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cswmsc 2007-02-28 23:18

真空术语全集

“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 h&{pMmS3,  
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真空术语 A{vG@Pwc:  
ohl%<FqS  
1.标准环境条件 standard ambient condition: +TX]~k79Oq  
2.气体的标准状态 standard reference conditions forgases: Qt$Q/<8U  
3.压力(压强)p pressure: I/l]Yv!  
4.帕斯卡Pa pascal: as8<c4:v  
5.托Torr torr: $) $sApB  
6.标准大气压atm standard atmosphere: .O(UK4Mb  
7.毫巴mbar millibar: ,MJZ*"V/3  
8.分压力 partial pressure: ~i4@sz&  
9.全压力 total pressure: f$L5=V  
10.真空 vacuum: lbY>R@5  
11.真空度 degree of vacuum: LY MfoXp  
12.真空区域 ranges of vacuum: ;L7<mU  
13.气体 gas: W0|?R6|  
14.非可凝气体 non-condensable gas: 6lPGop]js]  
15.蒸汽vapor: E^!%m8--  
16.饱和蒸汽压saturation vapor pressure: 4ET P  
17.饱和度degree of saturation:  O-k(5Zb  
18.饱和蒸汽saturated vapor: -T>`PJpJuL  
19.未饱和蒸汽unsaturated vapor: xab[  
20.分子数密度n,m-3 number density of molecules: IlVi1`]w  
21.平均自由程ι、λ,m mean free path: sXUM,h8$!+  
22.碰撞率ψ collision rate: s`{O-  
23.体积碰撞率χ volume collision rate: LQe<mZ<  
24.气体量G quantity of gas: TBpW/wz/  
25.气体的扩散 diffusion of gas: 7@`(DU`z  
26.扩散系数D diffusion coefficient; diffusivity: .d2s4q\  
27.粘滞流 viscous flow: @ 9uwcM1F  
28.粘滞系数η viscous factor: P*}Oi7Z  
29.泊肖叶流 poiseuille flow: :V [vE h  
30.中间流 intermediate flow: )}R0'QGd  
31.分子流 molecular flow: 0y(d|;':  
32克努曾数 number of knudsen: G100L}d"N  
33.分子泻流 molecular effusion; effusive flow: k$zDofdfp  
34.流逸 transpiration: Y9C]-zEv  
35.热流逸 thermal transpiration: nV<YwqK  
36.分子流率qN molecular flow rate; molecular flux: ]ba<4:[Go  
37.分子流率密度 molecular flow rate density; density of molecular flux: -Fb/GZt|  
38.质量流率qm mass flow rare: </eh^<_~  
39.流量qG throughput of gas: 0-@waK  
40.体积流率qV volume flow rate: #M:W?&.  
41.摩尔流率qυ molar flow rate: c;Li~FLR  
42.麦克斯韦速度分布 maxwellian velocity distribution: vUW!  
43.传输几率Pc transmission probability: ? in&/ZrB  
44.分子流导CN,UN molecular conductance: 2/GH5b(  
45.流导C,U conductance: g\ke,r6  
46.固有流导Ci,Ui intrinsic conductance: ?p5Eo{B  
47.流阻W resistance: 2$jY_{B+x  
48.吸附 sorption: :Qf^@TS}O  
49.表面吸附 adsorption: h"[ ][  
50.物理吸附physisorption: E\ QSU88^  
51.化学吸附 chemisorption: A2B&X}K|U  
52.吸收absorption: /HLQ  
53.适应系数α accommodation factor: sh0O~%]g  
54.入射率υ impingement rate: j"f ]pzg&  
55.凝结率condensation rate: 1$c*/Tc:E  
56.粘着率 sticking rate: .AKx8=f  
57.粘着几率Ps sticking probability: NoMEe<  
58.滞留时间τ residence time: '+`CwB2  
59.迁移 migration: U_w)*)F  
60.解吸 desorption: 1 @/+ c  
61.去气 degassing: %o5GD  
62.放气 outgassing: 7n#0eska,  
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: )sW1a  
64.蒸发率 evaporation rate: }!2|*Y  
65.渗透 permeation: BYu|loc  
66.渗透率φ permeability: \PL92HV  
67.渗透系数P permeability coefficient ?g9CeeH*  
2.   1.真空泵 vacuum pumps ~Su>^T(?-  
1-1.容积真空泵 positive displacement pump: J?%Z7&/M>  
⑴.气镇真空泵 gas ballast vacuum pump: Y*4\K%e(  
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: r8@:Ko= a  
⑶.干封真空泵 dry-sealed vacuum pump: ^E5Xpza  
⑷.往复真空泵 piston vacuum pump: ]E`DG  
⑸.液环真空泵 liquid ring vacuum pump: n] &fod  
⑹.旋片真空泵 sliding vane rotary vacuum pump: )]v vp{  
⑺.定片真空泵 rotary piston vacuum pump: %!WQ;(  
⑻.滑阀真空泵 rotary plunger vacuum pump: 3B>!9:w~f  
⑼.余摆线真空泵 trochoidal vacuum pump: !Qn:PSk  
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: >b/Yg:t  
⑾.罗茨真空泵 roots vacuum pump: <n0-zCf  
1-2.动量传输泵 kinetic vacuum pump: ?vvjwys@  
⑴.牵引分子泵molecular drag pump: bvAO(`  
⑵.涡轮分子泵turbo molecular pump: wZ29/{,  
⑶.喷射真空泵ejector vacuum pump: +&JF|#FQ`  
⑷.液体喷射真空泵liquid jet vacuum pump: ww=< =  
⑸.气体喷射真空泵gas jet vacuum pump: :I1bGa&I  
⑹.蒸汽喷射真空泵vapor jet vacuum pump : r0_3`; H  
⑺.扩散泵diffusion pump : e=YvM g  
⑻.自净化扩散泵self purifying diffusion pump: %2V_%KA  
⑼.分馏扩散泵 fractionating diffusion pump : >/Slk {  
⑽.扩散喷射泵diffusion ejector pump : cD7q;|+  
⑾.离子传输泵ion transfer pump: T"3WB o  
1-3.捕集真空泵 entrapment vacuum pump: O75ioO0  
⑴吸附泵adsorption pump: :  wb\N'b  
⑵.吸气剂泵 getter pump: az7L0pp  
⑶.升华(蒸发)泵 sublimation (evaporation)pump : oU67<jq  
⑷.吸气剂离子泵getter ion pump: aMT&}3  
⑸.蒸发离子泵 evaporation ion pump: Rg+V;C C~  
⑹.溅射离子泵sputter ion pump: 'j>Q7M7q{  
⑺.低温泵cryopump: C#;}U51:t  
^-rb&kW@:  
2.真空泵零部件 s}UPe)Vu  
2-1.泵壳 pump case: <^OGJ}G  
2-2.入口 inlet: E}yl@8g:#  
2-3.出口outlet: PJO +@+"{@  
2-4.旋片(滑片、滑阀)vane; blade : pZF`+6 42  
2-5.排气阀discharge valve: aZ- )w  
2-6.气镇阀gas ballast valve: izOtt^#DZt  
2-7.膨胀室expansion chamber: y1FS?hSD0  
2-8.压缩室compression chamber: jg' 'T1)  
2-9.真空泵油 vacuum pump oil: cy%^P^M  
2-10.泵液 pump fluid: .z)&#2E  
2-11.喷嘴 nozzle: !y `wAm>n  
2-13.喷嘴扩张率nozzle expansion rate: BPtU]Bv-  
2-14.喷嘴间隙面积 nozzle clearance area : vxY7/_]  
2-15.喷嘴间隙nozzle clearance: C {gYrz)  
2-16.射流jet: UjUDP>iz.>  
2-17.扩散器diffuser: p e |k}{  
2-18.扩散器喉部diffuser thoat: { +MqXeq  
2-19.蒸汽导管vapor tube(pipe;chimney): t d-EB&i\  
2-20.喷嘴组件nozzle assembly: ?tg(X[h{S  
2-21.下裙skirt: 8.F]&D0p8  
m'@NF--#Oq  
3.附件 u0Irf"Ab  
3-1阱trap: $D<LND=o=  
⑴.冷阱 cold trap: ig)rK<@*[  
⑵.吸附阱sorption trap: 4ijoAW3A^  
⑶.离子阱ion trap: 9^x'x@6  
⑷.冷冻升华阱 cryosublimation trap: >@` D@_v  
3-2.挡板baffle: G"3D"7f a  
3-3.油分离器oil separator:  UcKpid  
3-4.油净化器oil purifier: c5nl!0XX  
3-5.冷凝器condenser: {H=DeQ  
Sc`W'q^X  
4.泵按工作分类 P]bI".A8  
4-1.主泵main pump: IEmtt^C  
4-2.粗抽泵roughing vacuum pump: #iJ+}EW _  
4-3.前级真空泵backing vacuum pump: q!t_qX7u  
4-4.粗(低)真空泵 roughing(low)vacuum pump: uR"(0_  
4-5.维持真空泵holding vacuum pump: DgGGrV`  
4-6.高真空泵high vacuum pump: R*VJe+5w  
4-7.超高真空泵ultra-high vacuum pump: uwU;glT  
4-8.增压真空泵booster vacuum pump: 9Qst5n\Z  
eZJrV} V  
5.真空泵特性 049E# [<Q"  
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: f4@>7K]9TA  
5-2.真空泵的抽气量Q throughput of vacuum pump:。 g/'CX}g`  
5-3.起动压力starting pressure: YQ:F Bj  
5-4.前级压力 backing pressure : CuR.a  
5-5.临界前级压力 critical backing pressure: ]_G!(`Udh  
5-6.最大前级压力maximum backing pressure: "d^hY}Xx  
5-7.最大工作压力maximum working pressure: f,wB.MN  
5-8.真空泵的极限压力ultimate pressure of a pump: j|N;&s`  
5-9.压缩比compression ratio: Ml@,xJ/aia  
5-10.何氏系数Ho coefficient: w z}BH  
5-11.抽速系数speed factor: }'U "HHv  
5-12.气体的反扩散back-diffusion of gas: )S]4 Kt_  
5-13.泵液返流back-streaming of pump fluid: dj3}Tjt  
5-14.返流率back-streaming rate Y &6vTU  
5-15.返迁移back-migration: tF}Vs}  
5-16.爆腾bumping: B{hP#bYK  
5-17.水蒸气允许量qm water vapor tolerable load: p(g0+.?`~  
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: -Jr6aai3+  
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: p(-f$Q(  
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump 6p|*H?|It  
3.   1.一般术语 Ztu _UlGC  
1-1.压力计pressure gauge: Oc8]A=M12  
1-2.真空计vacuum gauge: |]kcgLqj  
⑴.规头(规管)gauge head: $d? N("L  
⑵.裸规nude gauge : ckY,6e"6  
⑶.真空计控制单元gauge control unit : 16Ym*kWIps  
⑷.真空计指示单元gauge indicating unit : ~M7 J{hK  
+ KGZk?%  
2.真空计一般分类 M@ t,P?  
2-1.压差式真空计differential vacuum gauge: ,<!_MNw[  
2-2.绝对真空计 absolute vacuum gauge: 5v<X-8"  
2-3.全压真空计total pressure vacuum gauge: mltG4R ?  
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: Z#0hh%E"|y  
2-5.相对真空计relative vacuum gauge : lv\C(^mGq  
" lar~  
3.真空计特性 WP{!|d&  
3-1.真空计测量范围pressure range of vacuum gauge: x;w&JS1 V  
3-2.灵敏度系数sensitivity coefficient: 4Qh\3UL~  
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): p^S]O\;M7  
3-5.规管光电流photon current of vacuum gauge head: oNH&VHjU  
3-6.等效氮压力equivalent nitrogen pressure : hYO UuC  
3-7.X射线极限值 X-ray limit: = zJY5@^'7  
3-8.逆X射线效应anti X-ray effect: K89 AZxH  
3-9.布利尔斯效应blears effect: 7UM!<@9\  
rWzw7T~  
4.全压真空计 EA_6L\+8&  
4-1.液位压力计liquid level manometer: K.'II9-{  
4-2.弹性元件真空计elastic element vacuum gauge: .b'hVOs{  
4-3.压缩式真空计compression gauge: \@6P A  
4-4.压力天平pressure balance: I`"B<=zi  
4-5.粘滞性真空计viscosity gauge : KFd !wZ @e  
4-6.热传导真空计thermal conductivity vacuum gauge : =I. b2e 1z  
4-7.热分子真空计thermo-molecular gauge: :wtr{,9rZ  
4-8.电离真空计ionization vacuum gauge: <7Igd6u  
4-9.放射性电离真空计radioactive ionization gauge: doM}vh)6  
4-10.冷阴极电离真空计cold cathode ionization gauge: QJ1_LJ4)a  
4-11.潘宁真空计penning gauge: XoI,m8A  
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: Pt<lHfd  
4-13.放电管指示器discharge tube indicator: G,,c,  
4-14.热阴极电离真空计hot cathode ionization gauge: mqPV Eo  
4-15.三极管式真空计triode gauge: DY]\@<ez  
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: Rf7*Ut wVr  
4-17.B-A型电离真空计Bayard-Alpert gauge: (KQAKEhD!  
4-18.调制型电离真空计modulator gauge: <tp\+v! u  
4-19.抑制型电离真空计suppressor gauge: N#<h/  
4-20.分离型电离真空计extractor gauge: p<hV7x-{  
4-21.弯注型电离真空计bent beam gauge: e]N?{s   
4-22.弹道型电离真空计 orbitron gauge : m#y?k1GY  
4-23.热阴极磁控管真空计hot cathode magnetron gauge: uEp v l  
@k.j6LKbc  
5.分压真空计(分压分析器) 57:Wh= x  
5-1.射频质谱仪radio frequency mass spectrometer: h!#!}|Q'  
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: -?)` OHc^  
5-3.单极质谱仪momopole mass spectrometer: 2x3'm  
5-4.双聚焦质谱仪double focusing mass spectrometer: &Z Ja}5k!r  
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: |%6zhkoufM  
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: @H'pvFLK?  
5-7.回旋质谱仪omegatron mass spectrometer: %) A-zzj  
5-8.飞行时间质谱仪time of flight mass spectrometer: /y2upu*!  
G}.t!"  
6.真空计校准 p_z_d6?  
6-1.标准真空计reference gauges: 9D 2B8t"a  
6-2.校准系统system of calibration: b.Wf*I?  
6-3.校准系数K calibration coefficient: LeY!A#j  
6-4.压缩计法meleod gauge method: 9H ~{2Un  
6-5.膨胀法expansion method: P=ARttT`(  
6-6.流导法flow method: <cTusC<  
4.   1.真空系统vacuum system @r.u8e)l  
1-1.真空机组pump system: P(N$U^pj  
1-2.有油真空机组pump system used oil : i7^_y3dG  
1-3.无油真空机组oil free pump system ep]tio_  
1-4.连续处理真空设备continuous treatment vacuum plant: xv! QO  
1-5.闸门式真空系统vacuum system with an air-lock: [3":7bB 'E  
1-6.压差真空系统differentially pumped vacuum system: JvFU7`4@  
1-7.进气系统gas admittance system: (bP\_F5D  
4BSSJ@z  
2.真空系统特性参量 v&CKtk!3{  
2-1.抽气装置的抽速volume flow rate of a pumping unit : <&&xt ?I.  
2-2.抽气装置的抽气量throughput of a pumping unit : K>H_q@-?f  
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: Epm'u[wV  
2-4.真空系统的漏气速率leak throughput of a vacuum system: (+g!~MP  
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: n ETm"  
2-6.极限压力ultimate pressure: T""y)%  
2-7.残余压力residual pressure: i2<dn)K[~-  
2-8.残余气体谱residual gas spectrum: ^%|(dMo4  
2-9.基础压力base pressure: E3N4(V\*  
2-10.工作压力working pressure: <fY<.X  
2-11.粗抽时间roughing time: ebF},Q(48  
2-12.抽气时间pump-down time: wg?:jK  
2-13.真空系统时间常数time constant of a vacuum system: 1zE_ SNx  
2-14.真空系统进气时间venting time: 8.vPh  
mUi|vq)`=D  
3.真空容器 VK9I#   
3-1.真空容器;真空室vacuum chamber: w+vYD2 a  
3-2.封离真空装置sealed vacuum device: G $u:1&   
3-3.真空钟罩vacuum bell jar: XK:KWqW  
3-4.真空容器底板vacuum base plate: h%kB>E~  
3-5.真空岐管vacuum manifold: l\8 l.xP  
3-6.前级真空容器(贮气罐)backing reservoir: h#bpog  
3-7.真空保护层outer chamber: IQK__)  
3-8.真空闸室vacuum air lock: B8'(3&)My  
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: #mqz*=L3  
)F;[  
4.真空封接和真空引入线 eW*nRha  
4-1.永久性真空封接permanent seal : JnX@eBNV  
4.2.玻璃分级过渡封接graded seal : MS Ui_|7  
4-3.压缩玻璃金属封接compression glass-to-metal seal: ?5m[Qc (<  
4-4.匹配式玻璃金属封接matched glass-to-metal seal: BaIh,iu  
4-5.陶瓷金属封接ceramic-to-metal seal: z41 p $  
4-6.半永久性真空封接semi-permanent seal : _\ n'uW$  
4-7.可拆卸的真空封接demountable joint: :SSlUl4sU$  
4-8.液体真空封接liquid seal ;8sEE?C$g  
4-9.熔融金属真空封接molten metal seal: 5Am*1S^  
4-10.研磨面搭接封接ground and lapped seal: }#@P+T:b  
4-11.真空法兰连接vacuum flange connection: ff"Cl p  
4-12.真空密封垫vacuum-tight gasket: F' ZLN]"{  
4-13.真空密封圈ring gasket: 6 USet`#  
4-14.真空平密封垫flat gasket: Z2 B59,I  
4-15.真空引入线feedthrough leadthrough: (mHFyEG  
4-16.真空轴密封shaft seal: B\bIMjXV  
4-17.真空窗vacuum window: /IVw}:G  
4-18.观察窗viewing window: rS9*_-NH  
6YT*=\KT  
5.真空阀门 %V;k/w~[  
5-1.真空阀门的特性characteristic of vacuum valves: Qwx}e\=  
⑴.真空阀门的流导conductance of vacuum valves: %@(6,^3%i  
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: ;B`e;B?1Q  
5-2.真空调节阀regulating valve: \@4QG.3&  
5-3.微调阀 micro-adjustable valve: C78d29  
5-4.充气阀charge valve: e*vSGT$KgL  
5-5.进气阀gas admittance valve: Db yy H_  
5-6.真空截止阀break valve: =_cWCl^5  
5-7.前级真空阀backing valve: pCf-W/v  
5-8.旁通阀 by-pass valve: D8W:mAGEu  
5-9.主真空阀main vacuum valve: y)U8\  
5-10.低真空阀low vacuum valve: -GP+e`d  
5-11.高真空阀high vacuum valve: |6\ ?"#  
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: DC*|tHl  
5-13.手动阀manually operated valve: ]8YHA}P  
5-14.气动阀pneumatically operated valve: ' 7>}I{Lq  
5-15.电磁阀electromagnetically operated valve: oTOe(5N8a  
5-16.电动阀valve with electrically motorized operation: `Pl=%DR  
5-17.挡板阀baffle valve: >C_! }~  
5-18.翻板阀flap valve: =KT7ZSTV  
5-19.插板阀gate valve: oB3>0Pm*a.  
5-20.蝶阀butterfly valve: -$WiB  
k` (_~/#  
6.真空管路 l%B1JGu*F  
6-1.粗抽管路roughing line: & A9psc(,&  
6-2.前级真空管路backing line: @R}L 4  
6-3.旁通管路;By-Pass管路 by-pass line: z!Jce}mx  
6-4.抽气封口接头pumping stem: OAw/  
6-5.真空限流件limiting conductance:       "_'9KBd!  
6-6.过滤器filter: _* 4 <  
5.   1.一般术语 9 J5Z'd_  
1-1真空镀膜vacuum coating: 1Sz5&jz  
1-2基片substrate: N!RyncJ  
1-3试验基片testing substrate: 40%p lNPj  
1-4镀膜材料coating material: */\dH<  
1-5蒸发材料evaporation material: D (qT$#  
1-6溅射材料sputtering material: :CHCVoh@95  
1-7膜层材料(膜层材质)film material: [W{`L_"  
1-8蒸发速率evaporation rate: lu-VBVwR  
1-9溅射速率sputtering rate: [Z Ea3/  
1-10沉积速率deposition rate: ,\}V.:THF  
1-11镀膜角度coating angle: H3OH  
$BH0W{S  
2.工艺 `p1`Sxz?  
2-1真空蒸膜vacuum evaporation coating: #C%<g:F8  
(1).同时蒸发simultaneous evaporation: oL }FD !}  
(2).蒸发场蒸发evaporation field evaporation: =K8`[iH  
(3).反应性真空蒸发reactive vacuum evaporation: '{( n1es  
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: [+GQ3Z\  
(5).直接加热的蒸发direct heating evaporation: aeUm,'Y$  
(6).感应加热蒸发induced heating evaporation: NX)7g}S  
(7).电子束蒸发electron beam evaporation: 9M01}  
(8).激光束蒸发laser beam evaporation: Gq-U}r  
(9).间接加热的蒸发indirect heating evaporation: 9lTA/-  
(10).闪蒸flash evaportion: ~sSB.g  
2-2真空溅射vacuum sputtering: jIdhmd* $z  
(1).反应性真空溅射 reactive vacuum sputtering: B0Z*YsbXL  
(2).偏压溅射bias sputtering: UQW;!8J#R(  
(3).直流二级溅射direct current diode sputtering: !2&h=;i~V  
(4).非对称性交流溅射asymmtric alternate current sputtering: I8^z\ef&  
(5).高频二极溅射high frequency diode sputtering: *QLl jGe  
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: #On1Q:d  
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: fngZ0k!  
(8).离子束溅射ion beam sputtering: $a5K  
(9).辉光放电清洗glow discharge cleaning: ~q|^z[7  
2-3物理气相沉积PVD physical vapor deposition: 8CEy#%7]}  
2-4化学气相沉积CVD chemical vapor deposition: cW&OVNj  
2-5磁控溅射magnetron sputtering: 3v0)oK  
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: uF(- h~  
2-7空心阴极离子镀HCD hollow cathode discharge deposition: yDd&*;9%Qg  
2-8电弧离子镀arc discharge deposition: |Q:`:ODy`5  
1YnDho;~  
3.专用部件 O4$: xjs  
3-1镀膜室coating chamber: ^O892-R  
3-2蒸发器装置evaporator device: Zqam Iq  
3-3蒸发器evaporator: _TX.}167;-  
3-4直接加热式蒸发器evaporator by direct heat: VCc4nn#  
3-5间接加热式蒸发器evaporator by indirect heat: UhEJznfi  
3-7溅射装置sputtering device: PS=crU@"H  
3-8靶target: * 5P/&*c|  
3-10时控挡板timing shutter: SH}O?d\Q:  
3-11掩膜mask: .+[[m$J  
3-12基片支架substrate holder: Lwv9oa|  
3-13夹紧装置clamp: L YH9P-5H  
3-14换向装置reversing device: * rs_k/2(  
3-15基片加热装置substrate heating device: {I2jLc  
3-16基片冷却装置substrate colding device: QT-rb~  
)0d3sJ8  
4.真空镀膜设备 Uw)K [T  
4-1真空镀膜设备vacuum coating plant: n!tCz<v  
(1).真空蒸发镀膜设备vacuum evaporation coating plant: $rjv4e}7  
(2).真空溅射镀膜设备vacuum sputtering coating plant: bt j\v[D  
4-2连续镀膜设备continuous coating plant: }:hdAZ+z  
4-3半连续镀膜设备semi- continuous coating plant +JQN=nTA  
6.   1.漏孔 ^Y'>3o21f  
1-1漏孔leaks: O>k.sO <  
1-2通道漏孔channel leak: 1y?TyUP  
1-3薄膜漏孔membrane leak: 3d,|26I7f  
1-4分子漏孔molecular leak: Pel3e ~?t  
1-5粘滞漏孔vixcous leak: j f^fj-  
1-6校准漏孔calibrated leak: oEi +S)_  
1-7标准漏孔reference leak : Bq$bxuhV  
1-8虚漏virtual leak: +F0M?,  
1-9漏率leak rate: wL%>  
1-10标准空气漏率standard air leak rate: v1)jZ.:  
1-11等值标准空气漏率equivalent standard air leak rate: Fir7z nRW  
1-12探索(示漏)气体: 6xj&Qo  
v=X\@27= ?  
2.本底 8Ipyr%l  
2-1本底background: 52%.^/  
2-2探索气体本底search gas background : (nV/-#*  
2-3漂移drift: dB1bf2'b#  
2-4噪声noise: 'vCFT(C-  
b1s1;8Q  
3.检漏仪 rP>5OLP  
3-1检漏仪leak detector: *np%67=jO  
3-2高频火花检漏仪H.F. spark leak detector: ?.~@lE  
3-3卤素检漏仪halide leak detector: nq$^}L3&~  
3-4氦质谱检漏仪helium mass spectrometer leak detector: #U6Wv1H{Lp  
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: AalyEn&>  
%_/_klxnO  
4.检漏 $T*kpUXH}  
4-1气泡检漏leak detection by bubbles: X#Hs{J~@p  
4-2氨检漏leak detection by ammonia: $%!]tNGS  
4-3升压检漏leak detection of rise pressure: \s)j0F)  
4-4放射性同位素检漏radioactive isotope leak detection: U :IQWlC  
4-5荧光检漏fluorescence leak detection Xt$?Kx_,  
7.   1.一般术语 HF0J>Clq  
1-1真空干燥vacuum drying: 8~4{e,} ,  
1-2冷冻干燥freeze drying : W;hI[9  
1-3物料material: 6t@3 a?  
1-4待干燥物料material to be dried: &{7%Vs TB  
1-5干燥物料dried material : ^srx/6X  
1-6湿气moisture;humidity: "\e9Y<  
1-7自由湿气free moisture: 3 i>uKU1  
1-8结合湿气bound moisture: CaK 0o*D  
1-9分湿气partial moisture: R2r0'Yx  
1-10含湿量moisture content: 'jfI1 ]q  
1-11初始含湿量initial moisture content: -1U]@s  
1-12最终含湿量final residual moisture: /dtFB5Z"w  
1-13湿度degree of moisture ,degree of humidity : .+ _x|?'  
1-14干燥物质dry matter : :x16N|z  
1-15干燥物质含量content of dry matter: =o9 %)  
1k;X*r#  
2.干燥工艺 =G*<WcR  
2-1干燥阶段stages of drying : WJ/&Ag1  
(1).预干燥preliminary dry: ?_ p3^kl  
(2).一次干燥(广义)primary drying(in general): G0<m3 Up  
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): cp]\<p('A  
(4).二次干燥secondary drying: V<(cW'zA/  
2-2.(1).接触干燥contact drying: rw58bkh6  
(2).辐射干燥 drying by radiation : :5p`H  
(3).微波干燥microwave drying: RD,` D!  
(4).气相干燥vapor phase drying: wl}Q|4rZ  
(5).静态干燥static drying:  X&(1DE  
(6).动态干燥dynamic drying: \ocJJc9  
2-3干燥时间drying time: ~|+   
2-4停留时间length of stay(in the drying chamber): d)9=hp;,V  
2-5循环时间cycle time: `43E-'g  
2-6干燥率 dessication ratio : z,$^|'pP  
2-7去湿速率mass flow rate of humidity: &(irri_  
2-8单位面积去湿速率mass flow rate of humidity per surface area: Lw2EA 5  
2-9干燥速度 drying speed : = q;ACW,z  
2-10干燥过程drying process: _?mu2!X  
2-11加热温度heating temperature: v-g2k_ o|  
2-12干燥温度temperature of the material being dried : _18) XR  
2-13干燥损失loss of material during the drying process : o5A@U0c_  
2-14飞尘lift off (particles): | [P!9e  
2-15堆层厚度thickness of the material: /_>S0  
}zj_Pp  
3.冷冻干燥 Un@dWf6'  
3-1冷冻freezing: arRb q!mO  
(1).静态冷冻static freezing: REc69Y.k  
(2).动态冷冻dynamic freezing: AvH^9zEE(  
(3).离心冷冻centrifugal freezing: =5',obYN>c  
(4).滚动冷冻shell freezing: UJ n3sZ<}  
(5).旋转冷冻spin-freezing: ;MR8E9  
(6).真空旋转冷冻vacuum spin-freezing: =J<3B H^m  
(7).喷雾冷冻spray freezing: <Y9e n!3\  
(8).气流冷冻air blast freezing: 2w+w'Ag_R  
3-2冷冻速率rate of freezing: UM3}7|  
3-3冷冻物料frozen material: ?7*.S Lt  
3-4冰核ice core: k_/*> lIZY  
3-5干燥物料外壳envelope of dried matter: PsaKzAg?  
3-6升华表面sublimation front: RGf&KV/  
3-7融化位置freezer burn: cY0NQKUk~  
3c}@_Yn  
4.真空干燥设备;真空冷冻干燥设备 o7;lR?  
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: GO2mccIB  
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: 58V`I5_  
4-3加热表面heating surface: Kejp7 okb  
4-4物品装载面shelf : QVJq%P  
4-5干燥器的处理能力throughput (of the vacuum drying chamber): .J"QW~g^  
4-6单位面积干燥器处理能力throughput per shelf area: TD!--l*gL  
4-7冰冷凝器ice condenser: i}[cq_wJ  
4-8冰冷凝器的负载load of the ice condenser: gNUYHNzDM(  
4-9冰冷凝器的额定负载rated load of the ice condenser 8BE] A_X  
8.   1.一般术语 k#liYw I  
1-1试样sample :  k{d]  
(1).表面层surface layer: .o8Sy2PaV  
(2).真实表面true surface: E2K{9@i  
(3).有效表面积effective surface area: m Q4(<,F  
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: %<8`(Uu5  
(5).表面粒子密度surface particle density: !K*(# [  
(6).单分子层monolayer: hK+6S3-E z  
(7).表面单分子层粒子密度monolayer density: 70Jx[3vr  
(8).覆盖系数coverage ratio: oq${}n<  
1-2激发excitation: @ <(4J   
(1).一次粒子primary particle: %e^GfZ  
(2).一次粒子通量primary particle flux: V^Y'!w\LGI  
(3).一次粒子通量密度density of primary particle flux: /s*.:cdH  
(4).一次粒子负荷primary particle load: u}3D'h  
(5).一次粒子积分负荷integral load of primary particle: *IX<&u#  
(6).一次粒子的入射能量energy of the incident primary particle: _NefzZWUJ  
(7).激发体积excited volume: 17$'r^t,S  
(8).激发面积excited area: O,6Wdw3+-3  
(9).激发深度excited death: @@JyCUd  
(10).二次粒子secondary particles: ^G|* =~_  
(11).二次粒子通量secondary particle flux: dq,j?~ _}  
(12).二次粒子发射能energy of the emitted secondary particles: UodBK7y  
(13).发射体积emitting volume: {Y-~7@  
(14).发射面积emitting area: @`$'sU  
(15).发射深度emitting depth: E75/EQ5p]p  
(16).信息深度information depth: 0vETg'r  
(17).平均信息深度mean information depth: =PU($  
1-3入射角angle of incidence: J 2<kOXXJ9  
1-4发射角angle of emission: !iO2yp  
1-5观测角observation: n{u\t+f  
1-6分析表面积analyzed surface area: w 5 yOSz  
1-7产额 yield : L!>nl4O>`  
1-8表面层微小损伤分析minimum damage surface analysis: '2GnAws^  
1-9表面层无损伤分析non-destructive surface analysis: _j+!Fd  
1-10断面深度分析 profile analysis in depth; depth profile analysis : !O,Sq/=.  
1-11可观测面积observable area: U% q-#^A  
1-12可观测立体角observable solid angle : p^CTHk_|  
1-13接受立体角;观测立体角angle of acceptance: WQ{[q" O  
1-14角分辨能力angular resolving power: z',Fa4@z  
1-15发光度luminosity: v3#,Z!  
1-16二次粒子探测比detection ratio of secondary particles: oNZ_7tU  
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: c/Xg ARCO  
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: [Ur\^wS  
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: u\V^g   
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: I)tiXcJw  
1-21本底压力base pressure: W:,Wex^9n  
1-22工作压力working pressure: -Arsmo  
h);^4cU  
2.分析方法 2]1u0-M5L  
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: ;-6-DEL  
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : u<Y#J,p`e  
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: h Ta(^  
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: R*:>h8  
2-3离子散射表面分析ion scattering spectroscopy: Hs*["zFc  
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: 3V<@ Vkf5  
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: ];Z6=9n  
2-6离子散射谱仪ion scattering spectrometer: d{"-iw)t  
2-7俄歇效应Auger process: =A.$~9P  
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: q pCI [[  
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: odCt6Du  
2-10光电子谱术photoelectron spectroscopy : ^cm ] [9  
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: z@yTkH_  
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: )P$|9<_q7x  
2-11光电子谱仪photoelectron spectrometer: TWzLJ63*  
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: U}LW8886  
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: I|U'@E  
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): OvtE)u l@  
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus
zuiyuan 2007-03-13 15:13
太好了啊,多谢了啊
zhy980730 2007-03-14 11:39
多谢,了解点.
flyinlove79 2007-03-15 17:43
不错,多谢楼主分享资料 [s:4]
飞花无心 2007-03-26 09:33
很好,谢谢楼主啊
wottlin100 2007-04-02 09:19
呵呵,楼主辛苦啦!如果有定义解释更好!
xingmeng1227 2011-10-29 12:40
呵呵,楼主辛苦啦!
zh9607109 2011-11-03 05:41
呵呵,楼主辛苦啦!
wym87 2011-11-13 23:18
谢谢楼主的分享!Thanks!
douyongming 2012-06-17 17:03
太好了啊,多谢了啊
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