| 燃烧的灵魂 |
2007-01-23 16:55 |
寻找硅胶。用在投影仪的光学元件上。
参数参考 iw6M3g#
Curing Xrs ~ove1V
Pre-cure: 100oC for 15 minutes A.*nDl`H
Full cure: 100oC for 1 hour (minimum) S`PSFetC
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin W5yu`Br
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Mechanical Data -&^( T
1. Tensile strength: 800 psi (min) %Y[/Ucdm
2. Lap shear strength: 250 psi (min) &l)v'
3. Elongation: 80% (min) $e,!fB;B
4. Hardness: 50 Shore D {
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KPK!'4,cu
Thermal and Optical Data: x}24?mP
1. Working temperature range: -40oC – 230oC k0=y_7
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2. Decomposition temperature: onset at 3000C (by TGA) Q^;\!$:M
3. No change in modulus with temperature 7 "U,N; y
4. CTE ~ 200 ppm/oC 0To
5| r
5. Refractive index: 1.43 ))zaL2UP.
6. Transmittance(%) >90 @260-700nm
MO+0]uh:
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