首页 -> 登录 -> 注册 -> 回复主题 -> 发表主题
光行天下 -> 光学薄膜设计,工艺与设备 -> 真空术语全集 [点此返回论坛查看本帖完整版本] [打印本页]

cswmsc 2007-02-28 23:18

真空术语全集

“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 :]]#X ~J  
--------------------------------------------------- :xwyE(w  
真空术语 q%&JAX=  
u_31Db<  
1.标准环境条件 standard ambient condition: ' 5tk0A  
2.气体的标准状态 standard reference conditions forgases: ZH<: g6  
3.压力(压强)p pressure: e97Ll=>  
4.帕斯卡Pa pascal: *m$lAWB5D  
5.托Torr torr: dC,a~`%O  
6.标准大气压atm standard atmosphere: T- ~l2u|s  
7.毫巴mbar millibar: Yf&P|Iiw  
8.分压力 partial pressure: gdr"34%vbM  
9.全压力 total pressure: $f>h_8cla  
10.真空 vacuum: 4{zz-4=  
11.真空度 degree of vacuum: cJ^{iOQ+  
12.真空区域 ranges of vacuum: I j w{g%  
13.气体 gas: zv.R~lMtY  
14.非可凝气体 non-condensable gas: *h([ai"1-  
15.蒸汽vapor: mc FSWmq  
16.饱和蒸汽压saturation vapor pressure: ^mp#7OL  
17.饱和度degree of saturation: B r`a;y T  
18.饱和蒸汽saturated vapor: Z.QgL=  
19.未饱和蒸汽unsaturated vapor: 2oBT _o%/J  
20.分子数密度n,m-3 number density of molecules: Z(h.)$yH*=  
21.平均自由程ι、λ,m mean free path: qp##>c31X  
22.碰撞率ψ collision rate: _ZMAlC*$G  
23.体积碰撞率χ volume collision rate: L|hoA9/]  
24.气体量G quantity of gas: %:S4OT8]  
25.气体的扩散 diffusion of gas: .m gm1zz  
26.扩散系数D diffusion coefficient; diffusivity: k.5(d.*(  
27.粘滞流 viscous flow: -|.Izgc  
28.粘滞系数η viscous factor: WgTD O3  
29.泊肖叶流 poiseuille flow: MJ?fMR@  
30.中间流 intermediate flow: Z~S%|{&Br  
31.分子流 molecular flow: a]S0|\BkN  
32克努曾数 number of knudsen: :z-UnC||j  
33.分子泻流 molecular effusion; effusive flow: aTWCX${~b  
34.流逸 transpiration: '73g~T%$^*  
35.热流逸 thermal transpiration: >))f;$D=  
36.分子流率qN molecular flow rate; molecular flux: =tS#t+2S  
37.分子流率密度 molecular flow rate density; density of molecular flux: :HiAjaA1pg  
38.质量流率qm mass flow rare: QKB*N)%6  
39.流量qG throughput of gas: % S vfY{  
40.体积流率qV volume flow rate: iZ( U]  
41.摩尔流率qυ molar flow rate: -s6k't  
42.麦克斯韦速度分布 maxwellian velocity distribution: _TbQjE&6  
43.传输几率Pc transmission probability: UE\Z] t!  
44.分子流导CN,UN molecular conductance: w\}@+w3b~  
45.流导C,U conductance: m%s&$  
46.固有流导Ci,Ui intrinsic conductance: WeiDg,]e$b  
47.流阻W resistance: &02I-lD4+  
48.吸附 sorption: b0| ;v-v  
49.表面吸附 adsorption: ^0tO2$  
50.物理吸附physisorption: 7TU(~]Z  
51.化学吸附 chemisorption: \?_M_5Nb  
52.吸收absorption: e0z(l/UB  
53.适应系数α accommodation factor: [:BD9V  
54.入射率υ impingement rate: *ufVZzP(  
55.凝结率condensation rate: b2r]>*Vc  
56.粘着率 sticking rate: UTS.o#d  
57.粘着几率Ps sticking probability: Jk=_8Xvr`  
58.滞留时间τ residence time: h1 npaD!  
59.迁移 migration: 4 \Ig<C9  
60.解吸 desorption: t6C2DHh7$  
61.去气 degassing: uvMc B9  
62.放气 outgassing: kMx^L;:n  
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: o|V`/sW{  
64.蒸发率 evaporation rate: :9~LYJ ?  
65.渗透 permeation:  DJJd_  
66.渗透率φ permeability: 1@:BUE;jZ  
67.渗透系数P permeability coefficient ss0`9:z  
2.   1.真空泵 vacuum pumps g-LMct8$  
1-1.容积真空泵 positive displacement pump: Liv.i;-qE  
⑴.气镇真空泵 gas ballast vacuum pump: E=# O|[=  
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: w!|jL $5L  
⑶.干封真空泵 dry-sealed vacuum pump: Y/<`C  
⑷.往复真空泵 piston vacuum pump: BqtUL_jm  
⑸.液环真空泵 liquid ring vacuum pump: (jp!q ,)  
⑹.旋片真空泵 sliding vane rotary vacuum pump: ^JM O POm  
⑺.定片真空泵 rotary piston vacuum pump: wLa8&E[  
⑻.滑阀真空泵 rotary plunger vacuum pump: }h+{>{2j  
⑼.余摆线真空泵 trochoidal vacuum pump: q@&6&cd  
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: Dq[Z0"8  
⑾.罗茨真空泵 roots vacuum pump: ^61;0   
1-2.动量传输泵 kinetic vacuum pump: ?1.W F}X'  
⑴.牵引分子泵molecular drag pump: q}|_]R_y  
⑵.涡轮分子泵turbo molecular pump: 5ktFL<^5T  
⑶.喷射真空泵ejector vacuum pump: q|ZzGEj:OV  
⑷.液体喷射真空泵liquid jet vacuum pump: :|a$[g5  
⑸.气体喷射真空泵gas jet vacuum pump: 2DNB?,uP,'  
⑹.蒸汽喷射真空泵vapor jet vacuum pump : M(U<H;Csk  
⑺.扩散泵diffusion pump : @j<Q2z^  
⑻.自净化扩散泵self purifying diffusion pump: QAzwNXE+  
⑼.分馏扩散泵 fractionating diffusion pump : VOSq%hB  
⑽.扩散喷射泵diffusion ejector pump : E_ D0Nm%n  
⑾.离子传输泵ion transfer pump: 8J)Kn4jq  
1-3.捕集真空泵 entrapment vacuum pump: b6NGhkr'\  
⑴吸附泵adsorption pump: A~X| vW  
⑵.吸气剂泵 getter pump: eb>jT:  
⑶.升华(蒸发)泵 sublimation (evaporation)pump : Oq*;GR(Q  
⑷.吸气剂离子泵getter ion pump: 7 MS-Gs|  
⑸.蒸发离子泵 evaporation ion pump: b5)a6qtb  
⑹.溅射离子泵sputter ion pump: A5E^1j}h@  
⑺.低温泵cryopump: tx7B?/5D  
f=A`{ 8^  
2.真空泵零部件 L/?jtF:o  
2-1.泵壳 pump case: x~QZVL=:  
2-2.入口 inlet: k&9[}a*  
2-3.出口outlet: |Ae7wXOs  
2-4.旋片(滑片、滑阀)vane; blade : &LYH >  
2-5.排气阀discharge valve: WH_ W:  
2-6.气镇阀gas ballast valve:  ]&OI.p  
2-7.膨胀室expansion chamber: ` >loleI  
2-8.压缩室compression chamber: FQ>y2n=<d  
2-9.真空泵油 vacuum pump oil: n s#v?D9NF  
2-10.泵液 pump fluid: Y|6gg  
2-11.喷嘴 nozzle: qVW3oj<2  
2-13.喷嘴扩张率nozzle expansion rate: ws<p BC,m  
2-14.喷嘴间隙面积 nozzle clearance area : VG_xNM  
2-15.喷嘴间隙nozzle clearance: 4_-L1WH  
2-16.射流jet: q"i]&dMr  
2-17.扩散器diffuser: {>Hn:jW<.  
2-18.扩散器喉部diffuser thoat: O%f{\Fr  
2-19.蒸汽导管vapor tube(pipe;chimney): a@ ^)?cH!z  
2-20.喷嘴组件nozzle assembly: !0_/=mA^  
2-21.下裙skirt: sI MN""@Y^  
:_|Xr'n`A  
3.附件 $DdC|gMK  
3-1阱trap: _jb&=f8  
⑴.冷阱 cold trap: -/:!AxIH  
⑵.吸附阱sorption trap: Y;"jsK{$  
⑶.离子阱ion trap: 2UG>(R:  
⑷.冷冻升华阱 cryosublimation trap: d;nk>6<|  
3-2.挡板baffle: 3^iVDbAW{  
3-3.油分离器oil separator: CfT(a!;Eox  
3-4.油净化器oil purifier: - "EPU]q  
3-5.冷凝器condenser: 9iV9q]($0  
DzIV5FG  
4.泵按工作分类 |]~],  
4-1.主泵main pump: oB(9{6@N  
4-2.粗抽泵roughing vacuum pump: .kTOG'K\e  
4-3.前级真空泵backing vacuum pump: 7x]q>Y8T  
4-4.粗(低)真空泵 roughing(low)vacuum pump: 1vYa&!  
4-5.维持真空泵holding vacuum pump: ,$ Cr9R&/  
4-6.高真空泵high vacuum pump: y@SI)&D  
4-7.超高真空泵ultra-high vacuum pump: b7y#uL1AE  
4-8.增压真空泵booster vacuum pump: N2 t`  
0p+3 6g  
5.真空泵特性 xiV!\Z}  
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: 2FY]o~@  
5-2.真空泵的抽气量Q throughput of vacuum pump:。 p +nh]  
5-3.起动压力starting pressure: +6x}yc:yd  
5-4.前级压力 backing pressure : G#~U\QlG-  
5-5.临界前级压力 critical backing pressure: $b[Ha{9(v  
5-6.最大前级压力maximum backing pressure: uPC(|U%  
5-7.最大工作压力maximum working pressure: 5j v*C]z  
5-8.真空泵的极限压力ultimate pressure of a pump: `(/xj{"Fr}  
5-9.压缩比compression ratio: RXo6y(^  
5-10.何氏系数Ho coefficient: uqD|j:~ =k  
5-11.抽速系数speed factor: j`+{FCB7  
5-12.气体的反扩散back-diffusion of gas: lavy?tFer  
5-13.泵液返流back-streaming of pump fluid: E:-~SH}  
5-14.返流率back-streaming rate P4LiU2C  
5-15.返迁移back-migration: /([a%,DI  
5-16.爆腾bumping: ?M^qSo=/~  
5-17.水蒸气允许量qm water vapor tolerable load: fCZ"0P3(  
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: ~~O4!|t  
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: h/2@4XKj  
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump ,M:[GuXD<  
3.   1.一般术语 I%($,kd}s  
1-1.压力计pressure gauge: 1!yd(p=cL  
1-2.真空计vacuum gauge: aPRMpY-YC3  
⑴.规头(规管)gauge head: i(ZzE  
⑵.裸规nude gauge : KEdqA/F>  
⑶.真空计控制单元gauge control unit :  vY"I  
⑷.真空计指示单元gauge indicating unit : \qTp#sF  
4TyzD%pOw  
2.真空计一般分类 138v{Z  
2-1.压差式真空计differential vacuum gauge: ?]aVRmL  
2-2.绝对真空计 absolute vacuum gauge: \T!,Z;zK  
2-3.全压真空计total pressure vacuum gauge: `[e0_g\  
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: zl|+YjR  
2-5.相对真空计relative vacuum gauge : J@QOF+&  
-d thY(8  
3.真空计特性 &gr  T@  
3-1.真空计测量范围pressure range of vacuum gauge: S(^YTb7  
3-2.灵敏度系数sensitivity coefficient: N<<O(r  
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): !? H:?  
3-5.规管光电流photon current of vacuum gauge head: R+!oPWfb  
3-6.等效氮压力equivalent nitrogen pressure : 5s;@;V  
3-7.X射线极限值 X-ray limit: 45x4JG  
3-8.逆X射线效应anti X-ray effect: CEBu[TT/9  
3-9.布利尔斯效应blears effect: w `+.F;}s  
Ups0Xg&{  
4.全压真空计 F/,6Jh  
4-1.液位压力计liquid level manometer: $5\!ws<cZ  
4-2.弹性元件真空计elastic element vacuum gauge: xAO\'#m  
4-3.压缩式真空计compression gauge: }@/Ox  
4-4.压力天平pressure balance: `t44.=%  
4-5.粘滞性真空计viscosity gauge : \Ui8gDJ8y5  
4-6.热传导真空计thermal conductivity vacuum gauge : 1]Cb i7  
4-7.热分子真空计thermo-molecular gauge: .Wr7*J[V.  
4-8.电离真空计ionization vacuum gauge: 9P,[MZ  
4-9.放射性电离真空计radioactive ionization gauge: xA<-'8ST  
4-10.冷阴极电离真空计cold cathode ionization gauge: ,% 'r:@'  
4-11.潘宁真空计penning gauge: %%I:L~c  
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: {<a)+S.6U  
4-13.放电管指示器discharge tube indicator: 4=`1C-v?q  
4-14.热阴极电离真空计hot cathode ionization gauge: &y7=tEV  
4-15.三极管式真空计triode gauge: !I\eIV>0b  
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: Pa#Jwo  
4-17.B-A型电离真空计Bayard-Alpert gauge: i3KAJ@  
4-18.调制型电离真空计modulator gauge: E2z=U  
4-19.抑制型电离真空计suppressor gauge: y|i(~  
4-20.分离型电离真空计extractor gauge: m-a':  
4-21.弯注型电离真空计bent beam gauge: j?T>S]xOX  
4-22.弹道型电离真空计 orbitron gauge : WnU2.:  
4-23.热阴极磁控管真空计hot cathode magnetron gauge: ueg%D +u  
8G2QI4  
5.分压真空计(分压分析器) YMy**  
5-1.射频质谱仪radio frequency mass spectrometer: ^UhqV"[7k  
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: f`K#=_Kq7  
5-3.单极质谱仪momopole mass spectrometer: VC_F Cz  
5-4.双聚焦质谱仪double focusing mass spectrometer: k {vd1,HZ  
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: v-^<,|vm2f  
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: Z-pZyDz  
5-7.回旋质谱仪omegatron mass spectrometer: N})vrB;1  
5-8.飞行时间质谱仪time of flight mass spectrometer: N)a5~<fBG  
%rf6 >  
6.真空计校准 |/c-~|%  
6-1.标准真空计reference gauges: n5efHJU  
6-2.校准系统system of calibration: S6C DK:  
6-3.校准系数K calibration coefficient: k]P'D .  
6-4.压缩计法meleod gauge method: 9b&;4Yq!f  
6-5.膨胀法expansion method: keKsLrd  
6-6.流导法flow method: gNZ"Kr o6  
4.   1.真空系统vacuum system k_Sm ep  
1-1.真空机组pump system: "vkM*HP  
1-2.有油真空机组pump system used oil : I>w|80%%  
1-3.无油真空机组oil free pump system 0LP0q9S:9  
1-4.连续处理真空设备continuous treatment vacuum plant: p2fzbBt  
1-5.闸门式真空系统vacuum system with an air-lock: d_f*'M2Gv  
1-6.压差真空系统differentially pumped vacuum system: <Wj /A/  
1-7.进气系统gas admittance system: #6mw CA|  
O3d Qno  
2.真空系统特性参量 j~=<O<P  
2-1.抽气装置的抽速volume flow rate of a pumping unit : *lu*h&Y  
2-2.抽气装置的抽气量throughput of a pumping unit : 7:=(yBG  
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: +afkpvj8  
2-4.真空系统的漏气速率leak throughput of a vacuum system: 0B2f[A  
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: ACFEM9 [=  
2-6.极限压力ultimate pressure: #Aj#C>  
2-7.残余压力residual pressure: a@9W'/?igk  
2-8.残余气体谱residual gas spectrum: O-pH~E  
2-9.基础压力base pressure: R%t|R7 9I  
2-10.工作压力working pressure: \ f VX<L  
2-11.粗抽时间roughing time: ep`8LQf  
2-12.抽气时间pump-down time: ;*U&lT  
2-13.真空系统时间常数time constant of a vacuum system: teLZplC=f  
2-14.真空系统进气时间venting time: E0aFHC[  
9"/=D9o9  
3.真空容器 (JE&1 @  
3-1.真空容器;真空室vacuum chamber: MCIuP`sC|  
3-2.封离真空装置sealed vacuum device: -]YsiE?r  
3-3.真空钟罩vacuum bell jar: 1N { >00  
3-4.真空容器底板vacuum base plate: pN)>c,  
3-5.真空岐管vacuum manifold: C\;%IGn  
3-6.前级真空容器(贮气罐)backing reservoir: Nv=%R  
3-7.真空保护层outer chamber: $RHw6*COG  
3-8.真空闸室vacuum air lock: Z^J)]UL/  
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: uKJo5%>  
1gvh6eE F  
4.真空封接和真空引入线 RUut7[r  
4-1.永久性真空封接permanent seal : M:d|M|'  
4.2.玻璃分级过渡封接graded seal : 1-<?EOYaE  
4-3.压缩玻璃金属封接compression glass-to-metal seal: ;2MdvHhz1  
4-4.匹配式玻璃金属封接matched glass-to-metal seal: YluvWHWi  
4-5.陶瓷金属封接ceramic-to-metal seal: >m=XqtP  
4-6.半永久性真空封接semi-permanent seal : <~svy)Cz  
4-7.可拆卸的真空封接demountable joint: N[DKA1Ei  
4-8.液体真空封接liquid seal ymR AQVv  
4-9.熔融金属真空封接molten metal seal: _0\wyjjU  
4-10.研磨面搭接封接ground and lapped seal: &`-e; Xt  
4-11.真空法兰连接vacuum flange connection: X*bOE}  
4-12.真空密封垫vacuum-tight gasket: b"w2 2%  
4-13.真空密封圈ring gasket: !HW?/-\,O  
4-14.真空平密封垫flat gasket: e;"%h%'  
4-15.真空引入线feedthrough leadthrough: \ 9sJ`,T?  
4-16.真空轴密封shaft seal: 62[_u]<Yub  
4-17.真空窗vacuum window: EU Oa8Z  
4-18.观察窗viewing window: MQy,[y7I  
z_y@4B6>}  
5.真空阀门 +4 D#Ht 7  
5-1.真空阀门的特性characteristic of vacuum valves: K8QEHc:  
⑴.真空阀门的流导conductance of vacuum valves: O31.\ZR2  
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: 0f5)]  
5-2.真空调节阀regulating valve: C [8='i26  
5-3.微调阀 micro-adjustable valve: /de~+I5AB~  
5-4.充气阀charge valve: "Gq%^^ *  
5-5.进气阀gas admittance valve: />7G  
5-6.真空截止阀break valve: C6D Eq>v  
5-7.前级真空阀backing valve: <c [X^8   
5-8.旁通阀 by-pass valve: 0Yr-Q;O<f  
5-9.主真空阀main vacuum valve: )G#O#Yy  
5-10.低真空阀low vacuum valve: Q[aBxy (  
5-11.高真空阀high vacuum valve: G?:5L0g  
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: lXnv(3j3*s  
5-13.手动阀manually operated valve: _w%{yF6   
5-14.气动阀pneumatically operated valve: j<w5xY  
5-15.电磁阀electromagnetically operated valve: 99b"WH^3$y  
5-16.电动阀valve with electrically motorized operation: WtMDHfwqu\  
5-17.挡板阀baffle valve: WOYN% 0#  
5-18.翻板阀flap valve: 9; aOUs:<  
5-19.插板阀gate valve: ^Uik{x  
5-20.蝶阀butterfly valve: O tR  
v.Q+4 k  
6.真空管路 ;PMy9H  
6-1.粗抽管路roughing line: Y}r UVn  
6-2.前级真空管路backing line: x!?$y_t  
6-3.旁通管路;By-Pass管路 by-pass line: 88DMD"$B  
6-4.抽气封口接头pumping stem: ksAu=X:  
6-5.真空限流件limiting conductance:       ] ; B`'Ia  
6-6.过滤器filter: bp P3#~ K  
5.   1.一般术语 j[fY.>yt&  
1-1真空镀膜vacuum coating: AUr~b3< 6  
1-2基片substrate: 3rx 8"  
1-3试验基片testing substrate: <bh!wf6;  
1-4镀膜材料coating material: g6.Tx]?b$  
1-5蒸发材料evaporation material: /@LUD=  
1-6溅射材料sputtering material: "^VPe[lA  
1-7膜层材料(膜层材质)film material: h)X"<a++N  
1-8蒸发速率evaporation rate: 14h0$7  
1-9溅射速率sputtering rate: *p^*>~i9)  
1-10沉积速率deposition rate: 1@^*tffL:  
1-11镀膜角度coating angle: T2 XLP  
Tpp?(lT7r  
2.工艺 Mqmy*m[U  
2-1真空蒸膜vacuum evaporation coating: 'L veCi_  
(1).同时蒸发simultaneous evaporation: 9XN/ w p  
(2).蒸发场蒸发evaporation field evaporation: \U HI%1^  
(3).反应性真空蒸发reactive vacuum evaporation: QG;V\2T2[  
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: hoZM;wC  
(5).直接加热的蒸发direct heating evaporation: c7 O$< F  
(6).感应加热蒸发induced heating evaporation:  <+p{U(  
(7).电子束蒸发electron beam evaporation: jg(cpo d  
(8).激光束蒸发laser beam evaporation: $HFimU,V=0  
(9).间接加热的蒸发indirect heating evaporation: XchVsA  
(10).闪蒸flash evaportion: 0G #s/u#  
2-2真空溅射vacuum sputtering: +^ |=MK%  
(1).反应性真空溅射 reactive vacuum sputtering: *orP{p -U  
(2).偏压溅射bias sputtering: A04E <nr  
(3).直流二级溅射direct current diode sputtering: DG 6W ^  
(4).非对称性交流溅射asymmtric alternate current sputtering: :qK^71gz  
(5).高频二极溅射high frequency diode sputtering: w(!COu  
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: GFYHt!&[\  
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: ,V ) |A=ml  
(8).离子束溅射ion beam sputtering:  I8  
(9).辉光放电清洗glow discharge cleaning: PKX Tj6hj)  
2-3物理气相沉积PVD physical vapor deposition: C+aL8_(R  
2-4化学气相沉积CVD chemical vapor deposition: @-aMj  
2-5磁控溅射magnetron sputtering: $6*6%T5}  
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: /"7_75 t  
2-7空心阴极离子镀HCD hollow cathode discharge deposition: ~x g#6%<=  
2-8电弧离子镀arc discharge deposition: ge$p/  
k6^!G"  
3.专用部件 ,<]~/5-f  
3-1镀膜室coating chamber: .=/TT|eMS  
3-2蒸发器装置evaporator device: Ab:+AC5{  
3-3蒸发器evaporator: [Qn$i/ ` J  
3-4直接加热式蒸发器evaporator by direct heat: Ydh+iLjhx  
3-5间接加热式蒸发器evaporator by indirect heat: ECLQqjB  
3-7溅射装置sputtering device: vptBDfzz  
3-8靶target: 3KN})*1  
3-10时控挡板timing shutter: >1NE6T  
3-11掩膜mask: W=!di3IA  
3-12基片支架substrate holder: rHD_sC*  
3-13夹紧装置clamp: 2D ' $  
3-14换向装置reversing device: 'zfj`aqc  
3-15基片加热装置substrate heating device: U$wD'v3pw  
3-16基片冷却装置substrate colding device: 0yBiio  
;Zw? tU  
4.真空镀膜设备 asKAHVT(  
4-1真空镀膜设备vacuum coating plant: "D7wtpJ  
(1).真空蒸发镀膜设备vacuum evaporation coating plant: ;;7: l,vy  
(2).真空溅射镀膜设备vacuum sputtering coating plant: Q <2 `ek  
4-2连续镀膜设备continuous coating plant: EOzw&M];r  
4-3半连续镀膜设备semi- continuous coating plant 6"u"B-cz  
6.   1.漏孔 C0 o  
1-1漏孔leaks: N:&EFfg3  
1-2通道漏孔channel leak: L3'$"L.|u  
1-3薄膜漏孔membrane leak: ?j@(1",=&  
1-4分子漏孔molecular leak: w ;xbQZ|+  
1-5粘滞漏孔vixcous leak: @ACq:+/Q c  
1-6校准漏孔calibrated leak: ,w$:=;i  
1-7标准漏孔reference leak : q?bKh*48  
1-8虚漏virtual leak: V D.T=(  
1-9漏率leak rate: N7mYE  
1-10标准空气漏率standard air leak rate: D;+sStZK3  
1-11等值标准空气漏率equivalent standard air leak rate: %O\zYtQR  
1-12探索(示漏)气体: sJ5Ws%q  
(Kb_/  
2.本底 p{oc}dWin  
2-1本底background: wlw`%z-B2  
2-2探索气体本底search gas background : V~"-\@  
2-3漂移drift: O("13cU  
2-4噪声noise: %>!$ eCX  
4-JyK%m,0  
3.检漏仪 @"O|[%7e  
3-1检漏仪leak detector: JNxrs~}  
3-2高频火花检漏仪H.F. spark leak detector: Qk] ^]I  
3-3卤素检漏仪halide leak detector: g& ?{^4t]  
3-4氦质谱检漏仪helium mass spectrometer leak detector: eR>|1s%^  
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: ND\M  
F6gU9=F1<  
4.检漏 vMeB2r<  
4-1气泡检漏leak detection by bubbles: }5]7lGR  
4-2氨检漏leak detection by ammonia:  r74' _y  
4-3升压检漏leak detection of rise pressure: *dPG[ }  
4-4放射性同位素检漏radioactive isotope leak detection: J)._&O$  
4-5荧光检漏fluorescence leak detection b&2 N7%  
7.   1.一般术语 8\Kpc;zb  
1-1真空干燥vacuum drying: KK, t!a  
1-2冷冻干燥freeze drying : );=0cnr3  
1-3物料material: ,U?^u%  
1-4待干燥物料material to be dried: ~UQX t r  
1-5干燥物料dried material : *IWWD\U  
1-6湿气moisture;humidity: < %{?Js  
1-7自由湿气free moisture: L-1#n  
1-8结合湿气bound moisture: A&D<}y/%  
1-9分湿气partial moisture: KuZZKh  
1-10含湿量moisture content: ?(Ytc)   
1-11初始含湿量initial moisture content: ky@ZEp=  
1-12最终含湿量final residual moisture: usR+ZQaA  
1-13湿度degree of moisture ,degree of humidity : P`AW8Y6o  
1-14干燥物质dry matter :  EHk$,bM  
1-15干燥物质含量content of dry matter: tui5?\  
W?<<al*  
2.干燥工艺 __|Y59J%  
2-1干燥阶段stages of drying : dheobD  
(1).预干燥preliminary dry: u{LtyDnik  
(2).一次干燥(广义)primary drying(in general): rr]-$]Q  
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): t 09-y  
(4).二次干燥secondary drying: N^4CA@'{  
2-2.(1).接触干燥contact drying: c'SjH".[  
(2).辐射干燥 drying by radiation : rUh2[z8:  
(3).微波干燥microwave drying: jr/IU=u*v  
(4).气相干燥vapor phase drying: U3~rtc*  
(5).静态干燥static drying: W5Vh+'3  
(6).动态干燥dynamic drying: ]DjnzClx  
2-3干燥时间drying time: @]7s`?  
2-4停留时间length of stay(in the drying chamber): 6k`O  
2-5循环时间cycle time: ^j7>Ul,  
2-6干燥率 dessication ratio : 0( q:K6zI}  
2-7去湿速率mass flow rate of humidity: ujS C  
2-8单位面积去湿速率mass flow rate of humidity per surface area: B["jndyr  
2-9干燥速度 drying speed : `t3w|%La}  
2-10干燥过程drying process: & tjL*/  
2-11加热温度heating temperature: Jk;dtLL}4  
2-12干燥温度temperature of the material being dried : =rA]kGx  
2-13干燥损失loss of material during the drying process : {LBL8sG  
2-14飞尘lift off (particles): 7n]ukqZ  
2-15堆层厚度thickness of the material: kQD~v+u{`  
@*BVS'\  
3.冷冻干燥 GD% qrK?  
3-1冷冻freezing: '0v]?mM  
(1).静态冷冻static freezing: M)3'\x :  
(2).动态冷冻dynamic freezing: zMh`Uqid  
(3).离心冷冻centrifugal freezing: U#:N/ts*(  
(4).滚动冷冻shell freezing: yVWt%o/  
(5).旋转冷冻spin-freezing: i,,mt_/,  
(6).真空旋转冷冻vacuum spin-freezing: >4bWXb'S}C  
(7).喷雾冷冻spray freezing: %k @4}M>  
(8).气流冷冻air blast freezing: JqV}$E"M2  
3-2冷冻速率rate of freezing: {01^xn.  
3-3冷冻物料frozen material: #j'7\SV  
3-4冰核ice core: Kx02 2rgDU  
3-5干燥物料外壳envelope of dried matter: }Z)YK}_1  
3-6升华表面sublimation front: .>1vN+  
3-7融化位置freezer burn: (-xVW#39  
!X`cNd)0Xo  
4.真空干燥设备;真空冷冻干燥设备 u)vS,dzu  
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: 08/Tk+  
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: ET(/h/r  
4-3加热表面heating surface: \+"Jg/)ij  
4-4物品装载面shelf : hPuF:iiQ4  
4-5干燥器的处理能力throughput (of the vacuum drying chamber): .Hg{$SAC(w  
4-6单位面积干燥器处理能力throughput per shelf area: G "ixw  
4-7冰冷凝器ice condenser: SgkW-#  
4-8冰冷凝器的负载load of the ice condenser: GJ:oUi  
4-9冰冷凝器的额定负载rated load of the ice condenser xVTl  
8.   1.一般术语 &FG0v<f5Pv  
1-1试样sample : udPLWrPF\  
(1).表面层surface layer: .  LeS-  
(2).真实表面true surface: >M^:x-mib  
(3).有效表面积effective surface area: D;z!C ys  
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: 5a4i)I6 3o  
(5).表面粒子密度surface particle density: O"1HO[  
(6).单分子层monolayer: &%tW  
(7).表面单分子层粒子密度monolayer density: 3xgU=@!;  
(8).覆盖系数coverage ratio: `5n^DP*X  
1-2激发excitation: t ?05  
(1).一次粒子primary particle: <pM6fI6BD  
(2).一次粒子通量primary particle flux: /Mj|Px%  
(3).一次粒子通量密度density of primary particle flux: :lu"14  
(4).一次粒子负荷primary particle load: 5sSAH  
(5).一次粒子积分负荷integral load of primary particle: ZCA= n  
(6).一次粒子的入射能量energy of the incident primary particle: }{mS"  
(7).激发体积excited volume: ";^_[n  
(8).激发面积excited area: ]2{]TJ @B  
(9).激发深度excited death: Mm!;+bM%  
(10).二次粒子secondary particles: 8:2Vib$  
(11).二次粒子通量secondary particle flux: I8|"h8\  
(12).二次粒子发射能energy of the emitted secondary particles: 9*XT|B  
(13).发射体积emitting volume: C3~O6<,Jh  
(14).发射面积emitting area: 9A87vs4[  
(15).发射深度emitting depth: X{:3UTBR  
(16).信息深度information depth: v=cX.^ L  
(17).平均信息深度mean information depth: kOC0d,  
1-3入射角angle of incidence: Pa"Kk9!o36  
1-4发射角angle of emission: CZ>Ujw=&k  
1-5观测角observation: u95D0S  
1-6分析表面积analyzed surface area: &q M8)2Y  
1-7产额 yield : ^1<i7u  
1-8表面层微小损伤分析minimum damage surface analysis: @z:E]O}  
1-9表面层无损伤分析non-destructive surface analysis: O\6gw$  
1-10断面深度分析 profile analysis in depth; depth profile analysis : -Ir>pY\!  
1-11可观测面积observable area: RL H!f1cta  
1-12可观测立体角observable solid angle : /FjdcH=  
1-13接受立体角;观测立体角angle of acceptance: \jZ)r>US"  
1-14角分辨能力angular resolving power: hZWkw{c  
1-15发光度luminosity: Eo6qC?5<  
1-16二次粒子探测比detection ratio of secondary particles: &he:_p$x  
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: n/e,jw  
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: X&Sah}0V&  
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: nzF2Waa-  
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: 8L]Cc!~  
1-21本底压力base pressure: 4J?\JcGs  
1-22工作压力working pressure: "'/+}xM"5  
TX7dwmt) N  
2.分析方法 tI5*0  
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: BB_(!omq[  
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : ~Q5]?ZNX  
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: hjhZ":I.  
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: ^/#8 "  
2-3离子散射表面分析ion scattering spectroscopy: 9<kMxtk$  
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: Vv+ oq5hf  
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: K3h"oVn  
2-6离子散射谱仪ion scattering spectrometer: M1T.  
2-7俄歇效应Auger process: (y1S*_D  
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: 87m`K Str7  
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: mx#)iHY  
2-10光电子谱术photoelectron spectroscopy : -BWWaL  
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: T_#8i^;D  
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: B?Rkz  
2-11光电子谱仪photoelectron spectrometer: 8iM:ok  
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: nc1?c1s,f  
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: F&B E+b/#  
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): 3+q-yP#X  
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus
zuiyuan 2007-03-13 15:13
太好了啊,多谢了啊
zhy980730 2007-03-14 11:39
多谢,了解点.
flyinlove79 2007-03-15 17:43
不错,多谢楼主分享资料 [s:4]
飞花无心 2007-03-26 09:33
很好,谢谢楼主啊
wottlin100 2007-04-02 09:19
呵呵,楼主辛苦啦!如果有定义解释更好!
xingmeng1227 2011-10-29 12:40
呵呵,楼主辛苦啦!
zh9607109 2011-11-03 05:41
呵呵,楼主辛苦啦!
wym87 2011-11-13 23:18
谢谢楼主的分享!Thanks!
douyongming 2012-06-17 17:03
太好了啊,多谢了啊
查看本帖完整版本: [-- 真空术语全集 --] [-- top --]

Copyright © 2005-2025 光行天下 蜀ICP备06003254号-1 网站统计