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cswmsc 2007-02-28 23:18

真空术语全集

“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 Gdnk1_D>  
--------------------------------------------------- |GE3.g  
真空术语 ;&e5.K+.Z  
g. f!Uc{  
1.标准环境条件 standard ambient condition: !;lA+O-t  
2.气体的标准状态 standard reference conditions forgases: $/,qw   
3.压力(压强)p pressure: :Oo  
4.帕斯卡Pa pascal: _6THyj$f  
5.托Torr torr: * b>W  
6.标准大气压atm standard atmosphere: z;1tJ  
7.毫巴mbar millibar: k#`.!yI,  
8.分压力 partial pressure: `ea;qWy  
9.全压力 total pressure: U6FM`w<  
10.真空 vacuum: `d6 {Tli  
11.真空度 degree of vacuum: z_!P0`  
12.真空区域 ranges of vacuum: KXcG;b[7n  
13.气体 gas: oLk>|J  
14.非可凝气体 non-condensable gas: e%x$Cb:znn  
15.蒸汽vapor: V'pNo&O=  
16.饱和蒸汽压saturation vapor pressure: \l_RyMi  
17.饱和度degree of saturation: Eag->mw/~  
18.饱和蒸汽saturated vapor: n?@3R#4D3  
19.未饱和蒸汽unsaturated vapor: #^<7VS!x  
20.分子数密度n,m-3 number density of molecules: t-dN:1  
21.平均自由程ι、λ,m mean free path: h3a HCr E  
22.碰撞率ψ collision rate: &bh?jW  
23.体积碰撞率χ volume collision rate: 9cFFQM|o  
24.气体量G quantity of gas: ^C>i(j&  
25.气体的扩散 diffusion of gas: @z$V(}(O^  
26.扩散系数D diffusion coefficient; diffusivity: 65N;PH59D  
27.粘滞流 viscous flow: Rb<aCX  
28.粘滞系数η viscous factor: zF<*h~  
29.泊肖叶流 poiseuille flow: dTyTj|"x{  
30.中间流 intermediate flow: 82Nh;5T r  
31.分子流 molecular flow: f'Wc_ L)  
32克努曾数 number of knudsen: 56u'XMB?  
33.分子泻流 molecular effusion; effusive flow: ?A(=%c|,g  
34.流逸 transpiration: Mp?Ev.  
35.热流逸 thermal transpiration: /-E>5wU  
36.分子流率qN molecular flow rate; molecular flux: "vH@b_>9|  
37.分子流率密度 molecular flow rate density; density of molecular flux: _.J{U0N  
38.质量流率qm mass flow rare: O-wR48Q  
39.流量qG throughput of gas: CY)Wuv ^  
40.体积流率qV volume flow rate: :~:(49l  
41.摩尔流率qυ molar flow rate: ^o!K0 t*  
42.麦克斯韦速度分布 maxwellian velocity distribution: &xr?yd  
43.传输几率Pc transmission probability: &k&tkE  
44.分子流导CN,UN molecular conductance: ma~WJ0LM\  
45.流导C,U conductance: -}2q-  
46.固有流导Ci,Ui intrinsic conductance: P~;NwHZ?k  
47.流阻W resistance: VyCBJK  
48.吸附 sorption: $b\Gl=YX^  
49.表面吸附 adsorption: {#=q[jVi%1  
50.物理吸附physisorption: rv;w`f  
51.化学吸附 chemisorption: /QHvwaW[  
52.吸收absorption: >T.U\,om7  
53.适应系数α accommodation factor: KLsTgo|J  
54.入射率υ impingement rate: W=mh*G3y  
55.凝结率condensation rate: [@#P3g\:>W  
56.粘着率 sticking rate: M=26@ n  
57.粘着几率Ps sticking probability: $Xk1'AzB8  
58.滞留时间τ residence time: vwZ2kk!|i  
59.迁移 migration: =B*,S#r  
60.解吸 desorption: L\nWhmwl  
61.去气 degassing: >8t3a-/  
62.放气 outgassing: hX$k8 o0  
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: pb$U~TvzhM  
64.蒸发率 evaporation rate: /V46:`V  
65.渗透 permeation: Jnb>u*7,  
66.渗透率φ permeability: z^{VqC*o+  
67.渗透系数P permeability coefficient 6T"[M  
2.   1.真空泵 vacuum pumps qW][Q%'lt  
1-1.容积真空泵 positive displacement pump: pHni"i T  
⑴.气镇真空泵 gas ballast vacuum pump: CO0Nq/@  
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: G~8C7$0z  
⑶.干封真空泵 dry-sealed vacuum pump: "%<Oadz ap  
⑷.往复真空泵 piston vacuum pump: 3VB{Qj  
⑸.液环真空泵 liquid ring vacuum pump: 0>4:(t7h\  
⑹.旋片真空泵 sliding vane rotary vacuum pump: DWHl,w;[z`  
⑺.定片真空泵 rotary piston vacuum pump: 6Ei>VcN4a  
⑻.滑阀真空泵 rotary plunger vacuum pump: n_)d4d zl  
⑼.余摆线真空泵 trochoidal vacuum pump: j?g{*M  
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: '2/48j X5  
⑾.罗茨真空泵 roots vacuum pump: Q6RBZucv  
1-2.动量传输泵 kinetic vacuum pump: opjrU$<]N  
⑴.牵引分子泵molecular drag pump: #";(&|7  
⑵.涡轮分子泵turbo molecular pump: "[BuQ0(g  
⑶.喷射真空泵ejector vacuum pump: ] 5YG*sD4  
⑷.液体喷射真空泵liquid jet vacuum pump: KFLIO>hE  
⑸.气体喷射真空泵gas jet vacuum pump: -1:yqF.x  
⑹.蒸汽喷射真空泵vapor jet vacuum pump : J ;i/X;^  
⑺.扩散泵diffusion pump : ^B1Q";# B^  
⑻.自净化扩散泵self purifying diffusion pump: D/9&pRsO  
⑼.分馏扩散泵 fractionating diffusion pump : K {!eHTU  
⑽.扩散喷射泵diffusion ejector pump : (VWTYG7  
⑾.离子传输泵ion transfer pump:  z4&|~-m,  
1-3.捕集真空泵 entrapment vacuum pump: tl CgW)<?  
⑴吸附泵adsorption pump: Tr(w~et  
⑵.吸气剂泵 getter pump: *'QD!Tc  
⑶.升华(蒸发)泵 sublimation (evaporation)pump : `Q, moz  
⑷.吸气剂离子泵getter ion pump: G3OqRH  
⑸.蒸发离子泵 evaporation ion pump: |TkMrj0  
⑹.溅射离子泵sputter ion pump: #QXB2x<*  
⑺.低温泵cryopump: SE;Jl[PgcL  
pI( OI>~3  
2.真空泵零部件 n>+M4Zb  
2-1.泵壳 pump case: {&4+W=0 n  
2-2.入口 inlet: hJkIFyQ{j  
2-3.出口outlet: 0V}%'Ec<e  
2-4.旋片(滑片、滑阀)vane; blade : /$%apci8  
2-5.排气阀discharge valve: ,+oQ 5c(f  
2-6.气镇阀gas ballast valve: 3EI$tP@4  
2-7.膨胀室expansion chamber: DdN{=}A  
2-8.压缩室compression chamber: \6T&gX  
2-9.真空泵油 vacuum pump oil: E/Q[J.$o  
2-10.泵液 pump fluid: =xw) [  
2-11.喷嘴 nozzle: TC<_I0jCh  
2-13.喷嘴扩张率nozzle expansion rate: {}s7q|$  
2-14.喷嘴间隙面积 nozzle clearance area : Oq|RMl  
2-15.喷嘴间隙nozzle clearance: f]qP xRw  
2-16.射流jet: @tM1e<  
2-17.扩散器diffuser: 4@.qM6 \\q  
2-18.扩散器喉部diffuser thoat: ?N~rms e  
2-19.蒸汽导管vapor tube(pipe;chimney): DKPX_::  
2-20.喷嘴组件nozzle assembly: X<OwB-N  
2-21.下裙skirt: {uM*.]  
^$FHI_  
3.附件 MQG(n+c  
3-1阱trap: \uc]+nV!o  
⑴.冷阱 cold trap: 4@u*#Bp`|  
⑵.吸附阱sorption trap: P bj&l0C  
⑶.离子阱ion trap: d!D#:l3;  
⑷.冷冻升华阱 cryosublimation trap: ==RYf*d  
3-2.挡板baffle: }:])1!a  
3-3.油分离器oil separator: 5hr$tkk L  
3-4.油净化器oil purifier: nVoL7ew+  
3-5.冷凝器condenser: `%ZM(9T  
@a'Rn  
4.泵按工作分类 `1=n H/E  
4-1.主泵main pump: N<zD<q  
4-2.粗抽泵roughing vacuum pump: \'xF\V  
4-3.前级真空泵backing vacuum pump: `WboM\u  
4-4.粗(低)真空泵 roughing(low)vacuum pump: bE74Ui  
4-5.维持真空泵holding vacuum pump: ]]Sz|6P  
4-6.高真空泵high vacuum pump: }Y[xj{2$O  
4-7.超高真空泵ultra-high vacuum pump: ^":UkPFCx:  
4-8.增压真空泵booster vacuum pump: 4QARrG%  
|C301ENZ  
5.真空泵特性 fa//~$#"{L  
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: i+ ]3J/J  
5-2.真空泵的抽气量Q throughput of vacuum pump:。 7?9QlUO  
5-3.起动压力starting pressure: C< 3` ]l  
5-4.前级压力 backing pressure : tBd-?+~7  
5-5.临界前级压力 critical backing pressure: $Ypt /`  
5-6.最大前级压力maximum backing pressure: T`mG+"O  
5-7.最大工作压力maximum working pressure: 7hQXGY,q  
5-8.真空泵的极限压力ultimate pressure of a pump: { 0RwjPYp  
5-9.压缩比compression ratio: 0ft81RK  
5-10.何氏系数Ho coefficient: uD0T()J.P5  
5-11.抽速系数speed factor: pX8TzmIB0  
5-12.气体的反扩散back-diffusion of gas: Q'5]E{1<'n  
5-13.泵液返流back-streaming of pump fluid: lD)ZMaaS3  
5-14.返流率back-streaming rate j #G4A%_  
5-15.返迁移back-migration: w<#/ngI2  
5-16.爆腾bumping: :[xFp}w{  
5-17.水蒸气允许量qm water vapor tolerable load: $REz {xgA=  
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: MKPxF@N(  
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: ,P ~jO  
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump He vZ}.  
3.   1.一般术语 @`xR1pXQ  
1-1.压力计pressure gauge: .;}vp*  
1-2.真空计vacuum gauge: NXo$rf:  
⑴.规头(规管)gauge head: fm]mqO  
⑵.裸规nude gauge : 3V=wW{;x  
⑶.真空计控制单元gauge control unit : +-~8t^  
⑷.真空计指示单元gauge indicating unit :  PgI H(  
=hFIH\x  
2.真空计一般分类 e}>3<Dh  
2-1.压差式真空计differential vacuum gauge: ) rw!. )  
2-2.绝对真空计 absolute vacuum gauge: "`g5iUHqUl  
2-3.全压真空计total pressure vacuum gauge: D=1:-aLP7  
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: >n$V1U&/  
2-5.相对真空计relative vacuum gauge : 7" Qj(N  
#djby}hi  
3.真空计特性 XX&4OV,^%D  
3-1.真空计测量范围pressure range of vacuum gauge: eFKF9m  
3-2.灵敏度系数sensitivity coefficient: .JCd:'-  
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): xnP@ h  
3-5.规管光电流photon current of vacuum gauge head: D[/h7Ha  
3-6.等效氮压力equivalent nitrogen pressure : 42$ pvw<  
3-7.X射线极限值 X-ray limit: 3fGL(5|_  
3-8.逆X射线效应anti X-ray effect: M`  V<`  
3-9.布利尔斯效应blears effect: gZq _BY_U  
tE'^O< K  
4.全压真空计 R*0]*\C z  
4-1.液位压力计liquid level manometer: jRiXN %  
4-2.弹性元件真空计elastic element vacuum gauge: W_.WMbT  
4-3.压缩式真空计compression gauge: Gb!R>WY  
4-4.压力天平pressure balance: >PuQ{T I  
4-5.粘滞性真空计viscosity gauge : %\"<lyD  
4-6.热传导真空计thermal conductivity vacuum gauge : MHj RPh  
4-7.热分子真空计thermo-molecular gauge: Th_PmkvC  
4-8.电离真空计ionization vacuum gauge: BSH2Kq  
4-9.放射性电离真空计radioactive ionization gauge: #ZkT![ `  
4-10.冷阴极电离真空计cold cathode ionization gauge: hXnfZx%  
4-11.潘宁真空计penning gauge: C&|K7Zp0v  
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: "w&IO}j;=  
4-13.放电管指示器discharge tube indicator: n)|{tb^  
4-14.热阴极电离真空计hot cathode ionization gauge: %(&$CmS@  
4-15.三极管式真空计triode gauge: &cGa~#-u  
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: ] M`%@ps  
4-17.B-A型电离真空计Bayard-Alpert gauge: 8+i=u" <  
4-18.调制型电离真空计modulator gauge: w)N~u%  
4-19.抑制型电离真空计suppressor gauge: gFpub_  
4-20.分离型电离真空计extractor gauge: .Ht;xq  
4-21.弯注型电离真空计bent beam gauge: Ie4\d2tQ;  
4-22.弹道型电离真空计 orbitron gauge : S-'R84M,F  
4-23.热阴极磁控管真空计hot cathode magnetron gauge: XEegUTs  
mUj_V#v  
5.分压真空计(分压分析器) -*A1[Z ?  
5-1.射频质谱仪radio frequency mass spectrometer: hT`fAn_  
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: ui RO,B}z  
5-3.单极质谱仪momopole mass spectrometer: : &bJMzB  
5-4.双聚焦质谱仪double focusing mass spectrometer: \VpN:RI  
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: EDT9O  
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: GXaPfC0-y  
5-7.回旋质谱仪omegatron mass spectrometer: o_8Wnx^  
5-8.飞行时间质谱仪time of flight mass spectrometer: ?lE&o w  
dBw7l}  
6.真空计校准 3{)!T;Wd  
6-1.标准真空计reference gauges: fUMjLA|*I<  
6-2.校准系统system of calibration: !\VzX  
6-3.校准系数K calibration coefficient: e@Mg9VwDc  
6-4.压缩计法meleod gauge method: w_h{6Kc<  
6-5.膨胀法expansion method: LLc^SP j  
6-6.流导法flow method: J#W*,%8O  
4.   1.真空系统vacuum system <?nz>vz  
1-1.真空机组pump system: +E^2]F7Zk  
1-2.有油真空机组pump system used oil : [tT_ z<e`  
1-3.无油真空机组oil free pump system R_D&"&   
1-4.连续处理真空设备continuous treatment vacuum plant: $DXO7;#  
1-5.闸门式真空系统vacuum system with an air-lock: $K.DLqDt  
1-6.压差真空系统differentially pumped vacuum system: 9a[1s|>w-  
1-7.进气系统gas admittance system: )DmydyQ'  
5o0n4W  
2.真空系统特性参量 ~!S/{Un   
2-1.抽气装置的抽速volume flow rate of a pumping unit : n }b{u@$  
2-2.抽气装置的抽气量throughput of a pumping unit : ic5af"/(\  
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: 3?K+wg s  
2-4.真空系统的漏气速率leak throughput of a vacuum system: R?zlZS.~  
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: &?@[bD'T  
2-6.极限压力ultimate pressure: ul3~!9F5F  
2-7.残余压力residual pressure: !E&l=* lM.  
2-8.残余气体谱residual gas spectrum: t>Ye*eR*`U  
2-9.基础压力base pressure: 4#{f8  
2-10.工作压力working pressure: O|S,="h"}  
2-11.粗抽时间roughing time: (/2rj[F&  
2-12.抽气时间pump-down time: gg.]\#3g  
2-13.真空系统时间常数time constant of a vacuum system: @ <3E `j'p  
2-14.真空系统进气时间venting time: tA^+RO4  
dG7d}0Ou'  
3.真空容器 Z^]jy>dj  
3-1.真空容器;真空室vacuum chamber: m 62Zta  
3-2.封离真空装置sealed vacuum device: b}fC' h  
3-3.真空钟罩vacuum bell jar: J6[}o4Z  
3-4.真空容器底板vacuum base plate: s >:gL,%c  
3-5.真空岐管vacuum manifold: 7m  ou  
3-6.前级真空容器(贮气罐)backing reservoir: 'Kk/ J+6U  
3-7.真空保护层outer chamber: Y(t /=3c[  
3-8.真空闸室vacuum air lock: k,$/l1D  
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: T_!F I29  
L@z[b^  
4.真空封接和真空引入线 ;e*okYM  
4-1.永久性真空封接permanent seal : i9Beap/t$  
4.2.玻璃分级过渡封接graded seal : Ux1j+}y  
4-3.压缩玻璃金属封接compression glass-to-metal seal: 2Y%7.YX"  
4-4.匹配式玻璃金属封接matched glass-to-metal seal: c0Bqm  
4-5.陶瓷金属封接ceramic-to-metal seal: K>vl o/#!  
4-6.半永久性真空封接semi-permanent seal : t #Kucde  
4-7.可拆卸的真空封接demountable joint: uB^"A ;0v  
4-8.液体真空封接liquid seal \#JXch  
4-9.熔融金属真空封接molten metal seal: !yT=*Cj4  
4-10.研磨面搭接封接ground and lapped seal: ^SsdM#E  
4-11.真空法兰连接vacuum flange connection: vmEn$`&2t  
4-12.真空密封垫vacuum-tight gasket: 1X2|jj  
4-13.真空密封圈ring gasket: p7 !y#  
4-14.真空平密封垫flat gasket: h<)ceD<,  
4-15.真空引入线feedthrough leadthrough:  5k@T{  
4-16.真空轴密封shaft seal: u:']jw=f  
4-17.真空窗vacuum window: oQrfrA&=M  
4-18.观察窗viewing window: \9@}0}%`  
Y- Q)sv  
5.真空阀门 mhv6.W@  
5-1.真空阀门的特性characteristic of vacuum valves: h^_^)P+;  
⑴.真空阀门的流导conductance of vacuum valves: Go1xyd:k  
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: MM]0}65KG  
5-2.真空调节阀regulating valve: 5Pq6X  
5-3.微调阀 micro-adjustable valve: [T4{K &  
5-4.充气阀charge valve: 4W|cIcU W  
5-5.进气阀gas admittance valve: mi$C%~]5m  
5-6.真空截止阀break valve: u$[&'D6  
5-7.前级真空阀backing valve: tV_3!7m0$  
5-8.旁通阀 by-pass valve: %]Nm'"Y`U  
5-9.主真空阀main vacuum valve: %z.V$2  
5-10.低真空阀low vacuum valve: Ym"^Ds}  
5-11.高真空阀high vacuum valve: Du +_dr^4  
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: }5n\us  
5-13.手动阀manually operated valve: n^$Q^[:Z  
5-14.气动阀pneumatically operated valve: -(e=S^36  
5-15.电磁阀electromagnetically operated valve: GOGS"q  
5-16.电动阀valve with electrically motorized operation: wLiPkW  
5-17.挡板阀baffle valve: .SmG)5U]  
5-18.翻板阀flap valve: Ek_&E7  
5-19.插板阀gate valve: ?/1LueC:  
5-20.蝶阀butterfly valve: {`k&Q +gY  
FeS ,TQ4j  
6.真空管路 =w;-4  
6-1.粗抽管路roughing line: #g@4c3um|  
6-2.前级真空管路backing line: o3\^9-jmp  
6-3.旁通管路;By-Pass管路 by-pass line: +w(6#R8u5  
6-4.抽气封口接头pumping stem: nC !NZ  
6-5.真空限流件limiting conductance:       9{ge U9&Z  
6-6.过滤器filter: o<p4r}*AVJ  
5.   1.一般术语 sw}^@0ua=  
1-1真空镀膜vacuum coating: RTvOaZ  
1-2基片substrate: *2N0r2t&  
1-3试验基片testing substrate: ]b>XN8y.  
1-4镀膜材料coating material: ~N}Zr$D  
1-5蒸发材料evaporation material: v!DK.PZbi  
1-6溅射材料sputtering material: t'J 4zV  
1-7膜层材料(膜层材质)film material: rNicg]:\x  
1-8蒸发速率evaporation rate: Z_dL@\#|  
1-9溅射速率sputtering rate: %-$ :/ N  
1-10沉积速率deposition rate: ^8bc<c:P  
1-11镀膜角度coating angle: ]8OmYU%6V  
b?cO+PY01  
2.工艺 kI04<!  
2-1真空蒸膜vacuum evaporation coating: +:jv )4^O  
(1).同时蒸发simultaneous evaporation: ,4XOe,WQ  
(2).蒸发场蒸发evaporation field evaporation: N"RPCd_  
(3).反应性真空蒸发reactive vacuum evaporation: rx;;|eb,  
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: 7JuHa /Mv  
(5).直接加热的蒸发direct heating evaporation: 7LM&3mA<  
(6).感应加热蒸发induced heating evaporation: ;5$ GJu(  
(7).电子束蒸发electron beam evaporation: |;(P+Q4lB  
(8).激光束蒸发laser beam evaporation: uVhzJu.  
(9).间接加热的蒸发indirect heating evaporation: |"KdW#.x  
(10).闪蒸flash evaportion: YM NLn9  
2-2真空溅射vacuum sputtering: FIAmAZH}_  
(1).反应性真空溅射 reactive vacuum sputtering:  u+z  
(2).偏压溅射bias sputtering: hyJ&~i0P{J  
(3).直流二级溅射direct current diode sputtering: (RrC<5"  
(4).非对称性交流溅射asymmtric alternate current sputtering: K0o${%'@7  
(5).高频二极溅射high frequency diode sputtering: GV ) "[O  
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: =_3rc\0  
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: uTz>I'f  
(8).离子束溅射ion beam sputtering: lb*;Z7fx<'  
(9).辉光放电清洗glow discharge cleaning: qf ]le]J  
2-3物理气相沉积PVD physical vapor deposition: @p/"]zf  
2-4化学气相沉积CVD chemical vapor deposition: 9An \uH)mL  
2-5磁控溅射magnetron sputtering: Uc ,..  
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: FqGMHM\J  
2-7空心阴极离子镀HCD hollow cathode discharge deposition:  Y%y  
2-8电弧离子镀arc discharge deposition: Y`$\o  
z0a`*3 -2  
3.专用部件 I`jG  
3-1镀膜室coating chamber: xQzW6H|  
3-2蒸发器装置evaporator device: (M u;U!M"P  
3-3蒸发器evaporator: +>2.O2)%q  
3-4直接加热式蒸发器evaporator by direct heat: ez%:>r4  
3-5间接加热式蒸发器evaporator by indirect heat: m :~y:.  
3-7溅射装置sputtering device: 7F]Hq  
3-8靶target:  huyfo1(  
3-10时控挡板timing shutter: ,Csjb1  
3-11掩膜mask: JV4fL~  
3-12基片支架substrate holder: _*{Lha  
3-13夹紧装置clamp: H"Hl~~U  
3-14换向装置reversing device: j"pyK@v2B  
3-15基片加热装置substrate heating device: E;'{qp  
3-16基片冷却装置substrate colding device: .!lLj1?p  
XhWo~zh"  
4.真空镀膜设备 lt]&o0>  
4-1真空镀膜设备vacuum coating plant: S1~K.<B  
(1).真空蒸发镀膜设备vacuum evaporation coating plant: Y[>h |@  
(2).真空溅射镀膜设备vacuum sputtering coating plant: n_Y7*3/b-o  
4-2连续镀膜设备continuous coating plant: #4"eQ*.*"  
4-3半连续镀膜设备semi- continuous coating plant x;} 25A|  
6.   1.漏孔 v_v>gPl,  
1-1漏孔leaks: Slv:CM M  
1-2通道漏孔channel leak: -k2|`t _  
1-3薄膜漏孔membrane leak: )Spa F)N8  
1-4分子漏孔molecular leak: <}c7E3Uc  
1-5粘滞漏孔vixcous leak: Ly2!(,FB.  
1-6校准漏孔calibrated leak: WD[jEWMV7D  
1-7标准漏孔reference leak : %z-so?gF  
1-8虚漏virtual leak: f w)tWJVD  
1-9漏率leak rate: FjiIB1 T  
1-10标准空气漏率standard air leak rate: ?8< =.,r  
1-11等值标准空气漏率equivalent standard air leak rate: 08k  
1-12探索(示漏)气体: X_bB6A6  
KyP@ hhj  
2.本底 xb9^WvV  
2-1本底background: OUO'w6m!  
2-2探索气体本底search gas background : saQo]6#  
2-3漂移drift: <HS{A$]  
2-4噪声noise: R3piI&u  
Buq(L6P9r  
3.检漏仪 lZ2g CZ  
3-1检漏仪leak detector: q;f L@L@-  
3-2高频火花检漏仪H.F. spark leak detector: T/%Y_.NtU  
3-3卤素检漏仪halide leak detector: C8)s6  
3-4氦质谱检漏仪helium mass spectrometer leak detector: +u5xK  
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: 0Ny +NE:6M  
QG L~??  
4.检漏 60e{]}Z  
4-1气泡检漏leak detection by bubbles: 'dzbeTJ D5  
4-2氨检漏leak detection by ammonia: yzL9Ic  
4-3升压检漏leak detection of rise pressure:  z.2UZ%:  
4-4放射性同位素检漏radioactive isotope leak detection: .A6pPRy e  
4-5荧光检漏fluorescence leak detection Ik A~+6UY  
7.   1.一般术语 Q[H4l({E  
1-1真空干燥vacuum drying: E(1G!uu<  
1-2冷冻干燥freeze drying : =eDC{/K  
1-3物料material: ;yjw(OAI*  
1-4待干燥物料material to be dried: LL+_zBP.   
1-5干燥物料dried material : \)aFYDq#\  
1-6湿气moisture;humidity: [ws;|n h  
1-7自由湿气free moisture: gA1j'!\6l9  
1-8结合湿气bound moisture: ,Tx38  
1-9分湿气partial moisture: zJUT<%[U  
1-10含湿量moisture content: e85E+S%  
1-11初始含湿量initial moisture content: yw7bIcs|#b  
1-12最终含湿量final residual moisture: :iQJ9Hdz  
1-13湿度degree of moisture ,degree of humidity : TC=>De2;  
1-14干燥物质dry matter : E6 T=lwOZ  
1-15干燥物质含量content of dry matter: ^Mhh2v  
f/0k,~,*  
2.干燥工艺 V@gG x  
2-1干燥阶段stages of drying : f= }!c*l"  
(1).预干燥preliminary dry: ^)|tf\4  
(2).一次干燥(广义)primary drying(in general): ~qTChCXP  
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): &H}Xk!q5b^  
(4).二次干燥secondary drying: U!BZs Vx  
2-2.(1).接触干燥contact drying: 2'Kh>c2  
(2).辐射干燥 drying by radiation : x1Gc|K/-  
(3).微波干燥microwave drying: @q@I(%_`  
(4).气相干燥vapor phase drying: {S@, ,  
(5).静态干燥static drying: DM\pi9<m  
(6).动态干燥dynamic drying:  : ?Z9  
2-3干燥时间drying time: =t~]@?]1D  
2-4停留时间length of stay(in the drying chamber): [IHG9Xg  
2-5循环时间cycle time: KxFA@3  
2-6干燥率 dessication ratio : F`Z?$ 1  
2-7去湿速率mass flow rate of humidity: hX-^h2eV  
2-8单位面积去湿速率mass flow rate of humidity per surface area: K>\v<!%a  
2-9干燥速度 drying speed : C9FAX$$^(Y  
2-10干燥过程drying process: *kj+6`:CPs  
2-11加热温度heating temperature: ew c:-2Y^  
2-12干燥温度temperature of the material being dried : 6vU%Y_n=y]  
2-13干燥损失loss of material during the drying process : N!\1O,  
2-14飞尘lift off (particles): u,`V%J?vW  
2-15堆层厚度thickness of the material: 4Y G\<Zf  
 7(o:J  
3.冷冻干燥 *N6sxFs  
3-1冷冻freezing: (Bpn9}F-V.  
(1).静态冷冻static freezing: ^0I"  
(2).动态冷冻dynamic freezing: 7MKZ*f@x;  
(3).离心冷冻centrifugal freezing: e%9zY{ABR%  
(4).滚动冷冻shell freezing:  2q9$5   
(5).旋转冷冻spin-freezing: 2@N-#x '  
(6).真空旋转冷冻vacuum spin-freezing: $}0\sj%  
(7).喷雾冷冻spray freezing: w`=XoYQl~*  
(8).气流冷冻air blast freezing: s4=EyBI  
3-2冷冻速率rate of freezing: T=g2gmo9  
3-3冷冻物料frozen material: e_S,N0  
3-4冰核ice core: E429<LQI/  
3-5干燥物料外壳envelope of dried matter: qR%as0;  
3-6升华表面sublimation front: ;1r|Bx<5  
3-7融化位置freezer burn: Cw5 B p9  
f|j<Mj+\  
4.真空干燥设备;真空冷冻干燥设备 N6*FlG-  
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: VY=YI}E  
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: g<8Oezi 65  
4-3加热表面heating surface: T w1&<S  
4-4物品装载面shelf : '@^mesMG  
4-5干燥器的处理能力throughput (of the vacuum drying chamber): ? Z2`f6;W4  
4-6单位面积干燥器处理能力throughput per shelf area: <:StZ{o;  
4-7冰冷凝器ice condenser: wkJ@#jD*[  
4-8冰冷凝器的负载load of the ice condenser: ? a/\5`gnN  
4-9冰冷凝器的额定负载rated load of the ice condenser |#(y?! A^  
8.   1.一般术语 C+Wa(K  
1-1试样sample : %T}*DC$&S  
(1).表面层surface layer: b<E78B+Aax  
(2).真实表面true surface: @qF:v]=_@  
(3).有效表面积effective surface area: A":cS }Ui  
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: 0R-W 9qP  
(5).表面粒子密度surface particle density: rWN%j)#+  
(6).单分子层monolayer: 'XOWSx;Y  
(7).表面单分子层粒子密度monolayer density: TCkMJs?  
(8).覆盖系数coverage ratio: +h1X-K:I  
1-2激发excitation: -x!JTx[K  
(1).一次粒子primary particle: ]#'& x%m  
(2).一次粒子通量primary particle flux: xo!2 GPD.  
(3).一次粒子通量密度density of primary particle flux: ;):E 8;B)  
(4).一次粒子负荷primary particle load: ?lU(FK  
(5).一次粒子积分负荷integral load of primary particle: B@8lD\  
(6).一次粒子的入射能量energy of the incident primary particle: E>u U6#v  
(7).激发体积excited volume: r( bA>L*mk  
(8).激发面积excited area: }:]CXrdg>  
(9).激发深度excited death: b4(,ls  
(10).二次粒子secondary particles: }E&:  
(11).二次粒子通量secondary particle flux: K d{o/R  
(12).二次粒子发射能energy of the emitted secondary particles: Jpn= ^f[rm  
(13).发射体积emitting volume: j@/p: fk  
(14).发射面积emitting area: j.\0p-,  
(15).发射深度emitting depth: T^#d\2  
(16).信息深度information depth: \ #la8,+9  
(17).平均信息深度mean information depth: tLP Er@  
1-3入射角angle of incidence: LMLrH.  
1-4发射角angle of emission: 0W)|n9  
1-5观测角observation: G#1W":|`  
1-6分析表面积analyzed surface area: [<wpH0lNoy  
1-7产额 yield : @z`eqG,']  
1-8表面层微小损伤分析minimum damage surface analysis: C4 -y%W"P  
1-9表面层无损伤分析non-destructive surface analysis: qXoq< |  
1-10断面深度分析 profile analysis in depth; depth profile analysis : mp*?GeV?M  
1-11可观测面积observable area: {"|la;*I  
1-12可观测立体角observable solid angle : &<- S-e  
1-13接受立体角;观测立体角angle of acceptance: -U|Z9sia  
1-14角分辨能力angular resolving power: +DE;aGQ.z?  
1-15发光度luminosity: R%`fd *g  
1-16二次粒子探测比detection ratio of secondary particles: '#jZ`  
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: f @Vd'k<  
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: NIp]n[ =.q  
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: ^,`]Q)P^  
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: Th$xk9TK^@  
1-21本底压力base pressure: O.{  
1-22工作压力working pressure: eWr6@  
dt/-0~U  
2.分析方法 Z=]ujlD  
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: xWM?E1@  
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : X(Z(cY(  
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: f6{.Uq%SGp  
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: ~6+>2|wIS  
2-3离子散射表面分析ion scattering spectroscopy: qI<c47d;q  
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: {e0(M*u  
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: .eyJ<b9  
2-6离子散射谱仪ion scattering spectrometer: Y&bO[(>1  
2-7俄歇效应Auger process: d<w]>T5VW  
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: ?6h~P:n.  
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: QvJ29  
2-10光电子谱术photoelectron spectroscopy : ,V{Bpr  
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: C u1G8t-  
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: FRXaPod  
2-11光电子谱仪photoelectron spectrometer: 3Zwhv+CP[  
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: BnaI30-  
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: T # gx2Y  
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): t. DnF[  
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus
zuiyuan 2007-03-13 15:13
太好了啊,多谢了啊
zhy980730 2007-03-14 11:39
多谢,了解点.
flyinlove79 2007-03-15 17:43
不错,多谢楼主分享资料 [s:4]
飞花无心 2007-03-26 09:33
很好,谢谢楼主啊
wottlin100 2007-04-02 09:19
呵呵,楼主辛苦啦!如果有定义解释更好!
xingmeng1227 2011-10-29 12:40
呵呵,楼主辛苦啦!
zh9607109 2011-11-03 05:41
呵呵,楼主辛苦啦!
wym87 2011-11-13 23:18
谢谢楼主的分享!Thanks!
douyongming 2012-06-17 17:03
太好了啊,多谢了啊
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