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--------------------------------------------------- Kj'uTEM
真空术语 N~a?0x
N[AX29
1.标准环境条件 standard ambient condition: 8&3G|m1-2
2.气体的标准状态 standard reference conditions forgases: n\d-^ml
3.压力(压强)p pressure: lc*<UZR
4.帕斯卡Pa pascal: f#[Fqkmj
5.托Torr torr: )O_Y(^+ $
6.标准大气压atm standard atmosphere: 9XS'5AXN
7.毫巴mbar millibar: s:Memvf
8.分压力 partial pressure: 2?HLEiI1
9.全压力 total pressure: or0f%wAF
10.真空 vacuum: {|
Tl3
11.真空度 degree of vacuum: R7vO,kZ6Q
12.真空区域 ranges of vacuum: O7E0{8
13.气体 gas: *c xYB
14.非可凝气体 non-condensable gas: %rYd=Ri
15.蒸汽vapor: }VyDX14j
16.饱和蒸汽压saturation vapor pressure: O[$&]>x]]
17.饱和度degree of saturation: 'H97D-86/
18.饱和蒸汽saturated vapor: Qq>M}
19.未饱和蒸汽unsaturated vapor: v\&Wb_;A
20.分子数密度n,m-3 number density of molecules: X+iUT
21.平均自由程ι、λ,m mean free path:
d':c
22.碰撞率ψ collision rate: zU]95I
23.体积碰撞率χ volume collision rate: YX-G>.Pc
24.气体量G quantity of gas: rIy,gZr.U
25.气体的扩散 diffusion of gas: \= i>}Sg
26.扩散系数D diffusion coefficient; diffusivity: g&&5F>mF
27.粘滞流 viscous flow: !}<Y^="
28.粘滞系数η viscous factor: IojF/
29.泊肖叶流 poiseuille flow: IE,xiV
30.中间流 intermediate flow: E7ixl~
31.分子流 molecular flow: HPT$)NeNc
32克努曾数 number of knudsen: ]H%y7kH8
33.分子泻流 molecular effusion; effusive flow: EE-jU<>|
34.流逸 transpiration: R0AVAUG
35.热流逸 thermal transpiration: F`+}p-
36.分子流率qN molecular flow rate; molecular flux: d'q,:="c
37.分子流率密度 molecular flow rate density; density of molecular flux: bfhap(F~(e
38.质量流率qm mass flow rare: P6@(nGgK<
39.流量qG throughput of gas: r,a V11{
40.体积流率qV volume flow rate: .r $d
8J
41.摩尔流率qυ molar flow rate: SCZtHEl9
42.麦克斯韦速度分布 maxwellian velocity distribution: qE!.C}L+
43.传输几率Pc transmission probability: ^pIT,|myY7
44.分子流导CN,UN molecular conductance: ~}PB&`%7
45.流导C,U conductance: \= =rdW-
46.固有流导Ci,Ui intrinsic conductance: tWT@%(2~0
47.流阻W resistance: |]*]k`o<)
48.吸附 sorption: iW9G0Ay
49.表面吸附 adsorption: r<
sx On
50.物理吸附physisorption: )w=ehjV^m
51.化学吸附 chemisorption: 4:WN-[xX
52.吸收absorption: -lAX-W0
53.适应系数α accommodation factor: :>+}|(v
54.入射率υ impingement rate: 1#/>[B
55.凝结率condensation rate: #| ETH;HM
56.粘着率 sticking rate: 1U^;fqvja
57.粘着几率Ps sticking probability: /J9|.];%r
58.滞留时间τ residence time: h0_od/D1r
59.迁移 migration: 2= S;<J
60.解吸 desorption: Y`.FSs
61.去气 degassing: !hdOH3h =
62.放气 outgassing: &>,c..Ke
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: xJlf}LEyF
64.蒸发率 evaporation rate: dn!#c=
65.渗透 permeation: D;*P'%_Z
66.渗透率φ permeability: A0~uv4MC
67.渗透系数P permeability coefficient xy;u"JY*
2. 1.真空泵 vacuum pumps
qp;eBa
1-1.容积真空泵 positive displacement pump: >PHin%#
⑴.气镇真空泵 gas ballast vacuum pump: ^--kcTiR%
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: RzgA;ZC'
⑶.干封真空泵 dry-sealed vacuum pump: ]6#bp,
⑷.往复真空泵 piston vacuum pump: VI_8r5o
⑸.液环真空泵 liquid ring vacuum pump: :QGgtTEV""
⑹.旋片真空泵 sliding vane rotary vacuum pump: -q'G]}
⑺.定片真空泵 rotary piston vacuum pump: J$"3w,O6+U
⑻.滑阀真空泵 rotary plunger vacuum pump: ny'?Hl'Q
⑼.余摆线真空泵 trochoidal vacuum pump: AYb-BaIc
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: l=4lhFG,Mk
⑾.罗茨真空泵 roots vacuum pump: QmxI;l
1-2.动量传输泵 kinetic vacuum pump: $z[FL=h)?+
⑴.牵引分子泵molecular drag pump: JiH^N!
⑵.涡轮分子泵turbo molecular pump: p`N+9t&I4
⑶.喷射真空泵ejector vacuum pump: H;D5)eJ90
⑷.液体喷射真空泵liquid jet vacuum pump: &pCa{p
⑸.气体喷射真空泵gas jet vacuum pump: zp.-=)D4e
⑹.蒸汽喷射真空泵vapor jet vacuum pump : /h6K"w=='!
⑺.扩散泵diffusion pump : x6N)T4J(
⑻.自净化扩散泵self purifying diffusion pump: A~0eJaq+
⑼.分馏扩散泵 fractionating diffusion pump : Pnl+.?
⑽.扩散喷射泵diffusion ejector pump : ]40@yrc
⑾.离子传输泵ion transfer pump: !:BmDX[<n
1-3.捕集真空泵 entrapment vacuum pump: fD:BKJQ
⑴吸附泵adsorption pump: gZ!q
⑵.吸气剂泵 getter pump: VkW N1A
⑶.升华(蒸发)泵 sublimation (evaporation)pump : -}:;
EGUtd
⑷.吸气剂离子泵getter ion pump: 9fQ[:Hl"
⑸.蒸发离子泵 evaporation ion pump: sQ";
t=yC
⑹.溅射离子泵sputter ion pump: \%BII>VS
⑺.低温泵cryopump: b;xn0sDn#
o|`%>&jP
2.真空泵零部件 v=8sj{g3,3
2-1.泵壳 pump case: ~$PY6s
2-2.入口 inlet: Rq`d I~5!b
2-3.出口outlet: ?c ur}`
2-4.旋片(滑片、滑阀)vane; blade : W*.j=?)\[
2-5.排气阀discharge valve: 6> DmcG:.
2-6.气镇阀gas ballast valve: @y1:=["b
2-7.膨胀室expansion chamber: X\Gbs=sf6
2-8.压缩室compression chamber: ^L?2y/
2-9.真空泵油 vacuum pump oil: 1Y+g^Z;G
2-10.泵液 pump fluid: l~(A(1
2-11.喷嘴 nozzle: oU`{6 ~;
2-13.喷嘴扩张率nozzle expansion rate: b%wm-p
2-14.喷嘴间隙面积 nozzle clearance area : @h=r;N#/`P
2-15.喷嘴间隙nozzle clearance: z ?L]5m`H
2-16.射流jet: K6Z/
2-17.扩散器diffuser: fug
Fk
2-18.扩散器喉部diffuser thoat: BWF>;*Xro
2-19.蒸汽导管vapor tube(pipe;chimney): .QVN&UyZ
2-20.喷嘴组件nozzle assembly: r}nz )=\Cj
2-21.下裙skirt: Fswr @du
nG4}8
3.附件 (/$a*$
3-1阱trap: Q'~3Ik
⑴.冷阱 cold trap: *N65B#
⑵.吸附阱sorption trap: /<
-+*79G
⑶.离子阱ion trap: 328gTP1
⑷.冷冻升华阱 cryosublimation trap: _=YHO.
3-2.挡板baffle: O&g$dK!Rad
3-3.油分离器oil separator: T/$hN hQK
3-4.油净化器oil purifier: Xte"tf9(C
3-5.冷凝器condenser:
JRr'81\
CaB@,L
4.泵按工作分类 ?v,4seRuz
4-1.主泵main pump: ?s]+2Tq
4-2.粗抽泵roughing vacuum pump: )0XJOm
4-3.前级真空泵backing vacuum pump: zvOSQxGQ
4-4.粗(低)真空泵 roughing(low)vacuum pump: }rA
_4%
4-5.维持真空泵holding vacuum pump: |C`.m|
4-6.高真空泵high vacuum pump: ~0V,B1a
4-7.超高真空泵ultra-high vacuum pump: v43FU3
4-8.增压真空泵booster vacuum pump: 6 K-jje;)
(@i2a
5.真空泵特性 #`qP7E w
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: AGMrBd|J{
5-2.真空泵的抽气量Q throughput of vacuum pump:。 v5A8"&Jr
5-3.起动压力starting pressure: } m&La4E
5-4.前级压力 backing pressure : 6b-E|;"]:^
5-5.临界前级压力 critical backing pressure: d)1Pl3+
5-6.最大前级压力maximum backing pressure: A(1dq
5-7.最大工作压力maximum working pressure: i%#
<Hi7
5-8.真空泵的极限压力ultimate pressure of a pump: =z4kK_?F,
5-9.压缩比compression ratio: ~]78R!HJ
5-10.何氏系数Ho coefficient: cyXnZs ?|
5-11.抽速系数speed factor: /SKgN{tWe
5-12.气体的反扩散back-diffusion of gas: wS;hC&~2
5-13.泵液返流back-streaming of pump fluid: h(gpqSN
5-14.返流率back-streaming rate $.KDnl^
5-15.返迁移back-migration: uePa4e!
5-16.爆腾bumping: @QbTO'UzK`
5-17.水蒸气允许量qm water vapor tolerable load: O m5+j:YM
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: JW9U&Bj{
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: ;@s'JSPt
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump ICm/9Onh&
3. 1.一般术语 EZ)$lw/!J
1-1.压力计pressure gauge: ;oivG)hJl
1-2.真空计vacuum gauge: HwxME%w
⑴.规头(规管)gauge head: (aX6jdvo
⑵.裸规nude gauge : ~ L?q.*q
⑶.真空计控制单元gauge control unit : RGz NZc
⑷.真空计指示单元gauge indicating unit : JG* Lc@ Q
Dl=qss~g+
2.真空计一般分类 v~KgCLo
2-1.压差式真空计differential vacuum gauge: gaVQ3NqF
2-2.绝对真空计 absolute vacuum gauge: MD,+>kh
2-3.全压真空计total pressure vacuum gauge: c=u'#|/eb
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: !A=>B=.|D
2-5.相对真空计relative vacuum gauge : <?Y.w1
+^<-;/FZue
3.真空计特性 &k@r23V7r
3-1.真空计测量范围pressure range of vacuum gauge: &? z6f9*$
3-2.灵敏度系数sensitivity coefficient: Y~g*"J5j
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): p?Jx2(%m
3-5.规管光电流photon current of vacuum gauge head: 'Ej&zh
3-6.等效氮压力equivalent nitrogen pressure : >*e,+ok
3-7.X射线极限值 X-ray limit: f{ER]U
3-8.逆X射线效应anti X-ray effect: .?LP$O=
3-9.布利尔斯效应blears effect: hM~zO1XW
3fhlMOm
4.全压真空计 -=VGXd
4-1.液位压力计liquid level manometer: jCxg)D7W
4-2.弹性元件真空计elastic element vacuum gauge: Pj7n_&*/
4-3.压缩式真空计compression gauge: 'G8.)eTA'
4-4.压力天平pressure balance: lAAs/
4-5.粘滞性真空计viscosity gauge : t`eUD>\
4-6.热传导真空计thermal conductivity vacuum gauge : zMbz_22*
4-7.热分子真空计thermo-molecular gauge: b&xlT+GN
4-8.电离真空计ionization vacuum gauge: G !;<#|a
4-9.放射性电离真空计radioactive ionization gauge: sFa5#w*>
4-10.冷阴极电离真空计cold cathode ionization gauge: +/Qgl
4-11.潘宁真空计penning gauge: Yxd&hr
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: 6\GL|#G
4-13.放电管指示器discharge tube indicator: [RFF&uy
4-14.热阴极电离真空计hot cathode ionization gauge: _H)>U[
4-15.三极管式真空计triode gauge: $|n#L6k
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: <ecif_a=m
4-17.B-A型电离真空计Bayard-Alpert gauge: q<>aZ|r
4-18.调制型电离真空计modulator gauge: >q^l
4-19.抑制型电离真空计suppressor gauge: (^;Fyf/
4-20.分离型电离真空计extractor gauge: yp\sJc`
4-21.弯注型电离真空计bent beam gauge: V>:ubl8j0l
4-22.弹道型电离真空计 orbitron gauge : 2-x#|9
4-23.热阴极磁控管真空计hot cathode magnetron gauge: ~E*`+kD
#P5tTCM
5.分压真空计(分压分析器) ^E= w3g&
5-1.射频质谱仪radio frequency mass spectrometer: &0*IN
nlc?
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: ]q<Zc>OC
5-3.单极质谱仪momopole mass spectrometer: }RN&w]<
5-4.双聚焦质谱仪double focusing mass spectrometer: -1 <*mbb0
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: tC4 7P[b
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: 2}8xY:|@(U
5-7.回旋质谱仪omegatron mass spectrometer: ,/6 aA7(
5-8.飞行时间质谱仪time of flight mass spectrometer: -9> oB
MO-)j_o-Z
6.真空计校准 xji2#S%
6-1.标准真空计reference gauges: |Y|g T*v
6-2.校准系统system of calibration: w;4FN'
6-3.校准系数K calibration coefficient: 7-`iI(N<
6-4.压缩计法meleod gauge method: <{kr5<
6-5.膨胀法expansion method: 0VBbSn}Z<
6-6.流导法flow method: +ht{ARX2(
4. 1.真空系统vacuum system uSU[Y,'x
1-1.真空机组pump system: |A% Jx__
1-2.有油真空机组pump system used oil : A0`#n|(Ad!
1-3.无油真空机组oil free pump system Z+]Uw
1-4.连续处理真空设备continuous treatment vacuum plant: /`vn/X^?^
1-5.闸门式真空系统vacuum system with an air-lock: )%D>U
1-6.压差真空系统differentially pumped vacuum system: w0!4@
1-7.进气系统gas admittance system: b$k|D)_|
(S=RFd
2.真空系统特性参量 R0_O/o+{
2-1.抽气装置的抽速volume flow rate of a pumping unit : [6{o13mCWE
2-2.抽气装置的抽气量throughput of a pumping unit : YNV4'
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: mZ^ev;
2-4.真空系统的漏气速率leak throughput of a vacuum system: fBRU4q=^T
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: S=.7$PY
2-6.极限压力ultimate pressure: JOvRUDZ
2-7.残余压力residual pressure: \.,qAc\[
2-8.残余气体谱residual gas spectrum: [d}AlG!
2-9.基础压力base pressure: oGXndfd"
2-10.工作压力working pressure: Hd9vS"TN]
2-11.粗抽时间roughing time: **!
2-12.抽气时间pump-down time: mf\eg`'4?
2-13.真空系统时间常数time constant of a vacuum system: kjVJ!R\
2-14.真空系统进气时间venting time: xQK;3b
z-X_O32
3.真空容器 1?j['~aE
3-1.真空容器;真空室vacuum chamber: : ZWKrnG
3-2.封离真空装置sealed vacuum device: g&oAa;~o
3-3.真空钟罩vacuum bell jar: S#wy+*
3-4.真空容器底板vacuum base plate: QFYO_$1Y)
3-5.真空岐管vacuum manifold: *%,{<C,Y
3-6.前级真空容器(贮气罐)backing reservoir: eK=<a<tx
3-7.真空保护层outer chamber: fu]mxGPc
3-8.真空闸室vacuum air lock: jJOs`'~Q\
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: cN(Toj'`
a/v!W@Zz}
4.真空封接和真空引入线 DLP
G
4-1.永久性真空封接permanent seal : yl'@p5n
4.2.玻璃分级过渡封接graded seal : ~vMdIZ.h
4-3.压缩玻璃金属封接compression glass-to-metal seal: TC$)::C1
4-4.匹配式玻璃金属封接matched glass-to-metal seal: yv2N5IQ>{V
4-5.陶瓷金属封接ceramic-to-metal seal: r3_O?b
4-6.半永久性真空封接semi-permanent seal : ~R!M.gY[rK
4-7.可拆卸的真空封接demountable joint: B=p6pf
4-8.液体真空封接liquid seal 2V6kCy@V
4-9.熔融金属真空封接molten metal seal: o<Z
4-10.研磨面搭接封接ground and lapped seal: G&LOjd2
4-11.真空法兰连接vacuum flange connection: ~ WO
4-12.真空密封垫vacuum-tight gasket: AZgeu$:7p<
4-13.真空密封圈ring gasket: ccPTJ/%$
4-14.真空平密封垫flat gasket: jF r[T
4-15.真空引入线feedthrough leadthrough: !i{9wI
4-16.真空轴密封shaft seal: vdt ":
4-17.真空窗vacuum window: _b)=ERBbCo
4-18.观察窗viewing window: pdFa]
m:
5.真空阀门 do$+ Eh
5-1.真空阀门的特性characteristic of vacuum valves: _9<nM48+t
⑴.真空阀门的流导conductance of vacuum valves: &uMx*TTY
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: $t{;- DpNB
5-2.真空调节阀regulating valve: PDi]zp9>H
5-3.微调阀 micro-adjustable valve: bCbp JZ
5-4.充气阀charge valve: W7PL]5y&
5-5.进气阀gas admittance valve: .4&pi
5-6.真空截止阀break valve: -\dcs?
5-7.前级真空阀backing valve: g;n6hXq4
5-8.旁通阀 by-pass valve: BD.>aAi!
5-9.主真空阀main vacuum valve: vi1
D<
5-10.低真空阀low vacuum valve: dvX[,*wz
5-11.高真空阀high vacuum valve: tP0\;W
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: cKM#0dq
5-13.手动阀manually operated valve: SE7mn6,%\
5-14.气动阀pneumatically operated valve: C^^AN~ZD
5-15.电磁阀electromagnetically operated valve: BGOajYD
5-16.电动阀valve with electrically motorized operation: :FN-.1C
5-17.挡板阀baffle valve: , R;k>'.
5-18.翻板阀flap valve: H,q-*Kk
5-19.插板阀gate valve: \)'5V!B|s
5-20.蝶阀butterfly valve: ALY3en9,
gx ]5)O
6.真空管路 5ca!JLs
6-1.粗抽管路roughing line: $3'xb/3|
6-2.前级真空管路backing line: &`^PO$
6-3.旁通管路;By-Pass管路 by-pass line: ]H$Trf:L
6-4.抽气封口接头pumping stem: ARd*c?Om
6-5.真空限流件limiting conductance: 089 <B& <
6-6.过滤器filter: F+ Dke>j
5. 1.一般术语 &)ED||r,
1-1真空镀膜vacuum coating: vXLGdv::
1-2基片substrate: ~4V-{-=0a7
1-3试验基片testing substrate: 9pMXjsE
1-4镀膜材料coating material: pt_]&3\e
1-5蒸发材料evaporation material: ya'Ma<4
1-6溅射材料sputtering material: IDK~
(t
1-7膜层材料(膜层材质)film material: <To$Hb,NP
1-8蒸发速率evaporation rate: &y&pjo6v1
1-9溅射速率sputtering rate: f>zd,|)At
1-10沉积速率deposition rate: 5I>a|I!j
1-11镀膜角度coating angle: me+u"G9I;
!~_6S*~
2.工艺 'A{B[
2-1真空蒸膜vacuum evaporation coating: wvcj*{7[
(1).同时蒸发simultaneous evaporation: m88(f2Ch
(2).蒸发场蒸发evaporation field evaporation: JKY
(3).反应性真空蒸发reactive vacuum evaporation: [U@;EeS
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: ZU68\cL
(5).直接加热的蒸发direct heating evaporation: <0btwsv}
(6).感应加热蒸发induced heating evaporation: }Dx5W9Ri"
(7).电子束蒸发electron beam evaporation: @>q4hYF
(8).激光束蒸发laser beam evaporation: .Mxt
F\
(9).间接加热的蒸发indirect heating evaporation: 8'-E>+L
(10).闪蒸flash evaportion: "BA&
2-2真空溅射vacuum sputtering: =:=s
(1).反应性真空溅射 reactive vacuum sputtering: :/\KVz'fw}
(2).偏压溅射bias sputtering: gHox>r6.A
(3).直流二级溅射direct current diode sputtering: ?Ll1B3f
(4).非对称性交流溅射asymmtric alternate current sputtering: '>:%n
(5).高频二极溅射high frequency diode sputtering: `1i\8s&O6@
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: ;-quK%VO!
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: ZfU &X{
(8).离子束溅射ion beam sputtering: ?.g="{5X
(9).辉光放电清洗glow discharge cleaning: jP31K{G?
2-3物理气相沉积PVD physical vapor deposition: T?KM}<$(O
2-4化学气相沉积CVD chemical vapor deposition: M Ui#3o\f
2-5磁控溅射magnetron sputtering: Sd *7jW?
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: "\O{!Hj8
2-7空心阴极离子镀HCD hollow cathode discharge deposition: tpQ8
m(
2-8电弧离子镀arc discharge deposition: <Q@{6
r"W<1Hu
3.专用部件 7e:7RAX
3-1镀膜室coating chamber: us )NgG
3-2蒸发器装置evaporator device: #&Fd16ov
3-3蒸发器evaporator: )(h<vo)-zX
3-4直接加热式蒸发器evaporator by direct heat: 49Hgq/uO
3-5间接加热式蒸发器evaporator by indirect heat: o@qI!?p&
3-7溅射装置sputtering device: L"'L@A|U
3-8靶target: =zRjb>
3-10时控挡板timing shutter: l'RuzBQr
3-11掩膜mask: b8h6fB:2
3-12基片支架substrate holder: ch)#NHZ9F
3-13夹紧装置clamp: b4CXif
3-14换向装置reversing device: =/kT|
3-15基片加热装置substrate heating device: LDbo=w
3-16基片冷却装置substrate colding device: P,bis7X.
q)!G5j3
4.真空镀膜设备 )AXa.y
4-1真空镀膜设备vacuum coating plant: ,A9{x\1!
(1).真空蒸发镀膜设备vacuum evaporation coating plant: e^h4cC\^
(2).真空溅射镀膜设备vacuum sputtering coating plant: kj@m5`G
4-2连续镀膜设备continuous coating plant: +K61-Div
4-3半连续镀膜设备semi- continuous coating plant %iD'2e:
6. 1.漏孔 v;:. k,E0
1-1漏孔leaks: Bw4PxJs-
1-2通道漏孔channel leak: ,%]xT>kH
1-3薄膜漏孔membrane leak: Z`yW2ON$'
1-4分子漏孔molecular leak: k-8$43
1-5粘滞漏孔vixcous leak: | (: PX
1-6校准漏孔calibrated leak: [p96H)8YU
1-7标准漏孔reference leak : q&@q/9kz
1-8虚漏virtual leak: +f\r?8s
1-9漏率leak rate: ol@LLT_m
1-10标准空气漏率standard air leak rate: o%l|16DR
1-11等值标准空气漏率equivalent standard air leak rate: '+iqbcUd,
1-12探索(示漏)气体: 2@f?yh0
!z_VwZ#,
2.本底 29k\}m7l<*
2-1本底background: ZZU"Q7`^
2-2探索气体本底search gas background : !;.nL-NQ
2-3漂移drift: gg QI
2-4噪声noise: f/]g@/`
("_tML 8/p
3.检漏仪 fMIKA72>{
3-1检漏仪leak detector: Q);^gV
3-2高频火花检漏仪H.F. spark leak detector: "%)^:('Ki
3-3卤素检漏仪halide leak detector: Gu\lV c
3-4氦质谱检漏仪helium mass spectrometer leak detector: X-J<gI(Y
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: ]F1ZeAh5
oWdvpvO
4.检漏 Hh0a\%!
4-1气泡检漏leak detection by bubbles: KHt.g`1:R
4-2氨检漏leak detection by ammonia: y%xn(Bn
4-3升压检漏leak detection of rise pressure: < c[dpK5c
4-4放射性同位素检漏radioactive isotope leak detection: Hv<jf38
4-5荧光检漏fluorescence leak detection 5E}~iC&
7. 1.一般术语 m'ykDK\B
1-1真空干燥vacuum drying: ompkDl\E
1-2冷冻干燥freeze drying : .RxAYf|
1-3物料material: wE J?Y8
1-4待干燥物料material to be dried: I:,D:00+
1-5干燥物料dried material : (f?&zQ!+
1-6湿气moisture;humidity: Dv[ 35[Yh
1-7自由湿气free moisture: MYF6tZ*
1-8结合湿气bound moisture: yXL]uh#b
1-9分湿气partial moisture: tS&rR0<OW
1-10含湿量moisture content: +)l6%QKcW
1-11初始含湿量initial moisture content: gTwxmp.,
1-12最终含湿量final residual moisture: j?'It`s
1-13湿度degree of moisture ,degree of humidity : ) ]3(ue
1-14干燥物质dry matter : 7cMSJM(]G
1-15干燥物质含量content of dry matter: _T[m YY
>s+*D=k
2.干燥工艺 \t
04-
2-1干燥阶段stages of drying : ZdY)&LJ
(1).预干燥preliminary dry: -VlXZj@u+
(2).一次干燥(广义)primary drying(in general): uQlQ%n%
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): ::A]p@
(4).二次干燥secondary drying: Wf>scl`s
2-2.(1).接触干燥contact drying: 9`p|>d!.
(2).辐射干燥 drying by radiation : sy;_%,}N
(3).微波干燥microwave drying: Q`7.-di
(4).气相干燥vapor phase drying: V_Oj?MMpn
(5).静态干燥static drying: fG*366W
(6).动态干燥dynamic drying: PK<+tIm\
2-3干燥时间drying time: #DFfySH)A
2-4停留时间length of stay(in the drying chamber): BR [3i}Ud
2-5循环时间cycle time: E/_I$<,_y
2-6干燥率 dessication ratio : jsOid5bs
2-7去湿速率mass flow rate of humidity: >|@i8?|E
2-8单位面积去湿速率mass flow rate of humidity per surface area: wc#E:GJcK
2-9干燥速度 drying speed : y,QJy=?
2-10干燥过程drying process: [:(^n0%
2-11加热温度heating temperature: 8e3I@mv
2-12干燥温度temperature of the material being dried : "`4V^1
2-13干燥损失loss of material during the drying process : (+ibT;!]
2-14飞尘lift off (particles): }{.0mu9
2-15堆层厚度thickness of the material:
).b,KSi
@fSBW+
3.冷冻干燥 V O=
o)H\
3-1冷冻freezing: <|MF\D'
(1).静态冷冻static freezing: cq,0?2R`t
(2).动态冷冻dynamic freezing: $'obj
(3).离心冷冻centrifugal freezing: }hy,
}2(8
(4).滚动冷冻shell freezing: fyE#8h_>4
(5).旋转冷冻spin-freezing: 1SGLA"r
(6).真空旋转冷冻vacuum spin-freezing: oX
#WT
(7).喷雾冷冻spray freezing: K7CrRT3>6
(8).气流冷冻air blast freezing: |kXx9vGq@
3-2冷冻速率rate of freezing: E 'O[E=
3-3冷冻物料frozen material: t5Oeb<REz
3-4冰核ice core: FELDz7DYya
3-5干燥物料外壳envelope of dried matter: F$k^px
3-6升华表面sublimation front: s}3`%?,6y
3-7融化位置freezer burn: Z>si%Npm\
U$,W/G}m
4.真空干燥设备;真空冷冻干燥设备 Dxlpo!
?#
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: 5m]N%{<jAB
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: y]e[fZ`L
4-3加热表面heating surface: 2aR<xcSg
4-4物品装载面shelf : e
1$<,.>
4-5干燥器的处理能力throughput (of the vacuum drying chamber): t/57LjV
4-6单位面积干燥器处理能力throughput per shelf area: t.`&Q|a
4-7冰冷凝器ice condenser: L"
GQQ
4-8冰冷凝器的负载load of the ice condenser: f6r~Ycf,f
4-9冰冷凝器的额定负载rated load of the ice condenser i=^!?
i
8. 1.一般术语 /eO:1c
1-1试样sample : zG. \xmp
(1).表面层surface layer: bk}'wcX<+]
(2).真实表面true surface: UTLuzm
(3).有效表面积effective surface area: Ey#7L
M)
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: qTuQ]*[-
(5).表面粒子密度surface particle density: ?~p]Ey}~9
(6).单分子层monolayer: $%P?2g"j,
(7).表面单分子层粒子密度monolayer density: 'C2X9/!,
(8).覆盖系数coverage ratio: ]9P2v X
1-2激发excitation: dz>2/'
(1).一次粒子primary particle: p-Jp/*R5
(2).一次粒子通量primary particle flux: 3Hd~mfO\
(3).一次粒子通量密度density of primary particle flux: 5Y(<T~
(4).一次粒子负荷primary particle load: D02(6|
(5).一次粒子积分负荷integral load of primary particle: \QvoL
(6).一次粒子的入射能量energy of the incident primary particle: 'OTQiI^t=
(7).激发体积excited volume: 8%ea(|Wjg
(8).激发面积excited area: N r,Qu8
(9).激发深度excited death: A 6IrA/b
(10).二次粒子secondary particles: d^(7\lw|
(11).二次粒子通量secondary particle flux: fFYfb4o
(12).二次粒子发射能energy of the emitted secondary particles: + ;LO|!
(13).发射体积emitting volume: {TL.2
(14).发射面积emitting area: o^ zrF
(15).发射深度emitting depth: 2t,N9@u=UN
(16).信息深度information depth: )4MM>Q
(17).平均信息深度mean information depth: Q_r}cL/A
1-3入射角angle of incidence: W2Ik!wEe&
1-4发射角angle of emission: 8= kwc
1-5观测角observation: YLsOA`5X
1-6分析表面积analyzed surface area: 90[6PSXk
1-7产额 yield : R0g^0K.
1-8表面层微小损伤分析minimum damage surface analysis: F(?O7z"d
1-9表面层无损伤分析non-destructive surface analysis: n muzTFs=
1-10断面深度分析 profile analysis in depth; depth profile analysis : >'1[Bh
1-11可观测面积observable area: 'EHtA9M
1-12可观测立体角observable solid angle : \}Al85
1-13接受立体角;观测立体角angle of acceptance: -^aJ}[uaI
1-14角分辨能力angular resolving power: m!K`?P]:N
1-15发光度luminosity: OAauD$Hh
1-16二次粒子探测比detection ratio of secondary particles: Fd86P.Df
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: xt&4]M
V
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: tiGBjTPt
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: 1.tAl6]
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: )! eJW(
1-21本底压力base pressure: y '[VZ$^i
1-22工作压力working pressure: f
OasX!=
64i*_\UKe
2.分析方法 %vil~NU
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: ;=p3L<~c`K
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : =%ok:+D]
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: |z7V1xF
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: `y|_hb
2-3离子散射表面分析ion scattering spectroscopy: Vak\N)=u
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: \(A A|;
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: d%za6=M
2-6离子散射谱仪ion scattering spectrometer: l0 8vF$k|d
2-7俄歇效应Auger process: 3;RQ\{eM
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: w^"IR
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: W#P`Y < u$
2-10光电子谱术photoelectron spectroscopy : kV+%(Gl8
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: 1Q/=s,{u
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: apOa E7|
2-11光电子谱仪photoelectron spectrometer: Vw|P;LLl`
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: rQxiG[0
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: 'u:-~nSX)
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): PjD9D.
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus