寻找硅胶。用在投影仪的光学元件上。

  参数参考 o_&*?k*  
Curing E3,Nc`'m9  
Pre-cure:    100oC for 15 minutes VW*d*!  
Full cure:    100oC for 1 hour (minimum) !d3:`l<  
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin -4nSiI  
137:T:  
Mechanical Data D;WQNlTU  
1. Tensile strength:    800 psi (min) Y@R9+7!  
2. Lap shear strength:    250 psi (min) p;YS`*!s  
3. Elongation:        80% (min) +C){&/=#  
4. Hardness:        50 Shore D 'AJlkLqm#>  
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Thermal and Optical Data: L&h90Az1W  
1.  Working temperature range: -40oC – 230oC Vrx3%_NkQ  
2.    Decomposition temperature:    onset at 3000C (by TGA) 4]%v%64U  
3.    No change in modulus with temperature qQx5n  
4.    CTE ~ 200 ppm/oC Z2hIoCT  
5.    Refractive index:        1.43 |sklY0?l(  
6.    Transmittance(%)    >90  @260-700nm k1Thjt  
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