寻找硅胶。用在投影仪的光学元件上。

  参数参考 uxB`  
Curing /KNDo^P  
Pre-cure:    100oC for 15 minutes kguZAO6  
Full cure:    100oC for 1 hour (minimum) W"GW[~ h  
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin m(*rMO>_  
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Mechanical Data ^'a#FbMtt  
1. Tensile strength:    800 psi (min) ft$RF  
2. Lap shear strength:    250 psi (min) CH&{x7$he  
3. Elongation:        80% (min) a[ayr$Hk?  
4. Hardness:        50 Shore D wjD<"p;P  
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Thermal and Optical Data: IWq#W(yM  
1.  Working temperature range: -40oC – 230oC 40pz<-B  
2.    Decomposition temperature:    onset at 3000C (by TGA) }ML2-k  
3.    No change in modulus with temperature W\NC3]  
4.    CTE ~ 200 ppm/oC 1^^8
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5.    Refractive index:        1.43 %^L{K[}  
6.    Transmittance(%)    >90  @260-700nm owQ,op#  
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