寻找硅胶。用在投影仪的光学元件上。

  参数参考 UusAsezm:  
Curing I6WHC*  
Pre-cure:    100oC for 15 minutes bN?*p($/  
Full cure:    100oC for 1 hour (minimum) !wAnsK  
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin yMW3mx301j  
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Mechanical Data Rs<S}oeLn  
1. Tensile strength:    800 psi (min) dZ|bw0~_!  
2. Lap shear strength:    250 psi (min) ~%\vX  
3. Elongation:        80% (min) UVXruH  
4. Hardness:        50 Shore D 70avr)OM  
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Thermal and Optical Data: %w_MRC  
1.  Working temperature range: -40oC – 230oC y2%[/L:u~  
2.    Decomposition temperature:    onset at 3000C (by TGA) >$}Mr%49  
3.    No change in modulus with temperature <!dZ=9^^1  
4.    CTE ~ 200 ppm/oC PM*lnd#J  
5.    Refractive index:        1.43
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6.    Transmittance(%)    >90  @260-700nm ?z`yNx6  
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