寻找硅胶。用在投影仪的光学元件上。

  参数参考 'f!Jh<i  
Curing rJxT)bR  
Pre-cure:    100oC for 15 minutes e$h\7i:(  
Full cure:    100oC for 1 hour (minimum) w|ei*L  
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin "*WXr$  
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Mechanical Data 1 ErYob.p  
1. Tensile strength:    800 psi (min) suSIz 7:  
2. Lap shear strength:    250 psi (min) %dQX d]  
3. Elongation:        80% (min) lDXH<W?  
4. Hardness:        50 Shore D Xs
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Thermal and Optical Data: b /ySt<  
1.  Working temperature range: -40oC – 230oC cke[SUH,  
2.    Decomposition temperature:    onset at 3000C (by TGA) "+60B0>sc  
3.    No change in modulus with temperature lUz@
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4.    CTE ~ 200 ppm/oC mUw,q;{  
5.    Refractive index:        1.43 c`Cn9bX  
6.    Transmittance(%)    >90  @260-700nm N"{o3QmA  
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