寻找硅胶。用在投影仪的光学元件上。

  参数参考 9NcC.}#-5  
Curing -vBk,;^>  
Pre-cure:    100oC for 15 minutes vA,tW,  
Full cure:    100oC for 1 hour (minimum) HZzdelo  
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin i+B
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Mechanical Data 
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1. Tensile strength:    800 psi (min) J`{HMv  
2. Lap shear strength:    250 psi (min) K9f7,/  
3. Elongation:        80% (min) >rzpYc'~w  
4. Hardness:        50 Shore D iC\t@BVS  
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Thermal and Optical Data: <D{_q.`vA  
1.  Working temperature range: -40oC – 230oC cy4V*zwp  
2.    Decomposition temperature:    onset at 3000C (by TGA) O8S"B6?$~'  
3.    No change in modulus with temperature Y4n;[nHQ(  
4.    CTE ~ 200 ppm/oC 0P6< 4  
5.    Refractive index:        1.43 @ei:/~y3  
6.    Transmittance(%)    >90  @260-700nm $)Pmr1==  
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