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cswmsc 2007-02-28 23:18

真空术语全集

“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 A)\>#Dv  
--------------------------------------------------- ?j1_ n,d  
真空术语 `^v4zWDK  
z=ML(1c=  
1.标准环境条件 standard ambient condition: GE%2/z p  
2.气体的标准状态 standard reference conditions forgases: i LF^%!:X%  
3.压力(压强)p pressure: UH5w7M  
4.帕斯卡Pa pascal: PV?]UUc'n<  
5.托Torr torr: @bY('gC,  
6.标准大气压atm standard atmosphere: 4rI:1 yGt@  
7.毫巴mbar millibar: 1a<]$tZk  
8.分压力 partial pressure: M-{*92y& |  
9.全压力 total pressure: ao)Ck3]  
10.真空 vacuum: 'Pf_5q  
11.真空度 degree of vacuum: g(m xhD!k  
12.真空区域 ranges of vacuum: xKY$L*  
13.气体 gas: |r5e{  
14.非可凝气体 non-condensable gas: u K'<xM"%T  
15.蒸汽vapor: "kX`FaAhY  
16.饱和蒸汽压saturation vapor pressure: `'u Umyg  
17.饱和度degree of saturation: 2< p{z  
18.饱和蒸汽saturated vapor: DC&A1I&  
19.未饱和蒸汽unsaturated vapor: UE^D2u  
20.分子数密度n,m-3 number density of molecules: W@l+ciZ_  
21.平均自由程ι、λ,m mean free path: yc*<:(p  
22.碰撞率ψ collision rate: 1<`9HCm  
23.体积碰撞率χ volume collision rate: 6^Ph '  
24.气体量G quantity of gas: Y5HfN[u^7  
25.气体的扩散 diffusion of gas: (YIhTSL"]  
26.扩散系数D diffusion coefficient; diffusivity: HeCcF+  
27.粘滞流 viscous flow: N;<//,  
28.粘滞系数η viscous factor: \ZS\i4  
29.泊肖叶流 poiseuille flow: 8)sg_JC  
30.中间流 intermediate flow: xS"$g9o0  
31.分子流 molecular flow: WM/#.  
32克努曾数 number of knudsen: $'^&\U~?  
33.分子泻流 molecular effusion; effusive flow: O7v]p  
34.流逸 transpiration: qtHfz"p  
35.热流逸 thermal transpiration: opdu=i=E  
36.分子流率qN molecular flow rate; molecular flux: _().t5<  
37.分子流率密度 molecular flow rate density; density of molecular flux:  JX{KYU  
38.质量流率qm mass flow rare: ,*dzJT$k  
39.流量qG throughput of gas: X:_<Y_JT  
40.体积流率qV volume flow rate: N=#4L$@-  
41.摩尔流率qυ molar flow rate: &Cq{ _M  
42.麦克斯韦速度分布 maxwellian velocity distribution: _ENuwBYW-  
43.传输几率Pc transmission probability: yLW/ -%I#u  
44.分子流导CN,UN molecular conductance: @44P4?;  
45.流导C,U conductance: p'&*r2_ram  
46.固有流导Ci,Ui intrinsic conductance: gv9=quG  
47.流阻W resistance: >D ne? 8r  
48.吸附 sorption: MHo1 lrZa+  
49.表面吸附 adsorption: ;-Ss# &  
50.物理吸附physisorption: l)Zs-V!M^\  
51.化学吸附 chemisorption: ]M3# 3Ha"  
52.吸收absorption: >!}`%pk(  
53.适应系数α accommodation factor: #XI"@pD  
54.入射率υ impingement rate: h~w4, T  
55.凝结率condensation rate: M/{g(|{  
56.粘着率 sticking rate: $M':&i5`,  
57.粘着几率Ps sticking probability: RlsVC_H\  
58.滞留时间τ residence time: :mpiAs<%U"  
59.迁移 migration: gLIT;BK  
60.解吸 desorption: Jf)3< ~G  
61.去气 degassing: cOkgoL" 4  
62.放气 outgassing: , H2YpZk  
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: ~GG?GB  
64.蒸发率 evaporation rate: H] k'?;  
65.渗透 permeation: [T`}yb@  
66.渗透率φ permeability: S5_t1wqBJ  
67.渗透系数P permeability coefficient /)9W1U^B  
2.   1.真空泵 vacuum pumps se!mb _!  
1-1.容积真空泵 positive displacement pump: Q2/.6O8  
⑴.气镇真空泵 gas ballast vacuum pump: JRO$<  
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: M$A#I51  
⑶.干封真空泵 dry-sealed vacuum pump: HM&1y ubh#  
⑷.往复真空泵 piston vacuum pump: <C<`J{X0  
⑸.液环真空泵 liquid ring vacuum pump: $ D'^t(  
⑹.旋片真空泵 sliding vane rotary vacuum pump: We}lx{E  
⑺.定片真空泵 rotary piston vacuum pump: |)o#|Qo  
⑻.滑阀真空泵 rotary plunger vacuum pump: Q> 8pP\ho  
⑼.余摆线真空泵 trochoidal vacuum pump: aq Mc6N`z  
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: &[@\f^~  
⑾.罗茨真空泵 roots vacuum pump: NP/>H9Q2%  
1-2.动量传输泵 kinetic vacuum pump: %6ub3PLw8  
⑴.牵引分子泵molecular drag pump: gLQ #4H  
⑵.涡轮分子泵turbo molecular pump: 3]U]?h  
⑶.喷射真空泵ejector vacuum pump: F98i*K`"  
⑷.液体喷射真空泵liquid jet vacuum pump: Y)XvlfJ,h?  
⑸.气体喷射真空泵gas jet vacuum pump: PJgp+u<  
⑹.蒸汽喷射真空泵vapor jet vacuum pump : j'G tgT  
⑺.扩散泵diffusion pump : }"zC >eX&  
⑻.自净化扩散泵self purifying diffusion pump: |NrrTN?>  
⑼.分馏扩散泵 fractionating diffusion pump : phP> 3f.T  
⑽.扩散喷射泵diffusion ejector pump : KWhZ +i`  
⑾.离子传输泵ion transfer pump: Ht[{ryTxu  
1-3.捕集真空泵 entrapment vacuum pump: }nud  
⑴吸附泵adsorption pump: w#(RW7":F  
⑵.吸气剂泵 getter pump: d~*TIN8Ke~  
⑶.升华(蒸发)泵 sublimation (evaporation)pump : /smiopFcq  
⑷.吸气剂离子泵getter ion pump: 44sy`e  
⑸.蒸发离子泵 evaporation ion pump: Q_zr\RM>  
⑹.溅射离子泵sputter ion pump: C+%K6/J(  
⑺.低温泵cryopump: ._ CP% R  
DjHp+TyT  
2.真空泵零部件 4h|dHXYZ  
2-1.泵壳 pump case: DQJG,?e{  
2-2.入口 inlet: 0a2@b"l  
2-3.出口outlet: I,O#X)O|i  
2-4.旋片(滑片、滑阀)vane; blade : Cca0](R*&  
2-5.排气阀discharge valve: G'x .NL  
2-6.气镇阀gas ballast valve: } /e`v6  
2-7.膨胀室expansion chamber: ]gEhE  
2-8.压缩室compression chamber: wJG$c-(\0  
2-9.真空泵油 vacuum pump oil: u&]vd /  
2-10.泵液 pump fluid: $%2H6Eg0  
2-11.喷嘴 nozzle: "T6#  
2-13.喷嘴扩张率nozzle expansion rate: &L4 q10-N  
2-14.喷嘴间隙面积 nozzle clearance area : Ec]|p6a3  
2-15.喷嘴间隙nozzle clearance: onte&Ed\  
2-16.射流jet: D>sYPrf  
2-17.扩散器diffuser: RuAlB*  
2-18.扩散器喉部diffuser thoat: .ve *Vp  
2-19.蒸汽导管vapor tube(pipe;chimney): RT*5d;l0  
2-20.喷嘴组件nozzle assembly: +F@_Es<6  
2-21.下裙skirt: @Doyt{|T  
Z=+03  
3.附件 {G*QY%j^  
3-1阱trap: H:S,\D?%2x  
⑴.冷阱 cold trap: Z1,gtl ?  
⑵.吸附阱sorption trap: d^V$Z6* ]  
⑶.离子阱ion trap: +=P@HfVfiq  
⑷.冷冻升华阱 cryosublimation trap: gPEqjj  
3-2.挡板baffle: 1BTIJ Gw  
3-3.油分离器oil separator: &35|16z%@  
3-4.油净化器oil purifier: $=aI "(3&  
3-5.冷凝器condenser: {0yu   
#DI$Oc  
4.泵按工作分类 t\R; < x  
4-1.主泵main pump: 0 bSA_  
4-2.粗抽泵roughing vacuum pump: >+9JD%]x]  
4-3.前级真空泵backing vacuum pump: G<qIY&D'  
4-4.粗(低)真空泵 roughing(low)vacuum pump: hW 2.8f$  
4-5.维持真空泵holding vacuum pump: q<{NO/Mm  
4-6.高真空泵high vacuum pump: 8+'C_t/0i  
4-7.超高真空泵ultra-high vacuum pump: z,f=}t[.Y  
4-8.增压真空泵booster vacuum pump: n2ndjE$  
", B'k  
5.真空泵特性 Z(Q2Ue;}&  
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: JW+*d`8Z[  
5-2.真空泵的抽气量Q throughput of vacuum pump:。 }e{qW  
5-3.起动压力starting pressure: ]~c+'E`  
5-4.前级压力 backing pressure : XZph%j0o  
5-5.临界前级压力 critical backing pressure: 3y`F<&sA  
5-6.最大前级压力maximum backing pressure: Un@\kAY  
5-7.最大工作压力maximum working pressure: 1dG06<!  
5-8.真空泵的极限压力ultimate pressure of a pump: "pvZ,l>8f  
5-9.压缩比compression ratio: t[C1z  
5-10.何氏系数Ho coefficient: OtUr GQP  
5-11.抽速系数speed factor: }ot"Sx\.  
5-12.气体的反扩散back-diffusion of gas: y?z\L   
5-13.泵液返流back-streaming of pump fluid: s ic$uT  
5-14.返流率back-streaming rate 5nLDj:C~  
5-15.返迁移back-migration: zg}YGu|J  
5-16.爆腾bumping: t#b0H)  
5-17.水蒸气允许量qm water vapor tolerable load: $\\lx_)  
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: UuJjO^t  
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: |X(2Zv^O  
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump >-cfZ9{!  
3.   1.一般术语 4tc:.  
1-1.压力计pressure gauge: >|udWd^$3  
1-2.真空计vacuum gauge: \cySWP[  
⑴.规头(规管)gauge head: >1|g5  
⑵.裸规nude gauge : \7 a4uc  
⑶.真空计控制单元gauge control unit : |:q/Dt@  
⑷.真空计指示单元gauge indicating unit : !,&yyx.  
y!Cc?$]_Y  
2.真空计一般分类 ~!:0iFE&H  
2-1.压差式真空计differential vacuum gauge: l?E|R Kp  
2-2.绝对真空计 absolute vacuum gauge: hKe30#:v  
2-3.全压真空计total pressure vacuum gauge: l I-p_K  
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: #$1$T  
2-5.相对真空计relative vacuum gauge : FxU'LN<;HY  
6`e@$(dfA  
3.真空计特性 #G;X' BN  
3-1.真空计测量范围pressure range of vacuum gauge: T0e<Slo~C  
3-2.灵敏度系数sensitivity coefficient: < K %j  
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): ]> G&jd7  
3-5.规管光电流photon current of vacuum gauge head: 8<&EvOk  
3-6.等效氮压力equivalent nitrogen pressure : !~ rt:Z  
3-7.X射线极限值 X-ray limit: LI W*4r!  
3-8.逆X射线效应anti X-ray effect: }DIF%}UK\  
3-9.布利尔斯效应blears effect: pB01J<@m  
$ |<m9CW  
4.全压真空计 !{%G0(Dv  
4-1.液位压力计liquid level manometer: ]T<^{jG  
4-2.弹性元件真空计elastic element vacuum gauge: ijYvqZ_  
4-3.压缩式真空计compression gauge: vq6%Ey3Gix  
4-4.压力天平pressure balance: (xT*LF+  
4-5.粘滞性真空计viscosity gauge : fE;Q:# Z.  
4-6.热传导真空计thermal conductivity vacuum gauge : :)c80`-E  
4-7.热分子真空计thermo-molecular gauge: ^%[F8\}XPJ  
4-8.电离真空计ionization vacuum gauge: [xaisXvI4  
4-9.放射性电离真空计radioactive ionization gauge: RUXCq`)"<  
4-10.冷阴极电离真空计cold cathode ionization gauge: T@ 48qg  
4-11.潘宁真空计penning gauge: SI-X[xf  
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: !1 :@8q  
4-13.放电管指示器discharge tube indicator: "yh Pm  
4-14.热阴极电离真空计hot cathode ionization gauge: FC>d_=V  
4-15.三极管式真空计triode gauge: > <Z'D  
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: ;e{5)@h$  
4-17.B-A型电离真空计Bayard-Alpert gauge: ef]B9J~h  
4-18.调制型电离真空计modulator gauge: !: us!s  
4-19.抑制型电离真空计suppressor gauge: K0fv( !r{  
4-20.分离型电离真空计extractor gauge: bhg}-dto  
4-21.弯注型电离真空计bent beam gauge: b1^cD6sT+  
4-22.弹道型电离真空计 orbitron gauge : 5 2Hqu>  
4-23.热阴极磁控管真空计hot cathode magnetron gauge: |f' 8p8J  
AV4~U:vU  
5.分压真空计(分压分析器)  (_+;R  
5-1.射频质谱仪radio frequency mass spectrometer: HeIS;gfUY  
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: Q,e*#oK3$  
5-3.单极质谱仪momopole mass spectrometer: IN!02`H  
5-4.双聚焦质谱仪double focusing mass spectrometer: vDE |sT  
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: Ps>&"k$T  
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: 8z T0_vw  
5-7.回旋质谱仪omegatron mass spectrometer: KH<v@IJ\  
5-8.飞行时间质谱仪time of flight mass spectrometer: :5# V^\3*  
+zO]N&  
6.真空计校准 p:[LnL  
6-1.标准真空计reference gauges: >FFVY{F  
6-2.校准系统system of calibration: m,6h ee  
6-3.校准系数K calibration coefficient: +/cgw,  
6-4.压缩计法meleod gauge method: ==9ZFdf  
6-5.膨胀法expansion method: JAP (|  
6-6.流导法flow method: uqZ3Hyb  
4.   1.真空系统vacuum system EXbTCT}`x  
1-1.真空机组pump system: "tR}j,=S:D  
1-2.有油真空机组pump system used oil : F(4yS2h(  
1-3.无油真空机组oil free pump system 3M N  
1-4.连续处理真空设备continuous treatment vacuum plant: r+\/G{+=}  
1-5.闸门式真空系统vacuum system with an air-lock: p;->hn~D'5  
1-6.压差真空系统differentially pumped vacuum system: lB:l)!]||=  
1-7.进气系统gas admittance system: - 9&g[  
pVG>A&4  
2.真空系统特性参量 vm}G[  
2-1.抽气装置的抽速volume flow rate of a pumping unit : 08r[K(bfb,  
2-2.抽气装置的抽气量throughput of a pumping unit : Rx S884  
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: !0jq6[&  
2-4.真空系统的漏气速率leak throughput of a vacuum system: /hci\-8N~  
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: W_JhNe  
2-6.极限压力ultimate pressure: vttrKVA  
2-7.残余压力residual pressure: Vy;_GfT$  
2-8.残余气体谱residual gas spectrum: 8=4^Lm  
2-9.基础压力base pressure: a4by^   
2-10.工作压力working pressure: yN:>!SQ  
2-11.粗抽时间roughing time: [%~NM/xu<  
2-12.抽气时间pump-down time: ^H!Lp[5c  
2-13.真空系统时间常数time constant of a vacuum system: 0/Q5d,'Y[2  
2-14.真空系统进气时间venting time: wAz,vq=x  
 -$R5  
3.真空容器 CWMlZ VG  
3-1.真空容器;真空室vacuum chamber: *k6$   
3-2.封离真空装置sealed vacuum device: rWe 8D/oc  
3-3.真空钟罩vacuum bell jar: 0O; Z  
3-4.真空容器底板vacuum base plate: hht+bpHl  
3-5.真空岐管vacuum manifold: (`mOB6j  
3-6.前级真空容器(贮气罐)backing reservoir: Sf/W9Jw  
3-7.真空保护层outer chamber: cVg$dt  
3-8.真空闸室vacuum air lock: W-XN4:,qI  
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: *1v_6<;2i<  
8Mb$+^zU  
4.真空封接和真空引入线 R `Q?J[e  
4-1.永久性真空封接permanent seal : V=9Bto00  
4.2.玻璃分级过渡封接graded seal : Eq7gcDQ  
4-3.压缩玻璃金属封接compression glass-to-metal seal: Te}IMi:  
4-4.匹配式玻璃金属封接matched glass-to-metal seal: MM*-i=  
4-5.陶瓷金属封接ceramic-to-metal seal: g TD%4V  
4-6.半永久性真空封接semi-permanent seal : Cha?7F[xL  
4-7.可拆卸的真空封接demountable joint: -faw:  
4-8.液体真空封接liquid seal dw99FA6  
4-9.熔融金属真空封接molten metal seal: LOt#1Qv  
4-10.研磨面搭接封接ground and lapped seal: 6\mC$:F  
4-11.真空法兰连接vacuum flange connection: auoA   
4-12.真空密封垫vacuum-tight gasket: ~,+[M-  
4-13.真空密封圈ring gasket: %\_h7:  
4-14.真空平密封垫flat gasket: o HRbAE^  
4-15.真空引入线feedthrough leadthrough: {5.?'vMp  
4-16.真空轴密封shaft seal: 04[)qPPS  
4-17.真空窗vacuum window: M Hn&; A]  
4-18.观察窗viewing window: %9.bu|`KK  
5Wl,J _<F  
5.真空阀门 uTUa4 ^]*  
5-1.真空阀门的特性characteristic of vacuum valves: nu(eLUU  
⑴.真空阀门的流导conductance of vacuum valves: rZ 6@b  
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: LVWxd}0  
5-2.真空调节阀regulating valve: ; ?j~8  
5-3.微调阀 micro-adjustable valve: Qvs(Rt3?y  
5-4.充气阀charge valve: +E `063  
5-5.进气阀gas admittance valve: Z%A<#%    
5-6.真空截止阀break valve: U(8I+xZ  
5-7.前级真空阀backing valve: a1 _o.A  
5-8.旁通阀 by-pass valve: @]<DR*<  
5-9.主真空阀main vacuum valve: +Hi{ /{k0N  
5-10.低真空阀low vacuum valve: d`<#}-nh  
5-11.高真空阀high vacuum valve: wfWS-pQ  
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: ?n73J wH  
5-13.手动阀manually operated valve: J$<:/^t  
5-14.气动阀pneumatically operated valve: ^M"HSewo  
5-15.电磁阀electromagnetically operated valve: 8L@UB6b\  
5-16.电动阀valve with electrically motorized operation: }]Qmt5'NI  
5-17.挡板阀baffle valve: ~F=#}6kg_  
5-18.翻板阀flap valve: IcO9V<Q|  
5-19.插板阀gate valve: ^JiaR)#r  
5-20.蝶阀butterfly valve: EgCp:L{  
2>`m<&y  
6.真空管路 EPR(i#xU  
6-1.粗抽管路roughing line: !~Ax  
6-2.前级真空管路backing line: Py}!C@e  
6-3.旁通管路;By-Pass管路 by-pass line: |ORmS& 7  
6-4.抽气封口接头pumping stem: ?%_]rr9  
6-5.真空限流件limiting conductance:       -aTg>Q|g&  
6-6.过滤器filter: 1Qrm"TFo  
5.   1.一般术语 P] {B^,E  
1-1真空镀膜vacuum coating: hVROzGZk  
1-2基片substrate: ^ON-#  
1-3试验基片testing substrate: LZ3rr-  
1-4镀膜材料coating material: 8Q#t\$RY  
1-5蒸发材料evaporation material: k QB 1=c  
1-6溅射材料sputtering material: <x.]OZgO  
1-7膜层材料(膜层材质)film material: a-SB1-5jf  
1-8蒸发速率evaporation rate: m3h2/}%9`  
1-9溅射速率sputtering rate: ".Tf< F  
1-10沉积速率deposition rate: ]J GKL5~p  
1-11镀膜角度coating angle: Q';\tGy  
,S7~=S  
2.工艺 >MBn2(\B;  
2-1真空蒸膜vacuum evaporation coating: P6.)P|n7=  
(1).同时蒸发simultaneous evaporation: 6kgCS{MZ  
(2).蒸发场蒸发evaporation field evaporation: v3iDh8.__  
(3).反应性真空蒸发reactive vacuum evaporation: ,APGPE}I[  
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: KE&InTM/j  
(5).直接加热的蒸发direct heating evaporation: Q;{D8 #!  
(6).感应加热蒸发induced heating evaporation: ?w c3 +?\J  
(7).电子束蒸发electron beam evaporation: :*^(OnIe  
(8).激光束蒸发laser beam evaporation: >Rx8 0  
(9).间接加热的蒸发indirect heating evaporation: Q#d+IIR0gK  
(10).闪蒸flash evaportion: \xa36~hh40  
2-2真空溅射vacuum sputtering: ROlzs}  
(1).反应性真空溅射 reactive vacuum sputtering: h$:&1jVY{  
(2).偏压溅射bias sputtering: 0KNH=;d}  
(3).直流二级溅射direct current diode sputtering: W0p#Y h:{_  
(4).非对称性交流溅射asymmtric alternate current sputtering: ?];~N5<'  
(5).高频二极溅射high frequency diode sputtering: ;[;S_|vZ=)  
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: m bB\~n  
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: >TH-Q[  
(8).离子束溅射ion beam sputtering: q70YNk}  
(9).辉光放电清洗glow discharge cleaning: q/aL8V<"z  
2-3物理气相沉积PVD physical vapor deposition: #b<lt'gC  
2-4化学气相沉积CVD chemical vapor deposition: 'Sb6 w+  
2-5磁控溅射magnetron sputtering:  A[wxa  
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: 6+{nw}e8  
2-7空心阴极离子镀HCD hollow cathode discharge deposition: 1.u gXD  
2-8电弧离子镀arc discharge deposition: sf|_2sI  
&~D.")Dz  
3.专用部件 h}c6+@w&-  
3-1镀膜室coating chamber: 2={K-s20  
3-2蒸发器装置evaporator device: oPCIlH  
3-3蒸发器evaporator: PgGrk5;  
3-4直接加热式蒸发器evaporator by direct heat: HY%6eUhj  
3-5间接加热式蒸发器evaporator by indirect heat: Bm2}\KOI  
3-7溅射装置sputtering device: 2t Z\{=  
3-8靶target:  9\W5   
3-10时控挡板timing shutter: &].1[&M]  
3-11掩膜mask: 0B!mEg  
3-12基片支架substrate holder: t9=|* =;9)  
3-13夹紧装置clamp: cl9;2D"Zm!  
3-14换向装置reversing device: AyI}LQm]u  
3-15基片加热装置substrate heating device: !:!@dC%8_  
3-16基片冷却装置substrate colding device: F".IB^} $  
R'$ T6FB5  
4.真空镀膜设备 jv?aB   
4-1真空镀膜设备vacuum coating plant: JUUF^/J  
(1).真空蒸发镀膜设备vacuum evaporation coating plant: ^b/q|(Nu&  
(2).真空溅射镀膜设备vacuum sputtering coating plant: wft:eQ  
4-2连续镀膜设备continuous coating plant: LTlC}3c28f  
4-3半连续镀膜设备semi- continuous coating plant 6iA c@  
6.   1.漏孔 pCud` :o"  
1-1漏孔leaks: "}y3@ M^  
1-2通道漏孔channel leak: _sD]Viqc  
1-3薄膜漏孔membrane leak: z 2EI"'4\9  
1-4分子漏孔molecular leak: (B?xq1Q  
1-5粘滞漏孔vixcous leak: Fr Q-v]c  
1-6校准漏孔calibrated leak: e]L3=R;  
1-7标准漏孔reference leak : pC?1gc1G  
1-8虚漏virtual leak: p|O-I&Xd  
1-9漏率leak rate: CI3_lWax%  
1-10标准空气漏率standard air leak rate: 2 3XAkpzp$  
1-11等值标准空气漏率equivalent standard air leak rate: 4s+J-l  
1-12探索(示漏)气体: My43\p  
2%No>w}/2  
2.本底 JKu6+V jO  
2-1本底background: iLQt9Hyk  
2-2探索气体本底search gas background : H2t pP~!G  
2-3漂移drift: ]t!}D6p  
2-4噪声noise: %RR|QY*  
aDJjVD  
3.检漏仪 aN);P>  
3-1检漏仪leak detector: d)J] Y=j  
3-2高频火花检漏仪H.F. spark leak detector: #I@[^^Vw  
3-3卤素检漏仪halide leak detector: :!it7vZ  
3-4氦质谱检漏仪helium mass spectrometer leak detector: B0?@k  
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: :!*;0~#  
$hY]EB  
4.检漏 eNk!pI7g  
4-1气泡检漏leak detection by bubbles: CIs1*:Q9  
4-2氨检漏leak detection by ammonia: l8 2uK"M  
4-3升压检漏leak detection of rise pressure: o\V4qekk  
4-4放射性同位素检漏radioactive isotope leak detection: Vm%ux>}  
4-5荧光检漏fluorescence leak detection sMpC4E  
7.   1.一般术语 d'@H@  
1-1真空干燥vacuum drying: [T?6~^m=  
1-2冷冻干燥freeze drying : )-Sl/ G  
1-3物料material: EO!cv,[a  
1-4待干燥物料material to be dried: =.2cZwxX$  
1-5干燥物料dried material : b}{9 :n/SC  
1-6湿气moisture;humidity: sT T455h)  
1-7自由湿气free moisture: n[p9$W`  
1-8结合湿气bound moisture: 2|H'j~  
1-9分湿气partial moisture: q8yJW-GA   
1-10含湿量moisture content: |Btx&'m  
1-11初始含湿量initial moisture content: K#pt8Q  
1-12最终含湿量final residual moisture: B qiq  
1-13湿度degree of moisture ,degree of humidity :  C(Gb  
1-14干燥物质dry matter : ra#)*fG,~  
1-15干燥物质含量content of dry matter: +OuG!3+w  
lNnbd?D8  
2.干燥工艺 E$zq8-p|  
2-1干燥阶段stages of drying : we).8%)'  
(1).预干燥preliminary dry: )RKhEm%Vr2  
(2).一次干燥(广义)primary drying(in general): DB= cc  
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): uN^qfJ'@ >  
(4).二次干燥secondary drying: {qdhp_~^l  
2-2.(1).接触干燥contact drying: `U>b6 {K  
(2).辐射干燥 drying by radiation : vM;dPE7  
(3).微波干燥microwave drying: v7I*W/  
(4).气相干燥vapor phase drying: 5v-;*  
(5).静态干燥static drying: BGYm]b\j[  
(6).动态干燥dynamic drying: >qGR^yvb  
2-3干燥时间drying time: 5oyMR_yl  
2-4停留时间length of stay(in the drying chamber): :s985sEv  
2-5循环时间cycle time: ^)]*10  
2-6干燥率 dessication ratio : Z8_gI[Zn  
2-7去湿速率mass flow rate of humidity: g<5Pc,  
2-8单位面积去湿速率mass flow rate of humidity per surface area: s~ZC!-[;  
2-9干燥速度 drying speed : %l P   
2-10干燥过程drying process: ?mUu(D:7D  
2-11加热温度heating temperature: dWWkO03 |  
2-12干燥温度temperature of the material being dried : S#z8H+'  
2-13干燥损失loss of material during the drying process : y:Ab5/bHy  
2-14飞尘lift off (particles): xa^HU~  
2-15堆层厚度thickness of the material: :iC\#i]6  
)/^$JYz  
3.冷冻干燥 l\y*wr`  
3-1冷冻freezing: +>%+r  
(1).静态冷冻static freezing: fmN)~-DV9`  
(2).动态冷冻dynamic freezing: 90v18k  
(3).离心冷冻centrifugal freezing: h>Pg:*N,(  
(4).滚动冷冻shell freezing: cCCplL  
(5).旋转冷冻spin-freezing: c<x6_H6[8  
(6).真空旋转冷冻vacuum spin-freezing: lR3^&d72?  
(7).喷雾冷冻spray freezing: 0'oT {iN  
(8).气流冷冻air blast freezing: W5uI(rS<6  
3-2冷冻速率rate of freezing: QQ8W;x  
3-3冷冻物料frozen material: =5eDT~=2{U  
3-4冰核ice core: .T X& X  
3-5干燥物料外壳envelope of dried matter: wLSYzz  
3-6升华表面sublimation front: @S:/6__  
3-7融化位置freezer burn: E cz"O   
P!ICno6[e  
4.真空干燥设备;真空冷冻干燥设备 U.0/r!po  
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: LP_F"?4  
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: n?tAa|_  
4-3加热表面heating surface: zSXC  
4-4物品装载面shelf : a];g  
4-5干燥器的处理能力throughput (of the vacuum drying chamber): x)5v8kgf  
4-6单位面积干燥器处理能力throughput per shelf area: L` "UeNT  
4-7冰冷凝器ice condenser: X*q C:]e  
4-8冰冷凝器的负载load of the ice condenser: aH"c0 A  
4-9冰冷凝器的额定负载rated load of the ice condenser v w;  
8.   1.一般术语 .e+UgC wi  
1-1试样sample : /)|y+<E]}  
(1).表面层surface layer: 7rg[5hP T  
(2).真实表面true surface: F'*&-l  
(3).有效表面积effective surface area: =*U24B*U93  
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: cyE2=  
(5).表面粒子密度surface particle density: %%[TM(z  
(6).单分子层monolayer: uK5Px!  
(7).表面单分子层粒子密度monolayer density: pwC/&bu  
(8).覆盖系数coverage ratio: xU"qB24]=  
1-2激发excitation: 2ow\d b  
(1).一次粒子primary particle: +60;z4y}w  
(2).一次粒子通量primary particle flux: NR@Tj]`k  
(3).一次粒子通量密度density of primary particle flux: bm.H0rHR4  
(4).一次粒子负荷primary particle load: q Q8l8  
(5).一次粒子积分负荷integral load of primary particle: ~MO C r  
(6).一次粒子的入射能量energy of the incident primary particle: b2%[9) "I.  
(7).激发体积excited volume: ,oe{@ z{*@  
(8).激发面积excited area: %"2B1^o>  
(9).激发深度excited death:  <k5~z(  
(10).二次粒子secondary particles: w(-n1oSo  
(11).二次粒子通量secondary particle flux: WG{/I/bJ_  
(12).二次粒子发射能energy of the emitted secondary particles: #!Fs[A5%  
(13).发射体积emitting volume: N-]n>E  
(14).发射面积emitting area: |L&V-f&K  
(15).发射深度emitting depth: q4N$.hpb  
(16).信息深度information depth: KA#-X2U/  
(17).平均信息深度mean information depth: Nb1lawC  
1-3入射角angle of incidence: uBgHtjmae  
1-4发射角angle of emission: )Cl&"bX  
1-5观测角observation: .Ps;O  
1-6分析表面积analyzed surface area: CcTJCuOS  
1-7产额 yield : ja2]VbB  
1-8表面层微小损伤分析minimum damage surface analysis: "kC>EtaX  
1-9表面层无损伤分析non-destructive surface analysis: 3!L)7Z/  
1-10断面深度分析 profile analysis in depth; depth profile analysis : ;|y,bo@sJJ  
1-11可观测面积observable area: .Dmvgi]  
1-12可观测立体角observable solid angle : !%@{S8IP.v  
1-13接受立体角;观测立体角angle of acceptance: VJaL$Wv)H  
1-14角分辨能力angular resolving power: :u0433z:  
1-15发光度luminosity: bJD"&h5  
1-16二次粒子探测比detection ratio of secondary particles: 5EUkp6Y  
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: j@2 hI,+  
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: `39U I7  
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: o_n.,=/cZ  
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: }2@$2YR[  
1-21本底压力base pressure: HPQ,tlp6j  
1-22工作压力working pressure: #p >PNW-  
6z*L9Vy($  
2.分析方法 < ]nI)W(  
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: uJ$,e5q  
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : LzfLCGA^  
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: v oxlo>:  
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: ;`+,gVrp  
2-3离子散射表面分析ion scattering spectroscopy: 4o8!p\a  
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: T Bco  
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: S}E@*t2 h  
2-6离子散射谱仪ion scattering spectrometer: :EjIV]e  
2-7俄歇效应Auger process: wkGF&U  
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: BR=Yte /  
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: DxBt83e  
2-10光电子谱术photoelectron spectroscopy : Fk4 3sqU6~  
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: rSk $]E]Z  
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: 0)NHjKP  
2-11光电子谱仪photoelectron spectrometer: /%7eo?@,  
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: :FSkXe2yy0  
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: K*<n<;W  
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): Ub$$wOsf  
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus
zuiyuan 2007-03-13 15:13
太好了啊,多谢了啊
zhy980730 2007-03-14 11:39
多谢,了解点.
flyinlove79 2007-03-15 17:43
不错,多谢楼主分享资料 [s:4]
飞花无心 2007-03-26 09:33
很好,谢谢楼主啊
wottlin100 2007-04-02 09:19
呵呵,楼主辛苦啦!如果有定义解释更好!
xingmeng1227 2011-10-29 12:40
呵呵,楼主辛苦啦!
zh9607109 2011-11-03 05:41
呵呵,楼主辛苦啦!
wym87 2011-11-13 23:18
谢谢楼主的分享!Thanks!
douyongming 2012-06-17 17:03
太好了啊,多谢了啊
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