寻找硅胶。用在投影仪的光学元件上。

  参数参考 #S?^?3d  
Curing &AJ bx  
Pre-cure:    100oC for 15 minutes 8S#$'2sT  
Full cure:    100oC for 1 hour (minimum) Cw(e7K7&  
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin MOQ6&C`7q  
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Mechanical Data VF2,(f-*  
1. Tensile strength:    800 psi (min) .9vS4C  
2. Lap shear strength:    250 psi (min) ,<L4tp+y0  
3. Elongation:        80% (min) "v:k5a(  
4. Hardness:        50 Shore D U*a#{C7"  
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Thermal and Optical Data: ura&9~  
1.  Working temperature range: -40oC – 230oC e=(Y,e3  
2.    Decomposition temperature:    onset at 3000C (by TGA) 90}vFoy  
3.    No change in modulus with temperature 9$$  Ijf  
4.    CTE ~ 200 ppm/oC 4JK6<Pk  
5.    Refractive index:        1.43 [nxYfER7  
6.    Transmittance(%)    >90  @260-700nm &pzL}/u  
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