| cswmsc |
2007-02-28 23:18 |
真空术语全集
“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 pp`U]Q5"gX --------------------------------------------------- HXQrtJ 真空术语 !;a<E: rY= #^S 1.标准环境条件 standard ambient condition: 3Cl9,Z"&6$ 2.气体的标准状态 standard reference conditions forgases: iT"Itz-^# 3.压力(压强)p pressure: u\wd<<I'] 4.帕斯卡Pa pascal: OXB-.< 5.托Torr torr: jayoARUB 6.标准大气压atm standard atmosphere: 8IH gsW"; 7.毫巴mbar millibar: PsnU5f)` 8.分压力 partial pressure: t_dg$KB 9.全压力 total pressure: YLo$n 10.真空 vacuum: :
eFc.>KoD 11.真空度 degree of vacuum: +bnw,B>< 12.真空区域 ranges of vacuum: }"Cn kg 13.气体 gas: zJ`(LnV 14.非可凝气体 non-condensable gas: buXG32; 15.蒸汽vapor: 1%`:8 16.饱和蒸汽压saturation vapor pressure: QR'g*Bro 17.饱和度degree of saturation: QEKFuY<E+ 18.饱和蒸汽saturated vapor: Biy 9jIWI 19.未饱和蒸汽unsaturated vapor: ($W 5fbu 20.分子数密度n,m-3 number density of molecules: lz 6 Aj 21.平均自由程ι、λ,m mean free path: $ZO<8|bW 22.碰撞率ψ collision rate: &L]*]Xz; 23.体积碰撞率χ volume collision rate: }C1wfZ~F~ 24.气体量G quantity of gas: M(uB
;Te 25.气体的扩散 diffusion of gas: L#Y;a
5b 26.扩散系数D diffusion coefficient; diffusivity: 9(WC#-, 27.粘滞流 viscous flow: PEIr-qs%D 28.粘滞系数η viscous factor: !?/bK[
P, 29.泊肖叶流 poiseuille flow: *Rh .s!@4 30.中间流 intermediate flow: G |^X:+ 31.分子流 molecular flow: I "2FTGA 32克努曾数 number of knudsen: P0z{R[KBH 33.分子泻流 molecular effusion; effusive flow: fZfiiE~7J 34.流逸 transpiration: X~3P?O]kFv 35.热流逸 thermal transpiration: iGk{8Da< 36.分子流率qN molecular flow rate; molecular flux: 55b |zf 37.分子流率密度 molecular flow rate density; density of molecular flux: %
cdP* 38.质量流率qm mass flow rare: :<8V2 39.流量qG throughput of gas: #>B1$(@ 40.体积流率qV volume flow rate: #UD 41.摩尔流率qυ molar flow rate: YO0x68 42.麦克斯韦速度分布 maxwellian velocity distribution: 66^t[[ 43.传输几率Pc transmission probability: 8]\h^k4f 44.分子流导CN,UN molecular conductance: nk
9 K\I
45.流导C,U conductance: _|:bac8pL 46.固有流导Ci,Ui intrinsic conductance: 4>C=:w
47.流阻W resistance: |7x^@i9w 48.吸附 sorption: j]O[I^5 49.表面吸附 adsorption: 6CRPdLTDf 50.物理吸附physisorption: 12xP)*:$ 51.化学吸附 chemisorption: RsfTUb)< 52.吸收absorption: Ki6.'#%7 53.适应系数α accommodation factor: )#~fS28j 54.入射率υ impingement rate: _
D}b 55.凝结率condensation rate: }zxh:"#K 56.粘着率 sticking rate: {; cB?II 57.粘着几率Ps sticking probability: P.Z<b:V! 58.滞留时间τ residence time: 4(GgaQFO? 59.迁移 migration: Q8cPKDB 60.解吸 desorption: -xIhN?r) 61.去气 degassing: kQl cT"R 62.放气 outgassing: _hL4@C 63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: 6XK`=ss? 64.蒸发率 evaporation rate: rOr1H! 65.渗透 permeation: G0Tc}_o<Y 66.渗透率φ permeability: /~cL L 67.渗透系数P permeability coefficient >/kG5]zxY 2. 1.真空泵 vacuum pumps 'N ::MN 1-1.容积真空泵 positive displacement pump: c$:=d4t5$ ⑴.气镇真空泵 gas ballast vacuum pump: "gajBY ⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: ={@ @`yP^$ ⑶.干封真空泵 dry-sealed vacuum pump: qgsE7 ] ⑷.往复真空泵 piston vacuum pump: Yf)|ws?! ⑸.液环真空泵 liquid ring vacuum pump: ^-*Tn ⑹.旋片真空泵 sliding vane rotary vacuum pump: 4qXRDsbCf ⑺.定片真空泵 rotary piston vacuum pump: O[p^lr(B7 ⑻.滑阀真空泵 rotary plunger vacuum pump: ":^
NLBm>5 ⑼.余摆线真空泵 trochoidal vacuum pump: &|"I0|tJ ⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: fA0=Y,pzv ⑾.罗茨真空泵 roots vacuum pump: q.sQ Z]ty9 1-2.动量传输泵 kinetic vacuum pump: D4 ]B> ⑴.牵引分子泵molecular drag pump: ,W8Iabi^ ⑵.涡轮分子泵turbo molecular pump: y{I[}$k ⑶.喷射真空泵ejector vacuum pump: _JIUds5 ⑷.液体喷射真空泵liquid jet vacuum pump: k+r9h'd ⑸.气体喷射真空泵gas jet vacuum pump: o/9LK ⑹.蒸汽喷射真空泵vapor jet vacuum pump : 9Y@?xn.\ ⑺.扩散泵diffusion pump : ~G:2iSi(# ⑻.自净化扩散泵self purifying diffusion pump: "mK i$FV ⑼.分馏扩散泵 fractionating diffusion pump :
R{KIkv ⑽.扩散喷射泵diffusion ejector pump : \ j X N*A ⑾.离子传输泵ion transfer pump: O0(Q0Ko 1-3.捕集真空泵 entrapment vacuum pump: !"x7re ⑴吸附泵adsorption pump: \j})Kul ⑵.吸气剂泵 getter pump: #Q7x:,f ⑶.升华(蒸发)泵 sublimation (evaporation)pump : B"Kce"! ⑷.吸气剂离子泵getter ion pump: 6?.pKFBZ ⑸.蒸发离子泵 evaporation ion pump: CC(*zrOd- ⑹.溅射离子泵sputter ion pump: rbuL@=S@* ⑺.低温泵cryopump: 3?Eoj95w! :htq%gPex9 2.真空泵零部件 qM!f 2-1.泵壳 pump case: chMc(.cN0 2-2.入口 inlet: /`O]etr`d 2-3.出口outlet: i$^B- 2-4.旋片(滑片、滑阀)vane; blade : =_m9so 2-5.排气阀discharge valve: |~bR.IA 2-6.气镇阀gas ballast valve: =6:L +V 2-7.膨胀室expansion chamber: 'Ywpdzz[ 2-8.压缩室compression chamber: Z'*Z@u3 2-9.真空泵油 vacuum pump oil: hN_f h J 2-10.泵液 pump fluid: ^g-t#O lD? 2-11.喷嘴 nozzle: L}jF#*Q% 2-13.喷嘴扩张率nozzle expansion rate: 1S(\2{Ylo 2-14.喷嘴间隙面积 nozzle clearance area : <k\H`P 2-15.喷嘴间隙nozzle clearance: =1
BNCKT< 2-16.射流jet: oAZF3h]po 2-17.扩散器diffuser: #;"D)C 2-18.扩散器喉部diffuser thoat: 0+<eRR9- 2-19.蒸汽导管vapor tube(pipe;chimney): b~r{J5x@ 2-20.喷嘴组件nozzle assembly: p;u 1{ 2-21.下裙skirt: o!toO&= ey\m)6A$ 3.附件 %t`SSW7I 3-1阱trap: 8 ih;#I=q ⑴.冷阱 cold trap: f7Df %&d ⑵.吸附阱sorption trap: m
UWkb ⑶.离子阱ion trap: '-PMF~~S ⑷.冷冻升华阱 cryosublimation trap: .-KtB(t 3-2.挡板baffle: I& M36f 3-3.油分离器oil separator: phgexAq 3-4.油净化器oil purifier: M .)}e7 3-5.冷凝器condenser: *|k;a]HT &(1H!
4.泵按工作分类 ) Kc%8hBv 4-1.主泵main pump: O b8B 4-2.粗抽泵roughing vacuum pump: Cl6m$YUt 4-3.前级真空泵backing vacuum pump: @1qdd~B} 4-4.粗(低)真空泵 roughing(low)vacuum pump: .5Knb c 4-5.维持真空泵holding vacuum pump: a4T~\\,dZ> 4-6.高真空泵high vacuum pump: V@v1a@=W 4-7.超高真空泵ultra-high vacuum pump: UK6xkra?# 4-8.增压真空泵booster vacuum pump: ^}o7* &@%
b?~ 5.真空泵特性 kYxl1nv 5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: [Y$5zeA 5-2.真空泵的抽气量Q throughput of vacuum pump:。 {4:
-0itG 5-3.起动压力starting pressure: ?Ml%$z@b? 5-4.前级压力 backing pressure : }qiF^D} 5-5.临界前级压力 critical backing pressure: nw0L1TP/J 5-6.最大前级压力maximum backing pressure: 69C8-fF0[I 5-7.最大工作压力maximum working pressure: zb5N,!%r 5-8.真空泵的极限压力ultimate pressure of a pump: -]Q(~'a 5-9.压缩比compression ratio: n$XdSh/ 5-10.何氏系数Ho coefficient: WHUT/:?f 5-11.抽速系数speed factor: 0%s3Mp6H 5-12.气体的反扩散back-diffusion of gas: 3ar=1_Ar 5-13.泵液返流back-streaming of pump fluid: ?0rOcaTY 5-14.返流率back-streaming rate s) Cpi 5-15.返迁移back-migration: kDzj%sm! 5-16.爆腾bumping: OE'K5oIM 5-17.水蒸气允许量qm water vapor tolerable load: =s'XR@ 5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: e=t<H"& 5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: a-]hW=[ 5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump xfq]9< 3. 1.一般术语 )Fqy%uR8 1-1.压力计pressure gauge: 5M%,N-P^ 1-2.真空计vacuum gauge: tu\mFHvlg ⑴.规头(规管)gauge head: iOT)0@f' ⑵.裸规nude gauge : Z-)[1+Hs ⑶.真空计控制单元gauge control unit : -IBO5;2_ ⑷.真空计指示单元gauge indicating unit : UvkJ?Bu ],8;eq%W) 2.真空计一般分类 \\jIl3Z 2-1.压差式真空计differential vacuum gauge: [@m[V1D 2-2.绝对真空计 absolute vacuum gauge: Fr-[UZ~V 2-3.全压真空计total pressure vacuum gauge: J &!B|TS 2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: zKLn!b#> 2-5.相对真空计relative vacuum gauge : *FV0Vy g b -Bxf 3.真空计特性 $ye^uu;Z 3-1.真空计测量范围pressure range of vacuum gauge: : *ERRSL) 3-2.灵敏度系数sensitivity coefficient: d,W/M(S 3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): RfKc{V 3-5.规管光电流photon current of vacuum gauge head: !#q{Z>H` 3-6.等效氮压力equivalent nitrogen pressure : ~}BJ0P(VMc 3-7.X射线极限值 X-ray limit: ?>sQF4 V" 3-8.逆X射线效应anti X-ray effect: KiQ(XNx 3-9.布利尔斯效应blears effect: >):m-I 0pD
W _ 4.全压真空计 )8;{nqoC 4-1.液位压力计liquid level manometer: XE9)c
4-2.弹性元件真空计elastic element vacuum gauge: |U#DUqw 4-3.压缩式真空计compression gauge: Y2<dM/b/ 4-4.压力天平pressure balance: tWm> j 4-5.粘滞性真空计viscosity gauge : 7Yuk
4-6.热传导真空计thermal conductivity vacuum gauge : A8J8u,u9 4-7.热分子真空计thermo-molecular gauge: W9dYljnZ8i 4-8.电离真空计ionization vacuum gauge: N/K=Ygv. 4-9.放射性电离真空计radioactive ionization gauge: ~z5@V5z 4-10.冷阴极电离真空计cold cathode ionization gauge: c4\C[$ 4-11.潘宁真空计penning gauge: 34SA~5 4-12.冷阴极磁控管真空计cold cathode magnetron gauge: j")FaIM 4-13.放电管指示器discharge tube indicator: l]H0g[ 4-14.热阴极电离真空计hot cathode ionization gauge: 4IZlUJ?j+c 4-15.三极管式真空计triode gauge: AM'gnP> 4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: (^LS']ybc 4-17.B-A型电离真空计Bayard-Alpert gauge: &&WDo(r3 4-18.调制型电离真空计modulator gauge: +semfZ) 4-19.抑制型电离真空计suppressor gauge: m4@MxQm 4-20.分离型电离真空计extractor gauge: 7,*%[#-HE 4-21.弯注型电离真空计bent beam gauge: >8|+%pK8< 4-22.弹道型电离真空计 orbitron gauge : 40 2x<H 4-23.热阴极磁控管真空计hot cathode magnetron gauge: j eq: u,eZ6 5.分压真空计(分压分析器) z>G;(F2 5-1.射频质谱仪radio frequency mass spectrometer: vf<UBa;Xm 5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: fD{II+T 5-3.单极质谱仪momopole mass spectrometer: >B_n/v3P(M 5-4.双聚焦质谱仪double focusing mass spectrometer: 9x?B5Ap[ 5-5.磁偏转质谱仪magnetic deflection mass spectrometer: g`n;R 5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: Y9u;H^^G 5-7.回旋质谱仪omegatron mass spectrometer: bg}+\/78# 5-8.飞行时间质谱仪time of flight mass spectrometer: sK&,):"]R 7S<UFj 6.真空计校准 d8E,o7$m 6-1.标准真空计reference gauges: %k2FPmA6 6-2.校准系统system of calibration: cD2+hp|9 6-3.校准系数K calibration coefficient: ]dG\j^e| 6-4.压缩计法meleod gauge method: `XW*kxpm 6-5.膨胀法expansion method: f"Vgefk 6-6.流导法flow method: \0ov[T N.> 4. 1.真空系统vacuum system $w)~xE5; 1-1.真空机组pump system: mibpG9+d 1-2.有油真空机组pump system used oil : JO=1ivZl 1-3.无油真空机组oil free pump system =1Z;Ma<; 1-4.连续处理真空设备continuous treatment vacuum plant: ` H
XEZ| 1-5.闸门式真空系统vacuum system with an air-lock: 44HiTWQS?l 1-6.压差真空系统differentially pumped vacuum system: _yv Luj 1-7.进气系统gas admittance system: R{?vQsLk >.<ooWw 2.真空系统特性参量 % ucjMa>t 2-1.抽气装置的抽速volume flow rate of a pumping unit : 8:thWGLN 2-2.抽气装置的抽气量throughput of a pumping unit : ]\Xc9N8w 2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: ,PECYwegkt 2-4.真空系统的漏气速率leak throughput of a vacuum system: DI1(`y 2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: pzhl*ss"6 2-6.极限压力ultimate pressure: ;Lo&}U3F,! 2-7.残余压力residual pressure: Cqxv"NN 2-8.残余气体谱residual gas spectrum: .<#ATFmY 2-9.基础压力base pressure: Bu3T/m 2-10.工作压力working pressure: UXH"si: 2-11.粗抽时间roughing time: _U0$ =V 2-12.抽气时间pump-down time: \:v$ZEDJ> 2-13.真空系统时间常数time constant of a vacuum system: L9FHgl? 2-14.真空系统进气时间venting time: bA@P}M)X P`jL]x 3.真空容器 }T.?c9l X 3-1.真空容器;真空室vacuum chamber: A&,,9G< 3-2.封离真空装置sealed vacuum device: ;AIc?Cg 3-3.真空钟罩vacuum bell jar: {2
%aCCV 3-4.真空容器底板vacuum base plate: g%a|q~) 3-5.真空岐管vacuum manifold: PB53myDQ 3-6.前级真空容器(贮气罐)backing reservoir: @hif$ 3-7.真空保护层outer chamber: 4woO;Gm 3-8.真空闸室vacuum air lock: 3s*(uS( 3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: .Cz %:%9 eV7u*d? 4.真空封接和真空引入线 xHo&[{ 4-1.永久性真空封接permanent seal : nfdq y) 4.2.玻璃分级过渡封接graded seal : gSt`% 4-3.压缩玻璃金属封接compression glass-to-metal seal: G7@O`N8' 4-4.匹配式玻璃金属封接matched glass-to-metal seal: "i&"* ~ 4-5.陶瓷金属封接ceramic-to-metal seal: z42F,4Gk 4-6.半永久性真空封接semi-permanent seal : feX^~gM 4-7.可拆卸的真空封接demountable joint: M4m$\~zf 4-8.液体真空封接liquid seal yT8=l"-[G 4-9.熔融金属真空封接molten metal seal: PdeBDFWD 4-10.研磨面搭接封接ground and lapped seal: }
JiSmi6o 4-11.真空法兰连接vacuum flange connection: '5KeL3J; 4-12.真空密封垫vacuum-tight gasket: e]Fp=*# 4-13.真空密封圈ring gasket: q|.dez' 4-14.真空平密封垫flat gasket: f)Xr!7 4-15.真空引入线feedthrough leadthrough: ]N{0:Va@D 4-16.真空轴密封shaft seal: o0It82?RN 4-17.真空窗vacuum window: j&R+2%
4-18.观察窗viewing window: :6{`~= x@>&IBiL 5.真空阀门 kA wNly 5-1.真空阀门的特性characteristic of vacuum valves: >[10H8~bI/ ⑴.真空阀门的流导conductance of vacuum valves: MXD4|r( ⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: YDC&u8 5-2.真空调节阀regulating valve: I97yt[,Yy 5-3.微调阀 micro-adjustable valve:
#^#HuDH 5-4.充气阀charge valve: 8,"yNq 5-5.进气阀gas admittance valve: [
ho(z30k 5-6.真空截止阀break valve: ;gg\;i}^ 5-7.前级真空阀backing valve: a->3`c 5-8.旁通阀 by-pass valve: bGF7Zh9 5-9.主真空阀main vacuum valve: PU<PhuMd
5-10.低真空阀low vacuum valve: 2";SJF'5\ 5-11.高真空阀high vacuum valve: #/2$+x 5-12.超高真空阀;UHV阀 ultra-high vacuum valve: I@#;nyAj" 5-13.手动阀manually operated valve: p[AO'
xx 5-14.气动阀pneumatically operated valve: *l&S-=] 5-15.电磁阀electromagnetically operated valve: q`NXJf=sc 5-16.电动阀valve with electrically motorized operation:
D L'iS 5-17.挡板阀baffle valve: e4>"92hX 5-18.翻板阀flap valve: M<PIeKIEB 5-19.插板阀gate valve: ``VW;l{ 5-20.蝶阀butterfly valve: "es?= _PFnh)o 6.真空管路 j=?'4sF 6-1.粗抽管路roughing line: Kf tgOG
f 6-2.前级真空管路backing line: b75$?_+ 6-3.旁通管路;By-Pass管路 by-pass line: }Z-Z|G)# 6-4.抽气封口接头pumping stem: wIB`%V 6-5.真空限流件limiting conductance: 7CXW#H 6-6.过滤器filter: #>=j79~ 5. 1.一般术语 RwI[R)k 1-1真空镀膜vacuum coating: ew _-Eb 1-2基片substrate: :r#)z4d5 1-3试验基片testing substrate: B.r4$:+jb2 1-4镀膜材料coating material: BVsD(
@lX 1-5蒸发材料evaporation material: l5xCz=dw 1-6溅射材料sputtering material: j]|U 1-7膜层材料(膜层材质)film material: [u}(57DS 1-8蒸发速率evaporation rate: m%;D 1-9溅射速率sputtering rate: >MK>gLg}! 1-10沉积速率deposition rate: k3?rp`V1 1-11镀膜角度coating angle: tGA :[SP <JMcIV837 2.工艺 Wq*b~Lw 2-1真空蒸膜vacuum evaporation coating: m7EcnQf (1).同时蒸发simultaneous evaporation: -HSs^dP` (2).蒸发场蒸发evaporation field evaporation: zDhB{3-Q1{ (3).反应性真空蒸发reactive vacuum evaporation: ~x#w<0e> (4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: DejA4XdW (5).直接加热的蒸发direct heating evaporation: m,C1J%{^ (6).感应加热蒸发induced heating evaporation: \`V;z~@iA (7).电子束蒸发electron beam evaporation: 8
C [/dH (8).激光束蒸发laser beam evaporation: q9w~A-Oh`1 (9).间接加热的蒸发indirect heating evaporation: 2(5ebe[ (10).闪蒸flash evaportion: `w I /0 2-2真空溅射vacuum sputtering: _@S`5;4x (1).反应性真空溅射 reactive vacuum sputtering: m]i @ +C (2).偏压溅射bias sputtering: !EUan (3).直流二级溅射direct current diode sputtering: ARcB'z\r (4).非对称性交流溅射asymmtric alternate current sputtering: w 4[{2 (5).高频二极溅射high frequency diode sputtering: .920{G?l5 (6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: `Al;vVMRO (7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: 4_Dp+^JF (8).离子束溅射ion beam sputtering: T~QJO0 (9).辉光放电清洗glow discharge cleaning: g&/T*L 2-3物理气相沉积PVD physical vapor deposition: gbVdOm 2-4化学气相沉积CVD chemical vapor deposition: __mF?m 2-5磁控溅射magnetron sputtering: ODZ|bN0> 2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: 4pw6bK,s2\ 2-7空心阴极离子镀HCD hollow cathode discharge deposition: 7{&|;U 2-8电弧离子镀arc discharge deposition: =zQN[ KYzv$oK 3.专用部件 y;/VB,4V 3-1镀膜室coating chamber: H":oNpfb 3-2蒸发器装置evaporator device: (#+^&1 3-3蒸发器evaporator: boDt`2= 3-4直接加热式蒸发器evaporator by direct heat: !K|5bK 3-5间接加热式蒸发器evaporator by indirect heat: jy-{~xdg[ 3-7溅射装置sputtering device: I? ,>DHUX 3-8靶target: Lemui) 3-10时控挡板timing shutter: M4as 3-11掩膜mask: )1X#*mCxk 3-12基片支架substrate holder: &b:1I7Cp* 3-13夹紧装置clamp: 8OgLn?"P 3-14换向装置reversing device: '],J$ge 3-15基片加热装置substrate heating device: >2~=)L 3-16基片冷却装置substrate colding device: ]+X@
7 0_ 88V 4.真空镀膜设备 Gz.|]:1 4-1真空镀膜设备vacuum coating plant: 4?B\O`sy. (1).真空蒸发镀膜设备vacuum evaporation coating plant: GSH>7!.# (2).真空溅射镀膜设备vacuum sputtering coating plant: F$)[kP,wtO 4-2连续镀膜设备continuous coating plant:
O({2ivX 4-3半连续镀膜设备semi- continuous coating plant 1I:+MBGin 6. 1.漏孔 ~3<>
3p 1-1漏孔leaks: EFz&N\2 1-2通道漏孔channel leak: Mo^ od< 1-3薄膜漏孔membrane leak: ;+ "+3 1-4分子漏孔molecular leak: % >=!p 1-5粘滞漏孔vixcous leak: ]q4rlT.i 1-6校准漏孔calibrated leak: FJMrs[ 1-7标准漏孔reference leak : wb0L.'jyR) 1-8虚漏virtual leak: _*f`iu:` 1-9漏率leak rate: q<M2,YrbAI 1-10标准空气漏率standard air leak rate: AIZ]jq 1-11等值标准空气漏率equivalent standard air leak rate: v?geCe=ng 1-12探索(示漏)气体: @{25xTt }4,L%$@n 2.本底 ?`?)QE8 2-1本底background: 4%4 }5UYN 2-2探索气体本底search gas background : %KLpig 2-3漂移drift: J\b^) 2-4噪声noise: c24dSNJg, F1yqxWHeo 3.检漏仪 aht[4(XH5 3-1检漏仪leak detector: ~nay" g: 3-2高频火花检漏仪H.F. spark leak detector: JJN.ugT}1 3-3卤素检漏仪halide leak detector: t7aefV&_, 3-4氦质谱检漏仪helium mass spectrometer leak detector: 2fL;-\!y( 3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: Y^wW2-,m 1n;0?MIZ 4.检漏 =%TWX[w 4-1气泡检漏leak detection by bubbles: ~x1$h#Cx' 4-2氨检漏leak detection by ammonia: ;@oN s- 4-3升压检漏leak detection of rise pressure: `r9!zffyS 4-4放射性同位素检漏radioactive isotope leak detection: W:pIPDx1=! 4-5荧光检漏fluorescence leak detection #cI{Fe0h 7. 1.一般术语 ,s"^kFl 1-1真空干燥vacuum drying: vg32y /l]S 1-2冷冻干燥freeze drying : P/W
XaE4 1-3物料material: T4Pgbop 1-4待干燥物料material to be dried: 9sYMSc~Bm 1-5干燥物料dried material : )"7iJb<E 1-6湿气moisture;humidity: ~qTx|", 1-7自由湿气free moisture: 3YR!Mq$|~ 1-8结合湿气bound moisture: -lY6|79bF 1-9分湿气partial moisture: nksLWfpG?B 1-10含湿量moisture content: '-Vt|O_Q 1-11初始含湿量initial moisture content: m#|
9hMu 1-12最终含湿量final residual moisture: Sw ig;` 1-13湿度degree of moisture ,degree of humidity : &w_j/nW^' 1-14干燥物质dry matter : Ng2twfSl$ 1-15干燥物质含量content of dry matter: Yg||{ <L8'! q} 2.干燥工艺 :(P9mt 2-1干燥阶段stages of drying : ,is3&9 (1).预干燥preliminary dry: d:C 'H8 (2).一次干燥(广义)primary drying(in general): kTOzSiq (3).一次干燥(冷冻干燥)primary drying(freeze-drying): 0z6R'Kjy A (4).二次干燥secondary drying: NJWA3zz
2-2.(1).接触干燥contact drying: 1#< '&Lr (2).辐射干燥 drying by radiation : Nk?
^1n$ (3).微波干燥microwave drying: *av<E (4).气相干燥vapor phase drying: B9jC?I |` (5).静态干燥static drying: h+g_rvIG* (6).动态干燥dynamic drying: *v !9MU9[( 2-3干燥时间drying time: |4;Fd9q^m 2-4停留时间length of stay(in the drying chamber): `EA\u]PwQ 2-5循环时间cycle time: wDal5GJp 2-6干燥率 dessication ratio : k8&;lgO' 2-7去湿速率mass flow rate of humidity: =(j1rW! 2-8单位面积去湿速率mass flow rate of humidity per surface area: {HltvO%8 2-9干燥速度 drying speed : 'CM|@Zz% 2-10干燥过程drying process: Q4#m\KK;i9 2-11加热温度heating temperature: y}" O U 2-12干燥温度temperature of the material being dried : J?"B%B5c 2-13干燥损失loss of material during the drying process : NX*Q F+ 2-14飞尘lift off (particles): BU/"rv"(Fg 2-15堆层厚度thickness of the material: dVtG/0 %}SrL* 3.冷冻干燥 /$Nsd 3-1冷冻freezing: WUn]F~Lt (1).静态冷冻static freezing: AUG#_HE]k (2).动态冷冻dynamic freezing: 6,8h]?u. (3).离心冷冻centrifugal freezing: r=
`Jn6@ (4).滚动冷冻shell freezing: U2#"p
(5).旋转冷冻spin-freezing: {T$9?`h~M (6).真空旋转冷冻vacuum spin-freezing: v!~fs)cdE| (7).喷雾冷冻spray freezing: r,73C/*&/ (8).气流冷冻air blast freezing: i
&nSh ]KK 3-2冷冻速率rate of freezing: f643#1 3-3冷冻物料frozen material: y&$A+peJ1 3-4冰核ice core: nV|EQs4( 3-5干燥物料外壳envelope of dried matter: ~d.Y&b 3-6升华表面sublimation front: 5uGq%(24 3-7融化位置freezer burn: X]TG<r *aM=Z+ 4.真空干燥设备;真空冷冻干燥设备 hR?{3d#x2 4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: 2~)`N>@ 4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: ;WQve_\ 4-3加热表面heating surface: 0*3R=7_},o 4-4物品装载面shelf : lfow1WRF 4-5干燥器的处理能力throughput (of the vacuum drying chamber): hE D}h![ 4-6单位面积干燥器处理能力throughput per shelf area: 2*& ^v 4-7冰冷凝器ice condenser: NIry)'" 4-8冰冷凝器的负载load of the ice condenser: `g=J%p 4-9冰冷凝器的额定负载rated load of the ice condenser Jq-]7N%k/ 8. 1.一般术语 rpha!h>w1% 1-1试样sample : AO4U}? (1).表面层surface layer: kiaw4_ (2).真实表面true surface: >1Ibc=}g (3).有效表面积effective surface area: l_d5oAh
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: L,/%f<wd (5).表面粒子密度surface particle density: z43M]P< (6).单分子层monolayer: h7Kzq{$ (7).表面单分子层粒子密度monolayer density: Dw.J2>uj (8).覆盖系数coverage ratio: }j)e6>K]) 1-2激发excitation: 194)QeoFw (1).一次粒子primary particle: Ax7[;|2 (2).一次粒子通量primary particle flux: A}9`S6 @@ (3).一次粒子通量密度density of primary particle flux: gPI
?C76 (4).一次粒子负荷primary particle load: oJz^|dW (5).一次粒子积分负荷integral load of primary particle: PJ%C N(0 (6).一次粒子的入射能量energy of the incident primary particle: 1.GQau~ (7).激发体积excited volume: )Nw8O{\ (8).激发面积excited area: B~ GbF*j (9).激发深度excited death: rq].UCj (10).二次粒子secondary particles: U%QI
a TN* (11).二次粒子通量secondary particle flux: Xl#ggub? (12).二次粒子发射能energy of the emitted secondary particles: aB&&YlR=n< (13).发射体积emitting volume: *])
`z8Ox (14).发射面积emitting area: K+3=tk]W9u (15).发射深度emitting depth: G5 WVr$ (16).信息深度information depth: 14yv$, (17).平均信息深度mean information depth: 8OU\V5i[,q 1-3入射角angle of incidence: FTUv IbT 1-4发射角angle of emission: kn4`Fa;)O 1-5观测角observation: !l8PDjAE 1-6分析表面积analyzed surface area: +a+Om73B2 1-7产额 yield : dR,fXQm 1-8表面层微小损伤分析minimum damage surface analysis: kdeWip6Y 1-9表面层无损伤分析non-destructive surface analysis: zRr*7G 1-10断面深度分析 profile analysis in depth; depth profile analysis : ]2KihP8z
x 1-11可观测面积observable area: _]H&,</ 1-12可观测立体角observable solid angle : YU'E@t5 1-13接受立体角;观测立体角angle of acceptance:
ZBp/sm 1-14角分辨能力angular resolving power: hRhe& ,v 1-15发光度luminosity: }19\.z&J 1-16二次粒子探测比detection ratio of secondary particles: htF] W|z 1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: 3XV/Fb}!(i 1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: m;QMQeGz 1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: 9WyhZoPD* 1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: @*((1(q 1-21本底压力base pressure: '5$b-x6 F 1-22工作压力working pressure: )jP1or jQB9j 2.分析方法 /h3RmUy 2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: NC(~l (1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : @Jw-8Q{ (2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: (O3nL. 2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: u^ ~W+ 2-3离子散射表面分析ion scattering spectroscopy: @\#td5' 2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: %Q|Atgp 2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: cVF"!. 2-6离子散射谱仪ion scattering spectrometer: _q-*7hCQ` 2-7俄歇效应Auger process: jNk%OrP] 2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: T_4/C2 2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: ud('0r',D 2-10光电子谱术photoelectron spectroscopy : S<Xf>-8w (1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: &%J08l6 (2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: ( a#BV}= 2-11光电子谱仪photoelectron spectrometer: aPL+=5 8r 2-12低能电子衍射;LEED low energy electron diffraction ;LEED: 4.t-i5 2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: 9\7en%( M 2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): C?eH]hkZ3 2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus
|
|