1 backplane 背板 &|,s{?z2
2 Band gap voltage reference 带隙电压参考 S_T
3 benchtop supply 工作台电源 LV=^jsQ5
4 Block Diagram 方块图 5 Bode Plot 波特图 >40
GP#Vz
6 Bootstrap 自举 Rkr^Z?/GH
7 Bottom FET Bottom FET s*{mT6s+T
8 bucket capcitor 桶形电容 K50t%yu#T]
9 chassis 机架 (wlfMiO
10 Combi-sense Combi-sense *K!7R2Rat
11 constant current source 恒流源 le2/Zs$
12 Core Sataration 铁芯饱和 {3SdX
13 crossover frequency 交叉频率 b7f0#*(?
14 current ripple 纹波电流 xc*!W*04
15 Cycle by Cycle 逐周期 x?>!UqgkY
16 cycle skipping 周期跳步 ;x RjQR
17 Dead Time 死区时间 Bb_}YU2#
18 DIE Temperature 核心温度 RR'(9QJ$
19 Disable 非使能,无效,禁用,关断 {*nEKPq(_*
20 dominant pole 主极点 X o_] v
21 Enable 使能,有效,启用 zK /f$}
22 ESD Rating ESD额定值 Z_jn27AC
23 Evaluation Board 评估板
!Pe1o-O
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. y$v@wb5
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 P[1m0!,B
25 Failling edge 下降沿 As p8qHS
26 figure of merit 品质因数 E.4n}s
27 float charge voltage 浮充电压 IKtiR8
28 flyback power stage 反驰式功率级 &V FjHW
29 forward voltage drop 前向压降 xtu]F
30 free-running 自由运行 (-#rFO5~l
31 Freewheel diode 续流二极管 B{N=0 cSi
32 Full load 满负载 33 gate drive 栅极驱动 kYTOldfY2
34 gate drive stage 栅极驱动级 WkcH5[
35 gerber plot Gerber 图 Flne=ij6g
36 ground plane 接地层 ->Q`'@'|P
37 Henry 电感单位:亨利 U!.~XT=
38 Human Body Model 人体模式 5@CpP-W#
39 Hysteresis 滞回 sOjF?bCdO
40 inrush current 涌入电流 0\ZaMu #
41 Inverting 反相 3[iSF5%V*p
42 jittery 抖动 QQSH +
43 Junction 结点 >9(7h&[Y
44 Kelvin connection 开尔文连接 <XY;fhnB
45 Lead Frame 引脚框架 '[n)N@h
46 Lead Free 无铅 3a/[."W
u
47 level-shift 电平移动 vx PDC~3;
48 Line regulation 电源调整率 '?z9,oW{
49 load regulation 负载调整率 @yCW8]
50 Lot Number 批号 x$*E\/zi<!
51 Low Dropout 低压差 .<0=a|IAz
52 Miller 密勒 53 node 节点 ^#}dPGm
54 Non-Inverting 非反相 ef^Cc)S-Q
55 novel 新颖的 !~ BZHi6\
56 off state 关断状态
kT>r<`rt
57 Operating supply voltage 电源工作电压 %GNUnr$
58 out drive stage 输出驱动级 'MSEki67
59 Out of Phase 异相 @*bvMEE
60 Part Number 产品型号 ?,D>+::
61 pass transistor pass transistor .jLMl*6%:
62 P-channel MOSFET P沟道MOSFET Zj:a-=
63 Phase margin 相位裕度 QQ5lW
64 Phase Node 开关节点 x:=0.l#
65 portable electronics 便携式电子设备 wxH(&CB-{
66 power down 掉电 l7!U),x%/U
67 Power Good 电源正常 782[yLyv
68 Power Groud 功率地 kQqBHA
69 Power Save Mode 节电模式 )RpqZe/h4
70 Power up 上电 J(3gT}z-
71 pull down 下拉 NvEm,E\|
72 pull up 上拉 Jsl k
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) W?SP .-I
74 push pull converter 推挽转换器 N8Rm})
75 ramp down 斜降 =}B4I
76 ramp up 斜升 Ufm(2` FQ
77 redundant diode 冗余二极管 7KvXTrN!9
78 resistive divider 电阻分压器 #Nu%]
79 ringing 振 铃 <K=@-4/Bp
80 ripple current 纹波电流 '*o7_Ez-{
81 rising edge 上升沿 a7XXhsZ
82 sense resistor 检测电阻 yS1b,cxz
83 Sequenced Power Supplys 序列电源 ORV}j,Ym
84 shoot-through 直通,同时导通 Z/XM`Cy
85 stray inductances. 杂散电感 T#MA#H2
86 sub-circuit 子电路 fcgDU *A%
87 substrate 基板 m1~qaD<DZ$
88 Telecom 电信 oG4w8+N
89 Thermal Information 热性能信息 B2ek&<I7N
90 thermal slug 散热片 c n\k`8
91 Threshold 阈值 Oz4,Y+[#
92 timing resistor 振荡电阻 2VoEQ
93 Top FET Top FET 6Tm
Rc
94 Trace 线路,走线,引线 W\ 1bE(AwZ
95 Transfer function 传递函数 [dSDg2]
96 Trip Point 跳变点 n"^/UQ|#j
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) $V`KrA~]
98 Under Voltage Lock Out (UVLO) 欠压锁定 w^:V."}-$
99 Voltage Reference 电压参考 rW=k%#
p
100 voltage-second product 伏秒积 k"Z"$V2i
101 zero-pole frequency compensation 零极点频率补偿 %a)0?U
102 beat frequency 拍频 r`&2-]
103 one shots 单击电路 kg/+vJ
104 scaling 缩放 (>!]A6^L~
105 ESR 等效串联电阻 [Page] 0)6i~Mg lY
106 Ground 地电位 +d6Aw}*
107 trimmed bandgap 平衡带隙 >|UrxJ7
108 dropout voltage 压差 I]uOMWZs
109 large bulk capacitance 大容量电容 VuX>
110 circuit breaker 断路器 2$j
Ot}
111 charge pump 电荷泵 j#Ky0+@V
112 overshoot 过冲 .-O@UQx.I
$'J6#Vs
印制电路printed circuit H|rX$P
印制线路 printed wiring avHD'zU}N
印制板 printed board &viwo}ls0
印制板电路 printed circuit board A-Q{*{^#
印制线路板 printed wiring board 4."o.:8x
印制元件 printed component &6,Yjs:T m
印制接点 printed contact z^ a6%N
印制板装配 printed board assembly P/C+L[X=
板 board tpNtoqg_$
刚性印制板 rigid printed board
BdE`p{
挠性印制电路 flexible printed circuit :XPC0^4s
挠性印制线路 flexible printed wiring Y^94iOk%T
齐平印制板 flush printed board 4BduUH
金属芯印制板 metal core printed board O$<%z[
金属基印制板 metal base printed board [G'!`^V,
多重布线印制板 mulit-wiring printed board |&0"N[t
塑电路板 molded circuit board `lu"y F
散线印制板 discrete wiring board $$bTd3N+
微线印制板 micro wire board &k_wqV
积层印制板 buile-up printed board ; $ ?jR
c
表面层合电路板 surface laminar circuit fzkCI
埋入凸块连印制板 B2it printed board Q~b M
载芯片板 chip on board c:@OX[##
埋电阻板 buried resistance board >^a"Z[s[
母板 mother board }Pm(oR'KTJ
子板 daughter board w.T=Lzp
背板 backplane +GYI2
裸板 bare board LrM.wr zI/
键盘板夹心板 copper-invar-copper board ~J. Fl[
动态挠性板 dynamic flex board syC"eH3{
静态挠性板 static flex board cyHak u+
可断拼板 break-away planel IioE<wS)
电缆 cable qm'C^X?
挠性扁平电缆 flexible flat cable (FFC) jL7MmR#y5"
薄膜开关 membrane switch bWQORjnd8
混合电路 hybrid circuit [oU+b(
厚膜 thick film OFQi&/
厚膜电路 thick film circuit lM|WOmD
薄膜 thin film YPff)0Nh
薄膜混合电路 thin film hybrid circuit CSX$Pk*
互连 interconnection \9|]
导线 conductor trace line [b
k&Nd[
齐平导线 flush conductor 49J+&G?)j
传输线 transmission line ?CT^Zegmr
跨交 crossover $?/Xk%d+
板边插头 edge-board contact \_I)loPc8
增强板 stiffener SJ~I
r#
基底 substrate d*\C^:Z
基板面 real estate X%9xuc
导线面 conductor side _#YHc[Wz
元件面 component side ]}l+ !NV<
焊接面 solder side J6["j
导电图形 conductive pattern 5#9Wd9LP
非导电图形 non-conductive pattern ndCS<ojcBP
基材 base material @+CSY-g$
层压板 laminate Q@ ) rw0$
覆金属箔基材 metal-clad bade material 1=q?#PQ
覆铜箔层压板 copper-clad laminate (CCL) M%5$-;6~_
复合层压板 composite laminate mZ5K hPvf8
薄层压板 thin laminate dXo'#.
基体材料 basis material W$t}3Ru
预浸材料 prepreg xu?QK6D:
粘结片 bonding sheet ^9*|_\3N
预浸粘结片 preimpregnated bonding sheer xXU/m|
环氧玻璃基板 epoxy glass substrate <<2b2?aS`
预制内层覆箔板 mass lamination panel @`y?\fWh
内层芯板 core material eRx[&-c
粘结层 bonding layer vs0H^L
粘结膜 film adhesive pTX'5
无支撑胶粘剂膜 unsupported adhesive film HlL@{<
覆盖层 cover layer (cover lay) dzv,)X
增强板材 stiffener material <9@]|
铜箔面 copper-clad surface ah Xq{>
去铜箔面 foil removal surface *1)NABp6D
层压板面 unclad laminate surface 8(_g] u#B;
基膜面 base film surface "xc*A&Sg
胶粘剂面 adhesive faec "g:&Ge*X
原始光洁面 plate finish s^t1PfP(,
粗面 matt finish mV(x&`Cx
剪切板 cut to size panel ,/b/O4`;y
超薄型层压板 ultra thin laminate <:{[Zvl'k
A阶树脂 A-stage resin +@)$l+kk9
B阶树脂 B-stage resin ccRk4xR
C阶树脂 C-stage resin m',_kY3
环氧树脂 epoxy resin IM5^E#-g7
酚醛树脂 phenolic resin _}D?+x,C8
聚酯树脂 polyester resin vlN. OQ
聚酰亚胺树脂 polyimide resin *-!ndbf
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin U}wq~fD
丙烯酸树脂 acrylic resin UlN|Oy,
三聚氰胺甲醛树脂 melamine formaldehyde resin l`%}
{3r9
多官能环氧树脂 polyfunctional epoxy resin hic$13KuP
溴化环氧树脂 brominated epoxy resin Rw{v"n
环氧酚醛 epoxy novolac 8kc'|F\
氟树脂 fluroresin ,M h/3DPgE
硅树脂 silicone resin u[|S*(P
硅烷 silane *4^]?Y\*
聚合物 polymer LLHOWD C(2
无定形聚合物 amorphous polymer |M/
\'pOe
结晶现象 crystalline polamer lg
双晶现象 dimorphism UO!6&k>c
共聚物 copolymer j p]geV54
合成树脂 synthetic z+D,:!yF
热固性树脂 thermosetting resin [Page] 2P=~3g*
热塑性树脂 thermoplastic resin IIn\{*|mW
感光性树脂 photosensitive resin h%^kA@3F
环氧值 epoxy value _r5Ild@n
双氰胺 dicyandiamide ?~Ed
n-"Y
粘结剂 binder "l,EcZRjTz
胶粘剂 adesive [k=9 +0p
固化剂 curing agent 2y7q
x1$C
阻燃剂 flame retardant :*+BBC
遮光剂 opaquer BBJ]>lQ
增塑剂 plasticizers 2,Dc]oj
不饱和聚酯 unsatuiated polyester }R5&[hxh4t
聚酯薄膜 polyester uv!qE1z@':
聚酰亚胺薄膜 polyimide film (PI) X$&Sw3c
聚四氟乙烯 polytetrafluoetylene (PTFE) /aa;M*Qp
增强材料 reinforcing material W!B4<'Fjc
折痕 crease v
4b`19}
云织 waviness HPdwx
V
鱼眼 fish eye E=*Q\3G~
毛圈长 feather length {=4:Tgw
厚薄段 mark (*Q|;
裂缝 split [f(^vlK
捻度 twist of yarn c@B%`6kF
浸润剂含量 size content .u;TeP
浸润剂残留量 size residue gq1Y]t|4F
处理剂含量 finish level @VS5Mg8
偶联剂 couplint agent a&VJYAB
断裂长 breaking length HU+H0S~g
吸水高度 height of capillary rise J+gsmP-_
湿强度保留率 wet strength retention Ru aJ9O
白度 whitenness +5mkMZ
导电箔 conductive foil |+~2sbM
铜箔 copper foil ~MQf($]
压延铜箔 rolled copper foil ^Jc0c)*
光面 shiny side es FL<T
粗糙面 matte side =F[,-B~
处理面 treated side 2`U&,,-Mf
防锈处理 stain proofing u.Yb#?
双面处理铜箔 double treated foil h5keYBA
模拟 simulation 7uNI
逻辑模拟 logic simulation 6yM dl~.
电路模拟 circit simulation ]LOtwY
时序模拟 timing simulation .T-p]9*p
模块化 modularization j5^b~F%
设计原点 design origin ]qHO{b4k
优化(设计) optimization (design) 6e|5qKr
供设计优化坐标轴 predominant axis v>!}cB/6
表格原点 table origin "Oko|3
元件安置 component positioning 2U{RA's
比例因子 scaling factor Bcon4
扫描填充 scan filling kxwm08/|f
矩形填充 rectangle filling
@+#p:sE
填充域 region filling I|;#VejX
实体设计 physical design ^v|!(h\ZC
逻辑设计 logic design 3*JybMo"
逻辑电路 logic circuit (Fd4Gw<sq
层次设计 hierarchical design 5&@ U T
自顶向下设计 top-down design ScKfr
自底向上设计 bottom-up design rep"xV&|>o
费用矩阵 cost metrix FCJ(D!
元件密度 component density liP{Mu/LO
自由度 degrees freedom LXV6Ew5E
出度 out going degree 7~f6j:{|z
入度 incoming degree ,jcp"-5#j
曼哈顿距离 manhatton distance $?{zV$r1
欧几里德距离 euclidean distance %BLKB%5
网络 network QjU"|$
阵列 array >C3 9`1
段 segment
N&.p\T&t
逻辑 logic
e90z(EF?0
逻辑设计自动化 logic design automation L1i> %5:g
分线 separated time vy?YA-
分层 separated layer cEu98nP
定顺序 definite sequence EtGr&\,
导线(通道) conduction (track) CNYchE,}
导线(体)宽度 conductor width T9?_ `h
导线距离 conductor spacing Y%@'a~
导线层 conductor layer l}/UriZ0
导线宽度/间距 conductor line/space Z Uv_u6aD
第一导线层 conductor layer No.1 b] V=wZ
o
圆形盘 round pad @7'gr>_E
方形盘 square pad [?*^&[
菱形盘 diamond pad IPR396J+-
长方形焊盘 oblong pad >,vuC4v-
子弹形盘 bullet pad jqedHnx
泪滴盘 teardrop pad 1j,Y
雪人盘 snowman pad <~w#sIh
形盘 V-shaped pad V =x>k:l~s
环形盘 annular pad 0in6z
非圆形盘 non-circular pad DI[Ee?
隔离盘 isolation pad 9t1_"{'N1
非功能连接盘 monfunctional pad JH#+E04#
偏置连接盘 offset land PQr
N";+
腹(背)裸盘 back-bard land (tN$G:+")F
盘址 anchoring spaur UUq9UV-h
连接盘图形 land pattern %xz02$k
连接盘网格阵列 land grid array K%B i8d
孔环 annular ring .*"IJD9
元件孔 component hole !
+ 7ve[z
安装孔 mounting hole pE N`&'4
支撑孔 supported hole $h9!"f[|j
非支撑孔 unsupported hole YeJdkt
导通孔 via +
aFjtb
镀通孔 plated through hole (PTH) 'C<=b UM
余隙孔 access hole eSU8/9B
盲孔 blind via (hole) :9Pqy
pd+
埋孔 buried via hole d+'+z %s%
埋,盲孔 buried blind via l1S1CS
任意层内部导通孔 any layer inner via hole ',pPs=
全部钻孔 all drilled hole u 36;;z
定位孔 toaling hole C7PiuL?
无连接盘孔 landless hole $@Fj_
N
中间孔 interstitial hole DJ^JUVi
无连接盘导通孔 landless via hole ~@;7}Aag
引导孔 pilot hole \Y$NGB=2[
端接全隙孔 terminal clearomee hole 9HP--Z=
准尺寸孔 dimensioned hole [Page] VK#zmEiB
在连接盘中导通孔 via-in-pad v5o%y:~
孔位 hole location aXagiz\;
孔密度 hole density e|P60cd /
孔图 hole pattern PdZSXP4;k
钻孔图 drill drawing L z
装配图assembly drawing tG-MC&;=
参考基准 datum referan JiR|+6"7
1) 元件设备 1Rh&04O>VL
",m5}mk:4
三绕组变压器:three-column transformer ThrClnTrans ghl9gFFj
双绕组变压器:double-column transformer DblClmnTrans LmE-&
电容器:Capacitor sBwgl9
并联电容器:shunt capacitor nj[6c
电抗器:Reactor D[mYrWHpn
母线:Busbar m[f\I^\%8
输电线:TransmissionLine Fwr,e;Z
发电厂:power plant 53QP~[F8R]
断路器:Breaker W=*\4B]
刀闸(隔离开关):Isolator X)~-MY*p
分接头:tap 7^F?key?
电动机:motor jX%Q
(2) 状态参数 OsXQWSkj~
tdm /U
有功:active power R)=<q]Ms
无功:reactive power +j,;g#d
电流:current Sa0\93oa
容量:capacity -_3.]o/J
电压:voltage 3A5" %
档位:tap position jv ";?*I6.
有功损耗:reactive loss qA30G~S
无功损耗:active loss RUEUn
功率因数:power-factor ]x|sTKv2
功率:power dj=n1f+;[
功角:power-angle e#wn;wo?
电压等级:voltage grade xM:dFS
空载损耗:no-load loss RwE]t$T/
铁损:iron loss (:1j-
铜损:copper loss wa C%o%fD
空载电流:no-load current H4N==o
阻抗:impedance PJLA^e C7>
正序阻抗:positive sequence impedance 1gC=xMAT
负序阻抗:negative sequence impedance 7"NUof?i
零序阻抗:zero sequence impedance Z8 x(_ft5
电阻:resistor !q X7
电抗:reactance ]O[f#lG
电导:conductance &e(de$}xt
电纳:susceptance S%4K-I
无功负载:reactive load 或者QLoad KH;e)91
有功负载: active load PLoad ^%L$$V
nG
遥测:YC(telemetering) y&
)z\8
遥信:YX [8"nRlXH
励磁电流(转子电流):magnetizing current B 5?(gb"
定子:stator r~sGot+sQA
功角:power-angle O@[q./VV,
上限:upper limit 8wBns)wy @
下限:lower limit v1}
$FmHL"
并列的:apposable N5_v}<CN
高压: high voltage 'D1@+FFU0
低压:low voltage =X`/.:%|[
中压:middle voltage GXAcyOV
电力系统 power system f /jN $p
发电机 generator c[5>kQ-nq
励磁 excitation 8S0)_L#S
励磁器 excitor K= 69z
电压 voltage /ZczfM\
电流 current Z5+0?X0i
母线 bus = *sP,
6
变压器 transformer pY2nv/
升压变压器 step-up transformer s:jwwE2
高压侧 high side htjJ0>&
输电系统 power transmission system W?$
ImW
输电线 transmission line NmeTp?)m
固定串联电容补偿fixed series capacitor compensation A%9"7]:
稳定 stability ;{>z\6N
电压稳定 voltage stability QoqdPk#1
功角稳定 angle stability xTe?*
暂态稳定 transient stability p5*i
d5
电厂 power plant P6X 4m(t
能量输送 power transfer '\9A78NV{;
交流 AC a9"Gg}h\
装机容量 installed capacity bC&_OU:
电网 power system xT@\FwPr
落点 drop point 4Q$\hO3b
开关站 switch station ,3^N_>d$W
双回同杆并架 double-circuit lines on the same tower `+<5QtD
变电站 transformer substation 5!?><{k=%
补偿度 degree of compensation *bZV4}
高抗 high voltage shunt reactor %1#5
7-
无功补偿 reactive power compensation ;1BbRnCr
故障 fault gSP|;Gy
调节 regulation [E=t{&t
裕度 magin Z!#zr@'k
三相故障 three phase fault JK_sl>v.7
故障切除时间 fault clearing time n&@\[,B
极限切除时间 critical clearing time u tQ_!3u
切机 generator triping g6N{Z e Wg
高顶值 high limited value 7)[4|I
强行励磁 reinforced excitation w{0UA6 +
线路补偿器 LDC(line drop compensation) ?bbguwo~F
机端 generator terminal hG3b7!^#g
静态 static (state) eX}uZR
动态 dynamic (state) 0`_Gj{:L
单机无穷大系统 one machine - infinity bus system 6N]v9uXZ
机端电压控制 AVR |vzGFfRI
电抗 reactance z7J#1q~:yY
电阻 resistance '*22j ]
功角 power angle yaeX-'(Fv[
有功(功率) active power /VJ[1o^
无功(功率) reactive power 1MOQ/N2BR
功率因数 power factor KaOS!e'
无功电流 reactive current [
h%ci3
下降特性 droop characteristics 8on2BC2
斜率 slope YT#"HYO
额定 rating m%m8002
变比 ratio xAsbP$J:
参考值 reference value l^fz
电压互感器 PT z )k\p'0"
分接头 tap DUa`8cE}
下降率 droop rate 8W#whK2El
仿真分析 simulation analysis RzNv|
传递函数 transfer function 5&6S["lt
框图 block diagram 5y@JMQSO
受端 receive-side \U,.!'+
裕度 margin YwEXTy>0
同步 synchronization <1V!-D4xu
失去同步 loss of synchronization WFy90*@Z
阻尼 damping 5^[V%4y>
摇摆 swing entO"~*EX
保护断路器 circuit breaker iYBs )
电阻:resistance 8L.Y0_x
电抗:reactance |UE&M3S
阻抗:impedance 2{g~6U.
电导:conductance H$WuT;cTE
电纳:susceptance