| 燃烧的灵魂 |
2007-01-23 16:55 |
寻找硅胶。用在投影仪的光学元件上。
参数参考
3BB/u%N}
Curing UXHtmi|_:
Pre-cure: 100oC for 15 minutes X(C=O?A
Full cure: 100oC for 1 hour (minimum) 7TZ,bD_
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin o;pJjC]
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Mechanical Data xp"F)6
1. Tensile strength: 800 psi (min) } 9+Vf'u|l
2. Lap shear strength: 250 psi (min) (~ :ip)v
3. Elongation: 80% (min) \T;(k?28HN
4. Hardness: 50 Shore D m2F+ 6G
qp/nWGj
Thermal and Optical Data: 36 ]?4, .
1. Working temperature range: -40oC – 230oC <?!%dV{z
2. Decomposition temperature: onset at 3000C (by TGA) ;^8X(R
3. No change in modulus with temperature j Zq CM{
4. CTE ~ 200 ppm/oC Z$K [e
5. Refractive index: 1.43 + a'nP=e&
6. Transmittance(%) >90 @260-700nm v0%FG9Gk
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