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2007-02-28 23:18 |
真空术语全集
“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 y%AJ>@/; --------------------------------------------------- w,$1 7+]3 真空术语 2HNS|GHb& :zoX
Xo 1.标准环境条件 standard ambient condition: 1gr jK.x 2.气体的标准状态 standard reference conditions forgases: wm4e:& 3.压力(压强)p pressure: h)8_sC 4.帕斯卡Pa pascal: ' ga2C\) 5.托Torr torr: e76)z;' 6.标准大气压atm standard atmosphere: bL%)k61G_v 7.毫巴mbar millibar: pq`MO
.R 8.分压力 partial pressure: +cN2 KP 9.全压力 total pressure: :4TcCWG 10.真空 vacuum: N"{o3QmA 11.真空度 degree of vacuum: P&VI2k 12.真空区域 ranges of vacuum: i=UJ*c 13.气体 gas: Wov_jVdN\ 14.非可凝气体 non-condensable gas: WBdb[N6\ 15.蒸汽vapor: G[ea@u$? 16.饱和蒸汽压saturation vapor pressure: 9p<l}h7g 17.饱和度degree of saturation: Ab)7hCUW 18.饱和蒸汽saturated vapor: 3@JwL{C 19.未饱和蒸汽unsaturated vapor: 8'$n|<1X 20.分子数密度n,m-3 number density of molecules: G Kr
L 21.平均自由程ι、λ,m mean free path: 9|,AhyhO 22.碰撞率ψ collision rate: `pr,lL 23.体积碰撞率χ volume collision rate: j3U8@tuG 24.气体量G quantity of gas: |V5H(2/nk 25.气体的扩散 diffusion of gas: dX*PR3I-3 26.扩散系数D diffusion coefficient; diffusivity: rjzRH 27.粘滞流 viscous flow: t/w>t! q 28.粘滞系数η viscous factor: }^t?v*kcA 29.泊肖叶流 poiseuille flow: ^q$sCt} 30.中间流 intermediate flow: >?tpGEZ\ 31.分子流 molecular flow: ijfT!W 32克努曾数 number of knudsen: :>z0m0nI\ 33.分子泻流 molecular effusion; effusive flow: t1S\M%? 34.流逸 transpiration: `7`iCYiTy 35.热流逸 thermal transpiration:
BN0))p 36.分子流率qN molecular flow rate; molecular flux: _'Z@ < ,L 37.分子流率密度 molecular flow rate density; density of molecular flux: \uH;ng|m 38.质量流率qm mass flow rare: FrS>.!OFn 39.流量qG throughput of gas: BH^q.p_#>X 40.体积流率qV volume flow rate: t<-Iiq+tL 41.摩尔流率qυ molar flow rate: 0FBifK 42.麦克斯韦速度分布 maxwellian velocity distribution: nBd;d}LD 43.传输几率Pc transmission probability: VlH9ap 44.分子流导CN,UN molecular conductance: P_}$|zj7 45.流导C,U conductance: <v?-$3YT 46.固有流导Ci,Ui intrinsic conductance: \BA_PyS?W+ 47.流阻W resistance: .+.Pc_fv 48.吸附 sorption: sE% n=Ww 49.表面吸附 adsorption: dJk.J9Z 50.物理吸附physisorption: /$E1!9J 51.化学吸附 chemisorption: MWB?V?qPSC 52.吸收absorption: H)Yv_gT 53.适应系数α accommodation factor: d{Z 54.入射率υ impingement rate: H3JWf
MlW 55.凝结率condensation rate: f-PDgs 56.粘着率 sticking rate: LS;kq', 57.粘着几率Ps sticking probability: 1-`8v[S 58.滞留时间τ residence time: q?wBh^ 59.迁移 migration: V'8
(}(s/ 60.解吸 desorption: Ty>`r n 61.去气 degassing: `C3F?Lch 62.放气 outgassing: iIg_S13 63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: 5}f$O 64.蒸发率 evaporation rate: >PTq5pk 65.渗透 permeation: Z|u_DaSrr| 66.渗透率φ permeability: x9a0J1Nb-h 67.渗透系数P permeability coefficient mY-r: 2. 1.真空泵 vacuum pumps q^gd1K<N 1-1.容积真空泵 positive displacement pump: f_}55?i0 ⑴.气镇真空泵 gas ballast vacuum pump: /%~`B[4F ⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: y<Z8+/f`f ⑶.干封真空泵 dry-sealed vacuum pump: ,ua]h8 ⑷.往复真空泵 piston vacuum pump: K-K+%U ⑸.液环真空泵 liquid ring vacuum pump: /IgTmXxxj ⑹.旋片真空泵 sliding vane rotary vacuum pump: :E.mU{ ⑺.定片真空泵 rotary piston vacuum pump: `*!.B ⑻.滑阀真空泵 rotary plunger vacuum pump: 8<xJmcTEwO ⑼.余摆线真空泵 trochoidal vacuum pump: ,^/;!ErR$ ⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: ^7=yjD` ⑾.罗茨真空泵 roots vacuum pump: p[cC%3 1-2.动量传输泵 kinetic vacuum pump: >t.I,Zn ⑴.牵引分子泵molecular drag pump:
uu HWN| ⑵.涡轮分子泵turbo molecular pump: U]_1yX ⑶.喷射真空泵ejector vacuum pump: 4o'0lz] ⑷.液体喷射真空泵liquid jet vacuum pump: G'! Hc6OZ ⑸.气体喷射真空泵gas jet vacuum pump: gZ 9<H q ⑹.蒸汽喷射真空泵vapor jet vacuum pump : :[Fwc ⑺.扩散泵diffusion pump : /@q_`tU ⑻.自净化扩散泵self purifying diffusion pump: h.PY$W< ⑼.分馏扩散泵 fractionating diffusion pump : bBGLf)fsTG ⑽.扩散喷射泵diffusion ejector pump : WFTTBUoH ⑾.离子传输泵ion transfer pump: W Qe>1 1-3.捕集真空泵 entrapment vacuum pump: 97Whn* ⑴吸附泵adsorption pump: V<1dA\I" ⑵.吸气剂泵 getter pump: \SyfEcSf2v ⑶.升华(蒸发)泵 sublimation (evaporation)pump : %h^; "|Z ⑷.吸气剂离子泵getter ion pump: u)%J5TR .Y ⑸.蒸发离子泵 evaporation ion pump: ! @|"84 ⑹.溅射离子泵sputter ion pump: w}+jfO9 ⑺.低温泵cryopump: .DHPKz`W0 *c. *e4uzF 2.真空泵零部件 ; R}:2 2-1.泵壳 pump case: ktnsq&qNL 2-2.入口 inlet: yYF%U7N/n 2-3.出口outlet: R9k
Z# 2-4.旋片(滑片、滑阀)vane; blade : k |M 2-5.排气阀discharge valve: -K PbA`j+ 2-6.气镇阀gas ballast valve: ,9=5.+AJ 2-7.膨胀室expansion chamber: wTqgH@rGtR 2-8.压缩室compression chamber: ~r+;i,,X 2-9.真空泵油 vacuum pump oil: A+>+XA' 2-10.泵液 pump fluid: (;\JCeGA 2-11.喷嘴 nozzle: dQTJC
%]O 2-13.喷嘴扩张率nozzle expansion rate: 7h0LR7 2-14.喷嘴间隙面积 nozzle clearance area : c.r]w 2-15.喷嘴间隙nozzle clearance: pFhznH{0 2-16.射流jet: V4iN2 2-17.扩散器diffuser: </Ja@% 2-18.扩散器喉部diffuser thoat: :D;BA 2-19.蒸汽导管vapor tube(pipe;chimney): \vsfY 2-20.喷嘴组件nozzle assembly: bt"*@NJ$ 2-21.下裙skirt: 5!-'~W /aNlr>^ 3.附件 >E6w,Ab 3-1阱trap: U%_BgLwy% ⑴.冷阱 cold trap: PIl:z?q({ ⑵.吸附阱sorption trap: ZDMS:w.'T ⑶.离子阱ion trap: lh{U@,/ ⑷.冷冻升华阱 cryosublimation trap: yO.q{|kX 3-2.挡板baffle: *7FtEk/l 3-3.油分离器oil separator: ch!/k 3-4.油净化器oil purifier: qYF150 3-5.冷凝器condenser: ^,*!Qk<c ,'Zs")Ydp 4.泵按工作分类 J4"?D9T3G 4-1.主泵main pump: /'O?
8X< 4-2.粗抽泵roughing vacuum pump: 7a\at)q/y 4-3.前级真空泵backing vacuum pump: gd#+N]C_ 4-4.粗(低)真空泵 roughing(low)vacuum pump: !W^P|:Qt 4-5.维持真空泵holding vacuum pump: "w7wd5h 4-6.高真空泵high vacuum pump: k>SPtiAs 4-7.超高真空泵ultra-high vacuum pump: t}w<xe 4-8.增压真空泵booster vacuum pump: Qv~lH&jG QbrR=[8b 5.真空泵特性 +~Wg@ 5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: :"{("!x 5-2.真空泵的抽气量Q throughput of vacuum pump:。 D?A3p6% 5-3.起动压力starting pressure: K+|G9 5-4.前级压力 backing pressure : 3qggdi 5-5.临界前级压力 critical backing pressure: ';'gKX!9V 5-6.最大前级压力maximum backing pressure: SI\
O>a9{ 5-7.最大工作压力maximum working pressure: UXgeL2`; 5-8.真空泵的极限压力ultimate pressure of a pump: b
v5BV 5-9.压缩比compression ratio: J;wDvt]]1 5-10.何氏系数Ho coefficient: :< X&y 5-11.抽速系数speed factor: *QH~z2:[ 5-12.气体的反扩散back-diffusion of gas: ecvQEK2L 5-13.泵液返流back-streaming of pump fluid: C)hS^D: 5-14.返流率back-streaming rate 1K\zamBg 5-15.返迁移back-migration: a!guZUg6 5-16.爆腾bumping: 1#}}: 5-17.水蒸气允许量qm water vapor tolerable load: '8Wu9 phT 5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: (_IP z)F 5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: eU(cn8/} 5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump qg1tDN`s 3. 1.一般术语 q!f'?yFYK 1-1.压力计pressure gauge: [$]qJ~kz 1-2.真空计vacuum gauge: B5v5D[ o5 ⑴.规头(规管)gauge head: tw
k ⑵.裸规nude gauge : FIu|eW+<l ⑶.真空计控制单元gauge control unit : ,)?!p_*@: ⑷.真空计指示单元gauge indicating unit : V10JExsJ <~z@GMQCf 2.真空计一般分类 D4Z7j\3a 2-1.压差式真空计differential vacuum gauge: ?LSwJ
@# 2-2.绝对真空计 absolute vacuum gauge: hik.c3 2-3.全压真空计total pressure vacuum gauge: zoibinm}Eg 2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: Fa0Fl}L 2-5.相对真空计relative vacuum gauge : .VXadgM @PzRHnT* 3.真空计特性 F81Kxcs 3-1.真空计测量范围pressure range of vacuum gauge: R+r;V ]-/ 3-2.灵敏度系数sensitivity coefficient: SiLWy=qbR 3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): Fe1^9ja 3-5.规管光电流photon current of vacuum gauge head: .C|dGE?, 3-6.等效氮压力equivalent nitrogen pressure : TdeHs{| 3-7.X射线极限值 X-ray limit: WU\Bs2 3-8.逆X射线效应anti X-ray effect: >1BDt:G36 3-9.布利尔斯效应blears effect: \%}w7J; 4OOI$J$Jh 4.全压真空计 ^Ycn&`s 4-1.液位压力计liquid level manometer: ?G>E[!8ev 4-2.弹性元件真空计elastic element vacuum gauge: *E|#g 4-3.压缩式真空计compression gauge: gY {/)" 4-4.压力天平pressure balance: sq_
yu( 4-5.粘滞性真空计viscosity gauge : ^]k=*>{
R 4-6.热传导真空计thermal conductivity vacuum gauge : "M}3T?0 O 4-7.热分子真空计thermo-molecular gauge: Yij_'0vZ 4-8.电离真空计ionization vacuum gauge: f]NaQ!.
7 4-9.放射性电离真空计radioactive ionization gauge: L'HO"EZFj 4-10.冷阴极电离真空计cold cathode ionization gauge: nTv^][ 4-11.潘宁真空计penning gauge: yk0^m/=C( 4-12.冷阴极磁控管真空计cold cathode magnetron gauge: o*5b]XWw 4-13.放电管指示器discharge tube indicator: `3^%ft~l 4-14.热阴极电离真空计hot cathode ionization gauge: 0ky3rFSh1 4-15.三极管式真空计triode gauge: f?lnBvT|b 4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: #X"fm1 4-17.B-A型电离真空计Bayard-Alpert gauge: .efbORp 4-18.调制型电离真空计modulator gauge: RDxvN:v 4-19.抑制型电离真空计suppressor gauge: Mj W{JR)I 4-20.分离型电离真空计extractor gauge: ^!6T,7B B 4-21.弯注型电离真空计bent beam gauge: )1/J5DI @8 4-22.弹道型电离真空计 orbitron gauge : wvI}|c 4-23.热阴极磁控管真空计hot cathode magnetron gauge: iw^"?:'% CqLAtS X7 5.分压真空计(分压分析器) TBmmC}PEd 5-1.射频质谱仪radio frequency mass spectrometer: ,8.zbr 5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: LIRL`xU7 5-3.单极质谱仪momopole mass spectrometer: PTpGZ2FZ 5-4.双聚焦质谱仪double focusing mass spectrometer: H,(4a2zx 5-5.磁偏转质谱仪magnetic deflection mass spectrometer: ?
@- t.N 5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: ua!RwSo 5-7.回旋质谱仪omegatron mass spectrometer: 2OwO|n 5-8.飞行时间质谱仪time of flight mass spectrometer: fBLR m!WDXt 6.真空计校准 (m() r0:@ 6-1.标准真空计reference gauges: Na.)!h_Kn' 6-2.校准系统system of calibration: ]t-B-(D 6-3.校准系数K calibration coefficient: XZ4H(Cj 6-4.压缩计法meleod gauge method: ,-V7~gM%} 6-5.膨胀法expansion method: }g"K\x:Z 6-6.流导法flow method: oz'^.+uvE 4. 1.真空系统vacuum system m^;A]0h+ 1-1.真空机组pump system: FTh/1"a 1-2.有油真空机组pump system used oil : 5N[H@%>QO 1-3.无油真空机组oil free pump system )2?A|f8 1-4.连续处理真空设备continuous treatment vacuum plant: CTZ#QiNP 1-5.闸门式真空系统vacuum system with an air-lock: yHmNO*(
1-6.压差真空系统differentially pumped vacuum system: S~ZRqL7ZO 1-7.进气系统gas admittance system: {^@qfkZz^ .~%,eF;l$ 2.真空系统特性参量 X?SLYm@v 2-1.抽气装置的抽速volume flow rate of a pumping unit : J';XAB } 2-2.抽气装置的抽气量throughput of a pumping unit : $uUJV% EX 2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: xL|4'8 2-4.真空系统的漏气速率leak throughput of a vacuum system: 8 O.5ML{ 2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: #1[Q?e4,0 2-6.极限压力ultimate pressure: (*G'~gSX 2-7.残余压力residual pressure: &P(vm@* 2-8.残余气体谱residual gas spectrum: T2}ccnDi 2-9.基础压力base pressure: `$>cQwB,D 2-10.工作压力working pressure: pJ_>^i= 2-11.粗抽时间roughing time: W4S]2P>T 2-12.抽气时间pump-down time: /i
IWt\J 2-13.真空系统时间常数time constant of a vacuum system: GI/4<J\ 2-14.真空系统进气时间venting time: F
<.} q|b 7J$Yd976 3.真空容器 fVxRK\a\\ 3-1.真空容器;真空室vacuum chamber: l 5z8]/ 3-2.封离真空装置sealed vacuum device: D}K/5iU]a 3-3.真空钟罩vacuum bell jar: Ffr6P
}I 3-4.真空容器底板vacuum base plate: @v=A)L 3-5.真空岐管vacuum manifold: -P$E)5?^ 3-6.前级真空容器(贮气罐)backing reservoir: G2hBJTW 3-7.真空保护层outer chamber: YL@d+
-\ 3-8.真空闸室vacuum air lock: #*;Nb 3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: q^+Z> 3bMUsyJ 2 4.真空封接和真空引入线 kA(q-Re$B* 4-1.永久性真空封接permanent seal : -1 _7z{. 4.2.玻璃分级过渡封接graded seal : bn8?- 4-3.压缩玻璃金属封接compression glass-to-metal seal: J9`[Qy\ 4-4.匹配式玻璃金属封接matched glass-to-metal seal: "6P- 0CJ 4-5.陶瓷金属封接ceramic-to-metal seal: 2O)2#N 4-6.半永久性真空封接semi-permanent seal : Vr<ypyC 4-7.可拆卸的真空封接demountable joint: Mta;6< 4-8.液体真空封接liquid seal nuX W/7M 4-9.熔融金属真空封接molten metal seal: qYR+qSAJP 4-10.研磨面搭接封接ground and lapped seal: !FR1yO'd> 4-11.真空法兰连接vacuum flange connection: P%xz"l i 4-12.真空密封垫vacuum-tight gasket: >jBnNA@ 4-13.真空密封圈ring gasket: IP+1 :M 4-14.真空平密封垫flat gasket: h}$]3/5H 4-15.真空引入线feedthrough leadthrough: d^jIsE ` 4-16.真空轴密封shaft seal: |h65[9DMP 4-17.真空窗vacuum window: Id'@!U:NA 4-18.观察窗viewing window: Is !DiB od~`q4p1(- 5.真空阀门 7<c&)No; 5-1.真空阀门的特性characteristic of vacuum valves:
\l8$1p ⑴.真空阀门的流导conductance of vacuum valves: 9@|X~z5E ⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: hy|X(m 5-2.真空调节阀regulating valve: ?4}EhXR( 5-3.微调阀 micro-adjustable valve: 6Bfu89 5-4.充气阀charge valve: vH^^QI:em 5-5.进气阀gas admittance valve: =.Q|gZ
5-6.真空截止阀break valve: #%g~fh 5-7.前级真空阀backing valve: rKys:is 5-8.旁通阀 by-pass valve: dSBW&-p 5-9.主真空阀main vacuum valve: >}ozEX6c2 5-10.低真空阀low vacuum valve: c~UYs\ 5-11.高真空阀high vacuum valve: -/#tQ~{gs 5-12.超高真空阀;UHV阀 ultra-high vacuum valve: J8yi#A>+ 5-13.手动阀manually operated valve: 3fJwj}wL 5-14.气动阀pneumatically operated valve: c/57_fOK 5-15.电磁阀electromagnetically operated valve: weiqt
*,8 5-16.电动阀valve with electrically motorized operation: E0*'AZi& 5-17.挡板阀baffle valve: <ST#<
$% 5-18.翻板阀flap valve: >AW=N 5-19.插板阀gate valve: cnOk 5-20.蝶阀butterfly valve: jsvD[ \P &p$SFH?s 6.真空管路 ?y{C"w!
6-1.粗抽管路roughing line: 2JYt.HN 6-2.前级真空管路backing line: :=tPC A= 6-3.旁通管路;By-Pass管路 by-pass line: ; (+r)r_ 6-4.抽气封口接头pumping stem: b_ | 6-5.真空限流件limiting conductance: PaFJw5f 6-6.过滤器filter: 1XO*yZF 5. 1.一般术语 ?%h JZm; 1-1真空镀膜vacuum coating: 8D:{05 1-2基片substrate: A2"xCJ0` 1-3试验基片testing substrate: FBcF 1-4镀膜材料coating material: y6o^ Knl 1-5蒸发材料evaporation material: tH"SOGfSt 1-6溅射材料sputtering material: v=|BqG` 1-7膜层材料(膜层材质)film material: Mf&W<n^j 1-8蒸发速率evaporation rate: 8E Y<^: 1-9溅射速率sputtering rate: h tn2` 1-10沉积速率deposition rate: ^F~e?^s 1-11镀膜角度coating angle: L&'0d$Tg8 0n,5"B 2.工艺 ys;e2xekg 2-1真空蒸膜vacuum evaporation coating: K0\a+6kh (1).同时蒸发simultaneous evaporation: .so{ RI (2).蒸发场蒸发evaporation field evaporation: zHB{I(q (3).反应性真空蒸发reactive vacuum evaporation: t{>66jm\R (4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: ~]/X,Cf (5).直接加热的蒸发direct heating evaporation: H9w*U (6).感应加热蒸发induced heating evaporation: =3oz74O[ (7).电子束蒸发electron beam evaporation: C<fNIc~. (8).激光束蒸发laser beam evaporation: K.R2)o` (9).间接加热的蒸发indirect heating evaporation: Prhq ~oI4 (10).闪蒸flash evaportion: @U:T}5)wc 2-2真空溅射vacuum sputtering: KF'H|)!K (1).反应性真空溅射 reactive vacuum sputtering: %`}CbD6 (2).偏压溅射bias sputtering: >UJ&noUD#: (3).直流二级溅射direct current diode sputtering: c)SSi@<
cv (4).非对称性交流溅射asymmtric alternate current sputtering: Ytx+7OLe (5).高频二极溅射high frequency diode sputtering: GGF;T&DWad (6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: S53%*7K. (7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: _u;^w}0 (8).离子束溅射ion beam sputtering: Xx|&%b{{r (9).辉光放电清洗glow discharge cleaning: dtM@iDljj 2-3物理气相沉积PVD physical vapor deposition: _T5~B"* 2-4化学气相沉积CVD chemical vapor deposition: #K!Df%,< 2-5磁控溅射magnetron sputtering: ''BP4=r5n 2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: &F'v_9 2-7空心阴极离子镀HCD hollow cathode discharge deposition: OqBw&zm 2-8电弧离子镀arc discharge deposition: XU9=@y+|v TKLy38 3.专用部件 qW7"qw= 3-1镀膜室coating chamber: Z{p6Q1u 3-2蒸发器装置evaporator device: B@zJ\Ir[ 3-3蒸发器evaporator: SC2C%.%l` 3-4直接加热式蒸发器evaporator by direct heat: F` I-G~e 3-5间接加热式蒸发器evaporator by indirect heat: "}SERC7 3-7溅射装置sputtering device: v[a#>!;s 3-8靶target: <YeF?$S} 3-10时控挡板timing shutter: FYcMvY 3-11掩膜mask: 29sgi" 3-12基片支架substrate holder: pXFNK"jm 3-13夹紧装置clamp:
GoEIY 3-14换向装置reversing device:
eN>
(IW 3-15基片加热装置substrate heating device: k) v[/#I 3-16基片冷却装置substrate colding device: )i_FU~ LRq Ix"c<1I 4.真空镀膜设备 jm-0]ugY&` 4-1真空镀膜设备vacuum coating plant: l IFt/ (1).真空蒸发镀膜设备vacuum evaporation coating plant: Ab2g),;c (2).真空溅射镀膜设备vacuum sputtering coating plant: uAvs 4-2连续镀膜设备continuous coating plant: =|U2 }U; 4-3半连续镀膜设备semi- continuous coating plant Ve8! 6. 1.漏孔 k@8#By l| 1-1漏孔leaks: mzT} C&hfP 1-2通道漏孔channel leak: k9Sqp:l, 1-3薄膜漏孔membrane leak: (J$A 1-4分子漏孔molecular leak: "}OFwes 1-5粘滞漏孔vixcous leak: |~HlNUPR 1-6校准漏孔calibrated leak: 'hekCZZ_I 1-7标准漏孔reference leak : hx^a&" 1-8虚漏virtual leak: 3-mw-;. 1-9漏率leak rate: phc1AN=[E 1-10标准空气漏率standard air leak rate: b<F 4_WF 1-11等值标准空气漏率equivalent standard air leak rate: Pm1
"
0 1-12探索(示漏)气体: o`77gkLO Rm*}<JN31 2.本底 D+SpSO7yg 2-1本底background: i`>X5Da5 2-2探索气体本底search gas background : ?UfZ VyHv+ 2-3漂移drift: 42wcpSp 2-4噪声noise: hL`zV ]Qu12Wg}P 3.检漏仪 +uLo~GdbE 3-1检漏仪leak detector: kH&ZPAI 3-2高频火花检漏仪H.F. spark leak detector: poe Xi\e!( 3-3卤素检漏仪halide leak detector: 8zc!g|5" 3-4氦质谱检漏仪helium mass spectrometer leak detector: FvJSJ.;E, 3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: b}4/4Z. 20moX7L 4.检漏
7k\7G= 4-1气泡检漏leak detection by bubbles: !n{c#HfG 4-2氨检漏leak detection by ammonia: gPwp
[ 4-3升压检漏leak detection of rise pressure:
?:FotnU*p 4-4放射性同位素检漏radioactive isotope leak detection: e6R"W9 4-5荧光检漏fluorescence leak detection *(`.h\+ 7. 1.一般术语 epbp9[` 1-1真空干燥vacuum drying: >o} ati 1-2冷冻干燥freeze drying : WsV3>=@f 1-3物料material: ;:|KfXiC8 1-4待干燥物料material to be dried: Az-!LAu9 R 1-5干燥物料dried material : v$i%>tQ\ 1-6湿气moisture;humidity: 1ZL_;k 1-7自由湿气free moisture: A pjqSz" 1-8结合湿气bound moisture: U]D.z}0 1-9分湿气partial moisture: "<2bjy 1-10含湿量moisture content: Q*C4
q` 1-11初始含湿量initial moisture content: h(8;7}K 1-12最终含湿量final residual moisture:
`_'Dj> 1-13湿度degree of moisture ,degree of humidity : -(uBTO s 1-14干燥物质dry matter : 2SJh6U 1-15干燥物质含量content of dry matter: 9Bk}g50$# )A0&16< 2.干燥工艺 3b3cNYP 2-1干燥阶段stages of drying : :b;1P@W< (1).预干燥preliminary dry: I7PWOd (2).一次干燥(广义)primary drying(in general): kV rT? (3).一次干燥(冷冻干燥)primary drying(freeze-drying): GF!{SO4 (4).二次干燥secondary drying: %'T>kz *A 2-2.(1).接触干燥contact drying: X{xJ*T y' (2).辐射干燥 drying by radiation : BNCJT$tYX (3).微波干燥microwave drying: qE72(#:R* (4).气相干燥vapor phase drying: erP>P (5).静态干燥static drying: `Y\/US70{c (6).动态干燥dynamic drying: />[6uvy#Q 2-3干燥时间drying time: y+scJ+< 2-4停留时间length of stay(in the drying chamber): 0:Y`#0qK 2-5循环时间cycle time: i`aG 2-6干燥率 dessication ratio : -NPkN%h 2-7去湿速率mass flow rate of humidity: N`Xnoehu 2-8单位面积去湿速率mass flow rate of humidity per surface area: =+h!JgY/L 2-9干燥速度 drying speed : C9H11g7{ 2-10干燥过程drying process: DiQkT R 2-11加热温度heating temperature: e-cb?.WU? 2-12干燥温度temperature of the material being dried : ^X;Xti 2-13干燥损失loss of material during the drying process : {}o>nenx\ 2-14飞尘lift off (particles): R[9PFMn 2-15堆层厚度thickness of the material: 56Y5kxmi YaZt+WA 3.冷冻干燥 r)5\3j[P 3-1冷冻freezing: 6&QTVdK'O (1).静态冷冻static freezing: *z"1MU (2).动态冷冻dynamic freezing: q7 oR9 (3).离心冷冻centrifugal freezing: K^vp(2 (4).滚动冷冻shell freezing: 0^&R7Rv c (5).旋转冷冻spin-freezing: TJ[jZuT: (6).真空旋转冷冻vacuum spin-freezing: Mto~ / (7).喷雾冷冻spray freezing: E9d i (8).气流冷冻air blast freezing: 6>BDA? 3-2冷冻速率rate of freezing: w52HN;Jm 3-3冷冻物料frozen material: y]YS2^ 3-4冰核ice core: v~2XGm 3-5干燥物料外壳envelope of dried matter: :z} _y&] 3-6升华表面sublimation front: ,q@(L 3-7融化位置freezer burn: _d0-%B
9m ?3TK7]1V: 4.真空干燥设备;真空冷冻干燥设备 :$cSQ(q9a 4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: HA.NZkq.tV 4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: txfwLqx 4-3加热表面heating surface: ]AC!R{H 4-4物品装载面shelf : l&sO?P[ / 4-5干燥器的处理能力throughput (of the vacuum drying chamber): 0HJqsSZ$mW 4-6单位面积干燥器处理能力throughput per shelf area: ckjVa\ 4-7冰冷凝器ice condenser: %cr]ZR 4-8冰冷凝器的负载load of the ice condenser: <,X+`m& 4-9冰冷凝器的额定负载rated load of the ice condenser ul=a\;3x#| 8. 1.一般术语 Sp~Gv>uMK 1-1试样sample : Z:Y.":[
Qi (1).表面层surface layer:
h[|zs>p (2).真实表面true surface: 8X
?GY8W: (3).有效表面积effective surface area: ;p#Z :6 (4).宏观表面;几何表面macroscopic surface area; geometric surface area: X\^& nLa (5).表面粒子密度surface particle density: 1[/$ZYk: (6).单分子层monolayer: jdg
~!<C (7).表面单分子层粒子密度monolayer density: R3{*v =ov (8).覆盖系数coverage ratio: &X]=Qpl 1-2激发excitation: ^8-~@01.`_ (1).一次粒子primary particle: M*~v'L_sI (2).一次粒子通量primary particle flux: Vi?~0.Z% (3).一次粒子通量密度density of primary particle flux: "'}v 0*[ (4).一次粒子负荷primary particle load: A D}}>v (5).一次粒子积分负荷integral load of primary particle: hKH$AEHEU} (6).一次粒子的入射能量energy of the incident primary particle: ]~
#+b> (7).激发体积excited volume: 61+pryW%g (8).激发面积excited area: Y0L5W;iM (9).激发深度excited death: fs3-rXoB (10).二次粒子secondary particles: ycl>git] (11).二次粒子通量secondary particle flux: "\zj][sL (12).二次粒子发射能energy of the emitted secondary particles: r8
Zyld_@ (13).发射体积emitting volume: <(bCz>o| (14).发射面积emitting area: V^Mf4!A(y (15).发射深度emitting depth: DUuC3^R (16).信息深度information depth: zhA',p@K?_ (17).平均信息深度mean information depth: pRrqs+IJZ\ 1-3入射角angle of incidence: p-i.ITRS 1-4发射角angle of emission: EBIa%, 1-5观测角observation: ph8Jn+|E 1-6分析表面积analyzed surface area: -l P ) 1-7产额 yield : '?`@7Eol 1-8表面层微小损伤分析minimum damage surface analysis: ){:q;E]^fB 1-9表面层无损伤分析non-destructive surface analysis: 0V>ESyae5 1-10断面深度分析 profile analysis in depth; depth profile analysis : aJy> 1-11可观测面积observable area: 5!SoN}$ 1-12可观测立体角observable solid angle : ;*wT,2;
1-13接受立体角;观测立体角angle of acceptance: w;yiX<t< 1-14角分辨能力angular resolving power: yBPt%EF 1-15发光度luminosity: o8};e 1-16二次粒子探测比detection ratio of secondary particles: l`v
+sV^1 1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: G. -h=DT] 1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: `'[7~ Ew[ 1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: *w'q 1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: Q{.{#G 1-21本底压力base pressure: .# !'c 1-22工作压力working pressure: j[m_qohd7 L@1,7@
2.分析方法 O?nPxa< 2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: r
1l/) ; (1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : `N|U"s; (2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: _C< 6349w 2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: .g/ARwM} 2-3离子散射表面分析ion scattering spectroscopy: \A'|XdQ 2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: (C-,ljY 2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: PwFQ #Z 2-6离子散射谱仪ion scattering spectrometer: OYszW]UMg 2-7俄歇效应Auger process: W"b&M%y| 2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: _DPB?)!x 2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: T:K" 2-10光电子谱术photoelectron spectroscopy : H4PbO/{xO (1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: %XEKhy (2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: =~GE?}.o 2-11光电子谱仪photoelectron spectrometer: rxs~y{Xi 2-12低能电子衍射;LEED low energy electron diffraction ;LEED: QHHW(InG< 2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: Je#!Wd 2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): <ICZ"F`S 2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus
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