寻找硅胶。用在投影仪的光学元件上。

  参数参考 Ulhk$CPA  
Curing ml2_ ]3j!  
Pre-cure:    100oC for 15 minutes .R`5Qds*l  
Full cure:    100oC for 1 hour (minimum) yH7F''O7  
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin 1h(0IjG8  
?=>+LqP  
Mechanical Data d^/3('H6  
1. Tensile strength:    800 psi (min) fz;iOjr>  
2. Lap shear strength:    250 psi (min) | H!28h  
3. Elongation:        80% (min) B! rTD5a  
4. Hardness:        50 Shore D mrTlXXz  
|\w=u6jX  
Thermal and Optical Data: rMXN[,|v  
1.  Working temperature range: -40oC – 230oC $GYm6x\4  
2.    Decomposition temperature:    onset at 3000C (by TGA) :d3bt~b'  
3.    No change in modulus with temperature soPLA68  
4.    CTE ~ 200 ppm/oC g$n7CXoT  
5.    Refractive index:        1.43 *?o{9v5}(  
6.    Transmittance(%)    >90  @260-700nm 8'n/?.7cX  
aF8fqu\  
如有类似产品，请与我联系shuliang.li@casix.com 0591-83610148