寻找硅胶。用在投影仪的光学元件上。

  参数参考 b:/;  
Curing x\r7q  
Pre-cure:    100oC for 15 minutes  6\ /x  
Full cure:    100oC for 1 hour (minimum) <`*}$Zh  
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin S(](C  
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Mechanical Data U>6MT@\  
1. Tensile strength:    800 psi (min) egboLqn  
2. Lap shear strength:    250 psi (min) Eq^k@  
3. Elongation:        80% (min) 2#l<L>#  
4. Hardness:        50 Shore D n'=-bj`  
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Thermal and Optical Data: Zws[}G"7h  
1.  Working temperature range: -40oC – 230oC FR9qW$B
  
2.    Decomposition temperature:    onset at 3000C (by TGA) ;T~]|#T\6  
3.    No change in modulus with temperature LY2oBX@fC  
4.    CTE ~ 200 ppm/oC %o9@[o .]  
5.    Refractive index:        1.43 j?%^N\9  
6.    Transmittance(%)    >90  @260-700nm 0ZPwE
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