| 燃烧的灵魂 |
2007-01-23 16:55 |
寻找硅胶。用在投影仪的光学元件上。
参数参考 A~P R
Curing ( Fon!_$:
Pre-cure: 100oC for 15 minutes &{.IU g
Full cure: 100oC for 1 hour (minimum) K~vJ/9"|R
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin cV W7I
%S;AM \o4
Mechanical Data wDh]vH[
1. Tensile strength: 800 psi (min) V^ n6~O
2. Lap shear strength: 250 psi (min) .)b<cH~%
3. Elongation: 80% (min) v,ZYh w
4. Hardness: 50 Shore D
P d~=:4
P.XT1)qo*
Thermal and Optical Data: ] "Uzn
1. Working temperature range: -40oC – 230oC 9=ygkP Y
2. Decomposition temperature: onset at 3000C (by TGA) Q} @t'
3. No change in modulus with temperature KhfADqji|
4. CTE ~ 200 ppm/oC I{cH$jt<
5. Refractive index: 1.43 ?h&XIM(
6. Transmittance(%) >90 @260-700nm z1B i#/i
5OI.Ka
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