| cswmsc |
2007-02-28 23:18 |
真空术语全集
“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 "'\f?A9 --------------------------------------------------- XbMAcgS 真空术语 y&{ Z"+B5 rtY4B~_ 1.标准环境条件 standard ambient condition: o dTg.m 2.气体的标准状态 standard reference conditions forgases: &j_:VP 3.压力(压强)p pressure: |cd=7[B 4.帕斯卡Pa pascal: 6>Ca O 5.托Torr torr: nps"nggk 6.标准大气压atm standard atmosphere: BLQD=?Q 7.毫巴mbar millibar: %eDJ]\*^X 8.分压力 partial pressure: >
g=u Y{Rf 9.全压力 total pressure: 1?N$I}? 10.真空 vacuum: 9&p;2/H 11.真空度 degree of vacuum: )o>1=Y`[z 12.真空区域 ranges of vacuum: [V _?`M 13.气体 gas: rm nfyn 14.非可凝气体 non-condensable gas: O| zLD 15.蒸汽vapor: aq<QKnU 16.饱和蒸汽压saturation vapor pressure: "}'Sk( 17.饱和度degree of saturation: W99Hq1W;r 18.饱和蒸汽saturated vapor: ]53'\TH 19.未饱和蒸汽unsaturated vapor: 2*1FW v 20.分子数密度n,m-3 number density of molecules: /'g"Ys?3 21.平均自由程ι、λ,m mean free path: KXTx{R 22.碰撞率ψ collision rate: z~+gche> 23.体积碰撞率χ volume collision rate: I'%(f@u~ 24.气体量G quantity of gas: 8`S6BkfC| 25.气体的扩散 diffusion of gas: V-
HO_GDo 26.扩散系数D diffusion coefficient; diffusivity: wM#BQe3t# 27.粘滞流 viscous flow: 1[Ffl^\ARp 28.粘滞系数η viscous factor: *2tG07kI 29.泊肖叶流 poiseuille flow: TSCc=c 30.中间流 intermediate flow: p-1
\4 31.分子流 molecular flow: b/g"ws_ 32克努曾数 number of knudsen: BL Q&VI4 33.分子泻流 molecular effusion; effusive flow: BpQ/$?5E" 34.流逸 transpiration: j*05!j<' 35.热流逸 thermal transpiration: ezR!ngt 36.分子流率qN molecular flow rate; molecular flux: d[Lr`=L; 37.分子流率密度 molecular flow rate density; density of molecular flux: 6
SosVE>Z 38.质量流率qm mass flow rare: bu|ecv 39.流量qG throughput of gas: *zR 40.体积流率qV volume flow rate: [6Nw)r(a( 41.摩尔流率qυ molar flow rate: /n|`a1! 42.麦克斯韦速度分布 maxwellian velocity distribution: b+`mh 43.传输几率Pc transmission probability: "TgE@bC 44.分子流导CN,UN molecular conductance: r=3knCEWK 45.流导C,U conductance: j/9Uf|z-_ 46.固有流导Ci,Ui intrinsic conductance: :*wjC.Z 47.流阻W resistance: =P.m5e< 48.吸附 sorption: =z$XqT.' 49.表面吸附 adsorption: i`2X[kc 50.物理吸附physisorption: 8x J]K 51.化学吸附 chemisorption: @xI:ZtM 52.吸收absorption: "RF<i3{S 53.适应系数α accommodation factor: 3h|:ew[ 54.入射率υ impingement rate: $SmmrM 55.凝结率condensation rate: '!6Py1i 56.粘着率 sticking rate: xE4iey@\} 57.粘着几率Ps sticking probability: mtON
dI 58.滞留时间τ residence time: \|}dlG 59.迁移 migration: D/&^Y'|T 60.解吸 desorption: ]O\Oj6C 61.去气 degassing: 4mY(* 2:HC 62.放气 outgassing: -OS&(7 63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: G}&{]w@ 64.蒸发率 evaporation rate: e:~r_,K 65.渗透 permeation: Vp'Zm: 66.渗透率φ permeability: 8C{mV^cn~ 67.渗透系数P permeability coefficient DGwN*>X 2. 1.真空泵 vacuum pumps z$>_c"D 1-1.容积真空泵 positive displacement pump: x{X(Y]*1S ⑴.气镇真空泵 gas ballast vacuum pump: <6s?M1J ⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: =k1 ,jn+ ⑶.干封真空泵 dry-sealed vacuum pump: #iOoi9( ⑷.往复真空泵 piston vacuum pump: s2{d<0x?v ⑸.液环真空泵 liquid ring vacuum pump: KnC;j-j ⑹.旋片真空泵 sliding vane rotary vacuum pump: a JC, ⑺.定片真空泵 rotary piston vacuum pump: Y70[Nz ⑻.滑阀真空泵 rotary plunger vacuum pump: Qw ukhD7 ⑼.余摆线真空泵 trochoidal vacuum pump: (1pxQ%yEA ⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: .#,!&Lt ⑾.罗茨真空泵 roots vacuum pump: |-HV@c] 1-2.动量传输泵 kinetic vacuum pump: -];/ *nl ⑴.牵引分子泵molecular drag pump: PSO9{! ⑵.涡轮分子泵turbo molecular pump: `;ofQz4 ⑶.喷射真空泵ejector vacuum pump: pb(YA/ ⑷.液体喷射真空泵liquid jet vacuum pump: }jQxwi) ⑸.气体喷射真空泵gas jet vacuum pump: ,{HxX0 ⑹.蒸汽喷射真空泵vapor jet vacuum pump : 0Jh^((i* ⑺.扩散泵diffusion pump : ' {L5 3cH= ⑻.自净化扩散泵self purifying diffusion pump: +h}>UK\ ⑼.分馏扩散泵 fractionating diffusion pump : vap,)kILF ⑽.扩散喷射泵diffusion ejector pump : I]"wT2@T;7 ⑾.离子传输泵ion transfer pump: w(QU '4~ 1-3.捕集真空泵 entrapment vacuum pump: >[=fbL@N<@ ⑴吸附泵adsorption pump: Lbka*@ ⑵.吸气剂泵 getter pump: @hlT7C)xK ⑶.升华(蒸发)泵 sublimation (evaporation)pump : JM-spi o ⑷.吸气剂离子泵getter ion pump: fWx
%?J ⑸.蒸发离子泵 evaporation ion pump: @O/Jy2>3H ⑹.溅射离子泵sputter ion pump: $r`^8/Mq3 ⑺.低温泵cryopump: i+$G=Z#3E }7>r, 2.真空泵零部件 R^PPgE6!$ 2-1.泵壳 pump case: 2nW:|*:/p6 2-2.入口 inlet: W0X/&v,k* 2-3.出口outlet: gBzg'Z 2-4.旋片(滑片、滑阀)vane; blade :
[*<F
2-5.排气阀discharge valve: .5ap9li] 2-6.气镇阀gas ballast valve: P8N`t&r"7 2-7.膨胀室expansion chamber: o5 UM)g 2-8.压缩室compression chamber: @)A) cBv# 2-9.真空泵油 vacuum pump oil: RKu'WD?sdH 2-10.泵液 pump fluid: )~{T 2-11.喷嘴 nozzle: "K3"s Ec% 2-13.喷嘴扩张率nozzle expansion rate: 'u6T^Y S 2-14.喷嘴间隙面积 nozzle clearance area : $TON`+lB 2-15.喷嘴间隙nozzle clearance: $4^cbk 2-16.射流jet: &@tD/Jw3 2-17.扩散器diffuser: V
_(L/6 2-18.扩散器喉部diffuser thoat: P|>
f O' 2-19.蒸汽导管vapor tube(pipe;chimney): G_GV 2-20.喷嘴组件nozzle assembly: cFcn61x- 2-21.下裙skirt: G%{J.J41F p^|IN'lx, 3.附件 &vf9Gp+MK 3-1阱trap: DJxe3< ⑴.冷阱 cold trap: g.wp
}fz ⑵.吸附阱sorption trap: Y}<w)b1e| ⑶.离子阱ion trap: zn| S3c ⑷.冷冻升华阱 cryosublimation trap: s}8(__| 3-2.挡板baffle: qPEtMvL
# 3-3.油分离器oil separator: J#h2~Hz! 3-4.油净化器oil purifier: X]^FHYjhS 3-5.冷凝器condenser: D=hy[sDBw < Y5pAStg 4.泵按工作分类 DQC=f8 4-1.主泵main pump: [{]/9E/& 4-2.粗抽泵roughing vacuum pump: OF [y$<jM 4-3.前级真空泵backing vacuum pump: ,$i2vGd 4-4.粗(低)真空泵 roughing(low)vacuum pump: S$ u`)BG): 4-5.维持真空泵holding vacuum pump: K4\{G 4-6.高真空泵high vacuum pump: f{
;L"*L 4-7.超高真空泵ultra-high vacuum pump: :@BAiKa[wa 4-8.增压真空泵booster vacuum pump: bXVH7F y %49P<vo`? 5.真空泵特性 x$:>W3?T=^ 5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: }I3 ZNd 5-2.真空泵的抽气量Q throughput of vacuum pump:。 uw!w}1Y]}2 5-3.起动压力starting pressure: 8+HXGqcv 5-4.前级压力 backing pressure : yQAW\0` 5-5.临界前级压力 critical backing pressure: uY{zZ4iw 5-6.最大前级压力maximum backing pressure: lD`@{A 5-7.最大工作压力maximum working pressure: (OA-Mgyc 5-8.真空泵的极限压力ultimate pressure of a pump: /W vF}y 5-9.压缩比compression ratio: 'o D31\@I 5-10.何氏系数Ho coefficient: $1aJdZC7 5-11.抽速系数speed factor: ]i$<<u 5-12.气体的反扩散back-diffusion of gas: >K|<hzZ 5-13.泵液返流back-streaming of pump fluid: s|p,UK 5-14.返流率back-streaming rate ~.FeLWP 5-15.返迁移back-migration: >XTDN 5-16.爆腾bumping: OV@MT^ 5-17.水蒸气允许量qm water vapor tolerable load: v BP
5n 5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: qDG{hvl[1r 5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: gLm ]* 5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump T0:%,o 3. 1.一般术语 .<#oLM^
1-1.压力计pressure gauge: U*P&O+(1' 1-2.真空计vacuum gauge: 47S1mxur ⑴.规头(规管)gauge head: A_h|f5
⑵.裸规nude gauge : 2O|jVGap5x ⑶.真空计控制单元gauge control unit : rM?O 2n ⑷.真空计指示单元gauge indicating unit : `S`,H 8C,}nh 2.真空计一般分类 mP!=&u fcU 2-1.压差式真空计differential vacuum gauge: l(irNKutgo 2-2.绝对真空计 absolute vacuum gauge: 8iv0&91Z 2-3.全压真空计total pressure vacuum gauge: eo#2n8I>=1 2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: }s9eRmJs 2-5.相对真空计relative vacuum gauge : h>w(Th\H r6JQRSakR 3.真空计特性 71S~*"O0f 3-1.真空计测量范围pressure range of vacuum gauge: L1Hk[j]X| 3-2.灵敏度系数sensitivity coefficient: D^_]x51> 3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): g2Hz[C( 3-5.规管光电流photon current of vacuum gauge head: $,b1`* 3-6.等效氮压力equivalent nitrogen pressure : 'P AIh*qA 3-7.X射线极限值 X-ray limit: M%yeI{m 3-8.逆X射线效应anti X-ray effect: wBuos}/ 3-9.布利尔斯效应blears effect: ''Pu +69[06F 4.全压真空计 (+(YQ2 4-1.液位压力计liquid level manometer: 2|6E{o 4-2.弹性元件真空计elastic element vacuum gauge: 8QJ^@|7 4-3.压缩式真空计compression gauge: DB=^Z%%Z 4-4.压力天平pressure balance: sYfiC`9SO 4-5.粘滞性真空计viscosity gauge : 0uZL*4A+C 4-6.热传导真空计thermal conductivity vacuum gauge : c"wk_# 4-7.热分子真空计thermo-molecular gauge: a)o-6 4-8.电离真空计ionization vacuum gauge: =<BPoGs5 4-9.放射性电离真空计radioactive ionization gauge: E;o
"^[we 4-10.冷阴极电离真空计cold cathode ionization gauge: [=EmDP:@ 4-11.潘宁真空计penning gauge: w\K(kNd( 4-12.冷阴极磁控管真空计cold cathode magnetron gauge: M~?2g.o'D 4-13.放电管指示器discharge tube indicator: >~F_/Z'5 4-14.热阴极电离真空计hot cathode ionization gauge: pu"m(9 4-15.三极管式真空计triode gauge: d`w3I`P1 4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: .!`y(N0hc 4-17.B-A型电离真空计Bayard-Alpert gauge: pdw;SIoC 4-18.调制型电离真空计modulator gauge: mXSs:FqE! 4-19.抑制型电离真空计suppressor gauge: RJ+["[k 4-20.分离型电离真空计extractor gauge: J<9;Ix8R 4-21.弯注型电离真空计bent beam gauge: v1R t$[ 4-22.弹道型电离真空计 orbitron gauge :
+|w%}/N 4-23.热阴极磁控管真空计hot cathode magnetron gauge: }J ^+66{ -f-@[; D 5.分压真空计(分压分析器) j^T
i6F>f 5-1.射频质谱仪radio frequency mass spectrometer: up;^,I 5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: CMiE$yC 5-3.单极质谱仪momopole mass spectrometer: G m~2s;/ 5-4.双聚焦质谱仪double focusing mass spectrometer: x :? EL)( 5-5.磁偏转质谱仪magnetic deflection mass spectrometer: =C(((T. 5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: g7l?/p[n 5-7.回旋质谱仪omegatron mass spectrometer: Puq 5-8.飞行时间质谱仪time of flight mass spectrometer: :z^,>So : %wQE
lkB 6.真空计校准 F*4zC@; 6-1.标准真空计reference gauges: j /)A<j$ 6-2.校准系统system of calibration: 2:jWO_V@ 6-3.校准系数K calibration coefficient: L;
o$vI~U, 6-4.压缩计法meleod gauge method: -+HD5Hc 6-5.膨胀法expansion method: bSkr:|A7 6-6.流导法flow method: sK/Z'h{| 4. 1.真空系统vacuum system >(\Z-I&YQ 1-1.真空机组pump system: 0s72BcP 1-2.有油真空机组pump system used oil : (7*(( 1-3.无油真空机组oil free pump system 8-s7s!j 1-4.连续处理真空设备continuous treatment vacuum plant: EEp~\^- 1-5.闸门式真空系统vacuum system with an air-lock: #zed8I:w 1-6.压差真空系统differentially pumped vacuum system: OnND(YiX 1-7.进气系统gas admittance system: x:E:~h[.^ 6
=H]p1p~O 2.真空系统特性参量 V6!1(| 2-1.抽气装置的抽速volume flow rate of a pumping unit : hQ80R B 2-2.抽气装置的抽气量throughput of a pumping unit : >$:_M*5 2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: vUR@P
- 2-4.真空系统的漏气速率leak throughput of a vacuum system: c>b{/92% 2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: IIY3/ 2-6.极限压力ultimate pressure: ^JY,K 2-7.残余压力residual pressure: #/
HQ?3h] 2-8.残余气体谱residual gas spectrum:
RQ;}+S 2-9.基础压力base pressure: Fql|0Fq 2-10.工作压力working pressure: S7h?tR*u 2-11.粗抽时间roughing time: uwc@~=; 2-12.抽气时间pump-down time: r
E&}B5PN= 2-13.真空系统时间常数time constant of a vacuum system: MWI7u7{ 2-14.真空系统进气时间venting time: yfZYGhPN( Oq[YbQ'GE 3.真空容器 ZkmYpi[ 3-1.真空容器;真空室vacuum chamber: {:TOm0eK 3-2.封离真空装置sealed vacuum device: U.pGp]\Q)G 3-3.真空钟罩vacuum bell jar: NRMEZ\*L 3-4.真空容器底板vacuum base plate: R*l3 zn> 3-5.真空岐管vacuum manifold: h'"~t#r 3-6.前级真空容器(贮气罐)backing reservoir: |.?Xov] 3-7.真空保护层outer chamber: YZZog 6% 3-8.真空闸室vacuum air lock: $6~t|[7:%Y 3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: B&"c:)1
C2 5BS !6o;P' 4.真空封接和真空引入线 7qLB 9r 4-1.永久性真空封接permanent seal : x-s\0l 4.2.玻璃分级过渡封接graded seal : =h\uC).t& 4-3.压缩玻璃金属封接compression glass-to-metal seal: >)edha*W] 4-4.匹配式玻璃金属封接matched glass-to-metal seal: f/670Acv 4-5.陶瓷金属封接ceramic-to-metal seal: [{.9#cQ" 4-6.半永久性真空封接semi-permanent seal : v!j%<H`NI 4-7.可拆卸的真空封接demountable joint: [e7nW9\l 4-8.液体真空封接liquid seal [mFgo
il 4-9.熔融金属真空封接molten metal seal: :U,-v 4-10.研磨面搭接封接ground and lapped seal: 6T6UIq 4-11.真空法兰连接vacuum flange connection: l9naqb:iP 4-12.真空密封垫vacuum-tight gasket: Y'Yu1mH) 4-13.真空密封圈ring gasket: `RyH~4\; 4-14.真空平密封垫flat gasket: 3
p!t_y|SX 4-15.真空引入线feedthrough leadthrough: 'iX y?l 4-16.真空轴密封shaft seal: 3oMa 4-17.真空窗vacuum window: SedVp cb+ 4-18.观察窗viewing window: Ao, <G.>R fF^A9{{BS 5.真空阀门 E&;;2 5-1.真空阀门的特性characteristic of vacuum valves: T'-kG"l b ⑴.真空阀门的流导conductance of vacuum valves: S\sy] 1*?$ ⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: a,eEP43dn 5-2.真空调节阀regulating valve: vT#m 8Kg 5-3.微调阀 micro-adjustable valve: ?nwg.&P 5-4.充气阀charge valve: ->'xjD 5-5.进气阀gas admittance valve: J@qwz[d i 5-6.真空截止阀break valve: {'6-;2&f 5-7.前级真空阀backing valve: +&[X7r< 5-8.旁通阀 by-pass valve: $pajE^d4V 5-9.主真空阀main vacuum valve: T~~K~a\8 5-10.低真空阀low vacuum valve: TTJj=KPA 5-11.高真空阀high vacuum valve: ^L-; S 5-12.超高真空阀;UHV阀 ultra-high vacuum valve: ]3d5kf 5-13.手动阀manually operated valve: H^JFPvEc 5-14.气动阀pneumatically operated valve: ?~X^YxWsY 5-15.电磁阀electromagnetically operated valve: W#foVAi . 5-16.电动阀valve with electrically motorized operation: x\!vr. 5-17.挡板阀baffle valve: 2+|U!X 5-18.翻板阀flap valve: w01u~"E 5-19.插板阀gate valve: aPin6L$;) 5-20.蝶阀butterfly valve: {j%7/T{ >2mV{i& 6.真空管路 pg3h>)$/ 6-1.粗抽管路roughing line: <tv"I-2 6-2.前级真空管路backing line: 6SEq 2 6-3.旁通管路;By-Pass管路 by-pass line: ztC>*SX 6-4.抽气封口接头pumping stem: 0}q*s! 6-5.真空限流件limiting conductance: %t%D|cf 6-6.过滤器filter: ,f$ftn\~j/ 5. 1.一般术语 W];l[D<S* 1-1真空镀膜vacuum coating: g:?p/L 1-2基片substrate: R(IYb%L 1-3试验基片testing substrate: [#2X 1-4镀膜材料coating material: ^4=%~Yx 1-5蒸发材料evaporation material: O5ZR{f& 1-6溅射材料sputtering material: sV`p3L8pl 1-7膜层材料(膜层材质)film material: Rw|P$dbu 1-8蒸发速率evaporation rate: W_[ tdqey 1-9溅射速率sputtering rate: YXDuhrs} 1-10沉积速率deposition rate: Na<);Pg 1-11镀膜角度coating angle:
Wux[h8G
!Aw.)<teW 2.工艺 6Ok]E` 2-1真空蒸膜vacuum evaporation coating: -EG=}uT['b (1).同时蒸发simultaneous evaporation: G=&nwSL (2).蒸发场蒸发evaporation field evaporation: z0?IQzR^T (3).反应性真空蒸发reactive vacuum evaporation: 8>[o.xV (4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: j"n"=rTTQ (5).直接加热的蒸发direct heating evaporation: U4h5K}j4 (6).感应加热蒸发induced heating evaporation: < mp_[-c (7).电子束蒸发electron beam evaporation: FvDi4[F# (8).激光束蒸发laser beam evaporation: {GG;/Ns{f- (9).间接加热的蒸发indirect heating evaporation: Jm,tN/o* (10).闪蒸flash evaportion: WU~L#Ih.V 2-2真空溅射vacuum sputtering: ?D=C8[NEX (1).反应性真空溅射 reactive vacuum sputtering: j7b 4wH\# (2).偏压溅射bias sputtering: j>Cp4 (3).直流二级溅射direct current diode sputtering: a&<_M$J& (4).非对称性交流溅射asymmtric alternate current sputtering: [p_<`gU? (5).高频二极溅射high frequency diode sputtering: 5?|yYQM0tK (6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: 3+H[S#e:Z (7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: 4oN*J +"=+ (8).离子束溅射ion beam sputtering: , nW)A/?} (9).辉光放电清洗glow discharge cleaning: nc;iJ/\4 2-3物理气相沉积PVD physical vapor deposition: R,m|+[sl 2-4化学气相沉积CVD chemical vapor deposition: 0+Q;a 2-5磁控溅射magnetron sputtering: "8/BVW^bv 2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: &S8,-~U 2-7空心阴极离子镀HCD hollow cathode discharge deposition: Vj6w7hz 2-8电弧离子镀arc discharge deposition: m=V69
a# HrHtA] 3.专用部件 5?8jj 3-1镀膜室coating chamber: a'?V:3 ] 3-2蒸发器装置evaporator device: _J>!K'Dz 3-3蒸发器evaporator: O#Ho08*Xn 3-4直接加热式蒸发器evaporator by direct heat: "]U_o<V 3-5间接加热式蒸发器evaporator by indirect heat: 7myYs7N8[ 3-7溅射装置sputtering device: 6Tsi^((Li 3-8靶target: YD] :3!MI 3-10时控挡板timing shutter: n,`j~.l-=> 3-11掩膜mask:
#M|q}jA| 3-12基片支架substrate holder: 6`Diz_( 3-13夹紧装置clamp: <J-.,: 3-14换向装置reversing device: ? s[!JeUA 3-15基片加热装置substrate heating device: BB.120v&N 3-16基片冷却装置substrate colding device: ^>#@qMw wLy:S .r 4.真空镀膜设备 |J:m{ 4-1真空镀膜设备vacuum coating plant: GB}!7W" (1).真空蒸发镀膜设备vacuum evaporation coating plant: pV/5w<_x? (2).真空溅射镀膜设备vacuum sputtering coating plant: %:\GYs(Y 4-2连续镀膜设备continuous coating plant: hQaa"U7[ 4-3半连续镀膜设备semi- continuous coating plant hpo*5Va 6. 1.漏孔 Ys8D|HIk 1-1漏孔leaks: dUkZ_<5'' 1-2通道漏孔channel leak: ~=?^v[T1 1-3薄膜漏孔membrane leak: AU<A\ 1-4分子漏孔molecular leak: Bs^p!4=
1-5粘滞漏孔vixcous leak: e)aH7Jj# 1-6校准漏孔calibrated leak: 9
!V,++j 1-7标准漏孔reference leak : \ \g Aa-}: 1-8虚漏virtual leak: E6#")2C~ 1-9漏率leak rate: :"`1}Q 1-10标准空气漏率standard air leak rate: '}F..w/ 1-11等值标准空气漏率equivalent standard air leak rate: e(vnnv?R{ 1-12探索(示漏)气体: D;6C2>U~L N'YQ6U 2.本底 rAS2qt 2-1本底background: Gk!CU"`sP 2-2探索气体本底search gas background : VN]j*$5
2-3漂移drift: S%o6cl = 2-4噪声noise: e5m]mzF@ OZ}o||/Rc 3.检漏仪 rS_pv=0S 3-1检漏仪leak detector: QG5)mIJ 3-2高频火花检漏仪H.F. spark leak detector: HjZf3VwI 3-3卤素检漏仪halide leak detector: 'W/AYF^5 3-4氦质谱检漏仪helium mass spectrometer leak detector: UH#S |o4 3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: #=#bv` tD> qHR 4.检漏 D:PrFa 4-1气泡检漏leak detection by bubbles: Wx8n) 4-2氨检漏leak detection by ammonia: C5=m~ 4-3升压检漏leak detection of rise pressure: RSIhZYA 4-4放射性同位素检漏radioactive isotope leak detection: S y^et 4-5荧光检漏fluorescence leak detection +q] kpkG! 7. 1.一般术语 s"(F({J 1-1真空干燥vacuum drying: O;m [ 1-2冷冻干燥freeze drying : 9XX:_9|I 1-3物料material: a@m
64l) 1-4待干燥物料material to be dried: OhTd>~R`< 1-5干燥物料dried material : p?sFX$S 1-6湿气moisture;humidity: ai;- _M+$ 1-7自由湿气free moisture: G@rV9 1-8结合湿气bound moisture: 7e6;
|? 1-9分湿气partial moisture: CykvTV Q 1-10含湿量moisture content: u\u6<[>P 1-11初始含湿量initial moisture content: u>[hLXuB 1-12最终含湿量final residual moisture: S(G&{KG 1-13湿度degree of moisture ,degree of humidity : WTUC\}#E\ 1-14干燥物质dry matter : IQ5'4zQg= 1-15干燥物质含量content of dry matter: tW%!|T5/ {r:5\ 2.干燥工艺 F,@uYMQs 2-1干燥阶段stages of drying : ?F9c6 $| (1).预干燥preliminary dry: ab>>W!r@! (2).一次干燥(广义)primary drying(in general): FH7l6b,^ (3).一次干燥(冷冻干燥)primary drying(freeze-drying): `]5 t'Ps (4).二次干燥secondary drying: iy [W:<c7j 2-2.(1).接触干燥contact drying: ]~\%ANoi (2).辐射干燥 drying by radiation : n(j5dN>] (3).微波干燥microwave drying: bkIQ?cl<at (4).气相干燥vapor phase drying: ~--F?KUnL (5).静态干燥static drying: pW-aX)\DR (6).动态干燥dynamic drying: W&e}* 2-3干燥时间drying time: &o7"L; 2-4停留时间length of stay(in the drying chamber): CMU\DO 2-5循环时间cycle time: 7$7#z\VWu 2-6干燥率 dessication ratio : #=czqZw 2-7去湿速率mass flow rate of humidity: d+%Rg\v 2-8单位面积去湿速率mass flow rate of humidity per surface area: kD#hfYs)i 2-9干燥速度 drying speed : AIt;~x 2-10干燥过程drying process: !0Eo9bU%@ 2-11加热温度heating temperature: %( #kJZ 2-12干燥温度temperature of the material being dried : 5KL??ao- 2-13干燥损失loss of material during the drying process : `bjPOA(g 2-14飞尘lift off (particles): [wM]w 2-15堆层厚度thickness of the material: ;bkvdn} Zn]!*} 3.冷冻干燥 oTk?a!Q 3-1冷冻freezing: imZ"4HnPP (1).静态冷冻static freezing: oe{,-<yck (2).动态冷冻dynamic freezing: 077 wk (3).离心冷冻centrifugal freezing: }!jn%@_y@ (4).滚动冷冻shell freezing: ? ;$f"Wl (5).旋转冷冻spin-freezing: 5`{u! QE (6).真空旋转冷冻vacuum spin-freezing: q uiX"lV( (7).喷雾冷冻spray freezing: hGj`IAW (8).气流冷冻air blast freezing: *iXaQu T 3-2冷冻速率rate of freezing: )KUEkslR: 3-3冷冻物料frozen material: nOq`Cwh9 3-4冰核ice core: EsjZ;D,c( 3-5干燥物料外壳envelope of dried matter: n*A"}i`ix 3-6升华表面sublimation front: 2t:CK 3-7融化位置freezer burn: AQgm]ex< ""x>-j4 4.真空干燥设备;真空冷冻干燥设备 ^%}PRl9 4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: _PGS"O?j 4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: ]I(<hDuRp 4-3加热表面heating surface: KvtJtql; 4-4物品装载面shelf : Q =4~uz| 4-5干燥器的处理能力throughput (of the vacuum drying chamber): k;!}nQ& 4-6单位面积干燥器处理能力throughput per shelf area: lh*!f$2~ 4-7冰冷凝器ice condenser: SVqKG+{My 4-8冰冷凝器的负载load of the ice condenser: <L:}u! 4-9冰冷凝器的额定负载rated load of the ice condenser #oxP,LR 8. 1.一般术语 K# BZ Jcb 1-1试样sample : h:{^&d
a (1).表面层surface layer: zC>zkFT>H (2).真实表面true surface: ?5rM'O2 (3).有效表面积effective surface area: r<EwtO+x (4).宏观表面;几何表面macroscopic surface area; geometric surface area: d% Nx/DS) (5).表面粒子密度surface particle density: 8eD/9PD=F (6).单分子层monolayer: a`8svo;VUO (7).表面单分子层粒子密度monolayer density: 4[n[Ch=lu (8).覆盖系数coverage ratio: p%- m"u 1-2激发excitation: 0hCUr]cZ, (1).一次粒子primary particle: tiTh7qYi9 (2).一次粒子通量primary particle flux: _t@9WA;+\ (3).一次粒子通量密度density of primary particle flux: |snWO0iF (4).一次粒子负荷primary particle load: mjJ/rx{kbw (5).一次粒子积分负荷integral load of primary particle: M`QK{$1p (6).一次粒子的入射能量energy of the incident primary particle: /R[PsB (7).激发体积excited volume: QUz_2rN^ (8).激发面积excited area: w!
':Ws (9).激发深度excited death: "rR$2`v" (10).二次粒子secondary particles: u^+
(5| (11).二次粒子通量secondary particle flux: #-K,," (12).二次粒子发射能energy of the emitted secondary particles: !b'!7p
(13).发射体积emitting volume: ?/^{sW'
| (14).发射面积emitting area: {|R +|ow (15).发射深度emitting depth: Zr$D\(hX (16).信息深度information depth: F7U$7(I2G (17).平均信息深度mean information depth: oZ!+._9 1-3入射角angle of incidence: 0<42\ya 1-4发射角angle of emission: 1owe'7\J 1-5观测角observation: Pt?d+aBtV 1-6分析表面积analyzed surface area: ts;C:.X 1-7产额 yield : %^(} fu 1-8表面层微小损伤分析minimum damage surface analysis: dyuT-.2 1-9表面层无损伤分析non-destructive surface analysis: tq2TiXo% 1-10断面深度分析 profile analysis in depth; depth profile analysis :
2>Sr04Pt 1-11可观测面积observable area: 89a`WV@} 1-12可观测立体角observable solid angle : <M M(Z 1-13接受立体角;观测立体角angle of acceptance: 1L<X+,]@ 1-14角分辨能力angular resolving power:
W>m#Mz 1-15发光度luminosity: a'B 5m]% 1-16二次粒子探测比detection ratio of secondary particles: s -),Pv| 1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: +3o
4KB} 1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: Tizjh&*^ 1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: !E9A=u{ 1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: I8LoXY 1-21本底压力base pressure: f}{Oj-:"CC 1-22工作压力working pressure: m,#Us K]yUPx 2.分析方法 w"A%@<V3Ec 2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: 5c-'m?k (1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : ~ ]^<*R (2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: 8AIAv_
g 2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: 'cvc\=p 2-3离子散射表面分析ion scattering spectroscopy: .*+e?- 2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: 6x"|,,&MD0 2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: G?v]|wdI 2-6离子散射谱仪ion scattering spectrometer: D]WU,a[$Bc 2-7俄歇效应Auger process: eLyaTOZadu 2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: o Np4> 7Lk 2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: Fn*)!,) 2-10光电子谱术photoelectron spectroscopy : 7A46?kfu (1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: `zMR?F` (2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: Rb_+C 2-11光电子谱仪photoelectron spectrometer: I>45xVA 2-12低能电子衍射;LEED low energy electron diffraction ;LEED: mY/x|)MmM 2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: IC@-`S#F 2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): ;Ak 6*Sr 2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus
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