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cswmsc 2007-02-28 23:18

真空术语全集

“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 bz[U<  
--------------------------------------------------- ?xWO>#/  
真空术语 l:-$ulAx  
h#dp_#  
1.标准环境条件 standard ambient condition: D{x'k2=  
2.气体的标准状态 standard reference conditions forgases: w<!F& kQB  
3.压力(压强)p pressure: V`fp%7W  
4.帕斯卡Pa pascal: )[C]1N=tK  
5.托Torr torr: 2-s ,PQno^  
6.标准大气压atm standard atmosphere: jdiH9]&U  
7.毫巴mbar millibar: b}HL uX  
8.分压力 partial pressure:  SP?~i@H  
9.全压力 total pressure: &G\Vn,1v  
10.真空 vacuum: r5M {*  
11.真空度 degree of vacuum: +DmfqKKbd  
12.真空区域 ranges of vacuum: w[YiH $  
13.气体 gas: ]$oo1ssZ1  
14.非可凝气体 non-condensable gas: 3q:U0&F  
15.蒸汽vapor: R.@I}>  
16.饱和蒸汽压saturation vapor pressure: <tXk\ cOg  
17.饱和度degree of saturation: BCMQ^hP}t  
18.饱和蒸汽saturated vapor: T1%_sq  
19.未饱和蒸汽unsaturated vapor: F$.h+v   
20.分子数密度n,m-3 number density of molecules: />Kd w  
21.平均自由程ι、λ,m mean free path: {k*rD!tT  
22.碰撞率ψ collision rate: L{1MyR7`I+  
23.体积碰撞率χ volume collision rate: fUx;_GX?  
24.气体量G quantity of gas: .;}vp*  
25.气体的扩散 diffusion of gas: NXo$rf:  
26.扩散系数D diffusion coefficient; diffusivity: 0`UI^Y~Q  
27.粘滞流 viscous flow: QiC}hj$  
28.粘滞系数η viscous factor: l7 Pn5c  
29.泊肖叶流 poiseuille flow: {P')$f)  
30.中间流 intermediate flow: $$F iCMI  
31.分子流 molecular flow: cZC%W!pT  
32克努曾数 number of knudsen: %])U(  
33.分子泻流 molecular effusion; effusive flow: _}+Aw{7!r  
34.流逸 transpiration: gr1NcHu  
35.热流逸 thermal transpiration: AK$&'t+$}7  
36.分子流率qN molecular flow rate; molecular flux: uaghB,i'n  
37.分子流率密度 molecular flow rate density; density of molecular flux: mO<1&{qMZ  
38.质量流率qm mass flow rare: NW_i<#  
39.流量qG throughput of gas: 8! eYax   
40.体积流率qV volume flow rate: K Q^CiX  
41.摩尔流率qυ molar flow rate: =d`w~iC  
42.麦克斯韦速度分布 maxwellian velocity distribution: \.ukZqB3 0  
43.传输几率Pc transmission probability: .ni<'  
44.分子流导CN,UN molecular conductance: M`  V<`  
45.流导C,U conductance: gZq _BY_U  
46.固有流导Ci,Ui intrinsic conductance: tE'^O< K  
47.流阻W resistance: R*0]*\C z  
48.吸附 sorption: jRiXN %  
49.表面吸附 adsorption: Y % 9$!  
50.物理吸附physisorption: ]QC9y:3  
51.化学吸附 chemisorption: .>#X*u  
52.吸收absorption: sg`   
53.适应系数α accommodation factor: V#X#rDfJZ  
54.入射率υ impingement rate: ,="hI:*<  
55.凝结率condensation rate: Th_PmkvC  
56.粘着率 sticking rate: 6|uv+$  
57.粘着几率Ps sticking probability: #ZkT![ `  
58.滞留时间τ residence time: ^?J3nf{  
59.迁移 migration: C&|K7Zp0v  
60.解吸 desorption: AjVX  
61.去气 degassing: Zzn N"Si,  
62.放气 outgassing: `6y=ky.,  
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: +[vI ocu  
64.蒸发率 evaporation rate: {ty)2  
65.渗透 permeation: ylm # Xa  
66.渗透率φ permeability: Ty<."dyPW  
67.渗透系数P permeability coefficient 9U>OeTh(  
2.   1.真空泵 vacuum pumps "?%2`*\  
1-1.容积真空泵 positive displacement pump: ]*?lgwE  
⑴.气镇真空泵 gas ballast vacuum pump: wKU9I[]  
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: mF:Pplf<  
⑶.干封真空泵 dry-sealed vacuum pump: ~+ kfb^<-  
⑷.往复真空泵 piston vacuum pump: PctXh, =  
⑸.液环真空泵 liquid ring vacuum pump: <$(y6+lY  
⑹.旋片真空泵 sliding vane rotary vacuum pump: v}LI-~M>U  
⑺.定片真空泵 rotary piston vacuum pump: kx?f,^ -  
⑻.滑阀真空泵 rotary plunger vacuum pump: %rlMjF'tG  
⑼.余摆线真空泵 trochoidal vacuum pump: iD*21c<kd  
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: xv"v='  
⑾.罗茨真空泵 roots vacuum pump: |yl,7m/B-G  
1-2.动量传输泵 kinetic vacuum pump: mW2D"-s  
⑴.牵引分子泵molecular drag pump: H +' 6*akV  
⑵.涡轮分子泵turbo molecular pump: 3n,jrX75u  
⑶.喷射真空泵ejector vacuum pump: qv^P  
⑷.液体喷射真空泵liquid jet vacuum pump: %oB0@&!mS  
⑸.气体喷射真空泵gas jet vacuum pump: Q5c3C &$6  
⑹.蒸汽喷射真空泵vapor jet vacuum pump : 0qINa:Ori  
⑺.扩散泵diffusion pump : <?nz>vz  
⑻.自净化扩散泵self purifying diffusion pump: qjObu\r  
⑼.分馏扩散泵 fractionating diffusion pump : !YPwql(  
⑽.扩散喷射泵diffusion ejector pump : H#i,Ve '  
⑾.离子传输泵ion transfer pump: Z`_x|cU?J  
1-3.捕集真空泵 entrapment vacuum pump: <Drm#2x!E  
⑴吸附泵adsorption pump: ku4Gc6f#gG  
⑵.吸气剂泵 getter pump: qt(4?_J  
⑶.升华(蒸发)泵 sublimation (evaporation)pump : 5dGfO:Dy_  
⑷.吸气剂离子泵getter ion pump: NH;e|8  
⑸.蒸发离子泵 evaporation ion pump: 0W0GSDx  
⑹.溅射离子泵sputter ion pump: *I!R0;HT  
⑺.低温泵cryopump: up{0ehr  
P3.  
2.真空泵零部件 7t+d+sQ-l  
2-1.泵壳 pump case: @F] w]d  
2-2.入口 inlet: Nw9@E R  
2-3.出口outlet:  v%$l(  
2-4.旋片(滑片、滑阀)vane; blade : 6cd!;Ca  
2-5.排气阀discharge valve: idB1%?<  
2-6.气镇阀gas ballast valve: ;*'I&  
2-7.膨胀室expansion chamber: 0C;Js\>3]  
2-8.压缩室compression chamber: ~/X8Hy!-  
2-9.真空泵油 vacuum pump oil: WMHYOJR  
2-10.泵液 pump fluid: =igTY1|af  
2-11.喷嘴 nozzle: udT0`6l;  
2-13.喷嘴扩张率nozzle expansion rate: MJh.)kd$  
2-14.喷嘴间隙面积 nozzle clearance area : &\I<j\F2/  
2-15.喷嘴间隙nozzle clearance: \61H(,  
2-16.射流jet: z . Z  
2-17.扩散器diffuser: fP:]s@$  
2-18.扩散器喉部diffuser thoat: %%F, G  
2-19.蒸汽导管vapor tube(pipe;chimney): 1.M<u)1GU  
2-20.喷嘴组件nozzle assembly: /O<~n%< G  
2-21.下裙skirt: ^^&H:q  
O}%E SAB  
3.附件 W/\pqH  
3-1阱trap: e/cHH3 4  
⑴.冷阱 cold trap: "n]x%. *  
⑵.吸附阱sorption trap: yUWc8]9\W  
⑶.离子阱ion trap: :-O$rm  
⑷.冷冻升华阱 cryosublimation trap: T_!F I29  
3-2.挡板baffle: L@z[b^  
3-3.油分离器oil separator: ;e*okYM  
3-4.油净化器oil purifier: i9Beap/t$  
3-5.冷凝器condenser: e,{k!BXU#'  
Dt<MEpbur  
4.泵按工作分类 c0Bqm  
4-1.主泵main pump: |||m5(`S  
4-2.粗抽泵roughing vacuum pump: SOE-Kio=B  
4-3.前级真空泵backing vacuum pump: OwEV$Q  
4-4.粗(低)真空泵 roughing(low)vacuum pump: epKr6 xq  
4-5.维持真空泵holding vacuum pump: unc6 V%  
4-6.高真空泵high vacuum pump: tvf5b8(Y-  
4-7.超高真空泵ultra-high vacuum pump: '.<iV!ZdZ  
4-8.增压真空泵booster vacuum pump:  ZB |s/  
A9N8Hav  
5.真空泵特性 V,rR*a&p  
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: C[<{>fl)  
5-2.真空泵的抽气量Q throughput of vacuum pump:。 )5n0P Zi  
5-3.起动压力starting pressure: M*bsA/Z  
5-4.前级压力 backing pressure : 1) K<x  
5-5.临界前级压力 critical backing pressure: X31%T"  
5-6.最大前级压力maximum backing pressure: +,,dsL  
5-7.最大工作压力maximum working pressure: :-#7j} R&  
5-8.真空泵的极限压力ultimate pressure of a pump: cuH5f}oc  
5-9.压缩比compression ratio: G~DHNO6  
5-10.何氏系数Ho coefficient: -~aG_Bp!($  
5-11.抽速系数speed factor: N<@K(? '  
5-12.气体的反扩散back-diffusion of gas: xv Xci W  
5-13.泵液返流back-streaming of pump fluid: dl[%C6  
5-14.返流率back-streaming rate 4[#)p}V  
5-15.返迁移back-migration: lAA&#-#YG  
5-16.爆腾bumping: *J]p/<> {  
5-17.水蒸气允许量qm water vapor tolerable load: ~CHcbEWk)W  
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: n:B){'S  
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: )X," NJG  
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump ygV_"=+|N  
3.   1.一般术语 WV'u}-v^  
1-1.压力计pressure gauge: jl}!UG  
1-2.真空计vacuum gauge: +zbCYA  
⑴.规头(规管)gauge head: 'hPW#*#W<  
⑵.裸规nude gauge : 8RuW[T?  
⑶.真空计控制单元gauge control unit : [kpQ:'P3  
⑷.真空计指示单元gauge indicating unit : *~4<CP+"0  
c%O97J.5b  
2.真空计一般分类 @YRy)+  
2-1.压差式真空计differential vacuum gauge: {>vgtkJ  
2-2.绝对真空计 absolute vacuum gauge: ?7TmAll<.s  
2-3.全压真空计total pressure vacuum gauge: -O,:~a=*_  
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: w0@XJH:P  
2-5.相对真空计relative vacuum gauge : X jxa 2D  
$<XQv$YS  
3.真空计特性 Y@k=m )zE  
3-1.真空计测量范围pressure range of vacuum gauge: Z ztp %2c  
3-2.灵敏度系数sensitivity coefficient: Yc?S<  
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): Mv/ SU">F  
3-5.规管光电流photon current of vacuum gauge head: \2[tM/+Bs  
3-6.等效氮压力equivalent nitrogen pressure : 1c @S[y  
3-7.X射线极限值 X-ray limit: RTvOaZ  
3-8.逆X射线效应anti X-ray effect: *2N0r2t&  
3-9.布利尔斯效应blears effect: ]b>XN8y.  
~N}Zr$D  
4.全压真空计 v!DK.PZbi  
4-1.液位压力计liquid level manometer: =bP<cC=3b  
4-2.弹性元件真空计elastic element vacuum gauge: rNicg]:\x  
4-3.压缩式真空计compression gauge: **z^aH?B2  
4-4.压力天平pressure balance: %-$ :/ N  
4-5.粘滞性真空计viscosity gauge : ^8bc<c:P  
4-6.热传导真空计thermal conductivity vacuum gauge : ]8OmYU%6V  
4-7.热分子真空计thermo-molecular gauge: As5l36  
4-8.电离真空计ionization vacuum gauge: jTNt!2 :B  
4-9.放射性电离真空计radioactive ionization gauge: k >.U!  
4-10.冷阴极电离真空计cold cathode ionization gauge: oxeIh9 E  
4-11.潘宁真空计penning gauge: c;]^aaQ+>  
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: <Piq?&VX[  
4-13.放电管指示器discharge tube indicator: ~.J*_0~Ze  
4-14.热阴极电离真空计hot cathode ionization gauge: p:$v,3:  
4-15.三极管式真空计triode gauge: +t*I{X(  
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: 4Ozcs'}  
4-17.B-A型电离真空计Bayard-Alpert gauge: htrtiJ1  
4-18.调制型电离真空计modulator gauge: A7XA?>~+|  
4-19.抑制型电离真空计suppressor gauge: ^x/D8 M  
4-20.分离型电离真空计extractor gauge: P0_Ymn=&  
4-21.弯注型电离真空计bent beam gauge: 3LJ\y  
4-22.弹道型电离真空计 orbitron gauge : x $[_Hix  
4-23.热阴极磁控管真空计hot cathode magnetron gauge: z19%!k  
$%ND5uK  
5.分压真空计(分压分析器) P_mP ^L  
5-1.射频质谱仪radio frequency mass spectrometer: fuCt9Kjo<  
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: k#~oagW_Gw  
5-3.单极质谱仪momopole mass spectrometer: "X!1^)W -8  
5-4.双聚焦质谱仪double focusing mass spectrometer: a{}#t}  
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: )MTf  
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: 9vW]HOK  
5-7.回旋质谱仪omegatron mass spectrometer: ^.g-}r8,  
5-8.飞行时间质谱仪time of flight mass spectrometer: 50A\Y)i_mZ  
}M"])B I  
6.真空计校准 l O*  
6-1.标准真空计reference gauges: $_eJ@L#  
6-2.校准系统system of calibration: ,CPAS}kS  
6-3.校准系数K calibration coefficient: r~7}w4U  
6-4.压缩计法meleod gauge method: ob9od5Rf  
6-5.膨胀法expansion method: .q:6F*,1M  
6-6.流导法flow method: -#G>`T~  
4.   1.真空系统vacuum system So~QZ%YA  
1-1.真空机组pump system: v+trHdSBYE  
1-2.有油真空机组pump system used oil : YwZx{%f  
1-3.无油真空机组oil free pump system =TzJgx  
1-4.连续处理真空设备continuous treatment vacuum plant: G;pmR^  
1-5.闸门式真空系统vacuum system with an air-lock: $\1M"a}F  
1-6.压差真空系统differentially pumped vacuum system: a+O?bO  
1-7.进气系统gas admittance system: u#y)+A2&!  
r}Gku0Hu_E  
2.真空系统特性参量 cH:&S=>h  
2-1.抽气装置的抽速volume flow rate of a pumping unit : -`z%<)!Y  
2-2.抽气装置的抽气量throughput of a pumping unit : ]mNsG0r6  
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: #4"eQ*.*"  
2-4.真空系统的漏气速率leak throughput of a vacuum system: $T66%wX  
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: v_v>gPl,  
2-6.极限压力ultimate pressure: 8cMX=P  
2-7.残余压力residual pressure: -k2|`t _  
2-8.残余气体谱residual gas spectrum: m#O; 1/P  
2-9.基础压力base pressure: kSCpr0c  
2-10.工作压力working pressure: T$<'ZC  
2-11.粗抽时间roughing time: HFF rS%  
2-12.抽气时间pump-down time: 8r@GoG>  
2-13.真空系统时间常数time constant of a vacuum system: P\{s C6E  
2-14.真空系统进气时间venting time: SdMLO6-  
6CGk*s  
3.真空容器 aZa1eE  
3-1.真空容器;真空室vacuum chamber: Y,,Z47% E  
3-2.封离真空装置sealed vacuum device: %1{O  
3-3.真空钟罩vacuum bell jar: vo)W ziHh  
3-4.真空容器底板vacuum base plate: OUO'w6m!  
3-5.真空岐管vacuum manifold: saQo]6#  
3-6.前级真空容器(贮气罐)backing reservoir: Vj8-[ww!  
3-7.真空保护层outer chamber: :ec>[N~KG  
3-8.真空闸室vacuum air lock: K&gE4;>  
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: T/%Y_.NtU  
KIWHn_ :  
4.真空封接和真空引入线 -{z[.v.p  
4-1.永久性真空封接permanent seal : 2VX9FDrnk  
4.2.玻璃分级过渡封接graded seal : k.)YFKi  
4-3.压缩玻璃金属封接compression glass-to-metal seal: x5;D'Y t"|  
4-4.匹配式玻璃金属封接matched glass-to-metal seal: 0a@tPskV  
4-5.陶瓷金属封接ceramic-to-metal seal: tO1k2<Z"Y&  
4-6.半永久性真空封接semi-permanent seal : "fSaM&@[B  
4-7.可拆卸的真空封接demountable joint: I4UsDs*BD  
4-8.液体真空封接liquid seal -=UvOzw  
4-9.熔融金属真空封接molten metal seal: t%k`)p7O  
4-10.研磨面搭接封接ground and lapped seal: yiH;fK+x  
4-11.真空法兰连接vacuum flange connection: 87)/dHc  
4-12.真空密封垫vacuum-tight gasket: | "M1+(k7  
4-13.真空密封圈ring gasket: LtKR15h,  
4-14.真空平密封垫flat gasket: 3KkJQ5a  
4-15.真空引入线feedthrough leadthrough: ft0d5n!ui4  
4-16.真空轴密封shaft seal: VJCj=jX  
4-17.真空窗vacuum window: |m*l/@1  
4-18.观察窗viewing window: ZdPqU \G^q  
BV/ ^S.~  
5.真空阀门 H ]](xYy.  
5-1.真空阀门的特性characteristic of vacuum valves: i/!KUbt  
⑴.真空阀门的流导conductance of vacuum valves: d#ab"&$bv  
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: z 3Z8vq  
5-2.真空调节阀regulating valve: _pvt,pW  
5-3.微调阀 micro-adjustable valve: M-+!z5 q~d  
5-4.充气阀charge valve: h:FN&E c}  
5-5.进气阀gas admittance valve: d]sg9`  
5-6.真空截止阀break valve: '%TD#!a  
5-7.前级真空阀backing valve: od,,2pwK+  
5-8.旁通阀 by-pass valve: y0) mBCX  
5-9.主真空阀main vacuum valve: [ {vX*q 3B  
5-10.低真空阀low vacuum valve: .;,,{ ;  
5-11.高真空阀high vacuum valve: v9f%IE4fX  
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: qzZ;{>_f  
5-13.手动阀manually operated valve: t)O]0) s  
5-14.气动阀pneumatically operated valve: @cx#'  
5-15.电磁阀electromagnetically operated valve: W!=ur,F+  
5-16.电动阀valve with electrically motorized operation: v=&xiwz}  
5-17.挡板阀baffle valve: i`}9VaUG  
5-18.翻板阀flap valve: dV*9bDkM/  
5-19.插板阀gate valve: h*Mi/\  
5-20.蝶阀butterfly valve: NNJQDkO-I  
ICG:4n(,  
6.真空管路 8LuU2Lo  
6-1.粗抽管路roughing line: ds{)p<LpT  
6-2.前级真空管路backing line: K,P`V &m?  
6-3.旁通管路;By-Pass管路 by-pass line: N>sHT =_  
6-4.抽气封口接头pumping stem: \t&8J+%  
6-5.真空限流件limiting conductance:       *rV{(%\m  
6-6.过滤器filter: D&],.N  
5.   1.一般术语 !SLfAFcS  
1-1真空镀膜vacuum coating: ,Vz-w;oDn  
1-2基片substrate: tpgD{BY^wJ  
1-3试验基片testing substrate: .H&XP W  
1-4镀膜材料coating material: U:PtRSdn!b  
1-5蒸发材料evaporation material: ;vk>k0S  
1-6溅射材料sputtering material: 7kMO);pO  
1-7膜层材料(膜层材质)film material: tTt}=hQpgX  
1-8蒸发速率evaporation rate: e%7#e%1s  
1-9溅射速率sputtering rate: R"z}q (O:  
1-10沉积速率deposition rate: rTST_$"_6  
1-11镀膜角度coating angle: Y%(8'Ch  
usi3z9P>n  
2.工艺 mMCd   
2-1真空蒸膜vacuum evaporation coating: &$~irI  
(1).同时蒸发simultaneous evaporation: 5+(Cp3  
(2).蒸发场蒸发evaporation field evaporation: ,~Lx7 5{  
(3).反应性真空蒸发reactive vacuum evaporation: x4?g>v*J  
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: }Cb-7/  
(5).直接加热的蒸发direct heating evaporation: yRp&pUtb  
(6).感应加热蒸发induced heating evaporation: @v\8+0  
(7).电子束蒸发electron beam evaporation: j5~~%  
(8).激光束蒸发laser beam evaporation: 4#B 56f8  
(9).间接加热的蒸发indirect heating evaporation: D|vck1C5,  
(10).闪蒸flash evaportion: e%=SgXl2t  
2-2真空溅射vacuum sputtering: od&wfwk(  
(1).反应性真空溅射 reactive vacuum sputtering: C+Wa(K  
(2).偏压溅射bias sputtering: %T}*DC$&S  
(3).直流二级溅射direct current diode sputtering:  |vBy=:  
(4).非对称性交流溅射asymmtric alternate current sputtering: &IG*;$c!  
(5).高频二极溅射high frequency diode sputtering: | `?J2WGe  
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: xd4~[n\hm  
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: 1T4#+kW&  
(8).离子束溅射ion beam sputtering: +Je%8jH  
(9).辉光放电清洗glow discharge cleaning: h5v=h>c  
2-3物理气相沉积PVD physical vapor deposition: "_+8z_  
2-4化学气相沉积CVD chemical vapor deposition: *3fhVl=8^*  
2-5磁控溅射magnetron sputtering: -AB0uMot  
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: tU.~7f#+A  
2-7空心阴极离子镀HCD hollow cathode discharge deposition: z)u\(W*\iA  
2-8电弧离子镀arc discharge deposition: xd+aO=)Td  
JI&.d:  
3.专用部件 8/"C0I (G  
3-1镀膜室coating chamber: PJ<9T3Fa  
3-2蒸发器装置evaporator device: m mH xPd  
3-3蒸发器evaporator: wxF\enDY  
3-4直接加热式蒸发器evaporator by direct heat: T#&X7!4  
3-5间接加热式蒸发器evaporator by indirect heat: g6OPYUPg  
3-7溅射装置sputtering device: =9:gW5F69  
3-8靶target: 7T(&DOGZ  
3-10时控挡板timing shutter: S>s+ nqcP  
3-11掩膜mask: zu,Yuq  
3-12基片支架substrate holder: Ir Y\Q)  
3-13夹紧装置clamp: ]i>,oxBWe  
3-14换向装置reversing device: )E^Pn|H  
3-15基片加热装置substrate heating device: MG^YT%f  
3-16基片冷却装置substrate colding device: `r %lB  
zNg[%{mz  
4.真空镀膜设备 ,@zw  
4-1真空镀膜设备vacuum coating plant: nPjK=o`KR  
(1).真空蒸发镀膜设备vacuum evaporation coating plant: qu;$I'Ul%  
(2).真空溅射镀膜设备vacuum sputtering coating plant: *bzqH2h8  
4-2连续镀膜设备continuous coating plant: 8zho\'  
4-3半连续镀膜设备semi- continuous coating plant ~1nKL0C6u  
6.   1.漏孔 nZEew .T:6  
1-1漏孔leaks: @qB>qD~WsD  
1-2通道漏孔channel leak: D"IxQ2}k  
1-3薄膜漏孔membrane leak: uF[~YJ>  
1-4分子漏孔molecular leak: ffsF], _J  
1-5粘滞漏孔vixcous leak: I [n|#N  
1-6校准漏孔calibrated leak: eZ 7Atuv  
1-7标准漏孔reference leak : 27}0  
1-8虚漏virtual leak: x4v&%d=M  
1-9漏率leak rate: zd{sw}  
1-10标准空气漏率standard air leak rate: S.pXo'}  
1-11等值标准空气漏率equivalent standard air leak rate: #JN4K>_4  
1-12探索(示漏)气体: /bLL!nD=^  
*aGJ$ P0  
2.本底 ZWKvz3Wt  
2-1本底background: `$vf9'\+  
2-2探索气体本底search gas background : }%D${.R]  
2-3漂移drift: Uz%ynH  
2-4噪声noise: ]&tcocq  
!=u=P9I  
3.检漏仪 Ve<f}  
3-1检漏仪leak detector: Q(4~r+  
3-2高频火花检漏仪H.F. spark leak detector: o[q|dhrANh  
3-3卤素检漏仪halide leak detector: gLK0L%"5  
3-4氦质谱检漏仪helium mass spectrometer leak detector: tqjjn5!  
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: VH vL:z  
xE!b)@>S  
4.检漏 '-3K`[  
4-1气泡检漏leak detection by bubbles: B;2#Sa.  
4-2氨检漏leak detection by ammonia: m[BpV.s  
4-3升压检漏leak detection of rise pressure: Q% ^_<u  
4-4放射性同位素检漏radioactive isotope leak detection: FU;a { irB  
4-5荧光检漏fluorescence leak detection 'lOQb)  
7.   1.一般术语 p[)yn%uh  
1-1真空干燥vacuum drying: TV`sqKW  
1-2冷冻干燥freeze drying : j3u!lZ}U  
1-3物料material: _nSEp >]L  
1-4待干燥物料material to be dried: RMdU1@  
1-5干燥物料dried material : &-m}w:j=  
1-6湿气moisture;humidity: T&}KUX~Q/  
1-7自由湿气free moisture: qggRS)a  
1-8结合湿气bound moisture: q d:"LS  
1-9分湿气partial moisture: z 0F55<i  
1-10含湿量moisture content: p&D7&Sb[  
1-11初始含湿量initial moisture content: -#R63f&  
1-12最终含湿量final residual moisture: ;vn0b"Fi3  
1-13湿度degree of moisture ,degree of humidity : P ,rLyx   
1-14干燥物质dry matter : XXeDOrb  
1-15干燥物质含量content of dry matter: r> .l^U9hJ  
G&4D0f  
2.干燥工艺 _xnJfW_  
2-1干燥阶段stages of drying : - b`  
(1).预干燥preliminary dry: Q5_,`r`  
(2).一次干燥(广义)primary drying(in general): '2rSX[$ tf  
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): 'pF$6n;  
(4).二次干燥secondary drying: ;alt%:$n  
2-2.(1).接触干燥contact drying: 5r d t  
(2).辐射干燥 drying by radiation : fJe5 i6`(  
(3).微波干燥microwave drying: v?n# C  
(4).气相干燥vapor phase drying: _,I~1"  
(5).静态干燥static drying: o@C|*TXN  
(6).动态干燥dynamic drying: u#Bj#y!  
2-3干燥时间drying time: "W_E!FP]r  
2-4停留时间length of stay(in the drying chamber): xn)F(P 0kv  
2-5循环时间cycle time: 4w]<1V  
2-6干燥率 dessication ratio : ZT`" {#L  
2-7去湿速率mass flow rate of humidity: p0}Yo8?OW  
2-8单位面积去湿速率mass flow rate of humidity per surface area: =F dFLrx~l  
2-9干燥速度 drying speed : eKU4"XTk  
2-10干燥过程drying process: tCGA3t  
2-11加热温度heating temperature: ;Rm';IW$  
2-12干燥温度temperature of the material being dried : m}2hIhD9  
2-13干燥损失loss of material during the drying process : ^x_.3E3Q  
2-14飞尘lift off (particles): ISTAJ8" D  
2-15堆层厚度thickness of the material: {}=5uU2Tu  
D%=&euB  
3.冷冻干燥 YfNN&G4_  
3-1冷冻freezing: "j.Q*Hazg  
(1).静态冷冻static freezing: auM1k]  
(2).动态冷冻dynamic freezing: t{B6W)q  
(3).离心冷冻centrifugal freezing: -x?|[ +%  
(4).滚动冷冻shell freezing: tA9Ew{3s  
(5).旋转冷冻spin-freezing:  }"q#"s  
(6).真空旋转冷冻vacuum spin-freezing: 0/cgOP!^  
(7).喷雾冷冻spray freezing: 6.a>7-K}%  
(8).气流冷冻air blast freezing: kHQn' r6  
3-2冷冻速率rate of freezing: &]anRT#  
3-3冷冻物料frozen material: nppSrj?  
3-4冰核ice core: L$jii  
3-5干燥物料外壳envelope of dried matter: &?gcnMg$,J  
3-6升华表面sublimation front: "g(q)u >  
3-7融化位置freezer burn: s"8z q ;)  
OSom-?|w  
4.真空干燥设备;真空冷冻干燥设备 CM `Q((  
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: 'z+Pa^)v  
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: LOgB_$9_3  
4-3加热表面heating surface: 9N|JI3*41  
4-4物品装载面shelf : .li)k[] ts  
4-5干燥器的处理能力throughput (of the vacuum drying chamber): m5hu;>gt  
4-6单位面积干燥器处理能力throughput per shelf area: 'OMl9}M  
4-7冰冷凝器ice condenser: HhzPKd  
4-8冰冷凝器的负载load of the ice condenser: 3@<m/%  
4-9冰冷凝器的额定负载rated load of the ice condenser .&K?@T4l  
8.   1.一般术语 P+3 ]g{2w  
1-1试样sample : hG}/o&}U  
(1).表面层surface layer: #!rH}A>n+  
(2).真实表面true surface: U1kW1L}B  
(3).有效表面积effective surface area: C?\HB#41  
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: %,d+jBM  
(5).表面粒子密度surface particle density: d 5h x%M  
(6).单分子层monolayer: l8lJ &  
(7).表面单分子层粒子密度monolayer density: u4[JDB7tH  
(8).覆盖系数coverage ratio: E,4*a5Fi  
1-2激发excitation: I."s&]FZ  
(1).一次粒子primary particle: Zh?n;n}  
(2).一次粒子通量primary particle flux: Y2+YmP*z`  
(3).一次粒子通量密度density of primary particle flux: lDs C>L-F  
(4).一次粒子负荷primary particle load: `EiL~*  
(5).一次粒子积分负荷integral load of primary particle: sr:hR Q27  
(6).一次粒子的入射能量energy of the incident primary particle: uLN.b339  
(7).激发体积excited volume: lB|.TCbW  
(8).激发面积excited area: Mv7tK l  
(9).激发深度excited death: 0s.4]Zg>5  
(10).二次粒子secondary particles: gOaK7A  
(11).二次粒子通量secondary particle flux: zaE!=-U  
(12).二次粒子发射能energy of the emitted secondary particles: **ls 4CE<  
(13).发射体积emitting volume: pf3-  
(14).发射面积emitting area: HZ\=NDz  
(15).发射深度emitting depth: >rFM8P(  
(16).信息深度information depth: i2\CDYP  
(17).平均信息深度mean information depth: [,|4%Y  
1-3入射角angle of incidence: 1ay{uU!EL  
1-4发射角angle of emission: R7x*/?  
1-5观测角observation: D6EqJ,~  
1-6分析表面积analyzed surface area: !,*Uvs@b  
1-7产额 yield : P{8<U8E  
1-8表面层微小损伤分析minimum damage surface analysis: McvLU+  
1-9表面层无损伤分析non-destructive surface analysis: &hzr(v~;  
1-10断面深度分析 profile analysis in depth; depth profile analysis : 4ug4[  
1-11可观测面积observable area: /j(<rz"j  
1-12可观测立体角observable solid angle : H]Gj$P=k  
1-13接受立体角;观测立体角angle of acceptance:  V#+J4   
1-14角分辨能力angular resolving power: a#3,qp!  
1-15发光度luminosity: G<t _=j/r  
1-16二次粒子探测比detection ratio of secondary particles: cty  
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: ab<7jfFIa  
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: lq27^K  
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: @Lm(bW  
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: {d,^tG}  
1-21本底压力base pressure: 4Y@q.QP  
1-22工作压力working pressure: & )EL%o5  
8p~|i97W]!  
2.分析方法 'Ub\8<HfJU  
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: B5va4@  
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : JRw)~Tg @  
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: Ly6) ,[q~  
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: &s&Ha{(!w  
2-3离子散射表面分析ion scattering spectroscopy: "ScY'<  
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: W-vEh  
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: Wt! NLlN8  
2-6离子散射谱仪ion scattering spectrometer: ^^gV@fz  
2-7俄歇效应Auger process: X!]p8Q y  
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: }4xz,oN  
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: Dn;$4Dak(  
2-10光电子谱术photoelectron spectroscopy : XN'<H(G  
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: =,LhMy  
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: kn6X I*  
2-11光电子谱仪photoelectron spectrometer: -O[9{`i]  
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: n UD;y}}n  
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: 74%Uojl"  
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): +*$@ K'VL  
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus
zuiyuan 2007-03-13 15:13
太好了啊,多谢了啊
zhy980730 2007-03-14 11:39
多谢,了解点.
flyinlove79 2007-03-15 17:43
不错,多谢楼主分享资料 [s:4]
飞花无心 2007-03-26 09:33
很好,谢谢楼主啊
wottlin100 2007-04-02 09:19
呵呵,楼主辛苦啦!如果有定义解释更好!
xingmeng1227 2011-10-29 12:40
呵呵,楼主辛苦啦!
zh9607109 2011-11-03 05:41
呵呵,楼主辛苦啦!
wym87 2011-11-13 23:18
谢谢楼主的分享!Thanks!
douyongming 2012-06-17 17:03
太好了啊,多谢了啊
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