寻找硅胶。用在投影仪的光学元件上。

  参数参考 qf#)lyr<D6  
Curing 5MF#&v  
Pre-cure:    100oC for 15 minutes TQ]
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Full cure:    100oC for 1 hour (minimum) eSfnB_@x2  
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin 5l{Ts04k%  
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Mechanical Data $IX\O  
1. Tensile strength:    800 psi (min) ldqLM  
2. Lap shear strength:    250 psi (min) n V&cC  
3. Elongation:        80% (min) t;NV $!!  
4. Hardness:        50 Shore D ny*i+4Mb  
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Thermal and Optical Data: F<|t\KOW  
1.  Working temperature range: -40oC – 230oC 5,)vJ,fs  
2.    Decomposition temperature:    onset at 3000C (by TGA) #7G*GbKY  
3.    No change in modulus with temperature ~h$wH{-U#  
4.    CTE ~ 200 ppm/oC 5(m(xo6  
5.    Refractive index:        1.43 l\OLyQ  
6.    Transmittance(%)    >90  @260-700nm `A@w7J'  
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