| 燃烧的灵魂 |
2007-01-23 16:55 |
寻找硅胶。用在投影仪的光学元件上。
参数参考 ,,H "?VO
Curing :E:e ^$p
Pre-cure: 100oC for 15 minutes GG} %
Full cure: 100oC for 1 hour (minimum) (]|h6aI'}
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin 64 s;EC
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Mechanical Data P RKZg]?
1. Tensile strength: 800 psi (min) /:{ %X(8
2. Lap shear strength: 250 psi (min) | f#wbw
3. Elongation: 80% (min) xoaO=7\io
4. Hardness: 50 Shore D @<.@ X*#I
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Thermal and Optical Data: T]#V
1. Working temperature range: -40oC – 230oC }F`|_8L*v)
2. Decomposition temperature: onset at 3000C (by TGA) O9=/\Kc
3. No change in modulus with temperature ,_[x|8m
4. CTE ~ 200 ppm/oC
v+c> iI
5. Refractive index: 1.43 F3tps
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6. Transmittance(%) >90 @260-700nm gP^2GnjHL8
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