寻找硅胶。用在投影仪的光学元件上。

  参数参考 Dj(7'jT  
Curing ped Yf{T  
Pre-cure:    100oC for 15 minutes XtdLKYET  
Full cure:    100oC for 1 hour (minimum) z-gG(  
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin T]-~?;Jh8  
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Mechanical Data P@`"MNS  
1. Tensile strength:    800 psi (min) ygt)7f5  
2. Lap shear strength:    250 psi (min) u6T?oK9j  
3. Elongation:        80% (min) ;NeEgqW"
 
4. Hardness:        50 Shore D 'fFdqsXr  
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Thermal and Optical Data: 6qpV53H  
1.  Working temperature range: -40oC – 230oC @A'1D@f#  
2.    Decomposition temperature:    onset at 3000C (by TGA) w8I&:"^7<  
3.    No change in modulus with temperature 5V8C+k)  
4.    CTE ~ 200 ppm/oC =XlIe{  
5.    Refractive index:        1.43 ?<^AXLiKV  
6.    Transmittance(%)    >90  @260-700nm -wMW@:M_  
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