| 燃烧的灵魂 |
2007-01-23 16:55 |
寻找硅胶。用在投影仪的光学元件上。
参数参考 %hQ`b$07t
Curing ?2c:|FD
Pre-cure: 100oC for 15 minutes }c:0cl
Full cure: 100oC for 1 hour (minimum) _JoA=< O!
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin J],BO\ECH
tO$M[P=b
Mechanical Data T;7|d5][
1. Tensile strength: 800 psi (min) pTd@i1%N r
2. Lap shear strength: 250 psi (min) ::w%rv
3. Elongation: 80% (min) [rem,i +
4. Hardness: 50 Shore D <L 0_< T
0KE l +
Thermal and Optical Data: W X9BS$}0
1. Working temperature range: -40oC – 230oC K;O\Pd
2. Decomposition temperature: onset at 3000C (by TGA) l-rI|0D#
3. No change in modulus with temperature J3v uh#
4. CTE ~ 200 ppm/oC NU"X*g- x^
5. Refractive index: 1.43 dXQWT@$y!E
6. Transmittance(%) >90 @260-700nm ?: c hAN@
oizoKwp%
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