“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 fK_~lGY(
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真空术语 lR@& Z6lw
h$Tr sO
1.标准环境条件 standard ambient condition: Pq?*C;D
2.气体的标准状态 standard reference conditions forgases: y]'CXCml)
3.压力(压强)p pressure: .S_QQM}Q
4.帕斯卡Pa pascal: o/1JO_41
5.托Torr torr: ffk4mhH
6.标准大气压atm standard atmosphere: a#y{pT2 b
7.毫巴mbar millibar: g$w6kz_[
8.分压力 partial pressure: X NE+(Bt
9.全压力 total pressure: E>}q2
10.真空 vacuum: QNArZ6UQ
11.真空度 degree of vacuum: 1lcnRHO
12.真空区域 ranges of vacuum: kA^A mfba
13.气体 gas: J=*K"8Qr
14.非可凝气体 non-condensable gas: ug#<LO-.Rd
15.蒸汽vapor: $.:3$et@/
16.饱和蒸汽压saturation vapor pressure: tD-gc''H
17.饱和度degree of saturation: _{Y$o'*#I
18.饱和蒸汽saturated vapor: _~A~+S}
19.未饱和蒸汽unsaturated vapor: 9m8ee&,
20.分子数密度n,m-3 number density of molecules: M|r8KW~S)
21.平均自由程ι、λ,m mean free path: 0d4cE10
22.碰撞率ψ collision rate: G{o+R]Us
23.体积碰撞率χ volume collision rate: j=ihbR^]Tl
24.气体量G quantity of gas: 31}W6l88c
25.气体的扩散 diffusion of gas: /U*yw5
26.扩散系数D diffusion coefficient; diffusivity: "={L+di:M
27.粘滞流 viscous flow: bulboyA
28.粘滞系数η viscous factor:
$Nu)E
29.泊肖叶流 poiseuille flow: uD(t`W"
30.中间流 intermediate flow: L~eAQR
31.分子流 molecular flow: ?N>pZR
32克努曾数 number of knudsen: m r4b
33.分子泻流 molecular effusion; effusive flow: ~/|zlu*jpc
34.流逸 transpiration: r1Z<:}ZwK
35.热流逸 thermal transpiration: [H,u)8)
36.分子流率qN molecular flow rate; molecular flux: <&U!N'CE
37.分子流率密度 molecular flow rate density; density of molecular flux: C) .2gQ
G
38.质量流率qm mass flow rare: f1Zt?=
39.流量qG throughput of gas: zZ,Yfd|W
40.体积流率qV volume flow rate: ]yLhJ_^
41.摩尔流率qυ molar flow rate: D1Yh,P<CF\
42.麦克斯韦速度分布 maxwellian velocity distribution: [6RfS
43.传输几率Pc transmission probability: ~lw<799F6
44.分子流导CN,UN molecular conductance: uvB1VV4
45.流导C,U conductance: 254~:eB0
46.固有流导Ci,Ui intrinsic conductance: Jqru AW<
47.流阻W resistance: GBbh ar},g
48.吸附 sorption: V`k8j-*s
49.表面吸附 adsorption: 4;*f1_;f~
50.物理吸附physisorption: A*'V+(
51.化学吸附 chemisorption: (F8AL6
52.吸收absorption: xK;e\^v
53.适应系数α accommodation factor: 2jA%[L9d^
54.入射率υ impingement rate: YKs4{?vw
55.凝结率condensation rate: uA\J0"0;}
56.粘着率 sticking rate: Y8ehmz|g]J
57.粘着几率Ps sticking probability: 84M3c
58.滞留时间τ residence time: &iSD/W
59.迁移 migration: =nVmthGw
60.解吸 desorption: (~()RkT
61.去气 degassing: 5 =Z!hQ}
62.放气 outgassing: )i!^]| $
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: Q6^x8
64.蒸发率 evaporation rate: }.{}A(^YR
65.渗透 permeation: :'*DMW~
66.渗透率φ permeability: Np)aS[9W
67.渗透系数P permeability coefficient 0H:dv:#WAI
2. 1.真空泵 vacuum pumps @G GccF
1-1.容积真空泵 positive displacement pump: l`gTU?<xd
⑴.气镇真空泵 gas ballast vacuum pump: _N'75
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: -&Gfh\_NW
⑶.干封真空泵 dry-sealed vacuum pump: Kt
`
⑷.往复真空泵 piston vacuum pump: <k]qH-v4
⑸.液环真空泵 liquid ring vacuum pump: TnE+[.Qu
⑹.旋片真空泵 sliding vane rotary vacuum pump: nGrVw&
⑺.定片真空泵 rotary piston vacuum pump: /#t&~E_|
⑻.滑阀真空泵 rotary plunger vacuum pump: #@Y/{[s|@
⑼.余摆线真空泵 trochoidal vacuum pump: @Fx@5e
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: ;NsO
⑾.罗茨真空泵 roots vacuum pump: BUC,M:J+H
1-2.动量传输泵 kinetic vacuum pump: @]'SeiNp
⑴.牵引分子泵molecular drag pump: m0( E kK
⑵.涡轮分子泵turbo molecular pump: xb$yu.c
⑶.喷射真空泵ejector vacuum pump: \*"`L3
⑷.液体喷射真空泵liquid jet vacuum pump: T-8J
⑸.气体喷射真空泵gas jet vacuum pump: 9P"iuU
⑹.蒸汽喷射真空泵vapor jet vacuum pump : PZM42"[&
⑺.扩散泵diffusion pump : 7g6RiH}
⑻.自净化扩散泵self purifying diffusion pump: Lko`F$5X
⑼.分馏扩散泵 fractionating diffusion pump : 8tQ|-l*
⑽.扩散喷射泵diffusion ejector pump : .3wY\W8Dr-
⑾.离子传输泵ion transfer pump: Iql5T#K+
1-3.捕集真空泵 entrapment vacuum pump: )=H{5&e#u
⑴吸附泵adsorption pump: ]\;xN~l
⑵.吸气剂泵 getter pump: 3"rkko?A
⑶.升华(蒸发)泵 sublimation (evaporation)pump : :vQM>9l7
⑷.吸气剂离子泵getter ion pump: crn k|o
⑸.蒸发离子泵 evaporation ion pump: *fhX*e8y
⑹.溅射离子泵sputter ion pump: GGE[{Gb9
⑺.低温泵cryopump: 6
=gp:I
aWaw&u
2.真空泵零部件 lrys3
2-1.泵壳 pump case: U e*$&VlT
2-2.入口 inlet: M|%c(K#E,3
2-3.出口outlet: *not.2+
2-4.旋片(滑片、滑阀)vane; blade : N@1p]\
2-5.排气阀discharge valve: ,sDr9h/'C3
2-6.气镇阀gas ballast valve: s4,(26y
2-7.膨胀室expansion chamber: PqEAqP
2-8.压缩室compression chamber: D4Sh9:\
2-9.真空泵油 vacuum pump oil: ~A >oO-0K
2-10.泵液 pump fluid: frH)_ YJ%
2-11.喷嘴 nozzle: hC>wFC
2-13.喷嘴扩张率nozzle expansion rate: %f!iHo+Z
2-14.喷嘴间隙面积 nozzle clearance area : H;I~N*ltJ(
2-15.喷嘴间隙nozzle clearance: X8CVY0<o
2-16.射流jet: )%mAZk-*;^
2-17.扩散器diffuser: M#M?1(O/NE
2-18.扩散器喉部diffuser thoat: \A(5;ZnuD
2-19.蒸汽导管vapor tube(pipe;chimney): pP\h6b+B
2-20.喷嘴组件nozzle assembly: `K?1L{p'4
2-21.下裙skirt: 9X]f [^
V/bH^@,sA
3.附件 LK+felL
3-1阱trap: detL jlE
⑴.冷阱 cold trap: 4<}A]BQVkJ
⑵.吸附阱sorption trap: &jm[4'$
*z
⑶.离子阱ion trap: =Ahw%`/&}]
⑷.冷冻升华阱 cryosublimation trap: IVteF*8hU
3-2.挡板baffle: treXOC9^B8
3-3.油分离器oil separator: &;v!oe
3-4.油净化器oil purifier: 7a<_BJXx
3-5.冷凝器condenser: Gah lS*W
k18$JyaG
4.泵按工作分类 Y:pRcO.4g
4-1.主泵main pump: hTw}X.<4
4-2.粗抽泵roughing vacuum pump: mo9$NGM&}
4-3.前级真空泵backing vacuum pump: k/#>S*Ne
4-4.粗(低)真空泵 roughing(low)vacuum pump: ,!>fmU`E4
4-5.维持真空泵holding vacuum pump: a8JN19}D
4-6.高真空泵high vacuum pump: Mi74Xl i
4-7.超高真空泵ultra-high vacuum pump: ./.=Rw
4-8.增压真空泵booster vacuum pump: 3; y_mg
g1qi\axm
5.真空泵特性 Dh`=ydI5
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: xF8 :^'
5-2.真空泵的抽气量Q throughput of vacuum pump:。 *V|zx#RN
5-3.起动压力starting pressure: XGIpUz
5-4.前级压力 backing pressure : 1+^n!$
5-5.临界前级压力 critical backing pressure: v3^t/[e~:
5-6.最大前级压力maximum backing pressure: W5/};K\.
5-7.最大工作压力maximum working pressure: 4oJ$dN
5-8.真空泵的极限压力ultimate pressure of a pump: /{we;Ut=g
5-9.压缩比compression ratio: \)R-A
'*U
5-10.何氏系数Ho coefficient: JS7dsO0;
5-11.抽速系数speed factor: &<h?''nCy
5-12.气体的反扩散back-diffusion of gas: K:w]>a
5-13.泵液返流back-streaming of pump fluid: }+DDJ6Jzs
5-14.返流率back-streaming rate rfTe
5-15.返迁移back-migration: wOcg4HlW
5-16.爆腾bumping: ]fC7%"nB
5-17.水蒸气允许量qm water vapor tolerable load: ND*]gM
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: b~as64
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: \`gEu{
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump +H}e)1^I
3. 1.一般术语 w `!LFHK
1-1.压力计pressure gauge: M=+M8M`Iy
1-2.真空计vacuum gauge: [;@):28"
⑴.规头(规管)gauge head: >0V0i%inmF
⑵.裸规nude gauge : ohplj`X[21
⑶.真空计控制单元gauge control unit : OPiaG!3<
⑷.真空计指示单元gauge indicating unit : [B,p,Q"
b,Lw7MY}[
2.真空计一般分类 (H-cDsh;c
2-1.压差式真空计differential vacuum gauge: {F!v+W>
2-2.绝对真空计 absolute vacuum gauge: Y)OBTX
2-3.全压真空计total pressure vacuum gauge: i[_|%'p
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: !x_t`78T
2-5.相对真空计relative vacuum gauge : h0XH`v
/.v_N%*-v
3.真空计特性 1p=&WM
3-1.真空计测量范围pressure range of vacuum gauge: I-{^[p p
3-2.灵敏度系数sensitivity coefficient: !tr9(d
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): -t>Z
9
3-5.规管光电流photon current of vacuum gauge head: b[0S=e
G
3-6.等效氮压力equivalent nitrogen pressure : %`oHemSy
3-7.X射线极限值 X-ray limit: 9A<0zt
3-8.逆X射线效应anti X-ray effect: C9pnU,[
3-9.布利尔斯效应blears effect: -3 ]|[
@T/q d>T o
4.全压真空计 HTN$ >QTI
4-1.液位压力计liquid level manometer: [D hEh@
4-2.弹性元件真空计elastic element vacuum gauge: P'F~\**5
4-3.压缩式真空计compression gauge: "ZqEP R)
4-4.压力天平pressure balance: B{99gwMe]
4-5.粘滞性真空计viscosity gauge : b-uZ"Kf^
4-6.热传导真空计thermal conductivity vacuum gauge : dq2@6xd
4-7.热分子真空计thermo-molecular gauge: XLocg
4-8.电离真空计ionization vacuum gauge: ^(g_.>
4-9.放射性电离真空计radioactive ionization gauge: "5(W[$f*]v
4-10.冷阴极电离真空计cold cathode ionization gauge:
p2^)2v
4-11.潘宁真空计penning gauge: g@(4ujOT
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: Y2D>tpqNw
4-13.放电管指示器discharge tube indicator: !U[:5@s06
4-14.热阴极电离真空计hot cathode ionization gauge: &L'6KEahR
4-15.三极管式真空计triode gauge: !"%S#nrL$
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: UeNF^6sWu0
4-17.B-A型电离真空计Bayard-Alpert gauge: <K,[sy&Qy
4-18.调制型电离真空计modulator gauge: :ovt?q8">
4-19.抑制型电离真空计suppressor gauge: 2$Wo&Q^_
4-20.分离型电离真空计extractor gauge: vgN@~Xa
4-21.弯注型电离真空计bent beam gauge: V:8@)Hc=
4-22.弹道型电离真空计 orbitron gauge : J7Sx!PQ
4-23.热阴极磁控管真空计hot cathode magnetron gauge: [brkx3h
L^x5&CCwk
5.分压真空计(分压分析器) Ta^.$O=F
5-1.射频质谱仪radio frequency mass spectrometer: 3wo'jOb
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: S<9gyW
5-3.单极质谱仪momopole mass spectrometer: pSXEJ 2k
5-4.双聚焦质谱仪double focusing mass spectrometer: 'rvE
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: _}^u-fJ/~
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: k1m'Ka-
5-7.回旋质谱仪omegatron mass spectrometer: IG&B2*
5-8.飞行时间质谱仪time of flight mass spectrometer: 2=O))^8
#:Xa'D+
6.真空计校准 ~7dF/Nn5
6-1.标准真空计reference gauges: q6Rw4
6-2.校准系统system of calibration: 5DUi4 Cbgy
6-3.校准系数K calibration coefficient: IBDVFA
6-4.压缩计法meleod gauge method: N|o>%)R
6-5.膨胀法expansion method: Z"]xdOre
6-6.流导法flow method: 8M~u_`6
4. 1.真空系统vacuum system !L/tLHk+
1-1.真空机组pump system: 4NJVW+:2
1-2.有油真空机组pump system used oil : 88#N~j~P
1-3.无油真空机组oil free pump system OFp#<o,p
1-4.连续处理真空设备continuous treatment vacuum plant: i"<ZVw
1-5.闸门式真空系统vacuum system with an air-lock: -GFwFkWm
1-6.压差真空系统differentially pumped vacuum system: :Fc8S9
1-7.进气系统gas admittance system: d;<.;Od$`
k5q(7&C
2.真空系统特性参量 Vl-D<M+ih
2-1.抽气装置的抽速volume flow rate of a pumping unit : 'Z y{mq\
2-2.抽气装置的抽气量throughput of a pumping unit : u!M&;QL
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: 8z?$t-D O
2-4.真空系统的漏气速率leak throughput of a vacuum system: x~%\y
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: ML"_CQlE7
2-6.极限压力ultimate pressure: UYH|?Jw!N
2-7.残余压力residual pressure: L-j/R1fTvl
2-8.残余气体谱residual gas spectrum: *Q0lC1GQ
2-9.基础压力base pressure: lu3Q, W
2-10.工作压力working pressure: 75<el.'H
2-11.粗抽时间roughing time: ~R)1nN|
2-12.抽气时间pump-down time: aE}=^%D
2-13.真空系统时间常数time constant of a vacuum system: w{~" ;[@
2-14.真空系统进气时间venting time: ?l(nM+[kSL
7bHE!#L`0
3.真空容器 >}mNi:6xq
3-1.真空容器;真空室vacuum chamber: 6<#Slw[
3-2.封离真空装置sealed vacuum device: f]hBPkZ6
3-3.真空钟罩vacuum bell jar: $x/J+9Ww
3-4.真空容器底板vacuum base plate: )eVzS j>MT
3-5.真空岐管vacuum manifold: <. ezw4ju
3-6.前级真空容器(贮气罐)backing reservoir: makaI0M
3-7.真空保护层outer chamber: n<=y"*
3-8.真空闸室vacuum air lock:
Ca$y819E2
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: =P1RdyP
hjw4Xzju
4.真空封接和真空引入线 gfV]^v
4-1.永久性真空封接permanent seal : \A` gK\/h
4.2.玻璃分级过渡封接graded seal : D\@e{.$MZ|
4-3.压缩玻璃金属封接compression glass-to-metal seal: w 7Cne%J8
4-4.匹配式玻璃金属封接matched glass-to-metal seal: dvC0 <*V
4-5.陶瓷金属封接ceramic-to-metal seal: | h
4-6.半永久性真空封接semi-permanent seal : |C^
c0
4-7.可拆卸的真空封接demountable joint: (\T8!s{AO
4-8.液体真空封接liquid seal C3]\$
4-9.熔融金属真空封接molten metal seal: E*Pz <
4-10.研磨面搭接封接ground and lapped seal: <yis
4-11.真空法兰连接vacuum flange connection: HI}pX{.\
4-12.真空密封垫vacuum-tight gasket: nZ" {y
4-13.真空密封圈ring gasket: -/@|2!d
4-14.真空平密封垫flat gasket: 7YoofI
4-15.真空引入线feedthrough leadthrough: h<+PP]l=
4-16.真空轴密封shaft seal: 5`(((_Um+
4-17.真空窗vacuum window: @?'t@P:4
4-18.观察窗viewing window: pK-_R#
[c,|Lw4
5.真空阀门 2,rY\ Nu_
5-1.真空阀门的特性characteristic of vacuum valves: @$2`DI{_^
⑴.真空阀门的流导conductance of vacuum valves: 5cPSv?x^F@
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: 3WQRN_
5-2.真空调节阀regulating valve: ,R7=]~<io"
5-3.微调阀 micro-adjustable valve: er&uC4Y]a
5-4.充气阀charge valve: Y{+zg9L*
5-5.进气阀gas admittance valve: =>gyc;{2K<
5-6.真空截止阀break valve: !%SdTaC{T
5-7.前级真空阀backing valve: aeN}hG
5-8.旁通阀 by-pass valve: yBpW#1=
5-9.主真空阀main vacuum valve: v!WU |=u
5-10.低真空阀low vacuum valve: \]tq7
5-11.高真空阀high vacuum valve: j<`I\Pmv
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: ]2hF!{wc
5-13.手动阀manually operated valve: ,-w-su=J_
5-14.气动阀pneumatically operated valve: K,`).YK
5-15.电磁阀electromagnetically operated valve: R[mH35D/
5-16.电动阀valve with electrically motorized operation: 7j9D;_(.^$
5-17.挡板阀baffle valve: =NVZ$K OZ
5-18.翻板阀flap valve: C:|q'"F
5-19.插板阀gate valve: WZ-4^WM=!
5-20.蝶阀butterfly valve: L8,H9T#e
;oN{I@}k
6.真空管路 wgSR*d>y*9
6-1.粗抽管路roughing line: $Uv<LVd(
6-2.前级真空管路backing line: Pn'QOVy
6-3.旁通管路;By-Pass管路 by-pass line: .y/NudD
6-4.抽气封口接头pumping stem: $@+p~ )r(l
6-5.真空限流件limiting conductance: y9l#;<b
6-6.过滤器filter: 3&drof\{
5. 1.一般术语 N"q+UCRC
1-1真空镀膜vacuum coating: J4Q)`Y\~
1-2基片substrate: ~:P8g<w
1-3试验基片testing substrate: 2n-Tpay0
1-4镀膜材料coating material: ')1}#V/I
1-5蒸发材料evaporation material: S0Rf>Eo4
1-6溅射材料sputtering material: ihpz}g
1-7膜层材料(膜层材质)film material: 3iwoMrp
1-8蒸发速率evaporation rate: #cSw"A
1-9溅射速率sputtering rate: <3],C)Zwc
1-10沉积速率deposition rate: ?<>,XyY
1-11镀膜角度coating angle: S*2L4Uj`|
z[0LU]b<
2.工艺 E :'
2-1真空蒸膜vacuum evaporation coating: d[P>jl%7
(1).同时蒸发simultaneous evaporation: `JY>v io
(2).蒸发场蒸发evaporation field evaporation: g%fJyk'
(3).反应性真空蒸发reactive vacuum evaporation: Cn6n4, 0
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: i5>J
(5).直接加热的蒸发direct heating evaporation: "tg\yem
(6).感应加热蒸发induced heating evaporation: ~u~[E
(7).电子束蒸发electron beam evaporation: ei|*s+OZu
(8).激光束蒸发laser beam evaporation: ^2Fs)19R
(9).间接加热的蒸发indirect heating evaporation: %z!d4J75
(10).闪蒸flash evaportion: '
q=NTP
2-2真空溅射vacuum sputtering: Pi"tQyw39$
(1).反应性真空溅射 reactive vacuum sputtering: Eezlx9b
(2).偏压溅射bias sputtering: ]P}K3tN%]
(3).直流二级溅射direct current diode sputtering: Up!ZCZ$RC
(4).非对称性交流溅射asymmtric alternate current sputtering: ziB]S@U
(5).高频二极溅射high frequency diode sputtering: yp^[]Mz=
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: ]"2 v7)e
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: +s*l#'Q
(8).离子束溅射ion beam sputtering: _($-dJ{
(9).辉光放电清洗glow discharge cleaning: ZB_16&2Ow
2-3物理气相沉积PVD physical vapor deposition: d<|lLNS
2-4化学气相沉积CVD chemical vapor deposition: I 1VEm?CQ
2-5磁控溅射magnetron sputtering: <De3mZb
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: w ;s ]n
2-7空心阴极离子镀HCD hollow cathode discharge deposition: !e#I4,f n
2-8电弧离子镀arc discharge deposition: YjIED,eRv
&)"7am(S`
3.专用部件 _]?Dt%MkD
3-1镀膜室coating chamber: wk@(CKQzI,
3-2蒸发器装置evaporator device: v,!Y=8~9
3-3蒸发器evaporator: q _T?G e
3-4直接加热式蒸发器evaporator by direct heat: Ei?9M^w
3-5间接加热式蒸发器evaporator by indirect heat: UVoLHd
3-7溅射装置sputtering device: hk lO:,`
3-8靶target: BhE~k?$9
3-10时控挡板timing shutter: jt10gVC
3-11掩膜mask: MLv.v&@S
3-12基片支架substrate holder: b0z{"
3-13夹紧装置clamp: e2Kpx8kWj
3-14换向装置reversing device: Z9
q{r s
3-15基片加热装置substrate heating device: yOn2}Z
3-16基片冷却装置substrate colding device: x4HMT/@AG2
!+|N<`
4.真空镀膜设备 G(|(y=ck
4-1真空镀膜设备vacuum coating plant: p$b=r+1f
(1).真空蒸发镀膜设备vacuum evaporation coating plant: Y=WN4w
(2).真空溅射镀膜设备vacuum sputtering coating plant: OL
]T+6X
4-2连续镀膜设备continuous coating plant: c^[1]'y
4-3半连续镀膜设备semi- continuous coating plant |>/&EElD
6. 1.漏孔 8a$jO+UvN
1-1漏孔leaks: X-ki%jp3
1-2通道漏孔channel leak: Zh~Lm
1-3薄膜漏孔membrane leak: X?}GPA4 W
1-4分子漏孔molecular leak: l"pz
)$eE
1-5粘滞漏孔vixcous leak: A*26'
1-6校准漏孔calibrated leak: X5oW[
1-7标准漏孔reference leak : l]klV+9t
1-8虚漏virtual leak: 4k&O-70y4^
1-9漏率leak rate: d`],l\oC
1-10标准空气漏率standard air leak rate: C+#;L+$Gi
1-11等值标准空气漏率equivalent standard air leak rate: IIt^e#s&
1-12探索(示漏)气体: 8yo6v3JqC
|>o0d~s
2.本底 "/K&qj
2-1本底background: <}Wy;!L
2-2探索气体本底search gas background : @tv];t
2-3漂移drift: + x;ML
2-4噪声noise: DneSzqO"o
b=QGbFf
3.检漏仪 2}#wdJ`
3-1检漏仪leak detector: KutgW#+40
3-2高频火花检漏仪H.F. spark leak detector: 3_eml\CY
3-3卤素检漏仪halide leak detector: A7,$y!D
3-4氦质谱检漏仪helium mass spectrometer leak detector: `@.s!L(V
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: *ZSp9g"Z
/%q9hI
4.检漏 !wb~A0m
4-1气泡检漏leak detection by bubbles: t>h
i$NX{p
4-2氨检漏leak detection by ammonia: UG?C=Tf
4-3升压检漏leak detection of rise pressure: ://#
%SE
4-4放射性同位素检漏radioactive isotope leak detection: eN?P) ,
4-5荧光检漏fluorescence leak detection O\8|niW|
7. 1.一般术语 Lvj5<4h;
1-1真空干燥vacuum drying:
IOSoc 7+"
1-2冷冻干燥freeze drying : H{A| ~V)
1-3物料material: 't%%hw-m}
1-4待干燥物料material to be dried: w3bH|VnU8;
1-5干燥物料dried material : <%#y^_
1-6湿气moisture;humidity: [.Wt,zrE
1-7自由湿气free moisture: &'ETx"
1-8结合湿气bound moisture: #M9D"
<pn}
1-9分湿气partial moisture: dVGUhXN6
1-10含湿量moisture content: v0MOX>`s
1-11初始含湿量initial moisture content: T[[
1-12最终含湿量final residual moisture: .rB;zA;4S)
1-13湿度degree of moisture ,degree of humidity : P$qkb|D,
1-14干燥物质dry matter : ;@Hi*d[
1-15干燥物质含量content of dry matter: kRXg."b(
bq&S?! =s
2.干燥工艺 DUliU8B}\
2-1干燥阶段stages of drying : }nY^T&?`
(1).预干燥preliminary dry: |{LaZXU &
(2).一次干燥(广义)primary drying(in general): &?Z)V-1H
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): R6$F<;nw
(4).二次干燥secondary drying: E!~2\qKT
2-2.(1).接触干燥contact drying: <W%Z_d&Xv
(2).辐射干燥 drying by radiation : -GWzMBS S
(3).微波干燥microwave drying: 8*PAgPj a
(4).气相干燥vapor phase drying: MMr7,?,$
(5).静态干燥static drying: HN~4-6[q
(6).动态干燥dynamic drying: ec[[OIO
2-3干燥时间drying time: v*fc5"3eO
2-4停留时间length of stay(in the drying chamber): z*~PYAt
2-5循环时间cycle time: g2>u]3&W
2-6干燥率 dessication ratio : o3=S<|V
2-7去湿速率mass flow rate of humidity: H_=[~mJ
2-8单位面积去湿速率mass flow rate of humidity per surface area: 0t[mhmSU,
2-9干燥速度 drying speed : +U)|&1oa
2-10干燥过程drying process: 5a|m}2IX
2-11加热温度heating temperature: q[+:t
2-12干燥温度temperature of the material being dried : fQ_8{=<-&X
2-13干燥损失loss of material during the drying process : 2/4x]i
H*
2-14飞尘lift off (particles): g+r{>x
2-15堆层厚度thickness of the material: @wgGnb)
$#JVI:
3.冷冻干燥 `"":
3-1冷冻freezing: & O\!!1%
(1).静态冷冻static freezing: 1nTaKK
q
(2).动态冷冻dynamic freezing: y$9t!cx
(3).离心冷冻centrifugal freezing: yx;R#8;b.
(4).滚动冷冻shell freezing: =}GyI_br;8
(5).旋转冷冻spin-freezing: A'-YwbY
(6).真空旋转冷冻vacuum spin-freezing: UXB8sS*wQ?
(7).喷雾冷冻spray freezing: 8PjhvU
(8).气流冷冻air blast freezing: bK;aV&
3-2冷冻速率rate of freezing: Bo\v-97
3-3冷冻物料frozen material: U105u.#7
3-4冰核ice core: [Q_|6Di
3-5干燥物料外壳envelope of dried matter: s ^R2jueR
3-6升华表面sublimation front: 5f@YrTO[@
3-7融化位置freezer burn: d]~1.i
Xt*%"7yTp
4.真空干燥设备;真空冷冻干燥设备 JU1; /3(
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: "(&`muIc
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: ayz1i:Q|
4-3加热表面heating surface: #( J}xz;
4-4物品装载面shelf : p)&\>
4-5干燥器的处理能力throughput (of the vacuum drying chamber): QGG(I7{-
4-6单位面积干燥器处理能力throughput per shelf area: H>X1(sh#}
4-7冰冷凝器ice condenser: cD@lorj
4-8冰冷凝器的负载load of the ice condenser: uN0fWj]
4-9冰冷凝器的额定负载rated load of the ice condenser t
U=b~
8. 1.一般术语 L\CM);y
1-1试样sample : ?'m5)Z{
(1).表面层surface layer: vUx$[/<
(2).真实表面true surface: -+@~*$
d
(3).有效表面积effective surface area: ~0GX~{;r
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: Z@O
e}\.$
(5).表面粒子密度surface particle density: l^?A8jG
(6).单分子层monolayer: .T wF]v
(7).表面单分子层粒子密度monolayer density: \JC(pn
(8).覆盖系数coverage ratio: grAL4
1-2激发excitation: i j;'4GzQL
(1).一次粒子primary particle: ~6i mkv^ F
(2).一次粒子通量primary particle flux: 7gmMqz"z(>
(3).一次粒子通量密度density of primary particle flux:
VZ@@j[F(
(4).一次粒子负荷primary particle load: %-po6Vf
(5).一次粒子积分负荷integral load of primary particle: usf(U>
(6).一次粒子的入射能量energy of the incident primary particle: 48rYs}
(7).激发体积excited volume: xi=uXxl
(8).激发面积excited area: ,?~,"IQyi[
(9).激发深度excited death: 8Kkr1}!wd
(10).二次粒子secondary particles: D ,^
U%<`
(11).二次粒子通量secondary particle flux: ,
)3+hnFY
(12).二次粒子发射能energy of the emitted secondary particles: urjp&L&
(13).发射体积emitting volume: g]JI}O*5
(14).发射面积emitting area: 5z]KkPQ
(15).发射深度emitting depth: R!xc$`N
(16).信息深度information depth: g~u!,Zc
(17).平均信息深度mean information depth: Ap18qp
1-3入射角angle of incidence: Q 5TyS8
1-4发射角angle of emission: Mn;CG'FA
1-5观测角observation: 481u1
1-6分析表面积analyzed surface area: V t;&2v
1-7产额 yield : [c )\?MWW
1-8表面层微小损伤分析minimum damage surface analysis: !&