寻找硅胶。用在投影仪的光学元件上。

  参数参考
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Curing E5M/XW\E6  
Pre-cure:    100oC for 15 minutes {7z]+h  
Full cure:    100oC for 1 hour (minimum) |%v:>XEO  
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin /Xb4'Qj  
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Mechanical Data ]\_tO  
1. Tensile strength:    800 psi (min) >(S)aug$1  
2. Lap shear strength:    250 psi (min) Zd>sdS`#r  
3. Elongation:        80% (min) o,dp{+({  
4. Hardness:        50 Shore D 3mo4;F,h9  
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Thermal and Optical Data: \&;y:4&l8  
1.  Working temperature range: -40oC – 230oC cK u[4D
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2.    Decomposition temperature:    onset at 3000C (by TGA) "8ellKh  
3.    No change in modulus with temperature 1ruI++P  
4.    CTE ~ 200 ppm/oC h%ys::\zF  
5.    Refractive index:        1.43 _#:7S sJ  
6.    Transmittance(%)    >90  @260-700nm L'?aoRj  
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