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cswmsc 2007-02-28 23:18

真空术语全集

“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 y%AJ>@/;  
--------------------------------------------------- w,$17+]3  
真空术语 2HNS|GHb&  
:zoX Xo  
1.标准环境条件 standard ambient condition: 1gr jK.x  
2.气体的标准状态 standard reference conditions forgases: wm4e:&  
3.压力(压强)p pressure: h)8_sC  
4.帕斯卡Pa pascal: ' ga2C\)  
5.托Torr torr: e76)z; '  
6.标准大气压atm standard atmosphere: bL%)k61G_v  
7.毫巴mbar millibar: pq`MO .R  
8.分压力 partial pressure: +cN2 KP  
9.全压力 total pressure: :4TcCWG  
10.真空 vacuum: N"{o3QmA  
11.真空度 degree of vacuum: P&VI2k  
12.真空区域 ranges of vacuum: i=UJ*c  
13.气体 gas: Wov_jVdN\  
14.非可凝气体 non-condensable gas: WBdb[N6\  
15.蒸汽vapor: G[ea@u$?  
16.饱和蒸汽压saturation vapor pressure: 9p<l}h7g  
17.饱和度degree of saturation: Ab)7hCUW  
18.饱和蒸汽saturated vapor: 3@J wL{C  
19.未饱和蒸汽unsaturated vapor: 8'$n|<1X  
20.分子数密度n,m-3 number density of molecules: GKr L  
21.平均自由程ι、λ,m mean free path: 9|,AhyhO  
22.碰撞率ψ collision rate: `pr,lL  
23.体积碰撞率χ volume collision rate: j3U8@tuG  
24.气体量G quantity of gas: |V5H(2/nk  
25.气体的扩散 diffusion of gas: dX*PR3I-3  
26.扩散系数D diffusion coefficient; diffusivity: rjzRH  
27.粘滞流 viscous flow: t/ w>t! q  
28.粘滞系数η viscous factor: }^t?v*kcA  
29.泊肖叶流 poiseuille flow: ^q$sCt}  
30.中间流 intermediate flow: >?tpGEZ\  
31.分子流 molecular flow: ijfT!W  
32克努曾数 number of knudsen: :>z0m 0nI\  
33.分子泻流 molecular effusion; effusive flow: t1S\M%?  
34.流逸 transpiration: `7`iCYiTy  
35.热流逸 thermal transpiration: BN0))p  
36.分子流率qN molecular flow rate; molecular flux: _'Z@ < ,L  
37.分子流率密度 molecular flow rate density; density of molecular flux: \uH;ng|m  
38.质量流率qm mass flow rare: FrS>.!OFn  
39.流量qG throughput of gas: BH^q.p_#>X  
40.体积流率qV volume flow rate: t<-Iiq+tL  
41.摩尔流率qυ molar flow rate: 0FBifK  
42.麦克斯韦速度分布 maxwellian velocity distribution: nBd;d}LD  
43.传输几率Pc transmission probability: VlH9ap  
44.分子流导CN,UN molecular conductance: P_}$|zj7  
45.流导C,U conductance: <v?-$3YT  
46.固有流导Ci,Ui intrinsic conductance: \BA_PyS?W+  
47.流阻W resistance: .+.Pc_fv  
48.吸附 sorption: sE% n=Ww  
49.表面吸附 adsorption: dJk.J9Z  
50.物理吸附physisorption: /$E1!9J  
51.化学吸附 chemisorption: MWB?V?qPSC  
52.吸收absorption: H)Yv_gT  
53.适应系数α accommodation factor: d{  Z  
54.入射率υ impingement rate: H3JWf MlW  
55.凝结率condensation rate: f-PDgs   
56.粘着率 sticking rate: LS;kq',  
57.粘着几率Ps sticking probability: 1-`8v[S  
58.滞留时间τ residence time: q?wB h^  
59.迁移 migration: V'8 (}(s/  
60.解吸 desorption: Ty>`r n  
61.去气 degassing: `C3F?Lch  
62.放气 outgassing: iIg_S13  
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: 5}f$O  
64.蒸发率 evaporation rate: >PTq5pk  
65.渗透 permeation: Z|u_DaSrr|  
66.渗透率φ permeability: x9a0J1Nb-h  
67.渗透系数P permeability coefficient mY-r:  
2.   1.真空泵 vacuum pumps q^gd1K<N  
1-1.容积真空泵 positive displacement pump: f_}55?i0  
⑴.气镇真空泵 gas ballast vacuum pump: /%~`B[4F  
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: y<Z8+/f`f  
⑶.干封真空泵 dry-sealed vacuum pump: ,ua]h8  
⑷.往复真空泵 piston vacuum pump: K-K+%U  
⑸.液环真空泵 liquid ring vacuum pump: /IgTmXxxj  
⑹.旋片真空泵 sliding vane rotary vacuum pump: :E.mU{  
⑺.定片真空泵 rotary piston vacuum pump: `*! .B  
⑻.滑阀真空泵 rotary plunger vacuum pump: 8<xJmcTEwO  
⑼.余摆线真空泵 trochoidal vacuum pump: ,^/;!ErR$  
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: ^7=yjD`  
⑾.罗茨真空泵 roots vacuum pump: p[cC%3  
1-2.动量传输泵 kinetic vacuum pump: >t.I,Zn  
⑴.牵引分子泵molecular drag pump: uu HWN|  
⑵.涡轮分子泵turbo molecular pump: U]_1yX  
⑶.喷射真空泵ejector vacuum pump: 4o'0lz]  
⑷.液体喷射真空泵liquid jet vacuum pump: G'!Hc6OZ  
⑸.气体喷射真空泵gas jet vacuum pump: gZ 9<H q  
⑹.蒸汽喷射真空泵vapor jet vacuum pump : :[F w c  
⑺.扩散泵diffusion pump : /@q_`tU  
⑻.自净化扩散泵self purifying diffusion pump: h.PY$W<  
⑼.分馏扩散泵 fractionating diffusion pump : bBGLf)fsTG  
⑽.扩散喷射泵diffusion ejector pump : WFTTBUoH  
⑾.离子传输泵ion transfer pump: W Qe>1   
1-3.捕集真空泵 entrapment vacuum pump: 97Whn*  
⑴吸附泵adsorption pump: V<1dA\I"  
⑵.吸气剂泵 getter pump: \SyfEcSf2v  
⑶.升华(蒸发)泵 sublimation (evaporation)pump : %h^; "|Z  
⑷.吸气剂离子泵getter ion pump: u)%J5TR.Y  
⑸.蒸发离子泵 evaporation ion pump: ! @|"84  
⑹.溅射离子泵sputter ion pump: w}+jfO9  
⑺.低温泵cryopump: .DHPKz`W0  
*c.*e4uzF  
2.真空泵零部件 ;R}:2  
2-1.泵壳 pump case: ktnsq&qNL  
2-2.入口 inlet: yYF%U7N/n  
2-3.出口outlet: R9k Z#  
2-4.旋片(滑片、滑阀)vane; blade : k |M  
2-5.排气阀discharge valve: -K PbA`j+  
2-6.气镇阀gas ballast valve: ,9=5.+AJ  
2-7.膨胀室expansion chamber: wTqgH@rGtR  
2-8.压缩室compression chamber: ~r+;i,,X  
2-9.真空泵油 vacuum pump oil: A+>+XA'  
2-10.泵液 pump fluid: (;\JCeGA  
2-11.喷嘴 nozzle: dQTJC %]O  
2-13.喷嘴扩张率nozzle expansion rate: 7h0LR7  
2-14.喷嘴间隙面积 nozzle clearance area : c.r]w  
2-15.喷嘴间隙nozzle clearance: pFhznH{0  
2-16.射流jet: V4iN2  
2-17.扩散器diffuser: </Ja@%  
2-18.扩散器喉部diffuser thoat: :D;BA  
2-19.蒸汽导管vapor tube(pipe;chimney): \vsfY   
2-20.喷嘴组件nozzle assembly: bt"*@NJ$  
2-21.下裙skirt: 5!-'~W  
/a Nlr>^  
3.附件 >E6w,Ab  
3-1阱trap: U%_BgLwy%  
⑴.冷阱 cold trap: PIl:z?q({  
⑵.吸附阱sorption trap: ZDMS:w.'T  
⑶.离子阱ion trap: lh{U@,/  
⑷.冷冻升华阱 cryosublimation trap: yO.q{|kX  
3-2.挡板baffle: *7FtEk/l  
3-3.油分离器oil separator: ch!/k  
3-4.油净化器oil purifier: qYF150  
3-5.冷凝器condenser: ^,*!Qk<c  
,'Zs")Ydp  
4.泵按工作分类 J4"?D9T3G  
4-1.主泵main pump: /'O? 8X<  
4-2.粗抽泵roughing vacuum pump: 7a\at)q/y  
4-3.前级真空泵backing vacuum pump: gd#+N]C_  
4-4.粗(低)真空泵 roughing(low)vacuum pump: !W^P|:Qt  
4-5.维持真空泵holding vacuum pump: "w7wd5h  
4-6.高真空泵high vacuum pump: k> SPtiAs  
4-7.超高真空泵ultra-high vacuum pump: t}w<xe  
4-8.增压真空泵booster vacuum pump: Qv~lH&jG  
QbrR=[8b  
5.真空泵特性 +~Wg@   
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: :"{("!x   
5-2.真空泵的抽气量Q throughput of vacuum pump:。 D?A3p6%  
5-3.起动压力starting pressure: K+|G9  
5-4.前级压力 backing pressure : 3qggdi  
5-5.临界前级压力 critical backing pressure: ';'gKX!9V  
5-6.最大前级压力maximum backing pressure: SI\ O>a 9{  
5-7.最大工作压力maximum working pressure: UXgeL2`;  
5-8.真空泵的极限压力ultimate pressure of a pump: b v5BV  
5-9.压缩比compression ratio: J;wDvt]]1  
5-10.何氏系数Ho coefficient: :< X&y  
5-11.抽速系数speed factor: *QH~ z2:[  
5-12.气体的反扩散back-diffusion of gas: ecvQEK2L  
5-13.泵液返流back-streaming of pump fluid: C)hS^D:  
5-14.返流率back-streaming rate 1K\z amBg  
5-15.返迁移back-migration: a!guZUg6  
5-16.爆腾bumping: 1#}}:  
5-17.水蒸气允许量qm water vapor tolerable load: '8Wu9 phT  
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: (_IPz)F  
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: eU(cn8/}  
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump qg1tDN`s  
3.   1.一般术语 q!f'?yFYK  
1-1.压力计pressure gauge: [$]qJ~kz  
1-2.真空计vacuum gauge: B5v5D[ o5  
⑴.规头(规管)gauge head: tw k  
⑵.裸规nude gauge : FIu|eW+<l  
⑶.真空计控制单元gauge control unit : ,)?!p_*@:  
⑷.真空计指示单元gauge indicating unit : V10JExsJ  
<~z@G MQCf  
2.真空计一般分类 D4Z7j\3a  
2-1.压差式真空计differential vacuum gauge: ?LSwJ @#  
2-2.绝对真空计 absolute vacuum gauge:  hik.c3  
2-3.全压真空计total pressure vacuum gauge: zoibinm}Eg  
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: Fa0Fl}L  
2-5.相对真空计relative vacuum gauge : .VXadgM  
@PzRHnT*  
3.真空计特性 F81Kxcs  
3-1.真空计测量范围pressure range of vacuum gauge: R+r;V]-/  
3-2.灵敏度系数sensitivity coefficient: SiLWy=qbR  
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): F e1^9ja  
3-5.规管光电流photon current of vacuum gauge head: .C|dGE?,  
3-6.等效氮压力equivalent nitrogen pressure : T deHs{|  
3-7.X射线极限值 X-ray limit: WU\Bs2  
3-8.逆X射线效应anti X-ray effect: >1BDt:G36  
3-9.布利尔斯效应blears effect: \%}w7J;  
4OOI$J$Jh  
4.全压真空计 ^Ycn&`s  
4-1.液位压力计liquid level manometer: ?G>E[!8ev  
4-2.弹性元件真空计elastic element vacuum gauge: *E|#g  
4-3.压缩式真空计compression gauge: gY {/)"  
4-4.压力天平pressure balance: sq_ yu(  
4-5.粘滞性真空计viscosity gauge : ^]k=*>{ R  
4-6.热传导真空计thermal conductivity vacuum gauge : "M}3T?0 O  
4-7.热分子真空计thermo-molecular gauge: Yij_'0vZ  
4-8.电离真空计ionization vacuum gauge: f]NaQ!. 7  
4-9.放射性电离真空计radioactive ionization gauge: L'HO"EZFj  
4-10.冷阴极电离真空计cold cathode ionization gauge: nTv^][  
4-11.潘宁真空计penning gauge: yk0^m/=C(  
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: o*5b]XWw  
4-13.放电管指示器discharge tube indicator: `3^%ft~l  
4-14.热阴极电离真空计hot cathode ionization gauge: 0ky3rFSh1  
4-15.三极管式真空计triode gauge: f?lnBvT|b  
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: #X"fm1  
4-17.B-A型电离真空计Bayard-Alpert gauge: . efbORp  
4-18.调制型电离真空计modulator gauge: RDxvN:v  
4-19.抑制型电离真空计suppressor gauge: MjW{JR)I  
4-20.分离型电离真空计extractor gauge: ^!6T,7 B B  
4-21.弯注型电离真空计bent beam gauge: )1/J5DI @8  
4-22.弹道型电离真空计 orbitron gauge : wvI}|c  
4-23.热阴极磁控管真空计hot cathode magnetron gauge: iw^"?:'%  
CqLAtS X7  
5.分压真空计(分压分析器) TBmmC}PEd  
5-1.射频质谱仪radio frequency mass spectrometer: ,8.zbr  
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: LIRL`xU7  
5-3.单极质谱仪momopole mass spectrometer: PTpGZ2FZ  
5-4.双聚焦质谱仪double focusing mass spectrometer: H,(4a2zx  
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: ? @- t.N  
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: ua!RwSo  
5-7.回旋质谱仪omegatron mass spectrometer: 2OwO|n  
5-8.飞行时间质谱仪time of flight mass spectrometer: fBLR  
m!WDXt  
6.真空计校准 (m() r0:@  
6-1.标准真空计reference gauges: Na.)!h_Kn'  
6-2.校准系统system of calibration: ]t-B-(D  
6-3.校准系数K calibration coefficient: XZ 4H(Cj  
6-4.压缩计法meleod gauge method: ,-V7~gM%}  
6-5.膨胀法expansion method: }g"K\x:Z  
6-6.流导法flow method: oz'^.+uvE  
4.   1.真空系统vacuum system m^;A]0h+  
1-1.真空机组pump system: FT h/1"a  
1-2.有油真空机组pump system used oil : 5N[H@%>QO  
1-3.无油真空机组oil free pump system )2?A|f8  
1-4.连续处理真空设备continuous treatment vacuum plant: CTZ#QiNP  
1-5.闸门式真空系统vacuum system with an air-lock: yHmNO*(  
1-6.压差真空系统differentially pumped vacuum system: S~ZRqL7Z O  
1-7.进气系统gas admittance system: {^@qfkZz^  
.~%,eF;l$  
2.真空系统特性参量 X?S LYm@v  
2-1.抽气装置的抽速volume flow rate of a pumping unit : J';XAB }  
2-2.抽气装置的抽气量throughput of a pumping unit : $uUJV% EX  
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: xL|4'8  
2-4.真空系统的漏气速率leak throughput of a vacuum system: 8O.5ML{  
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: #1[Q?e4,0  
2-6.极限压力ultimate pressure: (*G'~gSX  
2-7.残余压力residual pressure: &P(vm@*  
2-8.残余气体谱residual gas spectrum: T2}ccnDi  
2-9.基础压力base pressure: `$>cQwB,D  
2-10.工作压力working pressure: pJ_>^i=  
2-11.粗抽时间roughing time: W4S]2P>T  
2-12.抽气时间pump-down time: /i IWt\J  
2-13.真空系统时间常数time constant of a vacuum system: GI/4<J\  
2-14.真空系统进气时间venting time: F <.} q|b  
7J$Yd976  
3.真空容器 fVxRK\a\\  
3-1.真空容器;真空室vacuum chamber: l 5z8]/  
3-2.封离真空装置sealed vacuum device: D}K/5iU]a  
3-3.真空钟罩vacuum bell jar: Ffr6P }I  
3-4.真空容器底板vacuum base plate: @v=A)L  
3-5.真空岐管vacuum manifold: -P$E)5?^  
3-6.前级真空容器(贮气罐)backing reservoir: G2hBJTW  
3-7.真空保护层outer chamber: YL@d+ -\  
3-8.真空闸室vacuum air lock: #*;Nb  
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: q^+Z>   
3bMUsyJ2  
4.真空封接和真空引入线 kA(q-Re$B*  
4-1.永久性真空封接permanent seal : -1 _7z{.  
4.2.玻璃分级过渡封接graded seal : bn8?-  
4-3.压缩玻璃金属封接compression glass-to-metal seal: J9`[Qy\  
4-4.匹配式玻璃金属封接matched glass-to-metal seal: "6P-0CJ  
4-5.陶瓷金属封接ceramic-to-metal seal: 2O)2#N  
4-6.半永久性真空封接semi-permanent seal : Vr<ypyC  
4-7.可拆卸的真空封接demountable joint: Mta;6<  
4-8.液体真空封接liquid seal nuX W/7M  
4-9.熔融金属真空封接molten metal seal: qYR+qSAJP  
4-10.研磨面搭接封接ground and lapped seal: !FR1yO'd>  
4-11.真空法兰连接vacuum flange connection: P%xz"l i  
4-12.真空密封垫vacuum-tight gasket: >jBnNA@  
4-13.真空密封圈ring gasket: IP+1 :M  
4-14.真空平密封垫flat gasket: h}$]3/5H  
4-15.真空引入线feedthrough leadthrough: d^jIsE`  
4-16.真空轴密封shaft seal: |h65[9DMP  
4-17.真空窗vacuum window: Id'@!U:NA  
4-18.观察窗viewing window: Is !DiB  
od~`q4p1(-  
5.真空阀门 7<c&)No;  
5-1.真空阀门的特性characteristic of vacuum valves:  \ l8$1p  
⑴.真空阀门的流导conductance of vacuum valves: 9@|X~z5E  
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: hy|X(m  
5-2.真空调节阀regulating valve: ?4}EhXR(  
5-3.微调阀 micro-adjustable valve: 6Bfu89  
5-4.充气阀charge valve: vH^^QI:em  
5-5.进气阀gas admittance valve: =.Q|gZ   
5-6.真空截止阀break valve: #%g~fh  
5-7.前级真空阀backing valve: rKys:is  
5-8.旁通阀 by-pass valve: dSBW&-p  
5-9.主真空阀main vacuum valve: >}ozEX6c2  
5-10.低真空阀low vacuum valve: c~UYs\  
5-11.高真空阀high vacuum valve: -/ #tQ~{gs  
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: J8yi#A>+  
5-13.手动阀manually operated valve: 3fJwj}wL  
5-14.气动阀pneumatically operated valve: c/57_fOK  
5-15.电磁阀electromagnetically operated valve: weiqt *,8  
5-16.电动阀valve with electrically motorized operation: E0*'AZi&  
5-17.挡板阀baffle valve: <ST#< $%  
5-18.翻板阀flap valve: >AW=N  
5-19.插板阀gate valve: cnOk  
5-20.蝶阀butterfly valve: jsvD[\P  
&p$SFH?s  
6.真空管路 ?y{C"w!   
6-1.粗抽管路roughing line: 2JYt.HN  
6-2.前级真空管路backing line: :=tPC A=  
6-3.旁通管路;By-Pass管路 by-pass line: ; (+r)r_  
6-4.抽气封口接头pumping stem: b_ |  
6-5.真空限流件limiting conductance:       PaFJw5f  
6-6.过滤器filter: 1XO*yZF  
5.   1.一般术语 ?%h JZm;  
1-1真空镀膜vacuum coating: 8D:{05  
1-2基片substrate: A2"xCJ0`  
1-3试验基片testing substrate: FBcF  
1-4镀膜材料coating material: y6o^ Knl  
1-5蒸发材料evaporation material: tH"SOGfSt  
1-6溅射材料sputtering material: v=|BqG`  
1-7膜层材料(膜层材质)film material: Mf&W<n^j  
1-8蒸发速率evaporation rate: 8E Y< ^:  
1-9溅射速率sputtering rate: h tn2`  
1-10沉积速率deposition rate: ^F~e?^s  
1-11镀膜角度coating angle: L&'0d$Tg8  
0 n,5"B  
2.工艺 ys;e2xekg  
2-1真空蒸膜vacuum evaporation coating: K0\a+6kh  
(1).同时蒸发simultaneous evaporation: .so{ RI  
(2).蒸发场蒸发evaporation field evaporation: zHB{I(q  
(3).反应性真空蒸发reactive vacuum evaporation: t{>66jm\R  
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: ~]/X,Cf  
(5).直接加热的蒸发direct heating evaporation: H9w*U  
(6).感应加热蒸发induced heating evaporation: =3oz74O[  
(7).电子束蒸发electron beam evaporation: C<fNIc~.  
(8).激光束蒸发laser beam evaporation: K. R2)o`  
(9).间接加热的蒸发indirect heating evaporation: Prhq ~oI4  
(10).闪蒸flash evaportion: @U:T}5)wc  
2-2真空溅射vacuum sputtering: KF'H|)!K  
(1).反应性真空溅射 reactive vacuum sputtering: %`}CbD6  
(2).偏压溅射bias sputtering: >UJ&noUD#:  
(3).直流二级溅射direct current diode sputtering: c)SSi@< cv  
(4).非对称性交流溅射asymmtric alternate current sputtering: Ytx+7OLe  
(5).高频二极溅射high frequency diode sputtering: GGF;T&DWad  
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: S53%*7K.  
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: _u;^w}0  
(8).离子束溅射ion beam sputtering: Xx|&%b{{r  
(9).辉光放电清洗glow discharge cleaning: dtM@iDljj  
2-3物理气相沉积PVD physical vapor deposition: _T5~B"*  
2-4化学气相沉积CVD chemical vapor deposition: #K! Df%,<  
2-5磁控溅射magnetron sputtering: ''BP4=r5 n  
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: &F'v_9  
2-7空心阴极离子镀HCD hollow cathode discharge deposition: OqBw&zm  
2-8电弧离子镀arc discharge deposition: XU9=@y+|v  
TKLy38  
3.专用部件 qW7"qw=   
3-1镀膜室coating chamber: Z{p6Q1u  
3-2蒸发器装置evaporator device: B@zJ\Ir[  
3-3蒸发器evaporator: SC2C%.%l`  
3-4直接加热式蒸发器evaporator by direct heat: F`I-G~e  
3-5间接加热式蒸发器evaporator by indirect heat: "}SERC7  
3-7溅射装置sputtering device: v[a#>!;s  
3-8靶target: <YeF?$S}  
3-10时控挡板timing shutter: FYcMvY  
3-11掩膜mask:  29sgi"  
3-12基片支架substrate holder: pXFNK" jm  
3-13夹紧装置clamp: GoEIY  
3-14换向装置reversing device: eN> (IW  
3-15基片加热装置substrate heating device: k)v[/#I  
3-16基片冷却装置substrate colding device: )i_FU~ LRq  
Ix"c<1 I  
4.真空镀膜设备 jm-0]ugY&`  
4-1真空镀膜设备vacuum coating plant: lIFt/  
(1).真空蒸发镀膜设备vacuum evaporation coating plant: Ab2g),;c  
(2).真空溅射镀膜设备vacuum sputtering coating plant: uAvs  
4-2连续镀膜设备continuous coating plant: =|U2 }U;  
4-3半连续镀膜设备semi- continuous coating plant Ve8!   
6.   1.漏孔 k@8#Byl|  
1-1漏孔leaks: mzT} C&hfP  
1-2通道漏孔channel leak: k9Sqp :l,  
1-3薄膜漏孔membrane leak: (J$A  
1-4分子漏孔molecular leak: "}OFwes  
1-5粘滞漏孔vixcous leak: |~HlNUPR  
1-6校准漏孔calibrated leak: 'hek CZZ_I  
1-7标准漏孔reference leak : hx^a&"  
1-8虚漏virtual leak: 3-mw-;.  
1-9漏率leak rate: phc1AN=[E  
1-10标准空气漏率standard air leak rate: b<F 4_WF  
1-11等值标准空气漏率equivalent standard air leak rate: Pm1 " 0  
1-12探索(示漏)气体: o`77gkLO  
Rm*}<JN31  
2.本底 D+SpSO7yg  
2-1本底background: i `>X5Da5  
2-2探索气体本底search gas background : ?UfZVyHv+  
2-3漂移drift: 42wcpSp  
2-4噪声noise: hL`zV  
]Qu12Wg}P  
3.检漏仪 +uLo~GdbE  
3-1检漏仪leak detector: kH&ZPAI  
3-2高频火花检漏仪H.F. spark leak detector: poeXi\e!(  
3-3卤素检漏仪halide leak detector: 8zc!g|5"  
3-4氦质谱检漏仪helium mass spectrometer leak detector: FvJSJ.;E,  
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: b}4/4Z.  
20moX7L  
4.检漏 7k\7G=  
4-1气泡检漏leak detection by bubbles: !n{c#HfG  
4-2氨检漏leak detection by ammonia: gPwp [  
4-3升压检漏leak detection of rise pressure: ?:FotnU*p  
4-4放射性同位素检漏radioactive isotope leak detection: e6R "W9  
4-5荧光检漏fluorescence leak detection *(`.h\+  
7.   1.一般术语 epbp9[`  
1-1真空干燥vacuum drying: >o} ati  
1-2冷冻干燥freeze drying : WsV3>=@f  
1-3物料material: ;:|KfXiC8  
1-4待干燥物料material to be dried: Az-!LAu9 R  
1-5干燥物料dried material : v$i%>tQ\  
1-6湿气moisture;humidity: 1ZL_;k  
1-7自由湿气free moisture: A pjqSz"  
1-8结合湿气bound moisture: U]D.z}0  
1-9分湿气partial moisture: "<2b jy  
1-10含湿量moisture content: Q*C4  q`  
1-11初始含湿量initial moisture content: h(8;7} K  
1-12最终含湿量final residual moisture: `_'Dj>  
1-13湿度degree of moisture ,degree of humidity : -(uBTO s  
1-14干燥物质dry matter : 2SJh6U  
1-15干燥物质含量content of dry matter: 9Bk}g50$#  
)A0&16<  
2.干燥工艺 3b 3cNYP  
2-1干燥阶段stages of drying : :b ;1P@W<  
(1).预干燥preliminary dry: I7PWO d  
(2).一次干燥(广义)primary drying(in general): kVrT?  
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): GF!{SO4  
(4).二次干燥secondary drying: %'T>kz*A  
2-2.(1).接触干燥contact drying: X{xJ*T y'  
(2).辐射干燥 drying by radiation : BNCJT$t YX  
(3).微波干燥microwave drying: qE72(#:R*  
(4).气相干燥vapor phase drying: erP>P  
(5).静态干燥static drying: `Y\/US70{c  
(6).动态干燥dynamic drying: />[6uvy#Q  
2-3干燥时间drying time: y+scJ+<  
2-4停留时间length of stay(in the drying chamber): 0:Y`#0qK  
2-5循环时间cycle time: i`aG  
2-6干燥率 dessication ratio : -NPk N%h  
2-7去湿速率mass flow rate of humidity: N`Xnoehu  
2-8单位面积去湿速率mass flow rate of humidity per surface area: =+h!JgY/L  
2-9干燥速度 drying speed : C9H11g7{  
2-10干燥过程drying process:  DiQkT R  
2-11加热温度heating temperature: e-cb?.WU?  
2-12干燥温度temperature of the material being dried : ^X;Xti  
2-13干燥损失loss of material during the drying process : {}o>ne nx\  
2-14飞尘lift off (particles): R[9PFMn  
2-15堆层厚度thickness of the material: 56Y5kxmi  
YaZt+WA  
3.冷冻干燥 r)5\3j[P  
3-1冷冻freezing: 6&QTVdK'O  
(1).静态冷冻static freezing: *z"1MU  
(2).动态冷冻dynamic freezing: q7 oR9  
(3).离心冷冻centrifugal freezing: K^vp(2  
(4).滚动冷冻shell freezing: 0^&R7Rv c  
(5).旋转冷冻spin-freezing: TJ[jZuT:  
(6).真空旋转冷冻vacuum spin-freezing: Mto~ /  
(7).喷雾冷冻spray freezing: E9d i  
(8).气流冷冻air blast freezing: 6>BDA?  
3-2冷冻速率rate of freezing: w52HN;Jm  
3-3冷冻物料frozen material: y]YS2^  
3-4冰核ice core: v~2XGm  
3-5干燥物料外壳envelope of dried matter: :z} _y&]  
3-6升华表面sublimation front: , q@(L  
3-7融化位置freezer burn: _d0-%B 9m  
?3TK7]1V:  
4.真空干燥设备;真空冷冻干燥设备 :$cSQ(q9a  
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: HA.NZkq.tV  
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: txfwLqx  
4-3加热表面heating surface: ]AC!R{H  
4-4物品装载面shelf : l&sO?P[ /  
4-5干燥器的处理能力throughput (of the vacuum drying chamber): 0HJqsSZ$mW  
4-6单位面积干燥器处理能力throughput per shelf area: ckjVa\  
4-7冰冷凝器ice condenser: %cr]ZR  
4-8冰冷凝器的负载load of the ice condenser: <,X+`m&  
4-9冰冷凝器的额定负载rated load of the ice condenser ul=a\;3x#|  
8.   1.一般术语 Sp~Gv>uMK  
1-1试样sample : Z:Y.":[ Qi  
(1).表面层surface layer: h [|zs>p  
(2).真实表面true surface: 8X ?GY8W:  
(3).有效表面积effective surface area: ;p#Z:6  
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: X\^& nLa  
(5).表面粒子密度surface particle density: 1[/$ZYk:  
(6).单分子层monolayer: jdg ~!<C  
(7).表面单分子层粒子密度monolayer density: R3{*v =ov  
(8).覆盖系数coverage ratio: &X]=Q pl  
1-2激发excitation: ^8-~@01.`_  
(1).一次粒子primary particle: M*~v'L_sI  
(2).一次粒子通量primary particle flux: Vi?~0.Z%  
(3).一次粒子通量密度density of primary particle flux: "'}v0*[  
(4).一次粒子负荷primary particle load: A D}}>v  
(5).一次粒子积分负荷integral load of primary particle: hKH$AEHEU}  
(6).一次粒子的入射能量energy of the incident primary particle: ]~ #+ b>  
(7).激发体积excited volume: 61+pryW%g  
(8).激发面积excited area: Y0L5W;iM  
(9).激发深度excited death: fs3 -rXoB  
(10).二次粒子secondary particles: ycl>git]  
(11).二次粒子通量secondary particle flux: "\zj][sL  
(12).二次粒子发射能energy of the emitted secondary particles: r8 Zyld_@  
(13).发射体积emitting volume: <(bCz>o|  
(14).发射面积emitting area: V^Mf4!A(y  
(15).发射深度emitting depth: DUuC3^R  
(16).信息深度information depth: zhA',p@K?_  
(17).平均信息深度mean information depth: pRrqs+IJZ\  
1-3入射角angle of incidence: p-i.ITRS  
1-4发射角angle of emission: EBIa%,  
1-5观测角observation: ph8Jn+|E  
1-6分析表面积analyzed surface area: -lP )  
1-7产额 yield : '?`@7Eol  
1-8表面层微小损伤分析minimum damage surface analysis: ){:q;E]^fB  
1-9表面层无损伤分析non-destructive surface analysis: 0V>ESyae5  
1-10断面深度分析 profile analysis in depth; depth profile analysis : aJy>  
1-11可观测面积observable area: 5!SoN}$  
1-12可观测立体角observable solid angle : ;* wT,2;  
1-13接受立体角;观测立体角angle of acceptance: w;yiX<t<  
1-14角分辨能力angular resolving power: yBPt%EF  
1-15发光度luminosity: o8};e  
1-16二次粒子探测比detection ratio of secondary particles: l`v +sV^1  
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: G.-h=DT]  
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: `'[7~Ew[  
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: *w'q  
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: Q{.{#G  
1-21本底压力base pressure: .# !'c  
1-22工作压力working pressure: j[m_qohd7  
L@1,7@  
2.分析方法 O?nPxa<  
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: r 1l/) ;  
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : `N|U"s;  
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: _C< 6349w  
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: .g/ARwM}  
2-3离子散射表面分析ion scattering spectroscopy: \A'|XdQ  
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: (C-,ljY  
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: PwFQ#Z  
2-6离子散射谱仪ion scattering spectrometer: OYszW]UMg  
2-7俄歇效应Auger process: W"b&M%y|  
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES:  _DPB?)!x  
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: T:K"  
2-10光电子谱术photoelectron spectroscopy : H4PbO/{xO  
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: %XEKhy  
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: =~GE?}.o  
2-11光电子谱仪photoelectron spectrometer: rxs~y{ Xi  
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: QHHW(InG<  
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: Je#!Wd  
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): <ICZ"F`S  
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus
zuiyuan 2007-03-13 15:13
太好了啊,多谢了啊
zhy980730 2007-03-14 11:39
多谢,了解点.
flyinlove79 2007-03-15 17:43
不错,多谢楼主分享资料 [s:4]
飞花无心 2007-03-26 09:33
很好,谢谢楼主啊
wottlin100 2007-04-02 09:19
呵呵,楼主辛苦啦!如果有定义解释更好!
xingmeng1227 2011-10-29 12:40
呵呵,楼主辛苦啦!
zh9607109 2011-11-03 05:41
呵呵,楼主辛苦啦!
wym87 2011-11-13 23:18
谢谢楼主的分享!Thanks!
douyongming 2012-06-17 17:03
太好了啊,多谢了啊
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