寻找硅胶。用在投影仪的光学元件上。

  参数参考 Mnaoh:z  
Curing +aV>$Y  
Pre-cure:    100oC for 15 minutes "@E1^
  
Full cure:    100oC for 1 hour (minimum) (CH F=g  
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin gRKmfJ*u  
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Mechanical Data M,PZ|=V6a  
1. Tensile strength:    800 psi (min) t_WNEZW7f  
2. Lap shear strength:    250 psi (min) 56AaviEC  
3. Elongation:        80% (min) ){")RrD(  
4. Hardness:        50 Shore D ~/hP6*  
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Thermal and Optical Data: @B~/0 9  
1.  Working temperature range: -40oC – 230oC w'.ny<Pe  
2.    Decomposition temperature:    onset at 3000C (by TGA) kN;l@>  
3.    No change in modulus with temperature o_EXbS]C  
4.    CTE ~ 200 ppm/oC |]]Xee]  
5.    Refractive index:        1.43 .dVo[m;
 
6.    Transmittance(%)    >90  @260-700nm w-|i8%X  
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