| 燃烧的灵魂 |
2007-01-23 16:55 |
寻找硅胶。用在投影仪的光学元件上。
参数参考 KIn^,d0H
Curing 8B;`9?CI
Pre-cure: 100oC for 15 minutes S#0y\
Full cure: 100oC for 1 hour (minimum) F3jr J+nJ
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin 2g-'. w
Noz+\O \
Mechanical Data R<LW*8
1. Tensile strength: 800 psi (min) U#G
uB&V
2. Lap shear strength: 250 psi (min) qTC`[l
3. Elongation: 80% (min) DamLkkoA
4. Hardness: 50 Shore D g*t.g@B<2
Dn$zwksSs
Thermal and Optical Data: LW_ Y
1. Working temperature range: -40oC – 230oC ( f8g}2
2. Decomposition temperature: onset at 3000C (by TGA) W6'+#Fp
3. No change in modulus with temperature @)&b..c?_
4. CTE ~ 200 ppm/oC q9p BS1Ej
5. Refractive index: 1.43 ;w4 rwL
6. Transmittance(%) >90 @260-700nm O8SX#,3^}
^*C6]*C}te
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