寻找硅胶。用在投影仪的光学元件上。

  参数参考 iLIv<VK/d  
Curing n5G|OK0,  
Pre-cure:    100oC for 15 minutes ~rl,Hr3Zo  
Full cure:    100oC for 1 hour (minimum) Y;uQq-CP  
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin tEbR/?,GI  
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Mechanical Data c*~/`lG  
1. Tensile strength:    800 psi (min) pFW^  
2. Lap shear strength:    250 psi (min) (]}52%~  
3. Elongation:        80% (min) pOKs VS%fT  
4. Hardness:        50 Shore D tF&g3)D:NV  
K K_  
Thermal and Optical Data: 6oA2"!u^w  
1.  Working temperature range: -40oC – 230oC v*[oe  
2.    Decomposition temperature:    onset at 3000C (by TGA) )%6h9xyXt  
3.    No change in modulus with temperature QO;OeMQv%  
4.    CTE ~ 200 ppm/oC 4Y/kf%]]A  
5.    Refractive index:        1.43 jY|fP!
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6.    Transmittance(%)    >90  @260-700nm Gkr?M^@K  
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