“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 'H|=]n0
--------------------------------------------------- TxDzGC
真空术语 lRr ={
>s
G&f~A;'7k
1.标准环境条件 standard ambient condition: |`c=`xK7'
2.气体的标准状态 standard reference conditions forgases: c_+y~X)i
3.压力(压强)p pressure: f83Tl~
4.帕斯卡Pa pascal: @,%IVKg\
5.托Torr torr: `GQ'yv
6.标准大气压atm standard atmosphere: k2t#O%_f
7.毫巴mbar millibar: Kulh:d:w
8.分压力 partial pressure: *j/[5J0'M
9.全压力 total pressure: |d0,54!
10.真空 vacuum: ^N2N>^'&1.
11.真空度 degree of vacuum: H6! <y-
12.真空区域 ranges of vacuum: jn/
J-X=
13.气体 gas: +i1\],7
14.非可凝气体 non-condensable gas: P3u,)P&
15.蒸汽vapor: 1}>u Y
16.饱和蒸汽压saturation vapor pressure: I6B4S"Q5<
17.饱和度degree of saturation: p#6V|5~8
18.饱和蒸汽saturated vapor: *LZ^0c: r
19.未饱和蒸汽unsaturated vapor: mok%TK
20.分子数密度n,m-3 number density of molecules: ;+W9EbY2
21.平均自由程ι、λ,m mean free path: @ApX43U(
22.碰撞率ψ collision rate: FaVeP%v
23.体积碰撞率χ volume collision rate: = m6yH_`@
24.气体量G quantity of gas: /`"&n1
25.气体的扩散 diffusion of gas: LjOHlT'
26.扩散系数D diffusion coefficient; diffusivity: 0A.PfqYi
27.粘滞流 viscous flow: r|!r!V8j
28.粘滞系数η viscous factor: &:MfLDJ
29.泊肖叶流 poiseuille flow: 6;^ e
30.中间流 intermediate flow: [WxRwE
31.分子流 molecular flow: <6L=% \X{*
32克努曾数 number of knudsen: NIasce e
33.分子泻流 molecular effusion; effusive flow: xw5LPz;B
34.流逸 transpiration: oY$L
35.热流逸 thermal transpiration: ``j8T[g
36.分子流率qN molecular flow rate; molecular flux: 7\e96+j|f
37.分子流率密度 molecular flow rate density; density of molecular flux: g\O&gNq<)-
38.质量流率qm mass flow rare: ^>H+#@R
39.流量qG throughput of gas: eKj'[2G@/
40.体积流率qV volume flow rate: 48 | u{
41.摩尔流率qυ molar flow rate: +CF"Bm8@
42.麦克斯韦速度分布 maxwellian velocity distribution: j^&{5s
43.传输几率Pc transmission probability: |Vq&IfP
44.分子流导CN,UN molecular conductance: h~zG*B5F
45.流导C,U conductance: |'bRVqJ
46.固有流导Ci,Ui intrinsic conductance: f} _d`?K
47.流阻W resistance: ; Da[jFP
48.吸附 sorption: rt5eN:'qY
49.表面吸附 adsorption: i9FtS7
50.物理吸附physisorption: b}OOG
51.化学吸附 chemisorption: 3jG
#<4;J
52.吸收absorption: _s> ZY0
53.适应系数α accommodation factor: ygz6 ~(
54.入射率υ impingement rate: c'8a)j$$+
55.凝结率condensation rate: YEB@ p.
56.粘着率 sticking rate: 83ajok4E
57.粘着几率Ps sticking probability: {ylhh%t4hi
58.滞留时间τ residence time: yavoGk
59.迁移 migration: 5W29oz}-S
60.解吸 desorption: }CyS_Tc
61.去气 degassing: on=I*?+R
62.放气 outgassing: >.]'N:5
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: w`?Rd
64.蒸发率 evaporation rate: D]UqM<0Rz
65.渗透 permeation: ,& ^vc_}
66.渗透率φ permeability: kQY+D1
67.渗透系数P permeability coefficient KOQ9K
2. 1.真空泵 vacuum pumps 0/F/U=Z!
1-1.容积真空泵 positive displacement pump: .;'3Roi
⑴.气镇真空泵 gas ballast vacuum pump: 3n=`SLj/a
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: d*A(L5;@
⑶.干封真空泵 dry-sealed vacuum pump: =b* Is,R/
⑷.往复真空泵 piston vacuum pump: ydyGPZt
⑸.液环真空泵 liquid ring vacuum pump: uDZ$'a
⑹.旋片真空泵 sliding vane rotary vacuum pump: +.RC{o,
⑺.定片真空泵 rotary piston vacuum pump: yQXHEB
⑻.滑阀真空泵 rotary plunger vacuum pump: (^ Q:zU
⑼.余摆线真空泵 trochoidal vacuum pump: {#c**' 4
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: Rt{`v<
⑾.罗茨真空泵 roots vacuum pump: 22<T.c
1-2.动量传输泵 kinetic vacuum pump: ZPISclSA+
⑴.牵引分子泵molecular drag pump: Q6|~ks+Y
⑵.涡轮分子泵turbo molecular pump: |4F3Gu
⑶.喷射真空泵ejector vacuum pump: >,JA=s
⑷.液体喷射真空泵liquid jet vacuum pump: ,VM)ZK=Tr
⑸.气体喷射真空泵gas jet vacuum pump: 'xC83}!k
⑹.蒸汽喷射真空泵vapor jet vacuum pump : gtBnP~zT\B
⑺.扩散泵diffusion pump : us^2Oplq<
⑻.自净化扩散泵self purifying diffusion pump: J} 03 5
⑼.分馏扩散泵 fractionating diffusion pump : rU{E}
⑽.扩散喷射泵diffusion ejector pump : jb~/>I^1
⑾.离子传输泵ion transfer pump: %qM3IVPK)q
1-3.捕集真空泵 entrapment vacuum pump: v.ftfL!
⑴吸附泵adsorption pump: +cw;a]o^>
⑵.吸气剂泵 getter pump: JBsHr%!i
⑶.升华(蒸发)泵 sublimation (evaporation)pump : mu(EmAoenQ
⑷.吸气剂离子泵getter ion pump: o~*5FN}%+l
⑸.蒸发离子泵 evaporation ion pump: {[&_)AW6m%
⑹.溅射离子泵sputter ion pump: /
xfg4
⑺.低温泵cryopump:
'kD~tpZ
AV0C9a/td
2.真空泵零部件 {cNH|
2-1.泵壳 pump case: qQ_o>+3VAy
2-2.入口 inlet: p$5+^x'(
2-3.出口outlet: =HF||p@
2-4.旋片(滑片、滑阀)vane; blade : S&C
2-5.排气阀discharge valve: _Vs\:tygs
2-6.气镇阀gas ballast valve: E,#J\)'z
2-7.膨胀室expansion chamber: nj7wc9z4
2-8.压缩室compression chamber: IkU:D"n7
2-9.真空泵油 vacuum pump oil: +;}XWV
2-10.泵液 pump fluid: 6tE<`"P!
2-11.喷嘴 nozzle: ydNcbF%K
2-13.喷嘴扩张率nozzle expansion rate: ml|[xM8
2-14.喷嘴间隙面积 nozzle clearance area : 95,{40;X7
2-15.喷嘴间隙nozzle clearance: -1Luyuy/`
2-16.射流jet: 0ang^v;q
2-17.扩散器diffuser: E! i:h62
2-18.扩散器喉部diffuser thoat: ~ "]6
2-19.蒸汽导管vapor tube(pipe;chimney): s^/<6kwO
2-20.喷嘴组件nozzle assembly: ^XV=(k;~bX
2-21.下裙skirt: M.Fu>Xi
Om%9 x
3.附件 Ba$Ibq,r/
3-1阱trap: GHMoT
⑴.冷阱 cold trap: g2=5IU<
⑵.吸附阱sorption trap: (]|rxmycA
⑶.离子阱ion trap: 0Wf,SYx`s
⑷.冷冻升华阱 cryosublimation trap: "e4hPY#
3-2.挡板baffle: kpM5/=f/@
3-3.油分离器oil separator: m,e@bJ-
3-4.油净化器oil purifier: GRanR'xG
3-5.冷凝器condenser: C} #:<Jx
SnF3I
4.泵按工作分类 $lj1924?^
4-1.主泵main pump: 2EubMG
4-2.粗抽泵roughing vacuum pump: 4s<*rKm~
4-3.前级真空泵backing vacuum pump: glk_*x
4-4.粗(低)真空泵 roughing(low)vacuum pump: <}c`jN!z.
4-5.维持真空泵holding vacuum pump: )+[{MR'
4-6.高真空泵high vacuum pump: Y
9eGDpW
4-7.超高真空泵ultra-high vacuum pump: ^/Id!Y7
4-8.增压真空泵booster vacuum pump: 3N?WpA768/
Y&O<A8=8
5.真空泵特性 $Nr :YI
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: )fz)Rrr
5-2.真空泵的抽气量Q throughput of vacuum pump:。 Bv^{|w
5-3.起动压力starting pressure: =OIxG}*
5-4.前级压力 backing pressure : Oj#nF@U
5-5.临界前级压力 critical backing pressure: 3*G7H
5-6.最大前级压力maximum backing pressure: %y~=+Sm%m
5-7.最大工作压力maximum working pressure: dkuB{C,
5-8.真空泵的极限压力ultimate pressure of a pump: Q(-:)3g[aL
5-9.压缩比compression ratio: %f.(^<Gu
5-10.何氏系数Ho coefficient: u-zl- ?Ne
5-11.抽速系数speed factor: %@Nuzdp
5-12.气体的反扩散back-diffusion of gas: bJD2c\qoc
5-13.泵液返流back-streaming of pump fluid: &p1Et
5-14.返流率back-streaming rate a;eV&~
5-15.返迁移back-migration: nT0FonK>
5-16.爆腾bumping: |IqQ%;H
5-17.水蒸气允许量qm water vapor tolerable load: #msXAy$N3r
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: FO{K=9O
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: )1a3W7
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump DWep5$>&K
3. 1.一般术语 O2E6F^.pYw
1-1.压力计pressure gauge: j+:q:6 =
1-2.真空计vacuum gauge: NZ`( d
⑴.规头(规管)gauge head: A]2zK?|s
⑵.裸规nude gauge : vcsi@!
⑶.真空计控制单元gauge control unit : lHwQ'/r
⑷.真空计指示单元gauge indicating unit : M3j_sd'N
KaC+x-%K
2.真空计一般分类 %|[+\py$Q
2-1.压差式真空计differential vacuum gauge: B:=*lU.n
2-2.绝对真空计 absolute vacuum gauge: B*A{@)_
2-3.全压真空计total pressure vacuum gauge: _r8.I9|
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: IZczHHEL`b
2-5.相对真空计relative vacuum gauge : *5iNw_&
'vT
XR_D
3.真空计特性 ]3<k>?
3-1.真空计测量范围pressure range of vacuum gauge: tWYKW 3~]
3-2.灵敏度系数sensitivity coefficient: o'@VDGS`
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): Mg]q^T.a
3-5.规管光电流photon current of vacuum gauge head: ZYo Wz(
3-6.等效氮压力equivalent nitrogen pressure : i{w<4E3
3-7.X射线极限值 X-ray limit: +(VHnxNQs
3-8.逆X射线效应anti X-ray effect: \D] N*
3-9.布利尔斯效应blears effect: 4"fiEt,t<x
\+mc
4.全压真空计 -"iGcVV
4-1.液位压力计liquid level manometer: r{.DRbn
4-2.弹性元件真空计elastic element vacuum gauge: UUy|/z%
4-3.压缩式真空计compression gauge: $VYMAk&\
4-4.压力天平pressure balance: t%<nS=u
4-5.粘滞性真空计viscosity gauge : a_/\.
4-6.热传导真空计thermal conductivity vacuum gauge : X62h7?'Pd
4-7.热分子真空计thermo-molecular gauge: +]/_gz
4-8.电离真空计ionization vacuum gauge: |D
u.aN
4-9.放射性电离真空计radioactive ionization gauge: QT /TZ:
4-10.冷阴极电离真空计cold cathode ionization gauge: $[iSZ ;
4-11.潘宁真空计penning gauge: =CEQYk-y1
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: =h^cfyj
4-13.放电管指示器discharge tube indicator: pS
vDH-
4-14.热阴极电离真空计hot cathode ionization gauge: a?CV;9
4-15.三极管式真空计triode gauge: w
`6qT3v
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: [>+(zlK"
4-17.B-A型电离真空计Bayard-Alpert gauge: pPm[<^\# S
4-18.调制型电离真空计modulator gauge: MK7S*N1
4-19.抑制型电离真空计suppressor gauge: >(Jy=m?
4-20.分离型电离真空计extractor gauge: ,2vPmff
4-21.弯注型电离真空计bent beam gauge: >}h/$bU
4-22.弹道型电离真空计 orbitron gauge : CXGq>cQ=d
4-23.热阴极磁控管真空计hot cathode magnetron gauge: ]L4B
Ub%+8M
5.分压真空计(分压分析器) pc<")9U%/
5-1.射频质谱仪radio frequency mass spectrometer: "BZ6G`
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: 8'?V5.6?|~
5-3.单极质谱仪momopole mass spectrometer: ?"\`u;
5-4.双聚焦质谱仪double focusing mass spectrometer: =1fO"|L
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: .?9+1.`
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: {XiBRs e
5-7.回旋质谱仪omegatron mass spectrometer: "|V{@)!t
5-8.飞行时间质谱仪time of flight mass spectrometer: g4_DEBh
N7k<q=r-
6.真空计校准 w~QUG^0Fx
6-1.标准真空计reference gauges: O/$pT%D1x
6-2.校准系统system of calibration: rxjMCMF
6-3.校准系数K calibration coefficient: 9*2A}dH
6-4.压缩计法meleod gauge method: cAIMt]_
6-5.膨胀法expansion method: _|rrl
6-6.流导法flow method: {4Cn/}7Ly^
4. 1.真空系统vacuum system 'n%Ac&kk
1-1.真空机组pump system: :\x53-&hO4
1-2.有油真空机组pump system used oil : FW(y#Fmqs
1-3.无油真空机组oil free pump system oHdss;q
1-4.连续处理真空设备continuous treatment vacuum plant: /rN%y
1-5.闸门式真空系统vacuum system with an air-lock: C,+6g/{
1-6.压差真空系统differentially pumped vacuum system: )h&s.k
1-7.进气系统gas admittance system: 1$ez}k,
[TvH7ott'1
2.真空系统特性参量 {; ]:}nA
2-1.抽气装置的抽速volume flow rate of a pumping unit : IZYq
2-2.抽气装置的抽气量throughput of a pumping unit : Q3,`'[ F
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: aN{C86wx
2-4.真空系统的漏气速率leak throughput of a vacuum system: h.FC:ym"
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: *`[dC,+`.
2-6.极限压力ultimate pressure: .j:[R.
2-7.残余压力residual pressure: cZT;VmC
2-8.残余气体谱residual gas spectrum: @kC>+4s!
2-9.基础压力base pressure: -Czq[n=0(
2-10.工作压力working pressure: Lzu;"#pw
2-11.粗抽时间roughing time: H[?~u+
2-12.抽气时间pump-down time: j7=I!<w V
2-13.真空系统时间常数time constant of a vacuum system: VQV7W
2-14.真空系统进气时间venting time: &-W5T?Sl
T1m'+^?"
3.真空容器 4thLK8/c5g
3-1.真空容器;真空室vacuum chamber: FCTz>N^p
3-2.封离真空装置sealed vacuum device: ]8KAat~J
3-3.真空钟罩vacuum bell jar: q/~U[.C
3-4.真空容器底板vacuum base plate: ik02Q,J
3-5.真空岐管vacuum manifold: N#'+p5|>
3-6.前级真空容器(贮气罐)backing reservoir: Y ::\;s
3-7.真空保护层outer chamber: @=q,,t$r
3-8.真空闸室vacuum air lock: lob{{AB,!
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: LyO ,]
:#v8K;C
4.真空封接和真空引入线 cGiS[-g
4-1.永久性真空封接permanent seal : yHkZInn
4.2.玻璃分级过渡封接graded seal : p%
ESp&
4-3.压缩玻璃金属封接compression glass-to-metal seal: 4&;.>{:;
4-4.匹配式玻璃金属封接matched glass-to-metal seal: BFmYbK
4-5.陶瓷金属封接ceramic-to-metal seal: vUl5%r2O4
4-6.半永久性真空封接semi-permanent seal : "f\2/4EIl
4-7.可拆卸的真空封接demountable joint: 'gd3 w~
4-8.液体真空封接liquid seal [?$ZB),L8
4-9.熔融金属真空封接molten metal seal: x;"!
4-10.研磨面搭接封接ground and lapped seal: peqoLeJI
4-11.真空法兰连接vacuum flange connection: aZ^P*|_K3
4-12.真空密封垫vacuum-tight gasket: !U.Xb6
4-13.真空密封圈ring gasket: fI(u-z~,
4-14.真空平密封垫flat gasket: o.U$\9MNP
4-15.真空引入线feedthrough leadthrough: HVaWv ].
4-16.真空轴密封shaft seal: |$@/
Z+
4-17.真空窗vacuum window: QxCZ<|
4-18.观察窗viewing window: .CH0PK=l
Gs%IZo_
5.真空阀门 c\~H_ ~F
5-1.真空阀门的特性characteristic of vacuum valves: }LQ*vD-Jj
⑴.真空阀门的流导conductance of vacuum valves: R<
@o]p
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: ]X~;?>#:p
5-2.真空调节阀regulating valve: ~8~B VwZ_
5-3.微调阀 micro-adjustable valve: $~c?qU
5-4.充气阀charge valve: :"? boA#L
5-5.进气阀gas admittance valve: K_j$iHqLF
5-6.真空截止阀break valve: 3`_jNPV1
5-7.前级真空阀backing valve: MN\/F4Io
5-8.旁通阀 by-pass valve: v<iMlOEt
5-9.主真空阀main vacuum valve: ^ a%U *>P
5-10.低真空阀low vacuum valve: opTDW)
5-11.高真空阀high vacuum valve: iA*Z4FKkT
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: wJ-G7V,)
5-13.手动阀manually operated valve: 1L1_x'tT%
5-14.气动阀pneumatically operated valve: <y5V],-U
5-15.电磁阀electromagnetically operated valve: iK{q_f\"
5-16.电动阀valve with electrically motorized operation: 0-cqux2U
5-17.挡板阀baffle valve: '8`{u[:
5-18.翻板阀flap valve: {Pm^G^EP
5-19.插板阀gate valve: ^c{}G<U^
5-20.蝶阀butterfly valve: 2%\Nq:;T
ZxkX\gl91
6.真空管路 @!6eRp>Z
6-1.粗抽管路roughing line: JoQzf~
6-2.前级真空管路backing line: 3n9$qr='
6-3.旁通管路;By-Pass管路 by-pass line: bep}|8,#u
6-4.抽气封口接头pumping stem: WL-+;h@VQ
6-5.真空限流件limiting conductance: en>d T
6-6.过滤器filter: n
m(yFX?=
5. 1.一般术语 Lu\]]m
1-1真空镀膜vacuum coating: QxvxeK!Y
1-2基片substrate: TuY{c%qQ:
1-3试验基片testing substrate: I!lzOg4~
1-4镀膜材料coating material: ?^P#P0
1-5蒸发材料evaporation material: K0 .f4o
1-6溅射材料sputtering material: B'6^E#9
1-7膜层材料(膜层材质)film material: |Axg}Q|
1-8蒸发速率evaporation rate: ep<A d
1-9溅射速率sputtering rate: 0?l|A1I%
1-10沉积速率deposition rate: %~P]x7%|
1-11镀膜角度coating angle: RGYky3mQK
g6EdCG.V
2.工艺 '"QC^Joz
2-1真空蒸膜vacuum evaporation coating: {"8\~r &b
(1).同时蒸发simultaneous evaporation: d}tn/Eu?B
(2).蒸发场蒸发evaporation field evaporation: ZV}BDwOFI
(3).反应性真空蒸发reactive vacuum evaporation: VHVU*6_w
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: b6_*ljM
(5).直接加热的蒸发direct heating evaporation: @eMDRbgq;[
(6).感应加热蒸发induced heating evaporation: ]3hz{zqV^
(7).电子束蒸发electron beam evaporation: [YP8z~
(8).激光束蒸发laser beam evaporation: 5:9Ay ?
(9).间接加热的蒸发indirect heating evaporation: ?@Z~i]gE[V
(10).闪蒸flash evaportion: @va{&i`%A7
2-2真空溅射vacuum sputtering: A=|LMJMWR
(1).反应性真空溅射 reactive vacuum sputtering: q:#,b0|bv
(2).偏压溅射bias sputtering: wE3^6
(3).直流二级溅射direct current diode sputtering: vq_W zxaG
(4).非对称性交流溅射asymmtric alternate current sputtering: N%6jZmKip
(5).高频二极溅射high frequency diode sputtering: !Jb?rSJ.h
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: mJewUc!<5
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: YD2M<.U
(8).离子束溅射ion beam sputtering: >#dNXH]9
(9).辉光放电清洗glow discharge cleaning: H? N!F7s
2-3物理气相沉积PVD physical vapor deposition: _6THyj$f
2-4化学气相沉积CVD chemical vapor deposition: n|NI]Qi*
2-5磁控溅射magnetron sputtering: z;1tJ
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: k#`.!yI,
2-7空心阴极离子镀HCD hollow cathode discharge deposition: =Y|TShKk
2-8电弧离子镀arc discharge deposition: AQ. Y-'\t
tr7FV1p
3.专用部件 lW'6rat
3-1镀膜室coating chamber: ZA>hN3fE'
3-2蒸发器装置evaporator device: N-jFA8n
3-3蒸发器evaporator: !Qrlb>1z-
3-4直接加热式蒸发器evaporator by direct heat: )vOZp&
3-5间接加热式蒸发器evaporator by indirect heat: \l_RyMi
3-7溅射装置sputtering device: ih2H~c>O
3-8靶target: U/,`xA;v>
3-10时控挡板timing shutter: al=Dy60|z
3-11掩膜mask: k]Y+C@g
3-12基片支架substrate holder: JXBW0|8b
3-13夹紧装置clamp: 9?gLi!rd
3-14换向装置reversing device: &PD4+%!
3-15基片加热装置substrate heating device: IkH]W!_+
3-16基片冷却装置substrate colding device: kP%'{
*La*j3|:
4.真空镀膜设备 Wf13Ab
4-1真空镀膜设备vacuum coating plant: -,q&Zm
(1).真空蒸发镀膜设备vacuum evaporation coating plant: hnL"f[p@gC
(2).真空溅射镀膜设备vacuum sputtering coating plant: xZtA) Bp
4-2连续镀膜设备continuous coating plant: -`]B4Nt6
4-3半连续镀膜设备semi- continuous coating plant j9%u&
6. 1.漏孔 HoymGU`w
1-1漏孔leaks: T_6,o[b8
1-2通道漏孔channel leak: ko
im@B
1-3薄膜漏孔membrane leak: W2tIt&{
1-4分子漏孔molecular leak: 9NaC7D$,
1-5粘滞漏孔vixcous leak: !OPK?7
1-6校准漏孔calibrated leak: =NAL*4c+
1-7标准漏孔reference leak : N_$ X4.7p
1-8虚漏virtual leak: /+2^xEIjE
1-9漏率leak rate: J[L$8y:
1-10标准空气漏率standard air leak rate: !#3#}R.$Fl
1-11等值标准空气漏率equivalent standard air leak rate: &xr?yd
1-12探索(示漏)气体: M^r1b1tR
CcgCKT
2.本底 QYVT"$=
2-1本底background: zi2hi9A
2-2探索气体本底search gas background : "FcA:7 +
2-3漂移drift: >~TLgq*
2-4噪声noise: j !&g:{ e
/QHvwaW[
3.检漏仪 >T.U\,om7
3-1检漏仪leak detector: KL sTgo|J
3-2高频火花检漏仪H.F. spark leak detector: PPDm*,T.
3-3卤素检漏仪halide leak detector: yXc/Nl%
3-4氦质谱检漏仪helium mass spectrometer leak detector: :b^tu8E
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: eXnMS!g%Z
@`$8rck`
4.检漏 qB3
SQ:y
4-1气泡检漏leak detection by bubbles: ?&)<h_R4p
4-2氨检漏leak detection by ammonia: 0u
QqPF t
4-3升压检漏leak detection of rise pressure: L2P~moVIi
4-4放射性同位素检漏radioactive isotope leak detection: .cQwjL
4-5荧光检漏fluorescence leak detection } UHuFff,
7. 1.一般术语 -nN }8&l
1-1真空干燥vacuum drying: Nk86Y2h
1-2冷冻干燥freeze drying : vhTte
|(
1-3物料material: H~J#!3
1-4待干燥物料material to be dried: mcb0%
1-5干燥物料dried material : 1A< O
Z>
1-6湿气moisture;humidity: \W(C=e
1-7自由湿气free moisture: >LFhu6T
1-8结合湿气bound moisture: "%<Oadz ap
1-9分湿气partial moisture: +MGEO+
1-10含湿量moisture content: -2K`:}\y&
1-11初始含湿量initial moisture content: MJ8z"SKnV
1-12最终含湿量final residual moisture: )+N%!(ki
1-13湿度degree of moisture ,degree of humidity : puL1A?Y8UM
1-14干燥物质dry matter : j?g{*M
1-15干燥物质含量content of dry matter: _yJd@
Q6RBZucv
2.干燥工艺 j*q]-$ 2E
2-1干燥阶段stages of drying : 7od!:<v/
(1).预干燥preliminary dry: QlSZr[^v
(2).一次干燥(广义)primary drying(in general): PZf^r
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): lk%rE
(4).二次干燥secondary drying: F,P,dc
2-2.(1).接触干燥contact drying: FoInJ(PDH
(2).辐射干燥 drying by radiation : n_v|fxF1
(3).微波干燥microwave drying: ?%iAkV
(4).气相干燥vapor phase drying:
xdXt
(5).静态干燥static drying: ka[]pY
(6).动态干燥dynamic drying: EbY%:jR
2-3干燥时间drying time: mUm9[X~'
2-4停留时间length of stay(in the drying chamber): y2TJDb1
2-5循环时间cycle time: Pp@ P]
2-6干燥率 dessication ratio : +g/y)] AP
2-7去湿速率mass flow rate of humidity: `Q,moz
2-8单位面积去湿速率mass flow rate of humidity per surface area: 55zimv&DV
2-9干燥速度 drying speed : |TkMrj0
2-10干燥过程drying process: F9]GEBLr
2-11加热温度heating temperature: [9Q2/V;Uk%
2-12干燥温度temperature of the material being dried : [wjA8d.
2-13干燥损失loss of material during the drying process : oZmni9*SD
2-14飞尘lift off (particles): |bO}|X
2-15堆层厚度thickness of the material: ZxwI< T:&
}Rt?p8p
3.冷冻干燥 =eDVgOZ)
3-1冷冻freezing: :jT1=PfL
(1).静态冷冻static freezing: R8W{[@
(2).动态冷冻dynamic freezing: ?r'rvu'/
(3).离心冷冻centrifugal freezing: 0%cbno@1V
(4).滚动冷冻shell freezing: b=wc-nA
(5).旋转冷冻spin-freezing: wZ0$ylEX
(6).真空旋转冷冻vacuum spin-freezing: 54-sb~]
(7).喷雾冷冻spray freezing: y7u"a)T
(8).气流冷冻air blast freezing: >IJH#>i
3-2冷冻速率rate of freezing: ("}TW-r~
3-3冷冻物料frozen material: {3i.U028]
3-4冰核ice core: f-k%P$"X&
3-5干燥物料外壳envelope of dried matter: bsmZR(EnU
3-6升华表面sublimation front: Vge9AH:op
3-7融化位置freezer burn: Elom_
`&LPqb
4.真空干燥设备;真空冷冻干燥设备 \@N8[
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: %{Kp#R5E
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: O8wR#(/
4-3加热表面heating surface: JpcG5gX^B
4-4物品装载面shelf : Ty}'A(U
4-5干燥器的处理能力throughput (of the vacuum drying chamber): D2# 3fM6
4-6单位面积干燥器处理能力throughput per shelf area: ^{T]sv
4-7冰冷凝器ice condenser: ;/XWX$G@
4-8冰冷凝器的负载load of the ice condenser: rFh!&_
4-9冰冷凝器的额定负载rated load of the ice condenser z{wJQZ9"
8. 1.一般术语 k-Hy>5;
1-1试样sample : u3a"[DB9c
(1).表面层surface layer: t3}>5cAxy
(2).真实表面true surface: CCNrjaA
(3).有效表面积effective surface area: 1aP3oXLL
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: D{x'k2=
(5).表面粒子密度surface particle density: w<!F& kQB
(6).单分子层monolayer: <'>c`80@\*
(7).表面单分子层粒子密度monolayer density: -,)&?S
(8).覆盖系数coverage ratio: _ho9}7 >
1-2激发excitation: *P7 H=Yf&
(1).一次粒子primary particle: ZP
&q7HK\
(2).一次粒子通量primary particle flux: F0qpJM,
(3).一次粒子通量密度density of primary particle flux: [_Fj2nb*
(4).一次粒子负荷primary particle load: tg_xk+x
(5).一次粒子积分负荷integral load of primary particle: T`mG+"O
(6).一次粒子的入射能量energy of the incident primary particle: 7hQXGY,q
(7).激发体积excited volume: JfGU3d*c
(8).激发面积excited area: v*iD)k:|t
(9).激发深度excited death: o,>9|EMQZ
(10).二次粒子secondary particles: ++w7jVi9
(11).二次粒子通量secondary particle flux: !'8.qs
(12).二次粒子发射能energy of the emitted secondary particles: wW
EnAW~
(13).发射体积emitting volume: 9AF%Y:y
(14).发射面积emitting area: 8s16yuM
(15).发射深度emitting depth: Q"7vzri
(16).信息深度information depth: }$iKz*nx|
(17).平均信息深度mean information depth: Y)H~*-vGu
1-3入射角angle of incidence: NOM6},rp
1-4发射角angle of emission: He vZ}.
1-5观测角observation: w%~UuJ#i
1-6分析表面积analyzed surface area: )l g>'O
1-7产额 yield : o 9\J
vJk
1-8表面层微小损伤分析minimum damage surface analysis: f@yInIzRJ
1-9表面层无损伤分析non-destructive surface analysis: QiC}hj$
1-10断面深度分析 profile analysis in depth; depth profile analysis : ##!idcC
1-11可观测面积observable area: o5LyBUJ
1-12可观测立体角observable solid angle : ;}1O\nngR
1-13接受立体角;观测立体角angle of acceptance: cZC%W!pT
1-14角分辨能力angular resolving power: ]Y111<Ja
1-15发光度luminosity: xs,,)jF(u
1-16二次粒子探测比detection ratio of secondary particles: g]&7c:/
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: f$1&)1W[
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: ^x2zMB\t
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: ZDny=&>#
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: A\ARjSdb
1-21本底压力base pressure: U/}YpLgdD
1-22工作压力working pressure: c(Ws3
~H`m"4zQ
2.分析方法 +*uaB
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: =sZ58xA
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : ^E~F,]dV=
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: |ht:_l
8
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: AS4mJ UU9
2-3离子散射表面分析ion scattering spectroscopy: Q~k5 }n8
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: tVQq,_9C
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: Br4[hUV/
2-6离子散射谱仪ion scattering spectrometer: {,aX|*1Ku~
2-7俄歇效应Auger process: x994B@\j+
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES:
$Mg[e*ct
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: q"(b}3
2-10光电子谱术photoelectron spectroscopy : ;n,xu0/
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: GHNw.<`l?
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: 2$r8^}Nj?
2-11光电子谱仪photoelectron spectrometer: +~(SeTY
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: w.VjGPp
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: ,>+B>lbJ*
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): (^pIB~.z
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus