寻找硅胶。用在投影仪的光学元件上。

  参数参考 U&F1}P$fb  
Curing KMs[/|HX\  
Pre-cure:    100oC for 15 minutes (L`7-6e(Ab  
Full cure:    100oC for 1 hour (minimum) [D;wB|+,  
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin ~rnbuIh  
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Mechanical Data 5hxG\f#}?  
1. Tensile strength:    800 psi (min) 2EO WbN}M  
2. Lap shear strength:    250 psi (min) \\ZR~f!<  
3. Elongation:        80% (min) a7$]" T 7  
4. Hardness:        50 Shore D =2Vs))>Y  
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Thermal and Optical Data: dUt$kB  
1.  Working temperature range: -40oC – 230oC 11"- taWj  
2.    Decomposition temperature:    onset at 3000C (by TGA) 8>R 75dw  
3.    No change in modulus with temperature .qd/ft2  
4.    CTE ~ 200 ppm/oC R_DstpsT  
5.    Refractive index:        1.43 U-~6<\Mf  
6.    Transmittance(%)    >90  @260-700nm hB?a{#JL  
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