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cswmsc 2007-02-28 23:18

真空术语全集

“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 m/cx|b3hqv  
--------------------------------------------------- J511AoQ{R  
真空术语 x9 TuweG  
aTi0bQW{  
1.标准环境条件 standard ambient condition: QK,=5~IJ  
2.气体的标准状态 standard reference conditions forgases: 8 `yB  
3.压力(压强)p pressure: 0VG^GKmx  
4.帕斯卡Pa pascal: n2H&t>N  
5.托Torr torr: \gjl^# ;  
6.标准大气压atm standard atmosphere: L/c4"f|.*v  
7.毫巴mbar millibar: }`?7\\6  
8.分压力 partial pressure: 7Z9.z 4\  
9.全压力 total pressure: O#A8t<f|M  
10.真空 vacuum: E`U &Z  
11.真空度 degree of vacuum: 8U8P g2  
12.真空区域 ranges of vacuum: T %$2k>  
13.气体 gas: F%9e@{  
14.非可凝气体 non-condensable gas: T,A!5V>cX  
15.蒸汽vapor: 3KB| NS  
16.饱和蒸汽压saturation vapor pressure: {-~05,zE  
17.饱和度degree of saturation: [9'|7fdU  
18.饱和蒸汽saturated vapor: wA{*W>i  
19.未饱和蒸汽unsaturated vapor: lK_ ~d_f  
20.分子数密度n,m-3 number density of molecules: "K/[[wX\b  
21.平均自由程ι、λ,m mean free path: "tEj`eR  
22.碰撞率ψ collision rate: z&\Il#'\m+  
23.体积碰撞率χ volume collision rate: nYo&x'  
24.气体量G quantity of gas: hqdC9?\  
25.气体的扩散 diffusion of gas: 721{Ga4~S  
26.扩散系数D diffusion coefficient; diffusivity: ))8Emk^Q{  
27.粘滞流 viscous flow: HCI'q\\  
28.粘滞系数η viscous factor: 9(i0" hS^  
29.泊肖叶流 poiseuille flow: mYzsT Uq  
30.中间流 intermediate flow: eV@4VxaZ  
31.分子流 molecular flow: W*1d X"S  
32克努曾数 number of knudsen: u Zo]8mV  
33.分子泻流 molecular effusion; effusive flow: #p']-No  
34.流逸 transpiration: #JHy[!4  
35.热流逸 thermal transpiration: f>.` xC{  
36.分子流率qN molecular flow rate; molecular flux: \HBVNBY  
37.分子流率密度 molecular flow rate density; density of molecular flux: UUt~W  
38.质量流率qm mass flow rare: z_5rAlnwT.  
39.流量qG throughput of gas: *C[4 (DmB  
40.体积流率qV volume flow rate: S.zg&   
41.摩尔流率qυ molar flow rate: -6.i\ B  
42.麦克斯韦速度分布 maxwellian velocity distribution: U^vUdM"  
43.传输几率Pc transmission probability: Uqb]e?@  
44.分子流导CN,UN molecular conductance: P]~N-xdV  
45.流导C,U conductance: B<vvsp\X  
46.固有流导Ci,Ui intrinsic conductance: ?GaI6?lbn  
47.流阻W resistance: ^T uP=q5?  
48.吸附 sorption: v9X7-GJ~  
49.表面吸附 adsorption: (**-"o]HH  
50.物理吸附physisorption: N>W;0u!  
51.化学吸附 chemisorption: G_4K+ -K  
52.吸收absorption: [u!p-  
53.适应系数α accommodation factor: uD0(aqAZ  
54.入射率υ impingement rate: Y^*Lh/:h  
55.凝结率condensation rate: }.fZy&_  
56.粘着率 sticking rate: FF~on06!   
57.粘着几率Ps sticking probability: wR 5\^[GN  
58.滞留时间τ residence time: yoq\9* ?u^  
59.迁移 migration: Cy`<^_i  
60.解吸 desorption: WcV\kemf  
61.去气 degassing: (6b?ir~  
62.放气 outgassing: e>ZbZy?  
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: *o:B oP=S  
64.蒸发率 evaporation rate: @'k,\$/  
65.渗透 permeation: ;W$w=j: O{  
66.渗透率φ permeability: 6Y92&  
67.渗透系数P permeability coefficient b n<I#ZH2  
2.   1.真空泵 vacuum pumps )D6'k{6M  
1-1.容积真空泵 positive displacement pump: S20 nk.x  
⑴.气镇真空泵 gas ballast vacuum pump: 42b=z//;  
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: !.tL"U~4  
⑶.干封真空泵 dry-sealed vacuum pump: B J:E,P`_  
⑷.往复真空泵 piston vacuum pump: pUCEYR  
⑸.液环真空泵 liquid ring vacuum pump: Q+y-*1   
⑹.旋片真空泵 sliding vane rotary vacuum pump: ~x +:44*  
⑺.定片真空泵 rotary piston vacuum pump: eY6gb!5u  
⑻.滑阀真空泵 rotary plunger vacuum pump: $w";*">:0  
⑼.余摆线真空泵 trochoidal vacuum pump: &kr_CP:;  
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: W_e-7=6  
⑾.罗茨真空泵 roots vacuum pump: +Zty}fe  
1-2.动量传输泵 kinetic vacuum pump: <.?^LT  
⑴.牵引分子泵molecular drag pump: }R(0[0NQe-  
⑵.涡轮分子泵turbo molecular pump: sTYuwna~   
⑶.喷射真空泵ejector vacuum pump: >ji}j~cH  
⑷.液体喷射真空泵liquid jet vacuum pump: Q9x` Uy  
⑸.气体喷射真空泵gas jet vacuum pump: dH2j*G Ij  
⑹.蒸汽喷射真空泵vapor jet vacuum pump : `0n 7Cyed  
⑺.扩散泵diffusion pump : ~,`\D7Z3  
⑻.自净化扩散泵self purifying diffusion pump: fxtYo,;$  
⑼.分馏扩散泵 fractionating diffusion pump : #Kb)>gzT  
⑽.扩散喷射泵diffusion ejector pump : W~+!"^<n  
⑾.离子传输泵ion transfer pump: )P(d66yq'u  
1-3.捕集真空泵 entrapment vacuum pump: }{w_>!ee  
⑴吸附泵adsorption pump: pO7{3%  
⑵.吸气剂泵 getter pump: bCY^.S-  
⑶.升华(蒸发)泵 sublimation (evaporation)pump : 2\iD;Z#gM  
⑷.吸气剂离子泵getter ion pump: Xx9~  
⑸.蒸发离子泵 evaporation ion pump: EkgN6S`}  
⑹.溅射离子泵sputter ion pump: Rm[rQ }:  
⑺.低温泵cryopump: n_!]B_Vd$  
s6eq?1l 3  
2.真空泵零部件 2!~>)N  
2-1.泵壳 pump case: (-G(^Tn  
2-2.入口 inlet: Vqv2F @.  
2-3.出口outlet: [<3Q$*Ew  
2-4.旋片(滑片、滑阀)vane; blade : 6wvhvMkS  
2-5.排气阀discharge valve: WkU) I2oH  
2-6.气镇阀gas ballast valve: ?XTg%U  
2-7.膨胀室expansion chamber: ^JF_;~C  
2-8.压缩室compression chamber: Um0<I)  
2-9.真空泵油 vacuum pump oil: vI:bl~  
2-10.泵液 pump fluid: f'zFg["aZS  
2-11.喷嘴 nozzle: E#HU?<q8  
2-13.喷嘴扩张率nozzle expansion rate: 'mY,>#sT  
2-14.喷嘴间隙面积 nozzle clearance area : @u'27c_<d3  
2-15.喷嘴间隙nozzle clearance: >FMT#x t  
2-16.射流jet: 83 ^,'Z  
2-17.扩散器diffuser: *v7& T  
2-18.扩散器喉部diffuser thoat: :xUl+(+  
2-19.蒸汽导管vapor tube(pipe;chimney): ;6 &=]I  
2-20.喷嘴组件nozzle assembly: OD@@O9  
2-21.下裙skirt: 5+Zx-oWq_  
PB3!;  
3.附件 *IO;`k q,;  
3-1阱trap: %N_S/V0`  
⑴.冷阱 cold trap: }RP9%n^  
⑵.吸附阱sorption trap: ?\p%Mx?   
⑶.离子阱ion trap: da86Jj=k  
⑷.冷冻升华阱 cryosublimation trap: wGQhr="  
3-2.挡板baffle: Uub%s`O  
3-3.油分离器oil separator: %[ bO\,  
3-4.油净化器oil purifier: bEXHB  
3-5.冷凝器condenser: kk\zZC <  
E,yzy[gl  
4.泵按工作分类 @v-)|8GdY  
4-1.主泵main pump: Z_4H2HseL  
4-2.粗抽泵roughing vacuum pump: Go+,jT-  
4-3.前级真空泵backing vacuum pump: u{lDof>  
4-4.粗(低)真空泵 roughing(low)vacuum pump: O |I:[S},  
4-5.维持真空泵holding vacuum pump: kKk |@  
4-6.高真空泵high vacuum pump: 8!fAv$g0  
4-7.超高真空泵ultra-high vacuum pump: *p5T  
4-8.增压真空泵booster vacuum pump: 2Q_{2(nQb  
)1yUV*6  
5.真空泵特性 R O3e  
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: `::(jW.KO  
5-2.真空泵的抽气量Q throughput of vacuum pump:。 KL\=:iWA  
5-3.起动压力starting pressure: t:j07 ,1~  
5-4.前级压力 backing pressure : &T/9y W[L  
5-5.临界前级压力 critical backing pressure: 9qO:K79|  
5-6.最大前级压力maximum backing pressure: .$s|T  
5-7.最大工作压力maximum working pressure: ;NVTn<Uj  
5-8.真空泵的极限压力ultimate pressure of a pump: 9C'+~<l  
5-9.压缩比compression ratio: A5H8+gATK  
5-10.何氏系数Ho coefficient: .1q~,}toX  
5-11.抽速系数speed factor: bFdg '_  
5-12.气体的反扩散back-diffusion of gas: Gqz)='  
5-13.泵液返流back-streaming of pump fluid: T7Qd I[K%b  
5-14.返流率back-streaming rate 8_,wOkk_B  
5-15.返迁移back-migration: 7z0 uj  
5-16.爆腾bumping: i$<v*$.o  
5-17.水蒸气允许量qm water vapor tolerable load: O09g b[  
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: *z:lq2"G  
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: UU~;B  
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump n)7$xYuH  
3.   1.一般术语  ~9jP++&  
1-1.压力计pressure gauge: [&}<! :9'  
1-2.真空计vacuum gauge: kk./-G  
⑴.规头(规管)gauge head: 2o3k=hKS  
⑵.裸规nude gauge : 2 ]6u B e  
⑶.真空计控制单元gauge control unit : `,]PM) iC  
⑷.真空计指示单元gauge indicating unit : 0J,d9a [1  
zgOwSg8  
2.真空计一般分类 r\- k/0  
2-1.压差式真空计differential vacuum gauge: f6A['<%o  
2-2.绝对真空计 absolute vacuum gauge: -hV KPIb  
2-3.全压真空计total pressure vacuum gauge: ^9~%=k=  
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: k#G7`dJl  
2-5.相对真空计relative vacuum gauge : FNRE_83  
6#63D>OWp  
3.真空计特性 >bP7}T  
3-1.真空计测量范围pressure range of vacuum gauge: e$|)wOwU  
3-2.灵敏度系数sensitivity coefficient: !x / Z"  
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): p" W0$t.  
3-5.规管光电流photon current of vacuum gauge head: (j Q6~1  
3-6.等效氮压力equivalent nitrogen pressure : ' "p*FN  
3-7.X射线极限值 X-ray limit: <g1hdF0  
3-8.逆X射线效应anti X-ray effect: on&=%tCAL  
3-9.布利尔斯效应blears effect: MM$" 6Jor  
&=O1Qg=K  
4.全压真空计 Fd.d(  
4-1.液位压力计liquid level manometer: T}x%=4<E  
4-2.弹性元件真空计elastic element vacuum gauge: zC;lfy{f=  
4-3.压缩式真空计compression gauge: i_^NbC   
4-4.压力天平pressure balance: F09AX'nj  
4-5.粘滞性真空计viscosity gauge : 5!fW&OiY  
4-6.热传导真空计thermal conductivity vacuum gauge : eTHh  
4-7.热分子真空计thermo-molecular gauge: ]KT,s].  
4-8.电离真空计ionization vacuum gauge: w:(7fu=  
4-9.放射性电离真空计radioactive ionization gauge: ai9,4  
4-10.冷阴极电离真空计cold cathode ionization gauge: euC,]n.  
4-11.潘宁真空计penning gauge: L uK m  
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: t O;W?g  
4-13.放电管指示器discharge tube indicator: !9OgA  
4-14.热阴极电离真空计hot cathode ionization gauge: )f&]H}  
4-15.三极管式真空计triode gauge: .Sw'Bo!Ee  
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: CUcjJ|MZ  
4-17.B-A型电离真空计Bayard-Alpert gauge: Qj[O$L0 $  
4-18.调制型电离真空计modulator gauge: [)c|oh%  
4-19.抑制型电离真空计suppressor gauge: C^O^Jj5X%  
4-20.分离型电离真空计extractor gauge: XmR5dLc8  
4-21.弯注型电离真空计bent beam gauge: m(]IxI  
4-22.弹道型电离真空计 orbitron gauge : > PA,72e   
4-23.热阴极磁控管真空计hot cathode magnetron gauge: kfECC&"  
/a)=B)NH  
5.分压真空计(分压分析器) 8 z7,W3b  
5-1.射频质谱仪radio frequency mass spectrometer: Lwk-  
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: 1"PE@!]  
5-3.单极质谱仪momopole mass spectrometer: Q(7l<z  
5-4.双聚焦质谱仪double focusing mass spectrometer: 3o^M%  
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: !qv;F?2 <g  
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: nmrk-#._@9  
5-7.回旋质谱仪omegatron mass spectrometer: j)*nE./3  
5-8.飞行时间质谱仪time of flight mass spectrometer: *&MkkI#  
RjHpC7b*%  
6.真空计校准 F'*4:WD7  
6-1.标准真空计reference gauges: ^2@~AD`&h  
6-2.校准系统system of calibration: 54%}JA][  
6-3.校准系数K calibration coefficient: 4tTJE<y  
6-4.压缩计法meleod gauge method: essW,2,rjC  
6-5.膨胀法expansion method: NWj@iyi<  
6-6.流导法flow method: )Cfrqe1^  
4.   1.真空系统vacuum system 3Re\ T  
1-1.真空机组pump system: P://Zi6>  
1-2.有油真空机组pump system used oil : MqH~L?~}|  
1-3.无油真空机组oil free pump system PCjY,O  
1-4.连续处理真空设备continuous treatment vacuum plant: @kymL8"2w  
1-5.闸门式真空系统vacuum system with an air-lock: P^-9?u Bno  
1-6.压差真空系统differentially pumped vacuum system: ^123.Ru|t  
1-7.进气系统gas admittance system: *h6i9V%'  
uD3_'a  
2.真空系统特性参量 ![%,pip2/&  
2-1.抽气装置的抽速volume flow rate of a pumping unit : ?>&Zm$5V  
2-2.抽气装置的抽气量throughput of a pumping unit : W -&5 v  
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: 4pv :u:Z  
2-4.真空系统的漏气速率leak throughput of a vacuum system: H)tDfk sq\  
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: ?Pc 3*.  
2-6.极限压力ultimate pressure: X.<R['U&\  
2-7.残余压力residual pressure: pT tX[CE  
2-8.残余气体谱residual gas spectrum: ~yN,FpD  
2-9.基础压力base pressure: CXZeL 1+  
2-10.工作压力working pressure: Jmx }r,j  
2-11.粗抽时间roughing time: 3s2M$3r)6  
2-12.抽气时间pump-down time: v(~m!8!TI  
2-13.真空系统时间常数time constant of a vacuum system: |&7,g  
2-14.真空系统进气时间venting time: [DwB7l)O(  
 sd%~pY}  
3.真空容器 RkzBn  
3-1.真空容器;真空室vacuum chamber: ibyA~YUN/  
3-2.封离真空装置sealed vacuum device: `m^OnH  
3-3.真空钟罩vacuum bell jar: ;\N*iN#K  
3-4.真空容器底板vacuum base plate: RSC-+c6 1  
3-5.真空岐管vacuum manifold: =d}3>YHS  
3-6.前级真空容器(贮气罐)backing reservoir: ~JpUO~i/  
3-7.真空保护层outer chamber: KG$2u:n  
3-8.真空闸室vacuum air lock: ZD(gYNi  
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor:  %3j5Q   
9K!='u`  
4.真空封接和真空引入线 KJ_R@,v\  
4-1.永久性真空封接permanent seal : D2bUSRrb  
4.2.玻璃分级过渡封接graded seal : )RFeF!("  
4-3.压缩玻璃金属封接compression glass-to-metal seal: m@ YL Z  
4-4.匹配式玻璃金属封接matched glass-to-metal seal: :F&WlU$L  
4-5.陶瓷金属封接ceramic-to-metal seal: "f_Z.6WMY  
4-6.半永久性真空封接semi-permanent seal : t=AR>M!w~  
4-7.可拆卸的真空封接demountable joint: tUQ)q  
4-8.液体真空封接liquid seal ;H lv  
4-9.熔融金属真空封接molten metal seal: `Z-`-IL  
4-10.研磨面搭接封接ground and lapped seal: @#apOoVW>  
4-11.真空法兰连接vacuum flange connection: V_!i KEU  
4-12.真空密封垫vacuum-tight gasket: nP^$p C  
4-13.真空密封圈ring gasket: e=2D^ G#qE  
4-14.真空平密封垫flat gasket: bd4q/w4q  
4-15.真空引入线feedthrough leadthrough: eORt qX8*  
4-16.真空轴密封shaft seal: YVT^}7#  
4-17.真空窗vacuum window: *C\O] r:'  
4-18.观察窗viewing window: OjZ@_V:  
N2>JG]G  
5.真空阀门 iweP3u##  
5-1.真空阀门的特性characteristic of vacuum valves: 0*)79Sz  
⑴.真空阀门的流导conductance of vacuum valves: fvD wg  
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: rzu^br9X  
5-2.真空调节阀regulating valve: ;Peyo1  
5-3.微调阀 micro-adjustable valve: KVuv%?  
5-4.充气阀charge valve: Z>l>@wNm  
5-5.进气阀gas admittance valve: #^Y,,GA  
5-6.真空截止阀break valve: :Lx]`dSk  
5-7.前级真空阀backing valve: m| Z)h{&  
5-8.旁通阀 by-pass valve: iX=*qiVX  
5-9.主真空阀main vacuum valve: . fIodk  
5-10.低真空阀low vacuum valve: |($pXVLH`  
5-11.高真空阀high vacuum valve: x+pFu5,  
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: o0 Ae*Y0  
5-13.手动阀manually operated valve: x>^S..K}L%  
5-14.气动阀pneumatically operated valve: yFSL7`p+  
5-15.电磁阀electromagnetically operated valve: fOVRtSls  
5-16.电动阀valve with electrically motorized operation: utr_fFu  
5-17.挡板阀baffle valve: GOt@x9%  
5-18.翻板阀flap valve: nV,a|V5Xm  
5-19.插板阀gate valve: (I$hw"%&  
5-20.蝶阀butterfly valve: <$ 5\^y,V  
DcOLK\  
6.真空管路 b}fH$.V@  
6-1.粗抽管路roughing line: X\;y;pmRH  
6-2.前级真空管路backing line: b|NEU-oy  
6-3.旁通管路;By-Pass管路 by-pass line: ?V0IryF;  
6-4.抽气封口接头pumping stem: @9-qqU@  
6-5.真空限流件limiting conductance:       9g7T~|P  
6-6.过滤器filter:  Dg@6o  
5.   1.一般术语 n#*cVB81  
1-1真空镀膜vacuum coating: ?g'l/xuRe  
1-2基片substrate: (~jOtUyT  
1-3试验基片testing substrate: &\LbajP:+  
1-4镀膜材料coating material: wNlp4Z'[  
1-5蒸发材料evaporation material: IoC,\$s,  
1-6溅射材料sputtering material: <%5ny!]  
1-7膜层材料(膜层材质)film material: t?\osPL  
1-8蒸发速率evaporation rate: | !Knd ^}  
1-9溅射速率sputtering rate: %\A~w3E  
1-10沉积速率deposition rate: {0?76|  
1-11镀膜角度coating angle: N67m=wRx  
 #u~8Txt  
2.工艺 6Pz\6DU,I  
2-1真空蒸膜vacuum evaporation coating: C-8@elZ1  
(1).同时蒸发simultaneous evaporation: =#W6+=YN8  
(2).蒸发场蒸发evaporation field evaporation: &:rf80`z.  
(3).反应性真空蒸发reactive vacuum evaporation: 5lT lZRH1  
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: G]{)yZ'}  
(5).直接加热的蒸发direct heating evaporation: R8HFyP  
(6).感应加热蒸发induced heating evaporation: mz47lv1?  
(7).电子束蒸发electron beam evaporation: +:b| I'S  
(8).激光束蒸发laser beam evaporation: |q?A8@\u  
(9).间接加热的蒸发indirect heating evaporation: @ Fu|et  
(10).闪蒸flash evaportion: *p"%cas  
2-2真空溅射vacuum sputtering: #}.db?[Rv  
(1).反应性真空溅射 reactive vacuum sputtering: w0pH|$"/P  
(2).偏压溅射bias sputtering: [,VD^\  
(3).直流二级溅射direct current diode sputtering: d;`JDT  
(4).非对称性交流溅射asymmtric alternate current sputtering: &W1cc#(  
(5).高频二极溅射high frequency diode sputtering: T a_#Rg*!  
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: 5( 3tPbm{  
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: a$ Z06j  
(8).离子束溅射ion beam sputtering: Gd!y,n&s  
(9).辉光放电清洗glow discharge cleaning: u BvN*LQ  
2-3物理气相沉积PVD physical vapor deposition: oYW:p tJ  
2-4化学气相沉积CVD chemical vapor deposition: ./u3z|q1  
2-5磁控溅射magnetron sputtering: 7v{Dwg  
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: qTG/7tn "  
2-7空心阴极离子镀HCD hollow cathode discharge deposition: LVX.stN#p  
2-8电弧离子镀arc discharge deposition: =m UtBD.;  
z&w@67 >j  
3.专用部件 u-D%: lz85  
3-1镀膜室coating chamber: {Wt=NI?Ow  
3-2蒸发器装置evaporator device: o]@?QAu  
3-3蒸发器evaporator: BPW2WSm@<  
3-4直接加热式蒸发器evaporator by direct heat: 4h-tR  
3-5间接加热式蒸发器evaporator by indirect heat: l2i[wc"9  
3-7溅射装置sputtering device: W 5-=,t  
3-8靶target: |Gz(q4  
3-10时控挡板timing shutter: ->d 3FR  
3-11掩膜mask: q.*k J/L  
3-12基片支架substrate holder: t\ ym4`"  
3-13夹紧装置clamp: *~cq (PFQ  
3-14换向装置reversing device: rOX\rI%0+  
3-15基片加热装置substrate heating device: ^)TZHc2a[  
3-16基片冷却装置substrate colding device: NbH;@R)L  
I=0`xF|4K-  
4.真空镀膜设备 T< D&%)  
4-1真空镀膜设备vacuum coating plant: l4RZ!K*X_"  
(1).真空蒸发镀膜设备vacuum evaporation coating plant: $/K<hT_  
(2).真空溅射镀膜设备vacuum sputtering coating plant: *y0TtEd;  
4-2连续镀膜设备continuous coating plant: 51xiX90D  
4-3半连续镀膜设备semi- continuous coating plant L\a G.\  
6.   1.漏孔 eot%T h?[  
1-1漏孔leaks: K9]L>Wj  
1-2通道漏孔channel leak: X3@Uih}|  
1-3薄膜漏孔membrane leak: .r 4 *?>  
1-4分子漏孔molecular leak: !Wgi[VB  
1-5粘滞漏孔vixcous leak: G8}k9?26(  
1-6校准漏孔calibrated leak: +87|gC7B  
1-7标准漏孔reference leak : I|(r1.[K  
1-8虚漏virtual leak: Fsz;T;  
1-9漏率leak rate: G0)}?5L1J  
1-10标准空气漏率standard air leak rate: a[I :^S  
1-11等值标准空气漏率equivalent standard air leak rate: .kcyw>T`I  
1-12探索(示漏)气体: wNtC5  
T,r?% G{XE  
2.本底 fS?}(7  
2-1本底background: f3^Anaa]l  
2-2探索气体本底search gas background : xPCRT*Pd  
2-3漂移drift: 6Z.Fyte  
2-4噪声noise: ]Q$Sei5  
a5cary Z"z  
3.检漏仪 Q`kV| pjg  
3-1检漏仪leak detector: $t0o*i{  
3-2高频火花检漏仪H.F. spark leak detector: 2u Zb2O  
3-3卤素检漏仪halide leak detector: SMo nJ;Y  
3-4氦质谱检漏仪helium mass spectrometer leak detector: 4 K5  
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: {>g{+Eq  
xu\s2x$  
4.检漏 R"W5R-  
4-1气泡检漏leak detection by bubbles: "zj[v1K9-A  
4-2氨检漏leak detection by ammonia: 8wV`mdKN  
4-3升压检漏leak detection of rise pressure: %:t! u&:q  
4-4放射性同位素检漏radioactive isotope leak detection: galzk$D  
4-5荧光检漏fluorescence leak detection f*}}Az.4  
7.   1.一般术语 6%it`A8}  
1-1真空干燥vacuum drying: rtNYX=P  
1-2冷冻干燥freeze drying : .J <t]  
1-3物料material: Q p7h|<  
1-4待干燥物料material to be dried: 0 30LT$&!  
1-5干燥物料dried material : u8.F_'`z  
1-6湿气moisture;humidity: Jr5dw=B gw  
1-7自由湿气free moisture: ,oykOda:|  
1-8结合湿气bound moisture: ncqAof(/  
1-9分湿气partial moisture: bgLa`8  
1-10含湿量moisture content: kM J}sS  
1-11初始含湿量initial moisture content: _o[fjd  
1-12最终含湿量final residual moisture: ":0u%E?s  
1-13湿度degree of moisture ,degree of humidity : d~ +(g!  
1-14干燥物质dry matter : KRz~3yH{ c  
1-15干燥物质含量content of dry matter: q #mBNe62p  
aVCPaYe^  
2.干燥工艺 Z_[ P7P  
2-1干燥阶段stages of drying : T*:w1*:  
(1).预干燥preliminary dry: ?VlGTMaS+  
(2).一次干燥(广义)primary drying(in general): M287Z[  
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): G9NI`]k  
(4).二次干燥secondary drying: ?7}ybw3t]  
2-2.(1).接触干燥contact drying: C$q};7b1N  
(2).辐射干燥 drying by radiation : >TMd1? ,  
(3).微波干燥microwave drying:  9u^M{6  
(4).气相干燥vapor phase drying: _V 4O#;%?  
(5).静态干燥static drying: /78]u^SW  
(6).动态干燥dynamic drying: yX4 Vv{g  
2-3干燥时间drying time: tL3R<'  
2-4停留时间length of stay(in the drying chamber): oUwo!n}  
2-5循环时间cycle time: 3m= _a  
2-6干燥率 dessication ratio : 8t Q;N'  
2-7去湿速率mass flow rate of humidity: "I66 @d?  
2-8单位面积去湿速率mass flow rate of humidity per surface area: Da615d  
2-9干燥速度 drying speed : D'<L6w`  
2-10干燥过程drying process: <3!Al,!ej@  
2-11加热温度heating temperature: ]XU4nNi  
2-12干燥温度temperature of the material being dried : 1~ W@[D  
2-13干燥损失loss of material during the drying process : >MJ#|vO  
2-14飞尘lift off (particles): / cb`%"Z  
2-15堆层厚度thickness of the material: tPl 4'tW_  
ulxfxfd  
3.冷冻干燥 @4hzNi+  
3-1冷冻freezing: OKAU*}_  
(1).静态冷冻static freezing: vP x/&x  
(2).动态冷冻dynamic freezing: o`QNZN7/}  
(3).离心冷冻centrifugal freezing: s> m2qSu  
(4).滚动冷冻shell freezing: XHekz6_  
(5).旋转冷冻spin-freezing: "h#R>3I1)  
(6).真空旋转冷冻vacuum spin-freezing: dpTsTU!\  
(7).喷雾冷冻spray freezing: tBbOxMm0  
(8).气流冷冻air blast freezing: g]lEG>y1R  
3-2冷冻速率rate of freezing: 8'u9R~})   
3-3冷冻物料frozen material: :~ pGHl  
3-4冰核ice core: g E _+r  
3-5干燥物料外壳envelope of dried matter: ZA+dtEE=f9  
3-6升华表面sublimation front: Xd=KBB[r?  
3-7融化位置freezer burn: 0K[]UU=P=  
*mzi ?3  
4.真空干燥设备;真空冷冻干燥设备 /kY9z~l  
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: (oi:lC@h*  
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: 6LBdTnzUd  
4-3加热表面heating surface: 4d`YZNvZW/  
4-4物品装载面shelf : ,U3  
4-5干燥器的处理能力throughput (of the vacuum drying chamber): eJ99W=  
4-6单位面积干燥器处理能力throughput per shelf area: H"FK(N\  
4-7冰冷凝器ice condenser: }:m/@LKB  
4-8冰冷凝器的负载load of the ice condenser: ~f h  
4-9冰冷凝器的额定负载rated load of the ice condenser l)9IgJ|<b  
8.   1.一般术语 M@R"-$Z  
1-1试样sample : j:h}ka/!p  
(1).表面层surface layer: se\fbe^0  
(2).真实表面true surface: C3}:DIn"w  
(3).有效表面积effective surface area: 8cG?p  
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: -N8rs[c  
(5).表面粒子密度surface particle density: >\d&LLAe  
(6).单分子层monolayer: -g@!\{  
(7).表面单分子层粒子密度monolayer density: "E(i<  
(8).覆盖系数coverage ratio: I.n,TJoz4J  
1-2激发excitation: q#tUDxf(|  
(1).一次粒子primary particle: bZ\R0[0  
(2).一次粒子通量primary particle flux: mux/\TII  
(3).一次粒子通量密度density of primary particle flux: eR$@Q  
(4).一次粒子负荷primary particle load: j(=w4Sd_W  
(5).一次粒子积分负荷integral load of primary particle: XVqOiv)  
(6).一次粒子的入射能量energy of the incident primary particle: H)Btm  
(7).激发体积excited volume: `gX|q3K\s  
(8).激发面积excited area: #7i*Diqf9  
(9).激发深度excited death: /K#k_k  
(10).二次粒子secondary particles: 17 Ugz?  
(11).二次粒子通量secondary particle flux: ,AP0*Ln  
(12).二次粒子发射能energy of the emitted secondary particles: ~w? 02FU  
(13).发射体积emitting volume: X:oOp=y]|  
(14).发射面积emitting area: oX|T&"&  
(15).发射深度emitting depth: pR61bl)  
(16).信息深度information depth: ^ Oh  
(17).平均信息深度mean information depth: `,qft[1  
1-3入射角angle of incidence: BS9VwG <Z  
1-4发射角angle of emission: AJ\&>6GZ(b  
1-5观测角observation: i "h\*B=  
1-6分析表面积analyzed surface area: nGH6D2!F  
1-7产额 yield : G-d7}Uz ?  
1-8表面层微小损伤分析minimum damage surface analysis: x4WCAqi/2  
1-9表面层无损伤分析non-destructive surface analysis: B*T n@t W  
1-10断面深度分析 profile analysis in depth; depth profile analysis : ;7'O=%  
1-11可观测面积observable area: q&25,zWD  
1-12可观测立体角observable solid angle : '^UHY[mX8  
1-13接受立体角;观测立体角angle of acceptance: QTy=VLk43  
1-14角分辨能力angular resolving power: l7|z]v-  
1-15发光度luminosity: gXxi; g  
1-16二次粒子探测比detection ratio of secondary particles: Y4rxnXGw  
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: "`>6M&`U  
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: 2_q/<8t  
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: 9{u=  
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: P([!psgu  
1-21本底压力base pressure: /j~~S'sw  
1-22工作压力working pressure: NiZfaC6V  
("8Hku?  
2.分析方法 @7Ec(]yp  
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: h.edb6  
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : @IL04' \  
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: q`9.@u@a  
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: -8 uS#  
2-3离子散射表面分析ion scattering spectroscopy: B!wN%> U  
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: tu\XuDk y  
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: , Y:oTo=~  
2-6离子散射谱仪ion scattering spectrometer: sY;h~a0n  
2-7俄歇效应Auger process: jZA1fV  
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: uj8saNu  
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: o(hUC$vW  
2-10光电子谱术photoelectron spectroscopy : $gl|^c\  
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: mkSu $c  
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: JWNN5#=fQ  
2-11光电子谱仪photoelectron spectrometer: QLJ\>  
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: " .7@  
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: ]3 "0#Y  
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): }F>RI jj  
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus
zuiyuan 2007-03-13 15:13
太好了啊,多谢了啊
zhy980730 2007-03-14 11:39
多谢,了解点.
flyinlove79 2007-03-15 17:43
不错,多谢楼主分享资料 [s:4]
飞花无心 2007-03-26 09:33
很好,谢谢楼主啊
wottlin100 2007-04-02 09:19
呵呵,楼主辛苦啦!如果有定义解释更好!
xingmeng1227 2011-10-29 12:40
呵呵,楼主辛苦啦!
zh9607109 2011-11-03 05:41
呵呵,楼主辛苦啦!
wym87 2011-11-13 23:18
谢谢楼主的分享!Thanks!
douyongming 2012-06-17 17:03
太好了啊,多谢了啊
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