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cswmsc 2007-02-28 23:18

真空术语全集

“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 "'\f?A9  
--------------------------------------------------- XbMAcgS  
真空术语 y&{ Z"+B5  
rtY4 B~_  
1.标准环境条件 standard ambient condition: o dTg.m  
2.气体的标准状态 standard reference conditions forgases:  &j_:VP  
3.压力(压强)p pressure: |cd=7[B  
4.帕斯卡Pa pascal: 6> Ca O  
5.托Torr torr: nps"nggk  
6.标准大气压atm standard atmosphere: BLQD=?Q  
7.毫巴mbar millibar: %eDJ]\*^X  
8.分压力 partial pressure: > g=u Y{Rf  
9.全压力 total pressure: 1?N$I}?  
10.真空 vacuum: 9 &p;2/H  
11.真空度 degree of vacuum: )o>1=Y`[z  
12.真空区域 ranges of vacuum: [V_?`M  
13.气体 gas: rm nfyn  
14.非可凝气体 non-condensable gas: O| zLD  
15.蒸汽vapor: aq<QKn U  
16.饱和蒸汽压saturation vapor pressure: "}'Sk(  
17.饱和度degree of saturation: W99Hq1W;r  
18.饱和蒸汽saturated vapor: ]53'\TH  
19.未饱和蒸汽unsaturated vapor: 2*1FW v  
20.分子数密度n,m-3 number density of molecules: /'g"Ys?3  
21.平均自由程ι、λ,m mean free path: KXTx{R  
22.碰撞率ψ collision rate: z~+gche>  
23.体积碰撞率χ volume collision rate: I'%(f@u~  
24.气体量G quantity of gas: 8`S6BkfC|  
25.气体的扩散 diffusion of gas: V- HO_GDo  
26.扩散系数D diffusion coefficient; diffusivity: wM#BQe3t#  
27.粘滞流 viscous flow: 1[Ffl^\ARp  
28.粘滞系数η viscous factor: *2tG07kI  
29.泊肖叶流 poiseuille flow: TSCc=c  
30.中间流 intermediate flow: p-1 \4  
31.分子流 molecular flow: b/g"ws_  
32克努曾数 number of knudsen: BL Q&VI4  
33.分子泻流 molecular effusion; effusive flow: BpQ/$?5E"  
34.流逸 transpiration: j*05!j<'  
35.热流逸 thermal transpiration: ezR!ngt  
36.分子流率qN molecular flow rate; molecular flux: d[Lr`=L;  
37.分子流率密度 molecular flow rate density; density of molecular flux: 6 SosVE>Z  
38.质量流率qm mass flow rare: bu|ecv  
39.流量qG throughput of gas: *zR   
40.体积流率qV volume flow rate: [6Nw)r(a(  
41.摩尔流率qυ molar flow rate: /n|`a1!  
42.麦克斯韦速度分布 maxwellian velocity distribution: b+`mh  
43.传输几率Pc transmission probability: "TgE@bC  
44.分子流导CN,UN molecular conductance: r=3knCEWK  
45.流导C,U conductance: j/9Uf|z-_  
46.固有流导Ci,Ui intrinsic conductance: :*wjC.Z  
47.流阻W resistance: =P.m5e<  
48.吸附 sorption: =z$XqT.'  
49.表面吸附 adsorption: i`2X[kc  
50.物理吸附physisorption: 8x J]K  
51.化学吸附 chemisorption: @xI:ZtM  
52.吸收absorption: "RF<i3{S  
53.适应系数α accommodation factor: 3h|:ew[  
54.入射率υ impingement rate: $SmmrM  
55.凝结率condensation rate: '!6Py1i  
56.粘着率 sticking rate: xE4iey@\}  
57.粘着几率Ps sticking probability: mtON dI  
58.滞留时间τ residence time: \|}dlG  
59.迁移 migration: D/&^Y'|T  
60.解吸 desorption: ]O\Oj6C  
61.去气 degassing: 4mY(*2:HC  
62.放气 outgassing: -OS&(7  
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: G} &{]w@  
64.蒸发率 evaporation rate: e:~r_,K  
65.渗透 permeation: Vp'Zm:  
66.渗透率φ permeability: 8C{mV^cn~  
67.渗透系数P permeability coefficient DGwN*>X  
2.   1.真空泵 vacuum pumps z$>_c "D  
1-1.容积真空泵 positive displacement pump: x{X(Y]*1S  
⑴.气镇真空泵 gas ballast vacuum pump: <6s?M1J  
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: =k1 ,jn+  
⑶.干封真空泵 dry-sealed vacuum pump: #iOoi9(  
⑷.往复真空泵 piston vacuum pump: s2{d<0x?v  
⑸.液环真空泵 liquid ring vacuum pump: KnC;j-j  
⑹.旋片真空泵 sliding vane rotary vacuum pump: aJC,  
⑺.定片真空泵 rotary piston vacuum pump: Y70[Nz  
⑻.滑阀真空泵 rotary plunger vacuum pump: Qw ukhD7  
⑼.余摆线真空泵 trochoidal vacuum pump: (1pxQ%yEA  
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: .#,!&Lt  
⑾.罗茨真空泵 roots vacuum pump: |-HV@c]  
1-2.动量传输泵 kinetic vacuum pump: -];/*nl  
⑴.牵引分子泵molecular drag pump: PSO9{!  
⑵.涡轮分子泵turbo molecular pump: `;ofQz4  
⑶.喷射真空泵ejector vacuum pump: pb(YA/  
⑷.液体喷射真空泵liquid jet vacuum pump: }jQxwi)  
⑸.气体喷射真空泵gas jet vacuum pump: ,{HxX0  
⑹.蒸汽喷射真空泵vapor jet vacuum pump : 0Jh^((i*  
⑺.扩散泵diffusion pump : ' {L5 3cH=  
⑻.自净化扩散泵self purifying diffusion pump: +h}>UK\  
⑼.分馏扩散泵 fractionating diffusion pump : vap,)kILF  
⑽.扩散喷射泵diffusion ejector pump : I]"wT2@T;7  
⑾.离子传输泵ion transfer pump: w(QU'4~  
1-3.捕集真空泵 entrapment vacuum pump: >[=fbL@N<@  
⑴吸附泵adsorption pump: Lbka*@  
⑵.吸气剂泵 getter pump: @hlT7C)xK  
⑶.升华(蒸发)泵 sublimation (evaporation)pump : JM-spi o  
⑷.吸气剂离子泵getter ion pump:  fWx %?J  
⑸.蒸发离子泵 evaporation ion pump: @O/Jy2>3H  
⑹.溅射离子泵sputter ion pump: $r`^8/Mq3  
⑺.低温泵cryopump: i+$G=Z#3E  
}7>r,  
2.真空泵零部件 R^PPgE6!$  
2-1.泵壳 pump case: 2nW:|*:/p6  
2-2.入口 inlet: W0X/&v,k*  
2-3.出口outlet: gBzg'Z  
2-4.旋片(滑片、滑阀)vane; blade : [*<F   
2-5.排气阀discharge valve: .5ap9li]  
2-6.气镇阀gas ballast valve: P8N`t&r"7  
2-7.膨胀室expansion chamber: o5 UM)g  
2-8.压缩室compression chamber: @)A)cBv#  
2-9.真空泵油 vacuum pump oil: RKu'WD?sdH  
2-10.泵液 pump fluid: )~ {T  
2-11.喷嘴 nozzle: "K3"s Ec%  
2-13.喷嘴扩张率nozzle expansion rate: 'u6T^YS  
2-14.喷嘴间隙面积 nozzle clearance area : $TON`+lB  
2-15.喷嘴间隙nozzle clearance: $4^cbk  
2-16.射流jet: &@tD/Jw3  
2-17.扩散器diffuser: V _(L/6  
2-18.扩散器喉部diffuser thoat: P|> fO'  
2-19.蒸汽导管vapor tube(pipe;chimney): G_GV  
2-20.喷嘴组件nozzle assembly: cFcn61x-  
2-21.下裙skirt: G%{J.J41F  
p^|IN'lx,  
3.附件 &vf9Gp+MK  
3-1阱trap: DJxe3<  
⑴.冷阱 cold trap: g.wp }fz  
⑵.吸附阱sorption trap: Y}<w)b1e|  
⑶.离子阱ion trap: zn| S3c  
⑷.冷冻升华阱 cryosublimation trap: s}8(__|  
3-2.挡板baffle: qPEtMvL #  
3-3.油分离器oil separator: J#h2~Hz!  
3-4.油净化器oil purifier: X]^FHYjhS  
3-5.冷凝器condenser: D=hy[sDBw  
< Y5pAStg  
4.泵按工作分类 DQC=f8  
4-1.主泵main pump: [{]/9E /&  
4-2.粗抽泵roughing vacuum pump: OF[y$<jM  
4-3.前级真空泵backing vacuum pump: ,$i2vGd  
4-4.粗(低)真空泵 roughing(low)vacuum pump: S$ u`)BG):  
4-5.维持真空泵holding vacuum pump: K4 \{G  
4-6.高真空泵high vacuum pump: f{ ;L"*L  
4-7.超高真空泵ultra-high vacuum pump: :@BAiKa[wa  
4-8.增压真空泵booster vacuum pump: bXVH7Fy  
%49P<vo`?  
5.真空泵特性 x$:>W3?T=^  
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: }I3 ZNd   
5-2.真空泵的抽气量Q throughput of vacuum pump:。 uw!w}1Y]}2  
5-3.起动压力starting pressure: 8+HXGqcv  
5-4.前级压力 backing pressure : yQAW\0`  
5-5.临界前级压力 critical backing pressure: uY{zZ4iw  
5-6.最大前级压力maximum backing pressure: lD`@{A  
5-7.最大工作压力maximum working pressure: (OA-Mgyc  
5-8.真空泵的极限压力ultimate pressure of a pump: /WvF}y  
5-9.压缩比compression ratio: 'o D31\@I  
5-10.何氏系数Ho coefficient: $1aJdZC7  
5-11.抽速系数speed factor: ]i$ <<u  
5-12.气体的反扩散back-diffusion of gas: >K|<hzZ  
5-13.泵液返流back-streaming of pump fluid: s|p,UK  
5-14.返流率back-streaming rate ~.FeLWP  
5-15.返迁移back-migration: >XTDN  
5-16.爆腾bumping: OV@MT^  
5-17.水蒸气允许量qm water vapor tolerable load: vBP 5n  
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: qDG{hvl[1r  
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: gLm ]*  
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump T0:%,o  
3.   1.一般术语 .<#oLM^  
1-1.压力计pressure gauge: U*P&O+(1'  
1-2.真空计vacuum gauge: 47S1mxur  
⑴.规头(规管)gauge head: A_h|f5  
⑵.裸规nude gauge : 2O|jVGap5x  
⑶.真空计控制单元gauge control unit : rM?O2n  
⑷.真空计指示单元gauge indicating unit : `S`,H  
8C,}nh  
2.真空计一般分类 mP!=&u fcU  
2-1.压差式真空计differential vacuum gauge: l(irNKutgo  
2-2.绝对真空计 absolute vacuum gauge: 8iv0&91Z  
2-3.全压真空计total pressure vacuum gauge: eo#2n8I>=1  
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: }s9eRmJs  
2-5.相对真空计relative vacuum gauge : h>w(Th\H  
r6JQRSakR  
3.真空计特性 71S~*"O0f  
3-1.真空计测量范围pressure range of vacuum gauge: L1H k[j]X|  
3-2.灵敏度系数sensitivity coefficient: D^_]x51>  
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): g2Hz[C(  
3-5.规管光电流photon current of vacuum gauge head: $,b1`*  
3-6.等效氮压力equivalent nitrogen pressure : 'P AIh*qA  
3-7.X射线极限值 X-ray limit: M%yeI{m  
3-8.逆X射线效应anti X-ray effect: wBuos}/  
3-9.布利尔斯效应blears effect: '' Pu  
+69[06F  
4.全压真空计 (+(YQ2  
4-1.液位压力计liquid level manometer: 2|6E{o  
4-2.弹性元件真空计elastic element vacuum gauge: 8QJ^@|7  
4-3.压缩式真空计compression gauge: DB=^Z%%Z  
4-4.压力天平pressure balance: sYfiC`9SO  
4-5.粘滞性真空计viscosity gauge : 0uZL*4A+C  
4-6.热传导真空计thermal conductivity vacuum gauge : c"wk_ #  
4-7.热分子真空计thermo-molecular gauge: a)o-6  
4-8.电离真空计ionization vacuum gauge: =<BPoGs5  
4-9.放射性电离真空计radioactive ionization gauge: E;o "^[we  
4-10.冷阴极电离真空计cold cathode ionization gauge: [=EmDP:@  
4-11.潘宁真空计penning gauge: w\K(kNd(  
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: M~?2g.o'D  
4-13.放电管指示器discharge tube indicator: >~F_/Z'5  
4-14.热阴极电离真空计hot cathode ionization gauge: pu"m(9  
4-15.三极管式真空计triode gauge: d`w3I`P1  
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: .!`y(N0hc  
4-17.B-A型电离真空计Bayard-Alpert gauge: pdw;SIoC  
4-18.调制型电离真空计modulator gauge: mXSs:FqE!  
4-19.抑制型电离真空计suppressor gauge: RJ+["[k  
4-20.分离型电离真空计extractor gauge: J<9;Ix8R  
4-21.弯注型电离真空计bent beam gauge: v1R  t$[  
4-22.弹道型电离真空计 orbitron gauge : +|w%}/N  
4-23.热阴极磁控管真空计hot cathode magnetron gauge: }J^+66{  
-f-@[;D  
5.分压真空计(分压分析器) j^T i6F>f  
5-1.射频质谱仪radio frequency mass spectrometer: up;^,I  
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: CMiE$yC  
5-3.单极质谱仪momopole mass spectrometer: G m~2s;/  
5-4.双聚焦质谱仪double focusing mass spectrometer: x:? EL)(  
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: =C(((T.  
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: g7l?/p[n  
5-7.回旋质谱仪omegatron mass spectrometer: Puq  
5-8.飞行时间质谱仪time of flight mass spectrometer: :z^,>So:  
%wQE lkB  
6.真空计校准 F*4zC@;  
6-1.标准真空计reference gauges: j /)A<j$  
6-2.校准系统system of calibration: 2:jWO_V@  
6-3.校准系数K calibration coefficient: L; o$vI~U,  
6-4.压缩计法meleod gauge method: -+HD5Hc  
6-5.膨胀法expansion method: bSkr:|A7  
6-6.流导法flow method: sK/Z 'h{|  
4.   1.真空系统vacuum system >(\Z-I&YQ  
1-1.真空机组pump system: 0s72BcP  
1-2.有油真空机组pump system used oil : (7*((  
1-3.无油真空机组oil free pump system 8-s7s!j  
1-4.连续处理真空设备continuous treatment vacuum plant: EEp~\^ -  
1-5.闸门式真空系统vacuum system with an air-lock: #zed8I:w  
1-6.压差真空系统differentially pumped vacuum system: OnND(YiX  
1-7.进气系统gas admittance system: x:E:~h[.^  
6 =H]p1p~O  
2.真空系统特性参量 V6!1(|  
2-1.抽气装置的抽速volume flow rate of a pumping unit : hQ80R B  
2-2.抽气装置的抽气量throughput of a pumping unit : >$:_M*5  
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: vUR@P  -  
2-4.真空系统的漏气速率leak throughput of a vacuum system: c>b{/92%  
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: IIY3/   
2-6.极限压力ultimate pressure: ^JY,K  
2-7.残余压力residual pressure: #/ HQ?3h]  
2-8.残余气体谱residual gas spectrum: RQ;}+S  
2-9.基础压力base pressure: Fql|0Fq  
2-10.工作压力working pressure: S7h?tR*u  
2-11.粗抽时间roughing time: uwc@~=;  
2-12.抽气时间pump-down time: r E&}B5PN=  
2-13.真空系统时间常数time constant of a vacuum system: MWI7u7{  
2-14.真空系统进气时间venting time: yfZYGhPN(  
Oq[YbQ'GE  
3.真空容器 ZkmY pi[  
3-1.真空容器;真空室vacuum chamber: {:TOm0eK  
3-2.封离真空装置sealed vacuum device: U.pGp]\Q)G  
3-3.真空钟罩vacuum bell jar: NRMEZ\*L  
3-4.真空容器底板vacuum base plate: R*l3 zn>  
3-5.真空岐管vacuum manifold: h'"~t#r  
3-6.前级真空容器(贮气罐)backing reservoir: |.?X ov]  
3-7.真空保护层outer chamber: YZZog6%  
3-8.真空闸室vacuum air lock: $6~t|[7:%Y  
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: B&"c:)1 C2  
5BS !6o;P'  
4.真空封接和真空引入线 7qL B9r  
4-1.永久性真空封接permanent seal :  x-s\0l  
4.2.玻璃分级过渡封接graded seal : =h\uC).t&  
4-3.压缩玻璃金属封接compression glass-to-metal seal: >)edha*W]  
4-4.匹配式玻璃金属封接matched glass-to-metal seal: f/670Acv  
4-5.陶瓷金属封接ceramic-to-metal seal: [{.9#cQ "  
4-6.半永久性真空封接semi-permanent seal : v!j%<H`NI  
4-7.可拆卸的真空封接demountable joint: [e7nW9\l  
4-8.液体真空封接liquid seal [mFgo il  
4-9.熔融金属真空封接molten metal seal: : U,-v  
4-10.研磨面搭接封接ground and lapped seal: 6T6UIq  
4-11.真空法兰连接vacuum flange connection: l9naqb:iP  
4-12.真空密封垫vacuum-tight gasket: Y'Yu1mH)  
4-13.真空密封圈ring gasket: `RyH~4\;  
4-14.真空平密封垫flat gasket: 3 p!t_y|SX  
4-15.真空引入线feedthrough leadthrough: 'iX y?l  
4-16.真空轴密封shaft seal: 3oM&#a  
4-17.真空窗vacuum window: SedVp cb+  
4-18.观察窗viewing window: Ao, <G.>R  
fF^A9{{BS  
5.真空阀门 E&;;2  
5-1.真空阀门的特性characteristic of vacuum valves: T'-kG"lb  
⑴.真空阀门的流导conductance of vacuum valves: S\sy] 1*?$  
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: a,eEP43dn  
5-2.真空调节阀regulating valve: vT#m 8Kg  
5-3.微调阀 micro-adjustable valve: ?nwg.&P  
5-4.充气阀charge valve: ->'xjD  
5-5.进气阀gas admittance valve: J@qwz[d i  
5-6.真空截止阀break valve: {'6-;2&f  
5-7.前级真空阀backing valve: +&[X7r<  
5-8.旁通阀 by-pass valve: $pajE^d4V  
5-9.主真空阀main vacuum valve: T~~K~a \8  
5-10.低真空阀low vacuum valve: TTJj=KPA  
5-11.高真空阀high vacuum valve: ^L-; S  
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: ]3d5kf  
5-13.手动阀manually operated valve: H^JFPvEc  
5-14.气动阀pneumatically operated valve: ?~X^YxWsY  
5-15.电磁阀electromagnetically operated valve: W#foVAi .  
5-16.电动阀valve with electrically motorized operation: x\!vr.  
5-17.挡板阀baffle valve: 2+|U!X  
5-18.翻板阀flap valve: w0 1u~"E  
5-19.插板阀gate valve: aPin6L$;)  
5-20.蝶阀butterfly valve: {j%7/T{  
>2mV {i&  
6.真空管路 pg3h>)$/  
6-1.粗抽管路roughing line: <tv"I-2  
6-2.前级真空管路backing line: 6SEq 2   
6-3.旁通管路;By-Pass管路 by-pass line: ztC>*SX  
6-4.抽气封口接头pumping stem: 0}q*s!  
6-5.真空限流件limiting conductance:       %t%D|cf  
6-6.过滤器filter: ,f$ftn\~j/  
5.   1.一般术语 W];l[D<S*  
1-1真空镀膜vacuum coating:  g:?p/L  
1-2基片substrate: R(IYb%L  
1-3试验基片testing substrate: [#2X  
1-4镀膜材料coating material: ^4=%~Yx  
1-5蒸发材料evaporation material: O5ZR{f&  
1-6溅射材料sputtering material: sV`p3L8pl  
1-7膜层材料(膜层材质)film material: Rw|P$dbu  
1-8蒸发速率evaporation rate: W_[ tdqey  
1-9溅射速率sputtering rate: YXDuhrs}  
1-10沉积速率deposition rate: N a<);Pg  
1-11镀膜角度coating angle: Wux[h8G  
!Aw.)<teW  
2.工艺  6Ok]E`  
2-1真空蒸膜vacuum evaporation coating: -EG=}uT['b  
(1).同时蒸发simultaneous evaporation: G=&nwSL  
(2).蒸发场蒸发evaporation field evaporation: z0?IQzR^T  
(3).反应性真空蒸发reactive vacuum evaporation: 8>[o. xV  
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: j"n"=rTTQ  
(5).直接加热的蒸发direct heating evaporation: U4h5K}j4  
(6).感应加热蒸发induced heating evaporation: < mp_[-c  
(7).电子束蒸发electron beam evaporation: FvDi4[F#  
(8).激光束蒸发laser beam evaporation: {GG;/Ns{f-  
(9).间接加热的蒸发indirect heating evaporation: Jm,tN/o*  
(10).闪蒸flash evaportion: WU~L#Ih.V  
2-2真空溅射vacuum sputtering: ?D=C8EX  
(1).反应性真空溅射 reactive vacuum sputtering: j7b4wH\#  
(2).偏压溅射bias sputtering: j>Cp4  
(3).直流二级溅射direct current diode sputtering: a&<_M$J&  
(4).非对称性交流溅射asymmtric alternate current sputtering: [p_<`gU?  
(5).高频二极溅射high frequency diode sputtering: 5?|yYQM0tK  
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: 3+H[S#e:Z  
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: 4oN*J +"=+  
(8).离子束溅射ion beam sputtering: , nW)A/?}  
(9).辉光放电清洗glow discharge cleaning: nc;iJ/\4  
2-3物理气相沉积PVD physical vapor deposition: R,m|+[sl  
2-4化学气相沉积CVD chemical vapor deposition: 0+Q; a  
2-5磁控溅射magnetron sputtering: "8/BVW^bv  
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: &S8,-~U  
2-7空心阴极离子镀HCD hollow cathode discharge deposition: Vj6 w7hz  
2-8电弧离子镀arc discharge deposition: m=V69 a#  
HrHtA]  
3.专用部件 5?8jj  
3-1镀膜室coating chamber: a'?V:3 ]  
3-2蒸发器装置evaporator device: _J>!K'Dz  
3-3蒸发器evaporator: O#Ho08*Xn  
3-4直接加热式蒸发器evaporator by direct heat: "]U_o<V  
3-5间接加热式蒸发器evaporator by indirect heat: 7myYs7N8[  
3-7溅射装置sputtering device: 6Tsi^((Li  
3-8靶target: YD] :3!MI  
3-10时控挡板timing shutter: n,`j~.l-=>  
3-11掩膜mask: #M|q}jA|  
3-12基片支架substrate holder: 6`Diz_(  
3-13夹紧装置clamp: <J-.,:  
3-14换向装置reversing device: ?s[!JeUA  
3-15基片加热装置substrate heating device: BB.120v&N  
3-16基片冷却装置substrate colding device: ^ >#@qMw  
wLy:S.r  
4.真空镀膜设备 |J:m{  
4-1真空镀膜设备vacuum coating plant: GB}!7W"  
(1).真空蒸发镀膜设备vacuum evaporation coating plant: pV/5w<_x?  
(2).真空溅射镀膜设备vacuum sputtering coating plant: %:\GYs(Y  
4-2连续镀膜设备continuous coating plant: hQaa"U7[  
4-3半连续镀膜设备semi- continuous coating plant hpo*5Va  
6.   1.漏孔 Ys8D|HIk  
1-1漏孔leaks: dUkZ_<5''  
1-2通道漏孔channel leak: ~=?^v[T1  
1-3薄膜漏孔membrane leak: AU<A\  
1-4分子漏孔molecular leak: Bs^p!4=  
1-5粘滞漏孔vixcous leak: e)aH7Jj#  
1-6校准漏孔calibrated leak: 9 !V,++j  
1-7标准漏孔reference leak : \ \gAa-}:  
1-8虚漏virtual leak: E6#")2C~  
1-9漏率leak rate: :"`1}Q  
1-10标准空气漏率standard air leak rate: '}F..w/  
1-11等值标准空气漏率equivalent standard air leak rate: e(vnnv?R{  
1-12探索(示漏)气体: D;6C2>U~L  
N'YQ6U  
2.本底 rAS2qt  
2-1本底background: Gk!CU"`sP  
2-2探索气体本底search gas background : VN]j*$5   
2-3漂移drift: S%o6cl=  
2-4噪声noise: e5m]mzF@  
OZ}o||/Rc  
3.检漏仪 rS_pv=0S  
3-1检漏仪leak detector: QG5)mIJ  
3-2高频火花检漏仪H.F. spark leak detector: HjZf3VwI  
3-3卤素检漏仪halide leak detector: 'W/AYF^5  
3-4氦质谱检漏仪helium mass spectrometer leak detector: UH#S |o4  
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: #=#bv`  
tD> qHR  
4.检漏 D:PrFa  
4-1气泡检漏leak detection by bubbles: Wx8n)  
4-2氨检漏leak detection by ammonia: C5=m~  
4-3升压检漏leak detection of rise pressure: RSIhZYA  
4-4放射性同位素检漏radioactive isotope leak detection: S y^et  
4-5荧光检漏fluorescence leak detection +q] kpkG!  
7.   1.一般术语 s"(F({J  
1-1真空干燥vacuum drying: O ;m[  
1-2冷冻干燥freeze drying : 9XX:_9|I  
1-3物料material: a@m  64l)  
1-4待干燥物料material to be dried: OhTd>~R`<  
1-5干燥物料dried material : p?sFX$S  
1-6湿气moisture;humidity: ai;-_M+$  
1-7自由湿气free moisture: G@rV9  
1-8结合湿气bound moisture: 7e6; |?  
1-9分湿气partial moisture: CykvTV Q  
1-10含湿量moisture content: u\u6< [>P  
1-11初始含湿量initial moisture content: u >[hLXuB  
1-12最终含湿量final residual moisture: S(G&{KG  
1-13湿度degree of moisture ,degree of humidity : WTUC\}#E\  
1-14干燥物质dry matter : IQ5'4zQg=  
1-15干燥物质含量content of dry matter: tW%!|T5/  
{r:5\  
2.干燥工艺 F,@uYMQs  
2-1干燥阶段stages of drying : ?F9c6$|  
(1).预干燥preliminary dry: ab>>W!r@!  
(2).一次干燥(广义)primary drying(in general): FH7l6b,^  
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): `]5t'Ps  
(4).二次干燥secondary drying: iy [W:<c7j  
2-2.(1).接触干燥contact drying: ]~\%ANoi  
(2).辐射干燥 drying by radiation : n(j5dN>]  
(3).微波干燥microwave drying: bkIQ?cl<at  
(4).气相干燥vapor phase drying: ~--F?KUnL  
(5).静态干燥static drying: pW-aX)\DR  
(6).动态干燥dynamic drying: W&e}*  
2-3干燥时间drying time: &o7"L;  
2-4停留时间length of stay(in the drying chamber): CMU\DO  
2-5循环时间cycle time: 7$7#z\VWu  
2-6干燥率 dessication ratio : #=czqZw  
2-7去湿速率mass flow rate of humidity: d+%Rg\ v  
2-8单位面积去湿速率mass flow rate of humidity per surface area: kD#hfYs)i  
2-9干燥速度 drying speed : AIt;~x  
2-10干燥过程drying process: !0Eo9bU%@  
2-11加热温度heating temperature: %( #kJZ  
2-12干燥温度temperature of the material being dried : 5KL??ao-  
2-13干燥损失loss of material during the drying process : `bjPOA(g  
2-14飞尘lift off (particles): [wM]w  
2-15堆层厚度thickness of the material: ;bkvdn}  
Zn]!*}  
3.冷冻干燥 oTk?a!Q  
3-1冷冻freezing: imZ"4HnPP  
(1).静态冷冻static freezing: oe{,-<yck  
(2).动态冷冻dynamic freezing: 077 wk  
(3).离心冷冻centrifugal freezing: }!jn%@_y@  
(4).滚动冷冻shell freezing: ? ;$f"Wl  
(5).旋转冷冻spin-freezing: 5`{u! QE  
(6).真空旋转冷冻vacuum spin-freezing: quiX "lV(  
(7).喷雾冷冻spray freezing: hGj`IAW  
(8).气流冷冻air blast freezing: *iXaQuT  
3-2冷冻速率rate of freezing: )KUEkslR:  
3-3冷冻物料frozen material: nOq`Cwh9  
3-4冰核ice core: EsjZ;D, c(  
3-5干燥物料外壳envelope of dried matter: n*A"}i`ix  
3-6升华表面sublimation front: 2 t:CK  
3-7融化位置freezer burn: AQgm]ex<  
""x>-j4  
4.真空干燥设备;真空冷冻干燥设备 ^%}PRl9  
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: _PGS"O?j  
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: ]I(<hDuRp  
4-3加热表面heating surface: KvtJ tql;  
4-4物品装载面shelf : Q =4~u z|  
4-5干燥器的处理能力throughput (of the vacuum drying chamber): k;!}nQ&  
4-6单位面积干燥器处理能力throughput per shelf area: lh*!f$2 ~  
4-7冰冷凝器ice condenser: SVqKG+{My  
4-8冰冷凝器的负载load of the ice condenser: <L:}u!  
4-9冰冷凝器的额定负载rated load of the ice condenser #oxP,LR  
8.   1.一般术语 K# BZ Jcb  
1-1试样sample : h:{^&d a  
(1).表面层surface layer: zC>zkFT>H  
(2).真实表面true surface: ?5rM'O2  
(3).有效表面积effective surface area: r<EwtO+x  
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: d%Nx/DS)  
(5).表面粒子密度surface particle density: 8eD/9PD=F  
(6).单分子层monolayer: a`8svo;VUO  
(7).表面单分子层粒子密度monolayer density: 4[n[Ch=lu  
(8).覆盖系数coverage ratio: p%-m" u  
1-2激发excitation: 0hCUr]cZ,  
(1).一次粒子primary particle: tiTh7qYi9  
(2).一次粒子通量primary particle flux: _t@9WA;+\  
(3).一次粒子通量密度density of primary particle flux: |snWO0iF  
(4).一次粒子负荷primary particle load: mjJ/rx{kbw  
(5).一次粒子积分负荷integral load of primary particle: M`QK{$1p  
(6).一次粒子的入射能量energy of the incident primary particle: /R[P sB  
(7).激发体积excited volume: QUz_2rN^  
(8).激发面积excited area: w! ':Ws  
(9).激发深度excited death: "rR$2`v"  
(10).二次粒子secondary particles: u^+ (5|  
(11).二次粒子通量secondary particle flux:  #-K,,"  
(12).二次粒子发射能energy of the emitted secondary particles: !b'!7p  
(13).发射体积emitting volume: ?/^{sW' |  
(14).发射面积emitting area: {|R +|ow  
(15).发射深度emitting depth: Zr$D\(hX  
(16).信息深度information depth: F7U$ 7(I2G  
(17).平均信息深度mean information depth: oZ!+._9  
1-3入射角angle of incidence: 0<42\ya  
1-4发射角angle of emission: 1owe'7\J  
1-5观测角observation: Pt?d+aBtV  
1-6分析表面积analyzed surface area: ts;C:.X  
1-7产额 yield : %^(} fu  
1-8表面层微小损伤分析minimum damage surface analysis: dyuT-.2  
1-9表面层无损伤分析non-destructive surface analysis: tq2Ti Xo%  
1-10断面深度分析 profile analysis in depth; depth profile analysis : 2>Sr04Pt  
1-11可观测面积observable area: 89a`WV@}  
1-12可观测立体角observable solid angle : <M M(Z  
1-13接受立体角;观测立体角angle of acceptance: 1L<X+,]@  
1-14角分辨能力angular resolving power: W>m #Mz  
1-15发光度luminosity: a'B 5m]%  
1-16二次粒子探测比detection ratio of secondary particles: s-),Pv|  
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: +3o 4KB}  
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: Tizjh&*^  
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: !E9A=u{  
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: I8LoXY  
1-21本底压力base pressure: f}{Oj-:"CC  
1-22工作压力working pressure: m,#Us  
K]yUPx  
2.分析方法 w"A%@<V3Ec  
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: 5c-'m? k  
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : ~ ]^<*R  
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: 8AIAv_ g  
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: 'cvc\=p  
2-3离子散射表面分析ion scattering spectroscopy: .*+e?-  
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: 6x"|,,&MD0  
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: G?v]|wdI  
2-6离子散射谱仪ion scattering spectrometer: D]WU,a[$Bc  
2-7俄歇效应Auger process: eLyaTOZadu  
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: o Np4> 7Lk  
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: Fn*)!,)  
2-10光电子谱术photoelectron spectroscopy : 7A4 6?kfu  
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: `zMR?F`  
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: Rb_+C  
2-11光电子谱仪photoelectron spectrometer: I>45xVA  
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: mY/x|)MmM  
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: IC@-`S#F  
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): ;Ak 6*Sr  
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus
zuiyuan 2007-03-13 15:13
太好了啊,多谢了啊
zhy980730 2007-03-14 11:39
多谢,了解点.
flyinlove79 2007-03-15 17:43
不错,多谢楼主分享资料 [s:4]
飞花无心 2007-03-26 09:33
很好,谢谢楼主啊
wottlin100 2007-04-02 09:19
呵呵,楼主辛苦啦!如果有定义解释更好!
xingmeng1227 2011-10-29 12:40
呵呵,楼主辛苦啦!
zh9607109 2011-11-03 05:41
呵呵,楼主辛苦啦!
wym87 2011-11-13 23:18
谢谢楼主的分享!Thanks!
douyongming 2012-06-17 17:03
太好了啊,多谢了啊
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