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2008-01-12 21:59 |
LED照明专业术语中英文对照
1 backplane 背板 sqT^t! 2 Band gap voltage reference 带隙电压参考 R+s1[Z 3 benchtop supply 工作台电源 B9}E
{)T? 4 Block Diagram 方块图 5 Bode Plot 波特图 =w6}\ 'X 6 Bootstrap 自举 =9(tsB gTX 7 Bottom FET Bottom FET vuZf#\zh} 8 bucket capcitor 桶形电容 +Jdm#n?_ 9 chassis 机架 .W$
sxVXB 10 Combi-sense Combi-sense )'`CC>Q 11 constant current source 恒流源 4 HW; 12 Core Sataration 铁芯饱和 wsqLXZI 13 crossover frequency 交叉频率 GJvp{U}y9I 14 current ripple 纹波电流 dKb ^x^ 15 Cycle by Cycle 逐周期 b) Ux3PB 16 cycle skipping 周期跳步 %0lf 17 Dead Time 死区时间 nz[
m3] 18 DIE Temperature 核心温度 "(<%Ua 19 Disable 非使能,无效,禁用,关断 ~U9q-/(J/ 20 dominant pole 主极点 [$;,Ua-mt 21 Enable 使能,有效,启用 OMvT;Vgg 22 ESD Rating ESD额定值 s047"Q 23 Evaluation Board 评估板 P0)AUi 24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. vnL?O8`c 超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 D!S8oKW 25 Failling edge 下降沿 /w0w*nH 26 figure of merit 品质因数 BR3wX4i\ 27 float charge voltage 浮充电压 5*Btb#: 28 flyback power stage 反驰式功率级 # v+;: 29 forward voltage drop 前向压降 /eb-'m 30 free-running 自由运行 <W2ZoqaV 31 Freewheel diode 续流二极管 8A!'I<S1 32 Full load 满负载 33 gate drive 栅极驱动 RbKwO}
z$q 34 gate drive stage 栅极驱动级 ^;4YZwW5w 35 gerber plot Gerber 图 )O&z5n7t4s 36 ground plane 接地层 :WO{x g 37 Henry 电感单位:亨利 \qB6TiB/ 38 Human Body Model 人体模式 .'&V#D0 39 Hysteresis 滞回 AJdp6@O+ 40 inrush current 涌入电流 me:iQ.g 41 Inverting 反相 5/,Qz>QE[ 42 jittery 抖动 @+E7w6>% 43 Junction 结点 ++0rF\& 44 Kelvin connection 开尔文连接 cl_TF[n? 45 Lead Frame 引脚框架 5x2L(l-2 46 Lead Free 无铅 m@[3~
6A 47 level-shift 电平移动 T6X}Ws " 48 Line regulation 电源调整率 ~2(]ZfO?>H 49 load regulation 负载调整率 h9jc,Xu5X 50 Lot Number 批号 c})wD+1 51 Low Dropout 低压差 03Ukw/D& 52 Miller 密勒 53 node 节点 ;Gh>44UM[ 54 Non-Inverting 非反相 n$xszuNJ` 55 novel 新颖的 >uHb ^ 56 off state 关断状态 B$j' /e-Zk 57 Operating supply voltage 电源工作电压 5VZjDg? 58 out drive stage 输出驱动级 %4/xH9 59 Out of Phase 异相 tpZ->)1 60 Part Number 产品型号 "[.ne)/MC 61 pass transistor pass transistor d#8e~ 62 P-channel MOSFET P沟道MOSFET 7f*
RM 63 Phase margin 相位裕度
#Z0-8<\ 64 Phase Node 开关节点 @h9K 65 portable electronics 便携式电子设备 2lo:a{}j 66 power down 掉电 djGs~H>;U_ 67 Power Good 电源正常 wV>c" J 68 Power Groud 功率地 ]Zk}ZG>6 69 Power Save Mode 节电模式 0MrN:M2B 70 Power up 上电 #Wk5E2t 71 pull down 下拉 a
ea0+,; 72 pull up 上拉 x0ne8NDP 73 Pulse by Pulse 逐脉冲(Pulse by Pulse) h$/JGm5uDb 74 push pull converter 推挽转换器 USFg_sO 75 ramp down 斜降 U=DEV7 E 76 ramp up 斜升 ]'UgZsJ 77 redundant diode 冗余二极管 rs_h}+6"s 78 resistive divider 电阻分压器 T%~SM5 79 ringing 振 铃 SBL+e]P 80 ripple current 纹波电流 g}Mi9Kp 81 rising edge 上升沿 Ld~ q1*7J 82 sense resistor 检测电阻 Wn~ZA# 83 Sequenced Power Supplys 序列电源 4 4`WYK l 84 shoot-through 直通,同时导通 S<pkc8 85 stray inductances. 杂散电感 mLaCkn 86 sub-circuit 子电路 7>&1nBh. f 87 substrate 基板 tR;{. 88 Telecom 电信 &mdB\Y?^ 89 Thermal Information 热性能信息 QTE:K? 90 thermal slug 散热片 Y/D-V 91 Threshold 阈值 aaT5u14% 92 timing resistor 振荡电阻 }^9paU 93 Top FET Top FET 73)Ll"( 94 Trace 线路,走线,引线 Fs) 95 Transfer function 传递函数 =y<0UU 96 Trip Point 跳变点 Km"&mT $ 97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) Y;g% e3nu 98 Under Voltage Lock Out (UVLO) 欠压锁定 GMe0;StT 99 Voltage Reference 电压参考 ^Et,TF\ 100 voltage-second product 伏秒积 h1c{?xH2r 101 zero-pole frequency compensation 零极点频率补偿 f~R[&q+ 102 beat frequency 拍频 BUDGyl/= 103 one shots 单击电路 XmlIj8%9[& 104 scaling 缩放 @(){/cF 105 ESR 等效串联电阻 [Page] tvT4S 106 Ground 地电位 D:)~%wu Lt 107 trimmed bandgap 平衡带隙 Z/c_kf[ 108 dropout voltage 压差 `V@z&n0P6 109 large bulk capacitance 大容量电容 ` yYvYc 110 circuit breaker 断路器 |(&oI(l5K 111 charge pump 电荷泵 506V0]`/ 112 overshoot 过冲 ydup)[n )$h-ZYc 印制电路printed circuit MX?}?"y 印制线路 printed wiring
pl?kS8#U? 印制板 printed board Bz:&f46{ 印制板电路 printed circuit board #//
%&k 印制线路板 printed wiring board iJ4<f->t 印制元件 printed component i pwW%"6 印制接点 printed contact w?S8@|MK 印制板装配 printed board assembly z'*ml ? 板 board 4]EvT=Ro 刚性印制板 rigid printed board )WmZP3$^TX 挠性印制电路 flexible printed circuit .aJ%am/:% 挠性印制线路 flexible printed wiring B*2{M 齐平印制板 flush printed board m#;.yR 金属芯印制板 metal core printed board QY6O(= 金属基印制板 metal base printed board :l;,m}#@ 多重布线印制板 mulit-wiring printed board gW}} 5Xq 塑电路板 molded circuit board +[_gyLN<5b 散线印制板 discrete wiring board &1~Re.*B 微线印制板 micro wire board v4D!7t&v" 积层印制板 buile-up printed board j3LNnZY 表面层合电路板 surface laminar circuit Y&:/~&' 埋入凸块连印制板 B2it printed board @2?=3Wf 载芯片板 chip on board ey*,StT5a 埋电阻板 buried resistance board }H; ]k-) 母板 mother board A(NEWO 子板 daughter board %]!?{U\*k 背板 backplane H(?e&Qkg 裸板 bare board 3<3t;&e 键盘板夹心板 copper-invar-copper board $82zy q 动态挠性板 dynamic flex board Cc*|Zw 静态挠性板 static flex board Bu':2"7 可断拼板 break-away planel HwM/}-t 电缆 cable
ZRO.bMgZF 挠性扁平电缆 flexible flat cable (FFC) [d\#[l_ 薄膜开关 membrane switch h~:H?pj3g 混合电路 hybrid circuit =uS8>.Qj 厚膜 thick film TD%WJ9K\ 厚膜电路 thick film circuit bje'Oolc 薄膜 thin film Nl=+.d6Qo 薄膜混合电路 thin film hybrid circuit kHZKj!!R 互连 interconnection |\/~
8qP 导线 conductor trace line #|q;t 齐平导线 flush conductor *6'_5~G 传输线 transmission line nE4l0[_ 跨交 crossover Sw[=S '(l 板边插头 edge-board contact ,d5ia4\K 增强板 stiffener )|Jr|8 基底 substrate 95VqaR, 基板面 real estate uz8nRS s 导线面 conductor side [&fWF~D-p< 元件面 component side !SN6
?Xy 焊接面 solder side RR8U
Cv 导电图形 conductive pattern K:C+/O 非导电图形 non-conductive pattern U24V55ZnI 基材 base material i;gw=Be 层压板 laminate {XyG1 覆金属箔基材 metal-clad bade material YK7gd|LR] 覆铜箔层压板 copper-clad laminate (CCL) &MBOAHhze 复合层压板 composite laminate S|tA[klh 薄层压板 thin laminate {3jm%ex 基体材料 basis material >Y44{D\` 预浸材料 prepreg x[zKtX 粘结片 bonding sheet CdE2w?1 预浸粘结片 preimpregnated bonding sheer [sjrb?Xd 环氧玻璃基板 epoxy glass substrate <ihhV e 预制内层覆箔板 mass lamination panel k:@a[qnY 内层芯板 core material l^)o'YS y 粘结层 bonding layer PsacXZNs\N 粘结膜 film adhesive "bLP3 无支撑胶粘剂膜 unsupported adhesive film lrM.RM96 覆盖层 cover layer (cover lay) bwv/{3G,Ys 增强板材 stiffener material W5M
] 铜箔面 copper-clad surface 3ZLr"O1l ) 去铜箔面 foil removal surface d91I 层压板面 unclad laminate surface m/SJ4op$ 基膜面 base film surface qFB9,cUqh 胶粘剂面 adhesive faec aU,0gvI(} 原始光洁面 plate finish }mkA Hmu4 粗面 matt finish Nu>sp,|A 剪切板 cut to size panel $@XPL~4 超薄型层压板 ultra thin laminate bL6L-S A阶树脂 A-stage resin 7]R6 B阶树脂 B-stage resin :5q^\xmmq C阶树脂 C-stage resin ;))[P_$zB 环氧树脂 epoxy resin _:/Cl9~ 酚醛树脂 phenolic resin AycA:< 聚酯树脂 polyester resin rcD.P?" 聚酰亚胺树脂 polyimide resin 5M/%%Ox 双马来酰亚胺三嗪树脂 bismaleimide-triazine resin '` BjRg57] 丙烯酸树脂 acrylic resin e)fJd*P 三聚氰胺甲醛树脂 melamine formaldehyde resin {m1t~ S 多官能环氧树脂 polyfunctional epoxy resin /1s 9;'I 溴化环氧树脂 brominated epoxy resin $_%2D3-;D 环氧酚醛 epoxy novolac eP-R""uPw 氟树脂 fluroresin w yuJSB 硅树脂 silicone resin *RUd!]bh 硅烷 silane Xuz8"b5^Zx 聚合物 polymer N?Z+zN&P 无定形聚合物 amorphous polymer 0%(4G83gw 结晶现象 crystalline polamer (@N~ j& 双晶现象 dimorphism uaZ"x&oZ# 共聚物 copolymer >vNk kxWyQ 合成树脂 synthetic Y,<WX
v 热固性树脂 thermosetting resin [Page] o}j_eHl{
热塑性树脂 thermoplastic resin KBUAdpU8 感光性树脂 photosensitive resin giA~+m~fN 环氧值 epoxy value Rz])wBv e 双氰胺 dicyandiamide g(z#h$@S 粘结剂 binder Cz$Hk;3\6 胶粘剂 adesive qW` XA 固化剂 curing agent 4q@9 阻燃剂 flame retardant * 7zN 遮光剂 opaquer tOlzOBzR 增塑剂 plasticizers &j
wnM 不饱和聚酯 unsatuiated polyester !<['iM 聚酯薄膜 polyester ID{Pzmt- 聚酰亚胺薄膜 polyimide film (PI) _z_3%N
聚四氟乙烯 polytetrafluoetylene (PTFE) S|=rF<]my 增强材料 reinforcing material hz>yv@1 折痕 crease \|b1s @c8 云织 waviness " N`V*0h 鱼眼 fish eye M7cI$=G 毛圈长 feather length )=SYJ-ta< 厚薄段 mark h\: tUEg#J 裂缝 split (0+ GLI8 捻度 twist of yarn {) '"
k6w 浸润剂含量 size content 5G42vTDzS4 浸润剂残留量 size residue `)gkkZ$)j 处理剂含量 finish level '8kL1 偶联剂 couplint agent E}CqVuU$ 断裂长 breaking length 'piF_5(@ 吸水高度 height of capillary rise wTgx(LtH 湿强度保留率 wet strength retention gC,0+Y~ 白度 whitenness V }r_ 导电箔 conductive foil {H7$uiq3:B 铜箔 copper foil dM@k(9| 压延铜箔 rolled copper foil *M**h-p2' 光面 shiny side A)`fD
%+ 粗糙面 matte side Z({`9+/>u 处理面 treated side #VMBn} 防锈处理 stain proofing )uv$tnP* 双面处理铜箔 double treated foil gWU(uBS 模拟 simulation 3
v,ae7$U& 逻辑模拟 logic simulation -fZShOBY` 电路模拟 circit simulation nH3b<k;S 时序模拟 timing simulation YQ[&h 模块化 modularization bUg 2Bm!y 设计原点 design origin :N'[de 优化(设计) optimization (design) W~@GK 供设计优化坐标轴 predominant axis S r#fyr 表格原点 table origin ^Ihdq89 t 元件安置 component positioning B#V4 比例因子 scaling factor @SMy0:c: 扫描填充 scan filling v.8S
V] 矩形填充 rectangle filling 9[]"%6 填充域 region filling #lVl?F+~ 实体设计 physical design [ QL<&:s& 逻辑设计 logic design J;]@?( 逻辑电路 logic circuit Qre&N_ 层次设计 hierarchical design sB1tce 自顶向下设计 top-down design BrH`:Dw 自底向上设计 bottom-up design `?S?)0B 费用矩阵 cost metrix . L6@Rs 元件密度 component density ]e3}9. 自由度 degrees freedom L5N{ie_ 出度 out going degree bJMcI8` 入度 incoming degree Q9'p3"yoE 曼哈顿距离 manhatton distance }T*xT>p^3 欧几里德距离 euclidean distance Y
Z2VP 网络 network ?Dp^dR 阵列 array ?~y(--.t;T 段 segment N)I
T? 逻辑 logic arH\QPaka' 逻辑设计自动化 logic design automation (9q {J(44 分线 separated time aiX;D/t? 分层 separated layer ?kxWj(D 定顺序 definite sequence qA\kx#v]P 导线(通道) conduction (track) ob5nk^y 导线(体)宽度 conductor width C-
Rie[ 导线距离 conductor spacing 9PfU'm|h 导线层 conductor layer JY8"TQ$x 导线宽度/间距 conductor line/space N'BctKL 第一导线层 conductor layer No.1 Ewsg&CCN 圆形盘 round pad rxk{Li<9 方形盘 square pad S7>gNE;%]u 菱形盘 diamond pad scEQDV 长方形焊盘 oblong pad bvRGTOxO 子弹形盘 bullet pad .`#R%4Xl 泪滴盘 teardrop pad ,%G2>PBt 雪人盘 snowman pad |(ju!& 形盘 V-shaped pad V b1^Yxe#L 环形盘 annular pad *K^O oS 非圆形盘 non-circular pad 9F1stT0G% 隔离盘 isolation pad M{RZ-)IC 非功能连接盘 monfunctional pad yQ&%* ?J 偏置连接盘 offset land ffd3QQ 腹(背)裸盘 back-bard land Yf`.Cq_: 盘址 anchoring spaur '*Mb
.s" 连接盘图形 land pattern 9+Hb` 连接盘网格阵列 land grid array _%%"Y} 孔环 annular ring & | |