| 燃烧的灵魂 |
2007-01-23 16:55 |
寻找硅胶。用在投影仪的光学元件上。
参数参考 n@;B_Bt7
Curing lfC]!=2%~8
Pre-cure: 100oC for 15 minutes m$v >r\*X
Full cure: 100oC for 1 hour (minimum) i(cKg&+ktd
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin |_8l9rB5ip
H6j t[
Mechanical Data 9=T;Dxn
1. Tensile strength: 800 psi (min) Z~-N'L t{
2. Lap shear strength: 250 psi (min) cYC^;,C &|
3. Elongation: 80% (min) ?f q!BV
4. Hardness: 50 Shore D W,CAg7:*
oxL<\4)WJ
Thermal and Optical Data: %3#C0%{x
1. Working temperature range: -40oC – 230oC &}2@pu[S?7
2. Decomposition temperature: onset at 3000C (by TGA) .7b%7dQ<\
3. No change in modulus with temperature B U??}{
4. CTE ~ 200 ppm/oC ~;Y Tz
5. Refractive index: 1.43 Z^as ?k(iM
6. Transmittance(%) >90 @260-700nm #Mk: 4
v3M$UiN,:
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