17.饱和度degree of saturation: wIf
{6z{
18.饱和蒸汽saturated vapor: "Y=+Ls(3o(
19.未饱和蒸汽unsaturated vapor: nPUqMn'
20.分子数密度n,m-3 number density of molecules:
^W7X(LQ*+
21.平均自由程ι、λ,m mean free path: Ux2U*a;
22.碰撞率ψ collision rate: 1J?dK|% b
23.体积碰撞率χ volume collision rate: LZ~"VV^
24.气体量G quantity of gas: NS C/@._
25.气体的扩散 diffusion of gas: dC1V-x10ju
26.扩散系数D diffusion coefficient; diffusivity: RL[E X5U
27.粘滞流 viscous flow: F6hmku>\1
28.粘滞系数η viscous factor: vOgC>_x7
29.泊肖叶流 poiseuille flow: 8by@iQ
30.中间流 intermediate flow: }!TL2er_
31.分子流 molecular flow: AddeaB5<
32克努曾数 number of knudsen: *XWq?hi
33.分子泻流 molecular effusion; effusive flow: wLV~F[:
34.流逸 transpiration: 7'NS9|
35.热流逸 thermal transpiration: :|1.seLQ
36.分子流率qN molecular flow rate; molecular flux: 7P7b8]
37.分子流率密度 molecular flow rate density; density of molecular flux: [ REf>_R
38.质量流率qm mass flow rare: ;
"3+YTtp
39.流量qG throughput of gas: $c&0F,
40.体积流率qV volume flow rate: 1=2^90
41.摩尔流率qυ molar flow rate: },[;O^Do^{
42.麦克斯韦速度分布 maxwellian velocity distribution: yGpz,X4x
43.传输几率Pc transmission probability: CCDDK L]N:
44.分子流导CN,UN molecular conductance: 3^=+gsc
45.流导C,U conductance: bqx0d=Z~[
46.固有流导Ci,Ui intrinsic conductance: 0D~ C
5}/4
47.流阻W resistance: _DP|-bp D
48.吸附 sorption: iK_c.b
49.表面吸附 adsorption: Ejq#~Zhr!
50.物理吸附physisorption: s:y
^_W)d
51.化学吸附 chemisorption: F&;
52.吸收absorption: Rb}KZ+o"Z
53.适应系数α accommodation factor: K^t?gt@k}
54.入射率υ impingement rate: uENdI2EY8y
55.凝结率condensation rate: 2yo
cu!4l
56.粘着率 sticking rate: insY(.N
57.粘着几率Ps sticking probability: |vFj*XU
58.滞留时间τ residence time: ;pRcVL_4
59.迁移 migration: tK%c@gGU9
60.解吸 desorption: D';eTy Y
61.去气 degassing: y 0ckm6^
62.放气 outgassing: !~-6wN"k
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: xeTgV&$@
64.蒸发率 evaporation rate: E&~nps8e
65.渗透 permeation: rSVgWr8
66.渗透率φ permeability: Z%gx%$
67.渗透系数P permeability coefficient y~<@x.
2. 1.真空泵 vacuum pumps H]#Rg`~n
1-1.容积真空泵 positive displacement pump: 99 wc
⑴.气镇真空泵 gas ballast vacuum pump: o!&WsD
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: F: 37MUQi
⑶.干封真空泵 dry-sealed vacuum pump: BC\S/5~k
⑷.往复真空泵 piston vacuum pump: gd^Js1Z
⑸.液环真空泵 liquid ring vacuum pump: X21dX`eMN
⑹.旋片真空泵 sliding vane rotary vacuum pump: s.jO<{
⑺.定片真空泵 rotary piston vacuum pump: D!TZI
⑻.滑阀真空泵 rotary plunger vacuum pump: t0m*PJcF
⑼.余摆线真空泵 trochoidal vacuum pump: v
vE\
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: g.Hio.fVd
⑾.罗茨真空泵 roots vacuum pump: #%S0PL"x U
1-2.动量传输泵 kinetic vacuum pump: PoD^`()FR{
⑴.牵引分子泵molecular drag pump: v@u<Ww;=@
⑵.涡轮分子泵turbo molecular pump: K3p@$3hQ
⑶.喷射真空泵ejector vacuum pump: $->d!
⑷.液体喷射真空泵liquid jet vacuum pump: NyPd5m:
⑸.气体喷射真空泵gas jet vacuum pump: h
; kfh.
⑹.蒸汽喷射真空泵vapor jet vacuum pump : s'_,:R\VM>
⑺.扩散泵diffusion pump : PCfo
⑻.自净化扩散泵self purifying diffusion pump: G{c#\?12C
⑼.分馏扩散泵 fractionating diffusion pump : .]76!(fWZ
⑽.扩散喷射泵diffusion ejector pump : xX@FWAj
⑾.离子传输泵ion transfer pump: oO=o|w|T
1-3.捕集真空泵 entrapment vacuum pump: >xd<YwXZ
⑴吸附泵adsorption pump: fnH3CE
⑵.吸气剂泵 getter pump: uMFV%+I
⑶.升华(蒸发)泵 sublimation (evaporation)pump : .gT4_
⑷.吸气剂离子泵getter ion pump: N\R=cwk
⑸.蒸发离子泵 evaporation ion pump: F,v7ifo#f
⑹.溅射离子泵sputter ion pump: %cW;}Y[?P
⑺.低温泵cryopump: x0Bw{>Q
68x}w
Ae
2.真空泵零部件 t =dO
2-1.泵壳 pump case: 93w~.p
2-2.入口 inlet: M#0 @X
2-3.出口outlet: i7eI=f-Q
2-4.旋片(滑片、滑阀)vane; blade : &:!ij
2-5.排气阀discharge valve: kX8=cL9G
2-6.气镇阀gas ballast valve: am:.NG+
2-7.膨胀室expansion chamber: W(@>?$&
2-8.压缩室compression chamber: ]C *10S`
2-9.真空泵油 vacuum pump oil: =s[&;B`s
2-10.泵液 pump fluid: Tb#
2-11.喷嘴 nozzle: %D^bahf
2-13.喷嘴扩张率nozzle expansion rate: wOHEv^,
2-14.喷嘴间隙面积 nozzle clearance area : Bxv8RB
2-15.喷嘴间隙nozzle clearance: |U=(b,
2-16.射流jet: 6ojo##j
2-17.扩散器diffuser: 6q%ed
UED
2-18.扩散器喉部diffuser thoat: dt~iw
2-19.蒸汽导管vapor tube(pipe;chimney): F!~l
MpuE
2-20.喷嘴组件nozzle assembly: "=A|K~b
2-21.下裙skirt: ?'2 v.5TQt
BLW]|p|1:
3.附件 .Z5[_'T
3-1阱trap: },6*Y*?{
⑴.冷阱 cold trap: 37KU~9-A
⑵.吸附阱sorption trap: v*L
'{3f
⑶.离子阱ion trap: $Q4=37H+
⑷.冷冻升华阱 cryosublimation trap: eU~?p|Np
3-2.挡板baffle: 6_ ]8\n
3-3.油分离器oil separator: .&(8(C
3-4.油净化器oil purifier:
^Fp=y,D
3-5.冷凝器condenser: cQ,9Rnfl,
(C~dkR?
4.泵按工作分类 <|V'pim
4-1.主泵main pump: "%kGRHq
4-2.粗抽泵roughing vacuum pump: s]bPV,"p
4-3.前级真空泵backing vacuum pump: yfq>,
4-4.粗(低)真空泵 roughing(low)vacuum pump: )KE_t^$
4-5.维持真空泵holding vacuum pump: b_ JWnh
4-6.高真空泵high vacuum pump: h,hL?imD
4-7.超高真空泵ultra-high vacuum pump: 2[BA(B
4-8.增压真空泵booster vacuum pump: (txt8q
&(0N.=R
5.真空泵特性 s7|3zqi
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: ;o%:7&
5-2.真空泵的抽气量Q throughput of vacuum pump:。 ) MBS
5-3.起动压力starting pressure: eE,;K1
5-4.前级压力 backing pressure : LJ
l1v
5-5.临界前级压力 critical backing pressure: O=`o'%K<
5-6.最大前级压力maximum backing pressure: pVz pN8!
5-7.最大工作压力maximum working pressure: (uT^Nn9L=
5-8.真空泵的极限压力ultimate pressure of a pump: CKN8z
5-9.压缩比compression ratio: q]+)c2M
5-10.何氏系数Ho coefficient: zP|*(*
5-11.抽速系数speed factor: Zx9.p Fc"
5-12.气体的反扩散back-diffusion of gas: .m!s". ?[
5-13.泵液返流back-streaming of pump fluid: r?afv.@L2
5-14.返流率back-streaming rate IrUi
Eq
5-15.返迁移back-migration: R
^^1/%
5-16.爆腾bumping: Vs|sw
5-17.水蒸气允许量qm water vapor tolerable load: `rq<jtf+
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: 7p
!zp 9|
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: @92gb$xT
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump #!Ze\fOC
3. 1.一般术语 FSVS4mtiX\
1-1.压力计pressure gauge: -7,vtd[h
1-2.真空计vacuum gauge: y\@SC\jk|
⑴.规头(规管)gauge head: N[]U%9[=2F
⑵.裸规nude gauge : Yd.02 7
⑶.真空计控制单元gauge control unit : F\Y,JUn[G
⑷.真空计指示单元gauge indicating unit : # a.\P.{L
CHg]U l
2.真空计一般分类 &R0OeRToUb
2-1.压差式真空计differential vacuum gauge: *<?XTs<
2-2.绝对真空计 absolute vacuum gauge: l&$*}yCK
2-3.全压真空计total pressure vacuum gauge: 8`DO[Z
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: KKV)DExv?
2-5.相对真空计relative vacuum gauge : =;g= GcVK
rEg+i@~
3.真空计特性 `M,Nd'5&|
3-1.真空计测量范围pressure range of vacuum gauge: #,)PN @P
3-2.灵敏度系数sensitivity coefficient: V!H(;Tuuo
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): o;*]1
3-5.规管光电流photon current of vacuum gauge head: Ys)+9yPPn
3-6.等效氮压力equivalent nitrogen pressure : 5UPPk$8`
3-7.X射线极限值 X-ray limit: h1E
PaL
3-8.逆X射线效应anti X-ray effect: *WD;C0?z
3-9.布利尔斯效应blears effect: v^;-@ddr
l~ CZW*/
4.全压真空计 exsQmbj* %
4-1.液位压力计liquid level manometer: _qEWu Do
4-2.弹性元件真空计elastic element vacuum gauge: AmgWj/>
4-3.压缩式真空计compression gauge: 'G52<sF
4-4.压力天平pressure balance: i+U@\:=
4-5.粘滞性真空计viscosity gauge : ~NA1SZ{Y+
4-6.热传导真空计thermal conductivity vacuum gauge : KQ- ,W8Q5
4-7.热分子真空计thermo-molecular gauge: (K<Z=a
4-8.电离真空计ionization vacuum gauge: dG"K/|
4-9.放射性电离真空计radioactive ionization gauge: ~@[(U!G
4-10.冷阴极电离真空计cold cathode ionization gauge: C0P*D,
4-11.潘宁真空计penning gauge: O{Dm;@J-aM
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: d\\r_bGW
4-13.放电管指示器discharge tube indicator: S!u6dz^[$X
4-14.热阴极电离真空计hot cathode ionization gauge: zUNH8=U
4-15.三极管式真空计triode gauge: uAc@ Z-
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: IU7$%6<Y
4-17.B-A型电离真空计Bayard-Alpert gauge: 56"#Syj
4-18.调制型电离真空计modulator gauge: fm[_@L%
x
4-19.抑制型电离真空计suppressor gauge: VjC*(6<Gj
4-20.分离型电离真空计extractor gauge: ?rky6
4-21.弯注型电离真空计bent beam gauge: Nvi Fq
4-22.弹道型电离真空计 orbitron gauge : 0`V3s]%iu
4-23.热阴极磁控管真空计hot cathode magnetron gauge: @< wYT$
xq#U4E
5.分压真空计(分压分析器)
{VS''Lv
5-1.射频质谱仪radio frequency mass spectrometer: B:B8"ODV
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: 8e]z6:}'E
5-3.单极质谱仪momopole mass spectrometer: "w(N62z/
5-4.双聚焦质谱仪double focusing mass spectrometer: #Tup]czO
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: <Z2(qZ^Z
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: nXv 7OEpTx
5-7.回旋质谱仪omegatron mass spectrometer: E]e,cd
5-8.飞行时间质谱仪time of flight mass spectrometer: GU:r vS!
)!'Fa_$ e
6.真空计校准 <jpe u^7
6-1.标准真空计reference gauges: x-w`KFS
6-2.校准系统system of calibration: Lhl$w'r
6-3.校准系数K calibration coefficient: : =
]sq}IN
6-4.压缩计法meleod gauge method: [`y:M&@
6-5.膨胀法expansion method: i<B:
6-6.流导法flow method: _!CK
4. 1.真空系统vacuum system SPfD2%jjC
1-1.真空机组pump system:
#;5[('&[
1-2.有油真空机组pump system used oil : IXbdS9,>F
1-3.无油真空机组oil free pump system nYI/&B{p
1-4.连续处理真空设备continuous treatment vacuum plant: 4 *Bp
1-5.闸门式真空系统vacuum system with an air-lock: (45NZBs
1-6.压差真空系统differentially pumped vacuum system: 3'?h;`v\Lo
1-7.进气系统gas admittance system: C/{nr-V3u
fBHkLRFH
2.真空系统特性参量 83{x"G3>
2-1.抽气装置的抽速volume flow rate of a pumping unit : ,`ZPtnH+
2-2.抽气装置的抽气量throughput of a pumping unit : MV
Hz$hyB
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system:
YRg=yVo2
2-4.真空系统的漏气速率leak throughput of a vacuum system: Z}sG3p
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: R59e&
2-6.极限压力ultimate pressure: H.jLGe>
2-7.残余压力residual pressure: }2-[Ki yv
2-8.残余气体谱residual gas spectrum: Bpk@ {E9
2-9.基础压力base pressure: ?)Tz'9l
2-10.工作压力working pressure: ^U-vD[O8
2-11.粗抽时间roughing time: +O;OSZ
2-12.抽气时间pump-down time: }9L 40)8
2-13.真空系统时间常数time constant of a vacuum system: l-DGy# h+z
2-14.真空系统进气时间venting time: U@o2gjGN
nu\
3.真空容器 &(5^vw<0
3-1.真空容器;真空室vacuum chamber: |#DC.Ga!
3-2.封离真空装置sealed vacuum device: Y|hzF:ll
3-3.真空钟罩vacuum bell jar: 9f@#SB_H
3-4.真空容器底板vacuum base plate: n;-x!Gs
3-5.真空岐管vacuum manifold: r~S!<9f
3-6.前级真空容器(贮气罐)backing reservoir: c,6<7
3-7.真空保护层outer chamber: G=r(SJq
3-8.真空闸室vacuum air lock: IgzCh
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: %f_)<NP9=
LV}UBao5n
4.真空封接和真空引入线 m NUN6qVP~
4-1.永久性真空封接permanent seal : BxSk%$J
4.2.玻璃分级过渡封接graded seal : 377j3dP
4-3.压缩玻璃金属封接compression glass-to-metal seal: 1Y H4a|bc
4-4.匹配式玻璃金属封接matched glass-to-metal seal: kr/1Dsr4
4-5.陶瓷金属封接ceramic-to-metal seal: ?=/}Ft
4-6.半永久性真空封接semi-permanent seal : [oQ`HX1g
4-7.可拆卸的真空封接demountable joint: ~ERRp3Ee?
4-8.液体真空封接liquid seal ?:#>^eWYe7
4-9.熔融金属真空封接molten metal seal: ]>VJ--fH
4-10.研磨面搭接封接ground and lapped seal: t7U,AQ=;P5
4-11.真空法兰连接vacuum flange connection: TS\A`{^T
4-12.真空密封垫vacuum-tight gasket: EWuiaw.
4-13.真空密封圈ring gasket: ,wry u|7"$
4-14.真空平密封垫flat gasket: o*O"\/pmF
4-15.真空引入线feedthrough leadthrough: ?L<UOv7;t
4-16.真空轴密封shaft seal: <2o.,2?G
4-17.真空窗vacuum window: 6T{o3wc;
4-18.观察窗viewing window: u7WTSL%
c~^]jqid]
5.真空阀门 Q70**qm
5-1.真空阀门的特性characteristic of vacuum valves: +LQs.*
⑴.真空阀门的流导conductance of vacuum valves: ;qMnO_E
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: VurP1@e&
5-2.真空调节阀regulating valve: SU_]C+
5-3.微调阀 micro-adjustable valve: 'gk81@|
5-4.充气阀charge valve: (!XYH@Mz<w
5-5.进气阀gas admittance valve: }\`-G+i{W
5-6.真空截止阀break valve: ]AFM Y<mB
5-7.前级真空阀backing valve: s60:0 >
5-8.旁通阀 by-pass valve: 6]@|7|N>X
5-9.主真空阀main vacuum valve: *oX
5-10.低真空阀low vacuum valve: i#M a-0#
5-11.高真空阀high vacuum valve: :o.x=c B
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: 8ACYuN\
5-13.手动阀manually operated valve: ,<^tsCI
5-14.气动阀pneumatically operated valve: aowPji$H
5-15.电磁阀electromagnetically operated valve: 9d,]_l.sB
5-16.电动阀valve with electrically motorized operation: YaY;o^11/
5-17.挡板阀baffle valve: JEm?26n X
5-18.翻板阀flap valve: lH,]ZA./
5-19.插板阀gate valve: FkJ>]k
5-20.蝶阀butterfly valve: $8X tI
Fl#VKU3h
6.真空管路 )L(d$N=Bd
6-1.粗抽管路roughing line: VtzyB
6-2.前级真空管路backing line: 9GtVI^]
6-3.旁通管路;By-Pass管路 by-pass line: (8@hF#N1
6-4.抽气封口接头pumping stem: {g!exbVf
6-5.真空限流件limiting conductance: }]39
iK`w
6-6.过滤器filter: Vlp*'2VO
5. 1.一般术语 R>e3@DQ~
1-1真空镀膜vacuum coating: 02J6Pn3
1-2基片substrate: `%mBu`A
1-3试验基片testing substrate: aoakTi!}
1-4镀膜材料coating material: 08K.\3
1-5蒸发材料evaporation material: 11@2 ;vw
1-6溅射材料sputtering material: +Qi52OG
1-7膜层材料(膜层材质)film material: 1EAVMJ
1-8蒸发速率evaporation rate: Zjp5\+hHV
1-9溅射速率sputtering rate: ku[=QsMv
1-10沉积速率deposition rate: @]ptY*
1-11镀膜角度coating angle: d4/`:?w
gGiV1jN_
2.工艺 v_@#hf3
2-1真空蒸膜vacuum evaporation coating: YP\4XI
(1).同时蒸发simultaneous evaporation: z)<pqN
(2).蒸发场蒸发evaporation field evaporation: Q,,fDBN
(3).反应性真空蒸发reactive vacuum evaporation: RZ/+K=
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: j]F#p R}p
(5).直接加热的蒸发direct heating evaporation: X_tW#`
(6).感应加热蒸发induced heating evaporation: >;' 1k'
(7).电子束蒸发electron beam evaporation: xeP;"J}
(8).激光束蒸发laser beam evaporation: N5w]2xz!
(9).间接加热的蒸发indirect heating evaporation: uZ2v;]\Y6
(10).闪蒸flash evaportion: &;@b&p+
2-2真空溅射vacuum sputtering: R0YC:rAt
(1).反应性真空溅射 reactive vacuum sputtering: Z_OqXo=
(2).偏压溅射bias sputtering: ;5oH6{7_Z
(3).直流二级溅射direct current diode sputtering: 4G;`KqR@
(4).非对称性交流溅射asymmtric alternate current sputtering: A]SB c2
(5).高频二极溅射high frequency diode sputtering: |E_+*1l q.
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: xU\:Vid+A
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: 9J;H.:WH
(8).离子束溅射ion beam sputtering: fssL'DD
(9).辉光放电清洗glow discharge cleaning: [vjkU7;7A
2-3物理气相沉积PVD physical vapor deposition: e2h k
2-4化学气相沉积CVD chemical vapor deposition: s<r.+zqW
2-5磁控溅射magnetron sputtering: <T.3ZZ%
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: A^Hp #b@
2-7空心阴极离子镀HCD hollow cathode discharge deposition: "w|k\1D
2-8电弧离子镀arc discharge deposition: BE2\? q-
a+a%}76N
3.专用部件 z`r4edk3
3-1镀膜室coating chamber: GLKN<2|2@y
3-2蒸发器装置evaporator device: (27F
3-3蒸发器evaporator: tv=FFfQ
3-4直接加热式蒸发器evaporator by direct heat: l& ^B
3-5间接加热式蒸发器evaporator by indirect heat: ;'18
3-7溅射装置sputtering device: A_q3p\b
3-8靶target: %k;FxUKi
3-10时控挡板timing shutter: M"$RtS|h
3-11掩膜mask: "RJk7]p`*
3-12基片支架substrate holder: z#E,96R
3-13夹紧装置clamp: O"-PNF,J
3-14换向装置reversing device: em9]WSfZ@`
3-15基片加热装置substrate heating device: ?L#SnnE
3-16基片冷却装置substrate colding device: zQ|x>3
eNC5' Z
4.真空镀膜设备 (_n8$3T75
4-1真空镀膜设备vacuum coating plant: cSs/XJZ
(1).真空蒸发镀膜设备vacuum evaporation coating plant: mlw BATi
(2).真空溅射镀膜设备vacuum sputtering coating plant: {FmFu$z+[
4-2连续镀膜设备continuous coating plant: Z-p^3t'{
4-3半连续镀膜设备semi- continuous coating plant Lp]C.一次干燥(广义)primary drying(in general):
0d)n}fm
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): Y mSaIf
(4).二次干燥secondary drying: iU|C<A%Hh
2-2.(1).接触干燥contact drying: \s rOU|
(2).辐射干燥 drying by radiation : u-cC}DP
(3).微波干燥microwave drying: kQcQi}e
(4).气相干燥vapor phase drying: 2a}_|#*
(5).静态干燥static drying: .SFwjriZ
(6).动态干燥dynamic drying: 8u23@?
2-3干燥时间drying time: :{i mRa-
2-4停留时间length of stay(in the drying chamber): >CA1Ub&ls
2-5循环时间cycle time: !LESRh?
2-6干燥率 dessication ratio : XwGJ 8&N
2-7去湿速率mass flow rate of humidity: %tjEVQa
2-8单位面积去湿速率mass flow rate of humidity per surface area: 7P(:!ce4-
2-9干燥速度 drying speed : #jR?C9&!(
2-10干燥过程drying process: @g?z>n
n
2-11加热温度heating temperature: c9K\K~bk
2-12干燥温度temperature of the material being dried : 0(.C f.B~
2-13干燥损失loss of material during the drying process : v0pEN\
2-14飞尘lift off (particles): E$baQU hKS
2-15堆层厚度thickness of the material: U_04QwhK7
ON^u|*kO
3.冷冻干燥 7]
H4E.(l
3-1冷冻freezing: !b
Km}1T
(1).静态冷冻static freezing: ^`9OA`2
(2).动态冷冻dynamic freezing: hTqJDP"&F
(3).离心冷冻centrifugal freezing: /;J;,G`?
(4).滚动冷冻shell freezing: AS398L
(5).旋转冷冻spin-freezing: wjs7K|PK
(6).真空旋转冷冻vacuum spin-freezing: ~'Hwszpb
(7).喷雾冷冻spray freezing: FL}8h/
(8).气流冷冻air blast freezing: 4cL=f
3-2冷冻速率rate of freezing: 34:=A0z
3-3冷冻物料frozen material: Z!6G(zz:>
3-4冰核ice core: NIGFu{S
3-5干燥物料外壳envelope of dried matter: HkCme_y"
3-6升华表面sublimation front: O5"80z38[
3-7融化位置freezer burn: 6&cU*Io@
T!AQJ:;1
4.真空干燥设备;真空冷冻干燥设备 m[rJFSpef
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: GH!#"Sl8Z
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: _=p|"~rN$
4-3加热表面heating surface: vOU-bF%u
4-4物品装载面shelf : ?J
AzN
4-5干燥器的处理能力throughput (of the vacuum drying chamber): UJ+JVj
4-6单位面积干燥器处理能力throughput per shelf area: _t7A'`Dh]
4-7冰冷凝器ice condenser: /vU31_eZt
4-8冰冷凝器的负载load of the ice condenser: $1F9TfA
4-9冰冷凝器的额定负载rated load of the ice condenser :>u{BG;=79
8. 1.一般术语 eAEVpC2
1-1试样sample : C$5x*`y
(1).表面层surface layer: # jyAq$I0
(2).真实表面true surface: g>{=R|uO5
(3).有效表面积effective surface area: <7+.5iB3
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: o@-cT`HP
(5).表面粒子密度surface particle density: HvU)GJ u b
(6).单分子层monolayer: *HUqW}_r
(7).表面单分子层粒子密度monolayer density: ]cK@nq)
(8).覆盖系数coverage ratio: )XWL'':bF
1-2激发excitation: q^)(p'
X
(1).一次粒子primary particle: -rBj-4|"
(2).一次粒子通量primary particle flux: YrX{,YtiX
(3).一次粒子通量密度density of primary particle flux: 1{qg@xlj
(4).一次粒子负荷primary particle load: iW)Ou?aS
(5).一次粒子积分负荷integral load of primary particle: W3#L!&z_wK
(6).一次粒子的入射能量energy of the incident primary particle: W&nVVV8s@
(7).激发体积excited volume: "|H0 X#
(8).激发面积excited area: 8dNJZoV
(9).激发深度excited death: psBBiHB[L
(10).二次粒子secondary particles: 8^~]Ym:
(11).二次粒子通量secondary particle flux: >2r/d
(12).二次粒子发射能energy of the emitted secondary particles: P^z)]K#sw
(13).发射体积emitting volume: +=QboUN
(14).发射面积emitting area: U8z,N1]r*`
(15).发射深度emitting depth: ;3_'{
(16).信息深度information depth: BRT2 =}A
(17).平均信息深度mean information depth: 4_eq@'9-q
1-3入射角angle of incidence: ^"I!+Teb
1-4发射角angle of emission: ,k4
(b
1-5观测角observation: te_D
,
1-6分析表面积analyzed surface area: <_}u5E)7(
1-7产额 yield : ]dH;+3}
1-8表面层微小损伤分析minimum damage surface analysis: asb")NfIm
1-9表面层无损伤分析non-destructive surface analysis: mi+I)b=
1-10断面深度分析 profile analysis in depth; depth profile analysis : $t^`Pt*:u
1-11可观测面积observable area: *@< jJP4
1-12可观测立体角observable solid angle : ( Qnn
1-13接受立体角;观测立体角angle of acceptance: 4^
A\w
1-14角分辨能力angular resolving power: 6mZFsB
1-15发光度luminosity: qQQ~[JL
1-16二次粒子探测比detection ratio of secondary particles: mOBS[M5*
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: S;
>_9
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: 7_LE2jpC,5
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: b=sc2)3?
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: z\a#"2(G.
1-21本底压力base pressure: gs'(px
1-22工作压力working pressure: :?zOL w?(
KpWQ;3D2
2.分析方法 ><Z2uJZ4x
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: I2b[
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : -7u4f y{T
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: 16AYB17
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: #qzozQ4
2-3离子散射表面分析ion scattering spectroscopy: !,]_tw>R
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: {Q0"uE)-.
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: hP #>`)aNY
2-6离子散射谱仪ion scattering spectrometer: +%0+
2-7俄歇效应Auger process: r'j*f"uAm
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: a`}HFHm\2,
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: "&An9H'
2-10光电子谱术photoelectron spectroscopy :
*v6'I-#
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: L(iWFy1& T
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: \ /o`CV{O
2-11光电子谱仪photoelectron spectrometer: V`G]4}
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: h4]yIM`8d
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: w%kxY5q
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): N=(rl#<
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus