寻找硅胶。用在投影仪的光学元件上。

  参数参考 `&\Q +W  
Curing ojYbR<jn9  
Pre-cure:    100oC for 15 minutes {{V8;y  
Full cure:    100oC for 1 hour (minimum) |*Z$E$k:  
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin ? WJ> p  
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Mechanical Data #/PAA  
1. Tensile strength:    800 psi (min) ~wg:!VWA)  
2. Lap shear strength:    250 psi (min) zvABU+{jD  
3. Elongation:        80% (min) V5+SWXZ  
4. Hardness:        50 Shore D SGb;!T*  
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Thermal and Optical Data: K
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1.  Working temperature range: -40oC – 230oC N0hE4t  
2.    Decomposition temperature:    onset at 3000C (by TGA) r0p w_j  
3.    No change in modulus with temperature d%l{V6  
4.    CTE ~ 200 ppm/oC %%(R@kh9  
5.    Refractive index:        1.43 wFG3KzEq ~  
6.    Transmittance(%)    >90  @260-700nm {U&.D [{&  
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