寻找硅胶。用在投影仪的光学元件上。

  参数参考 j@/p: fk  
Curing ]L k- -\  
Pre-cure:    100oC for 15 minutes ZT<VDcP{  
Full cure:    100oC for 1 hour (minimum) Wo5%@C#M  
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin \9R=fA18  
onIZ&wrk  
Mechanical Data 1c*;Lr.K  
1. Tensile strength:    800 psi (min) 4)p ID`  
2. Lap shear strength:    250 psi (min) vPrlRG6  
3. Elongation:        80% (min) c^z)[  
4. Hardness:        50 Shore D n.G.fbO  
z0|-OCmL  
Thermal and Optical Data: VU+=b+B~m  
1.  Working temperature range: -40oC – 230oC MieO1l  
2.    Decomposition temperature:    onset at 3000C (by TGA) CF:!  
3.    No change in modulus with temperature G(bl)p^  
4.    CTE ~ 200 ppm/oC nx%eq,Pq  
5.    Refractive index:        1.43 7ab'q&Y[  
6.    Transmittance(%)    >90  @260-700nm /RWD\u<l  
;"8BbF.  
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