首页 -> 登录 -> 注册 -> 回复主题 -> 发表主题
光行天下 -> 光学薄膜设计,工艺与设备 -> 真空术语全集 [点此返回论坛查看本帖完整版本] [打印本页]

cswmsc 2007-02-28 23:18

真空术语全集

“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 pp`U]Q5"gX  
--------------------------------------------------- HXQ rtJ  
真空术语 !;a<E:  
rY= #^S  
1.标准环境条件 standard ambient condition: 3Cl9,Z"&6$  
2.气体的标准状态 standard reference conditions forgases: iT"Itz-^#  
3.压力(压强)p pressure: u\wd<<I']  
4.帕斯卡Pa pascal: OXB-.<  
5.托Torr torr: jayoARUB  
6.标准大气压atm standard atmosphere: 8IH gsW";  
7.毫巴mbar millibar: PsnU5f)`  
8.分压力 partial pressure: t_dg$KB  
9.全压力 total pressure: YLo$n  
10.真空 vacuum: : eFc.>KoD  
11.真空度 degree of vacuum: +bn w,B><  
12.真空区域 ranges of vacuum: }"Cn kg  
13.气体 gas: zJ`(LnV  
14.非可凝气体 non-condensable gas: buXG32;  
15.蒸汽vapor: 1 %`:8  
16.饱和蒸汽压saturation vapor pressure: QR'g*Bro  
17.饱和度degree of saturation: QEKFuY<E+  
18.饱和蒸汽saturated vapor: Biy 9jIWI  
19.未饱和蒸汽unsaturated vapor: ($W 5fbu  
20.分子数密度n,m-3 number density of molecules: lz 6 Aj  
21.平均自由程ι、λ,m mean free path: $ZO<8|bW  
22.碰撞率ψ collision rate: &L]*]Xz;  
23.体积碰撞率χ volume collision rate: }C1wfZ~F~  
24.气体量G quantity of gas: M(uB ;Te  
25.气体的扩散 diffusion of gas: L#Y;a 5b  
26.扩散系数D diffusion coefficient; diffusivity: 9(WC#-,  
27.粘滞流 viscous flow: PEIr-qs%D  
28.粘滞系数η viscous factor: !?/bK[ P,  
29.泊肖叶流 poiseuille flow: *Rh .s!@4  
30.中间流 intermediate flow: G |^X:+  
31.分子流 molecular flow: I "2FTGA  
32克努曾数 number of knudsen: P0z{R[KBH  
33.分子泻流 molecular effusion; effusive flow: fZ fiiE~7J  
34.流逸 transpiration: X~3P?O]kFv  
35.热流逸 thermal transpiration: iGk{8Da<  
36.分子流率qN molecular flow rate; molecular flux: 55b |zf  
37.分子流率密度 molecular flow rate density; density of molecular flux: % cdP*  
38.质量流率qm mass flow rare: :<8V2  
39.流量qG throughput of gas: #>B1$(@  
40.体积流率qV volume flow rate: #U D  
41.摩尔流率qυ molar flow rate: YO0x68  
42.麦克斯韦速度分布 maxwellian velocity distribution: 66^t[[  
43.传输几率Pc transmission probability: 8]\h^k4f  
44.分子流导CN,UN molecular conductance: nk 9 K\I  
45.流导C,U conductance: _|:bac8pL  
46.固有流导Ci,Ui intrinsic conductance: 4>C=:w  
47.流阻W resistance: |7x^@i9w  
48.吸附 sorption: j]O[I^5  
49.表面吸附 adsorption: 6CRPdLTDf  
50.物理吸附physisorption: 12xP)*:$  
51.化学吸附 chemisorption: RsfT Ub)<  
52.吸收absorption: Ki6.'#%7  
53.适应系数α accommodation factor: )#~fS28j  
54.入射率υ impingement rate: _ D}b  
55.凝结率condensation rate: }zxh:"#K  
56.粘着率 sticking rate: {; cB?II  
57.粘着几率Ps sticking probability: P.Z<b:V!  
58.滞留时间τ residence time: 4(GgaQFO?  
59.迁移 migration: Q8cPKDB  
60.解吸 desorption: -xIhN?r)  
61.去气 degassing: kQlcT"R  
62.放气 outgassing: _hL4@ C  
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: 6XK`=ss?  
64.蒸发率 evaporation rate: rOr1H!  
65.渗透 permeation: G0Tc}_o<Y  
66.渗透率φ permeability: /~cL L  
67.渗透系数P permeability coefficient >/kG5]zxY  
2.   1.真空泵 vacuum pumps 'N ::MN  
1-1.容积真空泵 positive displacement pump: c$:=d4t5$  
⑴.气镇真空泵 gas ballast vacuum pump: "gajBY  
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: ={@ @`yP^$  
⑶.干封真空泵 dry-sealed vacuum pump: qgsE7 ]  
⑷.往复真空泵 piston vacuum pump: Yf)|ws?!  
⑸.液环真空泵 liquid ring vacuum pump:  ^-*Tn  
⑹.旋片真空泵 sliding vane rotary vacuum pump: 4qXRDsbCf  
⑺.定片真空泵 rotary piston vacuum pump: O[p^lr(B7  
⑻.滑阀真空泵 rotary plunger vacuum pump: ":^ NLBm>5  
⑼.余摆线真空泵 trochoidal vacuum pump: &|"I0|tJ  
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: fA0=Y,pzv  
⑾.罗茨真空泵 roots vacuum pump: q.sQ Z]ty9  
1-2.动量传输泵 kinetic vacuum pump: D4]B>  
⑴.牵引分子泵molecular drag pump: ,W8Iabi^  
⑵.涡轮分子泵turbo molecular pump: y{I[}$k  
⑶.喷射真空泵ejector vacuum pump: _JIUds5  
⑷.液体喷射真空泵liquid jet vacuum pump: k+r9h'd   
⑸.气体喷射真空泵gas jet vacuum pump: o/9LK  
⑹.蒸汽喷射真空泵vapor jet vacuum pump : 9Y@?xn.\  
⑺.扩散泵diffusion pump : ~G:2iSi(#  
⑻.自净化扩散泵self purifying diffusion pump: "mK i$FV  
⑼.分馏扩散泵 fractionating diffusion pump : R{KIkv  
⑽.扩散喷射泵diffusion ejector pump : \ jXN*A  
⑾.离子传输泵ion transfer pump: O0(Q0Ko  
1-3.捕集真空泵 entrapment vacuum pump: !"x7re  
⑴吸附泵adsorption pump: \j})Kul  
⑵.吸气剂泵 getter pump: #Q7x:,f  
⑶.升华(蒸发)泵 sublimation (evaporation)pump : B"Kce"!  
⑷.吸气剂离子泵getter ion pump: 6?.pKFB Z  
⑸.蒸发离子泵 evaporation ion pump: CC(*zrOd-  
⑹.溅射离子泵sputter ion pump: rbuL@= S@*  
⑺.低温泵cryopump: 3?Eoj95w!  
:htq%gPex9  
2.真空泵零部件 qM!f   
2-1.泵壳 pump case: chMc(.cN0  
2-2.入口 inlet: /`O]etr`d  
2-3.出口outlet: i$^B-  
2-4.旋片(滑片、滑阀)vane; blade : =_m9so  
2-5.排气阀discharge valve: |~b R.IA  
2-6.气镇阀gas ballast valve: =6:L+ V  
2-7.膨胀室expansion chamber: 'Ywpdzz[  
2-8.压缩室compression chamber: Z'*Z@u3  
2-9.真空泵油 vacuum pump oil: hN_f h J  
2-10.泵液 pump fluid: ^g-t#O lD?  
2-11.喷嘴 nozzle: L}jF#*Q%  
2-13.喷嘴扩张率nozzle expansion rate: 1S(\2{Ylo  
2-14.喷嘴间隙面积 nozzle clearance area : <k\H`P  
2-15.喷嘴间隙nozzle clearance: =1 BNCKT<  
2-16.射流jet: oAZF3h]po  
2-17.扩散器diffuser: #;"D)C  
2-18.扩散器喉部diffuser thoat: 0+<eRR9 -  
2-19.蒸汽导管vapor tube(pipe;chimney): b~r{J5x@  
2-20.喷嘴组件nozzle assembly: p;u 1{  
2-21.下裙skirt: o!toO&=  
ey\m)6A$  
3.附件 %t`SSW7I  
3-1阱trap: 8 ih;#I=q  
⑴.冷阱 cold trap: f7Df %&d  
⑵.吸附阱sorption trap: m UWkb  
⑶.离子阱ion trap: '-PMF~~S  
⑷.冷冻升华阱 cryosublimation trap: .-KtB(t  
3-2.挡板baffle: I& M36f  
3-3.油分离器oil separator: phgexAq  
3-4.油净化器oil purifier: M. )}e7  
3-5.冷凝器condenser: *|k;a]HT  
 &(1H!  
4.泵按工作分类 ) Kc%8hBv  
4-1.主泵main pump: Ob8B  
4-2.粗抽泵roughing vacuum pump: Cl6m$YUt  
4-3.前级真空泵backing vacuum pump: @1qdd~B}  
4-4.粗(低)真空泵 roughing(low)vacuum pump: .5Knbc  
4-5.维持真空泵holding vacuum pump: a4T~\\,dZ>  
4-6.高真空泵high vacuum pump: V@v1a@=W  
4-7.超高真空泵ultra-high vacuum pump: UK6xkra?#  
4-8.增压真空泵booster vacuum pump: ^}o7*   
&@% b?~  
5.真空泵特性 kYxl1n v  
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: [Y$5zeA  
5-2.真空泵的抽气量Q throughput of vacuum pump:。 {4: -0itG  
5-3.起动压力starting pressure: ?Ml%$z@b?  
5-4.前级压力 backing pressure : }qiF^D}  
5-5.临界前级压力 critical backing pressure: nw0L1TP/J  
5-6.最大前级压力maximum backing pressure: 69C8-fF0[I  
5-7.最大工作压力maximum working pressure: zb5N,!%r  
5-8.真空泵的极限压力ultimate pressure of a pump: -]Q(~'a  
5-9.压缩比compression ratio: n$XdSh/   
5-10.何氏系数Ho coefficient: WHUT/:?f  
5-11.抽速系数speed factor: 0%s3Mp6H  
5-12.气体的反扩散back-diffusion of gas: 3ar=1_Ar  
5-13.泵液返流back-streaming of pump fluid: ?0rOcaTY  
5-14.返流率back-streaming rate s) Cpi  
5-15.返迁移back-migration: kDzj%sm!  
5-16.爆腾bumping: OE'K5oIM  
5-17.水蒸气允许量qm water vapor tolerable load: =s'XR@  
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: e=t<H"&  
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: a-]hW=[  
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump xfq]9<  
3.   1.一般术语 )Fqy%uR8  
1-1.压力计pressure gauge: 5M%,N-P^  
1-2.真空计vacuum gauge: tu\mFHvlg  
⑴.规头(规管)gauge head: iOT)0@f'  
⑵.裸规nude gauge : Z-)[1+Hs  
⑶.真空计控制单元gauge control unit : -IBO5;2_  
⑷.真空计指示单元gauge indicating unit : UvkJ?Bu  
],8;eq%W)  
2.真空计一般分类 \\ jIl3Z  
2-1.压差式真空计differential vacuum gauge: [@m[V1D  
2-2.绝对真空计 absolute vacuum gauge: Fr-[UZ~V  
2-3.全压真空计total pressure vacuum gauge: J &!B|TS  
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: zKLn!b#>  
2-5.相对真空计relative vacuum gauge : *FV0Vy  
g b -Bxf  
3.真空计特性 $ye^uu;Z  
3-1.真空计测量范围pressure range of vacuum gauge: : *ERRSL)  
3-2.灵敏度系数sensitivity coefficient: d,W/M(S  
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): RfKc{V  
3-5.规管光电流photon current of vacuum gauge head: !#q{Z>H`  
3-6.等效氮压力equivalent nitrogen pressure : ~}BJ0P(VMc  
3-7.X射线极限值 X-ray limit: ?>sQF4 V"  
3-8.逆X射线效应anti X-ray effect: KiQ(XNx  
3-9.布利尔斯效应blears effect: >):m-I  
0pD W _  
4.全压真空计 )8;{nqoC  
4-1.液位压力计liquid level manometer: X E 9)c   
4-2.弹性元件真空计elastic element vacuum gauge: |U#DUqw  
4-3.压缩式真空计compression gauge: Y2<dM/b/  
4-4.压力天平pressure balance: tWm>j  
4-5.粘滞性真空计viscosity gauge : 7Yuk  
4-6.热传导真空计thermal conductivity vacuum gauge : A8J8u,u9  
4-7.热分子真空计thermo-molecular gauge: W9dYljnZ8i  
4-8.电离真空计ionization vacuum gauge: N/K=Ygv.  
4-9.放射性电离真空计radioactive ionization gauge: ~z5@V5 z  
4-10.冷阴极电离真空计cold cathode ionization gauge: c4\C[$  
4-11.潘宁真空计penning gauge: 3 4SA~5  
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: j")FaIM  
4-13.放电管指示器discharge tube indicator: l]H0g[  
4-14.热阴极电离真空计hot cathode ionization gauge: 4IZlUJ?j+c  
4-15.三极管式真空计triode gauge: AM'gnP>  
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: (^LS']ybc  
4-17.B-A型电离真空计Bayard-Alpert gauge: &&WDo(r3  
4-18.调制型电离真空计modulator gauge: +semfZ)  
4-19.抑制型电离真空计suppressor gauge: m4@MxQm  
4-20.分离型电离真空计extractor gauge: 7,*%[#-HE  
4-21.弯注型电离真空计bent beam gauge: >8|+%pK8<  
4-22.弹道型电离真空计 orbitron gauge : 402x<H  
4-23.热阴极磁控管真空计hot cathode magnetron gauge: jeq:  
u, eZ6  
5.分压真空计(分压分析器) z>G;(F2  
5-1.射频质谱仪radio frequency mass spectrometer: vf<UBa;Xm  
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: fD{II+T  
5-3.单极质谱仪momopole mass spectrometer: >B_n/v3P(M  
5-4.双聚焦质谱仪double focusing mass spectrometer: 9x? B5Ap[  
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: g`n;R  
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: Y9u;H^^G  
5-7.回旋质谱仪omegatron mass spectrometer: bg}+\/78#  
5-8.飞行时间质谱仪time of flight mass spectrometer: sK&,):"]R  
7S<UFj   
6.真空计校准 d8E,o7$m  
6-1.标准真空计reference gauges: %k2FPmA6  
6-2.校准系统system of calibration: cD2+hp|9  
6-3.校准系数K calibration coefficient: ]dG\j^e|  
6-4.压缩计法meleod gauge method: `XW*kxpm  
6-5.膨胀法expansion method: f"Vgefk  
6-6.流导法flow method: \0ov[T N.>  
4.   1.真空系统vacuum system $w)~xE5;  
1-1.真空机组pump system: mibpG9+d  
1-2.有油真空机组pump system used oil : JO=1ivZl  
1-3.无油真空机组oil free pump system =1Z;Ma<;  
1-4.连续处理真空设备continuous treatment vacuum plant: ` H XEZ|  
1-5.闸门式真空系统vacuum system with an air-lock: 44HiTWQS?l  
1-6.压差真空系统differentially pumped vacuum system: _y vLu j  
1-7.进气系统gas admittance system: R{?vQsLk  
>.<ooWw  
2.真空系统特性参量 %ucjMa>t  
2-1.抽气装置的抽速volume flow rate of a pumping unit : 8:thWGLN  
2-2.抽气装置的抽气量throughput of a pumping unit : ]\Xc9N8w  
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: ,PECYwegkt  
2-4.真空系统的漏气速率leak throughput of a vacuum system: DI1(`y  
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: pzhl*ss"6  
2-6.极限压力ultimate pressure: ;Lo&}U3F,!  
2-7.残余压力residual pressure: Cqx v"NN  
2-8.残余气体谱residual gas spectrum: .<#ATFmY  
2-9.基础压力base pressure: Bu3T/m  
2-10.工作压力working pressure: UXH"si:  
2-11.粗抽时间roughing time: _U0$=V  
2-12.抽气时间pump-down time: \:v$ZEDJ>  
2-13.真空系统时间常数time constant of a vacuum system: L9FHgl?  
2-14.真空系统进气时间venting time: bA@P}M)X  
P`jL]x  
3.真空容器 }T.?c9l X  
3-1.真空容器;真空室vacuum chamber: A&,,9G<  
3-2.封离真空装置sealed vacuum device: ;AIc?Cg  
3-3.真空钟罩vacuum bell jar: {2 %aCCV  
3-4.真空容器底板vacuum base plate: g%a|q~)  
3-5.真空岐管vacuum manifold: PB53myDQ  
3-6.前级真空容器(贮气罐)backing reservoir: @hif$  
3-7.真空保护层outer chamber: 4woO;Gm  
3-8.真空闸室vacuum air lock: 3s*(uS(  
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: .Cz %:%9  
eV7 u*d?  
4.真空封接和真空引入线 xHo&[{  
4-1.永久性真空封接permanent seal : nfdq y)  
4.2.玻璃分级过渡封接graded seal : gSt`%  
4-3.压缩玻璃金属封接compression glass-to-metal seal: G7@ O`N8'  
4-4.匹配式玻璃金属封接matched glass-to-metal seal: "i&"* ~  
4-5.陶瓷金属封接ceramic-to-metal seal: z42F,4Gk  
4-6.半永久性真空封接semi-permanent seal : feX^~gM  
4-7.可拆卸的真空封接demountable joint: M4m$\~zf  
4-8.液体真空封接liquid seal yT8=l"-[G  
4-9.熔融金属真空封接molten metal seal: PdeBDFWD  
4-10.研磨面搭接封接ground and lapped seal: } JiSmi6o  
4-11.真空法兰连接vacuum flange connection: '5KeL3J;  
4-12.真空密封垫vacuum-tight gasket: e]Fp=*#  
4-13.真空密封圈ring gasket: q| .dez'  
4-14.真空平密封垫flat gasket: f)Xr!7  
4-15.真空引入线feedthrough leadthrough: ]N{0:Va@D  
4-16.真空轴密封shaft seal: o0It82?RN  
4-17.真空窗vacuum window: j&R+2%  
4-18.观察窗viewing window: :6{`~=  
x@>&IBiL  
5.真空阀门 kA wNly  
5-1.真空阀门的特性characteristic of vacuum valves: >[10H8~bI/  
⑴.真空阀门的流导conductance of vacuum valves: MXD4|r(  
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: YDC&u8  
5-2.真空调节阀regulating valve: I97yt[,Yy  
5-3.微调阀 micro-adjustable valve:  #^#HuDH  
5-4.充气阀charge valve: 8, "yNq  
5-5.进气阀gas admittance valve: [ ho (z30k  
5-6.真空截止阀break valve: ;gg\;i}^  
5-7.前级真空阀backing valve: a->3`c  
5-8.旁通阀 by-pass valve: bG F7Zh9  
5-9.主真空阀main vacuum valve: PU<PhuMd  
5-10.低真空阀low vacuum valve: 2";SJF'5\  
5-11.高真空阀high vacuum valve: #/2$+x  
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: I@#;nyAj"  
5-13.手动阀manually operated valve: p[AO' xx  
5-14.气动阀pneumatically operated valve: *l&S-=]  
5-15.电磁阀electromagnetically operated valve: q`NXJf=sc  
5-16.电动阀valve with electrically motorized operation: DL'iS  
5-17.挡板阀baffle valve: e4>"92hX  
5-18.翻板阀flap valve: M<PIeKIEB  
5-19.插板阀gate valve: ``VW;l{  
5-20.蝶阀butterfly valve: "es?=  
_PFnh)o  
6.真空管路 j=?'4sF  
6-1.粗抽管路roughing line: Kf tgOG f  
6-2.前级真空管路backing line: b75 $?_+  
6-3.旁通管路;By-Pass管路 by-pass line: }Z-Z|G)#  
6-4.抽气封口接头pumping stem: wI B`%V  
6-5.真空限流件limiting conductance:       7CXW#H  
6-6.过滤器filter: #>=j79~  
5.   1.一般术语 RwI[R)k  
1-1真空镀膜vacuum coating: ew _-Eb  
1-2基片substrate: :r#)z4d5  
1-3试验基片testing substrate: B.r4$:+jb2  
1-4镀膜材料coating material: BVsD( @lX  
1-5蒸发材料evaporation material: l5xCz=dw  
1-6溅射材料sputtering material: j]|U  
1-7膜层材料(膜层材质)film material: [u}(57DS  
1-8蒸发速率evaporation rate: m %;D  
1-9溅射速率sputtering rate: >MK>gLg}!  
1-10沉积速率deposition rate: k3?rp`V1  
1-11镀膜角度coating angle: tGA :[SP  
<JMcIV837  
2.工艺 Wq*b~Lw  
2-1真空蒸膜vacuum evaporation coating: m7EcnQf  
(1).同时蒸发simultaneous evaporation: -HSs^dP`  
(2).蒸发场蒸发evaporation field evaporation: zDhB{3-Q1{  
(3).反应性真空蒸发reactive vacuum evaporation: ~x#w<0e>  
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: DejA4XdW  
(5).直接加热的蒸发direct heating evaporation: m,C1J%{^  
(6).感应加热蒸发induced heating evaporation: \`V;z~@iA  
(7).电子束蒸发electron beam evaporation: 8 C[/dH  
(8).激光束蒸发laser beam evaporation: q9w~A-Oh`1  
(9).间接加热的蒸发indirect heating evaporation: 2(5ebe[  
(10).闪蒸flash evaportion: `w I/0  
2-2真空溅射vacuum sputtering: _@S`5;4x  
(1).反应性真空溅射 reactive vacuum sputtering: m]i @ +C  
(2).偏压溅射bias sputtering: !EUan  
(3).直流二级溅射direct current diode sputtering: ARcB'z\r  
(4).非对称性交流溅射asymmtric alternate current sputtering:  w 4[{2  
(5).高频二极溅射high frequency diode sputtering: .920{G?l5  
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: `Al;vVMRO  
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: 4_Dp+^JF  
(8).离子束溅射ion beam sputtering: T~Q JO0  
(9).辉光放电清洗glow discharge cleaning: g&/T*L  
2-3物理气相沉积PVD physical vapor deposition: gbVdOm  
2-4化学气相沉积CVD chemical vapor deposition: __mF ?m  
2-5磁控溅射magnetron sputtering: ODZ|bN0>  
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: 4pw6bK,s2\  
2-7空心阴极离子镀HCD hollow cathode discharge deposition: 7{&|;U  
2-8电弧离子镀arc discharge deposition: =zQN[  
KYzv$oK  
3.专用部件 y;/VB,4V  
3-1镀膜室coating chamber: H":oNpfb  
3-2蒸发器装置evaporator device: (#+^&1  
3-3蒸发器evaporator: boDt`2=  
3-4直接加热式蒸发器evaporator by direct heat: !K|5bK  
3-5间接加热式蒸发器evaporator by indirect heat: jy-{~xdg[  
3-7溅射装置sputtering device: I? ,>DHUX  
3-8靶target: Lemui)  
3-10时控挡板timing shutter: M4as  
3-11掩膜mask: )1X#*mCxk  
3-12基片支架substrate holder: &b:1I 7Cp*  
3-13夹紧装置clamp: 8OgLn?"P  
3-14换向装置reversing device: '],J$ge  
3-15基片加热装置substrate heating device: >2~=)L  
3-16基片冷却装置substrate colding device: ]+X@ 7  
0_88V  
4.真空镀膜设备 Gz .|]:1  
4-1真空镀膜设备vacuum coating plant: 4?B\O`sy.  
(1).真空蒸发镀膜设备vacuum evaporation coating plant: GSH>7!.#  
(2).真空溅射镀膜设备vacuum sputtering coating plant: F$)[kP,wtO  
4-2连续镀膜设备continuous coating plant: O({2ivX  
4-3半连续镀膜设备semi- continuous coating plant 1I:+MBGin  
6.   1.漏孔 ~3<> 3p  
1-1漏孔leaks: EFz&N\2  
1-2通道漏孔channel leak: Mo^ od<  
1-3薄膜漏孔membrane leak: ;+"+3  
1-4分子漏孔molecular leak: % >=!p  
1-5粘滞漏孔vixcous leak: ]q4rlT.i  
1-6校准漏孔calibrated leak: FJMrs[  
1-7标准漏孔reference leak : wb0L.'jyR)  
1-8虚漏virtual leak: _*f`iu:`  
1-9漏率leak rate: q<M2,YrbAI  
1-10标准空气漏率standard air leak rate: AIZ]jq  
1-11等值标准空气漏率equivalent standard air leak rate: v?geCe=ng  
1-12探索(示漏)气体: @{2 5xTt  
}4,L%$@n  
2.本底 ?` ?)QE8  
2-1本底background: 4%4 }5UYN  
2-2探索气体本底search gas background : %KLpig  
2-3漂移drift: J\b^)  
2-4噪声noise: c24dSNJg,  
F1yqxWHeo  
3.检漏仪 aht[4(XH5  
3-1检漏仪leak detector: ~nay"g:  
3-2高频火花检漏仪H.F. spark leak detector: JJN.ugT}1  
3-3卤素检漏仪halide leak detector: t7aefV&_,  
3-4氦质谱检漏仪helium mass spectrometer leak detector: 2fL;-\!y(  
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: Y^wW2-,m  
1n;0?MIZ  
4.检漏 = %TWX[w  
4-1气泡检漏leak detection by bubbles: ~x1$h#Cx'  
4-2氨检漏leak detection by ammonia: ;@oN s-  
4-3升压检漏leak detection of rise pressure: `r9!zffyS  
4-4放射性同位素检漏radioactive isotope leak detection: W:pIPDx1=!  
4-5荧光检漏fluorescence leak detection #cI{Fe0h  
7.   1.一般术语 , s"^kFl  
1-1真空干燥vacuum drying: vg32y /l]S  
1-2冷冻干燥freeze drying : P/W XaE4  
1-3物料material: T4Pgbop  
1-4待干燥物料material to be dried: 9sYMSc~Bm  
1-5干燥物料dried material : )"7iJb<E  
1-6湿气moisture;humidity: ~qTx|",  
1-7自由湿气free moisture: 3YR!Mq$|~  
1-8结合湿气bound moisture: -lY6|79bF  
1-9分湿气partial moisture: nksLWfpG?B  
1-10含湿量moisture content: '-Vt|O_Q  
1-11初始含湿量initial moisture content: m#| 9hMu  
1-12最终含湿量final residual moisture: Swig;`  
1-13湿度degree of moisture ,degree of humidity : &w_j/nW^'  
1-14干燥物质dry matter : Ng2twfSl$  
1-15干燥物质含量content of dry matter: Yg||{  
<L8'!q}  
2.干燥工艺 :(P9mt  
2-1干燥阶段stages of drying : ,is3&9  
(1).预干燥preliminary dry: d:C'H8  
(2).一次干燥(广义)primary drying(in general): kTOzSiq  
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): 0z6R'Kjy A  
(4).二次干燥secondary drying: NJWA3zz   
2-2.(1).接触干燥contact drying: 1#< '&Lr  
(2).辐射干燥 drying by radiation : Nk? ^1n$  
(3).微波干燥microwave drying: *av<E  
(4).气相干燥vapor phase drying: B9jC?I |`  
(5).静态干燥static drying: h+g_rvIG*  
(6).动态干燥dynamic drying: *v!9MU9[(  
2-3干燥时间drying time: |4;Fd9q^m  
2-4停留时间length of stay(in the drying chamber): `EA\u]PwQ  
2-5循环时间cycle time: wDal5GJp  
2-6干燥率 dessication ratio : k8&;lgO '  
2-7去湿速率mass flow rate of humidity: =(j1rW!  
2-8单位面积去湿速率mass flow rate of humidity per surface area: {HltvO%8  
2-9干燥速度 drying speed : 'CM|@Zz%  
2-10干燥过程drying process: Q4#m\KK;i9  
2-11加热温度heating temperature: y}" O U  
2-12干燥温度temperature of the material being dried : J?"B%B5c  
2-13干燥损失loss of material during the drying process : NX*Q F+  
2-14飞尘lift off (particles): BU/"rv"(Fg  
2-15堆层厚度thickness of the material:  dVtG/0  
%} SrL*  
3.冷冻干燥 /$Nsd  
3-1冷冻freezing: WUn]F~Lt  
(1).静态冷冻static freezing: AUG#_HE]k  
(2).动态冷冻dynamic freezing: 6,8h]?u.  
(3).离心冷冻centrifugal freezing: r= `Jn6@  
(4).滚动冷冻shell freezing: U2#"p   
(5).旋转冷冻spin-freezing: {T$9?`h~M  
(6).真空旋转冷冻vacuum spin-freezing: v!~fs)cdE|  
(7).喷雾冷冻spray freezing: r,73C/*&/  
(8).气流冷冻air blast freezing: i &nSh ]KK  
3-2冷冻速率rate of freezing: f643#1  
3-3冷冻物料frozen material: y&$A+peJ1  
3-4冰核ice core: nV|EQs4(  
3-5干燥物料外壳envelope of dried matter:  ~d.Y&b  
3-6升华表面sublimation front: 5uGq%(24  
3-7融化位置freezer burn: X]TG<r  
*a M=Z+  
4.真空干燥设备;真空冷冻干燥设备 hR?{3d#x2  
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: 2~)`N>@  
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: ;WQve_\  
4-3加热表面heating surface: 0*3R=7_},o  
4-4物品装载面shelf : lfow1WRF  
4-5干燥器的处理能力throughput (of the vacuum drying chamber): hED}h![  
4-6单位面积干燥器处理能力throughput per shelf area: 2*& ^v  
4-7冰冷凝器ice condenser: NIry)'"  
4-8冰冷凝器的负载load of the ice condenser: `g=J%p  
4-9冰冷凝器的额定负载rated load of the ice condenser Jq-]7N%k/  
8.   1.一般术语 rpha!h>w1%  
1-1试样sample : AO4U}?  
(1).表面层surface layer: kiaw4_  
(2).真实表面true surface: >1Ibc=}g  
(3).有效表面积effective surface area: l_d5oAh   
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: L,/%f<wd  
(5).表面粒子密度surface particle density: z43M] P<  
(6).单分子层monolayer: h7Kzq{$  
(7).表面单分子层粒子密度monolayer density: Dw.J2>uj  
(8).覆盖系数coverage ratio: }j)e6>K])  
1-2激发excitation: 194)QeoFw  
(1).一次粒子primary particle: Ax7[;|2  
(2).一次粒子通量primary particle flux: A}9`S6@@  
(3).一次粒子通量密度density of primary particle flux: gPI ?C76  
(4).一次粒子负荷primary particle load: oJz^|dW  
(5).一次粒子积分负荷integral load of primary particle: PJ%C N(0  
(6).一次粒子的入射能量energy of the incident primary particle: 1.GQau~  
(7).激发体积excited volume: )Nw8O{\  
(8).激发面积excited area: B~ GbF*j  
(9).激发深度excited death: r q].UCj  
(10).二次粒子secondary particles: U%QI a TN*  
(11).二次粒子通量secondary particle flux: Xl#ggub?  
(12).二次粒子发射能energy of the emitted secondary particles: aB&&YlR=n<  
(13).发射体积emitting volume: *] ) `z8Ox  
(14).发射面积emitting area: K+3=tk]W9u  
(15).发射深度emitting depth: G5 WVr$  
(16).信息深度information depth: 14yv$,  
(17).平均信息深度mean information depth: 8OU\V5i[,q  
1-3入射角angle of incidence: FTUv IbT  
1-4发射角angle of emission: kn 4`Fa;)O  
1-5观测角observation: !l8PDjAE  
1-6分析表面积analyzed surface area: +a+Om73B2  
1-7产额 yield : dR,fXQm  
1-8表面层微小损伤分析minimum damage surface analysis: kdeWip6Y  
1-9表面层无损伤分析non-destructive surface analysis: z Rr*7G  
1-10断面深度分析 profile analysis in depth; depth profile analysis : ]2KihP8z x  
1-11可观测面积observable area: _]H&,</  
1-12可观测立体角observable solid angle : YU'E@t5  
1-13接受立体角;观测立体角angle of acceptance:  ZBp/sm  
1-14角分辨能力angular resolving power: hRhe& ,v  
1-15发光度luminosity: }19\.z&J  
1-16二次粒子探测比detection ratio of secondary particles: htF] W|z  
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: 3XV/Fb}!(i  
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: m;QMQeGz  
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: 9WyhZoPD*  
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: @*( (1(q  
1-21本底压力base pressure: '5$b-x6F  
1-22工作压力working pressure: )jP1or  
jQB9j  
2.分析方法 /h3RmUy   
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: NC(~l  
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : @Jw-8Q{  
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: (O3nL.  
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: u^  ~W+  
2-3离子散射表面分析ion scattering spectroscopy: @\#td5'  
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: %Q|Atgp  
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: cVF "!.  
2-6离子散射谱仪ion scattering spectrometer: _q-*7hCQ`  
2-7俄歇效应Auger process: jNk%OrP]  
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: T_4/C2  
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: ud('0 r',D  
2-10光电子谱术photoelectron spectroscopy : S<Xf>-8w  
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: &%J08l6  
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: ( a#BV}=  
2-11光电子谱仪photoelectron spectrometer: aPL+=58r  
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: 4.t-i5  
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: 9\7en%(M  
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): C?eH]hkZ3  
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus
zuiyuan 2007-03-13 15:13
太好了啊,多谢了啊
zhy980730 2007-03-14 11:39
多谢,了解点.
flyinlove79 2007-03-15 17:43
不错,多谢楼主分享资料 [s:4]
飞花无心 2007-03-26 09:33
很好,谢谢楼主啊
wottlin100 2007-04-02 09:19
呵呵,楼主辛苦啦!如果有定义解释更好!
xingmeng1227 2011-10-29 12:40
呵呵,楼主辛苦啦!
zh9607109 2011-11-03 05:41
呵呵,楼主辛苦啦!
wym87 2011-11-13 23:18
谢谢楼主的分享!Thanks!
douyongming 2012-06-17 17:03
太好了啊,多谢了啊
查看本帖完整版本: [-- 真空术语全集 --] [-- top --]

Copyright © 2005-2026 光行天下 蜀ICP备06003254号-1 网站统计