| cswmsc |
2007-02-28 23:18 |
真空术语全集
“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 h&{pMmS3, --------------------------------------------------- oR } 真空术语 A{vG@Pwc: ohl%<FqS 1.标准环境条件 standard ambient condition: +TX]~k79Oq 2.气体的标准状态 standard reference conditions forgases: Qt$Q/<8U 3.压力(压强)p pressure: I/l]Yv! 4.帕斯卡Pa pascal: as8<c4:v 5.托Torr torr: $) $sApB 6.标准大气压atm standard atmosphere: .O(UK4Mb 7.毫巴mbar millibar: ,MJZ*"V/3 8.分压力 partial pressure: ~i4@sz& 9.全压力 total pressure: f$L5=V 10.真空 vacuum: lbY>R@5 11.真空度 degree of vacuum: LY MfoXp 12.真空区域 ranges of vacuum:
;L7<mU 13.气体 gas: W0|?R6| 14.非可凝气体 non-condensable gas: 6lPGop]js] 15.蒸汽vapor: E^!%m8-- 16.饱和蒸汽压saturation vapor pressure: 4 ET
P 17.饱和度degree of saturation: O-k(5Zb 18.饱和蒸汽saturated vapor: -T>`PJpJuL 19.未饱和蒸汽unsaturated vapor: xab[ 20.分子数密度n,m-3 number density of molecules: IlVi1`]w 21.平均自由程ι、λ,m mean free path: sXUM,h8$!+ 22.碰撞率ψ collision rate: s`{O- 23.体积碰撞率χ volume collision rate: LQe<mZ< 24.气体量G quantity of gas: TBpW/wz/ 25.气体的扩散 diffusion of gas:
7@`(DU`z 26.扩散系数D diffusion coefficient; diffusivity: .d2s4q\ 27.粘滞流 viscous flow: @ 9uwcM1F 28.粘滞系数η viscous factor: P*}Oi7Z 29.泊肖叶流 poiseuille flow: :V
[vE h 30.中间流 intermediate flow: )}R0'QGd 31.分子流 molecular flow: 0y(d|;': 32克努曾数 number of knudsen: G100L}d"N 33.分子泻流 molecular effusion; effusive flow: k$zDofdfp 34.流逸 transpiration: Y9C] -zEv 35.热流逸 thermal transpiration: n V<YwqK 36.分子流率qN molecular flow rate; molecular flux: ]ba<4:[Go 37.分子流率密度 molecular flow rate density; density of molecular flux: -Fb/GZt| 38.质量流率qm mass flow rare: </eh^<_~ 39.流量qG throughput of gas: 0-@waK 40.体积流率qV volume flow rate: #M:W?&. 41.摩尔流率qυ molar flow rate: c;Li~FLR 42.麦克斯韦速度分布 maxwellian velocity distribution: vUW ! 43.传输几率Pc transmission probability: ? in&/ZrB 44.分子流导CN,UN molecular conductance: 2/GH5b( 45.流导C,U conductance: g\ke,r6 46.固有流导Ci,Ui intrinsic conductance: ?p5Eo{B 47.流阻W resistance: 2$jY_{B+x 48.吸附 sorption: :Qf^@TS}O 49.表面吸附 adsorption: h"[
][ 50.物理吸附physisorption: E\QSU88^ 51.化学吸附 chemisorption: A2B&X}K|U 52.吸收absorption: /HLQ 53.适应系数α accommodation factor: sh0O~%]g 54.入射率υ impingement rate: j"f]pzg& 55.凝结率condensation rate: 1$c*/Tc:E 56.粘着率 sticking rate: .AKx8=f 57.粘着几率Ps sticking probability: NoMEe< 58.滞留时间τ residence time: '+`CwB2 59.迁移 migration: U_w)*)F 60.解吸 desorption: 1@/+ c 61.去气 degassing: %o5GD 62.放气 outgassing: 7n#0eska, 63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: )sW1a 64.蒸发率 evaporation rate: }!2|*Y 65.渗透 permeation:
BYu|loc 66.渗透率φ permeability: \PL92HV 67.渗透系数P permeability coefficient ?g9CeeH* 2. 1.真空泵 vacuum pumps ~Su>^T(?- 1-1.容积真空泵 positive displacement pump: J?%Z7&/M> ⑴.气镇真空泵 gas ballast vacuum pump: Y*4\K%e( ⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: r8@:Ko= a ⑶.干封真空泵 dry-sealed vacuum pump: ^E5Xpza ⑷.往复真空泵 piston vacuum pump: ]E`DG ⑸.液环真空泵 liquid ring vacuum pump: n] &fod ⑹.旋片真空泵 sliding vane rotary vacuum pump: )]v vp{ ⑺.定片真空泵 rotary piston vacuum pump: %!WQ;( ⑻.滑阀真空泵 rotary plunger vacuum pump: 3B>!9:w~f ⑼.余摆线真空泵 trochoidal vacuum pump:
!Qn:PSk ⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: >b/Yg:t ⑾.罗茨真空泵 roots vacuum pump: <n0-zCf 1-2.动量传输泵 kinetic vacuum pump: ?vvjwys@ ⑴.牵引分子泵molecular drag pump: bvAO(` ⑵.涡轮分子泵turbo molecular pump: wZ29/{, ⑶.喷射真空泵ejector vacuum pump: +&JF|#FQ` ⑷.液体喷射真空泵liquid jet vacuum pump: ww=< = ⑸.气体喷射真空泵gas jet vacuum pump: :I1bGa&I ⑹.蒸汽喷射真空泵vapor jet vacuum pump : r0_3 `;H ⑺.扩散泵diffusion pump : e=YvMg ⑻.自净化扩散泵self purifying diffusion pump: %2V_%KA ⑼.分馏扩散泵 fractionating diffusion pump : >/Slk{ ⑽.扩散喷射泵diffusion ejector pump : c D7q;|+ ⑾.离子传输泵ion transfer pump: T"3WB o 1-3.捕集真空泵 entrapment vacuum pump: O75ioO0 ⑴吸附泵adsorption pump: : wb\N'b ⑵.吸气剂泵 getter pump: az7L0pp ⑶.升华(蒸发)泵 sublimation (evaporation)pump : oU67<jq ⑷.吸气剂离子泵getter ion pump: aMT&}3 ⑸.蒸发离子泵 evaporation ion pump: Rg+V;C
C~ ⑹.溅射离子泵sputter ion pump: 'j>Q7M7q{ ⑺.低温泵cryopump: C#;}U51:t ^-rb&kW@: 2.真空泵零部件 s}UPe)Vu 2-1.泵壳 pump case: <^OGJ}G 2-2.入口 inlet: E}yl@8g:# 2-3.出口outlet: PJO +@+"{@ 2-4.旋片(滑片、滑阀)vane; blade : pZF`+642 2-5.排气阀discharge valve: aZ- )w 2-6.气镇阀gas ballast valve: izOtt^#DZt 2-7.膨胀室expansion chamber: y1FS?hSD0 2-8.压缩室compression chamber: jg' 'T1) 2-9.真空泵油 vacuum pump oil: cy%^P^M 2-10.泵液 pump fluid: .z)E 2-11.喷嘴 nozzle: !y `wAm>n 2-13.喷嘴扩张率nozzle expansion rate: BPtU]Bv- 2-14.喷嘴间隙面积 nozzle clearance area : vxY7/ _] 2-15.喷嘴间隙nozzle clearance: C {gYrz) 2-16.射流jet: UjUDP>iz.> 2-17.扩散器diffuser: p e |k}{ 2-18.扩散器喉部diffuser thoat: {
+MqXeq 2-19.蒸汽导管vapor tube(pipe;chimney): t d-EB&i\ 2-20.喷嘴组件nozzle assembly: ?tg(X[h{S 2-21.下裙skirt: 8.F]&D0p8 m'@NF--#Oq 3.附件 u0Irf"Ab 3-1阱trap: $D<LND=o= ⑴.冷阱 cold trap: ig)rK<@*[ ⑵.吸附阱sorption trap: 4ijoAW3A^ ⑶.离子阱ion trap: 9^x'x@6 ⑷.冷冻升华阱 cryosublimation trap: >@`D@_v 3-2.挡板baffle: G"3D"7fa 3-3.油分离器oil separator:
UcKpid 3-4.油净化器oil purifier: c5nl!0XX 3-5.冷凝器condenser: {H=DeQ Sc`W'q^X 4.泵按工作分类 P]bI".A8 4-1.主泵main pump: IEmtt^C 4-2.粗抽泵roughing vacuum pump: #iJ+}EW
_ 4-3.前级真空泵backing vacuum pump: q!t_qX7u 4-4.粗(低)真空泵 roughing(low)vacuum pump: uR"(0_ 4-5.维持真空泵holding vacuum pump: DgGGrV` 4-6.高真空泵high vacuum pump: R*VJe+5w 4-7.超高真空泵ultra-high vacuum pump: uwU;glT 4-8.增压真空泵booster vacuum pump: 9Qst5n\Z eZJrV}V 5.真空泵特性 049E#[<Q" 5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: f4@>7K]9TA 5-2.真空泵的抽气量Q throughput of vacuum pump:。 g/'CX}g` 5-3.起动压力starting pressure: YQ:FBj 5-4.前级压力 backing pressure : CuR.a 5-5.临界前级压力 critical backing pressure: ]_G!(`Udh 5-6.最大前级压力maximum backing pressure: "d^h Y}Xx 5-7.最大工作压力maximum working pressure: f,wB.MN 5-8.真空泵的极限压力ultimate pressure of a pump: j|N;&s` 5-9.压缩比compression ratio: Ml@,xJ/aia 5-10.何氏系数Ho coefficient: wz}BH 5-11.抽速系数speed factor: }'U"HHv 5-12.气体的反扩散back-diffusion of gas: )S]4
Kt_ 5-13.泵液返流back-streaming of pump fluid: dj3}Tjt 5-14.返流率back-streaming rate Y&6vTU 5-15.返迁移back-migration: tF}Vs} 5-16.爆腾bumping: B{hP#bYK 5-17.水蒸气允许量qm water vapor tolerable load: p(g0+.?`~ 5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: -Jr6aai3+ 5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: p(-f $Q( 5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump 6p|*H?|It 3. 1.一般术语 Ztu _UlGC 1-1.压力计pressure gauge: Oc8]A=M12 1-2.真空计vacuum gauge: |]kcgLqj ⑴.规头(规管)gauge head: $ d? N("L ⑵.裸规nude gauge : ckY,6e"6 ⑶.真空计控制单元gauge control unit : 16Ym*kWIps ⑷.真空计指示单元gauge indicating unit : ~M7
J{hK +KGZk?% 2.真空计一般分类 M@ t,P? 2-1.压差式真空计differential vacuum gauge: ,<!_MNw[ 2-2.绝对真空计 absolute vacuum gauge: 5v<X-8" 2-3.全压真空计total pressure vacuum gauge: mltG4R
? 2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: Z#0hh%E"|y 2-5.相对真空计relative vacuum gauge : lv\C(^mGq " lar~ 3.真空计特性 WP{!|d& 3-1.真空计测量范围pressure range of vacuum gauge: x;w&JS1V 3-2.灵敏度系数sensitivity coefficient: 4Qh\3UL~ 3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): p^S]O\;M7 3-5.规管光电流photon current of vacuum gauge head: oNH&VHjU 3-6.等效氮压力equivalent nitrogen pressure : hYOUuC 3-7.X射线极限值 X-ray limit: =
zJY5@^'7 3-8.逆X射线效应anti X-ray effect: K89 AZxH 3-9.布利尔斯效应blears effect: 7UM!<@9\ rWzw7T~ 4.全压真空计 EA_6L\+8& 4-1.液位压力计liquid level manometer: K.'II9-{ 4-2.弹性元件真空计elastic element vacuum gauge: .b'hVOs{ 4-3.压缩式真空计compression gauge: \@6PA 4-4.压力天平pressure balance: I`"B<=zi 4-5.粘滞性真空计viscosity gauge : KFd !wZ@e 4-6.热传导真空计thermal conductivity vacuum gauge : =I.
b2e1z 4-7.热分子真空计thermo-molecular gauge: :wtr{,9rZ 4-8.电离真空计ionization vacuum gauge: <7Igd6u 4-9.放射性电离真空计radioactive ionization gauge: doM}vh)6 4-10.冷阴极电离真空计cold cathode ionization gauge: QJ1_LJ4)a 4-11.潘宁真空计penning gauge: XoI,m8A 4-12.冷阴极磁控管真空计cold cathode magnetron gauge: Pt<lHfd 4-13.放电管指示器discharge tube indicator: G ,,c, 4-14.热阴极电离真空计hot cathode ionization gauge: mqPV
Eo 4-15.三极管式真空计triode gauge: DY]\@<ez 4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: Rf7*Ut
wVr 4-17.B-A型电离真空计Bayard-Alpert gauge: (KQAKEhD! 4-18.调制型电离真空计modulator gauge: <tp\+v!u 4-19.抑制型电离真空计suppressor gauge: N#<h/ 4-20.分离型电离真空计extractor gauge: p<hV7x-{ 4-21.弯注型电离真空计bent beam gauge: e]N?{s
4-22.弹道型电离真空计 orbitron gauge : m#y?k1GY 4-23.热阴极磁控管真空计hot cathode magnetron gauge: uEp
v l @k.j6LKbc 5.分压真空计(分压分析器) 57:Wh=x 5-1.射频质谱仪radio frequency mass spectrometer: h!#!}|Q' 5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: -?)` OHc^ 5-3.单极质谱仪momopole mass spectrometer: 2x3'm 5-4.双聚焦质谱仪double focusing mass spectrometer: &Z
Ja}5k!r 5-5.磁偏转质谱仪magnetic deflection mass spectrometer: |%6zhkoufM 5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: @H'pvFLK? 5-7.回旋质谱仪omegatron mass spectrometer: %) A-zzj 5-8.飞行时间质谱仪time of flight mass spectrometer: /y2upu*! G}.t!" 6.真空计校准 p_z_d6? 6-1.标准真空计reference gauges: 9D
2B8t"a 6-2.校准系统system of calibration: b.Wf*I? 6-3.校准系数K calibration coefficient: LeY!A#j 6-4.压缩计法meleod gauge method: 9H~{2Un 6-5.膨胀法expansion method: P=ARttT`( 6-6.流导法flow method: <cTusC< 4. 1.真空系统vacuum system @r.u8e)l 1-1.真空机组pump system: P(N$U^pj 1-2.有油真空机组pump system used oil : i7^_y3dG 1-3.无油真空机组oil free pump system ep]tio_ 1-4.连续处理真空设备continuous treatment vacuum plant: xv!
QO 1-5.闸门式真空系统vacuum system with an air-lock: [3":7bB 'E 1-6.压差真空系统differentially pumped vacuum system: JvFU7`4@ 1-7.进气系统gas admittance system: (bP\_F5D 4BSSJ@z 2.真空系统特性参量 v&CKtk!3{ 2-1.抽气装置的抽速volume flow rate of a pumping unit : <&&xt
?I. 2-2.抽气装置的抽气量throughput of a pumping unit : K>H_q@-?f 2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: Epm'u[wV 2-4.真空系统的漏气速率leak throughput of a vacuum system: (+g!~MP 2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: n
ETm" 2-6.极限压力ultimate pressure: T""y)% 2-7.残余压力residual pressure: i2<dn)K[~- 2-8.残余气体谱residual gas spectrum: ^%|(dMo4 2-9.基础压力base pressure: E3N4(V\* 2-10.工作压力working pressure: <fY<.X 2-11.粗抽时间roughing time: ebF},Q(48 2-12.抽气时间pump-down time: wg? :jK 2-13.真空系统时间常数time constant of a vacuum system: 1zE_ SNx 2-14.真空系统进气时间venting time: 8.vPh mUi|vq)`=D 3.真空容器 VK9I#
3-1.真空容器;真空室vacuum chamber: w+vYD2a 3-2.封离真空装置sealed vacuum device:
G
$u:1& 3-3.真空钟罩vacuum bell jar: XK:KWqW 3-4.真空容器底板vacuum base plate: h%kB>E~ 3-5.真空岐管vacuum manifold: l\8l.xP 3-6.前级真空容器(贮气罐)backing reservoir: h#bpog 3-7.真空保护层outer chamber: IQK__) 3-8.真空闸室vacuum air lock: B8'(3&)My 3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: #mqz*=L3 )F;[ 4.真空封接和真空引入线 e W*nRha 4-1.永久性真空封接permanent seal : JnX@eBNV 4.2.玻璃分级过渡封接graded seal : MS
Ui_|7 4-3.压缩玻璃金属封接compression glass-to-metal seal: ?5m[Qc(< 4-4.匹配式玻璃金属封接matched glass-to-metal seal: BaIh,iu 4-5.陶瓷金属封接ceramic-to-metal seal: z41
p$ 4-6.半永久性真空封接semi-permanent seal : _\ n'uW$ 4-7.可拆卸的真空封接demountable joint: :SSlUl4sU$ 4-8.液体真空封接liquid seal ;8sEE?C$g 4-9.熔融金属真空封接molten metal seal: 5Am*1S^ 4-10.研磨面搭接封接ground and lapped seal: }#@P+T:b 4-11.真空法兰连接vacuum flange connection: f f"Clp 4-12.真空密封垫vacuum-tight gasket: F'ZLN]"{ 4-13.真空密封圈ring gasket: 6USet`# 4-14.真空平密封垫flat gasket: Z2B59,I 4-15.真空引入线feedthrough leadthrough: (mHFyEG 4-16.真空轴密封shaft seal: B\bIMjXV 4-17.真空窗vacuum window: /IVw}:G 4-18.观察窗viewing window: rS9*_-NH 6YT*=\KT 5.真空阀门 %V;k/w~[ 5-1.真空阀门的特性characteristic of vacuum valves: Qwx}e\= ⑴.真空阀门的流导conductance of vacuum valves: %@(6,^3%i ⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: ;B`e;B?1Q 5-2.真空调节阀regulating valve: \@4QG.3& 5-3.微调阀 micro-adjustable valve: C78d29 5-4.充气阀charge valve: e*vSGT$KgL 5-5.进气阀gas admittance valve: Dbyy H_ 5-6.真空截止阀break valve: =_cWCl^5 5-7.前级真空阀backing valve: pCf-W/v 5-8.旁通阀 by-pass valve: D8W:mAGEu 5-9.主真空阀main vacuum valve: y)U8\ 5-10.低真空阀low vacuum valve: -GP+e`d 5-11.高真空阀high vacuum valve: |6\ ?"# 5-12.超高真空阀;UHV阀 ultra-high vacuum valve: DC*|tHl 5-13.手动阀manually operated valve: ]8YHA}P 5-14.气动阀pneumatically operated valve: ' 7>}I{Lq 5-15.电磁阀electromagnetically operated valve: oTOe(5N8a 5-16.电动阀valve with electrically motorized operation: `Pl=%DR 5-17.挡板阀baffle valve: >C_! }~ 5-18.翻板阀flap valve: =KT7ZSTV 5-19.插板阀gate valve: oB3>0Pm*a. 5-20.蝶阀butterfly valve: -$WiB k`
(_~/# 6.真空管路 l%B1JGu*F 6-1.粗抽管路roughing line: & A9psc(,& 6-2.前级真空管路backing line: @R}L
4 6-3.旁通管路;By-Pass管路 by-pass line: z!Jce}mx 6-4.抽气封口接头pumping stem: OAw/ 6-5.真空限流件limiting conductance: "_'9KBd! 6-6.过滤器filter: _* 4
< 5. 1.一般术语 9
J5Z'd_ 1-1真空镀膜vacuum coating: 1Sz5&jz 1-2基片substrate: N!RyncJ 1-3试验基片testing substrate: 40%p
lNPj 1-4镀膜材料coating material: */\dH< 1-5蒸发材料evaporation material: D (qT$# 1-6溅射材料sputtering material: :CHCVoh@95 1-7膜层材料(膜层材质)film material: [W{`L_" 1-8蒸发速率evaporation rate: lu-VBVwR 1-9溅射速率sputtering rate: [Z
Ea3/ 1-10沉积速率deposition rate: ,\}V.:THF 1-11镀膜角度coating angle: H3OH $BH0W{S 2.工艺 `p1`Sxz? 2-1真空蒸膜vacuum evaporation coating: #C%<g:F8 (1).同时蒸发simultaneous evaporation: oL}FD !} (2).蒸发场蒸发evaporation field evaporation: =K8`[iH (3).反应性真空蒸发reactive vacuum evaporation: '{( n1es (4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: [+GQ3Z\ (5).直接加热的蒸发direct heating evaporation: aeUm,'Y$ (6).感应加热蒸发induced heating evaporation: NX)7g}S (7).电子束蒸发electron beam evaporation: 9M01} (8).激光束蒸发laser beam evaporation: Gq-U}r (9).间接加热的蒸发indirect heating evaporation: 9lTA/- (10).闪蒸flash evaportion: ~sSB.g 2-2真空溅射vacuum sputtering: jIdhmd* $z (1).反应性真空溅射 reactive vacuum sputtering: B0Z*YsbXL (2).偏压溅射bias sputtering: UQW;!8J#R( (3).直流二级溅射direct current diode sputtering: !2&h=;i~V (4).非对称性交流溅射asymmtric alternate current sputtering: I8^z\ef& (5).高频二极溅射high frequency diode sputtering: *QLl
jGe (6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: #On1Q:d (7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: fngZ0k! (8).离子束溅射ion beam sputtering: $ a5K (9).辉光放电清洗glow discharge cleaning: ~q|^z[7 2-3物理气相沉积PVD physical vapor deposition:
8CEy#%7]} 2-4化学气相沉积CVD chemical vapor deposition: cW&OVNj 2-5磁控溅射magnetron sputtering: 3v0)oK 2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: uF(-h~ 2-7空心阴极离子镀HCD hollow cathode discharge deposition: yDd&*;9%Qg 2-8电弧离子镀arc discharge deposition: |Q:`:ODy`5 1YnDho;~ 3.专用部件 O4$:
xjs 3-1镀膜室coating chamber: ^O892 -R 3-2蒸发器装置evaporator device: Zqam Iq 3-3蒸发器evaporator: _TX.}167;- 3-4直接加热式蒸发器evaporator by direct heat: VCc4nn# 3-5间接加热式蒸发器evaporator by indirect heat: UhEJznfi 3-7溅射装置sputtering device: PS=crU@"H 3-8靶target: * 5P/&*c| 3-10时控挡板timing shutter: SH}O?d\Q: 3-11掩膜mask: .+[[m$J 3-12基片支架substrate holder: Lwv9oa| 3-13夹紧装置clamp: L
YH9P-5H 3-14换向装置reversing device: * rs_k/2( 3-15基片加热装置substrate heating device: {I2j Lc 3-16基片冷却装置substrate colding device: QT-rb~ )0d3sJ8 4.真空镀膜设备 Uw)K[T 4-1真空镀膜设备vacuum coating plant: n!tC z<v (1).真空蒸发镀膜设备vacuum evaporation coating plant: $rjv4e}7 (2).真空溅射镀膜设备vacuum sputtering coating plant: bt
j\v[D 4-2连续镀膜设备continuous coating plant: }:hdAZ+z 4-3半连续镀膜设备semi- continuous coating plant +JQN=nTA 6. 1.漏孔 ^Y'>3o21f 1-1漏孔leaks: O>k. sO
< 1-2通道漏孔channel leak: 1y?TyUP 1-3薄膜漏孔membrane leak: 3d,|26I 7f 1-4分子漏孔molecular leak: Pel3e ~?t 1-5粘滞漏孔vixcous leak: j
f^fj- 1-6校准漏孔calibrated leak: oEi+S)_ 1-7标准漏孔reference leak : Bq$bxuhV 1-8虚漏virtual leak: +F0M?, 1-9漏率leak rate: wL%> 1-10标准空气漏率standard air leak rate: v1)jZ.: 1-11等值标准空气漏率equivalent standard air leak rate: Fir7z nRW 1-12探索(示漏)气体: 6xj&Qo v=X\@27= ? 2.本底 8Ipyr%l 2-1本底background: 52%.^/ 2-2探索气体本底search gas background : (nV/-#* 2-3漂移drift: dB1bf2'b# 2-4噪声noise: 'vCFT(C- b1s1;8 Q 3.检漏仪 rP>5OLP 3-1检漏仪leak detector: *np%67=jO 3-2高频火花检漏仪H.F. spark leak detector: ?. ~@ lE 3-3卤素检漏仪halide leak detector: nq$^}L3&~ 3-4氦质谱检漏仪helium mass spectrometer leak detector: #U6Wv1H{Lp 3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: AalyEn&> %_/_klxnO 4.检漏 $T*kpUXH} 4-1气泡检漏leak detection by bubbles: X#Hs{J~@p 4-2氨检漏leak detection by ammonia: $%!]tNGS 4-3升压检漏leak detection of rise pressure: \s)j0F)
4-4放射性同位素检漏radioactive isotope leak detection: U:IQWl C 4-5荧光检漏fluorescence leak detection Xt$?Kx_, 7. 1.一般术语 HF0J>Clq 1-1真空干燥vacuum drying: 8~4{e,} , 1-2冷冻干燥freeze drying : W;hI[9 1-3物料material: 6t@3
a? 1-4待干燥物料material to be dried: &{7%VsTB 1-5干燥物料dried material : ^srx/6X 1-6湿气moisture;humidity: "\e9Y< 1-7自由湿气free moisture: 3 i>uKU1 1-8结合湿气bound moisture: CaK 0o*D 1-9分湿气partial moisture: R2r0'Yx 1-10含湿量moisture content: 'jfI1 ]q 1-11初始含湿量initial moisture content: -1U]@s 1-12最终含湿量final residual moisture: /dtFB5Z"w 1-13湿度degree of moisture ,degree of humidity : .+ _x|?' 1-14干燥物质dry matter : :x16N|z 1-15干燥物质含量content of dry matter: =o9
%) 1k;X*r# 2.干燥工艺 =G*<WcR 2-1干燥阶段stages of drying : WJ/&Ag1 (1).预干燥preliminary dry: ?_ p3^kl (2).一次干燥(广义)primary drying(in general): G0<m3 Up (3).一次干燥(冷冻干燥)primary drying(freeze-drying): cp]\<p('A (4).二次干燥secondary drying: V<(cW'zA/ 2-2.(1).接触干燥contact drying: rw58bkh6 (2).辐射干燥 drying by radiation : :5p`H (3).微波干燥microwave drying: RD,`D! (4).气相干燥vapor phase drying: wl}Q|4rZ (5).静态干燥static drying:
X&(1DE (6).动态干燥dynamic drying: \ocJJc9 2-3干燥时间drying time: ~|+ 2-4停留时间length of stay(in the drying chamber): d)9=hp;,V 2-5循环时间cycle time: `43E-'g 2-6干燥率 dessication ratio : z,$^|'pP 2-7去湿速率mass flow rate of humidity: &(irri_ 2-8单位面积去湿速率mass flow rate of humidity per surface area: Lw2EA 5 2-9干燥速度 drying speed : = q;ACW,z 2-10干燥过程drying process: _?mu2!X 2-11加热温度heating temperature: v-g2k_o| 2-12干燥温度temperature of the material being dried : _18) XR 2-13干燥损失loss of material during the drying process : o5A@U0c_ 2-14飞尘lift off (particles): | [P!9e 2-15堆层厚度thickness of the material: /_>S0 }zj_Pp 3.冷冻干燥 Un@d Wf6' 3-1冷冻freezing: arRbq!mO (1).静态冷冻static freezing: REc69Y.k (2).动态冷冻dynamic freezing: AvH^9zEE( (3).离心冷冻centrifugal freezing: =5',obYN>c (4).滚动冷冻shell freezing: UJ
n3sZ<} (5).旋转冷冻spin-freezing: ;MR8E9 (6).真空旋转冷冻vacuum spin-freezing: =J<3B
H^m (7).喷雾冷冻spray freezing: <Y9e n!3\ (8).气流冷冻air blast freezing: 2w+w'Ag_R 3-2冷冻速率rate of freezing: UM3}7| 3-3冷冻物料frozen material: ?7*.S Lt 3-4冰核ice core: k_/*>lIZY 3-5干燥物料外壳envelope of dried matter: PsaKzAg? 3-6升华表面sublimation front: RGf&KV/ 3-7融化位置freezer burn: cY0NQKUk~ 3c}@_Yn 4.真空干燥设备;真空冷冻干燥设备 o7;lR? 4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: GO2mccIB 4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: 58V`I5_ 4-3加热表面heating surface: Kejp7okb 4-4物品装载面shelf : QVJq% P 4-5干燥器的处理能力throughput (of the vacuum drying chamber): .J"QW~g^ 4-6单位面积干燥器处理能力throughput per shelf area: TD!--l*gL 4-7冰冷凝器ice condenser: i}[cq_wJ 4-8冰冷凝器的负载load of the ice condenser: gNUYHNzDM( 4-9冰冷凝器的额定负载rated load of the ice condenser 8BE] A_X 8. 1.一般术语 k#liYw I 1-1试样sample : k{d] (1).表面层surface layer: .o8Sy2PaV (2).真实表面true surface: E2K{9@i (3).有效表面积effective surface area: m Q4(<,F (4).宏观表面;几何表面macroscopic surface area; geometric surface area: %<8`(Uu5 (5).表面粒子密度surface particle density: !K*(# [ (6).单分子层monolayer: hK+6S3-Ez (7).表面单分子层粒子密度monolayer density: 70Jx[3vr (8).覆盖系数coverage ratio: oq${}n < 1-2激发excitation: @<(4J
(1).一次粒子primary particle: %e^GfZ (2).一次粒子通量primary particle flux: V^Y'!w\LGI (3).一次粒子通量密度density of primary particle flux: /s*.:cdH (4).一次粒子负荷primary particle load: u}3D'h (5).一次粒子积分负荷integral load of primary particle: *IX<&u# (6).一次粒子的入射能量energy of the incident primary particle: _Ne fzZWUJ (7).激发体积excited volume: 17$'r^t,S (8).激发面积excited area: O,6Wdw3+-3 (9).激发深度excited death: @@JyCUd (10).二次粒子secondary particles: ^G|*=~_ (11).二次粒子通量secondary particle flux: dq,j?~ _} (12).二次粒子发射能energy of the emitted secondary particles: UodBK7y (13).发射体积emitting volume: {Y-~7@ (14).发射面积emitting area: @`$'sU (15).发射深度emitting depth: E75/EQ5p]p (16).信息深度information depth: 0vETg'r (17).平均信息深度mean information depth: =PU($ 1-3入射角angle of incidence: J2<kOXXJ9 1-4发射角angle of emission: !iO2yp 1-5观测角observation: n{u\t+f 1-6分析表面积analyzed surface area: w 5 yOSz 1-7产额 yield : L!>nl4O>` 1-8表面层微小损伤分析minimum damage surface analysis: '2GnA ws^ 1-9表面层无损伤分析non-destructive surface analysis: _j+!Fd 1-10断面深度分析 profile analysis in depth; depth profile analysis : !O,Sq/=. 1-11可观测面积observable area: U%q-#^A 1-12可观测立体角observable solid angle : p^CTHk_| 1-13接受立体角;观测立体角angle of acceptance: WQ{[q" O 1-14角分辨能力angular resolving power: z',Fa4@z 1-15发光度luminosity: v3#,Z! 1-16二次粒子探测比detection ratio of secondary particles: oNZ_7tU 1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: c/Xg ARCO 1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: [Ur\^wS 1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: u\V^g 1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: I)tiXcJw 1-21本底压力base pressure: W:,Wex^9n 1-22工作压力working pressure: -Arsmo h);^4cU 2.分析方法 2]1u0-M5L 2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: ;-6-DEL (1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : u<Y#J,p`e (2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: hTa(^ 2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: R*:>h8 2-3离子散射表面分析ion scattering spectroscopy: Hs*["zFc 2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: 3V<@Vkf5 2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: ];Z6=9n 2-6离子散射谱仪ion scattering spectrometer: d{"-iw)t 2-7俄歇效应Auger process: =A.$~9P 2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: q pCI[[ 2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: odCt6Du 2-10光电子谱术photoelectron spectroscopy : ^cm]
[9 (1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: z@yTkH_ (2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: )P$|9<_q7x 2-11光电子谱仪photoelectron spectrometer: TWzLJ63* 2-12低能电子衍射;LEED low energy electron diffraction ;LEED: U}LW8886 2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: I |U'@E 2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): OvtE)ul@ 2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus
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